USD934822S1 - Circuit board for power semiconductor module - Google Patents
Circuit board for power semiconductor module Download PDFInfo
- Publication number
- USD934822S1 USD934822S1 US29/725,416 US202029725416F USD934822S US D934822 S1 USD934822 S1 US D934822S1 US 202029725416 F US202029725416 F US 202029725416F US D934822 S USD934822 S US D934822S
- Authority
- US
- United States
- Prior art keywords
- circuit board
- power semiconductor
- semiconductor module
- view
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The even broken lines illustrate portions of the circuit board for power semiconductor module that form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design.
Claims (1)
- The ornamental design for a circuit board for power semiconductor module, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-19213F JP1659674S (en) | 2019-08-29 | 2019-08-29 | |
JP2019-019213 | 2019-08-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD934822S1 true USD934822S1 (en) | 2021-11-02 |
Family
ID=70682015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/725,416 Active USD934822S1 (en) | 2019-08-29 | 2020-02-25 | Circuit board for power semiconductor module |
Country Status (2)
Country | Link |
---|---|
US (1) | USD934822S1 (en) |
JP (1) | JP1659674S (en) |
Citations (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
US5471089A (en) * | 1992-06-30 | 1995-11-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor power module |
US6078501A (en) | 1997-12-22 | 2000-06-20 | Omnirel Llc | Power semiconductor module |
US20010038143A1 (en) | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
US6774465B2 (en) | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
US20080142948A1 (en) | 2006-12-15 | 2008-06-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
US20140168900A1 (en) * | 2012-12-14 | 2014-06-19 | GM Global Technology Operations LLC | Scalable and modular approach for power electronic building block design in automotive applications |
JP1536191S (en) | 2014-08-19 | 2015-10-26 | ||
JP1536360S (en) | 2014-08-19 | 2015-10-26 | ||
JP1536359S (en) | 2014-08-19 | 2015-10-26 | ||
USD748595S1 (en) | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
USD754084S1 (en) | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
US20160190915A1 (en) | 2014-12-24 | 2016-06-30 | Hitachi Power Semiconductor Device, Ltd. | Semiconductor power module and power conversion apparatus using the same |
USD762185S1 (en) | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
US9418975B1 (en) | 2015-03-24 | 2016-08-16 | Mitsubishi Electric Corporation | Semiconductor module, power conversion device, and method for manufacturing semiconductor module |
USD766851S1 (en) | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
US20160276927A1 (en) * | 2015-03-16 | 2016-09-22 | Cree, Inc. | High speed, efficient sic power module |
US20160284618A1 (en) | 2015-03-25 | 2016-09-29 | Mitsubishi Electric Corporation | Semiconductor device |
US20160336245A1 (en) | 2015-05-15 | 2016-11-17 | Mitsubishi Electric Corporation | Power semiconductor device |
USD772184S1 (en) | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
USD774479S1 (en) | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
US20160372392A1 (en) * | 2015-06-18 | 2016-12-22 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device fabrication method |
US9660356B1 (en) | 2015-11-25 | 2017-05-23 | Fuji Electric Co., Ltd. | Semiconductor device |
USD790491S1 (en) | 2015-09-30 | 2017-06-27 | Mitsubishi Electric Corporation | Power semiconductor device |
JP1585830S (en) | 2017-01-05 | 2017-09-11 | ||
JP1585831S (en) | 2017-01-05 | 2017-09-11 | ||
JP1585962S (en) | 2017-01-05 | 2017-09-11 | ||
USD798832S1 (en) | 2015-09-30 | 2017-10-03 | Mitsubishi Electric Corporation | Power semiconductor device |
USD799439S1 (en) | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
JP1603980S (en) | 2017-09-07 | 2018-05-14 | ||
JP1603793S (en) | 2017-09-29 | 2018-05-14 | ||
JP1605558S (en) | 2017-01-05 | 2018-06-04 | ||
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
USD883240S1 (en) * | 2008-09-18 | 2020-05-05 | Advanced Powertrain Engineering, Llc | Printed circuit for an automatic transmission solenoid module |
USD887999S1 (en) * | 2018-10-17 | 2020-06-23 | Oupiin Electronic (Kunshan) Co., Ltd | Circuit board with zigzag routes |
USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
USD888674S1 (en) * | 2018-10-17 | 2020-06-30 | Oupiin Electronic (Kunshan) Co., Ltd. | Circuit board with zigzag routes |
USD892754S1 (en) | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
USD903612S1 (en) | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
USD903611S1 (en) | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD909319S1 (en) * | 2020-07-08 | 2021-02-02 | Impact Ip, Llc | Circuit board |
-
2019
- 2019-08-29 JP JPD2019-19213F patent/JP1659674S/ja active Active
-
2020
- 2020-02-25 US US29/725,416 patent/USD934822S1/en active Active
Patent Citations (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5471089A (en) * | 1992-06-30 | 1995-11-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor power module |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
US20010038143A1 (en) | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
US6078501A (en) | 1997-12-22 | 2000-06-20 | Omnirel Llc | Power semiconductor module |
US6774465B2 (en) | 2001-10-05 | 2004-08-10 | Fairchild Korea Semiconductor, Ltd. | Semiconductor power package module |
US20080142948A1 (en) | 2006-12-15 | 2008-06-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD883240S1 (en) * | 2008-09-18 | 2020-05-05 | Advanced Powertrain Engineering, Llc | Printed circuit for an automatic transmission solenoid module |
USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
US20140168900A1 (en) * | 2012-12-14 | 2014-06-19 | GM Global Technology Operations LLC | Scalable and modular approach for power electronic building block design in automotive applications |
USD754084S1 (en) | 2013-08-21 | 2016-04-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD805485S1 (en) | 2013-08-21 | 2017-12-19 | Mitsubishi Electric Corporation | Semiconductor device |
USD785577S1 (en) | 2013-08-21 | 2017-05-02 | Mitsubishi Electric Corporation | Semiconductor device |
USD762597S1 (en) | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
JP1536359S (en) | 2014-08-19 | 2015-10-26 | ||
JP1536360S (en) | 2014-08-19 | 2015-10-26 | ||
USD775091S1 (en) | 2014-08-19 | 2016-12-27 | Infineon Technologies Ag | Power semiconductor module |
JP1536191S (en) | 2014-08-19 | 2015-10-26 | ||
USD776071S1 (en) | 2014-08-19 | 2017-01-10 | Infineon Technologies Ag | Power semiconductor module |
USD775593S1 (en) | 2014-08-19 | 2017-01-03 | Infineon Technologies Ag | Power semiconductor module |
USD762185S1 (en) | 2014-08-21 | 2016-07-26 | Infineon Technologies Ag | Power semiconductor module |
USD774479S1 (en) | 2014-11-28 | 2016-12-20 | Fuji Electric Co., Ltd. | Semiconductor module |
USD772184S1 (en) | 2014-12-24 | 2016-11-22 | Fuji Electric Co., Ltd. | Semiconductor module |
US20160190915A1 (en) | 2014-12-24 | 2016-06-30 | Hitachi Power Semiconductor Device, Ltd. | Semiconductor power module and power conversion apparatus using the same |
USD810706S1 (en) | 2014-12-24 | 2018-02-20 | Fuji Electric Co., Ltd | Semiconductor module |
USD748595S1 (en) | 2015-02-03 | 2016-02-02 | Infineon Technologies Ag | Power semiconductor module |
USD766851S1 (en) | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
US20160276927A1 (en) * | 2015-03-16 | 2016-09-22 | Cree, Inc. | High speed, efficient sic power module |
US9418975B1 (en) | 2015-03-24 | 2016-08-16 | Mitsubishi Electric Corporation | Semiconductor module, power conversion device, and method for manufacturing semiconductor module |
US20160284618A1 (en) | 2015-03-25 | 2016-09-29 | Mitsubishi Electric Corporation | Semiconductor device |
US20160336245A1 (en) | 2015-05-15 | 2016-11-17 | Mitsubishi Electric Corporation | Power semiconductor device |
US20160372392A1 (en) * | 2015-06-18 | 2016-12-22 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor device fabrication method |
USD790491S1 (en) | 2015-09-30 | 2017-06-27 | Mitsubishi Electric Corporation | Power semiconductor device |
USD798832S1 (en) | 2015-09-30 | 2017-10-03 | Mitsubishi Electric Corporation | Power semiconductor device |
US9660356B1 (en) | 2015-11-25 | 2017-05-23 | Fuji Electric Co., Ltd. | Semiconductor device |
USD799439S1 (en) | 2016-05-31 | 2017-10-10 | Rohm Co., Ltd. | Power converting semiconductor module |
USD875058S1 (en) * | 2017-01-05 | 2020-02-11 | Rohm Co., Ltd. | Power semiconductor module |
JP1585831S (en) | 2017-01-05 | 2017-09-11 | ||
USD864132S1 (en) | 2017-01-05 | 2019-10-22 | Rohm Co., Ltd. | Power semiconductor module |
JP1605558S (en) | 2017-01-05 | 2018-06-04 | ||
USD858467S1 (en) | 2017-01-05 | 2019-09-03 | Rohm Co., Ltd. | Power semiconductor module |
JP1585962S (en) | 2017-01-05 | 2017-09-11 | ||
JP1585830S (en) | 2017-01-05 | 2017-09-11 | ||
USD887998S1 (en) * | 2017-02-17 | 2020-06-23 | Stat Peel Ag | Chip |
USD847103S1 (en) | 2017-09-07 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
JP1603980S (en) | 2017-09-07 | 2018-05-14 | ||
JP1603793S (en) | 2017-09-29 | 2018-05-14 | ||
USD847104S1 (en) | 2017-09-29 | 2019-04-30 | Rohm Co., Ltd. | Power semiconductor module |
USD892754S1 (en) | 2018-06-04 | 2020-08-11 | Semikron Elektronik Gmbh & Co. Kg | Power module |
USD888674S1 (en) * | 2018-10-17 | 2020-06-30 | Oupiin Electronic (Kunshan) Co., Ltd. | Circuit board with zigzag routes |
USD887999S1 (en) * | 2018-10-17 | 2020-06-23 | Oupiin Electronic (Kunshan) Co., Ltd | Circuit board with zigzag routes |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD903612S1 (en) | 2019-03-26 | 2020-12-01 | Fuji Electric Co., Ltd. | Semiconductor module |
USD903611S1 (en) | 2019-03-29 | 2020-12-01 | Mitsubishi Electric Corporation | Semiconductor device |
USD909319S1 (en) * | 2020-07-08 | 2021-02-02 | Impact Ip, Llc | Circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP1659674S (en) | 2020-05-18 |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |