USD845368S1 - Spoked solder pad - Google Patents
Spoked solder pad Download PDFInfo
- Publication number
- USD845368S1 USD845368S1 US29/636,907 US201829636907F USD845368S US D845368 S1 USD845368 S1 US D845368S1 US 201829636907 F US201829636907 F US 201829636907F US D845368 S USD845368 S US D845368S
- Authority
- US
- United States
- Prior art keywords
- solder pad
- spoked
- spoked solder
- view
- illustrative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Broken line illustrations of environmental structure in the drawings, including the radial axes in FIG. 2 , circuit board traces and vias in FIG. 3 , integrated circuit package outlines in FIG. 4 , and circuit board outlines in FIG. 5 , are provided for illustrative purposes only and form no part of the claimed design.
Claims (1)
- The ornamental design for a spoked solder pad, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/636,907 USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/512,592 USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
US29/636,907 USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/512,592 Division USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
Publications (1)
Publication Number | Publication Date |
---|---|
USD845368S1 true USD845368S1 (en) | 2019-04-09 |
Family
ID=61951999
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/512,592 Active USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
US29/636,907 Active USD845368S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
US29/636,910 Active USD845369S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/512,592 Active USD816135S1 (en) | 2014-12-19 | 2014-12-19 | Spoked solder pad |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/636,910 Active USD845369S1 (en) | 2014-12-19 | 2018-02-12 | Spoked solder pad |
Country Status (1)
Country | Link |
---|---|
US (3) | USD816135S1 (en) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102089A (en) | 1984-10-25 | 1986-05-20 | 松下電工株式会社 | Mount structure of flat package ic |
JPH09107173A (en) | 1995-10-11 | 1997-04-22 | Tokai Rika Co Ltd | Pad structure and wiring board device |
US5900674A (en) | 1996-12-23 | 1999-05-04 | General Electric Company | Interface structures for electronic devices |
US6054563A (en) | 1997-03-05 | 2000-04-25 | Rhodia Chimie | Preparation of solid, powdery rare earth carboxylates by evaporation method |
US20020071642A1 (en) | 1999-09-09 | 2002-06-13 | Fujitsu Limited | Installation structure and method for optical parts and electric parts |
US20020092672A1 (en) | 2001-01-16 | 2002-07-18 | Primavera Anthony A. | Contact pads and circuit boards incorporating same |
US20030057515A1 (en) | 1999-11-19 | 2003-03-27 | Fillion Raymond Albert | Methods of fabrication of electronic interface structures |
US20040020972A1 (en) | 2002-07-30 | 2004-02-05 | Yoshiyuki Miyajima | Printed circuit board and soldering structure for electronic parts thereto |
US20070126030A1 (en) | 2005-12-02 | 2007-06-07 | Sony Corporation | Semiconductor device and method for manufacturing same, and semiconductor wafer |
USD571810S1 (en) * | 2006-06-20 | 2008-06-24 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC cards |
US20090091025A1 (en) | 2007-10-04 | 2009-04-09 | Agency For Science, Technology And Research | Method for forming and releasing interconnects |
US20090211087A1 (en) | 2004-07-08 | 2009-08-27 | International Business Machines Corporation | Method and system for improving alignment precision of parts in mems |
US7902666B1 (en) | 2009-10-05 | 2011-03-08 | Powertech Technology Inc. | Flip chip device having soldered metal posts by surface mounting |
US20110067911A1 (en) | 2008-06-12 | 2011-03-24 | Mitsubishi Materials Corporation | Method of bonding parts to substrate using solder paste |
US20130323526A1 (en) | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD702240S1 (en) * | 2012-04-13 | 2014-04-08 | Blackberry Limited | UICC apparatus |
-
2014
- 2014-12-19 US US29/512,592 patent/USD816135S1/en active Active
-
2018
- 2018-02-12 US US29/636,907 patent/USD845368S1/en active Active
- 2018-02-12 US US29/636,910 patent/USD845369S1/en active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102089A (en) | 1984-10-25 | 1986-05-20 | 松下電工株式会社 | Mount structure of flat package ic |
JPH09107173A (en) | 1995-10-11 | 1997-04-22 | Tokai Rika Co Ltd | Pad structure and wiring board device |
US5900674A (en) | 1996-12-23 | 1999-05-04 | General Electric Company | Interface structures for electronic devices |
US6054563A (en) | 1997-03-05 | 2000-04-25 | Rhodia Chimie | Preparation of solid, powdery rare earth carboxylates by evaporation method |
US20020071642A1 (en) | 1999-09-09 | 2002-06-13 | Fujitsu Limited | Installation structure and method for optical parts and electric parts |
US20030057515A1 (en) | 1999-11-19 | 2003-03-27 | Fillion Raymond Albert | Methods of fabrication of electronic interface structures |
US20020092672A1 (en) | 2001-01-16 | 2002-07-18 | Primavera Anthony A. | Contact pads and circuit boards incorporating same |
US20040020972A1 (en) | 2002-07-30 | 2004-02-05 | Yoshiyuki Miyajima | Printed circuit board and soldering structure for electronic parts thereto |
US20090211087A1 (en) | 2004-07-08 | 2009-08-27 | International Business Machines Corporation | Method and system for improving alignment precision of parts in mems |
US20070126030A1 (en) | 2005-12-02 | 2007-06-07 | Sony Corporation | Semiconductor device and method for manufacturing same, and semiconductor wafer |
USD571810S1 (en) * | 2006-06-20 | 2008-06-24 | Kabushiki Kaisha Toshiba | Module with built-in integrated circuits for use with IC cards |
US20090091025A1 (en) | 2007-10-04 | 2009-04-09 | Agency For Science, Technology And Research | Method for forming and releasing interconnects |
US20110067911A1 (en) | 2008-06-12 | 2011-03-24 | Mitsubishi Materials Corporation | Method of bonding parts to substrate using solder paste |
US7902666B1 (en) | 2009-10-05 | 2011-03-08 | Powertech Technology Inc. | Flip chip device having soldered metal posts by surface mounting |
USD702240S1 (en) * | 2012-04-13 | 2014-04-08 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD702241S1 (en) * | 2012-04-23 | 2014-04-08 | Blackberry Limited | UICC apparatus |
US20130323526A1 (en) | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
Also Published As
Publication number | Publication date |
---|---|
USD845369S1 (en) | 2019-04-09 |
USD816135S1 (en) | 2018-04-24 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |