USD601979S1 - Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers - Google Patents

Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers Download PDF

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Publication number
USD601979S1
USD601979S1 US29/309,697 US30969708F USD601979S US D601979 S1 USD601979 S1 US D601979S1 US 30969708 F US30969708 F US 30969708F US D601979 S USD601979 S US D601979S
Authority
US
United States
Prior art keywords
heat insulating
semiconductor wafers
manufacturing semiconductor
insulating cylinder
pedestal base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/309,697
Inventor
Izumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SATO, IZUMI
Application granted granted Critical
Publication of USD601979S1 publication Critical patent/USD601979S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the design for a pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers in accordance with the invention;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a plan view thereof;
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a sectional view along line 8—8 of FIG. 6.

Claims (1)

  1. The ornamental design for a pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
US29/309,697 2008-03-28 2008-09-26 Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers Expired - Lifetime USD601979S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008007859 2008-03-28

Publications (1)

Publication Number Publication Date
USD601979S1 true USD601979S1 (en) 2009-10-13

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US29/309,697 Expired - Lifetime USD601979S1 (en) 2008-03-28 2008-09-26 Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD744967S1 (en) * 2012-03-20 2015-12-08 Veeco Instruments Inc. Spindle key
USD748591S1 (en) 2012-03-20 2016-02-02 Veeco Instruments Inc. Keyed spindle
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD744967S1 (en) * 2012-03-20 2015-12-08 Veeco Instruments Inc. Spindle key
USD748591S1 (en) 2012-03-20 2016-02-02 Veeco Instruments Inc. Keyed spindle
US9816184B2 (en) 2012-03-20 2017-11-14 Veeco Instruments Inc. Keyed wafer carrier
USD776801S1 (en) * 2014-06-24 2017-01-17 Kobe Steel, Ltd Heat exchanger tube

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