US8958203B2 - Electronic device with air guiding apparatus - Google Patents
Electronic device with air guiding apparatus Download PDFInfo
- Publication number
- US8958203B2 US8958203B2 US13/663,489 US201213663489A US8958203B2 US 8958203 B2 US8958203 B2 US 8958203B2 US 201213663489 A US201213663489 A US 201213663489A US 8958203 B2 US8958203 B2 US 8958203B2
- Authority
- US
- United States
- Prior art keywords
- end wall
- air guiding
- shaft
- electronic device
- guiding piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to the cooling of electronic devices and, particularly, to an electronic device with an air guiding apparatus for guiding airflow.
- Central processing units and memory cards generate a great amount of heat in the chassis of an electronic device.
- the heat needs to be dissipated immediately to ensure the continued proper function of the electronic devices.
- a cooling fan is provided to generate airflow, and an air duct guides the airflow.
- the contemporary air duct can only select the mating chassis of the electronic device. If the size of the chassis is changed, the air duct cannot be installed in the chassis, and the air duct cannot selectively mate with chassis of different sizes.
- FIG. 1 is an isometric view of an exemplary embodiment of an electronic device, wherein the electronic device includes an air guiding apparatus.
- FIG. 2 is an exploded, isometric view of the guiding apparatus of FIG. 1 .
- FIG. 3 is similar to FIG. 1 , but showing the air guiding apparatus in use.
- FIG. 1 shows an exemplary embodiment of an electronic device 100 .
- the electronic device 100 includes a chassis 20 and an air guiding apparatus 40 .
- the chassis 20 includes a case 22 , a circuit board 24 received in the case 22 , and a fan 26 received in the case 22 .
- the case 22 includes a rectangular bottom wall 222 , a first sidewall 223 perpendicularly extending up from a first side of the bottom wall 222 , a second sidewall 224 perpendicularly extending up from a second side of the bottom wall 222 opposite to the first sidewall 223 , a first end wall 225 perpendicularly extending up from a first end of the bottom wall 222 , and a second end wall 226 perpendicularly extending up from a second end of the bottom wall 222 opposite to the first end wall 225 .
- the first and second end walls 225 and 226 each define a plurality of vents 227 adjacent to the first sidewall 223 .
- the circuit board 24 is mounted on the bottom wall 222 .
- a chip 242 is mounted on the circuit board 24
- a heat sink 244 is mounted on the chip 242
- a plurality of memories 246 is mounted on the circuit board 24 between the heat sink 244 and the first end wall 225 .
- the fan 26 is located between the vents 227 of the second end wall 226 and the heat sink 244 .
- the chip 242 is a central processing unit.
- FIG. 2 shows the air guiding apparatus 40 .
- the air guiding apparatus 40 includes a bracket 42 , a shaft 44 , a flexible air guiding member 46 , and a resilient member 48 .
- the bracket 42 includes a rectangular bottom plate 422 , a top plate 423 opposite and parallel to the bottom plate 422 , and two end plates 424 respectively connected between corresponding ends of the bottom wall 422 and the top wall 423 .
- the bottom plate 422 , the top plate 423 , and the end plates 424 cooperatively bound a receiving space 426 .
- the end plates 424 define two opposite shaft holes 427 .
- One of the end plates 424 defines a latching hole 428 adjacent to the corresponding shaft hole 427 .
- Two tabs 425 extend out from the opposite ends of the bottom plate 422 . Each tab 425 defines a through hole 429 .
- Two opposite ends of the shaft 44 are rotatably inserted in the shaft holes 427 .
- the circumference of one of the ends of the shaft 44 longitudinally defines a long positioning hole 442 .
- the air guiding member 46 includes a rectangular guiding piece 462 and a position portion 464 extending from a first end of the guiding piece 462 .
- the guiding piece 462 is made of resilient and heat-resisting material, such as copper, or steel.
- a middle of the position portion 464 defines a position hole 465 .
- the resilient member 48 is a clockwork spring, and includes a first positioning end 482 at an inner side of the resilient member 48 , and a second positioning end 484 at an outer side of the resilient member 48 .
- a second end of the guiding piece 462 opposite to the positioning portion 464 is fixed to the shaft 44 .
- the shaft 44 is rotated to reel the guiding piece 462 about the shaft 44 .
- the resilient member 48 is fitted about the end of the shaft 44 defining the positioning hole 442 .
- the first positioning end 482 of the resilient member 48 is latched in the positioning hole 442 of the shaft 44 .
- a combination of the shaft 44 , the guiding piece 462 , and the resilient member 48 is received in the receiving space 426 of the bracket 42 .
- the ends of the shaft 44 are rotatably inserted in the shaft holes 427 of the bracket 42 .
- the second positioning end 484 of the resilient member 48 is latched in the latching hole 428 of the bracket 42 .
- the position portion 464 extends out of the receiving space 426 .
- the air guiding piece 462 can be wound on or let out from the shaft 44 as the shaft 44 rotates.
- the air guiding apparatus 40 is attached to the chassis 20 .
- Two fasteners (not shown) extend through the through holes 429 of the tabs 425 , to be fastened to the first end wall 225 adjacent to the vents 227 .
- the position portion 464 of the air guiding member 46 is pulled out.
- the shaft 44 is rotated, thereby deforming the resilient member 48 .
- the position portion 464 is extended to the second end wall 226 adjacent to the vents 227 , and fixed to the second end wall 226 by screwing or latching.
- the guiding piece 462 , the first end wall 225 , the second end wall 226 , and the first sidewall 223 cooperatively bound an airflow channel 27 .
- the fan 26 , the heat sink 244 , and the memories 246 are received in the airflow channel 27 .
- the fan 26 operates and draws airflow into the channel 27 through the vents 227 of the second end wall 226 .
- the airflow flows through the heat sink 244 and the memories 246 to dissipate heat for the chip 242 and the memories 246 , and is then exhausted out of the channel 27 through the vents 227 of the first end wall 225 .
- the positions of the air guiding piece 462 needs to changed, the position portion 464 is disengaged from the second end wall 226 .
- the resilient member 48 is restored to bias the shaft 84 to rotate, and the guiding piece 462 is withdrawn back into the receiving space 426 of the bracket 42 .
- the position portion 464 is pulled out again, and is mounted to a proper position of the case 22 for guiding airflow.
- the guiding piece 462 can be extended for suiting different specifications or sizes of the chassis 20
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101137390A TW201415997A (en) | 2012-10-11 | 2012-10-11 | Electronic device |
TW101137390A | 2012-10-11 | ||
TW101137390 | 2012-10-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20140104783A1 US20140104783A1 (en) | 2014-04-17 |
US8958203B2 true US8958203B2 (en) | 2015-02-17 |
Family
ID=50475129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/663,489 Active 2033-05-14 US8958203B2 (en) | 2012-10-11 | 2012-10-30 | Electronic device with air guiding apparatus |
Country Status (2)
Country | Link |
---|---|
US (1) | US8958203B2 (en) |
TW (1) | TW201415997A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150092348A1 (en) * | 2013-09-30 | 2015-04-02 | Cyan Inc. | Space-saving thermal management system for electronic devices |
US20220204331A1 (en) * | 2020-12-24 | 2022-06-30 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Thin Film Transfer Vehicle |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6528456B2 (en) * | 2015-02-27 | 2019-06-12 | 富士通株式会社 | Electronic device housing and wind control board |
CN106155192A (en) * | 2015-04-14 | 2016-11-23 | 鸿富锦精密工业(武汉)有限公司 | Computer |
CN107422784B (en) * | 2016-05-24 | 2020-09-11 | 联想企业解决方案(新加坡)有限公司 | Director for a computing device rack |
CN108650847B (en) * | 2018-04-18 | 2019-11-19 | 浙江大华技术股份有限公司 | A kind of mechanical equipment |
US11901264B2 (en) * | 2018-10-31 | 2024-02-13 | Sk Hynix Nand Product Solutions Corp. | Choked flow cooling |
CN109890178B (en) * | 2019-03-12 | 2020-07-24 | 华为技术有限公司 | Cabinet and flexible air duct system |
US11903170B2 (en) * | 2021-12-16 | 2024-02-13 | International Business Machines Corporation | Temporary structural bulkhead in an electronic enclosure |
CN219513913U (en) * | 2022-12-30 | 2023-08-11 | 阳光电源股份有限公司 | Heat abstractor and power generation facility |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3039377A (en) * | 1959-08-13 | 1962-06-19 | Ampex | Ventilating system for electronic apparatus |
US5493457A (en) * | 1991-10-18 | 1996-02-20 | Matsushita Electric Industrial Co., Ltd. | Optical disk apparatus with cooling arrangement |
US5871396A (en) * | 1997-08-12 | 1999-02-16 | Shen; Tsan Jung | Convection type heat dissipation device for computers that is adjustable with respect to a heat source |
US6147862A (en) * | 1998-08-26 | 2000-11-14 | Ho; Hsin Chien | Quick-detachable computer housing |
US7403387B2 (en) * | 2006-09-14 | 2008-07-22 | Dell Products L.P. | Directing air in a chassis |
US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
US20110053485A1 (en) * | 2009-08-28 | 2011-03-03 | Hon Hai Precision Industry Co., Ltd. | Server rack with baffle device |
US7965505B2 (en) * | 2009-10-09 | 2011-06-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guiding cover |
US20110220323A1 (en) * | 2010-03-11 | 2011-09-15 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guide |
-
2012
- 2012-10-11 TW TW101137390A patent/TW201415997A/en unknown
- 2012-10-30 US US13/663,489 patent/US8958203B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3039377A (en) * | 1959-08-13 | 1962-06-19 | Ampex | Ventilating system for electronic apparatus |
US5493457A (en) * | 1991-10-18 | 1996-02-20 | Matsushita Electric Industrial Co., Ltd. | Optical disk apparatus with cooling arrangement |
US5871396A (en) * | 1997-08-12 | 1999-02-16 | Shen; Tsan Jung | Convection type heat dissipation device for computers that is adjustable with respect to a heat source |
US6147862A (en) * | 1998-08-26 | 2000-11-14 | Ho; Hsin Chien | Quick-detachable computer housing |
US7403387B2 (en) * | 2006-09-14 | 2008-07-22 | Dell Products L.P. | Directing air in a chassis |
US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
US20110053485A1 (en) * | 2009-08-28 | 2011-03-03 | Hon Hai Precision Industry Co., Ltd. | Server rack with baffle device |
US7965505B2 (en) * | 2009-10-09 | 2011-06-21 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guiding cover |
US20110220323A1 (en) * | 2010-03-11 | 2011-09-15 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Airflow guide |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150092348A1 (en) * | 2013-09-30 | 2015-04-02 | Cyan Inc. | Space-saving thermal management system for electronic devices |
US9320172B2 (en) * | 2013-09-30 | 2016-04-19 | Ciena Corporation | Spacing-saving thermal management system for electronic devices |
US20220204331A1 (en) * | 2020-12-24 | 2022-06-30 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Thin Film Transfer Vehicle |
Also Published As
Publication number | Publication date |
---|---|
TW201415997A (en) | 2014-04-16 |
US20140104783A1 (en) | 2014-04-17 |
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AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YANG, CHENG-HSIU;CHANG, LI-CHEN;REEL/FRAME:029208/0422 Effective date: 20121030 |
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STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
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AS | Assignment |
Owner name: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD., SINGAPORE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:045281/0269 Effective date: 20180112 Owner name: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD., SING Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:045281/0269 Effective date: 20180112 |
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