USB527972I5 - - Google Patents
Info
- Publication number
- USB527972I5 USB527972I5 US52797274A USB527972I5 US B527972 I5 USB527972 I5 US B527972I5 US 52797274 A US52797274 A US 52797274A US B527972 I5 USB527972 I5 US B527972I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/527,972 US4000016A (en) | 1974-11-29 | 1974-11-29 | Water soluble fluxes |
GB2797475A GB1476264A (en) | 1974-11-29 | 1975-07-03 | Soldering fluxes |
DE19752535375 DE2535375A1 (en) | 1974-11-29 | 1975-08-08 | SOLDERING FLUX |
JP50115718A JPS5165055A (en) | 1974-11-29 | 1975-09-26 | |
FR7531450A FR2292757A1 (en) | 1974-11-29 | 1975-10-06 | GLYCEROL WELDING STRIPPER |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/527,972 US4000016A (en) | 1974-11-29 | 1974-11-29 | Water soluble fluxes |
Publications (2)
Publication Number | Publication Date |
---|---|
USB527972I5 true USB527972I5 (en) | 1976-03-09 |
US4000016A US4000016A (en) | 1976-12-28 |
Family
ID=24103732
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US05/527,972 Expired - Lifetime US4000016A (en) | 1974-11-29 | 1974-11-29 | Water soluble fluxes |
Country Status (5)
Country | Link |
---|---|
US (1) | US4000016A (en) |
JP (1) | JPS5165055A (en) |
DE (1) | DE2535375A1 (en) |
FR (1) | FR2292757A1 (en) |
GB (1) | GB1476264A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114932335A (en) * | 2022-05-13 | 2022-08-23 | 深圳市荣昌科技有限公司 | Water-soluble die-bonding solder paste for high-power LED packaging and preparation method thereof |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4568395A (en) * | 1985-05-10 | 1986-02-04 | Nabhani Abdol R | Precleaner system and soldering flux |
US4632295A (en) * | 1985-08-12 | 1986-12-30 | International Business Machines Corporation | Reduction atmosphere workpiece joining |
US5127968A (en) * | 1989-08-16 | 1992-07-07 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
US7740713B2 (en) | 2004-04-28 | 2010-06-22 | International Business Machines Corporation | Flux composition and techniques for use thereof |
TW200920877A (en) * | 2007-11-05 | 2009-05-16 | Magtech Technology Co Ltd | Method for soldering magnesium alloy workpieces |
US7956114B2 (en) * | 2009-03-09 | 2011-06-07 | Raytheon Company | Water immiscible rosin mildly activated flux |
US8887981B2 (en) | 2013-03-15 | 2014-11-18 | Raytheon Company | Temporary adhesive for component bonding |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2493372A (en) * | 1946-11-08 | 1950-01-03 | Harold R Williams | Brazing flux composition |
US3832242A (en) * | 1970-07-23 | 1974-08-27 | Scm Corp | Brazing and solder compositions comprising a chelating agent |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE786932A (en) * | 1971-07-28 | 1973-01-29 | Int Nickel Ltd | WELDING FLUX |
US3796610A (en) * | 1972-09-28 | 1974-03-12 | Ibm | Glycerol soldering fluxes |
-
1974
- 1974-11-29 US US05/527,972 patent/US4000016A/en not_active Expired - Lifetime
-
1975
- 1975-07-03 GB GB2797475A patent/GB1476264A/en not_active Expired
- 1975-08-08 DE DE19752535375 patent/DE2535375A1/en not_active Withdrawn
- 1975-09-26 JP JP50115718A patent/JPS5165055A/ja active Pending
- 1975-10-06 FR FR7531450A patent/FR2292757A1/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2493372A (en) * | 1946-11-08 | 1950-01-03 | Harold R Williams | Brazing flux composition |
US3832242A (en) * | 1970-07-23 | 1974-08-27 | Scm Corp | Brazing and solder compositions comprising a chelating agent |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114932335A (en) * | 2022-05-13 | 2022-08-23 | 深圳市荣昌科技有限公司 | Water-soluble die-bonding solder paste for high-power LED packaging and preparation method thereof |
CN114932335B (en) * | 2022-05-13 | 2024-03-26 | 深圳市荣昌科技有限公司 | Water-soluble die-bonding solder paste for high-power LED packaging and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
US4000016A (en) | 1976-12-28 |
JPS5165055A (en) | 1976-06-05 |
FR2292757B1 (en) | 1978-04-07 |
GB1476264A (en) | 1977-06-10 |
FR2292757A1 (en) | 1976-06-25 |
DE2535375A1 (en) | 1976-08-12 |