USD404720S - Heat sink and mounting plate for integrated circuits - Google Patents

Heat sink and mounting plate for integrated circuits Download PDF

Info

Publication number
USD404720S
USD404720S US29/066,146 US6614697F USD404720S US D404720 S USD404720 S US D404720S US 6614697 F US6614697 F US 6614697F US D404720 S USD404720 S US D404720S
Authority
US
United States
Prior art keywords
mounting plate
heat sink
integrated circuits
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/066,146
Inventor
Charles Gayle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US29/066,146 priority Critical patent/USD404720S/en
Application granted granted Critical
Publication of USD404720S publication Critical patent/USD404720S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a perspective view of the heat sink and mounting plate for integrated circuits showing my new design;
FIG. 2 is a front elevational view thereof, the rear elevational view being identical in appearance;
FIG. 3 is a top plan view thereof, the bottom plan view being identical in appearance; and,
FIG. 4 is a side elevational view thereof, the opposite side view being identical in appearance.

Claims (1)

  1. The ornamental design for a heat sink and mounting plate for integrated circuits, shown and described.
US29/066,146 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits Expired - Lifetime USD404720S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/066,146 USD404720S (en) 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/066,146 USD404720S (en) 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits

Publications (1)

Publication Number Publication Date
USD404720S true USD404720S (en) 1999-01-26

Family

ID=71658662

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/066,146 Expired - Lifetime USD404720S (en) 1997-02-06 1997-02-06 Heat sink and mounting plate for integrated circuits

Country Status (1)

Country Link
US (1) USD404720S (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US4807018A (en) * 1985-10-10 1989-02-21 Sgs Microelettronica S.P.A. Method and package for dissipating heat generated by an integrated circuit chip
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807018A (en) * 1985-10-10 1989-02-21 Sgs Microelettronica S.P.A. Method and package for dissipating heat generated by an integrated circuit chip
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD774472S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD774473S1 (en) * 2015-05-28 2016-12-20 Ebullient, Inc. Heat sink module
USD772822S1 (en) * 2015-06-11 2016-11-29 Ebullient, Inc. Redundant heat sink module
USD773408S1 (en) * 2015-06-11 2016-12-06 Ebullient, Inc. Redundant heat sink module
USD772179S1 (en) * 2015-08-26 2016-11-22 Ebullient, Inc. Heat sink module
USD772823S1 (en) * 2015-08-26 2016-11-29 Ebullient, Inc. Heat sink module
USD812022S1 (en) * 2015-09-12 2018-03-06 Ebullient, Llc Multi-chamber heat sink module
USD773409S1 (en) * 2015-09-16 2016-12-06 Ebullient, Llc Multi-chamber heat sink module
USD772178S1 (en) * 2015-09-26 2016-11-22 Ebullient, Inc. Heat sink module
USD786806S1 (en) * 2015-09-26 2017-05-16 Ebullient, Inc. Heat sink module
USD953280S1 (en) * 2020-01-17 2022-05-31 Furukawa Electric Co., Ltd Heat sink

Similar Documents

Publication Publication Date Title
USD418909S (en) Under sink liner
USD396846S (en) Semiconductor device
USD379799S (en) Heat sink
USD424468S (en) Earring
USD416236S (en) Integrated circuit package
USD418018S (en) Cocktail plate
USD416632S (en) Cove base
USD381011S (en) Heat sink
USD398295S (en) Heat dissipating plate for computer parts
USD427159S (en) Semiconductor element
USD404720S (en) Heat sink and mounting plate for integrated circuits
USD421967S (en) Semiconductor element
USD388399S (en) Heat sink
USD421969S (en) Semiconductor device
USD395868S (en) Electronic computer
USD419738S (en) Sink mat
USD410916S (en) Case for semiconductor element
USD419273S (en) Sink mat
USD417869S (en) Electronic device
USD395832S (en) Thermometer
USD344576S (en) Kitchen sink
USD423271S (en) Place mat
USD401679S (en) Portable sink
USD427670S (en) Sink
USD392024S (en) Faucet base