US9117464B1 - Methods for manufacturing hybrid coils for magnetic write heads used in storage systems - Google Patents
Methods for manufacturing hybrid coils for magnetic write heads used in storage systems Download PDFInfo
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- US9117464B1 US9117464B1 US13/932,332 US201313932332A US9117464B1 US 9117464 B1 US9117464 B1 US 9117464B1 US 201313932332 A US201313932332 A US 201313932332A US 9117464 B1 US9117464 B1 US 9117464B1
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 235000012771 pancakes Nutrition 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 230000002730 additional effect Effects 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/17—Construction or disposition of windings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/1278—Structure or manufacture of heads, e.g. inductive specially adapted for magnetisations perpendicular to the surface of the record carrier
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/312—Details for reducing flux leakage between the electrical coil layers and the magnetic cores or poles or between the magnetic cores or poles
- G11B5/3123—Details for reducing flux leakage between the electrical coil layers and the magnetic cores or poles or between the magnetic cores or poles by using special coil configurations or conductors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
- G11B5/3136—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure for reducing the pole-tip-protrusion at the head transducing surface, e.g. caused by thermal expansion of dissimilar materials
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B2005/0002—Special dispositions or recording techniques
- G11B2005/0005—Arrangements, methods or circuits
Definitions
- the present invention relates to disk drive technology, and more specifically to systems and methods for providing hybrid coils for magnetic write heads used in disk drives.
- An important advantage of the drive technology is high storage capacity at relatively lower cost compared to flash memory.
- increases in linear density for a given rpm and form factor of drive increase the maximum data rate.
- Server applications where access to large amounts of mission critical data is essential also requires high data rates.
- High data rates can be important for both conventional and electrically assisted magnetic recording (EAMR) recording technology.
- EAMR electrically assisted magnetic recording
- Coil designs for writers can be used in both conventional perpendicular and EAMR heads.
- EAMR heads generally require a large write gap (e.g., about 1.5 um) as optics needs to be sandwiched between the main pole (P1) and the return pole (P2) compared to conventional perpendicular writers where write field gradient requires a small gap (e.g., about 30 nm) between the main pole and the return pole.
- Write gap length in the conventional perpendicular design needs to be matched to the distance between head to the soft under layer (SUL) in the media, which is typically about 30 to 40 nm from the air bearing surface (ABS).
- SUL soft under layer
- the SUL generally needs to be completely removed or SUL generally needs to be deposited below the heat sink layer, thereby increasing distance between the head and the SUL.
- the EAMR design generally requires more coil turns to achieve head saturation for pre-amp current below approximately 50 mA. As a larger number of coil turns are often required, low inductance is needed to achieve high data rates. Therefore, a short yoke length and a helical coil are preferred over pancake coils typical of EAMR head designs. However, because of the short yoke and small coil pitch, the resistance of the helical coils can be large.
- the invention in another embodiment, relates to a method for manufacturing a magnetic read/write head of a storage system, the method including forming a substrate including a read transducer, forming a first coil having a pancake coil configuration on a first layer, the first layer on the substrate, forming a first portion of a second coil on the first layer, the second coil having a helical coil configuration, and forming a second portion of the second coil on a second layer, the second layer on the first layer, where the first coil and the second coil are coupled to form a hybrid coil, and where the first coil and the second coil are interleaved on the first layer.
- FIG. 4 is an exploded perspective view of the hybrid coil of FIG. 1 illustrating the lower layer, the upper layer, and coil vias for making electrical connections between the layers in accordance with one embodiment of the invention.
- FIG. 5 is a cross sectional view of another read/write head for a storage system, where the head includes another two layer hybrid coil having a pancake coil in a pancake configuration coupled and interleaved with a helical coil in a helical configuration in accordance with one embodiment of the invention.
- FIG. 9 is a flowchart of a process for manufacturing a hybrid coil in accordance with one embodiment of the invention.
- the lower layer 106 also includes an interleaved section 110 where turns of the pancake coil 102 are interleaved with turns of the helical coil 104 .
- the lower layer 106 also includes a non-interleaved section 112 including turns of the pancake coil 102 .
- the turns of the pancake coil 102 are wrapped around a component 114 of the main pole of head 100 , while the turns of the helical coil 104 are wrapped around the yoke 116 of the main pole.
- the pancake coil 102 has three turn segments in the non-interleaved section 112 extending into two turn segments in the interleaved section 110 .
- the helical coil 104 has exactly three turn segments in each of the lower layer 106 and the upper layer 108 .
- the width of the turn segments of the pancake coil 102 in the non-interleaved section 112 is substantially greater than the width of the turn segments of the pancake coil 102 in the interleaved section 110 .
- the relatively tight spacing in the interleaved section 110 allows for turns of both the pancake and helical coils to be closely interleaved.
- Related designs of coils often require spacing of about 0.4 to 0.5 microns.
- the interleaved section can have spacing between turns about as small as 0.1 micron. As a result, the yoke length can be decreased along with the overall length of the hybrid coil yielding lowered inductance.
- the helical coil 104 has three turns. In other embodiments, the helical coil can have more than or less than three turns. In the embodiment illustrated in FIGS. 1 and 2 , the pancake coil 102 has three turns (e.g., three turn segments in the non-interleaved section 112 extending into two turn segments in the interleaved section 110 ). In other embodiments, the pancake coil can have more than or less than three turns. In the embodiment illustrated in FIGS. 1 and 2 , the entry segment 102 a and exit segment 104 b are both on the upper layer 108 . In other embodiments, the entry segment 102 a and exit segment 104 b can be arranged in different configurations on the upper layer 108 and the lower layer 106 .
- FIG. 3 a is a top view of the lower layer 106 of FIG. 1 which includes the pancake coil 102 and the lower layer section of the helical coil 104 in accordance with one embodiment of the invention.
- the arrows indicate the direction of current flowing through the lower layer hybrid coil sections.
- FIG. 4 is an exploded perspective view of the hybrid coil 101 of FIG. 1 illustrating the lower layer 106 , the upper layer 108 , and coil vias 122 for making electrical connections between the layers in accordance with one embodiment of the invention.
- the return pole 120 several components of the return pole 120 are illustrated, including the return pole substrate 120 a , the return pole component 120 b , and the back via 120 c .
- the coil vias 122 are disposed within an insulation layer positioned between the lower layer 106 and the upper layer 108 .
- FIG. 5 is a cross sectional view of a read/write head 200 for a storage system, where the head 200 includes another two layer hybrid coil 201 having a pancake coil 202 in a pancake configuration coupled and interleaved with a helical coil 204 in a helical configuration in accordance with one embodiment of the invention.
- the two layer hybrid coil 201 includes a lower layer 206 and an upper layer 208 .
- the lower layer 206 includes all of the turns of the pancake coil 202 and three turns of a lower layer section of the helical coil 204 .
- FIG. 6 is a top view of the hybrid coil 201 of FIG. 5 where an upper layer section of the helical coil 204 , positioned above the lower layer section of the helical coil 204 and the pancake coil 202 , is shown as being transparent to illustrate the two layer configuration and coupling of the hybrid coil 201 in accordance with one embodiment of the invention.
- the lower layer 206 also includes an interleaved section 210 where turns of the pancake coil 202 are interleaved with turns of the helical coil 204 .
- the lower layer 206 also includes a non-interleaved section 212 including turns of the pancake coil 202 .
- the turns of the pancake coil 202 are wrapped around a component 214 of the main pole of head 200
- the turns of the helical coil 204 are wrapped around the yoke 216 of the main pole.
- the pancake coil 202 has two turn segments in the non-interleaved section 212 extending into two turn segments in the interleaved section 210 .
- the helical coil 204 has exactly three turn segments in each of the lower layer 206 and the upper layer 206 .
- the head 200 also includes a read head assembly 218 and a return pole 220 positioned on the read head assembly 218 .
- the remaining components of the head 200 can make up the write head assembly.
- the return pole 220 includes a return pole substrate 220 a , a return pole component 220 b , and a back via 220 c.
- the width of the turn segments of the pancake coil 202 in the non-interleaved section 212 is substantially greater than the width of the turn segments of the pancake coil 202 in the interleaved section 210 .
- the relatively tight spacing in the interleaved section 210 allows for turns of both the pancake and helical coils to be closely interleaved.
- current can enter the hybrid coil 201 through an entry segment 202 a (e.g., first terminal) on the lower layer 206 and pass through the turns of the pancake coil 202 and exit to a coupling section 221 before entering the helical coil 204 .
- the current flows through turns of the helical coil 204 on both the upper layer 208 and the lower layer 206 and through multiple vias 222 coupling the those turns on the separated layers.
- the current then exits the last turn 204 a (e.g., exit segment or exit terminal) of the helical coil 204 on the upper layer 208 .
- the helical coil 204 has three turns. In other embodiments, the helical coil can have more than or less than three turns. In the embodiment illustrated in FIGS. 5 and 6 , the pancake coil 202 has two turns (e.g., two turn segments in the non-interleaved section 212 extending into two turn segments in the interleaved section 210 ). In other embodiments, the pancake coil can have more than or less than two turns. In the embodiment illustrated in FIGS. 5 and 6 , the entry segment 202 a is positioned on the lower layer and the exit segment 204 b is positioned on the upper layer 208 . In other embodiments, the entry segment 202 a and exit segment 204 b can be arranged in different configurations on the upper layer 208 and the lower layer 206 .
- FIG. 7 b is a top view of the upper layer 208 of the hybrid coil 201 of FIG. 5 which includes the upper layer section of the helical coil 204 and an exit terminal 204 a of the hybrid coil 201 in accordance with one embodiment of the invention.
- the arrows indicate the direction of current flowing through the upper layer hybrid coil sections.
- FIG. 8 is an exploded perspective view of the hybrid coil 201 of FIG. 5 illustrating the lower layer 206 , the upper layer 208 , and coil vias 222 for making electrical connections between the layers in accordance with one embodiment of the invention.
- the return pole 220 several components of the return pole 220 are illustrated, including the return pole substrate 220 a , the return pole component 220 b , and the back via 220 c .
- the coil vias 222 are disposed within an insulation layer positioned between the lower layer 206 and the upper layer 208 .
- FIG. 9 is a flowchart of a process 300 for manufacturing a hybrid coil in accordance with one embodiment of the invention.
- the process 300 can be used to form the hybrid coils of FIG. 1 and FIG. 5 .
- the process first forms ( 302 ) a substrate including a read transducer.
- the process then forms ( 304 ) a first coil having a pancake coil configuration on a first layer, the first layer on the substrate.
- the process then forms ( 306 ) a first portion of a second coil on the first layer, the second coil having a helical coil configuration.
- the process forms ( 308 ) a second portion of the second coil on a second layer, the second layer on the first layer, where the first coil and the second coil are coupled to form a hybrid coil, and where the first coil and the second coil are interleaved on the first layer.
- the process forms an intervening layer including a top yoke of a write transducer on the first layer, and forms the second layer on the intervening layer.
- the process forms a first insulation layer to insulate the first coil from the second coil on the first layer.
- the first insulation layer can include alumina and/or resist.
- the thickness of the alumina ranges from 0.1 to 0.2 microns, and the thickness of the resist ranges from 0.4 to 0.5 microns.
- the alumina includes Al2O3, and the resist is a standard resist provided by MicroChem Corporation of Newton, Mass.
- the process can planarize the first portion using a chemical mechanical planarization process.
- the process can also form a plurality of coil vias configured to couple the first portion of the helical coil to the second portion of the helical coil.
- the process also forms a second insulation layer on the second layer to insulate turns of the second portion of the helical coil, and planarizes at least one turn of the second portion using a chemical mechanical planarization process.
- the process can perform the sequence of actions in a different order. In another embodiment, the process can skip one or more of the actions. In other embodiments, one or more of the actions are performed simultaneously. In some embodiments, additional actions can be performed.
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- Magnetic Heads (AREA)
Abstract
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US13/932,332 US9117464B1 (en) | 2011-06-30 | 2013-07-01 | Methods for manufacturing hybrid coils for magnetic write heads used in storage systems |
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US13/174,619 US8514517B1 (en) | 2011-06-30 | 2011-06-30 | Systems and methods for providing hybrid coils for magnetic write heads |
US13/932,332 US9117464B1 (en) | 2011-06-30 | 2013-07-01 | Methods for manufacturing hybrid coils for magnetic write heads used in storage systems |
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US13/174,619 Division US8514517B1 (en) | 2011-06-30 | 2011-06-30 | Systems and methods for providing hybrid coils for magnetic write heads |
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US13/174,619 Active 2031-09-13 US8514517B1 (en) | 2011-06-30 | 2011-06-30 | Systems and methods for providing hybrid coils for magnetic write heads |
US13/932,332 Active 2031-11-14 US9117464B1 (en) | 2011-06-30 | 2013-07-01 | Methods for manufacturing hybrid coils for magnetic write heads used in storage systems |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN106783069A (en) * | 2015-11-24 | 2017-05-31 | 三星电机株式会社 | Coil block and its manufacture method |
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