USD428857S - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
USD428857S
USD428857S US29/110,045 US11004599F USD428857S US D428857 S USD428857 S US D428857S US 11004599 F US11004599 F US 11004599F US D428857 S USD428857 S US D428857S
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United States
Prior art keywords
cooling device
view
elevation view
new design
device showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/110,045
Inventor
Guy R. Wagner
Steven E. Hanzlik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Priority to US29/110,045 priority Critical patent/USD428857S/en
Assigned to AGILENT TECHNOLOGIES reassignment AGILENT TECHNOLOGIES ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HANZLIK, STEVEN E., WAGNER, GUY R.
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY MERGER (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Assigned to AGILENT TECHNOLOGIES INC reassignment AGILENT TECHNOLOGIES INC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Application granted granted Critical
Publication of USD428857S publication Critical patent/USD428857S/en
Assigned to AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AGILENT TECHNOLOGIES, INC.
Anticipated expiration legal-status Critical
Assigned to AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: AGILENT TECHNOLOGIES, INC.
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a top front right perspective view of a first embodiment of a cooling device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a left elevation view thereof;
FIG. 5 is a right elevation view thereof;
FIG. 6 is a front elevation view thereof;
FIG. 7 is a rear elevation view thereof;
FIG. 8 is a top front right perspective view of a second embodiment of a cooling device showing our new design;
FIG. 9 is a top plan view of the second embodiment;
FIG. 10 is a bottom view of the second embodiment;
FIG. 11 is a left elevation view of the second embodiment;
FIG. 12 is a right elevation view of the second embodiment;
FIG. 13 is a front elevation view of the second embodiment;
FIG. 14 is a rear elevation view of the second embodiment;
FIG. 15 is a top front right perspective view of a third embodiment of a cooling device showing our new design;
FIG. 16 is a top plan view of the third embodiment;
FIG. 17 is a bottom view of the third embodiment;
FIG. 18 is a left elevation view of the third embodiment;
FIG. 19 is a right elevation view of the third embodiment;
FIG. 20 is a front elevation view of the third embodiment;
FIG. 21 is a rear elevation view of the third embodiment;
FIG. 22 is a top front right perspective view of a fourth embodiment of a cooling device showing our new design;
FIG. 23 is a top plan view of the fourth embodiment;
FIG. 24 is a bottom view of the fourth embodiment;
FIG. 25 is a left elevation view of the fourth embodiment;
FIG. 26 is a right elevation view of the fourth embodiment;
FIG. 27 is a front elevation view of the fourth embodiment; and,
FIG. 28 is a rear elevation view of the fourth embodiment.

Claims (1)

  1. The ornamental design for a cooling device, as shown and described.
US29/110,045 1999-09-03 1999-09-03 Cooling device Expired - Lifetime USD428857S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/110,045 USD428857S (en) 1999-09-03 1999-09-03 Cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/110,045 USD428857S (en) 1999-09-03 1999-09-03 Cooling device

Publications (1)

Publication Number Publication Date
USD428857S true USD428857S (en) 2000-08-01

Family

ID=71739994

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/110,045 Expired - Lifetime USD428857S (en) 1999-09-03 1999-09-03 Cooling device

Country Status (1)

Country Link
US (1) USD428857S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6505680B1 (en) 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
USD681259S1 (en) * 2010-04-10 2013-04-30 Lg Innotek Co., Ltd. LED lamp
TWD216462S (en) 2021-06-18 2022-01-01 宏碁股份有限公司 Fan housing
USD1010803S1 (en) * 2021-10-13 2024-01-09 Johnson Electric Asti S.R.L. Part of a cooling fan module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357900S (en) * 1993-04-01 1995-05-02 Fujitsu Limited Combined heat sink and fan
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
USD401686S (en) * 1997-10-07 1998-11-24 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipitation fan

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD357900S (en) * 1993-04-01 1995-05-02 Fujitsu Limited Combined heat sink and fan
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths
USD401686S (en) * 1997-10-07 1998-11-24 Sunonwealth Electric Machine Industry Co., Ltd. Heat dissipitation fan

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Pending U.S. Utility Patent Application of Wagner et al. for "Cooling Apparatus For Electronic Devices" (Attorney Docket No. 10982332-1).
U.S. Patent application Ser. No. 09/253,877 filed Feb. 22, 1999 for "Cooling Apparatus For Electronic Devices" of Steven E. Hanzlik et al.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6505680B1 (en) 2001-07-27 2003-01-14 Hewlett-Packard Company High performance cooling device
USD681259S1 (en) * 2010-04-10 2013-04-30 Lg Innotek Co., Ltd. LED lamp
TWD216462S (en) 2021-06-18 2022-01-01 宏碁股份有限公司 Fan housing
USD1010803S1 (en) * 2021-10-13 2024-01-09 Johnson Electric Asti S.R.L. Part of a cooling fan module

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