USD795821S1 - Liquid cooling cold plate with diamond cut pin fins - Google Patents
Liquid cooling cold plate with diamond cut pin fins Download PDFInfo
- Publication number
- USD795821S1 USD795821S1 US29/555,493 US201629555493F USD795821S US D795821 S1 USD795821 S1 US D795821S1 US 201629555493 F US201629555493 F US 201629555493F US D795821 S USD795821 S US D795821S
- Authority
- US
- United States
- Prior art keywords
- liquid cooling
- cold plate
- pin fins
- cooling cold
- diamond cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a liquid cooling cold plate with diamond cut pin fins, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/555,493 USD795821S1 (en) | 2016-02-22 | 2016-02-22 | Liquid cooling cold plate with diamond cut pin fins |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/555,493 USD795821S1 (en) | 2016-02-22 | 2016-02-22 | Liquid cooling cold plate with diamond cut pin fins |
Publications (1)
Publication Number | Publication Date |
---|---|
USD795821S1 true USD795821S1 (en) | 2017-08-29 |
Family
ID=59655243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/555,493 Active USD795821S1 (en) | 2016-02-22 | 2016-02-22 | Liquid cooling cold plate with diamond cut pin fins |
Country Status (1)
Country | Link |
---|---|
US (1) | USD795821S1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD954005S1 (en) * | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
USD971862S1 (en) | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060291165A1 (en) * | 2005-05-31 | 2006-12-28 | Behr Industry Gmbh & Co. Kg | Apparatus for cooling electronic components |
USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
US20080007915A1 (en) * | 2006-07-06 | 2008-01-10 | Chao-Chuan Chen | Heat sink device for a heat generating element |
USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
US20090268409A1 (en) * | 2008-04-28 | 2009-10-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation assembly |
US20110304979A1 (en) * | 2009-01-29 | 2011-12-15 | Peterson Eric C | Cooling apparatus |
US20120261095A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
US20160234968A1 (en) * | 2015-02-10 | 2016-08-11 | Dynatron Corporation | Liquid-Cooled Heat Sink for Electronic Devices |
US20160327996A1 (en) * | 2015-05-08 | 2016-11-10 | Fujitsu Limited | Cooling module and electronic device |
USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
USD773408S1 (en) * | 2015-06-11 | 2016-12-06 | Ebullient, Inc. | Redundant heat sink module |
US20160363967A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
US20160366788A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
USD774473S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
-
2016
- 2016-02-22 US US29/555,493 patent/USD795821S1/en active Active
Patent Citations (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060291165A1 (en) * | 2005-05-31 | 2006-12-28 | Behr Industry Gmbh & Co. Kg | Apparatus for cooling electronic components |
US20080007915A1 (en) * | 2006-07-06 | 2008-01-10 | Chao-Chuan Chen | Heat sink device for a heat generating element |
USD561711S1 (en) * | 2006-12-08 | 2008-02-12 | Thermaltake Technology Co., Ltd. | Heat sink |
USD553170S1 (en) * | 2007-02-09 | 2007-10-16 | Amulaire Thermal Technology, Inc | Cold plate heat sink |
USD573110S1 (en) * | 2007-07-27 | 2008-07-15 | Nidec Corporation | Heat sink |
US20090044929A1 (en) * | 2007-08-15 | 2009-02-19 | Xigmatek Co., Ltd | Liquid cooling module |
US20090268409A1 (en) * | 2008-04-28 | 2009-10-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation assembly |
US20110304979A1 (en) * | 2009-01-29 | 2011-12-15 | Peterson Eric C | Cooling apparatus |
US20120261095A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
US20140069614A1 (en) * | 2012-09-13 | 2014-03-13 | Asia Vital Components Co., Ltd. | Heat dissipaion device and thermal module using same |
USD715747S1 (en) * | 2013-09-06 | 2014-10-21 | Mitsubishi Electric Corporation | Cooling jacket |
USD715750S1 (en) * | 2013-11-26 | 2014-10-21 | Kilpatrick Townsend & Stockton Llp | Power heat sink with imbedded fly cut heat pipes |
US20160118317A1 (en) * | 2014-10-27 | 2016-04-28 | Ebullient, Llc | Microprocessor assembly adapted for fluid cooling |
US20160234968A1 (en) * | 2015-02-10 | 2016-08-11 | Dynatron Corporation | Liquid-Cooled Heat Sink for Electronic Devices |
USD755741S1 (en) * | 2015-02-18 | 2016-05-10 | Semiconductor Components Industries, Llc | Power device package |
US20160327996A1 (en) * | 2015-05-08 | 2016-11-10 | Fujitsu Limited | Cooling module and electronic device |
USD774473S1 (en) * | 2015-05-28 | 2016-12-20 | Ebullient, Inc. | Heat sink module |
USD773408S1 (en) * | 2015-06-11 | 2016-12-06 | Ebullient, Inc. | Redundant heat sink module |
US20160363967A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Electronic device and liquid cooling heat dissipation device thereof |
US20160366788A1 (en) * | 2015-06-11 | 2016-12-15 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
USD772823S1 (en) * | 2015-08-26 | 2016-11-29 | Ebullient, Inc. | Heat sink module |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD971862S1 (en) | 2018-12-28 | 2022-12-06 | Furukawa Electric Co., Ltd. | Heatsink |
USD954005S1 (en) * | 2019-09-12 | 2022-06-07 | Furukawa Electric Co., Ltd. | Heatsink |
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