US6281432B1 - Sheet metal component with depression - Google Patents
Sheet metal component with depression Download PDFInfo
- Publication number
- US6281432B1 US6281432B1 US09/318,167 US31816799A US6281432B1 US 6281432 B1 US6281432 B1 US 6281432B1 US 31816799 A US31816799 A US 31816799A US 6281432 B1 US6281432 B1 US 6281432B1
- Authority
- US
- United States
- Prior art keywords
- webs
- holes
- metal
- metal section
- metal element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to metal components and more particularly to electronic device housings made of sheet metal and sheet and support elements used for electronic devices, especially used for electronic devices operating at high frequencies.
- Support structures and housings made for electronic components are often made of sheet metal.
- the sheet metal structures can include support elements, housings as well as shielding elements, e.g. elements provided to shield various devices as to electromagnetic emissions that cause electromagnetic interference (EMI).
- EMI electromagnetic interference
- Sealing elements are often used for forming an electromagnetic shield. Such sealing elements are typically used at the interfaces between components. This may be for example where a sheet metal component joins with another sheet metal component or where a sheet metal component joins with some other element, including a circuit board. At these interfaces, various different sealing elements may be provided. Other similar elements which function to limit electromagnetic interference problems may also be provided to form an EMI barrier or shield.
- depressions and grooves may be provided. This is for example to provide a seat for the shield. Besides locating the shield, the depression provides additional space for the shield. Providing depressions in the sheet metal will however reduce space on the opposite side of the depression. This is problematic for various reasons. Such a depression will limit the space adjacent to the depression, at the opposite side of the sealing element.
- a process is provided providing a metal sheet element and removing portions of the sheet metal at a series of locations in a section of the sheet metal element. By removing portions a plurality of webs are provided separating the holes. The webs are subsequently pressed to allow the webs to expand into the region of the holes and to form a depressed region based on the depressed surfaces of each of the webs relative to the surrounding web sheet.
- the portions are preferably removed in a series along a section. After the webs are subsequently pressed this can form for example a groove or other depressed region. A gasket element or other device for limiting electromagnetic interference is subsequently provided in the depressed region.
- the holes may advantageously be formed using a punch press.
- a metal element is provided with a section including a first surface and a second surface.
- Plurality of holes are formed in the metal section extending through the metal section from the first surface to the second surface.
- the holes to define a series of webs separating the holes.
- the webs have a second surface at a level of the second surface of the metal element and the webs have a first surface which is depressed relative to the first surface of the metal surface by pressing the webs and allowing the webs to expand into the region of the holes to form a depressed region.
- the invention also relates to a system using a metal element as noted above wherein a gasket is positioned in the depressed region and an additional element for the surface is placed in close proximity with the first surface of the metal element.
- the gasket is provided in contact with the additional element to limit the electromagnetic interference from outside of the connection between the metal element and the additional element and from inside to the outside, effectively providing an EMI barrier.
- the gasket includes a conductive fabric or other conductive surface of a resilient body.
- sheet metal is used which may be for example have a thickness in the range of 0.048 in.
- the holes may advantageously be punched to have a width (HW) of for example 0.180 inch. This is advantageous as to the use of commercially available electromagnetic interference strips.
- the length (HL) of the hole may advantageously be 0.125 inch. This allows for various sized webs (W) including for example webs of from 0.075 to 0.080 inch. After the pressing of the webs, the surface of the webs is depressed from the surface of the metal element by e.g. 0.030 inch ⁇ 0.003/.000.
- the process is particularly advantageous for forming enclosures such as enclosures for local area network devices, communications devices, telephonic systems, etcetera.
- the process may be advantageously used to join two sheet metal elements to form either a housing or some other support. Additionally, the process may be employed with a sheet metal piece joined to a circuit board or some other element, e.g. plastic as well as plastic and a mixture of some other materials.
- FIG. 1 is a perspective view of a sheet metal element with a plurality of holes punched in a section of the sheet;
- FIG. 2 is a cross-sectional view of FIG. 1 taken along line 2 — 2 of FIG. 1;
- FIG. 3 is a perspective view of a sheet metal element after a coining step which forms strips of metal having an upper surface level which is lower (depressed) relative to the sheet surface at the same side;
- FIG. 4 is a cross-sectional view taken along line 4 — 4 of FIG. 3;
- FIG. 5 is a cross-sectional view showing a system forming an EMI barrier according to the invention.
- the invention comprises a method of providing a depressed section in an element such as a metal element and more particularly a sheet metal element generally designated 10 .
- the sheet metal element 10 may be of various different types but can be for example sheet steel of about 0.048 in. thick.
- the sheet metal element is suitably bent to form the finished shape.
- the finished element may be part of a housing or the finished element may function as a support piece. Most advantageously, according to the invention, the finished element forms part of a housing of an electronic device operating at high frequencies (for example up to or above 100 MHz).
- the metal element may also be a support structure for an electronic device. For example, the metal element may be used as part of a card received in the slot of the housing.
- a plurality of holes 12 are punched in the sheet metal piece.
- a standard punch press may be used or other suitable device for forming the holes.
- the holes are provided in a section of the metal element which section is to be used for electromagnetic sealing or shielding.
- the section may be for example a straight line, a curved line or the section may form lines at an angle (a corner). Such a section may be provided along a sealing edge.
- the section may also be in other shapes.
- FIG. 1 shows the series of holes 12 and the series of webs 14 .
- FIG. 2 shows one hole 12 , based on the cross-sectional view taken along line 2 — 2 of FIG. 1 .
- the sheet metal element 10 it is advantageous to form the holes or openings 12 to have a length dimension (along the direction of the series of holes) of 0.125 inch and to provide a width of 0.180 inch. Although these dimensions are advantageous, other dimensions are possible. It is also advantageous to provide the webs 14 to have a width of 0.075 to 0.080 inch.
- the process provides that the web elements 14 are subsequently subjected to a coining process.
- the webs which are relatively narrow, are pressed (compressed or coined).
- the compressing action is provided such that it does not allow the surface 16 of the web 14 to move relative to the adjacent surface 18 of the remaining element 10 .
- the surface 20 of the webs is depressed relative to the adjacent surface 22 of the metal element 10 .
- This depressed surface 20 is shown in FIG. 3 .
- the depressed surface 20 is depressed relative to surface 22 of the metal element 10 by e.g. 0.030 inch+0.003 inch ⁇ 0.000 inch.
- the coining or pressing process forces the material of the narrow webs to expand into the region of the punched holes.
- FIG. 5 shows a reduced electromagnetic emissions assembly system including the sheet metal element 10 with a depressed channel section 24 formed as discussed above. This provides a mounting seat for an EMI gasket 26 . Another element 28 is suitably connected to form a reduced EMI system. In the reduced EMI system the gasket 26 is seated in the depressed channel section 24 sandwiched between the sheet metal element 10 and the adjacent element 28 . This provides a suitable EMI barrier.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/318,167 US6281432B1 (en) | 1999-05-25 | 1999-05-25 | Sheet metal component with depression |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/318,167 US6281432B1 (en) | 1999-05-25 | 1999-05-25 | Sheet metal component with depression |
Publications (1)
Publication Number | Publication Date |
---|---|
US6281432B1 true US6281432B1 (en) | 2001-08-28 |
Family
ID=23236962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/318,167 Expired - Lifetime US6281432B1 (en) | 1999-05-25 | 1999-05-25 | Sheet metal component with depression |
Country Status (1)
Country | Link |
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US (1) | US6281432B1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717791A (en) * | 1986-07-09 | 1988-01-05 | Tektronix, Inc. | Shield structure for limiting transmission of electromagnetic radiation |
EP0467399A1 (en) * | 1990-07-20 | 1992-01-22 | SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG | Sealing strip for low and high frequency impermeable connection of screwed shielding elements |
JPH04116900A (en) * | 1990-09-07 | 1992-04-17 | Fujitsu Ltd | Shielding structure of molded resin case |
US5161997A (en) * | 1991-10-11 | 1992-11-10 | Amp Incorporated | Hardwareless panel retention for shielded connector |
US5656380A (en) * | 1995-03-20 | 1997-08-12 | General Electric Company | Superconductive article and method of making |
-
1999
- 1999-05-25 US US09/318,167 patent/US6281432B1/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4717791A (en) * | 1986-07-09 | 1988-01-05 | Tektronix, Inc. | Shield structure for limiting transmission of electromagnetic radiation |
EP0467399A1 (en) * | 1990-07-20 | 1992-01-22 | SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG | Sealing strip for low and high frequency impermeable connection of screwed shielding elements |
JPH04116900A (en) * | 1990-09-07 | 1992-04-17 | Fujitsu Ltd | Shielding structure of molded resin case |
US5161997A (en) * | 1991-10-11 | 1992-11-10 | Amp Incorporated | Hardwareless panel retention for shielded connector |
US5656380A (en) * | 1995-03-20 | 1997-08-12 | General Electric Company | Superconductive article and method of making |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: 3COM CORPORATION, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LAUT, MARVIN;REEL/FRAME:010002/0010 Effective date: 19990518 |
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STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
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FPAY | Fee payment |
Year of fee payment: 4 |
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FEPP | Fee payment procedure |
Free format text: PAYER NUMBER DE-ASSIGNED (ORIGINAL EVENT CODE: RMPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
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FPAY | Fee payment |
Year of fee payment: 8 |
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AS | Assignment |
Owner name: HEWLETT-PACKARD COMPANY, CALIFORNIA Free format text: MERGER;ASSIGNOR:3COM CORPORATION;REEL/FRAME:024630/0820 Effective date: 20100428 |
|
AS | Assignment |
Owner name: HEWLETT-PACKARD COMPANY, CALIFORNIA Free format text: CORRECTIVE ASSIGNMENT TO CORRECT THE SEE ATTACHED;ASSIGNOR:3COM CORPORATION;REEL/FRAME:025039/0844 Effective date: 20100428 |
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AS | Assignment |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HEWLETT-PACKARD COMPANY;REEL/FRAME:027329/0044 Effective date: 20030131 |
|
AS | Assignment |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., TEXAS Free format text: CORRECTIVE ASSIGNMENT PREVIUOSLY RECORDED ON REEL 027329 FRAME 0001 AND 0044;ASSIGNOR:HEWLETT-PACKARD COMPANY;REEL/FRAME:028911/0846 Effective date: 20111010 |
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FPAY | Fee payment |
Year of fee payment: 12 |
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SULP | Surcharge for late payment |
Year of fee payment: 11 |
|
AS | Assignment |
Owner name: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, TEXAS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;REEL/FRAME:037079/0001 Effective date: 20151027 |