USB437450I5 - - Google Patents
Info
- Publication number
- USB437450I5 USB437450I5 US43745074A USB437450I5 US B437450 I5 USB437450 I5 US B437450I5 US 43745074 A US43745074 A US 43745074A US B437450 I5 USB437450 I5 US B437450I5
- Authority
- US
- United States
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US437450*A US3922479A (en) | 1971-09-15 | 1974-01-28 | Coaxial circuit construction and method of making |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18088671A | 1971-09-15 | 1971-09-15 | |
US437450*A US3922479A (en) | 1971-09-15 | 1974-01-28 | Coaxial circuit construction and method of making |
Publications (2)
Publication Number | Publication Date |
---|---|
USB437450I5 true USB437450I5 (en) | 1975-01-28 |
US3922479A US3922479A (en) | 1975-11-25 |
Family
ID=26876710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US437450*A Expired - Lifetime US3922479A (en) | 1971-09-15 | 1974-01-28 | Coaxial circuit construction and method of making |
Country Status (1)
Country | Link |
---|---|
US (1) | US3922479A (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4153988A (en) * | 1977-07-15 | 1979-05-15 | International Business Machines Corporation | High performance integrated circuit semiconductor package and method of making |
US4157407A (en) * | 1978-02-13 | 1979-06-05 | E. I. Du Pont De Nemours And Company | Toning and solvent washout process for making conductive interconnections |
US4576900A (en) * | 1981-10-09 | 1986-03-18 | Amdahl Corporation | Integrated circuit multilevel interconnect system and method |
US4888450A (en) * | 1981-12-11 | 1989-12-19 | At&T Bell Laboratories | Circuit board fabrication leading to increased capacity |
JPS58502079A (en) * | 1981-12-11 | 1983-12-01 | ウエスタ−ン エレクトリツク カムパニ− インコ−ポレ−テツド | Manufacturing circuit boards that increase capacity |
US4706167A (en) * | 1983-11-10 | 1987-11-10 | Telemark Co., Inc. | Circuit wiring disposed on solder mask coating |
US4566186A (en) * | 1984-06-29 | 1986-01-28 | Tektronix, Inc. | Multilayer interconnect circuitry using photoimageable dielectric |
FR2567684B1 (en) * | 1984-07-10 | 1988-11-04 | Nec Corp | MODULE HAVING A MULTILAYER CERAMIC SUBSTRATE AND A MULTILAYER CIRCUIT ON THE SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF |
US4876322A (en) * | 1984-08-10 | 1989-10-24 | Siemens Aktiengesselschaft | Irradiation cross-linkable thermostable polymer system, for microelectronic applications |
EP0174494B1 (en) * | 1984-08-10 | 1989-06-07 | Siemens Aktiengesellschaft | Thermostable polymer system, cross-linkable by irradiation, for microelectronic use |
US4729510A (en) * | 1984-11-14 | 1988-03-08 | Itt Corporation | Coaxial shielded helical delay line and process |
US4647878A (en) * | 1984-11-14 | 1987-03-03 | Itt Corporation | Coaxial shielded directional microwave coupler |
US4647882A (en) * | 1984-11-14 | 1987-03-03 | Itt Corporation | Miniature microwave guide |
US4673904A (en) * | 1984-11-14 | 1987-06-16 | Itt Corporation | Micro-coaxial substrate |
DE3679453D1 (en) * | 1985-06-05 | 1991-07-04 | Siemens Ag | METHOD FOR PRODUCING PRINTED CIRCUITS USING A RADIATION NETWORKING PHOTOPOLYMER SYSTEM. |
US5302494A (en) * | 1985-06-10 | 1994-04-12 | The Foxboro Company | Multilayer circuit board having microporous layers and process for making same |
US4915983A (en) * | 1985-06-10 | 1990-04-10 | The Foxboro Company | Multilayer circuit board fabrication process |
US4816616A (en) * | 1987-12-10 | 1989-03-28 | Microelectronics Center Of North Carolina | Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes |
US4889962A (en) * | 1988-08-19 | 1989-12-26 | Northern Telecom Limited | Circuit board with coaxial circuit and method therefor |
JP2840271B2 (en) * | 1989-01-27 | 1998-12-24 | キヤノン株式会社 | Recording head |
US5219669A (en) * | 1990-04-26 | 1993-06-15 | International Business Machines Corporation | Layer thin film wiring process featuring self-alignment of vias |
JPH05226833A (en) * | 1992-02-17 | 1993-09-03 | Toshiba Corp | Manufacture of printed circuit board |
US5363550A (en) * | 1992-12-23 | 1994-11-15 | International Business Machines Corporation | Method of Fabricating a micro-coaxial wiring structure |
FI106585B (en) * | 1997-10-22 | 2001-02-28 | Nokia Mobile Phones Ltd | Coaxial cable, a method for making a coaxial cable, and wireless communication |
US6387810B2 (en) * | 1999-06-28 | 2002-05-14 | International Business Machines Corporation | Method for homogenizing device parameters through photoresist planarization |
JP2001332859A (en) * | 2000-05-22 | 2001-11-30 | Murata Mfg Co Ltd | Laminate type ceramic electronic component and its manufacturing method, as well as electronic device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3366519A (en) * | 1964-01-20 | 1968-01-30 | Texas Instruments Inc | Process for manufacturing multilayer film circuits |
US3391454A (en) * | 1965-03-10 | 1968-07-09 | Litton Systems Inc | Shielded etched circuit conductor |
US3508325A (en) * | 1965-01-25 | 1970-04-28 | Texas Instruments Inc | Method of making insulation structures for crossover leads in integrated circuitry |
-
1974
- 1974-01-28 US US437450*A patent/US3922479A/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3366519A (en) * | 1964-01-20 | 1968-01-30 | Texas Instruments Inc | Process for manufacturing multilayer film circuits |
US3508325A (en) * | 1965-01-25 | 1970-04-28 | Texas Instruments Inc | Method of making insulation structures for crossover leads in integrated circuitry |
US3391454A (en) * | 1965-03-10 | 1968-07-09 | Litton Systems Inc | Shielded etched circuit conductor |
Also Published As
Publication number | Publication date |
---|---|
US3922479A (en) | 1975-11-25 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ALLIED CORPORATION COLUMBIA ROAD AND PARK AVENUE, Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:BUNKER RAMO CORPORATION A CORP. OF DE;REEL/FRAME:004149/0365 Effective date: 19820922 |
|
AS | Assignment |
Owner name: EATON CORPORATION AN OH CORP Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:ALLIED CORPORATION A NY CORP;REEL/FRAME:004261/0983 Effective date: 19840426 |