USD803801S1 - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- USD803801S1 USD803801S1 US29/543,065 US201529543065F USD803801S US D803801 S1 USD803801 S1 US D803801S1 US 201529543065 F US201529543065 F US 201529543065F US D803801 S USD803801 S US D803801S
- Authority
- US
- United States
- Prior art keywords
- lead frame
- view
- taken along
- along line
- end view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The Dash-Dot broken lines in FIG. 11 labeled as “2” are included to indicate the point at which the magnified view is cut off. The Dash-Dot broken lines define the bounds of the claimed design and form no part thereof. The Dash-Dash broken line portion of the figure drawings is included to show environment and form no part of the claimed design.
Claims (1)
- The ornamental design for a lead frame, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-008837 | 2015-01-20 | ||
JPD2015-8837F JP1537981S (en) | 2015-04-20 | 2015-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD803801S1 true USD803801S1 (en) | 2017-11-28 |
Family
ID=54549589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/543,065 Active USD803801S1 (en) | 2015-04-20 | 2015-10-20 | Lead frame |
Country Status (3)
Country | Link |
---|---|
US (1) | USD803801S1 (en) |
JP (1) | JP1537981S (en) |
TW (1) | TWD175796S (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10964628B2 (en) * | 2019-02-21 | 2021-03-30 | Infineon Technologies Ag | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
US11515244B2 (en) | 2019-02-21 | 2022-11-29 | Infineon Technologies Ag | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
Citations (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
US6409775B1 (en) * | 1999-02-09 | 2002-06-25 | Matsushita Electric Industrial Co., Ltd. | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
US6433424B1 (en) * | 2000-12-14 | 2002-08-13 | International Rectifier Corporation | Semiconductor device package and lead frame with die overhanging lead frame pad |
USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484104S1 (en) | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487432S1 (en) | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
US20100052125A1 (en) * | 2008-08-29 | 2010-03-04 | Sanyo Electric Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
USD637566S1 (en) * | 2010-08-10 | 2011-05-10 | Taymac Corporation | Electrical receptacle circuit board |
US20110212341A1 (en) * | 2010-02-26 | 2011-09-01 | Freescale Semiconductor, Inc. | Lead frame sheet |
USD656469S1 (en) * | 2011-04-28 | 2012-03-27 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode |
JP2013128007A (en) * | 2011-12-16 | 2013-06-27 | Toshiba Corp | Manufacturing method of photocoupler and lead frame sheet for photocoupler |
US20140252574A1 (en) * | 2013-03-05 | 2014-09-11 | Nichia Corporation | Lead frame and semiconductor device |
US20140327004A1 (en) * | 2013-05-03 | 2014-11-06 | Infineon Technologies Ag | Lead Frame Strips with Support Members |
US20150064849A1 (en) * | 2013-08-30 | 2015-03-05 | Infineon Technologies Ag | Lead Frame Strips with Electrical Isolation of Die Paddles |
US9054091B2 (en) * | 2013-06-10 | 2015-06-09 | Alpha & Omega Semiconductor, Inc. | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures |
US20160027721A1 (en) * | 2014-07-28 | 2016-01-28 | Texas Instruments Incorporated | Leadframe Strip And Leadframes |
USD762197S1 (en) * | 2014-09-12 | 2016-07-26 | Taoglas Group Holdings Limited | GPS antenna assembly |
US20160218051A1 (en) * | 2015-01-22 | 2016-07-28 | Sh Materials Co., Ltd. | Lead frame |
US9607934B2 (en) * | 2013-07-31 | 2017-03-28 | Nichia Corporation | Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
-
2015
- 2015-04-20 JP JPD2015-8837F patent/JP1537981S/ja active Active
- 2015-10-20 US US29/543,065 patent/USD803801S1/en active Active
- 2015-10-20 TW TW104305868F patent/TWD175796S/en unknown
Patent Citations (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
US6409775B1 (en) * | 1999-02-09 | 2002-06-25 | Matsushita Electric Industrial Co., Ltd. | Method of molding a plurality of solid electrolytic capacitors on a metal lead frame |
US6433424B1 (en) * | 2000-12-14 | 2002-08-13 | International Rectifier Corporation | Semiconductor device package and lead frame with die overhanging lead frame pad |
USD492266S1 (en) * | 2002-11-15 | 2004-06-29 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD483336S1 (en) * | 2002-11-15 | 2003-12-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484858S1 (en) * | 2002-11-15 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484104S1 (en) | 2002-11-25 | 2003-12-23 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD494939S1 (en) * | 2002-12-17 | 2004-08-24 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD491900S1 (en) * | 2002-12-17 | 2004-06-22 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485244S1 (en) * | 2002-12-17 | 2004-01-13 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD485808S1 (en) * | 2003-01-03 | 2004-01-27 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487431S1 (en) * | 2003-01-03 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD488136S1 (en) * | 2003-01-03 | 2004-04-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505122S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD505121S1 (en) * | 2003-01-03 | 2005-05-17 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD487432S1 (en) | 2003-02-07 | 2004-03-09 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD484859S1 (en) * | 2003-02-07 | 2004-01-06 | Gem Services, Inc. | Portion of a matrix for surface mount package leadframe |
USD588080S1 (en) * | 2007-09-26 | 2009-03-10 | Gem Services, Inc. | 2021-8J matrix leadframe |
US20100052125A1 (en) * | 2008-08-29 | 2010-03-04 | Sanyo Electric Co., Ltd. | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame |
US20110212341A1 (en) * | 2010-02-26 | 2011-09-01 | Freescale Semiconductor, Inc. | Lead frame sheet |
USD637566S1 (en) * | 2010-08-10 | 2011-05-10 | Taymac Corporation | Electrical receptacle circuit board |
USD656469S1 (en) * | 2011-04-28 | 2012-03-27 | Kabushiki Kaisha Toshiba | Portion of a light-emitting diode |
JP2013128007A (en) * | 2011-12-16 | 2013-06-27 | Toshiba Corp | Manufacturing method of photocoupler and lead frame sheet for photocoupler |
US20140252574A1 (en) * | 2013-03-05 | 2014-09-11 | Nichia Corporation | Lead frame and semiconductor device |
US20140327004A1 (en) * | 2013-05-03 | 2014-11-06 | Infineon Technologies Ag | Lead Frame Strips with Support Members |
US9054091B2 (en) * | 2013-06-10 | 2015-06-09 | Alpha & Omega Semiconductor, Inc. | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures |
US9607934B2 (en) * | 2013-07-31 | 2017-03-28 | Nichia Corporation | Lead frame, lead frame with resin attached thereto, resin package, light emitting device, and method for manufacturing resin package |
US20150064849A1 (en) * | 2013-08-30 | 2015-03-05 | Infineon Technologies Ag | Lead Frame Strips with Electrical Isolation of Die Paddles |
US20160027721A1 (en) * | 2014-07-28 | 2016-01-28 | Texas Instruments Incorporated | Leadframe Strip And Leadframes |
USD762197S1 (en) * | 2014-09-12 | 2016-07-26 | Taoglas Group Holdings Limited | GPS antenna assembly |
US20160218051A1 (en) * | 2015-01-22 | 2016-07-28 | Sh Materials Co., Ltd. | Lead frame |
Non-Patent Citations (1)
Title |
---|
Excel Cell Electronic Co., dated Dec. 29, 2014, [online], [site visited Mar. 31, 2017]. Available from Internet, <URL: http://www.ece.com.tw/product.php>. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10964628B2 (en) * | 2019-02-21 | 2021-03-30 | Infineon Technologies Ag | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
US11515244B2 (en) | 2019-02-21 | 2022-11-29 | Infineon Technologies Ag | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture |
Also Published As
Publication number | Publication date |
---|---|
TWD175796S (en) | 2016-05-21 |
JP1537981S (en) | 2015-11-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USD876905S1 (en) | Jug | |
USD807110S1 (en) | Bottle | |
USD749977S1 (en) | Band | |
USD852779S1 (en) | Loudspeaker | |
USD774294S1 (en) | Shoe upper | |
USD818946S1 (en) | Battery | |
USD756968S1 (en) | Speaker | |
USD769704S1 (en) | Pointed zip tie | |
USD716640S1 (en) | Twist tie mount | |
USD740809S1 (en) | Storage drive | |
USD753618S1 (en) | Television | |
USD759630S1 (en) | Sound bar | |
USD815842S1 (en) | Portion of a frame for displaying an object | |
USD782856S1 (en) | Table | |
USD731078S1 (en) | Transition strip | |
USD801147S1 (en) | Handle for a saw | |
USD736170S1 (en) | Television | |
USD725447S1 (en) | Head of hoe-rake | |
USD755599S1 (en) | Scissors | |
USD759453S1 (en) | Wire cutter and stripper | |
USD721940S1 (en) | Hacksaw | |
USD745350S1 (en) | Saw blade tang | |
USD799917S1 (en) | Pole saw | |
USD763797S1 (en) | Power strip | |
USD745349S1 (en) | Saw blade tang |