USD1024149S1 - Collimator for a physical vapor deposition (PVD) chamber - Google Patents

Collimator for a physical vapor deposition (PVD) chamber Download PDF

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Publication number
USD1024149S1
USD1024149S1 US29/863,219 US202229863219F USD1024149S US D1024149 S1 USD1024149 S1 US D1024149S1 US 202229863219 F US202229863219 F US 202229863219F US D1024149 S USD1024149 S US D1024149S
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Prior art keywords
collimator
pvd
chamber
vapor deposition
physical vapor
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US29/863,219
Inventor
Martin Lee Riker
Luke Vianney Varkey
Xiangjin Xie
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Applied Materials Inc
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Applied Materials Inc
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Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RIKER, MARTIN LEE, VARKEY, LUKE VIANNEY, XIE, XIANGJIN
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FIG. 1 is a top isometric view of a collimator for a physical vapor deposition (PVD) chamber showing our new design.
FIG. 2 is a bottom isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a front elevation view thereof.
FIG. 6 is a back elevation view thereof.
FIG. 7 is a left side elevation view thereof.
FIG. 8 is a right side elevation view thereof.
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 3 . Portions of
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 3 .
The dash-dash broken lines in the drawings illustrate portions of the article that form no part of the claimed design. The dot-dash broken lines are for the purpose of illustrating the indications of the cross-section and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a collimator for a physical vapor deposition (PVD) chamber, as shown and described.
US29/863,219 2022-12-16 2022-12-16 Collimator for a physical vapor deposition (PVD) chamber Active USD1024149S1 (en)

Priority Applications (1)

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US29/863,219 USD1024149S1 (en) 2022-12-16 2022-12-16 Collimator for a physical vapor deposition (PVD) chamber

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US29/863,219 USD1024149S1 (en) 2022-12-16 2022-12-16 Collimator for a physical vapor deposition (PVD) chamber

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USD1024149S1 true USD1024149S1 (en) 2024-04-23

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Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5544771A (en) * 1994-02-23 1996-08-13 Samsung Electronics Co., Ltd. Method for manufacturing a collimator
US5770026A (en) * 1996-09-19 1998-06-23 Lg Semicon Co., Ltd. Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus
US20090308739A1 (en) * 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
US20150114823A1 (en) * 2013-10-24 2015-04-30 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
US20150354054A1 (en) * 2014-06-06 2015-12-10 Applied Materials, Inc. Cooled process tool adapter for use in substrate processing chambers
US20160145735A1 (en) * 2014-11-26 2016-05-26 Applied Materials, Inc. Collimator for use in substrate processing chambers
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
US20170117121A1 (en) * 2015-10-27 2017-04-27 Applied Materials, Inc. Biasable flux optimizer / collimator for pvd sputter chamber
US20170253959A1 (en) * 2016-03-05 2017-09-07 Applied Materials, Inc. Methods and apparatus for controlling ion fraction in physical vapor deposition processes
US20170301525A1 (en) * 2014-11-05 2017-10-19 Kabushiki Kaisha Toshiba Processing apparatus and collimator
US20180233335A1 (en) * 2016-03-14 2018-08-16 Kabushiki Kaisha Toshiba Processing device and collimator
US20180237903A1 (en) * 2016-03-14 2018-08-23 Kabushiki Kaisha Toshiba Processing device, sputtering device, and collimator
US20180265964A1 (en) * 2017-03-17 2018-09-20 Kabushiki Kaisha Toshiba Collimator and processing apparatus
US20190027346A1 (en) * 2016-03-14 2019-01-24 Kabushiki Kaisha Toshiba Processing apparatus and collimator
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
JP1719724S (en) * 2021-08-29 2022-07-13 Collimator for physical vapor deposition chamber
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5544771A (en) * 1994-02-23 1996-08-13 Samsung Electronics Co., Ltd. Method for manufacturing a collimator
US5770026A (en) * 1996-09-19 1998-06-23 Lg Semicon Co., Ltd. Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus
US20090308739A1 (en) * 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
US20150114823A1 (en) * 2013-10-24 2015-04-30 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
US20150354054A1 (en) * 2014-06-06 2015-12-10 Applied Materials, Inc. Cooled process tool adapter for use in substrate processing chambers
US20170301525A1 (en) * 2014-11-05 2017-10-19 Kabushiki Kaisha Toshiba Processing apparatus and collimator
US20160145735A1 (en) * 2014-11-26 2016-05-26 Applied Materials, Inc. Collimator for use in substrate processing chambers
US9543126B2 (en) * 2014-11-26 2017-01-10 Applied Materials, Inc. Collimator for use in substrate processing chambers
US20170117121A1 (en) * 2015-10-27 2017-04-27 Applied Materials, Inc. Biasable flux optimizer / collimator for pvd sputter chamber
US20170253959A1 (en) * 2016-03-05 2017-09-07 Applied Materials, Inc. Methods and apparatus for controlling ion fraction in physical vapor deposition processes
US20190027346A1 (en) * 2016-03-14 2019-01-24 Kabushiki Kaisha Toshiba Processing apparatus and collimator
US20180237903A1 (en) * 2016-03-14 2018-08-23 Kabushiki Kaisha Toshiba Processing device, sputtering device, and collimator
US20180233335A1 (en) * 2016-03-14 2018-08-16 Kabushiki Kaisha Toshiba Processing device and collimator
US20180265964A1 (en) * 2017-03-17 2018-09-20 Kabushiki Kaisha Toshiba Collimator and processing apparatus
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
JP1719724S (en) * 2021-08-29 2022-07-13 Collimator for physical vapor deposition chamber
TWD224691S (en) * 2021-08-29 2023-04-11 美商應用材料股份有限公司 Collimator for use in a physical vapor deposition (pvd) chamber
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

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