USD923587S1 - Semiconductor driving circuit module - Google Patents

Semiconductor driving circuit module Download PDF

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Publication number
USD923587S1
USD923587S1 US29/704,639 US201929704639F USD923587S US D923587 S1 USD923587 S1 US D923587S1 US 201929704639 F US201929704639 F US 201929704639F US D923587 S USD923587 S US D923587S
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Prior art keywords
driving circuit
circuit module
semiconductor driving
semiconductor
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Inventor
Hirotoshi Aoki
Kiyotaka Yoshida
Tomohiko YOSHINO
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Tamura Corp
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Tamura Corp
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Assigned to TAMURA CORPORATION reassignment TAMURA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YOSHIDA, KIYOTAKA, AOKI, HIROTOSHI, YOSHINO, TOMOHIKO
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US29/704,639 2019-03-15 2019-09-05 Semiconductor driving circuit module Active USD923587S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-005628 2019-03-15
JPD2019-5628F JP1643134S (ja) 2019-03-15 2019-03-15

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USD923587S1 true USD923587S1 (en) 2021-06-29

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD1005142S1 (en) * 2021-11-11 2023-11-21 Tamura Corporation Current sensor
USD1005143S1 (en) * 2022-09-12 2023-11-21 Tamura Corporation Current sensor
USD1020742S1 (en) * 2021-07-21 2024-04-02 Mitsubishi Electric Corporation Memory card reader for programmable controller

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140008780A1 (en) * 2011-07-26 2014-01-09 Mahiro Tsujino Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
US20150131232A1 (en) * 2012-06-29 2015-05-14 Denso Corporation Semiconductor device and semiconductor device connection structure
US20160141244A1 (en) * 2014-11-17 2016-05-19 Qualcomm Incorporated Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield
US20170164488A1 (en) * 2014-07-02 2017-06-08 Autonetworks Technologies, Ltd. Electrical junction box
US20190029132A1 (en) * 2016-07-21 2019-01-24 Xcelsis Corporation Configurable smart object system with methods of making modules and contactors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140008780A1 (en) * 2011-07-26 2014-01-09 Mahiro Tsujino Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same
US20150131232A1 (en) * 2012-06-29 2015-05-14 Denso Corporation Semiconductor device and semiconductor device connection structure
US20170164488A1 (en) * 2014-07-02 2017-06-08 Autonetworks Technologies, Ltd. Electrical junction box
US20160141244A1 (en) * 2014-11-17 2016-05-19 Qualcomm Incorporated Integrated device package comprising an electromagnetic (em) passive device in an encapsulation layer, and an em shield
US20190029132A1 (en) * 2016-07-21 2019-01-24 Xcelsis Corporation Configurable smart object system with methods of making modules and contactors

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD942405S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD942404S1 (en) * 2019-01-11 2022-02-01 Fuji Electric Co., Ltd. Semiconductor module
USD1020742S1 (en) * 2021-07-21 2024-04-02 Mitsubishi Electric Corporation Memory card reader for programmable controller
USD1005142S1 (en) * 2021-11-11 2023-11-21 Tamura Corporation Current sensor
USD1005143S1 (en) * 2022-09-12 2023-11-21 Tamura Corporation Current sensor

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JP1643134S (ja) 2019-10-07

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