US799218A - Process of depositing metal on non-metallic bodies. - Google Patents
Process of depositing metal on non-metallic bodies. Download PDFInfo
- Publication number
- US799218A US799218A US24110905A US1905241109A US799218A US 799218 A US799218 A US 799218A US 24110905 A US24110905 A US 24110905A US 1905241109 A US1905241109 A US 1905241109A US 799218 A US799218 A US 799218A
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- US
- United States
- Prior art keywords
- mold
- silver
- depositing metal
- metallic
- metallic bodies
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
Definitions
- I prepare a silver solution by adding nitrate of silver to water in about the proportions of twenty grains of the former to one ounce of the latter and adding liquid ammonia until the precipitate is redissolved.
- I also prepare a reducing agent consisting of forty per cent. formaldehyde or formalin or the chemical equivalent thereof diluted with water in about the proportions of one ounce of the former to three ounces of the latter.
- the wax or other non-metallic mold to be coated with silver is prepared, precedent to the application of the commingled silver and reducing agent, by applying to the mold an alcoholic substratum of collodion.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Description
- alcohol.
UNITED STATES PATENT OFFICE.
PROCESS OF DEPOSITING METAL ON NON-METALLIC BODIES- Specification of Letters Patent.
Patented Sept. 12, 1905.
Application filed n ary 14, 1905. Serial No. 241,109.
To 11,2] whom it may concern.-
Be it known that I, CASSIUS F. Brnoxmnon, a citizen of the United States, residing at lV-ashington, in theDistrict of Columbia, have invented new and useful Improvements in Processes of Depositing Metal on Non-Metallic Bodies, of which the following is a specification.
My invention pertains to depositing or precipitating metal on non-metallic bodies; and it contemplates the provision of a process calculated to assure the quick deposition or precipitation of a compact and uniform surface of metallic silver upon a wax or other nonmetallic mold with a view of making the mold electrically conductive, and thereby accelerating and rendering certain and perfect a subsequent operation of depositing metal, preferably nickel, on the mold by electrolysis to make an elect-rotype or the like.
In the preferable practice of my invention I prepare a silver solution by adding nitrate of silver to water in about the proportions of twenty grains of the former to one ounce of the latter and adding liquid ammonia until the precipitate is redissolved. Ialso prepare a reducing agent consisting of forty per cent. formaldehyde or formalin or the chemical equivalent thereof diluted with water in about the proportions of one ounce of the former to three ounces of the latter. The wax or other non-metallic mold to be coated with silver is prepared, precedent to the application of the commingled silver and reducing agent, by applying to the mold an alcoholic substratum of collodion. This latter is made by dissolving about one grain of guncotton (pyroxylin) in about one-fourth of an ounce of sulfuric ether and about threefourths of an ounce of ninety-five per cent. It is flowed over the mold or is applied to the same with a brush or in any other approved manner, and after the application the mold is permitted to dry. The said substratum of collodion conduces to the proper deposition or precipitation of the metallic silver on the mold and is preferably employed for such reason. I desire it distinctly understood, however, that I do not confine myself to the use of collodion, as any other substance compatible with the purpose of my invention may be employed; also, that I do not confine myself to treating the mold in any manner whatsoever precedent to the deposition of the silver thereon, inasmuch as good results are obtainable without so treating the mold.
.ln practicing my novel process I add the reducing agent described to the ammonia nitrate-of-silver solution in about the proportions of six drams of the former to two ounces of the latter and immediately thereafter ap ply the mixture to the mold, preferably by pouring it on the face of the mold and ma nipulating the mold so that the mixture is spread evenly over the face. The mold is gently oscillated until the metallic silver is reduced upon its face, which takes place in a very short time i. 0., from two to live minutes when the mold will have a compact and uniform metallic surface.
My novel process is designed more particularly for depositing nickel on a mold of nonconductive material by electrolysis, and when the mold is provided with a compact and uniform metallic surface in the manner just stated the quick and perfect deposition of the nickel by electrolysis is assured and the nickel is not liable to peel during the use of the electrotype.
I have entered into a detailed description of my novel process as I prefer to practice it in order to impart a full, clear, and exact understanding of the same. I do not desire, however, to be understood as confining myself to the specific practice liereinbefore pointed out or to the proportions of the ingredients entering into the several compositions or to the specific ingredients, as such changes or modifications may be made in practice as fairly fall within the scope of my invention as claimed.
Having described my invention, what I claim, and desire to secure by Letters Patent,
1. The electrotyping process which consists in preparing a mold of non-conductive material, coating the mold with substance that will conduce to the precipitation of metallic silver on the mold, adding liquid ammonia to a nitrate-of-silver solution until the precipitate is redissolved and adding formaldehyde to the mixture, applying this mixture to the coated mold, and depositing metal on the silver surface of the mold by electrolysis.
2. The electroty ping process which consists in preparing a mold of non-conductive material, coating the mold with substance that will conduce to the precipitation of metallic silver on the mold, adding liquid ammonia to a nimy hand in presence of two subscribing Wittrate-of-silver solution until the precipitate nesses. 4 is redissolved and adding formaldehyde to the mixture, applying this mixture to the coated OASSIUS BLACKLIDGE- l 5 mold and depositing nickel on the silver sur- Witnesses:
face of the mold by electrolysis. THOS. Gr. LEWIS,
In testimony whereof I have hereunto set l/VM. BERRY.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24110905A US799218A (en) | 1905-01-14 | 1905-01-14 | Process of depositing metal on non-metallic bodies. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24110905A US799218A (en) | 1905-01-14 | 1905-01-14 | Process of depositing metal on non-metallic bodies. |
Publications (1)
Publication Number | Publication Date |
---|---|
US799218A true US799218A (en) | 1905-09-12 |
Family
ID=2867706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US24110905A Expired - Lifetime US799218A (en) | 1905-01-14 | 1905-01-14 | Process of depositing metal on non-metallic bodies. |
Country Status (1)
Country | Link |
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US (1) | US799218A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3533921A (en) * | 1968-03-08 | 1970-10-13 | Frost Co | Method of finishing the surface of metal articles |
-
1905
- 1905-01-14 US US24110905A patent/US799218A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3533921A (en) * | 1968-03-08 | 1970-10-13 | Frost Co | Method of finishing the surface of metal articles |
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