USD816623S1 - Solder pad - Google Patents

Description

FIG. 1 is a front, left, and top perspective view of a first embodiment of a solder pad in accordance with my design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a rear elevation view thereof;

FIG. 5 is a left elevation view thereof; and

FIG. 6 is a right elevation view thereof;

FIG. 7 is a front, left, and top perspective view of a second embodiment of a solder pad in accordance with my design.

FIG. 8 is a top plan view thereof;

FIG. 9 is a front elevation view thereof;

FIG. 10 is a rear elevation view thereof;

FIG. 11 is a left elevation view thereof; and,

FIG. 12 is a right elevation view thereof.

All broken lines shown in the drawings depict portions of the solder pad that form no part of the claimed design.

Claims (1)

CLAIM
1. The ornamental design for a solder pad, as shown and described.

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