US8997840B2 - Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound film - Google Patents

Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound film Download PDF

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US8997840B2
US8997840B2 US13/045,772 US201113045772A US8997840B2 US 8997840 B2 US8997840 B2 US 8997840B2 US 201113045772 A US201113045772 A US 201113045772A US 8997840 B2 US8997840 B2 US 8997840B2
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guiding
liquid
heat
compound film
hydrophilic compound
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US20120227936A1 (en
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Hsiu-Wei Yang
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/04—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a surface receptive to ink or other liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2245/00—Coatings; Surface treatments
    • F28F2245/02—Coatings; Surface treatments hydrophilic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film, and in particular to a heat-dissipating unit having a hydrophilic compound film with an improved heat-conducting efficiency and a method for depositing such a hydrophilic compound film.
  • the heat pipe is made of copper or aluminum material.
  • the interior of the heat pipe is provided with a chamber.
  • a wick structure is formed on the inner surface of the chamber.
  • One end of the heat pipe is sealed first and a working fluid is filled in the heat pipe through the other end thereof (i.e., the non-sealed end). Then, a degassing process is performed to make the interior of the heat pipe become a vacuum. Finally, the non-sealed end is sealed to form a vacuum sealed chamber.
  • the heat pipe is often made into a tubular pipe or flat pipe.
  • the wick structure within the heat pipe plays an important role in determining the heat-conducting efficiency of the heat pipe.
  • the flat heat pipe requires the wick structure to have a large capillary force and a small resistance to liquid flow.
  • these two properties seem conflicting in terms of the construction of the heat pipe.
  • the wick structure is usually treated for improving its surface property.
  • the wick structure is surface-treated to have a better wettability to increase the capillary force of the heat pipe. The most effective way is to form nano-scale microstructures on the surface of the wick structure.
  • the nano-scale microstructures may be made by an etching process, in which a chemical solution is used to etch micro-pits on the surface of the wick structure.
  • a chemical solution is used to etch micro-pits on the surface of the wick structure.
  • it is uneasy to control the etching rate of such an etching process.
  • the pollution of the chemical solution is also troublesome.
  • Taiwan Patent Publication No. I292028 discloses a heat pipe and a method for manufacturing the same.
  • the heat pipe includes a hollow tubular casing having two sealed ends.
  • the inner surface of the hollow tubular casing is formed with a liquid-absorbing core.
  • the surface of the liquid-absorbing core is formed with a hydrophilic coating.
  • a liquid fluid is filled in the liquid-absorbing core and sealed in the hollow tubular casing.
  • the hydrophilic coating includes nano-TiO 2 , nano-ZnO, nano-Al 2 O 3 or the mixture thereof.
  • the thickness of the hydrophilic coating is in a range of 10 to 200 nanometers, preferably 20 to 50 nanometer.
  • the heat-conducting coating includes a nano-scale film made of carbon, copper, aluminum, or copper-aluminum alloy.
  • the thickness of the heat-conducting coating is in a range of 10 to 500 nanometers, preferably 20 to 300 nanometers.
  • the liquid-absorbing core includes nano-scale carbon balls or carbon fibers.
  • the thickness of the liquid-absorbing core is in a range of 0.1 to 0.5 millimeters, preferably 0.2 to 0.3 millimeters.
  • the method for manufacturing the heat pipe includes the steps of: providing a hollow tubular casing, forming a liquid-absorbing core on inner surfaces of the hollow tubular casing, forming a hydrophilic coating on the surface of the liquid-absorbing core; and sealing a working fluid in the hollowing tubular casing and making the interior of the hollow tubular casing vacuum.
  • the inner and outer surfaces of the hollow tubular casing are surface-treated by a laser texturing process.
  • the hydrophilic coating is made by a vacuum film deposition method.
  • a primary objective of the present invention is to provide a heat-dissipating unit having a hydrophilic compound film, which is capable of increasing its heat-conducting efficiency.
  • the other object of the present invention is to provide a method for depositing a hydrophilic compound film of a heat-dissipating unit.
  • the present invention is to provide a heat-dissipating unit having a hydrophilic compound film, including: a metallic body having a chamber, the chamber having an evaporating portion, a condensing portion, a connecting portion and a hydrophilic compound film, the interior of the chamber being filled with a working fluid, the evaporating portion being provided in the chamber and having a plurality of first liquid-guiding portions, the first liquid-guiding portions being constituted of a plurality of first liquid-guiding bodies arranged at intervals, at least one first channel being formed between the first liquid-guiding bodies, at least one end of the first channel being a free end connected to a free region, the condensing portion being provided in the chamber opposite to the evaporating portion, the interior of the condensing portion having a plurality of second liquid-guiding portions, the second liquid-guiding portions being constituted of a plurality of liquid-guiding bodies arranged at intervals, at least one second channel being formed between the second liquid-guiding bodies,
  • the present invention further provides a method for depositing a hydrophilic compound film of a heat-dissipating unit, including steps of: providing a heat-dissipating unit having a chamber and a liquid-guiding structure, and coating at least one hydrophilic compound film on the surfaces of the chamber and the liquid-guiding structure of the heat-dissipating unit.
  • the working fluid can flow in the heat-dissipating unit more smoothly to thereby increase the heat-conducting efficiency.
  • FIG. 1 is an exploded perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with a preferred embodiment of the present invention
  • FIG. 2 is an assembled perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention
  • FIG. 3 is a cross-sectional view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention
  • FIG. 4 is a top view showing an evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with a second embodiment of the present invention
  • FIG. 5 is a bottom view showing a condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the second embodiment of the present invention
  • FIG. 6 is a top view showing an evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with a third embodiment of the present invention.
  • FIG. 7 is a bottom view showing a condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the third embodiment of the present invention.
  • FIG. 8 is a flow chart showing the method for depositing a hydrophilic compound film of the heat-dissipating unit in accordance with the present invention.
  • FIG. 9 is a schematic view showing the manufacturing of the hydrophilic compound film of the heat-dissipating unit in accordance with the present invention.
  • FIG. 1 is an exploded perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with a preferred embodiment of the present invention.
  • FIG. 2 is an assembled perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention.
  • the heat-dissipating unit 1 having a hydrophilic compound unit comprises a metallic body 1 a having a chamber 11 .
  • the chamber 11 has an evaporating portion 111 , a condensing portion 112 , a connecting portion 113 , and a hydrophilic compound film 4 .
  • the interior of the chamber 11 has a working fluid 2 .
  • the evaporating portion 111 , the condensing portion 112 and the connecting portion 113 define a liquid-guiding structure 11 a.
  • the evaporating portion 111 is provided in the chamber 11 .
  • the evaporating portion 111 has a plurality of first liquid-guiding portions 1111 .
  • the first liquid-guiding portions 1111 are constituted of a plurality of first liquid-guiding bodies 1111 a arranged at intervals. At least one first channel 1111 b is formed between the first liquid-guiding bodies 1111 a . At least one end of the first channel 1111 b is a free end connected to a free region 1111 c .
  • the first liquid-guiding body 1111 a is formed into an elongate rib.
  • the elongate ribs are arranged transversely at intervals.
  • the first channel 1111 b is formed between the elongate ribs.
  • a guiding portion 114 including a first guiding element 1141 and a second guiding element 1142 , is formed between the first liquid-guiding bodies 1111 a and the at least one first channel 1111 b and the free region 1111 c and defines gradual narrow channels.
  • the condensing portion 112 is provided in the chamber 11 opposite to the evaporating portion 111 .
  • the interior of the condensing portion 112 has a plurality of second liquid-guiding portions 1121 .
  • the second liquid-guiding portions 1121 are constituted of a plurality of second liquid-guiding bodies 1121 a arranged at intervals. At least one second channel 1121 b is formed between the second liquid-guiding bodies 1121 a .
  • the second liquid-guiding body 1121 a is formed into an elongate rib.
  • the elongate ribs are arranged transversely at intervals.
  • the first channel 111 b is formed between the elongate ribs.
  • the connecting portion 113 is provided between the evaporating portion 111 and the condensing portion 112 .
  • the connecting portion 113 has at least one first communication hole set 1131 and at least one second communication hole set 1132 .
  • the first communication hole set 1131 and the second communication hole set 1132 are in communication with the evaporating portion 111 and the condensing portion 112 .
  • the hydrophilic compound film 4 is coated on the evaporating portion 111 , the condensing portion 112 , the connecting portion 113 and the surface of the chamber 11 .
  • the hydrophilic compound film 4 may be any one of oxides or sulfides.
  • the oxides may be any one selected from a group including SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , CaO, K 2 O, ZnO.
  • the heat-dissipating unit 1 may be any one of a vapor chamber, a flat heat pipe, and a loop heat pipe.
  • a vapor chamber is used as an example, but the heat-dissipating unit 1 is not limited thereto.
  • the metallic body 1 a is any one selected from a group including copper, aluminum, nickel and stainless steel.
  • FIG. 4 is a top view showing the evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the second embodiment of the present invention
  • FIG. 5 is a bottom view showing the condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the second embodiment of the present invention.
  • the structural relationship among the components of the second embodiment is substantial to that of the first embodiment, so that the redundant description is omitted for simplicity.
  • the difference between the second embodiment and the first embodiment lies in that: the first liquid-guiding bodies 111 a are longitudinally arranged at intervals.
  • the second liquid-guiding portions 1121 a are longitudinally arranged at intervals.
  • FIG. 6 is a top view showing an evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the third embodiment of the present invention
  • FIG. 7 is a bottom view showing a condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the third embodiment of the present invention.
  • the structural relationship among the components of the third embodiment is substantial to that of the second embodiment, so that the redundant description is omitted for simplicity.
  • the difference between the third embodiment and the second embodiment lies in that: the first liquid-guiding bodies 111 a and the second liquid-guiding bodies 1121 a are provided with a plurality of pits 115 .
  • the pits 115 may be each shaped as a circle, square, triangle or other shape. In the present embodiment, each of the pits 115 is shaped as a fish-scale shape, but it is not limited thereto.
  • FIG. 8 is a flow chart showing the method for depositing a hydrophilic compound film of the heat-dissipating unit in accordance with the present invention
  • FIG. 9 is a schematic view showing the manufacturing of the hydrophilic compound film of the heat-dissipating unit in accordance with the present invention. Please also refer to FIGS. 1 to 7 .
  • the method for depositing a hydrophilic compound film of the heat-dissipating unit includes a step S 1 of providing a heat-dissipating unit having a chamber and a liquid-guiding structure, and a step S 2 of coating at least one hydrophilic compound film on surfaces of the chamber and the liquid-guiding structure of the heat-dissipating unit.
  • a heat-dissipating unit 1 having a chamber 11 and a liquid-guiding structure 11 a is provided.
  • the heat-dissipating unit 1 may be a heat-pipe, a vapor chamber, a flat heat pipe, a loop heat pipe or the like.
  • the vapor chamber is used as an example of the heat-dissipating unit 1 , but it is not limited thereto.
  • the surfaces of the chamber 11 and the liquid-guiding structure 11 a are coated with at least one hydrophilic compound film 4 .
  • the hydrophilic compound film 4 may be oxides or sulfides.
  • the oxides may be any one selected from a group including SiO 2 , TiO 2 , Al 2 O 3 , ZrO 2 , CaO, K 2 O and ZnO.
  • the hydrophilic compound film 4 is made of Al2O3, but it not limited thereto.
  • the hydrophilic compound film 4 is made by a physical vapor deposition method (PVD) and a sol gel method.
  • the sol gel method is used as an example, but it is not limited thereto.
  • the sol gel method may be performed by a precipitating, spin coating, brushing, wetting or soaking process.
  • the soaking process is used as an example of the sol gel method for coating the hydrophilic compound film 4 , but the soaking process is not limited thereto.
  • Al2O3 particles are soaked in an aqueous solution 5 .
  • the aqueous solution 5 and the Al2O3 particles are poured in a tank 6 and dispersed therein uniformly.
  • a portion of the heat-dissipating unit 1 having the liquid-guiding structure 11 a is soaked in the aqueous solution 5 of the tank 6 . Then, the heat-dissipating unit 1 is disposed in the aqueous solution 5 of the tank 6 . Finally, the heat-dissipating unit 1 is taken out of the aqueous solution 5 or the aqueous solution 5 is drained from the tank 6 in such a manner that the Al 2 O 3 particles are adhered to the surface of the liquid-guiding structure 11 a ( FIG. 9 ).
  • the heat-dissipating unit 1 mentioned in the previous embodiments may be any one of a vapor chamber, a flat heat pipe and a loop heat pipe.

Abstract

A heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film are disclosed. The heat-dissipating unit includes a metallic body having a chamber and a working fluid. The chamber has a liquid-guiding structure constituted of an evaporating portion, a condensing portion and a connecting portion. At least one hydrophilic compound film is coated on surfaces of the chamber and the liquid-guiding structure. By this arrangement, the flowing of the working fluid in the heat-dissipating unit is enhanced to improve the heat-conducting efficiency of the heat-dissipating unit.

Description

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a heat-dissipating unit having a hydrophilic compound film and a method for depositing a hydrophilic compound film, and in particular to a heat-dissipating unit having a hydrophilic compound film with an improved heat-conducting efficiency and a method for depositing such a hydrophilic compound film.
2. Description of Prior Art
Since the operating speed of a modern electronic apparatus becomes higher, more heat is generated by the electronic apparatus and accumulated therein to raise its operating temperature. Thus, people pay more attention to the heat dissipation of electronic elements and chips because the electronic apparatus may break down or overheat if the heat accumulated therein cannot be dissipated to the outside efficiently.
Thus, people try to mount a heat sink, a heat-dissipating module or a fan on the electronic elements and chips for heat dissipation. Further, people also like to use heat pipes because they are very effective in heat conduction. The heat pipe is made of copper or aluminum material. The interior of the heat pipe is provided with a chamber. A wick structure is formed on the inner surface of the chamber. One end of the heat pipe is sealed first and a working fluid is filled in the heat pipe through the other end thereof (i.e., the non-sealed end). Then, a degassing process is performed to make the interior of the heat pipe become a vacuum. Finally, the non-sealed end is sealed to form a vacuum sealed chamber. The heat pipe is often made into a tubular pipe or flat pipe. The wick structure within the heat pipe plays an important role in determining the heat-conducting efficiency of the heat pipe. Especially, the flat heat pipe requires the wick structure to have a large capillary force and a small resistance to liquid flow. However, these two properties seem conflicting in terms of the construction of the heat pipe. In order to solve this conflicting problem, the wick structure is usually treated for improving its surface property. In general, the wick structure is surface-treated to have a better wettability to increase the capillary force of the heat pipe. The most effective way is to form nano-scale microstructures on the surface of the wick structure. For example, the nano-scale microstructures may be made by an etching process, in which a chemical solution is used to etch micro-pits on the surface of the wick structure. However, it is uneasy to control the etching rate of such an etching process. Further, the pollution of the chemical solution is also troublesome.
Taiwan Patent Publication No. I292028 discloses a heat pipe and a method for manufacturing the same. The heat pipe includes a hollow tubular casing having two sealed ends. The inner surface of the hollow tubular casing is formed with a liquid-absorbing core. The surface of the liquid-absorbing core is formed with a hydrophilic coating. A liquid fluid is filled in the liquid-absorbing core and sealed in the hollow tubular casing. The hydrophilic coating includes nano-TiO2, nano-ZnO, nano-Al2O3 or the mixture thereof. The thickness of the hydrophilic coating is in a range of 10 to 200 nanometers, preferably 20 to 50 nanometer.
This patent document discloses a heat-conducting coating formed on the outer surface of the hollow tubular casing. The heat-conducting coating includes a nano-scale film made of carbon, copper, aluminum, or copper-aluminum alloy. The thickness of the heat-conducting coating is in a range of 10 to 500 nanometers, preferably 20 to 300 nanometers.
The liquid-absorbing core includes nano-scale carbon balls or carbon fibers. The thickness of the liquid-absorbing core is in a range of 0.1 to 0.5 millimeters, preferably 0.2 to 0.3 millimeters.
The method for manufacturing the heat pipe includes the steps of: providing a hollow tubular casing, forming a liquid-absorbing core on inner surfaces of the hollow tubular casing, forming a hydrophilic coating on the surface of the liquid-absorbing core; and sealing a working fluid in the hollowing tubular casing and making the interior of the hollow tubular casing vacuum.
The inner and outer surfaces of the hollow tubular casing are surface-treated by a laser texturing process.
The hydrophilic coating is made by a vacuum film deposition method.
However, the above conventional art has to utilize expensive apparatuses and inevitably increases its production cost. Therefore, it has problems of (1) complicated production, (2) high cost, and (3) expensive facilities.
SUMMARY OF THE INVENTION
In order to solve the above problems, a primary objective of the present invention is to provide a heat-dissipating unit having a hydrophilic compound film, which is capable of increasing its heat-conducting efficiency.
The other object of the present invention is to provide a method for depositing a hydrophilic compound film of a heat-dissipating unit.
In order to achieve the above objectives, the present invention is to provide a heat-dissipating unit having a hydrophilic compound film, including: a metallic body having a chamber, the chamber having an evaporating portion, a condensing portion, a connecting portion and a hydrophilic compound film, the interior of the chamber being filled with a working fluid, the evaporating portion being provided in the chamber and having a plurality of first liquid-guiding portions, the first liquid-guiding portions being constituted of a plurality of first liquid-guiding bodies arranged at intervals, at least one first channel being formed between the first liquid-guiding bodies, at least one end of the first channel being a free end connected to a free region, the condensing portion being provided in the chamber opposite to the evaporating portion, the interior of the condensing portion having a plurality of second liquid-guiding portions, the second liquid-guiding portions being constituted of a plurality of liquid-guiding bodies arranged at intervals, at least one second channel being formed between the second liquid-guiding bodies, the connecting portion being provided between the evaporating portion and the condensing portion, the connecting portion having at least one communication hole set and at least one second communication hole set, the first and second communication hole sets being in communication with the evaporating portion and the condensing portion, the hydrophilic compound film being coated on the evaporating portion, the condensing portion, the connecting portion, and the surface of the chamber.
The present invention further provides a method for depositing a hydrophilic compound film of a heat-dissipating unit, including steps of: providing a heat-dissipating unit having a chamber and a liquid-guiding structure, and coating at least one hydrophilic compound film on the surfaces of the chamber and the liquid-guiding structure of the heat-dissipating unit.
Since the surfaces of the chamber and the liquid-guiding structure of the heat-dissipating unit are deposited with at least one hydrophilic compound film, the working fluid can flow in the heat-dissipating unit more smoothly to thereby increase the heat-conducting efficiency.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with a preferred embodiment of the present invention;
FIG. 2 is an assembled perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention;
FIG. 3 is a cross-sectional view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention;
FIG. 4 is a top view showing an evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with a second embodiment of the present invention;
FIG. 5 is a bottom view showing a condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the second embodiment of the present invention;
FIG. 6 is a top view showing an evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with a third embodiment of the present invention;
FIG. 7 is a bottom view showing a condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the third embodiment of the present invention;
FIG. 8 is a flow chart showing the method for depositing a hydrophilic compound film of the heat-dissipating unit in accordance with the present invention; and
FIG. 9 is a schematic view showing the manufacturing of the hydrophilic compound film of the heat-dissipating unit in accordance with the present invention.
 DETAILED DESCRIPTION OF THE INVENTION
The above objectives and structural and functional features of the present invention will be described in more detail with reference to preferred embodiments thereof shown in the accompanying drawings
Please refer to FIGS. 1 to 3. FIG. 1 is an exploded perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with a preferred embodiment of the present invention. FIG. 2 is an assembled perspective view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention. FIG. 3 is a cross-sectional view showing the heat-dissipating unit having a hydrophilic compound film in accordance with the preferred embodiment of the present invention. The heat-dissipating unit 1 having a hydrophilic compound unit comprises a metallic body 1 a having a chamber 11. The chamber 11 has an evaporating portion 111, a condensing portion 112, a connecting portion 113, and a hydrophilic compound film 4. The interior of the chamber 11 has a working fluid 2.
The evaporating portion 111, the condensing portion 112 and the connecting portion 113 define a liquid-guiding structure 11 a.
The evaporating portion 111 is provided in the chamber 11. The evaporating portion 111 has a plurality of first liquid-guiding portions 1111. The first liquid-guiding portions 1111 are constituted of a plurality of first liquid-guiding bodies 1111 a arranged at intervals. At least one first channel 1111 b is formed between the first liquid-guiding bodies 1111 a. At least one end of the first channel 1111 b is a free end connected to a free region 1111 c. The first liquid-guiding body 1111 a is formed into an elongate rib. The elongate ribs are arranged transversely at intervals. The first channel 1111 b is formed between the elongate ribs. A guiding portion 114, including a first guiding element 1141 and a second guiding element 1142, is formed between the first liquid-guiding bodies 1111 a and the at least one first channel 1111 b and the free region 1111 c and defines gradual narrow channels.
The condensing portion 112 is provided in the chamber 11 opposite to the evaporating portion 111. The interior of the condensing portion 112 has a plurality of second liquid-guiding portions 1121. The second liquid-guiding portions 1121 are constituted of a plurality of second liquid-guiding bodies 1121 a arranged at intervals. At least one second channel 1121 b is formed between the second liquid-guiding bodies 1121 a. The second liquid-guiding body 1121 a is formed into an elongate rib. The elongate ribs are arranged transversely at intervals. The first channel 111 b is formed between the elongate ribs.
The connecting portion 113 is provided between the evaporating portion 111 and the condensing portion 112. The connecting portion 113 has at least one first communication hole set 1131 and at least one second communication hole set 1132. The first communication hole set 1131 and the second communication hole set 1132 are in communication with the evaporating portion 111 and the condensing portion 112.
The hydrophilic compound film 4 is coated on the evaporating portion 111, the condensing portion 112, the connecting portion 113 and the surface of the chamber 11.
The hydrophilic compound film 4 may be any one of oxides or sulfides. The oxides may be any one selected from a group including SiO2, TiO2, Al2O3, ZrO2, CaO, K2O, ZnO.
The heat-dissipating unit 1 may be any one of a vapor chamber, a flat heat pipe, and a loop heat pipe. In the present embodiment, a vapor chamber is used as an example, but the heat-dissipating unit 1 is not limited thereto.
The metallic body 1 a is any one selected from a group including copper, aluminum, nickel and stainless steel.
Please refer to FIGS. 4 and 5. FIG. 4 is a top view showing the evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the second embodiment of the present invention, and FIG. 5 is a bottom view showing the condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the second embodiment of the present invention. The structural relationship among the components of the second embodiment is substantial to that of the first embodiment, so that the redundant description is omitted for simplicity. The difference between the second embodiment and the first embodiment lies in that: the first liquid-guiding bodies 111 a are longitudinally arranged at intervals. The second liquid-guiding portions 1121 a are longitudinally arranged at intervals.
Please refer to FIGS. 6 and 7. FIG. 6 is a top view showing an evaporating portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the third embodiment of the present invention, and FIG. 7 is a bottom view showing a condensing portion of the heat-dissipating unit having a hydrophilic compound film in accordance with the third embodiment of the present invention. The structural relationship among the components of the third embodiment is substantial to that of the second embodiment, so that the redundant description is omitted for simplicity. The difference between the third embodiment and the second embodiment lies in that: the first liquid-guiding bodies 111 a and the second liquid-guiding bodies 1121 a are provided with a plurality of pits 115. The pits 115 may be each shaped as a circle, square, triangle or other shape. In the present embodiment, each of the pits 115 is shaped as a fish-scale shape, but it is not limited thereto.
Please refer to FIGS. 8 and 9. FIG. 8 is a flow chart showing the method for depositing a hydrophilic compound film of the heat-dissipating unit in accordance with the present invention, and FIG. 9 is a schematic view showing the manufacturing of the hydrophilic compound film of the heat-dissipating unit in accordance with the present invention. Please also refer to FIGS. 1 to 7. The method for depositing a hydrophilic compound film of the heat-dissipating unit includes a step S1 of providing a heat-dissipating unit having a chamber and a liquid-guiding structure, and a step S2 of coating at least one hydrophilic compound film on surfaces of the chamber and the liquid-guiding structure of the heat-dissipating unit.
In the step S1, a heat-dissipating unit 1 having a chamber 11 and a liquid-guiding structure 11 a is provided. The heat-dissipating unit 1 may be a heat-pipe, a vapor chamber, a flat heat pipe, a loop heat pipe or the like. In the present embodiment, the vapor chamber is used as an example of the heat-dissipating unit 1, but it is not limited thereto.
In the step S2, the surfaces of the chamber 11 and the liquid-guiding structure 11 a are coated with at least one hydrophilic compound film 4. The hydrophilic compound film 4 may be oxides or sulfides. The oxides may be any one selected from a group including SiO2, TiO2, Al2O3, ZrO2, CaO, K2O and ZnO. In the present embodiment, the hydrophilic compound film 4 is made of Al2O3, but it not limited thereto.
In the heat-dissipating unit 1 of the present invention, the hydrophilic compound film 4 is made by a physical vapor deposition method (PVD) and a sol gel method. In the present embodiment, the sol gel method is used as an example, but it is not limited thereto. The sol gel method may be performed by a precipitating, spin coating, brushing, wetting or soaking process. In the present embodiment, the soaking process is used as an example of the sol gel method for coating the hydrophilic compound film 4, but the soaking process is not limited thereto. In the sol gel method, Al2O3 particles are soaked in an aqueous solution 5. The aqueous solution 5 and the Al2O3 particles are poured in a tank 6 and dispersed therein uniformly. A portion of the heat-dissipating unit 1 having the liquid-guiding structure 11 a is soaked in the aqueous solution 5 of the tank 6. Then, the heat-dissipating unit 1 is disposed in the aqueous solution 5 of the tank 6. Finally, the heat-dissipating unit 1 is taken out of the aqueous solution 5 or the aqueous solution 5 is drained from the tank 6 in such a manner that the Al2O3 particles are adhered to the surface of the liquid-guiding structure 11 a (FIG. 9).
The heat-dissipating unit 1 mentioned in the previous embodiments may be any one of a vapor chamber, a flat heat pipe and a loop heat pipe.

Claims (14)

What is claimed is:
1. A heat-dissipating unit having a hydrophilic compound film, including a metallic body having a chamber and a working fluid, the chamber having:
an evaporating portion provided in the chamber, the evaporating portion having
a plurality of first liquid-guiding portions, each first liquid-guiding portion being constituted of a plurality of elongate first liquid-guiding bodies arranged at intervals and extending in a first direction in a major plane of the evaporating portion and from a first wall of the chamber only partially across the evaporating portion,
at least one first channel being formed between the first liquid-guiding bodies and extending in the first direction, one end of the first channel being a free end connected to a free region, wherein the free region is defined as a region between terminal ends of the first liquid-guiding portions and an opposite second wall of the chamber, and
a guiding portion provided in the evaporating portion, the guiding portion having a first guiding element and a second guiding element, wherein the first guiding element and the second guiding element respectively extend centrally from third and fourth opposed walls of the chamber generally transverse to the first direction and in the major plane of the evaporating portion and wherein the first and second guiding elements each taper inwardly as extending inwardly from the respective third and fourth opposed walls of the chamber to form a necked opening between the first liquid-guiding portions and the at least one first channel and the free region;
a condensing portion provided in the chamber opposite to the evaporating portion, the condensing portion having a plurality of second liquid-guiding portions therein, the second liquid-guiding portions being constituted of a plurality of elongate second liquid-guiding bodies arranged at intervals, at least one second channel being formed between the second liquid-guiding portions;
a connecting portion provided between the evaporating portion and the condensing portion, the connecting portion having at least one first communication hole set and at least one second communication hole set, the first communication hole set and the second communication hole set being in communication with the evaporating portion and the condensing portion, the evaporating portion, the condensing portion and the connecting portion defining a liquid-guiding structure; and
a hydrophilic compound film coated on the evaporating portion, the condensing portion, the connecting portion and a surface of the chamber.
2. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein the heat-dissipating unit is any one of a vapor chamber, a flat heat pipe and a loop heat pipe.
3. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein the hydrophilic compound film is an oxide.
4. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein the hydrophilic compound film is a sulfide.
5. The heat-dissipating unit having a hydrophilic compound film according to claim 3, wherein the oxide is one selected from a group including SiO2, TiO2, Al2O3, ZrO2, CaO, K2O and ZnO.
6. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein the metallic body is one selected from the group consisting of copper, aluminum, nickel and stainless steel.
7. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein each of the first liquid-guiding bodies is an elongated rib, the elongated ribs are arranged at intervals, and the first channel is formed between the elongated ribs.
8. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein each of the second liquid-guiding bodies is an elongated rib, the elongated ribs are arranged at intervals, and the second channel is formed between the elongated ribs.
9. The heat-dissipating unit having a hydrophilic compound film according to claim 1, wherein the first liquid-guiding bodies and the second liquid-guiding bodies have a plurality of pits.
10. The heat-dissipating unit having a hydrophilic compound film according to claim 9, wherein each of the pits is shaped as one of a circle, a square, a triangle and a fish scale.
11. A method for depositing a hydrophilic compound film of a heat-dissipating unit, including steps of:
providing a heat-dissipating unit having a metallic body with a chamber and a working fluid, the chamber having an evaporating portion provided in the chamber, the evaporating portion having
a plurality of first liquid-guiding portions, each first liquid-guiding portion being constituted of a plurality of elongate first liquid-guiding bodies arranged at intervals and extending in a first direction in a major plane of the evaporating portion and from a first wall of the chamber only partially across the evaporating portion,
at least one first channel being formed between the first liquid-guiding bodies and extending in the first direction, one end of the first channel being a free end connected to a free region, wherein the free region is defined as a region between terminal ends of the first liquid-guiding portions and an opposite second wall of the chamber, and
a guiding portion provided in the evaporating portion, the guiding portion having a first guiding element and a second guiding element, wherein the first guiding element and the second guiding element respectively extend centrally from third and fourth opposed walls of the chamber generally transverse to the first direction and in the major plane of the evaporating portion and wherein the first and second guiding elements each taper inwardly as extending inwardly from the respective third and fourth opposed walls of the chamber to form a necked opening between the first liquid-guiding portions and the at least one first channel and the free region;
a condensing portion provided in the chamber opposite to the evaporating portion, the condensing portion having a plurality of second liquid-guiding portions therein, the second liquid-guiding portions being constituted of a plurality of elongate second liquid-guiding bodies arranged at intervals, at least one second channel being formed between the second liquid-guiding portions;
a connecting portion provided between the evaporating portion and the condensing portion, the connecting portion having at least one first communication hole set and at least one second communication hole set, the first communication hole set and the second communication hole set being in communication with the evaporating portion and the condensing portion, the evaporating portion, the condensing portion and the connecting portion defining a liquid-guiding structure; and
coating at least one hydrophilic compound film on surfaces of the liquid-guiding structure.
12. The method according to claim 11, wherein the heat-dissipating unit is any one of a vapor chamber, a flat heat pipe and a loop heat pipe.
13. The method according to claim 11, wherein the hydrophilic compound film is coated on the heat-dissipating unit by any one of a physical vapor deposition process, a chemical vapor deposition process, and a sol gel process.
14. The method according to claim 13, wherein the sol gel process is performed by any one of precipitating, spin coating, brushing, wetting and soaking.
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