USD414503S - Machine for forming a semiconductor wafer film - Google Patents

Machine for forming a semiconductor wafer film Download PDF

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Publication number
USD414503S
USD414503S US29/085,326 US8532698F USD414503S US D414503 S USD414503 S US D414503S US 8532698 F US8532698 F US 8532698F US D414503 S USD414503 S US D414503S
Authority
US
United States
Prior art keywords
machine
forming
semiconductor wafer
wafer film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/085,326
Inventor
Susumu Katoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KATOH, SUSUMU
Application granted granted Critical
Publication of USD414503S publication Critical patent/USD414503S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of machine for forming a semiconductor wafer film, showing my new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for machine for forming a semiconductor wafer film, as shown.
US29/085,326 1997-09-24 1998-03-20 Machine for forming a semiconductor wafer film Expired - Lifetime USD414503S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9-68687 1997-09-24
JP6868797 1997-09-24

Publications (1)

Publication Number Publication Date
USD414503S true USD414503S (en) 1999-09-28

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ID=71726782

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/085,326 Expired - Lifetime USD414503S (en) 1997-09-24 1998-03-20 Machine for forming a semiconductor wafer film

Country Status (1)

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US (1) USD414503S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281511B1 (en) * 1997-02-10 2001-08-28 Micron Technology Apparatus for forming materials
USD754765S1 (en) * 2014-04-16 2016-04-26 Nimatic Aps Fluid mixer
USD823363S1 (en) * 2016-02-12 2018-07-17 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD824440S1 (en) * 2016-02-12 2018-07-31 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281511B1 (en) * 1997-02-10 2001-08-28 Micron Technology Apparatus for forming materials
USD754765S1 (en) * 2014-04-16 2016-04-26 Nimatic Aps Fluid mixer
USD823363S1 (en) * 2016-02-12 2018-07-17 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus
USD824440S1 (en) * 2016-02-12 2018-07-31 Hitachi Kokusai Electric Inc. Heater of substrate processing apparatus

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