USD913230S1 - Heater for heating semiconductor wafer - Google Patents
Heater for heating semiconductor wafer Download PDFInfo
- Publication number
- USD913230S1 USD913230S1 US29/709,589 US201929709589F USD913230S US D913230 S1 USD913230 S1 US D913230S1 US 201929709589 F US201929709589 F US 201929709589F US D913230 S USD913230 S US D913230S
- Authority
- US
- United States
- Prior art keywords
- heater
- semiconductor wafer
- heating semiconductor
- heating
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines shown represent the portions of the heater for heating semiconductor wafer that form no part of the claimed design.
Claims (1)
- The ornamental design for a heater for heating semiconductor wafer, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-9164F JP1651167S (en) | 2019-04-24 | 2019-04-24 | |
JP2019-009164 | 2019-04-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD913230S1 true USD913230S1 (en) | 2021-03-16 |
Family
ID=69182931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/709,589 Active USD913230S1 (en) | 2019-04-24 | 2019-10-15 | Heater for heating semiconductor wafer |
Country Status (2)
Country | Link |
---|---|
US (1) | USD913230S1 (en) |
JP (1) | JP1651167S (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD990421S1 (en) * | 2021-05-31 | 2023-06-27 | Shindengen Electric Manufacturing Co., Ltd. | Coil |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD402156S (en) * | 1996-02-02 | 1998-12-08 | Ako-Werke Gmbh & Co. Kg | Radiant stove heating element |
USD410438S (en) * | 1997-01-31 | 1999-06-01 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
USD423028S (en) * | 1998-08-26 | 2000-04-18 | Matsushita Electric Industrial Co., Ltd. | Coil |
US6080970A (en) * | 1997-12-26 | 2000-06-27 | Kyocera Corporation | Wafer heating apparatus |
US20060096972A1 (en) * | 2004-10-28 | 2006-05-11 | Kyocera Corporation | Heater, wafer heating apparatus and method for manufacturing heater |
US8610034B2 (en) * | 2008-08-26 | 2013-12-17 | Nuflare Technology, Inc. | Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device |
USD706714S1 (en) * | 2010-03-12 | 2014-06-10 | Fluke Corporation | Rogowski coil |
USD797690S1 (en) * | 2015-03-16 | 2017-09-19 | Nuflare Technology, Inc. | Heater for semiconductor manufacturing apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
-
2019
- 2019-04-24 JP JPD2019-9164F patent/JP1651167S/ja active Active
- 2019-10-15 US US29/709,589 patent/USD913230S1/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD402156S (en) * | 1996-02-02 | 1998-12-08 | Ako-Werke Gmbh & Co. Kg | Radiant stove heating element |
USD410438S (en) * | 1997-01-31 | 1999-06-01 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
US6080970A (en) * | 1997-12-26 | 2000-06-27 | Kyocera Corporation | Wafer heating apparatus |
USD423028S (en) * | 1998-08-26 | 2000-04-18 | Matsushita Electric Industrial Co., Ltd. | Coil |
US20060096972A1 (en) * | 2004-10-28 | 2006-05-11 | Kyocera Corporation | Heater, wafer heating apparatus and method for manufacturing heater |
US8610034B2 (en) * | 2008-08-26 | 2013-12-17 | Nuflare Technology, Inc. | Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device |
USD706714S1 (en) * | 2010-03-12 | 2014-06-10 | Fluke Corporation | Rogowski coil |
USD797690S1 (en) * | 2015-03-16 | 2017-09-19 | Nuflare Technology, Inc. | Heater for semiconductor manufacturing apparatus |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD990421S1 (en) * | 2021-05-31 | 2023-06-27 | Shindengen Electric Manufacturing Co., Ltd. | Coil |
Also Published As
Publication number | Publication date |
---|---|
JP1651167S (en) | 2020-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |