USD881822S1 - Material having an edge shape - Google Patents

Material having an edge shape Download PDF

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Publication number
USD881822S1
USD881822S1 US29/621,302 US201729621302F USD881822S US D881822 S1 USD881822 S1 US D881822S1 US 201729621302 F US201729621302 F US 201729621302F US D881822 S USD881822 S US D881822S
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United States
Prior art keywords
edge shape
edge
shape
view
ornamental design
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US29/621,302
Inventor
Michael S. WLADYKA
Keith David JOHNSON
Jason L. Strader
Mark D. Kittel
Jingting YANG
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Laird Technologies Inc
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Laird Technologies Inc
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Priority to US29/621,302 priority Critical patent/USD881822S1/en
Assigned to LAIRD TECHNOLOGIES, INC. reassignment LAIRD TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: STRADER, JASON L., KITTEL, MARK D., YANG, JINGTING, JOHNSON, KEITH DAVID, WLADYKA, MICHAEL S.
Priority to US29/731,731 priority patent/USD998827S1/en
Application granted granted Critical
Publication of USD881822S1 publication Critical patent/USD881822S1/en
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FIG. 1 is a perspective view of a material having an edge shape, showing our new design;
FIG. 2 is a cross-sectional perspective view of the material having an edge shape of FIG. 1, taken along lines 2-2 in FIG. 1;
FIG. 3 is a top plan view of the material having an edge shape of FIG. 1;
FIG. 4 is a right side elevation view of the material having an edge shape of FIG. 1; and,
FIG. 5 is a left side elevation view of the material having an edge shape of FIG. 1.
The broken lines in FIGS. 1-7 illustrate portions of the material having an edge shape that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a material having an edge shape, as shown and described.
US29/621,302 2017-10-06 2017-10-06 Material having an edge shape Active USD881822S1 (en)

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US29/621,302 USD881822S1 (en) 2017-10-06 2017-10-06 Material having an edge shape
US29/731,731 USD998827S1 (en) 2017-10-06 2020-04-17 Material having edge shape

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US29/621,302 USD881822S1 (en) 2017-10-06 2017-10-06 Material having an edge shape

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US29/731,731 Division USD998827S1 (en) 2017-10-06 2020-04-17 Material having edge shape

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD930536S1 (en) * 2019-07-12 2021-09-14 Jinhao Guo Weatherstrip for car door
US11731224B2 (en) 2018-04-28 2023-08-22 Laird Technologies, Inc. Systems and methods of applying materials to components
USD998827S1 (en) * 2017-10-06 2023-09-12 Laird Technologies, Inc. Material having edge shape
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging

Citations (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058537A (en) 1976-01-05 1977-11-15 Ciba-Geigy Corporation Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols
US4199490A (en) 1974-05-07 1980-04-22 Asahi Kasei Kogyo Kabushiki Kaisha Block copolymer latex composition
US4678115A (en) 1985-04-15 1987-07-07 Ontario Technologies Corporation Method for making layered foil structure
US4863551A (en) 1987-08-10 1989-09-05 Yoshido Kogyo K.K. Marking apparatus
USD344489S (en) * 1991-11-04 1994-02-22 Texstar, Inc. Fairing seal for aircraft canopy
USD348387S (en) * 1990-09-21 1994-07-05 The Serco Corporation Loading dock seal
WO1997041599A1 (en) 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5700340A (en) 1993-10-22 1997-12-23 Ykk Corporation Method of manufacturing a tape having a succession of surface-type fastener pieces
US5943557A (en) 1996-09-25 1999-08-24 Micron Technology, Inc. Method and structure for attaching a semiconductor die to a lead frame
US6391686B1 (en) 1999-06-14 2002-05-21 Seiko Epson Corporation Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument
US20030037866A1 (en) 2001-08-22 2003-02-27 Shin-Etsu Chemical Co., Ltd. Method of bonding a heat radiating sheet
US20030234322A1 (en) * 2002-06-25 2003-12-25 Ralph Bladt Aircraft windows and associated methods for installation
US6696639B1 (en) * 1999-06-24 2004-02-24 Nokia Corporation Protecting device against interfering electromagnetic radiation comprising EMI-gaskets
US20040180474A1 (en) 2003-03-10 2004-09-16 Oman Todd P. Electronic assembly having electrically-isolated heat-conductive structure and method therefor
US20040188814A1 (en) 2003-03-31 2004-09-30 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US20040262372A1 (en) 2003-06-26 2004-12-30 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20040262743A1 (en) 2003-06-26 2004-12-30 Intel Corporation Thermal interface structure with integrated liquid cooling and methods
US20040261980A1 (en) 2003-06-30 2004-12-30 Dani Ashay A. Heat dissipating device with preselected designed interface for thermal interface materials
JP2005327923A (en) 2004-05-14 2005-11-24 Alps Electric Co Ltd Method and device of sticking conductive joint film
US6987671B2 (en) 2003-06-26 2006-01-17 Intel Corporation Composite thermal interface devices and methods for integrated circuit heat transfer
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US20070193672A1 (en) 2006-02-22 2007-08-23 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
KR100827725B1 (en) 2007-05-02 2008-05-08 티티엠주식회사 Pcm attachment method and automatic machine thereof
US20090000818A1 (en) * 2007-06-29 2009-01-01 Michael Poulsen Perforated emi gaskets and related methods
US7488900B1 (en) * 2006-09-22 2009-02-10 Laird Technologies, Inc. Gaskets for providing environmental sealing and/or electromagnetic interference (EMI) shielding
JP2010235953A (en) 2002-05-02 2010-10-21 Three M Innovative Properties Co Thermally conductive sheet and method for producing the same
US7906845B1 (en) 2008-04-23 2011-03-15 Amkor Technology, Inc. Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
USD644757S1 (en) * 2009-10-06 2011-09-06 Elematic Group Oy Chamfer strip
JP2012084688A (en) 2010-10-12 2012-04-26 Nitto Denko Corp Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
USD690272S1 (en) * 2011-05-05 2013-09-24 Laird Technologies, Inc. Profile for a co-extrusion
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
EP2814057A2 (en) 2013-06-14 2014-12-17 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
US8916419B2 (en) 2012-03-29 2014-12-23 Taiwan Semiconductor Manufacturing Company, Ltd. Lid attach process and apparatus for fabrication of semiconductor packages
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
US9016629B1 (en) * 2011-11-28 2015-04-28 The Boeing Company Combined pressure and thermal window system for space vehicles
USD728773S1 (en) * 2012-05-08 2015-05-05 Laird Technologies, Inc. Vent panel
USD731078S1 (en) * 2013-07-25 2015-06-02 Chad Marcus Frenette Transition strip
US9089044B1 (en) * 2014-04-04 2015-07-21 Laird Technologies, Inc. EMI shielding connector gasket
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
US9257364B2 (en) 2012-06-27 2016-02-09 Intel Corporation Integrated heat spreader that maximizes heat transfer from a multi-chip package
US9316447B2 (en) 2012-03-22 2016-04-19 Koninklijke Philips N.V. Thermal interface material
US9330998B2 (en) 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods
US20160160104A1 (en) 2010-02-23 2016-06-09 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US20160185074A1 (en) 2013-08-12 2016-06-30 Seiji Kagawa Heat-dissipating film, and its production method and apparatus
US9418912B2 (en) 2012-12-21 2016-08-16 Intel Corporation Methods of forming serpentine thermal interface material and structures formed thereby
US9472485B2 (en) 2012-08-29 2016-10-18 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US20160315030A1 (en) 2015-04-24 2016-10-27 Laird Technologies, Inc. Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
US20160326419A1 (en) 2013-12-31 2016-11-10 The Regents Of The University Of California Thermal interface materials with alligned fillers
WO2016182996A1 (en) 2015-05-11 2016-11-17 Laird Technologies, Inc. Board level shields with adjustable covers
US20160355249A1 (en) * 2015-06-05 2016-12-08 Airbus Helicopters Deutschland GmbH Jettisonable emergency exit for a vehicle
US20160362169A1 (en) * 2015-06-09 2016-12-15 Gentex Corporation Multi-piece bezel for electro-optic window assembly
USD807531S1 (en) * 2014-01-21 2018-01-09 Yuseal Limited Flexible seal
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707762A (en) 1970-10-29 1973-01-02 North American Rockwell Methods of using fluxes in joining metal surfaces
JPS6219104A (en) 1985-07-19 1987-01-27 ワイケイケイ株式会社 Production of tape having face fastener piece provided thereto
US4872258A (en) 1988-09-22 1989-10-10 Universal Instruments Corporation Pick and place method and apparatus
US6294729B1 (en) * 1997-10-31 2001-09-25 Laird Technologies Clad polymer EMI shield
JP4716668B2 (en) 2004-04-21 2011-07-06 日東電工株式会社 Heat-peeling method for adherend and heat-peeling apparatus
JP2005347416A (en) 2004-06-01 2005-12-15 Sharp Corp Solid-state imaging apparatus, semiconductor wafer, and camera module
JP4441451B2 (en) 2005-07-07 2010-03-31 リンテック株式会社 Sheet pasting device
JP4773419B2 (en) 2007-12-20 2011-09-14 リンテック株式会社 Sheet sticking device and sticking method
US7889515B2 (en) * 2008-02-15 2011-02-15 Laird Technologies, Inc. EMI shielding assemblies and related methods of retaining components thereof together
US20090229732A1 (en) 2008-03-14 2009-09-17 3M Innovative Properties Company Stretch releasable adhesive
JP5043743B2 (en) 2008-04-18 2012-10-10 ラピスセミコンダクタ株式会社 Manufacturing method of semiconductor device
KR20110044860A (en) 2008-08-07 2011-05-02 세키스이가가쿠 고교가부시키가이샤 Insulation Sheets and Laminated Structures
JP5075084B2 (en) 2008-10-16 2012-11-14 日東電工株式会社 Protective tape application method and protective tape application device
JP2013168533A (en) 2012-02-16 2013-08-29 Panasonic Corp Resin coating device and resin coating method
USD779997S1 (en) * 2015-11-16 2017-02-28 ClearSite, LLC Bracelet
USD879046S1 (en) * 2017-10-06 2020-03-24 Laird Technologies, Inc. Material having edging
USD881822S1 (en) * 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD901648S1 (en) * 2018-07-10 2020-11-10 Valqua, Ltd. Seal
USD895623S1 (en) * 2018-10-05 2020-09-08 Laird Technologies, Inc. Frame for shielding assembly
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus

Patent Citations (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4199490A (en) 1974-05-07 1980-04-22 Asahi Kasei Kogyo Kabushiki Kaisha Block copolymer latex composition
US4058537A (en) 1976-01-05 1977-11-15 Ciba-Geigy Corporation Esters of anhydride aromatic polycarboxylic acids with perfluoroalkyl alcohols
US4678115A (en) 1985-04-15 1987-07-07 Ontario Technologies Corporation Method for making layered foil structure
US4863551A (en) 1987-08-10 1989-09-05 Yoshido Kogyo K.K. Marking apparatus
USD348387S (en) * 1990-09-21 1994-07-05 The Serco Corporation Loading dock seal
USD344489S (en) * 1991-11-04 1994-02-22 Texstar, Inc. Fairing seal for aircraft canopy
US5700340A (en) 1993-10-22 1997-12-23 Ykk Corporation Method of manufacturing a tape having a succession of surface-type fastener pieces
WO1997041599A1 (en) 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5943557A (en) 1996-09-25 1999-08-24 Micron Technology, Inc. Method and structure for attaching a semiconductor die to a lead frame
US6391686B1 (en) 1999-06-14 2002-05-21 Seiko Epson Corporation Adhesive material applying method and apparatus, interconnect substrate, semiconductor device and manufacturing method thereof, circuit board and electronic instrument
US6696639B1 (en) * 1999-06-24 2004-02-24 Nokia Corporation Protecting device against interfering electromagnetic radiation comprising EMI-gaskets
US7004244B2 (en) 2001-06-07 2006-02-28 Henkel Corporation Thermal interface wafer and method of making and using the same
US20030037866A1 (en) 2001-08-22 2003-02-27 Shin-Etsu Chemical Co., Ltd. Method of bonding a heat radiating sheet
JP2010235953A (en) 2002-05-02 2010-10-21 Three M Innovative Properties Co Thermally conductive sheet and method for producing the same
US20030234322A1 (en) * 2002-06-25 2003-12-25 Ralph Bladt Aircraft windows and associated methods for installation
US20040180474A1 (en) 2003-03-10 2004-09-16 Oman Todd P. Electronic assembly having electrically-isolated heat-conductive structure and method therefor
US20040188814A1 (en) 2003-03-31 2004-09-30 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7821126B2 (en) 2003-03-31 2010-10-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US20040262372A1 (en) 2003-06-26 2004-12-30 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US20040262743A1 (en) 2003-06-26 2004-12-30 Intel Corporation Thermal interface structure with integrated liquid cooling and methods
US6987671B2 (en) 2003-06-26 2006-01-17 Intel Corporation Composite thermal interface devices and methods for integrated circuit heat transfer
US20040261980A1 (en) 2003-06-30 2004-12-30 Dani Ashay A. Heat dissipating device with preselected designed interface for thermal interface materials
JP2005327923A (en) 2004-05-14 2005-11-24 Alps Electric Co Ltd Method and device of sticking conductive joint film
US20070193672A1 (en) 2006-02-22 2007-08-23 Nitto Denko Corporation Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
US7488900B1 (en) * 2006-09-22 2009-02-10 Laird Technologies, Inc. Gaskets for providing environmental sealing and/or electromagnetic interference (EMI) shielding
KR100827725B1 (en) 2007-05-02 2008-05-08 티티엠주식회사 Pcm attachment method and automatic machine thereof
US20090000818A1 (en) * 2007-06-29 2009-01-01 Michael Poulsen Perforated emi gaskets and related methods
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US7906845B1 (en) 2008-04-23 2011-03-15 Amkor Technology, Inc. Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
USD644757S1 (en) * 2009-10-06 2011-09-06 Elematic Group Oy Chamfer strip
US20160160104A1 (en) 2010-02-23 2016-06-09 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
JP2012084688A (en) 2010-10-12 2012-04-26 Nitto Denko Corp Method of pasting double-sided adhesive tape, and device of pasting double-sided adhesive tape
USD690272S1 (en) * 2011-05-05 2013-09-24 Laird Technologies, Inc. Profile for a co-extrusion
USD707185S1 (en) * 2011-05-05 2014-06-17 Laird Technologies, Inc. Profile for a co-extrusion
US9016629B1 (en) * 2011-11-28 2015-04-28 The Boeing Company Combined pressure and thermal window system for space vehicles
US9316447B2 (en) 2012-03-22 2016-04-19 Koninklijke Philips N.V. Thermal interface material
US8916419B2 (en) 2012-03-29 2014-12-23 Taiwan Semiconductor Manufacturing Company, Ltd. Lid attach process and apparatus for fabrication of semiconductor packages
USD728773S1 (en) * 2012-05-08 2015-05-05 Laird Technologies, Inc. Vent panel
US9257364B2 (en) 2012-06-27 2016-02-09 Intel Corporation Integrated heat spreader that maximizes heat transfer from a multi-chip package
US9472485B2 (en) 2012-08-29 2016-10-18 Broadcom Corporation Hybrid thermal interface material for IC packages with integrated heat spreader
US8920919B2 (en) 2012-09-24 2014-12-30 Intel Corporation Thermal interface material composition including polymeric matrix and carbon filler
US9418912B2 (en) 2012-12-21 2016-08-16 Intel Corporation Methods of forming serpentine thermal interface material and structures formed thereby
EP2814057A2 (en) 2013-06-14 2014-12-17 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
US20140367847A1 (en) 2013-06-14 2014-12-18 Laird Technologies, Inc. Methods for establishing thermal joints between heat spreaders or lids and heat sources
USD734732S1 (en) * 2013-07-10 2015-07-21 Sumitomo Electric Fine Polymer, Inc. Circuit board material
USD731078S1 (en) * 2013-07-25 2015-06-02 Chad Marcus Frenette Transition strip
US20160185074A1 (en) 2013-08-12 2016-06-30 Seiji Kagawa Heat-dissipating film, and its production method and apparatus
US20160326419A1 (en) 2013-12-31 2016-11-10 The Regents Of The University Of California Thermal interface materials with alligned fillers
USD807531S1 (en) * 2014-01-21 2018-01-09 Yuseal Limited Flexible seal
US9089044B1 (en) * 2014-04-04 2015-07-21 Laird Technologies, Inc. EMI shielding connector gasket
US9330998B2 (en) 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods
US20160315030A1 (en) 2015-04-24 2016-10-27 Laird Technologies, Inc. Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
WO2016182996A1 (en) 2015-05-11 2016-11-17 Laird Technologies, Inc. Board level shields with adjustable covers
US20160355249A1 (en) * 2015-06-05 2016-12-08 Airbus Helicopters Deutschland GmbH Jettisonable emergency exit for a vehicle
US20160362169A1 (en) * 2015-06-09 2016-12-15 Gentex Corporation Multi-piece bezel for electro-optic window assembly
USD862404S1 (en) * 2016-10-25 2019-10-08 Kokusai Electric Corporation Sealing material ring for a semiconductor manufacturing apparatus

Non-Patent Citations (9)

* Cited by examiner, † Cited by third party
Title
Basics of Processing for Fabricated Films and Pads—Dow Corning; Thermal Interface—Wet Dispensed; http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial13.asp> accessed Jul. 11, 2016; 1 page.
European Search Report for EP17178138.8 filed Jun. 27, 2017 which claims priority to the instant application, dated Dec. 13, 2017, 6 pages.
European Search Report for EP17178138.8 filed Jun. 27, 2017 which names the same applicant and 2 of the same inventors but is not related through a priority claim, 6 pages.
Final Office Action for U.S. Appl. No. 15/207,444, filed Jul. 11, 2016 which names two of the same inventors, and the same assignee, but is not related through a priority claim, dated Apr. 19, 2019, 13 pages.
Hirschi, David; Dow Corning Case Study; Understanding Differences Between Thermal Interface Materials: Improve your ability to specify the optimum TIM; Copyright 2008, 4 pages.
Korean Office Action dated Oct. 22, 2018 issued in Application No. 10-2017-0085269 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 15 pages. An English language translation of the Korean Office Action is not available at this time.
Non-Final Office Action dated Sep. 24, 2018 issued by the United States Patent and Trademark Office for U.S. Appl. No. 15/207,444 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 12 pages.
Packaging and Storage Considerations—Dow Corning; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial14.asp> accessed Jul. 11, 2016.
Types of Fabricated Films and Pad Thermal Interface Materials—Dow Corning; Thermal Interface—Wet Dispensed; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial5.asp>; accessed Jul. 11, 2016.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD998827S1 (en) * 2017-10-06 2023-09-12 Laird Technologies, Inc. Material having edge shape
USD999405S1 (en) * 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
US11731224B2 (en) 2018-04-28 2023-08-22 Laird Technologies, Inc. Systems and methods of applying materials to components
USD909323S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD909322S1 (en) * 2018-10-12 2021-02-02 Valqua, Ltd. Seal member for use in semiconductor production apparatus
USD933033S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933031S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933032S1 (en) 2018-10-12 2021-10-12 Valqua, Ltd. Seal member for semiconductor production apparatus
USD933619S1 (en) 2018-10-12 2021-10-19 Valqua, Ltd. Seal member for semiconductor production apparatus
USD930536S1 (en) * 2019-07-12 2021-09-14 Jinhao Guo Weatherstrip for car door

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