US7735383B2 - Balanced resistance capacitive sensing apparatus - Google Patents
Balanced resistance capacitive sensing apparatus Download PDFInfo
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- US7735383B2 US7735383B2 US12/144,928 US14492808A US7735383B2 US 7735383 B2 US7735383 B2 US 7735383B2 US 14492808 A US14492808 A US 14492808A US 7735383 B2 US7735383 B2 US 7735383B2
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- routing trace
- routing
- capacitive sensing
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- sensing apparatus
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
- G01D5/2405—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by varying dielectric
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
- H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
- H03K2217/96—Touch switches
- H03K2217/9607—Capacitive touch switches
- H03K2217/960705—Safety of capacitive touch and proximity switches, e.g. increasing reliability, fail-safe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
Definitions
- Capacitive sensing devices otherwise known as touch sensing devices or proximity sensors are widely used in modern electronic devices/apparatus.
- a capacitive sensing device is often used for touch based navigation, selection, or other input, in response to a finger, stylus, or other object being placed on or in proximity to a sensor of the capacitive sensing device.
- capacitive sensing devices are often employed in computers (e.g. notebook/laptop computers), touch screens, media players, multi-media devices, remote controls, personal digital assistants, smart devices, telephones, control consoles, and the like.
- Un-patterned sheet sensors are often employed as a simple and economical method means for implementing attractive sensors for sensing contact, touch, and/or proximity based inputs.
- a capacitive sensing device may become distorted due to the presence of noise. That is, interference sources such as LCD's and RF transmitters can corrupt signals produced by capacitive sensors within the capacitive sensing device.
- Embodiments for a capacitive sensing apparatus with attenuated electrical interference across a plurality of routing traces are provided.
- One embodiment forms a first sensor electrode on a substrate.
- a first set of routing traces is formed on the substrate, the first routing trace coupled with the first sensor electrode.
- One embodiment additionally forms a second sensor electrode on the substrate.
- a second set of routing traces differing in length from the first routing trace is also formed on the substrate, the second routing trace coupled with the second sensor electrode.
- the second routing trace is formed having an approximately equal RC time constant characteristic as the first routing trace.
- FIG. 1 is block diagram of a sensor device according to an embodiment of the present technology.
- FIG. 2 is a top view of a sensor and routing trace array according to an embodiment of the present technology.
- FIG. 3 is a flow diagram of a method for forming a capacitive sensing apparatus with attenuated electrical interference across a plurality of routing traces in accordance with an embodiment of the present technology.
- apparatus and techniques for balancing the RC time constants among the sensing channels in a capacitive sensing apparatus is described.
- the balancing is a result of adding resistance in a controlled manner across one or more of the sensing channels (or routing traces) in a sensor device.
- a first material and a second material having a resistivity different from a resistivity of the first material is provided in series when forming each of the plurality of routing traces.
- RF radio frequency
- the resultant impedance mismatch will allow each of the routing traces to act as a radio frequency (RF) reflector.
- the impedance mismatch will reduce routing trace antenna efficiencies thereby resulting in reduced interference properties. For example, small resistivity changes in the routing trace will significantly reduce the RF coupling efficiency.
- the impedance mismatch will deter the routing trace from acting as an antenna when RF or other low frequency interference is encountered; such as when a sensor device is used in mobile phone applications, LCD applications, or the like.
- the resistance of the routing traces may be varied per routing trace to provide an approximate RC time constant that is similar for each routing trace. In other words, by balancing the RC time constant across two or more routing traces common mode interference will be received at the controller as common mode noise and will result in a capacitive sensing device with significantly better balanced common mode RF interference recognition and removal.
- each routing trace will be affected similarly; that is, in a common mode fashion.
- embodiments described herein provide a cost effective method of adding this resistance to a routing trace.
- the technology described herein will enable variable sensing frequencies, reduce clock modulation related jitter, and the like while adding little or no present or follow-on programming overhead.
- embodiments described herein may also be utilized for RC sheet sensors.
- sensor device 109 is shown.
- sensor device 109 is implemented in an application specific integrated circuit (ASIC) that is specifically designed and configured to operate in conjunction with sensor electrodes of the capacitive touch sensing device.
- ASIC application specific integrated circuit
- sensor device 109 includes a controller 102 coupled to sensor electrode 106 a and sensor electrode 106 n via trace 108 a and trace 108 n , respectively.
- controller 102 coupled to sensor electrode 106 a and sensor electrode 106 n via trace 108 a and trace 108 n , respectively.
- sensor electrode 106 a and sensor electrode 106 n via trace 108 a and trace 108 n , respectively.
- FIG. 1 Although two sensor electrodes are shown in FIG. 1 , embodiments are well suited for use with a capacitive touch sensing device comprised of a single sensor electrode, two sensor electrodes, or more than two sensor electrodes. Additionally, embodiments in accordance with the present invention are well suited to use sensor electrodes having any of various shapes, sizes, or patterns.
- FIG. 1 also includes an object 112 (e.g. a finger, a stylus, a pointing object, etc.) shown approaching sensor electrodes 106 a and 106 n .
- object 112 e.g. a finger, a stylus, a pointing object, etc.
- FIG. 1 also includes an object 112 (e.g. a finger, a stylus, a pointing object, etc.) shown approaching sensor electrodes 106 a and 106 n .
- object 112 e.g. a finger, a stylus, a pointing object, etc.
- FIG. 2 includes a substrate 204 having a plurality of traces 108 a - 108 n formed thereon.
- sensor electrodes 106 a - 106 n and routing traces 108 a - 108 n form the sensing area of sensor device 202 .
- routing traces 108 a - 108 n are each coupled to controller 102 , of FIG. 1 , to enable the operation of sensor device 109 .
- sensor device 109 may be placed over an information display device such as a liquid crystal display (LCD) or over an RF radiating device such as a mobile phone.
- LCD liquid crystal display
- RF radiating device such as a mobile phone.
- a user would view the underlying image or information display by looking through sensing area of sensor array 202 .
- any number of sets of conductive traces may be implemented in accordance with the present embodiment. For example, operations described herein may be repeated as desired.
- sensor electrodes 106 a - 106 n includes a clear conductive material.
- sensor electrodes 106 a - 106 n are disposed by printing (e.g., screen printing) a conductive polymer in a desired conductive pattern. In one embodiment, such a polymer is clear in coloration.
- sensor electrodes 106 a - 106 n are disposed through patterning a conductive material such as ITO (indium tin oxide) on a thermoplastic polymer substrate such as a PET (polyethylene terephthalate) substrate or glass. In some instances this conductive material (e.g., ITO) comprises a water clear conductive coating.
- ITO indium tin oxide
- sensor electrodes 106 a - 106 n may comprise several layers of conductive and insulating materials.
- sensor electrodes 106 a - 106 n that supports two-dimensional sensing of objects may be built up from one or more ITO+PET layers. When two or more ITO+PET layers are used, they are laminated together, such as with optically clear adhesive.
- the ITO is disposed into capacitive sensor pattern 125 via a sputtering process.
- routing traces 108 a - 108 n are utilized to electrically access and couple with sensor electrodes 106 a - 106 n and are disposed contemporaneously with the disposition of sensor electrodes 106 a - 106 n .
- routing traces 108 a - 108 n are used for connecting sensor electrodes 106 a - 106 n with electronic components, such as an ASIC configured for interpreting whether and/or where an object touches or comes into proximity with the sensing region (sensor electrodes 106 a - 106 n ) of capacitive sensor 109 of FIG. 1 .
- conductive ink pads and/or traces may be incorporated into or proximate to routing traces 108 a - 108 n . Such traces and/or pads may be disposed in one or more regions of sensor device 109 . In one embodiment, conductive pads are used for coupling routing traces 108 a - 108 n with controller 102 .
- sensor device 202 has been shown as being substantially planar, it may be formed into a non-planar shape such as a curved surface of an automotive dashboard or console panel or sensor device 202 may be disposed as a keypad on an electronic device or over a display, such as a liquid crystal display.
- an insulating material is deposited above the set of conductive traces.
- the insulating material may act as protection (e.g., from handling damage) for the set of conductive traces and also provide them electrical insulation from the outside world.
- the deposition of the insulating material may be an optional and may be implemented in diverse ways. For example, a deposition of a dielectric layer (e.g., SiO 2 , Spin-On-Glass, and the like) may be used as the insulating material.
- the insulating material may include a substantially transparent insulating material or an opaque insulating material. Additionally, the insulating material may be deposited to cover the entire set of conductive traces or it may be deposited to cover one or more portions of the set of conductive traces.
- each of routing traces 108 a - 108 n have a first material 208 having a first resistivity and a second material 210 having a second resistivity. Moreover, the first resistivity of the first material 208 is different than the resistivity of the second material 210 .
- first material 208 and second material 210 may be materials such as conductive ink and indium tin oxide (ITO). In another embodiment, less than every trace 108 a - 108 n includes the two materials.
- Sensor device 202 also includes a plurality of sensor electrodes such as sensor electrode 106 a made of a plurality of sensor elements.
- each of routing traces 108 a - 108 n may be formed of a single material or a compound having different shapes and/or thicknesses to provide a first resistance region and a second resistance region.
- the resultant impedance mismatch will allow each of routing traces 108 a - 108 / n to act as RF reflectors. Further, the impedance mismatch will reduce routing traces 108 a - 108 n antenna efficiencies thereby resulting in reduced interference properties.
- a capacitance of routing trace 108 a is approximately equal to the capacitance of routing trace 108 n . This is accomplished, in one embodiment, by controlling the amount of first material 208 and second material 210 used when forming each routing trace. In another embodiment, also described further herein, an RC time constant associated with the first routing trace 108 a is approximately equal to the RC time constant associated with the second routing trace 108 n . This may also be accomplished, in one embodiment, by controlling the amount of first material 208 and second material 210 used when forming each routing trace. For example, in one embodiment, the first material 208 and second material 210 may be disposed in sequence, interspersed, overlaid, or otherwise distributed in routing traces 108 a - 108 n.
- second material 210 is shown in a similar location, it is understood that second material 210 may be found in any location throughout routing traces 108 a - 108 n .
- routing traces 108 a - 108 n may have more than one portion formed of second material 210 .
- each of routing traces 108 a - 108 n may be formed with different amounts, combinations, or patterns of first material 208 and second material 210 .
- a longer routing trace 108 a may be formed with a different amount and/or shape of first material 208 and second material 210 than a shorter routing trace 108 n.
- a substantially transparent substrate e.g., a glass, a plastic or a crystalline material
- a set of conductive traces is patterned above the substantially transparent substrate.
- an insulating material may be deposited above the set of conductive traces. In one embodiment, the insulating material may act as protection for the set of conductive traces and also provide them electrical insulation from the outside world.
- substrate 204 is a substantially transparent substrate.
- the substantially transparent substrate may include, but is not limited to, a glass, a plastic or a crystalline material.
- the substantially transparent substrate may be a component of an information display device.
- the substantially transparent substrate may be implemented as a part of a casing or front cover of the information display device. It is noted that the substantially transparent substrate may include a wide variety of materials in accordance with the present embodiment.
- the substrate is not substantially transparent and may include, but is not limited to, silicon wafer, or the like.
- First sensor electrode 106 a is normally formed from a plurality of sensor elements patterned above the substrate.
- the forming or patterning of first sensor electrode 106 a may be implemented in diverse ways.
- the patterning of first sensor electrode 106 a can include, but is not limited to, a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA.
- LIGA is the German abbreviation for LIthogafie Galvanoformung Abformung which in English means lithographic electrodeposition.
- First sensor electrode 106 a can include substantially opaque material and/or substantially non-reflective material. Furthermore, first sensor electrode 106 a may be formed of at least one layer of material that is substantially non-reflective. It is noted that by locating a substantially opaque, non-reflective material such that it faces a user of the capacitive sensing device, it can optically obscure from the user any reflective materials included as part of the set of conductive traces that make up first sensor electrode 106 a . In this manner, the substantially non-reflective material makes the set of conductive traces more difficult to see by the user. It is noted that first sensor electrode 106 a can include at least one layer of substantially opaque material.
- first sensor electrode 106 a may be patterned such that each of the conductive traces has a width less than approximately 12 micrometers. It is noted that the width of each conductive trace may be understood to mean the width of each individual conductive element of the set of conductive traces forming first sensor electrode 106 a . In this manner, when a user is approximately at arm's length from the capacitive sensing device, the user's eyes are substantially unable to view the set of conductive traces of the capacitive sensing device. It is understood that by decreasing the width of each trace of the set of conductive traces, there is a point at which they are no longer resolvable by a human eye. In this fashion, there is no deleterious obstruction of an underlying image by the set of conductive traces that make up first sensor electrode 106 a.
- first routing trace 108 a forms a first routing trace 108 a on the substrate 204 .
- the first routing trace 108 a coupled with the first senor electrode 106 a .
- first routing trace 108 a may be formed in diverse ways.
- first routing trace 108 a may be formed from a first material 208 having a first resistivity and a second material 210 having a second resistivity.
- first material 208 may be a conductive ink such as silver ink while second material 210 may be ITO.
- first routing trace 108 a may be formed from a single material or compound having thicker local portions or wider local portions to produce lower resistance portions such as described and shown with respect to first material 208 and second material 210 .
- the patterning of first routing trace 108 a can include patterning a landing pad region above substrate 204 to enable coupling of one or more sensing circuit components, such as controller 102 of FIG. 2 , to substrate 204 .
- the landing pad region may include wiring for coupling integrated circuit (IC) chips, capacitors, resistors, connectors and other electronic components to the substantially transparent substrate.
- IC integrated circuit
- the landing pad region may be plated with gold, tin, copper or any other metal that is compatible with solder.
- Second sensor electrode 106 n is normally formed from a plurality of sensor elements patterned above the substrate.
- the forming or patterning of second sensor electrode 106 n may be implemented in diverse ways.
- the patterning of second sensor electrode 106 n can include, but is not limited to, a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA. It is noted that LIGA is the German abbreviation for LIthogafie Galvanoformung Abformung which in English means lithographic electrodeposition.
- Second sensor electrode 106 n can include substantially opaque material and/or substantially non-reflective material.
- the set of conductive traces may be formed of at least one layer of material that is substantially non-reflective. It is noted that by locating a substantially opaque, non-reflective material such that it faces a user of the capacitive sensing device, it can optically obscure from the user any reflective materials included as part of the set of conductive traces. In this manner, the substantially non-reflective material makes the set of conductive traces more difficult to see by the user. It is noted that the set of conductive traces can include at least one layer of substantially opaque material.
- second sensor electrode 106 n may be patterned such that each of the conductive traces has a width less than approximately 12 micrometers. It is noted that the width of each conductive trace may be understood to mean the width of each individual conductive element of the set of conductive traces forming second sensor electrode 106 n . In this manner, when a user is approximately at arm's length from the capacitive sensing device, the user's eyes are substantially unable to view the set of conductive traces that make up second sensor electrode 106 n . It is understood that by decreasing the width of each trace of the set of conductive traces, there is a point at which they are no longer resolvable by a human eye. In this fashion, there is no deleterious obstruction of an underlying image by the set of conductive traces of the second sensor electrode 106 n.
- one embodiment forms a second routing trace 108 n differing in length from the first routing trace 108 a on the substrate 204 .
- the second routing trace 108 n coupled with the second senor electrode 106 n.
- second routing trace 108 n may be formed in diverse ways.
- second routing trace 108 n may be formed from a first material 208 having a first resistivity and a second material 210 having a second resistivity.
- first material 208 may be a conductive ink such as silver ink while second material 210 may be ITO.
- first routing trace 108 a may be formed from a single material or compound having thicker local portions or wider local portions to produce lower resistance portions such as described and shown with respect to first material 208 and second material 210 .
- the patterning of first routing trace 108 a can include patterning a landing pad region above substrate 204 to enable coupling of one or more sensing circuit components, such as controller 102 of FIG. 2 , to substrate 204 .
- the landing pad region may include wiring for coupling integrated circuit (IC) chips, capacitors, resistors, connectors and other electronic components to the substantially transparent substrate.
- IC integrated circuit
- the landing pad region may be plated with gold, tin, copper or any other metal that is compatible with solder.
- second routing trace 108 n has an RC time constant that is approximately equal to the RC time constant of the first routing trace 108 a to attenuate electrical interference.
- second material 210 may be overlaid or interspersed with respect to first material 208 .
- the impedance mismatch will reduce trace antenna efficiencies thereby resulting in reduced interference properties at routing traces 108 a - 108 n .
- small resistivity changes in routing traces 108 a - 108 n will significantly reduce the RF coupling efficiency.
- the impedance mismatch will deter routing traces 108 a - 108 n from acting as antenna when RF or other low frequency interference is encountered; such as when a sensor device is used in mobile phone applications, LCD applications, or the like.
- the resistance of routing traces 108 a - 108 n may be varied such that an overall matching RC time constant is realized for each of routing traces 108 a - 108 n .
- common mode interference will be received at the controller 102 as common mode noise and will result in a capacitive sensing device with significantly better balanced common mode RF interference recognition and removal.
- each of routing traces 108 a - 108 n will be affected similarly; that is, in a common mode fashion.
- embodiments described herein provide a cost effective method of adding this resistance to routing traces 108 a - 108 n .
- the technology described herein will enable variable sensing frequencies, reduce clock modulation related jitter, and the like while adding little or no present or follow-on programming overhead to controller 102 .
- embodiments described herein may also be utilized for RC sheet sensors.
- portions of the present technology are composed of computer-readable and computer-executable instructions that reside, for example, in computer-usable media of a computer system. That is, pluralities of computer systems and components having computer readable media disposed thereon (e.g. random access memory (RAM) and/or read-only memory (ROM)) may be used to implement embodiments, of the present technology.
- RAM random access memory
- ROM read-only memory
- embodiments described herein can operate on or within a number of different computer systems including general purpose networked computer systems, embedded computer systems, routers, switches, server devices, client devices, various intermediate devices/nodes, stand alone computer systems, and the like.
Abstract
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US9329731B2 (en) | 2012-09-12 | 2016-05-03 | Synaptics Incorporated | Routing trace compensation |
US20160290878A1 (en) * | 2015-04-02 | 2016-10-06 | Tacto Tek Oy | Multilayer structure for capacitive pressure sensing |
US10444862B2 (en) | 2014-08-22 | 2019-10-15 | Synaptics Incorporated | Low-profile capacitive pointing stick |
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US20140306920A1 (en) * | 2013-04-10 | 2014-10-16 | Himax Technologies Limited | Touch screen structure for receiving and processing touch signal |
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