USD873783S1 - LED chip - Google Patents

LED chip Download PDF

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Publication number
USD873783S1
USD873783S1 US29/667,183 US201829667183F USD873783S US D873783 S1 USD873783 S1 US D873783S1 US 201829667183 F US201829667183 F US 201829667183F US D873783 S USD873783 S US D873783S
Authority
US
United States
Prior art keywords
led chip
view
elevation view
ornamental design
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/667,183
Inventor
Jianxin Pan
Lian WU
Hongbo Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haining Xincheng Electronics Co Ltd
Original Assignee
Haining Xincheng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haining Xincheng Electronics Co Ltd filed Critical Haining Xincheng Electronics Co Ltd
Priority to US29/667,183 priority Critical patent/USD873783S1/en
Application granted granted Critical
Publication of USD873783S1 publication Critical patent/USD873783S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front elevation view of an LED chip showing my new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a left elevation view thereof;
FIG. 4 is a right elevation view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is an exploded perspective view thereof showing portions that are not visible in the corresponding views.

Claims (1)

    CLAIM
  1. The ornamental design for an LED chip, as shown and described.
US29/667,183 2018-10-19 2018-10-19 LED chip Active USD873783S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/667,183 USD873783S1 (en) 2018-10-19 2018-10-19 LED chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/667,183 USD873783S1 (en) 2018-10-19 2018-10-19 LED chip

Publications (1)

Publication Number Publication Date
USD873783S1 true USD873783S1 (en) 2020-01-28

Family

ID=69173951

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/667,183 Active USD873783S1 (en) 2018-10-19 2018-10-19 LED chip

Country Status (1)

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US (1) USD873783S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus

Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD525214S1 (en) * 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD528672S1 (en) * 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
USD569529S1 (en) * 2006-06-20 2008-05-20 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570003S1 (en) * 2006-06-20 2008-05-27 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
US20090206350A1 (en) * 2008-02-20 2009-08-20 Bily Wang LED chip package structure with different LED spacings and a method for making the same
US20090224265A1 (en) * 2008-03-05 2009-09-10 Bily Wang LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same
US20090261368A1 (en) * 2008-04-16 2009-10-22 Harvatek Corporation Led chip package structure using a substrate as a lampshade and method for making the same
US20120009700A1 (en) * 2009-04-17 2012-01-12 Harvatek Corporation Method of manufacturing a led chip package structure
USD673307S1 (en) * 2011-05-12 2012-12-25 Cooper Technologies Company Light bar
USD690444S1 (en) * 2011-06-06 2013-09-24 Citizen Electronics Co., Ltd. Light-emitting diode
USD712854S1 (en) * 2013-04-26 2014-09-09 Nok Corporation Integrated circuit tag
US20150338041A1 (en) * 2012-12-20 2015-11-26 Tridonic Jennersdorf Gmbh Led module with led chip groups
US20160276318A1 (en) * 2014-03-12 2016-09-22 Ming Sun Package of LED Chip and Manufacturing Method Thereof
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
US20170084586A1 (en) * 2015-09-21 2017-03-23 Lextar Electronics Corporation Led chip package

Patent Citations (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD525214S1 (en) * 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD528672S1 (en) * 2005-01-28 2006-09-19 Matsushita Electric Industrial Co., Ltd. LED module
USD569529S1 (en) * 2006-06-20 2008-05-20 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570003S1 (en) * 2006-06-20 2008-05-27 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
USD570506S1 (en) * 2006-06-20 2008-06-03 Matsushita Electric Industrial Co., Ltd. Lighting apparatus
US20090206350A1 (en) * 2008-02-20 2009-08-20 Bily Wang LED chip package structure with different LED spacings and a method for making the same
US20090224265A1 (en) * 2008-03-05 2009-09-10 Bily Wang LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same
US20090261368A1 (en) * 2008-04-16 2009-10-22 Harvatek Corporation Led chip package structure using a substrate as a lampshade and method for making the same
US20120009700A1 (en) * 2009-04-17 2012-01-12 Harvatek Corporation Method of manufacturing a led chip package structure
USD673307S1 (en) * 2011-05-12 2012-12-25 Cooper Technologies Company Light bar
USD690444S1 (en) * 2011-06-06 2013-09-24 Citizen Electronics Co., Ltd. Light-emitting diode
US20150338041A1 (en) * 2012-12-20 2015-11-26 Tridonic Jennersdorf Gmbh Led module with led chip groups
USD712854S1 (en) * 2013-04-26 2014-09-09 Nok Corporation Integrated circuit tag
USD770991S1 (en) * 2013-11-05 2016-11-08 Nok Corporation Integrated circuit tag
US20160276318A1 (en) * 2014-03-12 2016-09-22 Ming Sun Package of LED Chip and Manufacturing Method Thereof
US20170084586A1 (en) * 2015-09-21 2017-03-23 Lextar Electronics Corporation Led chip package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus

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