USD913230S1 - Heater for heating semiconductor wafer - Google Patents

Heater for heating semiconductor wafer Download PDF

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Publication number
USD913230S1
USD913230S1 US29/709,589 US201929709589F USD913230S US D913230 S1 USD913230 S1 US D913230S1 US 201929709589 F US201929709589 F US 201929709589F US D913230 S USD913230 S US D913230S
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United States
Prior art keywords
heater
semiconductor wafer
heating semiconductor
heating
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/709,589
Inventor
Toshiki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, TOSHIKI
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Publication of USD913230S1 publication Critical patent/USD913230S1/en
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Description

FIG. 1 is a perspective view of a heater for heating semiconductor wafer, showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken lines shown represent the portions of the heater for heating semiconductor wafer that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heater for heating semiconductor wafer, as shown and described.
US29/709,589 2019-04-24 2019-10-15 Heater for heating semiconductor wafer Active USD913230S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-9164F JP1651167S (en) 2019-04-24 2019-04-24
JP2019-009164 2019-04-24

Publications (1)

Publication Number Publication Date
USD913230S1 true USD913230S1 (en) 2021-03-16

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US29/709,589 Active USD913230S1 (en) 2019-04-24 2019-10-15 Heater for heating semiconductor wafer

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US (1) USD913230S1 (en)
JP (1) JP1651167S (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD990421S1 (en) * 2021-05-31 2023-06-27 Shindengen Electric Manufacturing Co., Ltd. Coil

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD402156S (en) * 1996-02-02 1998-12-08 Ako-Werke Gmbh & Co. Kg Radiant stove heating element
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD423028S (en) * 1998-08-26 2000-04-18 Matsushita Electric Industrial Co., Ltd. Coil
US6080970A (en) * 1997-12-26 2000-06-27 Kyocera Corporation Wafer heating apparatus
US20060096972A1 (en) * 2004-10-28 2006-05-11 Kyocera Corporation Heater, wafer heating apparatus and method for manufacturing heater
US8610034B2 (en) * 2008-08-26 2013-12-17 Nuflare Technology, Inc. Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
USD706714S1 (en) * 2010-03-12 2014-06-10 Fluke Corporation Rogowski coil
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD402156S (en) * 1996-02-02 1998-12-08 Ako-Werke Gmbh & Co. Kg Radiant stove heating element
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US6080970A (en) * 1997-12-26 2000-06-27 Kyocera Corporation Wafer heating apparatus
USD423028S (en) * 1998-08-26 2000-04-18 Matsushita Electric Industrial Co., Ltd. Coil
US20060096972A1 (en) * 2004-10-28 2006-05-11 Kyocera Corporation Heater, wafer heating apparatus and method for manufacturing heater
US8610034B2 (en) * 2008-08-26 2013-12-17 Nuflare Technology, Inc. Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
USD706714S1 (en) * 2010-03-12 2014-06-10 Fluke Corporation Rogowski coil
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD990421S1 (en) * 2021-05-31 2023-06-27 Shindengen Electric Manufacturing Co., Ltd. Coil

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JP1651167S (en) 2020-01-27

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