US9528825B2 - Method for calibrating a position-measuring system and position-measuring system - Google Patents
Method for calibrating a position-measuring system and position-measuring system Download PDFInfo
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- US9528825B2 US9528825B2 US14/327,634 US201414327634A US9528825B2 US 9528825 B2 US9528825 B2 US 9528825B2 US 201414327634 A US201414327634 A US 201414327634A US 9528825 B2 US9528825 B2 US 9528825B2
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- measuring
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- gaseous medium
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/16—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02055—Reduction or prevention of errors; Testing; Calibration
- G01B9/0207—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer
- G01B9/02072—Error reduction by correction of the measurement signal based on independently determined error sources, e.g. using a reference interferometer by calibration or testing of interferometer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
Definitions
- the present invention relates to a method for calibrating a position-measuring system and a position-measuring system for detecting a position.
- Such position-measuring systems are, for example, used in the field of metrology in order, e.g., to measure structures on a wafer or structures of a mask for producing semiconductor elements. For this, e.g., an image of a structure on a sample is recorded, then the sample (e.g., wafer or mask) moves and the image of a second structure on the sample is recorded. Then, for example, the distance between the two structures as well as a movement distance of the sample can be determined from the images.
- a movement of the sample may be measured by use of interferometry.
- Accuracy of the position measurement by the use of interferometry depends on the refractive index of the gaseous medium (e.g., ambient air) in which the sample is arranged.
- the refractive index of the gaseous medium is continually determined, typically with a known reference section (etalon). To this end, the refractive index is calculated from the changes, measured by use of interferometry, in etalon length signal and known etalon length, and the measured positions are corrected accordingly.
- an aspect of the invention is to provide a method for calibrating a position-measuring system, and a position-measuring system, which make possible to improve measuring accuracy.
- the measuring system includes a measuring area filled with a gaseous medium; a sample stage for holding a sample, which sample stage can be moved at least in one direction and is arranged in the measuring area; an optical system arranged in the measuring area, which system records the structure of a held sample and produces corresponding first measuring signals; a first measuring system which is arranged in the measuring area, measures, by use of interferometry, the movement of the sample stage in the at least one direction and produces corresponding second measuring signals; a second measuring system which measures a change in distance corresponding to a change in pressure of the gaseous medium in the measuring area and produces corresponding third measuring signals; and an evaluation unit which, based on the first, second and third measuring signals, determines the position of a recorded structure, wherein the third measuring signals serve to reduce a measuring error occurring when the pressure of the gaseous medium changes during interferometric measurement of the movement of the sample stage.
- the calibrating method includes the following steps: a) multiple measurements of a structure of a sample held by the sample stage at different pressures of the gaseous medium, b) ascertaining the pressure dependence when determining actual positions by use of an evaluation unit, c) establishing a calibration rule based on the ascertained pressure dependence, and d) applying the calibration rule when determining the actual positions by use of the evaluation unit and/or when producing the first, second and/or third measuring signals, in order to reduce the pressure dependence when determining the actual positions.
- Implementations of the invention may include one or more of the following aspects.
- the influence of the change in pressure on components of the measuring section is taken into account when determining the position. This leads to the desired increase in measuring accuracy when determining the position. In particular it is not necessary to control the pressure in the measuring area. Indeed, this may, but need not, be carried out with the position-measuring system according to the invention. If such a pressure regulation is dispensed with, the position-measuring system can be produced more cost-effectively but also still have a very high measuring accuracy.
- Atmospheric-pressure-induced influences on determining the position can also be taken into account with the method according to the invention, which influences are not produced by changes in the refractive index.
- large fluctuations in pressure can lead to errors in scaling/measurement because of compression of materials of components involved in measurement, such as e.g. the sample, the measuring section, the sample stage measurement mirror, etc.
- methods of calculating pressure-induced changes in shape of components involved in the measuring circuit e.g., by use of the finite elements method, and storing an executing program in a control unit, known thus far, are very costly and also require that most or all components are sufficiently precisely known, which is generally not the case.
- step b) a linear approximation of the measured positions, depending on the pressure, can be determined as pressure dependence and in step c) as calibration rule there can be established a proportionality factor which is determined such that the pressure dependence is reduced.
- a proportionality factor which is determined such that the pressure dependence is reduced.
- the second measuring system can have a measuring section with a constant length through the gaseous medium (e.g., in the measuring area or in an area connected thereto) and, for measuring the change in pressure, detect the interference of a measuring beam passing through the measuring section and a measuring beam not passing through the measuring section.
- the second measuring system can be designed as a differential interferometer.
- the calibration rule can arithmetically change the length of the measuring section to be taken into account while determining the change in pressure. That is, a coefficient of correction is taken into account numerically in that, when determining the position, not the actual length of the measuring section but a corresponding length longer or shorter than the actual length of the measuring section is used in corresponding calculations.
- step a) several structures can be measured several times in step a) and the distance between structures can be determined in step b).
- the temperature and/or the relative moisture of the gaseous medium can be controlled in the measuring area such that a predetermined constant value is maintained.
- a device for carrying out the method according to an aspect of the invention has a measuring area filled with a gaseous medium; a sample stage for holding a sample, which sample stage can be moved at least in one direction and is arranged in the measuring area; an optical system arranged in the measuring area, which system records positions of the structure of a held sample and produces corresponding first measuring signals; a first measuring system which is arranged in the measuring area, measures, by use of interferometry, movement of the sample stage in the at least one direction and produces corresponding second measuring signals; a second measuring system which measures a change in distance corresponding to a change in pressure of the gaseous medium in the measuring area and produces corresponding third measuring signals; and an evaluation unit which, based on the first, second and third measuring signals, determines a position of a recorded structure, wherein the third measuring signals serve to reduce a measuring error occurring when the pressure of the gaseous medium changes during the interferometric measuring of the movement of the sample stage.
- a position-measuring system includes a measuring area filled with a gaseous medium; a sample stage for holding a sample, which stage can be moved at least in one direction and is arranged in the measuring area; an optical system arranged in the measuring area, which system records positions of a structure of a held sample and produces corresponding first measuring signals; a first measuring system which is arranged in the measuring area, measures, by use of interferometry, movement of the sample stage in the at least one direction and produces corresponding second measuring signals; a second measuring system which measures a change in distance corresponding to a change in the pressure of the gaseous medium in the measuring area and produces corresponding third measuring signals; an evaluation unit which, based on the first, second and third measuring signals, determines a position of a recorded structure, wherein the third measuring signals serve to reduce a measuring error occurring when the pressure of the gaseous medium changes during the interferometric measuring of the movement of the sample stage.
- the system includes a control unit that carries out the following steps: a) multiple measurements of positions of a structure of a sample held by the sample stage at different pressures of the gaseous medium, b) ascertaining the pressure dependence when determining an actual position by use of an evaluation unit, c) establishing a calibration rule based on the ascertained pressure dependence, and d) applying the calibration rule when determining the actual position by use of the evaluation unit and/or when producing the first, second and/or third measuring signals, in order to reduce the pressure dependence when determining the actual position.
- the position-measuring system according to an aspect of the invention can be developed such that the method according to the aspect of the invention for calibrating a position-measuring system, including the described developments, can be carried out by said system.
- the measuring section can be provided by two mirrors, spatially separated from each other, wherein the two mirrors are spatially separated from one another in particular by a spacer. They can be connected to the spacer.
- the spacer can be produced from a material which has very low dimensional changes when subjected to changes in temperature and/or pressure. In particular, the material Zerodur can be used.
- the second measuring system measures the interference (in particular the phase change) of the two measuring beams continually.
- the evaluation unit can take into account a factor of correction as calibration rule when determining the position of the structure, which factor shows or represents the change in length of the measuring section induced by the change in pressure in the measuring area. This can in particular be the changed length of the measuring section. This changed length of the measuring section can be called effective length and, when determining the position, it can be assumed that the measuring section has this effective length.
- Errors in scaling can be ascertained in step b) in particular for determining the calibration rule. It has been established that there is in particular a linear dependence of the change in measured scalings on the third measuring signals. Therefore, e.g., a straight line can be fitted to the scaling values and the gradient of the fitted straight line used when ascertaining the calibration rule (e.g., the factor of correction).
- the position-measuring system can have a regulating module which regulates the temperature and/or the relative moisture of the gaseous medium in the measuring area such that a predetermined constant value is maintained. This leads to an increase in measuring accuracy.
- the second measuring system can be developed in particular as a differential interferometer.
- the position-measuring system according to an aspect of the invention can be developed as a metrology system.
- the position-measuring system can have further elements known to a person skilled in the art which are useful for operating the position-measuring system. Furthermore, the position-measuring system can determine the position of the object relative to a fixed position.
- the method according to the one or more aspects of the invention can be developed such that it has the method steps described in connection with the position-measuring system according to the one or more aspects of the invention (including developments thereof).
- FIG. 1 shows a schematic representation of an embodiment of a position-measuring system.
- a position-measuring system 1 includes a stage 2 which can be moved at least in one direction, which stage is arranged in a measuring area 3 in which a gaseous medium is present.
- the stage 2 bears a mask 4 to be examined, which mask is illuminated either by a first illumination device 5 for transillumination or a second illumination device 6 for incident illumination.
- the illumination device 5 , 6 can for example each be developed as a laser which emits light with a wavelength of 193 nm.
- the illuminated mask 4 is imaged via imaging optics 7 and a beam splitter 8 on an image sensor 9 (which for example is developed as a CCD sensor or as a CMOS sensor), which together can also be called recording unit or optical system.
- image sensor 9 is connected to a control unit 10 arranged outside the measuring area 3 and said image sensor transmits the image signals to said control unit as first measuring signals.
- a first measuring system 11 which detects, by use of interferometry as shown by the double-headed arrow P 2 , the movement of the stage 2 in the first direction P 1 .
- the corresponding measuring signals are supplied to the control unit 10 as second measuring signals.
- a second measuring system 12 is arranged in the measuring area 3 , which system is developed as a differential interferometer and has a measuring section 13 of constant length.
- the measuring section 13 is the distance between a first and a second mirror 14 , 15 , wherein the distance between the two mirrors 14 , 15 is fixed by a spacer 16 and known.
- the spacer 16 can for example be produced from Zerodur.
- a laser beam 17 is divided at a first beam splitter 18 into a first and second measuring beam 19 , 20 , wherein the first measuring beam 19 strikes the first mirror 14 and the second measuring beam 20 strikes the second mirror 15 via a reflecting mirror 21 .
- the second measuring beam 20 thus passes through the measuring section 13 (here twice), whereas the first measuring beam 19 does not pass through the measuring section 13 .
- the third measuring signals show a change in the optical path of the measuring section 13 which is composed from the product of refractive index of the gaseous medium and geometric path of the measuring section.
- the length EL is measured and is available to the control unit 10 .
- control unit 10 is designed such that it likewise takes into account, e.g., due to the change in length of the working section 13 , brought about by the change in pressure, when the position of the sample stage 2 is being determined.
- the measuring accuracy can be further increased.
- the influence of the change in measuring section 13 can be taken into account by a coefficient of correction which is to be determined for a position-measuring system 1 present and can then be taken into account when determining the position of the sample stage 2 . Determining such a coefficient of correction is described below.
- the reference section being the spacer 16 for the two mirrors 14 , 15 is called etalon.
- the length of the etalon (l E0 ) is measured accurately to a few ⁇ m, e.g., with a coordinate measuring machine.
- the value ⁇ E describes the pressure-dependent compression of the spacer 16 , wherein the indicated value ⁇ E has been ascertained by a FEM (FEM refers to finite element method) calculation.
- FEM finite element method
- the length of the measuring section 13 is not sufficiently accurately known under standard conditions, as the length is determined mechanically by a corresponding measuring device.
- the refractive index can be indicated as follows ( ⁇ 0 is the vacuum wavelength of the laser beam 17 ):
- n ′ n ⁇ R + ⁇ 0 2 ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ E l eff ( 6 )
- the effective length of the measuring section 13 or the effective etalon length, which takes into account etalon and mask compression, can then be indicated as follows (the numerical value relates in turn to the observed real position-measuring system)
- the pressure dependence of the further components leads in turn to a measuring error when determining the position of the stage 2 .
- This dependence can, in the same way, be taken into account as a coefficient of correction when determining the pressure-dependent refractive index by the second measuring system 12 .
- these effects can practically barely or no longer be determined analytically or by approximation computations.
- positions of structures on the mask 4 can be measured at different pressures which occur during a measuring period.
- a position measurement e.g., a dimensioning of the structures or a distance between at least two structures on the mask 4 can be ascertained.
- the coefficient of correction behaves like an effective change in length of the reference section 13
- the coefficient of correction itself can be determined empirically from the measurements on the respective measuring system.
- a change in the measured dimensions or the measured distance also called enlargement hereinafter
- the correction value can then be calculated from the gradient of a fitted straight line with regard to these measurement values.
- the correction value is calculated such that the change in the measured dimension or measured distance is as independent as possible on the measuring signals of the second measuring system 12 .
- the position-measuring system is designed in particular as a metrology system which can be used for measuring lengths or for measuring distances. If the mask 4 contains, e.g., two distinguishing markings, and the distance between them is to be measured, then a recording of each of the markings is carried out by use of the imaging optics 7 and the recording sensor 9 . For each recording, the corresponding marking is moved into a recording area which is predetermined by the imaging optics 7 and the recording sensor 9 , in which a desired distance can be ascertained with great precision from the recordings in connection with the measured travel path which is detected in the described manner by use of the two measuring systems 11 and 12 .
- the position-measuring system can also have a regulating module 22 which regulates the temperature and/or the relative humidity in the measuring area 3 such that these are kept as constant as possible.
- the regulating module 22 can regulate the temperature with an accuracy of, e.g., ⁇ 0.01° C. and the relative moisture with an accuracy of, e.g., ⁇ 1%.
- the regulating module 22 can be connected to the control unit 10 .
- the stage 2 can also be moved in two directions perpendicular to one another (e.g., in the direction of the double-headed arrow P 1 as well as perpendicular to the plane of the drawing).
- the first measuring system 11 is designed such that it measures, by use of interferometry, the movement in both directions.
- the recording unit (imaging optics 7 , beam splitter 8 and sensor 9 ) can be moved relative to the stage 2 .
- the movement of the recording unit would then be measured, by use of interferometry, using the first measuring system.
- the second measuring system 12 can, as described, be arranged in the measuring area 3 . However, it is also possible that the second measuring system 12 is arranged in a separate area which, however, is connected to the measuring area 3 such that the same conditions and in particular the same pressure as in the measuring area 3 are present there.
- the first and second illumination device 5 , 6 is drawn in the embodiment of the position-measuring system 1 , shown in FIG. 1 .
- the position-measuring system need not have two illumination devices 5 , 6 . It may also include merely one of the two illumination devices 5 , 6 .
- the features described above related to processing of data can be implemented in digital electronic circuitry, or in computer hardware, firmware, software, or in combinations of them.
- the features can be implemented in a computer program product tangibly embodied in an information carrier, e.g., in a machine-readable storage device, for execution by a programmable processor; and method steps can be performed by a programmable processor executing a program of instructions to perform functions of the described implementations by operating on input data and generating output.
- the program instructions can be encoded on a propagated signal that is an artificially generated signal, e.g., a machine-generated electrical, optical, or electromagnetic signal that is generated to encode information for transmission to suitable receiver apparatus for execution by a programmable processor.
- an artificially generated signal e.g., a machine-generated electrical, optical, or electromagnetic signal that is generated to encode information for transmission to suitable receiver apparatus for execution by a programmable processor.
- a computer program is a set of instructions that can be used, directly or indirectly, in a computer to perform a certain activity or bring about a certain result.
- a computer program can be written in any form of programming language (e.g., Fortran, C, C++, Objective-C, Java), including compiled or interpreted languages, and it can be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.
- Suitable processors for the execution of a program of instructions include, by way of example, both general and special purpose microprocessors, and the sole processor or one of multiple processors or cores, of any kind of computer.
- the control unit 10 may include one or more such processors that execute instructions for implementing a process for calibrating the position-measuring system.
- a processor will receive instructions and data from a read-only memory or a random access memory or both.
- the elements of a computer include a processor for executing instructions and one or more memories for storing instructions and data.
- a computer will also include, or be operatively coupled to communicate with, one or more mass storage devices for storing data files; such devices include magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and optical disks.
- Storage devices suitable for tangibly embodying computer program instructions and data include all forms of non-volatile memory, including by way of example semiconductor memory devices, such as EPROM, EEPROM, and flash memory devices; magnetic disks such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.
- the processor and the memory can be supplemented by, or incorporated in, ASICs (application-specific integrated circuits).
- the features can be implemented on a computer having a display device such as a LCD (liquid crystal display) monitor, an electronic ink (E-ink) display, or an organic light emitting diode (OLED) display for displaying information to the user and a keyboard and a pointing device such as a mouse, a trackball, or touchpad by which the user can provide input to the computer.
- a display device such as a LCD (liquid crystal display) monitor, an electronic ink (E-ink) display, or an organic light emitting diode (OLED) display for displaying information to the user and a keyboard and a pointing device such as a mouse, a trackball, or touchpad by which the user can provide input to the computer.
- a touch display can also be used in which the display surface is sensitive to touch inputs from a user.
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Abstract
Description
l E =l E0·[1−εE·(p−p 0)], (1)
wherein p0=1,013.25 mbar, p is the present pressure, lE0 the expected length of the measuring
{tilde over (l)} E =l E0 −Δl E0 (3)
wherein ΔlE0 indicates the measuring accuracy with a mechanical measurement of the measuring
This approximation is valid because εE is very small for a large pressure range (the error of approximation is less than 10% for a range from 900 to 1,050 mbar).
A more accurate value can be obtained from an FEM calculation.
Claims (19)
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DE201310213525 DE102013213525B3 (en) | 2013-07-10 | 2013-07-10 | Method for calibrating position measuring system of wafer used for manufacturing semiconductor device, involves applying calibration regulation in position determination during generation of first, second and third measuring signals |
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US20190011690A1 (en) * | 2017-07-10 | 2019-01-10 | Carl Zeiss Smt Gmbh | Method for capturing and compensating ambient effects in a measuring microscope |
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US20150013427A1 (en) | 2015-01-15 |
DE102013213525B3 (en) | 2014-08-21 |
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