USD913229S1 - Heater for heating semiconductor wafer - Google Patents

Heater for heating semiconductor wafer Download PDF

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Publication number
USD913229S1
USD913229S1 US29/709,587 US201929709587F USD913229S US D913229 S1 USD913229 S1 US D913229S1 US 201929709587 F US201929709587 F US 201929709587F US D913229 S USD913229 S US D913229S
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US
United States
Prior art keywords
heater
semiconductor wafer
heating semiconductor
heating
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/709,587
Inventor
Toshiki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
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Publication date
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Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, TOSHIKI
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Description

FIG. 1 is a perspective view of a heater for heating semiconductor wafer, showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a heater for heating semiconductor wafer, as shown and described.
US29/709,587 2019-04-24 2019-10-15 Heater for heating semiconductor wafer Active USD913229S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019009163F JP1646292S (en) 2019-04-24 2019-04-24
JP2019-009163 2019-04-24

Publications (1)

Publication Number Publication Date
USD913229S1 true USD913229S1 (en) 2021-03-16

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Family Applications (1)

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US29/709,587 Active USD913229S1 (en) 2019-04-24 2019-10-15 Heater for heating semiconductor wafer

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US (1) USD913229S1 (en)
JP (1) JP1646292S (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD402156S (en) * 1996-02-02 1998-12-08 Ako-Werke Gmbh & Co. Kg Radiant stove heating element
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD423028S (en) * 1998-08-26 2000-04-18 Matsushita Electric Industrial Co., Ltd. Coil
US6080970A (en) * 1997-12-26 2000-06-27 Kyocera Corporation Wafer heating apparatus
US20060096972A1 (en) * 2004-10-28 2006-05-11 Kyocera Corporation Heater, wafer heating apparatus and method for manufacturing heater
US8610034B2 (en) * 2008-08-26 2013-12-17 Nuflare Technology, Inc. Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
USD706714S1 (en) * 2010-03-12 2014-06-10 Fluke Corporation Rogowski coil
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD402156S (en) * 1996-02-02 1998-12-08 Ako-Werke Gmbh & Co. Kg Radiant stove heating element
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
US6080970A (en) * 1997-12-26 2000-06-27 Kyocera Corporation Wafer heating apparatus
USD423028S (en) * 1998-08-26 2000-04-18 Matsushita Electric Industrial Co., Ltd. Coil
US20060096972A1 (en) * 2004-10-28 2006-05-11 Kyocera Corporation Heater, wafer heating apparatus and method for manufacturing heater
US8610034B2 (en) * 2008-08-26 2013-12-17 Nuflare Technology, Inc. Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
USD706714S1 (en) * 2010-03-12 2014-06-10 Fluke Corporation Rogowski coil
USD797690S1 (en) * 2015-03-16 2017-09-19 Nuflare Technology, Inc. Heater for semiconductor manufacturing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Also Published As

Publication number Publication date
JP1646292S (en) 2019-11-25

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