USD903610S1 - Flexible heat sink - Google Patents

Flexible heat sink Download PDF

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Publication number
USD903610S1
USD903610S1 US29/703,632 US201929703632F USD903610S US D903610 S1 USD903610 S1 US D903610S1 US 201929703632 F US201929703632 F US 201929703632F US D903610 S USD903610 S US D903610S
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view
heat sink
flexible heat
elevation
mirror image
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US29/703,632
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Baratunde Cola
Craig Green
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Carbice Corp
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Carbice Corp
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Priority to US29/703,632 priority Critical patent/USD903610S1/en
Assigned to CARBICE CORPORATION reassignment CARBICE CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLA, BARATUNDE, GREEN, CRAIG
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Assigned to WESTERN ALLIANCE BANK reassignment WESTERN ALLIANCE BANK SECURITY AGREEMENT Assignors: CARBICE CORPORATION
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The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
FIG. 1 is a top isometric view of a flexible heat sink showing our new design in grey scale;
FIG. 2 is a front elevation view thereof, each of the right elevation, left elevation, and rear elevation views being a mirror image thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a top isometric view of the heat sink illustrated in FIGS. 1 to 4 on a curved surface;
FIG. 6 is a front elevation view thereof, the rear elevation view being a mirror image thereof;
FIG. 7 is a top view thereof;
FIG. 8 is a bottom view thereof; and
FIG. 9 is a top isometric view of a heat sink showing our new design in color;
FIG. 10 is a front elevation view thereof, each of the right elevation, left elevation, and rear elevation views being a mirror image thereof;
FIG. 11 is a top view thereof;
FIG. 12 is a bottom view thereof;
FIG. 13 is a top isometric view of the heat sink illustrated in FIGS. 10 to 13 on a curved surface;
FIG. 14 is a front elevation view thereof, the rear elevation view being a mirror image thereof;
FIG. 15 is a top view thereof;
FIG. 16 is a bottom view thereof; and
FIG. 17 is a top isometric view of a heat sink showing our new design in color;
FIG. 18 is a front elevation view thereof, each of the right elevation, left elevation, and rear elevation views being a mirror image thereof;
FIG. 19 is a top view thereof;
FIG. 20 is a bottom view thereof;
FIG. 21 is a top isometric view of the heat sink illustrated in FIGS. 17 to 20 on a curved surface;
FIG. 22 is a front elevation view thereof, the rear elevation view being a mirror image thereof;
FIG. 23 is a top view thereof; and,
FIG. 24 is a bottom view thereof.
The shade lines in the Figures show contour and not surface ornamentation.
The white and black broken dash-dot-dot lines in the views define boundary lines and are not part of the claimed design. The evenly broken lines are used to depict environmental features for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. We claim the ornamental design for a flexible heat sink, as follows.
US29/703,632 2019-08-28 2019-08-28 Flexible heat sink Active USD903610S1 (en)

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Citations (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2243979A (en) 1935-12-17 1941-06-03 Reynolds Metals Co Production of aluminum-coated iron or steel
US3234683A (en) * 1961-10-19 1966-02-15 Interlego Ag Toy building element including a rotatable bushing
US3640017A (en) * 1968-02-01 1972-02-08 Modulex As Slide-bar assembly having complementary slidable members
USD244632S (en) * 1975-03-25 1977-06-07 Interlego A.G. Toy construction piece
US4064300A (en) * 1975-07-16 1977-12-20 Rolls-Royce Limited Laminated materials
US5057903A (en) 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
US5102829A (en) 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
USD327185S (en) * 1989-11-29 1992-06-23 Interlego A.G. Toy box
US5369301A (en) * 1993-07-08 1994-11-29 Sumitomo Metal Industries, Ltd. Pin-finned forged heat sink
EP0662244A1 (en) 1992-09-17 1995-07-12 Olin Corporation Plastic semiconductor package with aluminum heat spreader
WO1996006321A1 (en) 1994-08-22 1996-02-29 Iowa State University Research Foundation, Inc. Heat sink
US5763296A (en) 1991-11-21 1998-06-09 Sgs-Thomson Microelectronics S.R.L. Method for fabricating an electronic device structure with studs locating lead frame on backing plate
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US5991155A (en) 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
US6142847A (en) * 1998-12-30 2000-11-07 90Degrees, Inc. Reflective I-rail interconnector
US6221463B1 (en) * 1998-07-08 2001-04-24 Eugene W. White Three-dimensional film structures and methods
US6250127B1 (en) 1999-10-11 2001-06-26 Polese Company, Inc. Heat-dissipating aluminum silicon carbide composite manufacturing method
US6367541B2 (en) 1999-05-06 2002-04-09 Cool Options, Inc. Conforming heat sink assembly
US20020140336A1 (en) 2001-03-27 2002-10-03 Stoner Brian R. Coated electrode with enhanced electron emission and ignition characteristics
US20030183379A1 (en) 2002-03-29 2003-10-02 Krassowski Daniel W. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US20040027816A1 (en) * 2002-05-09 2004-02-12 Ice Donald A. Modular cage with heat sink for use with pluggable module
USD487544S1 (en) * 2002-09-20 2004-03-16 Interlego Ag Bucket lid
US20040065717A1 (en) 2000-10-18 2004-04-08 Kinji Saijo Multilayered metal laminate and process for producing the same
US6724071B2 (en) 1993-09-03 2004-04-20 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US20040105807A1 (en) 2002-11-29 2004-06-03 Shoushan Fan Method for manufacturing carbon nanotubes
US20040118579A1 (en) * 2002-12-19 2004-06-24 3M Innovative Properties Company Flexible heat sink
US20040125266A1 (en) * 2002-10-30 2004-07-01 Akihiro Miyauchi Functioning substrate with a group of columnar micro pillars and its manufacturing method
US20040184981A1 (en) 2003-03-19 2004-09-23 Liang Liu Carbon nanotube array and method for forming same
US6800932B2 (en) 1999-05-27 2004-10-05 Advanced Analogic Technologies, Inc. Package for semiconductor die containing symmetrical lead and heat sink
US20040261987A1 (en) 2003-06-30 2004-12-30 Yuegang Zhang Thermal interface apparatus, systems, and methods
US6921462B2 (en) 2001-12-17 2005-07-26 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US20050214197A1 (en) 2003-09-17 2005-09-29 Molecular Nanosystems, Inc. Methods for producing and using catalytic substrates for carbon nanotube growth
US20050228097A1 (en) 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
US6965513B2 (en) 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
US20060073089A1 (en) 2003-12-12 2006-04-06 Rensselaer Polytechnic Institute Carbon nanotube foam and method of making and using thereof
US7056566B2 (en) * 2000-05-17 2006-06-06 Henkel Corporation Preappliable phase change thermal interface pad
US7086451B2 (en) 2003-11-04 2006-08-08 Hon Hai Precision Ind. Co., Ltd. Heat sink with carbon nanotubes and method for manufacturing same
US20060231970A1 (en) 2005-04-14 2006-10-19 Tsinghua Unversity Method for manufacturing a thermal interface material
US7173823B1 (en) * 2004-12-18 2007-02-06 Rinehart Motion Systems, Llc Fluid cooled electrical assembly
US20070091565A1 (en) * 2005-10-25 2007-04-26 Malone Christopher G Impingement cooling of components in an electronic system
US20070253889A1 (en) 2002-06-19 2007-11-01 Yuji Awano Carbon nanotubes, process for their production, and catalyst for production of carbon nanotubes
US20080095695A1 (en) 2006-10-19 2008-04-24 Shanov Vesselin N Composite catalyst and method for manufacturing carbon nanostructured materials
US20080149166A1 (en) 2006-12-21 2008-06-26 Goldeneye, Inc. Compact light conversion device and light source with high thermal conductivity wavelength conversion material
US20080160866A1 (en) 2006-07-19 2008-07-03 Tsinghua University Method for manufacturing field emission cathode
USD576185S1 (en) * 2006-11-23 2008-09-02 Rin-Soon Park Abrasive segment
US20080241755A1 (en) 2007-02-01 2008-10-02 Franklin Aaron D Contact metallization of carbon nanotubes
US20080236804A1 (en) 2006-10-17 2008-10-02 Cola Baratunde A Electrothermal interface material enhancer
US7443678B2 (en) * 2005-08-18 2008-10-28 Industrial Technology Research Institute Flexible circuit board with heat sink
US20080292840A1 (en) 2004-05-19 2008-11-27 The Regents Of The University Of California Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive
US7465605B2 (en) 2005-12-14 2008-12-16 Intel Corporation In-situ functionalization of carbon nanotubes
US20090032496A1 (en) 2007-07-13 2009-02-05 Tsinghua University Method for manufacturing thermal interface material having carbon nanotubes
US20090246507A1 (en) 2008-01-15 2009-10-01 Georgia Tech Research Corporation Systems and methods for fabrication and transfer of carbon nanotubes
US20100006272A1 (en) * 2006-04-26 2010-01-14 Horst Braun Regulator Having a Cooling Body for an Electric Machine
US20100027221A1 (en) 2007-10-22 2010-02-04 Fujitsu Limited Sheet structure and method of manufacturing the same
US20100053892A1 (en) * 2008-08-29 2010-03-04 Inventec Corporation Electronic device and heat sink thereof
US7828827B2 (en) * 2002-05-24 2010-11-09 Corium International, Inc. Method of exfoliation of skin using closely-packed microstructures
EP2251302A1 (en) 2009-05-14 2010-11-17 Samsung Electronics Co., Ltd. Method of Manufacturing Carbon Nanotube Device Array
US20110020593A1 (en) 2008-03-06 2011-01-27 Teijin Aramid B.V. Ballistic resistant articles comprising elongate bodies
US20110067841A1 (en) * 2009-09-24 2011-03-24 Gm Global Technology Operations, Inc. Heat sink systems and devices
US20110086464A1 (en) 2009-10-12 2011-04-14 Board Of Regents, The University Of Texas System Tuning of fe catalysts for growth of spin-capable carbon nanotubes
US20110103021A1 (en) 2008-03-20 2011-05-05 Robert Hendrik Catharina Janssen Heatsinks of thermally conductive plastic materials
USD647959S1 (en) * 2010-04-14 2011-11-01 Mark's Inc. Notebook cover
US8093715B2 (en) 2005-08-05 2012-01-10 Purdue Research Foundation Enhancement of thermal interface conductivities with carbon nanotube arrays
US20120018134A1 (en) * 2009-01-13 2012-01-26 Polk Jr Dale E Heat Exchange Panel
US20120090563A1 (en) * 2009-06-23 2012-04-19 Bekaert Combustion Technology B.V. Core box with air vents integrated in pins
US20120128880A1 (en) 2006-08-25 2012-05-24 Rensselaer Polytechnic Institute Carbon nanotube growth on metallic substrate using vapor phase catalyst delivery
US20120132410A1 (en) * 2010-11-29 2012-05-31 Honeywell International Inc. Heat sink fin forming process
US8226625B2 (en) 2009-04-08 2012-07-24 The Procter & Gamble Company Stretchable laminates of nonwoven web(s) and elastic film
CN302015674S (en) 2011-09-16 2012-08-01 株式会社神户制钢所 Plates for heat exchangers
US20120217257A1 (en) * 2011-02-25 2012-08-30 Shao-Chieh Ting Sleeve structure for a hand-held electronic device
US20120325430A1 (en) * 2011-06-21 2012-12-27 Shih-Ming Chen Fin type heat sink fixing assembly
WO2013007645A2 (en) 2011-07-08 2013-01-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Layer system having a layer of carbon nanotubes arranged parallel to one another and an electrically conductive surface layer, method for producing the layer system, and use of the layer system in microsystem technology
US8377364B2 (en) * 2006-07-04 2013-02-19 Toppan Printing Co., Ltd. Method of manufacturing microneedle
JP2013115094A (en) 2011-11-25 2013-06-10 Fujitsu Ltd Heat radiating material and method for manufacturing the same
US20130153189A1 (en) * 2011-12-18 2013-06-20 Chia-Yu Lin Heat dissipating fin, heat dissipating device and method of manufacturing the same
US20130234313A1 (en) 2012-03-08 2013-09-12 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
US20130256868A1 (en) 2008-06-23 2013-10-03 Seoul Semiconductor Co., Ltd. Thermal interface material for semiconductor chip and method for forming the same
US20130284404A1 (en) * 2011-11-11 2013-10-31 Showa Denko K.K. Liquid-cooled-type cooling device and manufacturing method for same
USD694226S1 (en) * 2011-04-29 2013-11-26 Rubicon Communications, LP Case for a portable electronic device
USD694703S1 (en) * 2013-06-24 2013-12-03 Kevin Faro Battery in shape of block
US20140015158A1 (en) 2012-07-11 2014-01-16 Carbice Nanotechnologies, Inc. Vertically aligned arrays of carbon nanotubes formed on multilayer substrates
US20140083671A1 (en) * 2012-09-27 2014-03-27 Dowa Metaltech Co., Ltd. Heat radiating plate and method for producing same
US20150047822A1 (en) * 2013-08-16 2015-02-19 Hon Hai Precision Industry Co., Ltd. Heat sink device with emi shielding function
JP2015041768A (en) 2013-08-23 2015-03-02 太陽工業株式会社 Heat sink
US9097468B2 (en) 2009-03-25 2015-08-04 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
US20150245523A1 (en) * 2012-08-09 2015-08-27 Hitachi Automotive System, Ltd. Power Module
US20150338176A1 (en) * 2014-05-25 2015-11-26 Amulaire Thermal Technology, Inc. Compound heat-dissipating device
US20160069622A1 (en) * 2013-04-23 2016-03-10 Alexiou & Tryde Holding Aps Heat Sink Having a Cooling Structure with Decreasing Structure Density
US20160091260A1 (en) * 2014-09-29 2016-03-31 International Business Machines Corporation Pin fin compliant heat sink with enhanced flexibility
US20160158825A1 (en) * 2014-12-05 2016-06-09 Toyota Jidosha Kabushiki Kaisha Pin fin forming method
US20160234976A1 (en) * 2013-10-07 2016-08-11 Hitachi Automotive Systems, Ltd. Power Conversion Device
US20170018478A1 (en) * 2015-07-14 2017-01-19 Avago Technologies General Ip (Singapore) Pte. Ltd. Via structures for thermal dissipation
WO2017087136A1 (en) 2015-11-20 2017-05-26 Laird Technologies, Inc. Board level shield including an integrated heat sink
USD792183S1 (en) * 2014-10-30 2017-07-18 Poppin, Inc. Tool holder
US20170280588A1 (en) * 2016-03-23 2017-09-28 Amulaire Thermal Technology, Inc. Heat dissipating device
US20170363375A1 (en) * 2015-06-30 2017-12-21 Georgia Tech Research Corporation Heat exchanger with variable density feature arrays
US20180087846A1 (en) * 2016-09-25 2018-03-29 Ralph Remsburg Heat sink having thermal distortion compensation
US20180149436A1 (en) * 2016-11-30 2018-05-31 National Cheng Kung University High efficiency thermal conductivity structure
US20180151472A1 (en) 2016-11-29 2018-05-31 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
US10037930B2 (en) * 2014-06-26 2018-07-31 Hitachi Automotive Systems, Ltd. Power semiconductor module and manufacturing method of power semiconductor module
US20180317342A1 (en) * 2015-10-30 2018-11-01 Byd Company Limited Base plate for heat sink as well as heat sink and igbt module having the same
US20180359886A1 (en) * 2014-03-07 2018-12-13 Bridge Semiconductor Corp. Methods of making interconnect substrate having stress modulator and crack inhibiting layer and making flip chip assembly thereof
US20180363893A1 (en) 2015-12-21 2018-12-20 Sabic Global Technologies B.V. Thermal conductive flexible pcb and all plastic heat sink for led bulb retrofit
USD839253S1 (en) * 2016-02-05 2019-01-29 Multi-Blocks Gadget Limited Mobile phone case with an embossed surface
US20190139863A1 (en) 2016-07-26 2019-05-09 Showa Denko K.K. Cooling apparatus
US10287471B2 (en) * 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10297523B2 (en) 2014-12-09 2019-05-21 Delta Electronics, Inc. Power module and method for manufacturing the same
US20190219313A1 (en) * 2018-01-18 2019-07-18 Mahle International Gmbh Stacked plate heat exchanger
US20190221501A1 (en) * 2016-10-07 2019-07-18 Showa Denko K.K. Method of producing heat-dissipating unit
US20190237382A1 (en) * 2018-01-29 2019-08-01 Samsung Electronics Co., Ltd. Semiconductor package including a thermal conductive layer and method of manufacturing the same
US20190302325A1 (en) * 2018-04-02 2019-10-03 Northrop Grumman Systems Corporation Reflection and diffraction control with slanted semiconductor metamaterials
USD865876S1 (en) * 2016-03-15 2019-11-05 STUT NO. 1 Pty Ltd Stackable block
US20190369294A1 (en) * 2018-05-29 2019-12-05 North Carolina State University Enhancing optical transmission of multlayer composites with interfacial nanostructures

Patent Citations (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2243979A (en) 1935-12-17 1941-06-03 Reynolds Metals Co Production of aluminum-coated iron or steel
US3234683A (en) * 1961-10-19 1966-02-15 Interlego Ag Toy building element including a rotatable bushing
US3640017A (en) * 1968-02-01 1972-02-08 Modulex As Slide-bar assembly having complementary slidable members
USD244632S (en) * 1975-03-25 1977-06-07 Interlego A.G. Toy construction piece
US4064300A (en) * 1975-07-16 1977-12-20 Rolls-Royce Limited Laminated materials
US5057903A (en) 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
USD327185S (en) * 1989-11-29 1992-06-23 Interlego A.G. Toy box
US5102829A (en) 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
US5763296A (en) 1991-11-21 1998-06-09 Sgs-Thomson Microelectronics S.R.L. Method for fabricating an electronic device structure with studs locating lead frame on backing plate
EP0662244A1 (en) 1992-09-17 1995-07-12 Olin Corporation Plastic semiconductor package with aluminum heat spreader
US5369301A (en) * 1993-07-08 1994-11-29 Sumitomo Metal Industries, Ltd. Pin-finned forged heat sink
US6724071B2 (en) 1993-09-03 2004-04-20 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
WO1996006321A1 (en) 1994-08-22 1996-02-29 Iowa State University Research Foundation, Inc. Heat sink
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
US5991155A (en) 1996-12-13 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Heat sink assembly including flexible heat spreader sheet
US6221463B1 (en) * 1998-07-08 2001-04-24 Eugene W. White Three-dimensional film structures and methods
US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US6142847A (en) * 1998-12-30 2000-11-07 90Degrees, Inc. Reflective I-rail interconnector
US6367541B2 (en) 1999-05-06 2002-04-09 Cool Options, Inc. Conforming heat sink assembly
US6800932B2 (en) 1999-05-27 2004-10-05 Advanced Analogic Technologies, Inc. Package for semiconductor die containing symmetrical lead and heat sink
US6250127B1 (en) 1999-10-11 2001-06-26 Polese Company, Inc. Heat-dissipating aluminum silicon carbide composite manufacturing method
US7056566B2 (en) * 2000-05-17 2006-06-06 Henkel Corporation Preappliable phase change thermal interface pad
US20040065717A1 (en) 2000-10-18 2004-04-08 Kinji Saijo Multilayered metal laminate and process for producing the same
US20020140336A1 (en) 2001-03-27 2002-10-03 Stoner Brian R. Coated electrode with enhanced electron emission and ignition characteristics
US6921462B2 (en) 2001-12-17 2005-07-26 Intel Corporation Method and apparatus for producing aligned carbon nanotube thermal interface structure
US6965513B2 (en) 2001-12-20 2005-11-15 Intel Corporation Carbon nanotube thermal interface structures
US20030183379A1 (en) 2002-03-29 2003-10-02 Krassowski Daniel W. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US20040027816A1 (en) * 2002-05-09 2004-02-12 Ice Donald A. Modular cage with heat sink for use with pluggable module
US7828827B2 (en) * 2002-05-24 2010-11-09 Corium International, Inc. Method of exfoliation of skin using closely-packed microstructures
US20070253889A1 (en) 2002-06-19 2007-11-01 Yuji Awano Carbon nanotubes, process for their production, and catalyst for production of carbon nanotubes
USD487544S1 (en) * 2002-09-20 2004-03-16 Interlego Ag Bucket lid
US20040125266A1 (en) * 2002-10-30 2004-07-01 Akihiro Miyauchi Functioning substrate with a group of columnar micro pillars and its manufacturing method
US20040105807A1 (en) 2002-11-29 2004-06-03 Shoushan Fan Method for manufacturing carbon nanotubes
US6919504B2 (en) 2002-12-19 2005-07-19 3M Innovative Properties Company Flexible heat sink
US20040118579A1 (en) * 2002-12-19 2004-06-24 3M Innovative Properties Company Flexible heat sink
US7399919B2 (en) * 2002-12-19 2008-07-15 3M Innovative Properties Company Flexible heat sink
US20040184981A1 (en) 2003-03-19 2004-09-23 Liang Liu Carbon nanotube array and method for forming same
US20040261987A1 (en) 2003-06-30 2004-12-30 Yuegang Zhang Thermal interface apparatus, systems, and methods
US20050214197A1 (en) 2003-09-17 2005-09-29 Molecular Nanosystems, Inc. Methods for producing and using catalytic substrates for carbon nanotube growth
US7086451B2 (en) 2003-11-04 2006-08-08 Hon Hai Precision Ind. Co., Ltd. Heat sink with carbon nanotubes and method for manufacturing same
US20060073089A1 (en) 2003-12-12 2006-04-06 Rensselaer Polytechnic Institute Carbon nanotube foam and method of making and using thereof
US20050228097A1 (en) 2004-03-30 2005-10-13 General Electric Company Thermally conductive compositions and methods of making thereof
US20080292840A1 (en) 2004-05-19 2008-11-27 The Regents Of The University Of California Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive
US7173823B1 (en) * 2004-12-18 2007-02-06 Rinehart Motion Systems, Llc Fluid cooled electrical assembly
US20060231970A1 (en) 2005-04-14 2006-10-19 Tsinghua Unversity Method for manufacturing a thermal interface material
US8093715B2 (en) 2005-08-05 2012-01-10 Purdue Research Foundation Enhancement of thermal interface conductivities with carbon nanotube arrays
US7443678B2 (en) * 2005-08-18 2008-10-28 Industrial Technology Research Institute Flexible circuit board with heat sink
US20070091565A1 (en) * 2005-10-25 2007-04-26 Malone Christopher G Impingement cooling of components in an electronic system
US7465605B2 (en) 2005-12-14 2008-12-16 Intel Corporation In-situ functionalization of carbon nanotubes
US20100006272A1 (en) * 2006-04-26 2010-01-14 Horst Braun Regulator Having a Cooling Body for an Electric Machine
US8377364B2 (en) * 2006-07-04 2013-02-19 Toppan Printing Co., Ltd. Method of manufacturing microneedle
US20080160866A1 (en) 2006-07-19 2008-07-03 Tsinghua University Method for manufacturing field emission cathode
US20120128880A1 (en) 2006-08-25 2012-05-24 Rensselaer Polytechnic Institute Carbon nanotube growth on metallic substrate using vapor phase catalyst delivery
US20080236804A1 (en) 2006-10-17 2008-10-02 Cola Baratunde A Electrothermal interface material enhancer
US8220530B2 (en) 2006-10-17 2012-07-17 Purdue Research Foundation Electrothermal interface material enhancer
US20080095695A1 (en) 2006-10-19 2008-04-24 Shanov Vesselin N Composite catalyst and method for manufacturing carbon nanostructured materials
USD576185S1 (en) * 2006-11-23 2008-09-02 Rin-Soon Park Abrasive segment
US20080149166A1 (en) 2006-12-21 2008-06-26 Goldeneye, Inc. Compact light conversion device and light source with high thermal conductivity wavelength conversion material
US20080241755A1 (en) 2007-02-01 2008-10-02 Franklin Aaron D Contact metallization of carbon nanotubes
US20090032496A1 (en) 2007-07-13 2009-02-05 Tsinghua University Method for manufacturing thermal interface material having carbon nanotubes
US20100027221A1 (en) 2007-10-22 2010-02-04 Fujitsu Limited Sheet structure and method of manufacturing the same
US20090246507A1 (en) 2008-01-15 2009-10-01 Georgia Tech Research Corporation Systems and methods for fabrication and transfer of carbon nanotubes
US20110020593A1 (en) 2008-03-06 2011-01-27 Teijin Aramid B.V. Ballistic resistant articles comprising elongate bodies
US20110103021A1 (en) 2008-03-20 2011-05-05 Robert Hendrik Catharina Janssen Heatsinks of thermally conductive plastic materials
US20130256868A1 (en) 2008-06-23 2013-10-03 Seoul Semiconductor Co., Ltd. Thermal interface material for semiconductor chip and method for forming the same
US20100053892A1 (en) * 2008-08-29 2010-03-04 Inventec Corporation Electronic device and heat sink thereof
US20120018134A1 (en) * 2009-01-13 2012-01-26 Polk Jr Dale E Heat Exchange Panel
US9097468B2 (en) 2009-03-25 2015-08-04 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
US8226625B2 (en) 2009-04-08 2012-07-24 The Procter & Gamble Company Stretchable laminates of nonwoven web(s) and elastic film
EP2251302A1 (en) 2009-05-14 2010-11-17 Samsung Electronics Co., Ltd. Method of Manufacturing Carbon Nanotube Device Array
US20120090563A1 (en) * 2009-06-23 2012-04-19 Bekaert Combustion Technology B.V. Core box with air vents integrated in pins
US20110067841A1 (en) * 2009-09-24 2011-03-24 Gm Global Technology Operations, Inc. Heat sink systems and devices
US20110086464A1 (en) 2009-10-12 2011-04-14 Board Of Regents, The University Of Texas System Tuning of fe catalysts for growth of spin-capable carbon nanotubes
USD647959S1 (en) * 2010-04-14 2011-11-01 Mark's Inc. Notebook cover
US20120132410A1 (en) * 2010-11-29 2012-05-31 Honeywell International Inc. Heat sink fin forming process
US20120217257A1 (en) * 2011-02-25 2012-08-30 Shao-Chieh Ting Sleeve structure for a hand-held electronic device
USD694226S1 (en) * 2011-04-29 2013-11-26 Rubicon Communications, LP Case for a portable electronic device
US20120325430A1 (en) * 2011-06-21 2012-12-27 Shih-Ming Chen Fin type heat sink fixing assembly
WO2013007645A2 (en) 2011-07-08 2013-01-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Layer system having a layer of carbon nanotubes arranged parallel to one another and an electrically conductive surface layer, method for producing the layer system, and use of the layer system in microsystem technology
CN302015674S (en) 2011-09-16 2012-08-01 株式会社神户制钢所 Plates for heat exchangers
US20130284404A1 (en) * 2011-11-11 2013-10-31 Showa Denko K.K. Liquid-cooled-type cooling device and manufacturing method for same
JP2013115094A (en) 2011-11-25 2013-06-10 Fujitsu Ltd Heat radiating material and method for manufacturing the same
US20130153189A1 (en) * 2011-12-18 2013-06-20 Chia-Yu Lin Heat dissipating fin, heat dissipating device and method of manufacturing the same
US20130234313A1 (en) 2012-03-08 2013-09-12 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
US20140015158A1 (en) 2012-07-11 2014-01-16 Carbice Nanotechnologies, Inc. Vertically aligned arrays of carbon nanotubes formed on multilayer substrates
US20150245523A1 (en) * 2012-08-09 2015-08-27 Hitachi Automotive System, Ltd. Power Module
US20140083671A1 (en) * 2012-09-27 2014-03-27 Dowa Metaltech Co., Ltd. Heat radiating plate and method for producing same
US20160069622A1 (en) * 2013-04-23 2016-03-10 Alexiou & Tryde Holding Aps Heat Sink Having a Cooling Structure with Decreasing Structure Density
USD694703S1 (en) * 2013-06-24 2013-12-03 Kevin Faro Battery in shape of block
US20150047822A1 (en) * 2013-08-16 2015-02-19 Hon Hai Precision Industry Co., Ltd. Heat sink device with emi shielding function
JP2015041768A (en) 2013-08-23 2015-03-02 太陽工業株式会社 Heat sink
US20160234976A1 (en) * 2013-10-07 2016-08-11 Hitachi Automotive Systems, Ltd. Power Conversion Device
US20180359886A1 (en) * 2014-03-07 2018-12-13 Bridge Semiconductor Corp. Methods of making interconnect substrate having stress modulator and crack inhibiting layer and making flip chip assembly thereof
US20150338176A1 (en) * 2014-05-25 2015-11-26 Amulaire Thermal Technology, Inc. Compound heat-dissipating device
US10037930B2 (en) * 2014-06-26 2018-07-31 Hitachi Automotive Systems, Ltd. Power semiconductor module and manufacturing method of power semiconductor module
US20160091260A1 (en) * 2014-09-29 2016-03-31 International Business Machines Corporation Pin fin compliant heat sink with enhanced flexibility
USD792183S1 (en) * 2014-10-30 2017-07-18 Poppin, Inc. Tool holder
US20160158825A1 (en) * 2014-12-05 2016-06-09 Toyota Jidosha Kabushiki Kaisha Pin fin forming method
US10287471B2 (en) * 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10297523B2 (en) 2014-12-09 2019-05-21 Delta Electronics, Inc. Power module and method for manufacturing the same
US20170363375A1 (en) * 2015-06-30 2017-12-21 Georgia Tech Research Corporation Heat exchanger with variable density feature arrays
US20170018478A1 (en) * 2015-07-14 2017-01-19 Avago Technologies General Ip (Singapore) Pte. Ltd. Via structures for thermal dissipation
US20180317342A1 (en) * 2015-10-30 2018-11-01 Byd Company Limited Base plate for heat sink as well as heat sink and igbt module having the same
WO2017087136A1 (en) 2015-11-20 2017-05-26 Laird Technologies, Inc. Board level shield including an integrated heat sink
US20180363893A1 (en) 2015-12-21 2018-12-20 Sabic Global Technologies B.V. Thermal conductive flexible pcb and all plastic heat sink for led bulb retrofit
USD839253S1 (en) * 2016-02-05 2019-01-29 Multi-Blocks Gadget Limited Mobile phone case with an embossed surface
USD865876S1 (en) * 2016-03-15 2019-11-05 STUT NO. 1 Pty Ltd Stackable block
US20170280588A1 (en) * 2016-03-23 2017-09-28 Amulaire Thermal Technology, Inc. Heat dissipating device
USD822625S1 (en) * 2016-04-26 2018-07-10 Showa Denko K.K. Fin for heat exchanger
US20190139863A1 (en) 2016-07-26 2019-05-09 Showa Denko K.K. Cooling apparatus
US20180087846A1 (en) * 2016-09-25 2018-03-29 Ralph Remsburg Heat sink having thermal distortion compensation
US20190221501A1 (en) * 2016-10-07 2019-07-18 Showa Denko K.K. Method of producing heat-dissipating unit
US20180151472A1 (en) 2016-11-29 2018-05-31 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
US20180149436A1 (en) * 2016-11-30 2018-05-31 National Cheng Kung University High efficiency thermal conductivity structure
US20190219313A1 (en) * 2018-01-18 2019-07-18 Mahle International Gmbh Stacked plate heat exchanger
US20190237382A1 (en) * 2018-01-29 2019-08-01 Samsung Electronics Co., Ltd. Semiconductor package including a thermal conductive layer and method of manufacturing the same
US20190302325A1 (en) * 2018-04-02 2019-10-03 Northrop Grumman Systems Corporation Reflection and diffraction control with slanted semiconductor metamaterials
US20190369294A1 (en) * 2018-05-29 2019-12-05 North Carolina State University Enhancing optical transmission of multlayer composites with interfacial nanostructures

Non-Patent Citations (22)

* Cited by examiner, † Cited by third party
Title
13th IEEE ITHERM Conference, "Microfabrication of Short Pin Fins on Heat Sink Surfaces to Augment Heat Transfer Performance" , Congshun Wang, Youmin Yu, Terrence Simon, and Tianhong Cui. 2012 (Year: 2012). *
140 mm Pin Din Heatsink Square Shapes, https://www.alibaba.com/product-detail/140mm-Pin-Fin-Heatsink-Square-Shapes_60775112298.html, accessed Oct. 2, 2019.
2013 IEEE International Conference on 3D System Integration, "Contact Testing of Copper Micro-pillars with Very Low Damage for 3D IC Assembly", Onnik Yaglioglu , Ben Eldridge . 2013 (Year: 2013). *
Amazon,"Easycargo Raspberry Pi 4 Heatsink Copper Kit.", First on sale May 29, 2018. (https://www.amazon.com/Easycargo-Raspberry-Heatsink-Conductive-Adhesive/dp/B07D4BWK6G) (Year: 2018). *
Bayer, et al., Support-Catalyst-Gas interactions during carbon nanotube growth on metallic ta films, J Phys. Chem., 115:4359-69 (2011).
Cola, et al., "Contact mechanics and thermal conductance of carbon nanotube array interfaces", Int. J. Heat Mass Trans., 52:3490-3503 (2009).
Cu/Al Pin Fin Heat Sink_Heat Sink_Jacarlos Industries Co. Ltd., www.jacarlosworld.com/view/asp?id=159, 1-2, accessed Oct. 2, 2019.
Dagan, et al., "Hybrid heat sinks provide optimal cooling for embedded systems", https://www/embedded.com/print/4027004, 1-5, (2009).
Dai, et al., "Controlled growth and modification of vertically-aligned carbon nanotubes for multifunctional applications", Mater. Sci. Eng., 70:63-91 (2010).
Embedded, "Hybrid heat sinks provide optimal cooling for embedded systems", Posted May 20, 2009. (https://www.embedded.com/hybrid-heat-sinks-provide-optimal-cooling-for-embedded-systems/) (Year: 2009). *
Hildreth, et al., "Conformally coating vertically aligned carbon nanotube arrays using thermal decomposition of iron pentacarbonyl", J Vac Sci Technol. B, 30(3):03D1011-03D1013 (2012).
Kim, et al., "Evolution in catalyst morphology leads to carbon nanotube growth termination", J Phys. Chem. Lett, 1:918-22 (2010).
Learn How AlSiC substrates Offer CTE matching for Thermal Dissipation, https://www.indium.com/blog/learn-how-alsic-substrates-offer-cte-matching-for-thermal-dissipation.php, 1-4, (2010).
MIT News, "Better surfaces could help dissipate heat", Published Jun. 26, 2012. (http://news.mit.edu/2012/better-heat-transfer-0626) (Year: 2012). *
Research Micro Stamps, "shop", Cached on May 18, 2017. (https://researchmicrostamps.com/shop-online/) (Year: 2017). *
Sleasman, et al., "Cool Running Autos", https;//powersystemsdesign.com/articles/cool-running-autos/22/5339, 1-6, (2010).
Thermocool, "Copper base bonded fin heatsink", first cached on Jul. 6, 2017. (https://thermocoolcorp.com/project/copper-base-bonded-fin-heatsink/) (Year: 2017). *
Toshiba Machine, "Micro-Pattern Imprinting Machine ST Series", Cached on Feb. 28, 2015. (http://www.toshiba-machine.co.jp/en/product/nano/lineup/st/imprint.html) (Year: 2015). *
U.S. Appl. No. 16/021,562, filed Jun. 28, 2018. (unpublished application).
YGmetal, "Substrate & Heat sinks", Posted Dec. 6, 2018. (https://www.ygmetal.com/info/substrate-heat-sinks-30971008.html) (Year: 2018). *
Youtube, "TCP3D Flexible 3D Printed Composite Heat Sink for SSD, LEDs, CPUs, etc.", Uploaded by TCPoly on Jan. 25, 2018. (https://www.youtube.com/watch?v=ta2vwQrOq14) (Year: 2018). *
Youtube, "Thermal Interface Material Explanation", uploaded by user Advanced Thermal Solutions, Inc. on Jan. 23, 2018. (https://www.youtube.com/watch?v=MAdTWlpnzbA) (Year: 2018). *

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