US7463493B2 - Module for transferring PCB, apparatus for attaching PCB and liquid crystal display device including PCB - Google Patents
Module for transferring PCB, apparatus for attaching PCB and liquid crystal display device including PCB Download PDFInfo
- Publication number
- US7463493B2 US7463493B2 US11/304,014 US30401405A US7463493B2 US 7463493 B2 US7463493 B2 US 7463493B2 US 30401405 A US30401405 A US 30401405A US 7463493 B2 US7463493 B2 US 7463493B2
- Authority
- US
- United States
- Prior art keywords
- transfer body
- pcb
- printed circuit
- transfer
- attaching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Definitions
- the present invention relates to a module for transferring a printed circuit board (PCB) during manufacture and an apparatus for attaching a PCB to a liquid crystal display device.
- PCB printed circuit board
- PCBs have commonly been used to operate electric devices, such as display devices.
- a PCB is fabricated by printing signal lines on a glass fiber or a plastic substrate and attaching electric elements to the substrate.
- TCP tape carrier packaging
- the TCP technology is a packaging technology that uses TAB (tape automated bonding) technology where a semiconductor chip is joined with a film and sealed up with resin, and the TCP technology includes COF (chip on film or chip on flexible printed circuit).
- a PCB can be used to operate a liquid crystal display (LCD) device with the TCP film.
- LCD liquid crystal display
- a liquid crystal panel 2 includes first and second substrates 4 , 6 , with a liquid crystal layer between the two substrates 4 , 6 .
- the liquid crystal panel 2 is connected to gate and data PCBs 12 , 14 .
- the liquid crystal panel 2 is normally operated as an active matrix.
- On an inner surface of the first substrate 4 a plurality of gate and data lines are arranged to define a plurality pixel regions in a matrix form.
- a plurality of thin film transistors are arranged at crossing portions of the gate and data lines and connected to a plurality of pixel electrodes in the plurality of pixel regions.
- the inner surface of the second substrate 6 includes a black matrix that provides shielding to the gate and data lines and the thin film transistor, a color filter located in the pixel region, and a common electrode where the black matrix and the color filter are arranged.
- the gate PCB 12 is connected to the gate lines to supply gate signals to the gate lines.
- the data PCB 14 is connected to the data lines to supply data signals to the data lines.
- the gate PCB 12 may sequentially supply On gate signals to the gate lines, which sequentially turns on the thin film transistors.
- the thin film transistors When the thin film transistors are turned on, data signals are supplied to the pixel electrodes through the data lines.
- the common electrode is supplied with a common voltage, an electric field is induced in the liquid crystal layer by a voltage difference between the pixel electrode and the common electrode.
- the alignment of the liquid crystal molecules in the liquid crystal layer changes in accordance with the intensity and direction of the induced electric field, thereby changing the light transmissivity of the LCD device.
- a backlight unit (not shown) is disposed below the liquid crystal panel 2 , to supply light to the liquid crystal panel 2 .
- the PCBs 12 , 14 are connected to the liquid crystal panel 2 through at least one TCP film 20 .
- the TCP film 20 is attached to the PCBs 12 , 24 and the liquid crystal panel 2 through first and second anisotropic conductive films (ACFs) 22 , 24 that form conductive bonding agents at both ends of the TCP film 20 .
- ACFs anisotropic conductive films
- Connection of the PCBs 12 and 14 to the liquid crystal panel 12 is conducted as follows. The steps of adhering the first ACF 22 to the PCBs 12 , 14 and attaching the TCP 20 to the liquid crystal panel 2 with the second ACF 24 are performed separately.
- the PCBs 12 , 14 are attached to the TCP 20 , which was previously attached to the liquid crystal panel 2 , with the first ACF 22 adhered to the PCBs 12 , 14 . These attaching processes are conducted in a PCB attaching apparatus.
- a related art PCB attaching apparatus includes a first attaching portion 30 , a second attaching portion 50 and a delivery device 40 connecting the first and second attaching portions 30 , 50 .
- the first attaching portion 30 includes a loading part 32 , a first attaching part 34 , and an unloading part 36 .
- the second attaching portion 50 includes an inspection part 52 and a second attaching part 54 .
- the first attaching portion 30 further includes a PCB transfer module 60 transferring a PCB ( 12 , 14 of FIG. 1 ) in the first attaching portion 30 .
- the PCB transfer module 60 makes a trip along a moving path Land passes the loading part 32 , the first attaching part 34 , and the unloading part 36 .
- the PCB supplied to the loading part 32 is transferred to the first attaching part 34 using the PCB transfer module 60 where an ACF ( 22 of FIG. 1 ) is adhered to the PCB, then the PCB with the ACF 22 is transferred to the unloading part 36 using the PCB transfer module 60 .
- the PCB at the unloading part 36 is delivered to the inspection part 52 with a delivery device 40 such as a pickup robot.
- a delivery device 40 such as a pickup robot.
- the inspection part 52 the electrical connection between the bonded PCB and ACF are inspected.
- the PCB with the ACF is then transferred to the second attaching part 54 .
- the TCP film ( 20 of FIG. 1 ) that previously was attached to a liquid crystal panel ( 2 of FIG. 1 ) with another ACF ( 24 of FIG. 1 ) is prepared. Accordingly, the PCB is attached to the TCP film with the ACF previously adhered to the PCB.
- the second attaching portion 50 may further include another transfer module 62 that transfers the PCB from the inspection part 52 to the second attaching part 54 .
- the PCB transfer module 60 includes a pair of guide rails 70 and a transfer body 80 .
- the guide rails 70 pass though a loading part 32 , a first attaching part 34 and an unloading part 36 along the moving path (L of FIG. 2 ) of the transfer module 60 , with the transfer body 80 sliding forward and backward on the guide rails 70 .
- the transfer body 80 includes a supporter 82 that fixedly supports a plate 84 .
- the PCB is placed on the plate 84 to be transferred. Accordingly, the transfer body 80 transfers the PCB between the loading part 32 and the unloading part 36 .
- the number of the LCD devices fabricated in the second attaching portion 50 is limited by the number of cycles the transfer body 80 . Additionally, the PCB attaching process is completely stopped when the transfer body 80 is secured for repairs. In addition, the transfer module 62 of the second attaching portion 50 remains idle while the transfer body 80 transfers the PCB from the loading part 32 to the unloading part 36 via the first attaching part 34 , and also while the transfer body 80 returns to the loading part 32 without the PCB and transfers new PCB to the unloading part 36 . Therefore, efficiency of the related art PCB attaching apparatus is greatly reduced with use of the transfer module 62 of the second attaching portion 60 .
- the speed of the transfer body may be increased.
- the speed of the transfer body must be limited to maintain stability.
- multiple guide rails and multiple transfer bodies can be used.
- the multiple transfer bodies start at the same loading part 32 , return to the same unloading part 36 , and meet at the same first attaching part 34 . Accordingly, the use of multiple transfer bodies would require waiting a period of time to avoid bottlenecks at the starting point, the meeting point, and the returning point. Additionally, if the PCB attaching apparatus was provided with multiple transfer bodies would need a large installation space.
- a module for transferring a printed circuit board includes a first transfer body that is translatable along a first moving path to transfer a first printed circuit board and a second transfer body that is translatable along a second moving path to transfer a second printed circuit board.
- the second transfer body may be formed with an aperture.
- the first transfer body may be adjustable from a first orientation where the first transfer body does not fit through the aperture to a second orientation wherein the first transfer body can fit within the aperture.
- a module for transferring a PCB includes a first transfer body making around trip along a moving path to transfer a first PCB, and a second transfer body making around trip along the moving path to transfer a second PCB.
- the second transfer body has an aperture therein, wherein a height of the first transfer body is adjustable such that the first transfer body penetrates through the aperture.
- An apparatus for attaching a PCB to an object device may include a first attaching portion for attaching an ACF to each of first and second PCBs and including a plurality of parts that move along a moving direction, and a second attaching portion for attaching each of the first and second PCBs to the object device.
- the first and second transfer bodies each make a round trip along the moving path to transfer the first and second PCBs, respectively.
- the second transfer body includes an aperture therein, and the height of the first transfer body is adjustable to allow that the first transfer body to penetrate through the aperture of the second transfer body.
- a liquid crystal display device having a PCB includes a liquid crystal panel, and a TCP film attached to the liquid crystal panel, wherein the PCB is attached to the TCP film attached to the liquid crystal panel with an apparatus for attaching a PCB to an object device.
- the apparatus includes a first attaching portion for attaching an ACF to each of first and second PCBs and a plurality of parts along a moving path, a second attaching portion for attaching each of the first and second PCBs to the object device, and first and second transfer bodies that make a round trip along the moving path to transfer the first and second PCBs.
- the second transfer body includes an aperture therein, and the height of the first transfer body is adjustable to allow the first transfer body to penetrate through the tunnel space.
- FIG. 1 is a perspective view illustrating a related art liquid crystal panel connected to PCBs with TCP films.
- FIG. 2 is a block diagram illustrating a related art PCB attaching apparatus.
- FIG. 3 is a side view illustrating a related art PCB transfer module of FIG. 2 .
- FIG. 4 is a block diagram illustrating a PCB attaching apparatus according to an embodiment of the present invention.
- FIG. 5 is a side view illustrating the PCB transfer module of FIG. 4 .
- FIG. 6A is a perspective view of the PCB transfer module of FIG. 5 in a first position.
- FIG. 6B is a perspective view of the PCB transfer module of FIG. 5 in a second position.
- FIG. 6C is a perspective view of the PCB transfer module of FIG. 5 in a third position.
- a printed circuit board (PCB) attaching apparatus includes first attaching portion 110 , a second attaching portion 130 , and a delivery device 120 connecting the first and second attaching portions 110 and 130 .
- the PCB used with this design may be a PCB used with a liquid crystal display (LCD) device.
- LCD liquid crystal display
- the first attaching portion 110 includes a loading part 112 , a first attaching part 114 , an inspection part 116 , an unloading part 118 , and a PCB transfer module 140 .
- the PCB transfer module 140 includes first and second transfer bodies 150 and 160 that each make round trips along a moving path L, while sequentially passing the loading part 112 , the first attaching part 114 , the inspection part 116 , and the unloading part 118 .
- a PCB is loaded on each transfer body 150 and 160 at the loading part 112 from outside of the system described here.
- the first attaching part 114 attaches an anisotropic conductive film (ACF) to the PCB transferred from the loading part 112 .
- the inspection part 116 inspects the electric connections and the alignment of the ACF attached to the PCB.
- the inspected PCB having the ACF is unloaded from each transfer body 150 and 160 at the unloading part 118 with the delivery device 120 .
- the delivery device 120 delivers the PCB from the unloading part 118 to the second attaching portion 130 and may include a pickup robot.
- the second attaching portion 130 attaches the PCB with the ACF to a target object, for example, a liquid crystal panel where a tape carrier packaging (TCP) film that includes another ACF is attached.
- TCP tape carrier packaging
- a process of attaching the TCP film to the liquid crystal panel is conducted separately from a process of attaching the ACF to the PCB, and then the liquid crystal panel having the TCP film is supplied to the second attaching portion 130 .
- the PCB is attached to the TCP film, which was previously attached to the liquid crystal panel, in the second attaching portion 130 to finish the process of electrically connecting the PCB to the liquid crystal panel.
- the first attaching part 114 may have a heating tool to attach the ACF to the PCB effectively.
- the inspection part 116 may have a camera and a light source to inspect the electric connection and alignment.
- the second attaching portion 130 may have another heating tool to attach the PCB to the liquid crystal panel effectively.
- the inspection part 116 is disposed in the first attaching portion 110 , in contrast to the related art PCB attaching apparatus, which is possible because the two transfer bodies 150 and 160 are used for the PCB transfer module 140 .
- the inspection part 116 is arranged in the first attaching portion 110 , and particularly between the first attaching part 114 and the unloading part 118 to increase the cycle time in the first attaching portion 110 .
- the PCB transfer module is explained in more detail with reference to FIGS. 4 through 6C .
- a pair of first guide rails 142 and a pair of second guide rails 144 are arranged along the same moving path (L of FIG. 4 ).
- the first guide rails 142 are disposed in parallel and within the second guide rails 144 .
- the first and second transfer bodies 150 , 160 are connected to the first and second guide rails 142 , 144 , respectively, and separately move forward and backward in a sliding manner along the first and second guide rails 142 , 144 .
- the first transfer body 150 is constructed to have an adjustable height, and the second transfer body 160 includes a tunnel space, or an aperture, A that provides room for the first transfer body 150 to translate through the aperture A.
- the first transfer body 150 includes a first supporter 152 that translates on the first guide rails 142 in a sliding manner and a first plate 158 fixed on the first supporter 152 that is adapted for holding the PCB thereon.
- the first supporter 152 includes a lower piece 154 contacting the first guide rails 142 and an upper piece 156 that is movable with respect to the lower piece 154 .
- An oblique fault plane 155 is disposed between the lower and upper pieces 154 , 156 such that the upper piece 156 is movable upward and downward along the oblique plane 155 . As the upper piece 156 ascends and descends along the oblique fault plane 155 , the height of the first transfer body 150 above the first guide rail 142 changes.
- the oblique fault plane 155 may be formed to cross the moving path such that the size of the aperture A can be minimized.
- upward and downward movement of the upper piece 156 causes corresponding upward and downward movement of the first plate 158 fixed on the upper piece 156 .
- a pair of linear motion guides 190 may be arranged in parallel to the oblique fault plane 155 .
- the linear motion guides 190 are fixed on the lower piece 154 and contact a lower surface of the oblique fault plane 155 and obliquely extended outside the plane 155 . Accordingly, the upper piece 156 is effectively movable upward and downward along the linear motion guides 190 . Therefore, by using the linear motion guides 190 , the height of the first transfer body 150 can be precisely adjusted.
- the second transfer body 160 includes a second supporter 162 that translates along the second guide rails 144 in a sliding manner and a second plate 168 fixed on the second supporter 162 that is adapted for holding the PCB thereon.
- the second supporter 162 includes two pieces that each contact one of the second guide rails 144 .
- the second supporter 162 having the two pieces and the second plate 168 defines the aperture A.
- the first plate 158 When the first transfer body 150 is arranged in a first orientation with the greatest height, the first plate 158 has substantially has the same position as the second plate 168 . Therefore, the first and second plates 158 , 168 can effectively share the loading part 112 , the first attaching part 114 , the inspection part 116 , and the unloading part 118 .
- the plate 158 When the first transfer body 150 is arranged with the lowest height, the plate 158 is lower than the top of aperture A, which allows the first transfer body 150 to penetrate through the aperture A.
- the height of the first transfer body 150 is adjustable by changing the angle of the oblique fault plane 155 and the length of the linear motion guides 190 .
- the first transfer body 150 is in the first orientation at the loading part 112 , when the PCB is supplied to the first plate 158 .
- the first transfer body 150 then translates along the first guide rails 142 toward the unloading part 118 by way of the first attaching part 114 and the inspection part 116 .
- the first transfer body 150 meets the second transfer body 160 that moves at regular intervals with the first transfer body 150 .
- the first and second transfer bodies 150 , 160 may move along their respective rails 142 , 144 with the same constant speed so that the first and second transfer bodies 150 , 160 meet each other at regular and consistent intervals. Additionally, to conduct the processes stably, the first and second transfer bodies 150 , 160 may meet between different stations, or parts, 112 , 114 , 116 and 118 of the first attaching portion 110 to avoid motion of the first transfer body 150 at one of these stations.
- the upper piece 156 ascends along the oblique fault plane 155 until the first transfer body 150 returns to the first orientation and becomes substantially the same height as the second transfer body 160 .
- the first transfer body 150 arrives at the unloading part 118 and the PCB on the first transfer body 150 is delivered by the delivery device 120 .
- a PCB may be loaded on each of the first and second transfer bodies 150 and 160 at the loading part 112 .
- the first and second transfer bodies 150 , 160 have the PCB loaded thereon at regular intervals.
- Each of the first and second transfer bodies 150 , 160 then transfers the PCB sequentially to the first attaching part 114 , which attaches the ACF to the PCB, then to the inspection part 116 , which inspects the attached ACF and PCB, and then to the unloading part 118 , which delivers the inspected ACF and PCB.
- the upper piece 156 of the first transfer body 150 descends toward the second orientation and penetrates the second transfer body 160 , as explained above.
- the delivery device 120 removes the PCBs from the first and second transfer bodies 150 , 160 to the second attaching portion 130 .
- Each of the first and second transfer bodies 150 , 160 then returns to the loading part 112 and repeats the process discussed above. Meanwhile, the PCB delivered to the second attaching part 130 is attached to the TCP film that was previously attached to the liquid crystal panel.
- the PCBs transferred by the first and second transfer bodies 150 and 160 may be the same type PCBs or the different type PCBs.
- the first and second transfer bodies 150 and 160 transfer the gate and data PCBs ( 12 and 14 of FIG. 1 ), respectively.
- a backlight unit is arranged below the liquid crystal panel and the liquid crystal panel and the backlight unit are combined using modular members to fabricate the liquid crystal display module.
- the modular members include a main support bracket that surrounds peripheral portions of the liquid crystal panel and the backlight unit, a bottom cover that may cover the bottom surface of the backlight unit and in combination with the main support bracket, and a top cover surrounding peripheral portions of a top surface of the liquid crystal panel.
- the PCB attaching apparatus can have high attaching efficiency and thus can improve the overall production efficiency of the LCD device.
- the two transfer bodies may transfer the PCBs without waiting time, and thus the number of the PCBs that can be processed can be about two times more than the related art.
- the number of the PCBs transferred is increased, while the burden on the second attaching portion 130 can be reduced, which increases overall productivity of the overall process. Therefore, the PCB attaching efficiency and the production efficiency of the LCD device can be improved greatly.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2005-0046744 | 2005-06-01 | ||
KR1020050046744A KR100971946B1 (en) | 2005-06-01 | 2005-06-01 | PCB transfer module, PCB connecting system, PCB connecting method and manufacturing method liquid crystal display device using thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060285946A1 US20060285946A1 (en) | 2006-12-21 |
US7463493B2 true US7463493B2 (en) | 2008-12-09 |
Family
ID=37573506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/304,014 Expired - Fee Related US7463493B2 (en) | 2005-06-01 | 2005-12-14 | Module for transferring PCB, apparatus for attaching PCB and liquid crystal display device including PCB |
Country Status (2)
Country | Link |
---|---|
US (1) | US7463493B2 (en) |
KR (1) | KR100971946B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080003084A1 (en) * | 2006-06-30 | 2008-01-03 | Behnke Merlin E | High speed tray transfer system |
US20170113878A1 (en) * | 2015-10-27 | 2017-04-27 | Panasonic Intellectual Property Management Co., Ltd. | Tray supplier and tray supply method |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100958323B1 (en) * | 2008-10-07 | 2010-05-17 | (주)에이에스티 | Bonding apparatus |
DE102011105888A1 (en) * | 2011-06-28 | 2013-01-03 | Markus Fritsch | Assembly table of placement machine used for mounting flexible printed circuit board of e.g. electronic component, has table top portions that are guided relative to table substructure in feed direction of printed circuit board web |
CN105217340B (en) * | 2015-10-10 | 2017-05-17 | 江苏比微曼智能科技有限公司 | Automatic feeding and bonding device |
KR102152206B1 (en) | 2019-11-14 | 2020-09-04 | 주식회사 미래티이씨 | Transfer Device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087839A (en) * | 1997-03-13 | 2000-07-11 | Samsung Electronics Co., Ltd. | Apparatus for testing printed circuit board |
US20020000359A1 (en) * | 1996-11-27 | 2002-01-03 | Fuji Machine Mfg. Co., Ltd. | Circuit-substrate-related-operation performing system |
US6374484B1 (en) * | 1997-08-29 | 2002-04-23 | Matsushita Electric Industrial Co., Ltd. | Parts mounting method and apparatus |
US6701611B1 (en) * | 1999-04-21 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus operable to mount electronic components onto a mount object |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05338783A (en) * | 1992-06-08 | 1993-12-21 | Matsushita Electric Ind Co Ltd | Circuit board carrying device |
JPH07312500A (en) * | 1994-05-18 | 1995-11-28 | Sony Corp | Method and apparatus for transferring printed board |
JP2000269684A (en) * | 1999-03-16 | 2000-09-29 | Ricoh Co Ltd | Parts feeder |
-
2005
- 2005-06-01 KR KR1020050046744A patent/KR100971946B1/en active IP Right Grant
- 2005-12-14 US US11/304,014 patent/US7463493B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020000359A1 (en) * | 1996-11-27 | 2002-01-03 | Fuji Machine Mfg. Co., Ltd. | Circuit-substrate-related-operation performing system |
US6087839A (en) * | 1997-03-13 | 2000-07-11 | Samsung Electronics Co., Ltd. | Apparatus for testing printed circuit board |
US6374484B1 (en) * | 1997-08-29 | 2002-04-23 | Matsushita Electric Industrial Co., Ltd. | Parts mounting method and apparatus |
US6701611B1 (en) * | 1999-04-21 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus operable to mount electronic components onto a mount object |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080003084A1 (en) * | 2006-06-30 | 2008-01-03 | Behnke Merlin E | High speed tray transfer system |
US20170113878A1 (en) * | 2015-10-27 | 2017-04-27 | Panasonic Intellectual Property Management Co., Ltd. | Tray supplier and tray supply method |
US10562712B2 (en) * | 2015-10-27 | 2020-02-18 | Panasonic Intellectual Property Management Co., Ltd. | Tray supplier and tray supply method |
Also Published As
Publication number | Publication date |
---|---|
KR20060124997A (en) | 2006-12-06 |
US20060285946A1 (en) | 2006-12-21 |
KR100971946B1 (en) | 2010-07-23 |
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