USD873783S1 - LED chip - Google Patents
LED chip Download PDFInfo
- Publication number
- USD873783S1 USD873783S1 US29/667,183 US201829667183F USD873783S US D873783 S1 USD873783 S1 US D873783S1 US 201829667183 F US201829667183 F US 201829667183F US D873783 S USD873783 S US D873783S
- Authority
- US
- United States
- Prior art keywords
- led chip
- view
- elevation view
- ornamental design
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for an LED chip, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/667,183 USD873783S1 (en) | 2018-10-19 | 2018-10-19 | LED chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/667,183 USD873783S1 (en) | 2018-10-19 | 2018-10-19 | LED chip |
Publications (1)
Publication Number | Publication Date |
---|---|
USD873783S1 true USD873783S1 (en) | 2020-01-28 |
Family
ID=69173951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/667,183 Active USD873783S1 (en) | 2018-10-19 | 2018-10-19 | LED chip |
Country Status (1)
Country | Link |
---|---|
US (1) | USD873783S1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD940669S1 (en) * | 2018-11-19 | 2022-01-11 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD525214S1 (en) * | 2004-06-25 | 2006-07-18 | Matsushita Electrical Industrial Co., Ltd. | Information storage semiconductor element |
USD528672S1 (en) * | 2005-01-28 | 2006-09-19 | Matsushita Electric Industrial Co., Ltd. | LED module |
USD569529S1 (en) * | 2006-06-20 | 2008-05-20 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
USD570003S1 (en) * | 2006-06-20 | 2008-05-27 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
USD570506S1 (en) * | 2006-06-20 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
US20090206350A1 (en) * | 2008-02-20 | 2009-08-20 | Bily Wang | LED chip package structure with different LED spacings and a method for making the same |
US20090224265A1 (en) * | 2008-03-05 | 2009-09-10 | Bily Wang | LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same |
US20090261368A1 (en) * | 2008-04-16 | 2009-10-22 | Harvatek Corporation | Led chip package structure using a substrate as a lampshade and method for making the same |
US20120009700A1 (en) * | 2009-04-17 | 2012-01-12 | Harvatek Corporation | Method of manufacturing a led chip package structure |
USD673307S1 (en) * | 2011-05-12 | 2012-12-25 | Cooper Technologies Company | Light bar |
USD690444S1 (en) * | 2011-06-06 | 2013-09-24 | Citizen Electronics Co., Ltd. | Light-emitting diode |
USD712854S1 (en) * | 2013-04-26 | 2014-09-09 | Nok Corporation | Integrated circuit tag |
US20150338041A1 (en) * | 2012-12-20 | 2015-11-26 | Tridonic Jennersdorf Gmbh | Led module with led chip groups |
US20160276318A1 (en) * | 2014-03-12 | 2016-09-22 | Ming Sun | Package of LED Chip and Manufacturing Method Thereof |
USD770991S1 (en) * | 2013-11-05 | 2016-11-08 | Nok Corporation | Integrated circuit tag |
US20170084586A1 (en) * | 2015-09-21 | 2017-03-23 | Lextar Electronics Corporation | Led chip package |
-
2018
- 2018-10-19 US US29/667,183 patent/USD873783S1/en active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD525214S1 (en) * | 2004-06-25 | 2006-07-18 | Matsushita Electrical Industrial Co., Ltd. | Information storage semiconductor element |
USD528672S1 (en) * | 2005-01-28 | 2006-09-19 | Matsushita Electric Industrial Co., Ltd. | LED module |
USD569529S1 (en) * | 2006-06-20 | 2008-05-20 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
USD570003S1 (en) * | 2006-06-20 | 2008-05-27 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
USD570506S1 (en) * | 2006-06-20 | 2008-06-03 | Matsushita Electric Industrial Co., Ltd. | Lighting apparatus |
US20090206350A1 (en) * | 2008-02-20 | 2009-08-20 | Bily Wang | LED chip package structure with different LED spacings and a method for making the same |
US20090224265A1 (en) * | 2008-03-05 | 2009-09-10 | Bily Wang | LED chip package structure with a high-efficiency heat-dissipating substrate and method for making the same |
US20090261368A1 (en) * | 2008-04-16 | 2009-10-22 | Harvatek Corporation | Led chip package structure using a substrate as a lampshade and method for making the same |
US20120009700A1 (en) * | 2009-04-17 | 2012-01-12 | Harvatek Corporation | Method of manufacturing a led chip package structure |
USD673307S1 (en) * | 2011-05-12 | 2012-12-25 | Cooper Technologies Company | Light bar |
USD690444S1 (en) * | 2011-06-06 | 2013-09-24 | Citizen Electronics Co., Ltd. | Light-emitting diode |
US20150338041A1 (en) * | 2012-12-20 | 2015-11-26 | Tridonic Jennersdorf Gmbh | Led module with led chip groups |
USD712854S1 (en) * | 2013-04-26 | 2014-09-09 | Nok Corporation | Integrated circuit tag |
USD770991S1 (en) * | 2013-11-05 | 2016-11-08 | Nok Corporation | Integrated circuit tag |
US20160276318A1 (en) * | 2014-03-12 | 2016-09-22 | Ming Sun | Package of LED Chip and Manufacturing Method Thereof |
US20170084586A1 (en) * | 2015-09-21 | 2017-03-23 | Lextar Electronics Corporation | Led chip package |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD940669S1 (en) * | 2018-11-19 | 2022-01-11 | Kokusai Electric Corporation | Boat for substrate processing apparatus |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |