USD903610S1 - Flexible heat sink - Google Patents
Flexible heat sink Download PDFInfo
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- USD903610S1 USD903610S1 US29/703,632 US201929703632F USD903610S US D903610 S1 USD903610 S1 US D903610S1 US 201929703632 F US201929703632 F US 201929703632F US D903610 S USD903610 S US D903610S
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The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
The shade lines in the Figures show contour and not surface ornamentation.
The white and black broken dash-dot-dot lines in the views define boundary lines and are not part of the claimed design. The evenly broken lines are used to depict environmental features for illustrative purposes only and form no part of the claimed design.
Claims (1)
- We claim the ornamental design for a flexible heat sink, as follows.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US29/703,632 USD903610S1 (en) | 2019-08-28 | 2019-08-28 | Flexible heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US29/703,632 USD903610S1 (en) | 2019-08-28 | 2019-08-28 | Flexible heat sink |
Publications (1)
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USD903610S1 true USD903610S1 (en) | 2020-12-01 |
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US29/703,632 Active USD903610S1 (en) | 2019-08-28 | 2019-08-28 | Flexible heat sink |
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US (1) | USD903610S1 (en) |
Citations (115)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2243979A (en) | 1935-12-17 | 1941-06-03 | Reynolds Metals Co | Production of aluminum-coated iron or steel |
US3234683A (en) * | 1961-10-19 | 1966-02-15 | Interlego Ag | Toy building element including a rotatable bushing |
US3640017A (en) * | 1968-02-01 | 1972-02-08 | Modulex As | Slide-bar assembly having complementary slidable members |
USD244632S (en) * | 1975-03-25 | 1977-06-07 | Interlego A.G. | Toy construction piece |
US4064300A (en) * | 1975-07-16 | 1977-12-20 | Rolls-Royce Limited | Laminated materials |
US5057903A (en) | 1989-07-17 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Thermal heat sink encapsulated integrated circuit |
US5102829A (en) | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
USD327185S (en) * | 1989-11-29 | 1992-06-23 | Interlego A.G. | Toy box |
US5369301A (en) * | 1993-07-08 | 1994-11-29 | Sumitomo Metal Industries, Ltd. | Pin-finned forged heat sink |
EP0662244A1 (en) | 1992-09-17 | 1995-07-12 | Olin Corporation | Plastic semiconductor package with aluminum heat spreader |
WO1996006321A1 (en) | 1994-08-22 | 1996-02-29 | Iowa State University Research Foundation, Inc. | Heat sink |
US5763296A (en) | 1991-11-21 | 1998-06-09 | Sgs-Thomson Microelectronics S.R.L. | Method for fabricating an electronic device structure with studs locating lead frame on backing plate |
USD398295S (en) * | 1996-10-08 | 1998-09-15 | Chih Pin Chang | Heat dissipating plate for computer parts |
US5912805A (en) * | 1998-11-04 | 1999-06-15 | Freuler; Raymond G. | Thermal interface with adhesive |
US5991155A (en) | 1996-12-13 | 1999-11-23 | Mitsubishi Denki Kabushiki Kaisha | Heat sink assembly including flexible heat spreader sheet |
US6142847A (en) * | 1998-12-30 | 2000-11-07 | 90Degrees, Inc. | Reflective I-rail interconnector |
US6221463B1 (en) * | 1998-07-08 | 2001-04-24 | Eugene W. White | Three-dimensional film structures and methods |
US6250127B1 (en) | 1999-10-11 | 2001-06-26 | Polese Company, Inc. | Heat-dissipating aluminum silicon carbide composite manufacturing method |
US6367541B2 (en) | 1999-05-06 | 2002-04-09 | Cool Options, Inc. | Conforming heat sink assembly |
US20020140336A1 (en) | 2001-03-27 | 2002-10-03 | Stoner Brian R. | Coated electrode with enhanced electron emission and ignition characteristics |
US20030183379A1 (en) | 2002-03-29 | 2003-10-02 | Krassowski Daniel W. | Optimized heat sink using high thermal conducting base and low thermal conducting fins |
US20040027816A1 (en) * | 2002-05-09 | 2004-02-12 | Ice Donald A. | Modular cage with heat sink for use with pluggable module |
USD487544S1 (en) * | 2002-09-20 | 2004-03-16 | Interlego Ag | Bucket lid |
US20040065717A1 (en) | 2000-10-18 | 2004-04-08 | Kinji Saijo | Multilayered metal laminate and process for producing the same |
US6724071B2 (en) | 1993-09-03 | 2004-04-20 | Asat, Limited | Molded plastic package with heat sink and enhanced electrical performance |
US20040105807A1 (en) | 2002-11-29 | 2004-06-03 | Shoushan Fan | Method for manufacturing carbon nanotubes |
US20040118579A1 (en) * | 2002-12-19 | 2004-06-24 | 3M Innovative Properties Company | Flexible heat sink |
US20040125266A1 (en) * | 2002-10-30 | 2004-07-01 | Akihiro Miyauchi | Functioning substrate with a group of columnar micro pillars and its manufacturing method |
US20040184981A1 (en) | 2003-03-19 | 2004-09-23 | Liang Liu | Carbon nanotube array and method for forming same |
US6800932B2 (en) | 1999-05-27 | 2004-10-05 | Advanced Analogic Technologies, Inc. | Package for semiconductor die containing symmetrical lead and heat sink |
US20040261987A1 (en) | 2003-06-30 | 2004-12-30 | Yuegang Zhang | Thermal interface apparatus, systems, and methods |
US6921462B2 (en) | 2001-12-17 | 2005-07-26 | Intel Corporation | Method and apparatus for producing aligned carbon nanotube thermal interface structure |
US20050214197A1 (en) | 2003-09-17 | 2005-09-29 | Molecular Nanosystems, Inc. | Methods for producing and using catalytic substrates for carbon nanotube growth |
US20050228097A1 (en) | 2004-03-30 | 2005-10-13 | General Electric Company | Thermally conductive compositions and methods of making thereof |
US6965513B2 (en) | 2001-12-20 | 2005-11-15 | Intel Corporation | Carbon nanotube thermal interface structures |
US20060073089A1 (en) | 2003-12-12 | 2006-04-06 | Rensselaer Polytechnic Institute | Carbon nanotube foam and method of making and using thereof |
US7056566B2 (en) * | 2000-05-17 | 2006-06-06 | Henkel Corporation | Preappliable phase change thermal interface pad |
US7086451B2 (en) | 2003-11-04 | 2006-08-08 | Hon Hai Precision Ind. Co., Ltd. | Heat sink with carbon nanotubes and method for manufacturing same |
US20060231970A1 (en) | 2005-04-14 | 2006-10-19 | Tsinghua Unversity | Method for manufacturing a thermal interface material |
US7173823B1 (en) * | 2004-12-18 | 2007-02-06 | Rinehart Motion Systems, Llc | Fluid cooled electrical assembly |
US20070091565A1 (en) * | 2005-10-25 | 2007-04-26 | Malone Christopher G | Impingement cooling of components in an electronic system |
US20070253889A1 (en) | 2002-06-19 | 2007-11-01 | Yuji Awano | Carbon nanotubes, process for their production, and catalyst for production of carbon nanotubes |
US20080095695A1 (en) | 2006-10-19 | 2008-04-24 | Shanov Vesselin N | Composite catalyst and method for manufacturing carbon nanostructured materials |
US20080149166A1 (en) | 2006-12-21 | 2008-06-26 | Goldeneye, Inc. | Compact light conversion device and light source with high thermal conductivity wavelength conversion material |
US20080160866A1 (en) | 2006-07-19 | 2008-07-03 | Tsinghua University | Method for manufacturing field emission cathode |
USD576185S1 (en) * | 2006-11-23 | 2008-09-02 | Rin-Soon Park | Abrasive segment |
US20080241755A1 (en) | 2007-02-01 | 2008-10-02 | Franklin Aaron D | Contact metallization of carbon nanotubes |
US20080236804A1 (en) | 2006-10-17 | 2008-10-02 | Cola Baratunde A | Electrothermal interface material enhancer |
US7443678B2 (en) * | 2005-08-18 | 2008-10-28 | Industrial Technology Research Institute | Flexible circuit board with heat sink |
US20080292840A1 (en) | 2004-05-19 | 2008-11-27 | The Regents Of The University Of California | Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive |
US7465605B2 (en) | 2005-12-14 | 2008-12-16 | Intel Corporation | In-situ functionalization of carbon nanotubes |
US20090032496A1 (en) | 2007-07-13 | 2009-02-05 | Tsinghua University | Method for manufacturing thermal interface material having carbon nanotubes |
US20090246507A1 (en) | 2008-01-15 | 2009-10-01 | Georgia Tech Research Corporation | Systems and methods for fabrication and transfer of carbon nanotubes |
US20100006272A1 (en) * | 2006-04-26 | 2010-01-14 | Horst Braun | Regulator Having a Cooling Body for an Electric Machine |
US20100027221A1 (en) | 2007-10-22 | 2010-02-04 | Fujitsu Limited | Sheet structure and method of manufacturing the same |
US20100053892A1 (en) * | 2008-08-29 | 2010-03-04 | Inventec Corporation | Electronic device and heat sink thereof |
US7828827B2 (en) * | 2002-05-24 | 2010-11-09 | Corium International, Inc. | Method of exfoliation of skin using closely-packed microstructures |
EP2251302A1 (en) | 2009-05-14 | 2010-11-17 | Samsung Electronics Co., Ltd. | Method of Manufacturing Carbon Nanotube Device Array |
US20110020593A1 (en) | 2008-03-06 | 2011-01-27 | Teijin Aramid B.V. | Ballistic resistant articles comprising elongate bodies |
US20110067841A1 (en) * | 2009-09-24 | 2011-03-24 | Gm Global Technology Operations, Inc. | Heat sink systems and devices |
US20110086464A1 (en) | 2009-10-12 | 2011-04-14 | Board Of Regents, The University Of Texas System | Tuning of fe catalysts for growth of spin-capable carbon nanotubes |
US20110103021A1 (en) | 2008-03-20 | 2011-05-05 | Robert Hendrik Catharina Janssen | Heatsinks of thermally conductive plastic materials |
USD647959S1 (en) * | 2010-04-14 | 2011-11-01 | Mark's Inc. | Notebook cover |
US8093715B2 (en) | 2005-08-05 | 2012-01-10 | Purdue Research Foundation | Enhancement of thermal interface conductivities with carbon nanotube arrays |
US20120018134A1 (en) * | 2009-01-13 | 2012-01-26 | Polk Jr Dale E | Heat Exchange Panel |
US20120090563A1 (en) * | 2009-06-23 | 2012-04-19 | Bekaert Combustion Technology B.V. | Core box with air vents integrated in pins |
US20120128880A1 (en) | 2006-08-25 | 2012-05-24 | Rensselaer Polytechnic Institute | Carbon nanotube growth on metallic substrate using vapor phase catalyst delivery |
US20120132410A1 (en) * | 2010-11-29 | 2012-05-31 | Honeywell International Inc. | Heat sink fin forming process |
US8226625B2 (en) | 2009-04-08 | 2012-07-24 | The Procter & Gamble Company | Stretchable laminates of nonwoven web(s) and elastic film |
CN302015674S (en) | 2011-09-16 | 2012-08-01 | 株式会社神户制钢所 | Plates for heat exchangers |
US20120217257A1 (en) * | 2011-02-25 | 2012-08-30 | Shao-Chieh Ting | Sleeve structure for a hand-held electronic device |
US20120325430A1 (en) * | 2011-06-21 | 2012-12-27 | Shih-Ming Chen | Fin type heat sink fixing assembly |
WO2013007645A2 (en) | 2011-07-08 | 2013-01-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Layer system having a layer of carbon nanotubes arranged parallel to one another and an electrically conductive surface layer, method for producing the layer system, and use of the layer system in microsystem technology |
US8377364B2 (en) * | 2006-07-04 | 2013-02-19 | Toppan Printing Co., Ltd. | Method of manufacturing microneedle |
JP2013115094A (en) | 2011-11-25 | 2013-06-10 | Fujitsu Ltd | Heat radiating material and method for manufacturing the same |
US20130153189A1 (en) * | 2011-12-18 | 2013-06-20 | Chia-Yu Lin | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
US20130234313A1 (en) | 2012-03-08 | 2013-09-12 | Texas Instruments Incorporated | Grown carbon nanotube die attach structures, articles, devices, and processes for making them |
US20130256868A1 (en) | 2008-06-23 | 2013-10-03 | Seoul Semiconductor Co., Ltd. | Thermal interface material for semiconductor chip and method for forming the same |
US20130284404A1 (en) * | 2011-11-11 | 2013-10-31 | Showa Denko K.K. | Liquid-cooled-type cooling device and manufacturing method for same |
USD694226S1 (en) * | 2011-04-29 | 2013-11-26 | Rubicon Communications, LP | Case for a portable electronic device |
USD694703S1 (en) * | 2013-06-24 | 2013-12-03 | Kevin Faro | Battery in shape of block |
US20140015158A1 (en) | 2012-07-11 | 2014-01-16 | Carbice Nanotechnologies, Inc. | Vertically aligned arrays of carbon nanotubes formed on multilayer substrates |
US20140083671A1 (en) * | 2012-09-27 | 2014-03-27 | Dowa Metaltech Co., Ltd. | Heat radiating plate and method for producing same |
US20150047822A1 (en) * | 2013-08-16 | 2015-02-19 | Hon Hai Precision Industry Co., Ltd. | Heat sink device with emi shielding function |
JP2015041768A (en) | 2013-08-23 | 2015-03-02 | 太陽工業株式会社 | Heat sink |
US9097468B2 (en) | 2009-03-25 | 2015-08-04 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
US20150245523A1 (en) * | 2012-08-09 | 2015-08-27 | Hitachi Automotive System, Ltd. | Power Module |
US20150338176A1 (en) * | 2014-05-25 | 2015-11-26 | Amulaire Thermal Technology, Inc. | Compound heat-dissipating device |
US20160069622A1 (en) * | 2013-04-23 | 2016-03-10 | Alexiou & Tryde Holding Aps | Heat Sink Having a Cooling Structure with Decreasing Structure Density |
US20160091260A1 (en) * | 2014-09-29 | 2016-03-31 | International Business Machines Corporation | Pin fin compliant heat sink with enhanced flexibility |
US20160158825A1 (en) * | 2014-12-05 | 2016-06-09 | Toyota Jidosha Kabushiki Kaisha | Pin fin forming method |
US20160234976A1 (en) * | 2013-10-07 | 2016-08-11 | Hitachi Automotive Systems, Ltd. | Power Conversion Device |
US20170018478A1 (en) * | 2015-07-14 | 2017-01-19 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Via structures for thermal dissipation |
WO2017087136A1 (en) | 2015-11-20 | 2017-05-26 | Laird Technologies, Inc. | Board level shield including an integrated heat sink |
USD792183S1 (en) * | 2014-10-30 | 2017-07-18 | Poppin, Inc. | Tool holder |
US20170280588A1 (en) * | 2016-03-23 | 2017-09-28 | Amulaire Thermal Technology, Inc. | Heat dissipating device |
US20170363375A1 (en) * | 2015-06-30 | 2017-12-21 | Georgia Tech Research Corporation | Heat exchanger with variable density feature arrays |
US20180087846A1 (en) * | 2016-09-25 | 2018-03-29 | Ralph Remsburg | Heat sink having thermal distortion compensation |
US20180149436A1 (en) * | 2016-11-30 | 2018-05-31 | National Cheng Kung University | High efficiency thermal conductivity structure |
US20180151472A1 (en) | 2016-11-29 | 2018-05-31 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
US10037930B2 (en) * | 2014-06-26 | 2018-07-31 | Hitachi Automotive Systems, Ltd. | Power semiconductor module and manufacturing method of power semiconductor module |
US20180317342A1 (en) * | 2015-10-30 | 2018-11-01 | Byd Company Limited | Base plate for heat sink as well as heat sink and igbt module having the same |
US20180359886A1 (en) * | 2014-03-07 | 2018-12-13 | Bridge Semiconductor Corp. | Methods of making interconnect substrate having stress modulator and crack inhibiting layer and making flip chip assembly thereof |
US20180363893A1 (en) | 2015-12-21 | 2018-12-20 | Sabic Global Technologies B.V. | Thermal conductive flexible pcb and all plastic heat sink for led bulb retrofit |
USD839253S1 (en) * | 2016-02-05 | 2019-01-29 | Multi-Blocks Gadget Limited | Mobile phone case with an embossed surface |
US20190139863A1 (en) | 2016-07-26 | 2019-05-09 | Showa Denko K.K. | Cooling apparatus |
US10287471B2 (en) * | 2014-12-05 | 2019-05-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
US10297523B2 (en) | 2014-12-09 | 2019-05-21 | Delta Electronics, Inc. | Power module and method for manufacturing the same |
US20190219313A1 (en) * | 2018-01-18 | 2019-07-18 | Mahle International Gmbh | Stacked plate heat exchanger |
US20190221501A1 (en) * | 2016-10-07 | 2019-07-18 | Showa Denko K.K. | Method of producing heat-dissipating unit |
US20190237382A1 (en) * | 2018-01-29 | 2019-08-01 | Samsung Electronics Co., Ltd. | Semiconductor package including a thermal conductive layer and method of manufacturing the same |
US20190302325A1 (en) * | 2018-04-02 | 2019-10-03 | Northrop Grumman Systems Corporation | Reflection and diffraction control with slanted semiconductor metamaterials |
USD865876S1 (en) * | 2016-03-15 | 2019-11-05 | STUT NO. 1 Pty Ltd | Stackable block |
US20190369294A1 (en) * | 2018-05-29 | 2019-12-05 | North Carolina State University | Enhancing optical transmission of multlayer composites with interfacial nanostructures |
-
2019
- 2019-08-28 US US29/703,632 patent/USD903610S1/en active Active
Patent Citations (118)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2243979A (en) | 1935-12-17 | 1941-06-03 | Reynolds Metals Co | Production of aluminum-coated iron or steel |
US3234683A (en) * | 1961-10-19 | 1966-02-15 | Interlego Ag | Toy building element including a rotatable bushing |
US3640017A (en) * | 1968-02-01 | 1972-02-08 | Modulex As | Slide-bar assembly having complementary slidable members |
USD244632S (en) * | 1975-03-25 | 1977-06-07 | Interlego A.G. | Toy construction piece |
US4064300A (en) * | 1975-07-16 | 1977-12-20 | Rolls-Royce Limited | Laminated materials |
US5057903A (en) | 1989-07-17 | 1991-10-15 | Microelectronics And Computer Technology Corporation | Thermal heat sink encapsulated integrated circuit |
USD327185S (en) * | 1989-11-29 | 1992-06-23 | Interlego A.G. | Toy box |
US5102829A (en) | 1991-07-22 | 1992-04-07 | At&T Bell Laboratories | Plastic pin grid array package |
US5763296A (en) | 1991-11-21 | 1998-06-09 | Sgs-Thomson Microelectronics S.R.L. | Method for fabricating an electronic device structure with studs locating lead frame on backing plate |
EP0662244A1 (en) | 1992-09-17 | 1995-07-12 | Olin Corporation | Plastic semiconductor package with aluminum heat spreader |
US5369301A (en) * | 1993-07-08 | 1994-11-29 | Sumitomo Metal Industries, Ltd. | Pin-finned forged heat sink |
US6724071B2 (en) | 1993-09-03 | 2004-04-20 | Asat, Limited | Molded plastic package with heat sink and enhanced electrical performance |
WO1996006321A1 (en) | 1994-08-22 | 1996-02-29 | Iowa State University Research Foundation, Inc. | Heat sink |
USD398295S (en) * | 1996-10-08 | 1998-09-15 | Chih Pin Chang | Heat dissipating plate for computer parts |
US5991155A (en) | 1996-12-13 | 1999-11-23 | Mitsubishi Denki Kabushiki Kaisha | Heat sink assembly including flexible heat spreader sheet |
US6221463B1 (en) * | 1998-07-08 | 2001-04-24 | Eugene W. White | Three-dimensional film structures and methods |
US5912805A (en) * | 1998-11-04 | 1999-06-15 | Freuler; Raymond G. | Thermal interface with adhesive |
US6142847A (en) * | 1998-12-30 | 2000-11-07 | 90Degrees, Inc. | Reflective I-rail interconnector |
US6367541B2 (en) | 1999-05-06 | 2002-04-09 | Cool Options, Inc. | Conforming heat sink assembly |
US6800932B2 (en) | 1999-05-27 | 2004-10-05 | Advanced Analogic Technologies, Inc. | Package for semiconductor die containing symmetrical lead and heat sink |
US6250127B1 (en) | 1999-10-11 | 2001-06-26 | Polese Company, Inc. | Heat-dissipating aluminum silicon carbide composite manufacturing method |
US7056566B2 (en) * | 2000-05-17 | 2006-06-06 | Henkel Corporation | Preappliable phase change thermal interface pad |
US20040065717A1 (en) | 2000-10-18 | 2004-04-08 | Kinji Saijo | Multilayered metal laminate and process for producing the same |
US20020140336A1 (en) | 2001-03-27 | 2002-10-03 | Stoner Brian R. | Coated electrode with enhanced electron emission and ignition characteristics |
US6921462B2 (en) | 2001-12-17 | 2005-07-26 | Intel Corporation | Method and apparatus for producing aligned carbon nanotube thermal interface structure |
US6965513B2 (en) | 2001-12-20 | 2005-11-15 | Intel Corporation | Carbon nanotube thermal interface structures |
US20030183379A1 (en) | 2002-03-29 | 2003-10-02 | Krassowski Daniel W. | Optimized heat sink using high thermal conducting base and low thermal conducting fins |
US20040027816A1 (en) * | 2002-05-09 | 2004-02-12 | Ice Donald A. | Modular cage with heat sink for use with pluggable module |
US7828827B2 (en) * | 2002-05-24 | 2010-11-09 | Corium International, Inc. | Method of exfoliation of skin using closely-packed microstructures |
US20070253889A1 (en) | 2002-06-19 | 2007-11-01 | Yuji Awano | Carbon nanotubes, process for their production, and catalyst for production of carbon nanotubes |
USD487544S1 (en) * | 2002-09-20 | 2004-03-16 | Interlego Ag | Bucket lid |
US20040125266A1 (en) * | 2002-10-30 | 2004-07-01 | Akihiro Miyauchi | Functioning substrate with a group of columnar micro pillars and its manufacturing method |
US20040105807A1 (en) | 2002-11-29 | 2004-06-03 | Shoushan Fan | Method for manufacturing carbon nanotubes |
US6919504B2 (en) | 2002-12-19 | 2005-07-19 | 3M Innovative Properties Company | Flexible heat sink |
US20040118579A1 (en) * | 2002-12-19 | 2004-06-24 | 3M Innovative Properties Company | Flexible heat sink |
US7399919B2 (en) * | 2002-12-19 | 2008-07-15 | 3M Innovative Properties Company | Flexible heat sink |
US20040184981A1 (en) | 2003-03-19 | 2004-09-23 | Liang Liu | Carbon nanotube array and method for forming same |
US20040261987A1 (en) | 2003-06-30 | 2004-12-30 | Yuegang Zhang | Thermal interface apparatus, systems, and methods |
US20050214197A1 (en) | 2003-09-17 | 2005-09-29 | Molecular Nanosystems, Inc. | Methods for producing and using catalytic substrates for carbon nanotube growth |
US7086451B2 (en) | 2003-11-04 | 2006-08-08 | Hon Hai Precision Ind. Co., Ltd. | Heat sink with carbon nanotubes and method for manufacturing same |
US20060073089A1 (en) | 2003-12-12 | 2006-04-06 | Rensselaer Polytechnic Institute | Carbon nanotube foam and method of making and using thereof |
US20050228097A1 (en) | 2004-03-30 | 2005-10-13 | General Electric Company | Thermally conductive compositions and methods of making thereof |
US20080292840A1 (en) | 2004-05-19 | 2008-11-27 | The Regents Of The University Of California | Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive |
US7173823B1 (en) * | 2004-12-18 | 2007-02-06 | Rinehart Motion Systems, Llc | Fluid cooled electrical assembly |
US20060231970A1 (en) | 2005-04-14 | 2006-10-19 | Tsinghua Unversity | Method for manufacturing a thermal interface material |
US8093715B2 (en) | 2005-08-05 | 2012-01-10 | Purdue Research Foundation | Enhancement of thermal interface conductivities with carbon nanotube arrays |
US7443678B2 (en) * | 2005-08-18 | 2008-10-28 | Industrial Technology Research Institute | Flexible circuit board with heat sink |
US20070091565A1 (en) * | 2005-10-25 | 2007-04-26 | Malone Christopher G | Impingement cooling of components in an electronic system |
US7465605B2 (en) | 2005-12-14 | 2008-12-16 | Intel Corporation | In-situ functionalization of carbon nanotubes |
US20100006272A1 (en) * | 2006-04-26 | 2010-01-14 | Horst Braun | Regulator Having a Cooling Body for an Electric Machine |
US8377364B2 (en) * | 2006-07-04 | 2013-02-19 | Toppan Printing Co., Ltd. | Method of manufacturing microneedle |
US20080160866A1 (en) | 2006-07-19 | 2008-07-03 | Tsinghua University | Method for manufacturing field emission cathode |
US20120128880A1 (en) | 2006-08-25 | 2012-05-24 | Rensselaer Polytechnic Institute | Carbon nanotube growth on metallic substrate using vapor phase catalyst delivery |
US20080236804A1 (en) | 2006-10-17 | 2008-10-02 | Cola Baratunde A | Electrothermal interface material enhancer |
US8220530B2 (en) | 2006-10-17 | 2012-07-17 | Purdue Research Foundation | Electrothermal interface material enhancer |
US20080095695A1 (en) | 2006-10-19 | 2008-04-24 | Shanov Vesselin N | Composite catalyst and method for manufacturing carbon nanostructured materials |
USD576185S1 (en) * | 2006-11-23 | 2008-09-02 | Rin-Soon Park | Abrasive segment |
US20080149166A1 (en) | 2006-12-21 | 2008-06-26 | Goldeneye, Inc. | Compact light conversion device and light source with high thermal conductivity wavelength conversion material |
US20080241755A1 (en) | 2007-02-01 | 2008-10-02 | Franklin Aaron D | Contact metallization of carbon nanotubes |
US20090032496A1 (en) | 2007-07-13 | 2009-02-05 | Tsinghua University | Method for manufacturing thermal interface material having carbon nanotubes |
US20100027221A1 (en) | 2007-10-22 | 2010-02-04 | Fujitsu Limited | Sheet structure and method of manufacturing the same |
US20090246507A1 (en) | 2008-01-15 | 2009-10-01 | Georgia Tech Research Corporation | Systems and methods for fabrication and transfer of carbon nanotubes |
US20110020593A1 (en) | 2008-03-06 | 2011-01-27 | Teijin Aramid B.V. | Ballistic resistant articles comprising elongate bodies |
US20110103021A1 (en) | 2008-03-20 | 2011-05-05 | Robert Hendrik Catharina Janssen | Heatsinks of thermally conductive plastic materials |
US20130256868A1 (en) | 2008-06-23 | 2013-10-03 | Seoul Semiconductor Co., Ltd. | Thermal interface material for semiconductor chip and method for forming the same |
US20100053892A1 (en) * | 2008-08-29 | 2010-03-04 | Inventec Corporation | Electronic device and heat sink thereof |
US20120018134A1 (en) * | 2009-01-13 | 2012-01-26 | Polk Jr Dale E | Heat Exchange Panel |
US9097468B2 (en) | 2009-03-25 | 2015-08-04 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
US8226625B2 (en) | 2009-04-08 | 2012-07-24 | The Procter & Gamble Company | Stretchable laminates of nonwoven web(s) and elastic film |
EP2251302A1 (en) | 2009-05-14 | 2010-11-17 | Samsung Electronics Co., Ltd. | Method of Manufacturing Carbon Nanotube Device Array |
US20120090563A1 (en) * | 2009-06-23 | 2012-04-19 | Bekaert Combustion Technology B.V. | Core box with air vents integrated in pins |
US20110067841A1 (en) * | 2009-09-24 | 2011-03-24 | Gm Global Technology Operations, Inc. | Heat sink systems and devices |
US20110086464A1 (en) | 2009-10-12 | 2011-04-14 | Board Of Regents, The University Of Texas System | Tuning of fe catalysts for growth of spin-capable carbon nanotubes |
USD647959S1 (en) * | 2010-04-14 | 2011-11-01 | Mark's Inc. | Notebook cover |
US20120132410A1 (en) * | 2010-11-29 | 2012-05-31 | Honeywell International Inc. | Heat sink fin forming process |
US20120217257A1 (en) * | 2011-02-25 | 2012-08-30 | Shao-Chieh Ting | Sleeve structure for a hand-held electronic device |
USD694226S1 (en) * | 2011-04-29 | 2013-11-26 | Rubicon Communications, LP | Case for a portable electronic device |
US20120325430A1 (en) * | 2011-06-21 | 2012-12-27 | Shih-Ming Chen | Fin type heat sink fixing assembly |
WO2013007645A2 (en) | 2011-07-08 | 2013-01-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Layer system having a layer of carbon nanotubes arranged parallel to one another and an electrically conductive surface layer, method for producing the layer system, and use of the layer system in microsystem technology |
CN302015674S (en) | 2011-09-16 | 2012-08-01 | 株式会社神户制钢所 | Plates for heat exchangers |
US20130284404A1 (en) * | 2011-11-11 | 2013-10-31 | Showa Denko K.K. | Liquid-cooled-type cooling device and manufacturing method for same |
JP2013115094A (en) | 2011-11-25 | 2013-06-10 | Fujitsu Ltd | Heat radiating material and method for manufacturing the same |
US20130153189A1 (en) * | 2011-12-18 | 2013-06-20 | Chia-Yu Lin | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
US20130234313A1 (en) | 2012-03-08 | 2013-09-12 | Texas Instruments Incorporated | Grown carbon nanotube die attach structures, articles, devices, and processes for making them |
US20140015158A1 (en) | 2012-07-11 | 2014-01-16 | Carbice Nanotechnologies, Inc. | Vertically aligned arrays of carbon nanotubes formed on multilayer substrates |
US20150245523A1 (en) * | 2012-08-09 | 2015-08-27 | Hitachi Automotive System, Ltd. | Power Module |
US20140083671A1 (en) * | 2012-09-27 | 2014-03-27 | Dowa Metaltech Co., Ltd. | Heat radiating plate and method for producing same |
US20160069622A1 (en) * | 2013-04-23 | 2016-03-10 | Alexiou & Tryde Holding Aps | Heat Sink Having a Cooling Structure with Decreasing Structure Density |
USD694703S1 (en) * | 2013-06-24 | 2013-12-03 | Kevin Faro | Battery in shape of block |
US20150047822A1 (en) * | 2013-08-16 | 2015-02-19 | Hon Hai Precision Industry Co., Ltd. | Heat sink device with emi shielding function |
JP2015041768A (en) | 2013-08-23 | 2015-03-02 | 太陽工業株式会社 | Heat sink |
US20160234976A1 (en) * | 2013-10-07 | 2016-08-11 | Hitachi Automotive Systems, Ltd. | Power Conversion Device |
US20180359886A1 (en) * | 2014-03-07 | 2018-12-13 | Bridge Semiconductor Corp. | Methods of making interconnect substrate having stress modulator and crack inhibiting layer and making flip chip assembly thereof |
US20150338176A1 (en) * | 2014-05-25 | 2015-11-26 | Amulaire Thermal Technology, Inc. | Compound heat-dissipating device |
US10037930B2 (en) * | 2014-06-26 | 2018-07-31 | Hitachi Automotive Systems, Ltd. | Power semiconductor module and manufacturing method of power semiconductor module |
US20160091260A1 (en) * | 2014-09-29 | 2016-03-31 | International Business Machines Corporation | Pin fin compliant heat sink with enhanced flexibility |
USD792183S1 (en) * | 2014-10-30 | 2017-07-18 | Poppin, Inc. | Tool holder |
US20160158825A1 (en) * | 2014-12-05 | 2016-06-09 | Toyota Jidosha Kabushiki Kaisha | Pin fin forming method |
US10287471B2 (en) * | 2014-12-05 | 2019-05-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
US10297523B2 (en) | 2014-12-09 | 2019-05-21 | Delta Electronics, Inc. | Power module and method for manufacturing the same |
US20170363375A1 (en) * | 2015-06-30 | 2017-12-21 | Georgia Tech Research Corporation | Heat exchanger with variable density feature arrays |
US20170018478A1 (en) * | 2015-07-14 | 2017-01-19 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Via structures for thermal dissipation |
US20180317342A1 (en) * | 2015-10-30 | 2018-11-01 | Byd Company Limited | Base plate for heat sink as well as heat sink and igbt module having the same |
WO2017087136A1 (en) | 2015-11-20 | 2017-05-26 | Laird Technologies, Inc. | Board level shield including an integrated heat sink |
US20180363893A1 (en) | 2015-12-21 | 2018-12-20 | Sabic Global Technologies B.V. | Thermal conductive flexible pcb and all plastic heat sink for led bulb retrofit |
USD839253S1 (en) * | 2016-02-05 | 2019-01-29 | Multi-Blocks Gadget Limited | Mobile phone case with an embossed surface |
USD865876S1 (en) * | 2016-03-15 | 2019-11-05 | STUT NO. 1 Pty Ltd | Stackable block |
US20170280588A1 (en) * | 2016-03-23 | 2017-09-28 | Amulaire Thermal Technology, Inc. | Heat dissipating device |
USD822625S1 (en) * | 2016-04-26 | 2018-07-10 | Showa Denko K.K. | Fin for heat exchanger |
US20190139863A1 (en) | 2016-07-26 | 2019-05-09 | Showa Denko K.K. | Cooling apparatus |
US20180087846A1 (en) * | 2016-09-25 | 2018-03-29 | Ralph Remsburg | Heat sink having thermal distortion compensation |
US20190221501A1 (en) * | 2016-10-07 | 2019-07-18 | Showa Denko K.K. | Method of producing heat-dissipating unit |
US20180151472A1 (en) | 2016-11-29 | 2018-05-31 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
US20180149436A1 (en) * | 2016-11-30 | 2018-05-31 | National Cheng Kung University | High efficiency thermal conductivity structure |
US20190219313A1 (en) * | 2018-01-18 | 2019-07-18 | Mahle International Gmbh | Stacked plate heat exchanger |
US20190237382A1 (en) * | 2018-01-29 | 2019-08-01 | Samsung Electronics Co., Ltd. | Semiconductor package including a thermal conductive layer and method of manufacturing the same |
US20190302325A1 (en) * | 2018-04-02 | 2019-10-03 | Northrop Grumman Systems Corporation | Reflection and diffraction control with slanted semiconductor metamaterials |
US20190369294A1 (en) * | 2018-05-29 | 2019-12-05 | North Carolina State University | Enhancing optical transmission of multlayer composites with interfacial nanostructures |
Non-Patent Citations (22)
Title |
---|
13th IEEE ITHERM Conference, "Microfabrication of Short Pin Fins on Heat Sink Surfaces to Augment Heat Transfer Performance" , Congshun Wang, Youmin Yu, Terrence Simon, and Tianhong Cui. 2012 (Year: 2012). * |
140 mm Pin Din Heatsink Square Shapes, https://www.alibaba.com/product-detail/140mm-Pin-Fin-Heatsink-Square-Shapes_60775112298.html, accessed Oct. 2, 2019. |
2013 IEEE International Conference on 3D System Integration, "Contact Testing of Copper Micro-pillars with Very Low Damage for 3D IC Assembly", Onnik Yaglioglu , Ben Eldridge . 2013 (Year: 2013). * |
Amazon,"Easycargo Raspberry Pi 4 Heatsink Copper Kit.", First on sale May 29, 2018. (https://www.amazon.com/Easycargo-Raspberry-Heatsink-Conductive-Adhesive/dp/B07D4BWK6G) (Year: 2018). * |
Bayer, et al., Support-Catalyst-Gas interactions during carbon nanotube growth on metallic ta films, J Phys. Chem., 115:4359-69 (2011). |
Cola, et al., "Contact mechanics and thermal conductance of carbon nanotube array interfaces", Int. J. Heat Mass Trans., 52:3490-3503 (2009). |
Cu/Al Pin Fin Heat Sink_Heat Sink_Jacarlos Industries Co. Ltd., www.jacarlosworld.com/view/asp?id=159, 1-2, accessed Oct. 2, 2019. |
Dagan, et al., "Hybrid heat sinks provide optimal cooling for embedded systems", https://www/embedded.com/print/4027004, 1-5, (2009). |
Dai, et al., "Controlled growth and modification of vertically-aligned carbon nanotubes for multifunctional applications", Mater. Sci. Eng., 70:63-91 (2010). |
Embedded, "Hybrid heat sinks provide optimal cooling for embedded systems", Posted May 20, 2009. (https://www.embedded.com/hybrid-heat-sinks-provide-optimal-cooling-for-embedded-systems/) (Year: 2009). * |
Hildreth, et al., "Conformally coating vertically aligned carbon nanotube arrays using thermal decomposition of iron pentacarbonyl", J Vac Sci Technol. B, 30(3):03D1011-03D1013 (2012). |
Kim, et al., "Evolution in catalyst morphology leads to carbon nanotube growth termination", J Phys. Chem. Lett, 1:918-22 (2010). |
Learn How AlSiC substrates Offer CTE matching for Thermal Dissipation, https://www.indium.com/blog/learn-how-alsic-substrates-offer-cte-matching-for-thermal-dissipation.php, 1-4, (2010). |
MIT News, "Better surfaces could help dissipate heat", Published Jun. 26, 2012. (http://news.mit.edu/2012/better-heat-transfer-0626) (Year: 2012). * |
Research Micro Stamps, "shop", Cached on May 18, 2017. (https://researchmicrostamps.com/shop-online/) (Year: 2017). * |
Sleasman, et al., "Cool Running Autos", https;//powersystemsdesign.com/articles/cool-running-autos/22/5339, 1-6, (2010). |
Thermocool, "Copper base bonded fin heatsink", first cached on Jul. 6, 2017. (https://thermocoolcorp.com/project/copper-base-bonded-fin-heatsink/) (Year: 2017). * |
Toshiba Machine, "Micro-Pattern Imprinting Machine ST Series", Cached on Feb. 28, 2015. (http://www.toshiba-machine.co.jp/en/product/nano/lineup/st/imprint.html) (Year: 2015). * |
U.S. Appl. No. 16/021,562, filed Jun. 28, 2018. (unpublished application). |
YGmetal, "Substrate & Heat sinks", Posted Dec. 6, 2018. (https://www.ygmetal.com/info/substrate-heat-sinks-30971008.html) (Year: 2018). * |
Youtube, "TCP3D Flexible 3D Printed Composite Heat Sink for SSD, LEDs, CPUs, etc.", Uploaded by TCPoly on Jan. 25, 2018. (https://www.youtube.com/watch?v=ta2vwQrOq14) (Year: 2018). * |
Youtube, "Thermal Interface Material Explanation", uploaded by user Advanced Thermal Solutions, Inc. on Jan. 23, 2018. (https://www.youtube.com/watch?v=MAdTWlpnzbA) (Year: 2018). * |
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