USB435844I5 - - Google Patents

Info

Publication number
USB435844I5
USB435844I5 US43584474A USB435844I5 US B435844 I5 USB435844 I5 US B435844I5 US 43584474 A US43584474 A US 43584474A US B435844 I5 USB435844 I5 US B435844I5
Authority
US
United States
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to US435844A priority Critical patent/US3925170A/en
Priority to CA217,526A priority patent/CA1036534A/fr
Priority to JP966175A priority patent/JPS548537B2/ja
Publication of USB435844I5 publication Critical patent/USB435844I5/en
Application granted granted Critical
Publication of US3925170A publication Critical patent/US3925170A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US435844A 1974-01-23 1974-01-23 Method and composition for producing bright palladium electrodepositions Expired - Lifetime US3925170A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US435844A US3925170A (en) 1974-01-23 1974-01-23 Method and composition for producing bright palladium electrodepositions
CA217,526A CA1036534A (fr) 1974-01-23 1975-01-07 Methode et compose pour l'obtention d'electrodepositions brillantes au palladium
JP966175A JPS548537B2 (fr) 1974-01-23 1975-01-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US435844A US3925170A (en) 1974-01-23 1974-01-23 Method and composition for producing bright palladium electrodepositions

Publications (2)

Publication Number Publication Date
USB435844I5 true USB435844I5 (fr) 1975-01-28
US3925170A US3925170A (en) 1975-12-09

Family

ID=23730043

Family Applications (1)

Application Number Title Priority Date Filing Date
US435844A Expired - Lifetime US3925170A (en) 1974-01-23 1974-01-23 Method and composition for producing bright palladium electrodepositions

Country Status (3)

Country Link
US (1) US3925170A (fr)
JP (1) JPS548537B2 (fr)
CA (1) CA1036534A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496127A1 (fr) * 1980-12-17 1982-06-18 Hooker Chemicals Plastics Corp Bains et procede electrolytique pour le depot de palladium blanc
EP0112561A1 (fr) * 1982-12-22 1984-07-04 LeaRonal, Inc. Solutions de dépôt électrolytique aqueuses et procédé de dépôt électrolytique d'alliages palladium-argent
EP0107308A3 (fr) * 1982-09-09 1985-07-03 Engelhard Corporation Bain de dépôt électrolytique de palladium, son procédé de préparation et d'utilisation
EP0524760A2 (fr) * 1991-07-22 1993-01-27 AT&T Corp. Traitement thermique des alliages de Palladium

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
US4028064A (en) * 1976-02-17 1977-06-07 Texas Instruments Incorporated Beryllium copper plating process
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
US4100039A (en) * 1976-11-11 1978-07-11 International Business Machines Corporation Method for plating palladium-nickel alloy
CH649581A5 (de) * 1979-08-20 1985-05-31 Oxy Metal Industries Corp Mittel zur elektrolytischen ablagerung von metallischem palladium auf einem substrat.
US4401527A (en) * 1979-08-20 1983-08-30 Occidental Chemical Corporation Process for the electrodeposition of palladium
US4297179A (en) * 1980-09-02 1981-10-27 American Chemical & Refining Company Incorporated Palladium electroplating bath and process
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
US4392921A (en) * 1980-12-17 1983-07-12 Occidental Chemical Corporation Composition and process for electroplating white palladium
US4545868A (en) * 1981-10-06 1985-10-08 Learonal, Inc. Palladium plating
US4622110A (en) * 1981-10-06 1986-11-11 Learonal, Inc. Palladium plating
DE3148788C2 (de) * 1981-12-09 1986-08-21 Siemens AG, 1000 Berlin und 8000 München Wäßriges Bad und Verfahren zum galvanischen Abscheiden von glänzenden und rißfreien Palladiumschichten sowie Verfahren zur Herstellung des Bades
US4468296A (en) * 1982-12-10 1984-08-28 At&T Bell Laboratories Process for electroplating palladium
US4778574A (en) * 1987-09-14 1988-10-18 American Chemical & Refining Company, Inc. Amine-containing bath for electroplating palladium
US5415685A (en) * 1993-08-16 1995-05-16 Enthone-Omi Inc. Electroplating bath and process for white palladium
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
TWI354716B (en) * 2007-04-13 2011-12-21 Green Hydrotec Inc Palladium-containing plating solution and its uses
US20110147225A1 (en) * 2007-07-20 2011-06-23 Rohm And Haas Electronic Materials Llc High speed method for plating palladium and palladium alloys
CN101348928B (zh) * 2007-07-20 2012-07-04 罗门哈斯电子材料有限公司 镀钯及镀钯合金之高速方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU213509A1 (ru) * С. Н. Виноградов Способ электролитического осаждения сплава на основе палладия
US3580820A (en) * 1967-01-11 1971-05-25 Suwa Seikosha Kk Palladium-nickel alloy plating bath

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU213509A1 (ru) * С. Н. Виноградов Способ электролитического осаждения сплава на основе палладия
SU212692A1 (ru) * С. Н. Виноградов Способ электролитического осаждения сплава на основе палладия
US3580820A (en) * 1967-01-11 1971-05-25 Suwa Seikosha Kk Palladium-nickel alloy plating bath
US3677909A (en) * 1967-01-11 1972-07-18 Katsumi Yamamura Palladium-nickel alloy plating bath

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
K.S. Indira et al., Metal Finishing, pp.52-57, Vol. 6, (1973) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2496127A1 (fr) * 1980-12-17 1982-06-18 Hooker Chemicals Plastics Corp Bains et procede electrolytique pour le depot de palladium blanc
EP0107308A3 (fr) * 1982-09-09 1985-07-03 Engelhard Corporation Bain de dépôt électrolytique de palladium, son procédé de préparation et d'utilisation
EP0112561A1 (fr) * 1982-12-22 1984-07-04 LeaRonal, Inc. Solutions de dépôt électrolytique aqueuses et procédé de dépôt électrolytique d'alliages palladium-argent
EP0524760A2 (fr) * 1991-07-22 1993-01-27 AT&T Corp. Traitement thermique des alliages de Palladium
EP0524760A3 (en) * 1991-07-22 1994-07-13 At & T Corp Thermal annealing of palladium alloys

Also Published As

Publication number Publication date
US3925170A (en) 1975-12-09
JPS548537B2 (fr) 1979-04-17
JPS50123532A (fr) 1975-09-29
CA1036534A (fr) 1978-08-15

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