USD1022931S1 - Integrated circuit - Google Patents

Integrated circuit Download PDF

Info

Publication number
USD1022931S1
USD1022931S1 US29/801,988 US202129801988F USD1022931S US D1022931 S1 USD1022931 S1 US D1022931S1 US 202129801988 F US202129801988 F US 202129801988F US D1022931 S USD1022931 S US D1022931S
Authority
US
United States
Prior art keywords
integrated circuit
sensing
view
circuit shown
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/801,988
Inventor
Vignesh Kannan
Joshua M. Yu
Matthew David Smith
Jeffrey A. Nielsen
Kenneth Duda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to US29/801,988 priority Critical patent/USD1022931S1/en
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DUDA, KENNETH, YU, JOSHUA M., KANNAN, Vignesh, SMITH, MATTHEW DAVID, NIELSEN, JEFFREY A.
Application granted granted Critical
Publication of USD1022931S1 publication Critical patent/USD1022931S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is perspective view, taken from a front, lower-right elevation of a sensing and dispensing integrated circuit;
FIG. 2 is a front plan view of the sensing and dispensing integrated circuit shown in FIG. 1 ;
FIG. 3 is a back plan view of the sensing and dispensing integrated circuit shown in FIG. 1 ;
FIG. 4 is a right side plan view of the sensing and dispensing integrated circuit shown in FIG. 1 ;
FIG. 5 is a left side plan view of the sensing and dispensing integrated circuit shown in FIG. 1 ;
FIG. 6 is a top plan view of the sensing and dispensing integrated circuit shown in FIG. 1 ; and,
FIG. 7 is a bottom plan view of the sensing and dispensing integrated circuit shown in FIG. 1 .
Broken lines shown in the drawings represent portions of the integrated flex circuit that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an integrated circuit, as shown and described.
US29/801,988 2021-08-02 2021-08-02 Integrated circuit Active USD1022931S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/801,988 USD1022931S1 (en) 2021-08-02 2021-08-02 Integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/801,988 USD1022931S1 (en) 2021-08-02 2021-08-02 Integrated circuit

Publications (1)

Publication Number Publication Date
USD1022931S1 true USD1022931S1 (en) 2024-04-16

Family

ID=90624254

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/801,988 Active USD1022931S1 (en) 2021-08-02 2021-08-02 Integrated circuit

Country Status (1)

Country Link
US (1) USD1022931S1 (en)

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD440209S1 (en) * 1999-07-28 2001-04-10 Keonil Kang Board of wireless frequency for amplification of transmitting and receiving electric wave
USD457146S1 (en) * 2000-11-29 2002-05-14 Kabushiki Kaisha Toshiba Substrate for a semiconductor element
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD485536S1 (en) * 2003-03-10 2004-01-20 Pulse Engineering, Inc. Electronics component assembly
USD570307S1 (en) * 2006-11-30 2008-06-03 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD612347S1 (en) * 2005-01-14 2010-03-23 Panasonic Corporation Electric circuit board
USD639756S1 (en) * 2010-07-16 2011-06-14 Dbg Group Investments, Llc Circuit board for integrated ozone laundry system
USD642546S1 (en) * 2010-07-16 2011-08-02 Dbg Group Investments, Llc Circuit board with LEDS for an integrated ozone laundry system
USD720311S1 (en) * 2013-10-17 2014-12-30 Nec Engineering, Ltd. Coaxial waveguide converter substrate with filtering function
USD799438S1 (en) * 2015-11-12 2017-10-10 Mitsubishi Electric Corporation Circuit board
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD440209S1 (en) * 1999-07-28 2001-04-10 Keonil Kang Board of wireless frequency for amplification of transmitting and receiving electric wave
USD457146S1 (en) * 2000-11-29 2002-05-14 Kabushiki Kaisha Toshiba Substrate for a semiconductor element
USD466093S1 (en) * 2001-04-27 2002-11-26 Taiyo Yuden Co., Ltd. Hybird integrated circuit board
USD485536S1 (en) * 2003-03-10 2004-01-20 Pulse Engineering, Inc. Electronics component assembly
USD612347S1 (en) * 2005-01-14 2010-03-23 Panasonic Corporation Electric circuit board
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD570307S1 (en) * 2006-11-30 2008-06-03 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD883240S1 (en) * 2008-09-18 2020-05-05 Advanced Powertrain Engineering, Llc Printed circuit for an automatic transmission solenoid module
USD639756S1 (en) * 2010-07-16 2011-06-14 Dbg Group Investments, Llc Circuit board for integrated ozone laundry system
USD642546S1 (en) * 2010-07-16 2011-08-02 Dbg Group Investments, Llc Circuit board with LEDS for an integrated ozone laundry system
USD720311S1 (en) * 2013-10-17 2014-12-30 Nec Engineering, Ltd. Coaxial waveguide converter substrate with filtering function
USD799438S1 (en) * 2015-11-12 2017-10-10 Mitsubishi Electric Corporation Circuit board
USD956707S1 (en) * 2019-09-26 2022-07-05 Lapis Semiconductor Co., Ltd. Circuit board

Similar Documents

Publication Publication Date Title
USD1015288S1 (en) Electronic device
USD1034585S1 (en) Electronic device
USD951897S1 (en) Electronic device
USD908952S1 (en) Electronic cigarette
USD978146S1 (en) Electronic device
USD938428S1 (en) Cover for an electronic device
USD1015291S1 (en) Electronic device
USD938429S1 (en) Cover for an electronic device
USD1034584S1 (en) Electronic device
USD1009043S1 (en) Cover for an electronic device
USD995332S1 (en) Rear sensor housing
USD999279S1 (en) Point of sale device
USD974353S1 (en) Electronic device
USD1033426S1 (en) Electronic device
USD1005276S1 (en) Case for an electronic device
USD962099S1 (en) Electronic scale
USD957247S1 (en) Punnet tray
USD996419S1 (en) Electronic device
USD910851S1 (en) Electronic dental device
USD976895S1 (en) Electronic device
USD947696S1 (en) Electronic scale
USD982006S1 (en) Electronic device
USD994676S1 (en) Electronic device support
USD973525S1 (en) Electronic scale
USD973524S1 (en) Electronic scale

Legal Events

Date Code Title Description
FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY