USD476959S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD476959S1
USD476959S1 US29/164,710 US16471002F USD476959S US D476959 S1 USD476959 S1 US D476959S1 US 16471002 F US16471002 F US 16471002F US D476959 S USD476959 S US D476959S
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United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/164,710
Inventor
Junji Yamada
Seiji Saiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US29/164,710 priority Critical patent/USD476959S1/en
Assigned to MITSUBISHI DENKI KABUSHIKI KAISHA reassignment MITSUBISHI DENKI KABUSHIKI KAISHA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAIKI, SEIJI, YAMADA, JUNJI
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Publication of USD476959S1 publication Critical patent/USD476959S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a left side elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/164,710 2002-07-31 2002-07-31 Semiconductor device Expired - Lifetime USD476959S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/164,710 USD476959S1 (en) 2002-07-31 2002-07-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/164,710 USD476959S1 (en) 2002-07-31 2002-07-31 Semiconductor device

Publications (1)

Publication Number Publication Date
USD476959S1 true USD476959S1 (en) 2003-07-08

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US29/164,710 Expired - Lifetime USD476959S1 (en) 2002-07-31 2002-07-31 Semiconductor device

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US (1) USD476959S1 (en)

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD827590S1 (en) * 2015-09-30 2018-09-04 Mitsubishi Electric Corporation Power semiconductor device
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
J. Yamada, et al., "Next Generation High Power Dual IGBT Module with CSTBT Chip and New Packgage Concept", Official Proceedings International Conferences ZM Communications GmbH, PCIM 2002, Power Electronics, May 14-16, 2002, 11 pages.

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD805485S1 (en) 2013-08-21 2017-12-19 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD762597S1 (en) 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD742338S1 (en) * 2014-08-27 2015-11-03 Apple Inc. MLB module for electronic device
USD814433S1 (en) * 2014-11-28 2018-04-03 Fuji Electric Co., Ltd Semiconductor module
USD827593S1 (en) 2014-11-28 2018-09-04 Fuji Electric Co., Ltd Semiconductor module
USD810706S1 (en) * 2014-12-24 2018-02-20 Fuji Electric Co., Ltd Semiconductor module
USD748595S1 (en) * 2015-02-03 2016-02-02 Infineon Technologies Ag Power semiconductor module
USD755742S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD755741S1 (en) * 2015-02-18 2016-05-10 Semiconductor Components Industries, Llc Power device package
USD827590S1 (en) * 2015-09-30 2018-09-04 Mitsubishi Electric Corporation Power semiconductor device
USD790491S1 (en) * 2015-09-30 2017-06-27 Mitsubishi Electric Corporation Power semiconductor device
USD798832S1 (en) * 2015-09-30 2017-10-03 Mitsubishi Electric Corporation Power semiconductor device
USD799439S1 (en) * 2016-05-31 2017-10-10 Rohm Co., Ltd. Power converting semiconductor module
USD823270S1 (en) * 2016-09-30 2018-07-17 Rohm Co., Ltd. Semiconductor device
USD827591S1 (en) * 2016-10-31 2018-09-04 Fuji Electric Co., Ltd. Semiconductor module
USD858467S1 (en) 2017-01-05 2019-09-03 Rohm Co., Ltd. Power semiconductor module
USD875058S1 (en) 2017-01-05 2020-02-11 Rohm Co., Ltd. Power semiconductor module
USD864132S1 (en) 2017-01-05 2019-10-22 Rohm Co., Ltd. Power semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD822628S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD822627S1 (en) * 2017-01-31 2018-07-10 Rohm Co., Ltd. Semiconductor device
USD851612S1 (en) * 2017-06-30 2019-06-18 Microduino Inc. Electrical module
USD879729S1 (en) * 2017-06-30 2020-03-31 Microduino Inc. Electrical module
USD847103S1 (en) * 2017-09-07 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD864882S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD864883S1 (en) * 2017-09-27 2019-10-29 Hamamatsu Photonics K.K. Part for semiconductor device
USD865690S1 (en) * 2017-09-27 2019-11-05 Hamamatsu Photonics K.K. Part for semiconductor device
USD847104S1 (en) * 2017-09-29 2019-04-30 Rohm Co., Ltd. Power semiconductor module
USD884662S1 (en) * 2018-06-01 2020-05-19 Fuji Electric Co., Ltd. Semiconductor module
USD923591S1 (en) * 2019-03-15 2021-06-29 Tamura Corporation Semiconductor driving circuit module

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