US7618553B2 - Insulating material for printed circuit board - Google Patents

Insulating material for printed circuit board Download PDF

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Publication number
US7618553B2
US7618553B2 US11/902,487 US90248707A US7618553B2 US 7618553 B2 US7618553 B2 US 7618553B2 US 90248707 A US90248707 A US 90248707A US 7618553 B2 US7618553 B2 US 7618553B2
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United States
Prior art keywords
insulating material
dielectric constant
temperature
ceramic powder
liquid crystal
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Expired - Fee Related, expires
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US11/902,487
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English (en)
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US20080081177A1 (en
Inventor
Jin Cheol Kim
Jun Rok Oh
Tae Kyoung Kim
Sang Jun Yoon
Hwa Young Lee
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Publication date
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Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, JIN CHEOL, KIM, TAE KYOUNG, LEE, HWA YOUNG, OH, JUN ROK, YOON, SANG JUN
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/71—Ceramic products containing macroscopic reinforcing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

Definitions

  • the present invention relates, in general, to an insulating material for a printed circuit board (PCB). More particularly, the present invention relates to an insulating material for a PCB, which includes a liquid crystal polyester resin and ceramic powder to exhibit superior dielectric properties and a small change in dielectric constant depending on changes in temperature so as to realize excellent reliability when applied to high-frequency circuits.
  • PCB printed circuit board
  • the frequency of a signal which is transmitted along the line of a PCB, is increased.
  • impedance matching of an input terminal and an output terminal is regarded as very important.
  • an epoxy resin for example, FR-4, which is mainly used as the insulating material of a PCB, is greatly changed in dielectric constant depending on the change in temperature, as illustrated in FIG. 1 , and therefore has ⁇ 91897 ppm at ⁇ 55° C. and 81712 ppm at 125° C., relative to the dielectric constant at 25° C. From this, a TCC (Temperature Coefficient of Capacitance) is determined to be 960 or more ppm/° C.
  • the great change in dielectric constant of the epoxy resin depending on the temperature is considered to be a limitation in the ability to design a circuit of a PCB for transmitting the high-frequency signal in consideration of impedance matching.
  • the dielectric constant of an electronic apparatus changes depending on the surrounding environment, in particular, temperature, and thereby the impedance of the matched signal line varies, undesirably causing signal loss, such as signal reflection.
  • an insulating material for high-frequency signal transmission has been actively developed according to the trend toward a low dielectric constant for increasing a transmission speed and a low dissipation factor for minimizing signal loss.
  • the development of the insulating material for high-frequency signal transmission has progressed to the preparation of a resin having a dielectric constant and a dissipation factor lower than conventional epoxy resins and to the improvement of dielectric properties through the dispersion/addition of a high-frequency ceramic filler.
  • BCB has a low dissipation factor and stable TCC properties, as illustrated in FIG. 2 , but is disadvantageous because it is expensive and easily cracks in a curing reaction. Further, this polymer is not easily formed into a film, and is undesirably difficult to commercialize.
  • the LCP has superior dielectric properties, including dielectric constant and dissipation factor, it is problematic in use in high-frequency circuits because the TCC thereof is as high as about 900 ppm/° C. at high temperatures (125° C.), as illustrated in FIG. 3 .
  • the present invention provides an insulating material for a PCB, which can be used in high-frequency circuits.
  • the present invention provides an insulating material for a PCB, which has a lower dissipation factor and a smaller change in dielectric constant depending on the change in temperature, compared to conventional epoxy resins and engineering polymers.
  • an insulating material for a PCB may include a liquid crystal polyester resin and ceramic powder to thus have a TCC ranging from ⁇ 300 to +300 ppm/° C. in the temperature range of ⁇ 55 ⁇ 125° C. and a dielectric constant of 5 to 40.
  • the insulating material may have a dissipation factor of 0.01 or less.
  • the ceramic powder may be contained in an amount of 10 to 50 vol %.
  • the ceramic powder may have an average particle size of 0.1 to 5 ⁇ m.
  • the liquid crystal polyester resin may be an aromatic liquid crystal polyester resin.
  • FIG. 1 is a graph illustrating the change in dielectric constant of epoxy over temperature
  • FIG. 2 is a graph illustrating the change in dielectric constant of a functional polymer (e.g., BCB) over temperature;
  • a functional polymer e.g., BCB
  • FIG. 3 is a graph illustrating the change in dielectric constant of a functional polymer (e.g., LCP) over temperature;
  • a functional polymer e.g., LCP
  • FIG. 4 is a view illustrating the structure of a microstrip
  • FIG. 5 is a graph illustrating the TCC properties depending on the amount of LaAlO 3 , in the CTLA prepared in Preparative Example 1 of the present invention
  • FIG. 6 is a graph illustrating the change in dielectric constant of the insulating film depending on the chemical composition and amount of the filler, in Example 1 of the present invention.
  • the microstrip has a substrate structure for forming a circuit in a manner such that an electrode 20 for a GND is formed on the entire bottom surface, the height h and the dielectric constant ⁇ r of an intermediate insulator (dielectric) 10 are precisely defined, and then a signal line 30 is disposed on the top surface in response to the height/dielectric constant.
  • the width W and the thickness t of the signal line 30 of the microstrip substrate but also the height h and the dielectric constant ⁇ r of the intermediate insulator 10 thereof should be precisely defined.
  • the present invention pertains to an insulating material for a PCB, which may be used as the intermediate insulator (dielectric) upon high-frequency circuit design, as mentioned above.
  • the insulating material is characterized in that it has superior dielectric properties, including dielectric constant and dissipation factor, and a small change in dielectric constant depending on the change in temperature.
  • the insulating material having desired dielectric properties is obtained through a method of dispersing a high-frequency ceramic filler in the liquid crystal polyester resin.
  • the insulating material exhibits a TCC of ⁇ 300 ⁇ +300 ppm/° C., and preferably ⁇ 30 ⁇ +280 ppm/° C. in the temperature range of ⁇ 55 ⁇ 125° C., and has a dielectric constant of 5 ⁇ 40, and preferably 5 ⁇ 15.
  • the insulating material has a dissipation factor of about 0.01 or less, and preferably 0.005 ⁇ 0.008, which is much lower than the dissipation factors of conventional epoxy resins and engineering polymers.
  • ceramic powder is used to improve the TCC properties through the dispersion of the ceramic powder having a low dissipation factor and ⁇ TCC properties in the liquid crystal polyester having +TCC properties in which the dielectric constant is increased in proportion to an increase in temperature ( FIG. 3 ).
  • the ceramic powder used in the present invention may be CTLA-based powder, having a chemical composition of (1-x)(CaTiO 3 ) ⁇ x(LaAlO 3 ), in which x is 0.001 ⁇ 0.5, and preferably 0.15 ⁇ 0.35, to be suitable for exhibiting desired dielectric properties.
  • the amount of the ceramic powder is appropriately adjusted depending on the end uses, and is preferably set to 10 to 50 vol %, and more preferably 22 to 37 vol %.
  • the average particle size of the ceramic powder is not particularly limited, but is preferably set to 0.1 to 5 ⁇ m in the interests of improving of dispersibility and workability.
  • CTLA-based filler having a chemical composition of (1-x)(CaTiO 3 ) ⁇ x(LaAlO 3 ), powders, in which x is 0.01, 0.1 and 0.2, were respectively prepared through the following procedure.
  • CaCO 3 having a high purity of 99.9% or more
  • the weight ratio of material powder and water was 2:1, and 0.5 wt % of a dispersant was added to improve mixing effects and dispersibility.
  • the spray-dried powder was calcined at 1250° C. for 4 hours, thus synthesizing a (Ca,La)(Ti,Al)O 3 solid solution.
  • the synthesized powder was pulverized using a bead mill to make it suitable for use as a filler. In the pulverization condition, the solid solution and water were added in a ratio of 2:1 to thus adjust the concentration of the slurry.
  • the slurry was added with 0.5 wt % of the dispersant, and was then pulverized. When the viscosity of the slurry was increased while pulverizing the particles, 1 wt % of the dispersant was further added.
  • the particle size distribution was measured at 1 hour intervals.
  • the circulation process was stopped, after which the material powder was further subjected to a one-pass process to thus adjust a final particle size to 0.9 ⁇ m or less and then spray dried, thereby preparing the filler.
  • the RCC and the copper foil were laminated at a maximum of 300° C. using a high-temperature V press, thus forming electrodes on both surfaces of the insulating film.
  • the dielectric constant of the insulating film depending on the amount of the filler is depicted in FIG. 6 .
  • the loss value of the RCC containing 30 vol % of the filler at 1 GHz is shown in Table 2 below. The value thus measured is significantly varied not by the chemical composition of powder but by the degree of dispersion thereof, but is as low as 0.01 or less.
  • Example 2 Furthermore, the aromatic polyester resin (LCP) used in Example 1, the CTLA filler powder, in which x is 0.2, and the RCC manufactured as above were measured for TCC under conditions of the oscillation voltage of 1 Vrms and the frequency of 1 MHz. The results are shown in FIG. 7 .
  • the TCC of the LCP ranges from ⁇ 260 ⁇ +800 ppm/° C. in the temperature range of ⁇ 55 ⁇ 125° C. but is decreased to ⁇ 26 ⁇ +260 ppm/° C. under the same measurement conditions when the CTLA filler is added.
  • the use of the filler having the considerably great TCC having a sign opposite to that of the resin can be seen to make it possible to decrease the TCC range to a conventional capacitor range.
  • the present invention provides an insulating material for a PCB.
  • the insulating material has a smaller change in dielectric constant depending on the change in temperature than conventional insulating materials for PCBs, and may be used as an insulating layer in a circuit when impedance matching is regarded as important.
  • impedance mismatch attributable to the change in dielectric constant depending on the change in temperature, may be minimized, and signal loss resulting therefrom may also be reduced, compared to the case where a PCB is manufactured using conventional materials.
  • a high-frequency part such as a filter, it is possible to decrease the variation in the band width depending on the temperature, to thus replace an SMT passive device.
  • the insulating material of the invention is used as a material for embedding a capacitor having C properties, which is presently mounted on a PCT to realize impedance matching, parasitic inductance may be advantageously reduced compared to when a conventional capacitor is provided.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
US11/902,487 2006-09-29 2007-09-21 Insulating material for printed circuit board Expired - Fee Related US7618553B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060095758A KR100752019B1 (ko) 2006-09-29 2006-09-29 인쇄회로기판용 절연재
KR10-2006-0095758 2006-09-29

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US7618553B2 true US7618553B2 (en) 2009-11-17

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JP (1) JP2008091908A (zh)
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
US11729908B2 (en) 2020-02-26 2023-08-15 Ticona Llc Circuit structure
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014081650A1 (en) * 2012-11-21 2014-05-30 Ticona Llc Liquid crystalline polymer composition for melt-extruded substrates

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04161461A (ja) 1990-10-24 1992-06-04 Murata Mfg Co Ltd 誘電体起電流型アンテナ用複合材料
JPH09118562A (ja) 1995-09-07 1997-05-06 Korea Advanced Inst Of Sci Technol 高周波用磁器誘電体
JP2003342478A (ja) 2002-05-28 2003-12-03 Matsushita Electric Works Ltd 熱可塑性樹脂組成物及び成形品
JP2006176564A (ja) 2004-12-21 2006-07-06 Sumitomo Chemical Co Ltd 芳香族液晶ポリエステル液状組成物
US20080212299A1 (en) * 2007-03-02 2008-09-04 Samsung Electro-Mechanics Co., Ltd. Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same

Family Cites Families (4)

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US6528145B1 (en) * 2000-06-29 2003-03-04 International Business Machines Corporation Polymer and ceramic composite electronic substrates
JP4196647B2 (ja) * 2002-11-15 2008-12-17 東レ株式会社 アンテナ部品用錠剤、アンテナ部品およびその製造方法
JP2005029700A (ja) * 2003-07-04 2005-02-03 Tdk Corp 複合誘電体、複合誘電体シート、複合誘電体ペースト、金属層付き複合誘電体シート、配線板及び多層配線板
JP2006233118A (ja) * 2005-02-28 2006-09-07 Sumitomo Chemical Co Ltd アンテナ用樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04161461A (ja) 1990-10-24 1992-06-04 Murata Mfg Co Ltd 誘電体起電流型アンテナ用複合材料
JPH09118562A (ja) 1995-09-07 1997-05-06 Korea Advanced Inst Of Sci Technol 高周波用磁器誘電体
JP2003342478A (ja) 2002-05-28 2003-12-03 Matsushita Electric Works Ltd 熱可塑性樹脂組成物及び成形品
JP2006176564A (ja) 2004-12-21 2006-07-06 Sumitomo Chemical Co Ltd 芳香族液晶ポリエステル液状組成物
US20080212299A1 (en) * 2007-03-02 2008-09-04 Samsung Electro-Mechanics Co., Ltd. Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Japanese Office Action issued on Mar. 24, 2009 in corresponding Japanese Patent Application 2007-249849.
Japanese Patent Office Action, mailed Aug. 12, 2008 and issued in corresponding Japanese Patent Application No. 2007-249849.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11705641B2 (en) 2019-08-21 2023-07-18 Ticoan Llc Antenna system including a polymer composition having a low dissipation factor
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
US11729908B2 (en) 2020-02-26 2023-08-15 Ticona Llc Circuit structure
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system

Also Published As

Publication number Publication date
CN101155470A (zh) 2008-04-02
JP2008091908A (ja) 2008-04-17
US20080081177A1 (en) 2008-04-03
KR100752019B1 (ko) 2007-08-28

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