US5720919A - Al2 O3 and Y2 O3 containing silicon nitride having high mechanical strength at high temperatures - Google Patents
Al2 O3 and Y2 O3 containing silicon nitride having high mechanical strength at high temperatures Download PDFInfo
- Publication number
- US5720919A US5720919A US08/459,407 US45940795A US5720919A US 5720919 A US5720919 A US 5720919A US 45940795 A US45940795 A US 45940795A US 5720919 A US5720919 A US 5720919A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
- C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
- C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
- C04B35/593—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering
- C04B35/5935—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering obtained by gas pressure sintering
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/77—Density
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
Definitions
- the present invention relates to shaped parts of sintered silicon nitride ceramic which have high strength both at room temperature and at high temperatures and which contain Si 3 N 4 in the crystalline phases of the ⁇ and/or ⁇ forms.
- Silicon nitride and components produced therefrom by sintering have already been described in numerous publications. From JP-A-59/18165 it is known, for example, that a mixture of Si 3 N 4 with Y2O 3 and Al 2 O 3 in a weight ratio of 94 to 3 to 3 can be sintered under gas pressure at temperatures above 1900° C. and that high strengths at room temperature can thus be achieved.
- the weight ratio of Y 2 O 3 to Al 2 O 3 according to this publication is 1; however, in the case of production via a two-stage pressure sintering cycle at very high temperatures between 1900° and 1950° C. in combination with a very long sintering time of a total of 4 hours, this leads however to a microstructure which is too coarse in respect of its crystallite size to still be suitable for specific applications in high performance technology.
- EP-A-197 548 discloses that from 0.5 to 4% by weight of Al 2 O 3 and from 4 to 8% by weight of Y 2 O 3 can be used as additives to silicon nitride without needing to adhere to a particular weight ratio of the two additives. According to this publication, however, only from 85 to 97% of the theoretically possible density is achieved in the shaped parts.
- HfO 2 as an additive in silicon nitride is known from a further Japanese publication JP-A-31/53574. According to this publication, however, the HfO 2 combines with yttrium to give Y 2 Hf 2 O 7 .
- shaped parts of the generic type mentioned in the introduction comprise at least 87% by weight of silicon nitride and up to 13% by weight of an additive combination of Al 2 O 3 and Y 2 O 3 , the Y 2 O 3 /Al 2 O 3 weight ratio being in the range of from 1.1 to 3.4, that they additionally contain from 0 to 1.0% by weight of HfO 2 and/or ZrO 2 , that the shaped parts have a density of greater than 98% of the theoretically possible density and that they have a flexural strength of >850 MPa at room temperature and of ⁇ 800 MPa at a temperature of 800° C.
- shaped parts of Si 3 N 4 ceramic having relatively high Al 2 O 3 contents can be produced without the glass phase crystallizing out and have good strength both at room temperature and also at elevated service temperatures with a simultaneously high fracture toughness.
- this is achieved by components of HfO 2 and/or ZrO 2 in the amorphous phase and/or the setting of suitable Y 2 O 3 /Al 2 O 3 ratios.
- the materials dissolved in the amorphous phase raise the transition temperature T G of the amorphous phase and/or its viscosity-temperature behavior above T G is favorably affected in the direction of higher strengths of the shaped parts at high temperatures.
- the microstructure of a Si 3 N 4 ceramic is made up of rod-shaped Si 3 N 4 crystals and the grain boundary phase.
- the crystals are normally present in a disordered, purely random arrangement which is described as isotropic microstructure.
- test pieces are ground, etched and then optically examined with a scanning electron microscope to produce photographs at magnifications of 5000 and 10,000. The photographs are then evaluated semi-automatically.
- For each test piece about 800 to 1500 grains must be evaluated, in each case the longest diagonal of a grain being defined as the grain length L and the shortest diagonal being defined as the grain width W.
- the aspect ratio A is the ratio of L to W.
- To determine the aspect ratio at least 40 grains per test piece having grain edges as close to parallel as possible and grain lengths as long as possible are selected, so as to level out the influence of the sectioning effect.
- the shaped parts of the invention preferably possess a microstructure which has a fine grain arrangement of silicon nitride having more than 3 ⁇ 10 6 grains/mm 2 with an average width of the silicon nitride crystallites of less than 0.4 ⁇ m, a maximum grain width of at most 2 ⁇ m and an aspect ratio of greater than 8 within a finely divided amorphous phase, the amorphous grain boundary phase between the Si 3 N 4 grains being no thicker than 0.1 ⁇ m.
- the fracture toughness K IC of the shaped parts of the invention is preferably greater than 9 MPa ⁇ m, their mechanical flexural breaking strength (4 point bend test in accordance with DIN 51 110) at room temperature is greater than 950 MPa and their mechanical flexural breaking strength above 800° C. is greater than 800 MPa. Because of the high sintered bulk density of ⁇ 98% of the theoretically possible density the modulus of elasticity is in the range of from 290 to 320 GPa. With the relatively low coefficient of thermal expansion of 3.1 ⁇ 10 -6 /K and a thermal conductivity of 20 W/m ⁇ K the shaped parts of the invention possess good thermal shock resistance, quantified by a critical temperature difference of ⁇ 800 K.
- the components of the invention are particularly suitable for use in machine and plant construction and as valves in combustion engines for automobiles.
- a mixture of Si 3 N 4 having a specific surface area of from 2 to 15 m 2 /g, an O 2 content of ⁇ 1.5% by weight and a proportion of ⁇ form of ⁇ 2% by volume with finely divided Y 2 O 3 , Al 2 O 3 or HfO 2 and/or ZrO 2 is first prepared.
- the total additive content should, according to the invention, be between 5 and 13% by weight, based on the total weight of the mixture. In particular, the additive content should be in the range of from 8 to 10% by weight.
- the mixture is then mixed and milled in a liquid dispersion medium (water or organic solvent) and the suspension so produced is dried and agglomerated in, for example, a spray dryer.
- a liquid dispersion medium water or organic solvent
- the agglomerated material obtained is then made into shaped parts by pressing, injection molding or redispersing and casting and then sintering under gas pressure at temperatures between 1725° and 1850° C. and at N 2 pressures between 2 and 8 MPa over a period of up to 2 h.
- These mixtures were intensively mixed and milled in batches of 400 g in an agitated ball mill using Al 2 O 3 milling media and isopropanol as dispersion medium for a period of 2 h.
- the suspension was dried in a rotary evaporator and subsequently sieved through a sieve having a mesh size of 250 ⁇ m.
- the powders were subsequently isostatically pressed at 300 MPa to give compacts.
- Example 1 sintering was carried out without pressure in a 0.1 MPa N 2 atmosphere by raising the temperature to 1800° C. over a period of one hour, maintaining it at this value for one hour and then cooling back down to room temperature over a further three hours.
- Example 2 sintering was carried out under a gas pressure of 2 MPa over a period of 30 min.
- the results of Examples 1 and 2 are shown in Table 1.
- the use of gas pressure has improved the high-temperature strengths.
- Example 4 Sufficiently good compaction was obtained only in Examples 4 and 2, with Example 4 corresponding to the invention and being distinguished from Example 2 (comparative example according to the prior art as described by Boberski et al., Mechanical Properties of Gas Pressure Sintered Silicon Nitride, in Proceedings of 4th internat. Symp. of Ceramic Material and Components for Engines, Goteborg 1991) by the total additive content being reduced and the Y 2 O 3 :Al 2 O 3 ratio being lowered to 2.
- the flexural breaking strength of the sample in Example 4 is 800 MPa at 1000° C. Furthermore, these samples have a high K IC value of 10.5 ⁇ m MPa.
- the individual features of the structure are shown in Table 2.
- Example 3 Sufficiently good compaction was not achieved in Example 6; this means that with the selected compositions and gas-pressure sintering conditions sufficient compaction to guarantee good strength could not be achieved. For the low additive content of 6% by weight, therefore, other compaction conditions must be selected.
- HfO 2 Example 7 with a somewhat increased total additive content has led to both excellent compaction and to very good high-temperature properties and gave 869 MPa at 1000° C.
- the sample was also distinguished by the Si 3 N 4 being present in both the ⁇ and the ⁇ forms.
- HfO 2 is present in solution in the glass phase, since no hafnium-containing crystalline phase in addition to Si 3 N 4 could be indentified in the X-ray diffraction spectrum.
- the addition of ZrO 2 (Example 8) also leads to good high-temperature properties.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/459,407 US5720919A (en) | 1992-12-23 | 1995-06-02 | Al2 O3 and Y2 O3 containing silicon nitride having high mechanical strength at high temperatures |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4243743.1 | 1992-12-23 | ||
DE4243743 | 1992-12-23 | ||
US17092193A | 1993-12-21 | 1993-12-21 | |
US08/459,407 US5720919A (en) | 1992-12-23 | 1995-06-02 | Al2 O3 and Y2 O3 containing silicon nitride having high mechanical strength at high temperatures |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/534,059 Division US5556815A (en) | 1992-12-23 | 1995-09-26 | High temperature resistant silicon nitride ceramic |
Publications (1)
Publication Number | Publication Date |
---|---|
US5720919A true US5720919A (en) | 1998-02-24 |
Family
ID=6476309
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/459,407 Expired - Fee Related US5720919A (en) | 1992-12-23 | 1995-06-02 | Al2 O3 and Y2 O3 containing silicon nitride having high mechanical strength at high temperatures |
US08/534,059 Expired - Fee Related US5556815A (en) | 1992-12-23 | 1995-09-26 | High temperature resistant silicon nitride ceramic |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/534,059 Expired - Fee Related US5556815A (en) | 1992-12-23 | 1995-09-26 | High temperature resistant silicon nitride ceramic |
Country Status (12)
Country | Link |
---|---|
US (2) | US5720919A (es) |
EP (1) | EP0603787B1 (es) |
JP (1) | JPH06219839A (es) |
KR (1) | KR940014258A (es) |
AT (1) | ATE164371T1 (es) |
BR (1) | BR9305200A (es) |
CZ (1) | CZ285130B6 (es) |
DE (1) | DE59308305D1 (es) |
DK (1) | DK0603787T3 (es) |
ES (1) | ES2116395T3 (es) |
MX (1) | MX9400078A (es) |
TW (1) | TW267997B (es) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5902761A (en) * | 1996-03-29 | 1999-05-11 | Kyocera Corporation | Ceramic granules, process for preparing the same, and process for producing sintered product of silicon nitride |
US20110272187A1 (en) * | 2009-01-13 | 2011-11-10 | Hitachi Metals, Ltd. | Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module |
CN108046808A (zh) * | 2018-01-05 | 2018-05-18 | 广东工业大学 | 一种Si3N4梯度材料及其制备方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2124093C (en) * | 1994-03-31 | 2001-04-17 | Prasad S. Apte | Microwave sintering process |
JP2723170B2 (ja) * | 1994-06-30 | 1998-03-09 | 科学技術庁無機材質研究所長 | 超塑性窒化ケイ素焼結体 |
JP3624225B2 (ja) * | 1994-10-04 | 2005-03-02 | 独立行政法人産業技術総合研究所 | 窒化ケイ素系又はサイアロン系のセラミックス及びその成形法 |
JPH0925171A (ja) * | 1995-07-11 | 1997-01-28 | Ngk Insulators Ltd | 成形用造粒粉体及びその製造方法並びに当該粉体を用いて作製された窒化珪素焼結体 |
DE19748225A1 (de) * | 1997-10-31 | 1999-05-06 | Ceramtec Ag | Siliciumnitridkeramik mit hoher mechanischer Festigkeit bei Raum- und erhöhter Temperatur |
JP4070417B2 (ja) * | 2000-03-31 | 2008-04-02 | 日本特殊陶業株式会社 | 窒化珪素質部材及びその製造方法並びに切削工具 |
US7695521B2 (en) | 2001-05-01 | 2010-04-13 | Amedica Corporation | Hip prosthesis with monoblock ceramic acetabular cup |
US7776085B2 (en) | 2001-05-01 | 2010-08-17 | Amedica Corporation | Knee prosthesis with ceramic tibial component |
EP1389978B1 (en) * | 2001-05-01 | 2009-01-07 | Amedica Corporation | Radiolucent bone graft |
WO2002102275A2 (en) * | 2001-06-14 | 2002-12-27 | Amedica Corporation | Metal-ceramic composite articulation |
US6994727B2 (en) * | 2002-12-17 | 2006-02-07 | Amedica Corporation | Total disc implant |
US8252058B2 (en) | 2006-02-16 | 2012-08-28 | Amedica Corporation | Spinal implant with elliptical articulatory interface |
KR101044202B1 (ko) * | 2009-02-26 | 2011-06-29 | 순천향대학교 산학협력단 | 현탁액에 기포발생을 이용한 다공질 Si₂N₂O-Si₃N₄복합체의 제조방법 |
JP6416088B2 (ja) * | 2013-06-13 | 2018-10-31 | 株式会社東芝 | 窒化珪素製耐摩耗性部材および窒化珪素焼結体の製造方法 |
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-
1993
- 1993-12-20 DE DE59308305T patent/DE59308305D1/de not_active Expired - Fee Related
- 1993-12-20 DK DK93120517T patent/DK0603787T3/da active
- 1993-12-20 ES ES93120517T patent/ES2116395T3/es not_active Expired - Lifetime
- 1993-12-20 EP EP93120517A patent/EP0603787B1/de not_active Expired - Lifetime
- 1993-12-20 AT AT93120517T patent/ATE164371T1/de not_active IP Right Cessation
- 1993-12-21 CZ CZ932854A patent/CZ285130B6/cs not_active IP Right Cessation
- 1993-12-21 KR KR1019930028811A patent/KR940014258A/ko active IP Right Grant
- 1993-12-22 JP JP5324137A patent/JPH06219839A/ja active Pending
- 1993-12-22 BR BR9305200A patent/BR9305200A/pt not_active Application Discontinuation
-
1994
- 1994-01-03 MX MX9400078A patent/MX9400078A/es not_active IP Right Cessation
- 1994-01-10 TW TW083100152A patent/TW267997B/zh active
-
1995
- 1995-06-02 US US08/459,407 patent/US5720919A/en not_active Expired - Fee Related
- 1995-09-26 US US08/534,059 patent/US5556815A/en not_active Expired - Fee Related
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Cited By (4)
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US5902761A (en) * | 1996-03-29 | 1999-05-11 | Kyocera Corporation | Ceramic granules, process for preparing the same, and process for producing sintered product of silicon nitride |
US20110272187A1 (en) * | 2009-01-13 | 2011-11-10 | Hitachi Metals, Ltd. | Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module |
US8858865B2 (en) * | 2009-01-13 | 2014-10-14 | Hitachi Metals, Ltd. | Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module |
CN108046808A (zh) * | 2018-01-05 | 2018-05-18 | 广东工业大学 | 一种Si3N4梯度材料及其制备方法 |
Also Published As
Publication number | Publication date |
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CZ285130B6 (cs) | 1999-05-12 |
EP0603787A2 (de) | 1994-06-29 |
EP0603787A3 (de) | 1994-11-23 |
ATE164371T1 (de) | 1998-04-15 |
ES2116395T3 (es) | 1998-07-16 |
MX9400078A (es) | 1994-07-29 |
CZ285493A3 (en) | 1994-07-13 |
TW267997B (es) | 1996-01-11 |
BR9305200A (pt) | 1994-06-28 |
EP0603787B1 (de) | 1998-03-25 |
DK0603787T3 (da) | 1998-09-28 |
KR940014258A (ko) | 1994-07-18 |
DE59308305D1 (de) | 1998-04-30 |
JPH06219839A (ja) | 1994-08-09 |
US5556815A (en) | 1996-09-17 |
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