USB527972I5 - - Google Patents

Info

Publication number
USB527972I5
USB527972I5 US52797274A USB527972I5 US B527972 I5 USB527972 I5 US B527972I5 US 52797274 A US52797274 A US 52797274A US B527972 I5 USB527972 I5 US B527972I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US05/527,972 priority Critical patent/US4000016A/en
Priority to GB2797475A priority patent/GB1476264A/en
Priority to DE19752535375 priority patent/DE2535375A1/en
Priority to JP50115718A priority patent/JPS5165055A/ja
Priority to FR7531450A priority patent/FR2292757A1/en
Publication of USB527972I5 publication Critical patent/USB527972I5/en
Application granted granted Critical
Publication of US4000016A publication Critical patent/US4000016A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
US05/527,972 1974-11-29 1974-11-29 Water soluble fluxes Expired - Lifetime US4000016A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US05/527,972 US4000016A (en) 1974-11-29 1974-11-29 Water soluble fluxes
GB2797475A GB1476264A (en) 1974-11-29 1975-07-03 Soldering fluxes
DE19752535375 DE2535375A1 (en) 1974-11-29 1975-08-08 SOLDERING FLUX
JP50115718A JPS5165055A (en) 1974-11-29 1975-09-26
FR7531450A FR2292757A1 (en) 1974-11-29 1975-10-06 GLYCEROL WELDING STRIPPER

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/527,972 US4000016A (en) 1974-11-29 1974-11-29 Water soluble fluxes

Publications (2)

Publication Number Publication Date
USB527972I5 true USB527972I5 (en) 1976-03-09
US4000016A US4000016A (en) 1976-12-28

Family

ID=24103732

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/527,972 Expired - Lifetime US4000016A (en) 1974-11-29 1974-11-29 Water soluble fluxes

Country Status (5)

Country Link
US (1) US4000016A (en)
JP (1) JPS5165055A (en)
DE (1) DE2535375A1 (en)
FR (1) FR2292757A1 (en)
GB (1) GB1476264A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114932335A (en) * 2022-05-13 2022-08-23 深圳市荣昌科技有限公司 Water-soluble die-bonding solder paste for high-power LED packaging and preparation method thereof

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568395A (en) * 1985-05-10 1986-02-04 Nabhani Abdol R Precleaner system and soldering flux
US4632295A (en) * 1985-08-12 1986-12-30 International Business Machines Corporation Reduction atmosphere workpiece joining
US5127968A (en) * 1989-08-16 1992-07-07 Yuho Chemicals Inc. Additive for fluxes and soldering pastes
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5297721A (en) * 1992-11-19 1994-03-29 Fry's Metals, Inc. No-clean soldering flux and method using the same
US5571340A (en) * 1994-09-09 1996-11-05 Fry's Metals, Inc. Rosin-free, low VOC, no-clean soldering flux and method using the same
US7740713B2 (en) 2004-04-28 2010-06-22 International Business Machines Corporation Flux composition and techniques for use thereof
TW200920877A (en) * 2007-11-05 2009-05-16 Magtech Technology Co Ltd Method for soldering magnesium alloy workpieces
US7956114B2 (en) * 2009-03-09 2011-06-07 Raytheon Company Water immiscible rosin mildly activated flux
US8887981B2 (en) 2013-03-15 2014-11-18 Raytheon Company Temporary adhesive for component bonding

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2493372A (en) * 1946-11-08 1950-01-03 Harold R Williams Brazing flux composition
US3832242A (en) * 1970-07-23 1974-08-27 Scm Corp Brazing and solder compositions comprising a chelating agent

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE786932A (en) * 1971-07-28 1973-01-29 Int Nickel Ltd WELDING FLUX
US3796610A (en) * 1972-09-28 1974-03-12 Ibm Glycerol soldering fluxes

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2493372A (en) * 1946-11-08 1950-01-03 Harold R Williams Brazing flux composition
US3832242A (en) * 1970-07-23 1974-08-27 Scm Corp Brazing and solder compositions comprising a chelating agent

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114932335A (en) * 2022-05-13 2022-08-23 深圳市荣昌科技有限公司 Water-soluble die-bonding solder paste for high-power LED packaging and preparation method thereof
CN114932335B (en) * 2022-05-13 2024-03-26 深圳市荣昌科技有限公司 Water-soluble die-bonding solder paste for high-power LED packaging and preparation method thereof

Also Published As

Publication number Publication date
US4000016A (en) 1976-12-28
JPS5165055A (en) 1976-06-05
FR2292757B1 (en) 1978-04-07
GB1476264A (en) 1977-06-10
FR2292757A1 (en) 1976-06-25
DE2535375A1 (en) 1976-08-12

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