US5082740A - Plastic clad metal laminate for heat transfer partitions - Google Patents
Plastic clad metal laminate for heat transfer partitions Download PDFInfo
- Publication number
- US5082740A US5082740A US07/499,849 US49984990A US5082740A US 5082740 A US5082740 A US 5082740A US 49984990 A US49984990 A US 49984990A US 5082740 A US5082740 A US 5082740A
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- US
- United States
- Prior art keywords
- laminate according
- thermoplastic resin
- sublayer
- metal
- sulfonated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 41
- 239000002184 metal Substances 0.000 title claims abstract description 41
- 238000005192 partition Methods 0.000 title claims abstract description 21
- 229920003023 plastic Polymers 0.000 title claims abstract description 10
- 239000004033 plastic Substances 0.000 title claims abstract description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 238000006277 sulfonation reaction Methods 0.000 claims description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 8
- 150000001491 aromatic compounds Chemical class 0.000 claims description 8
- 239000004599 antimicrobial Substances 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 238000009736 wetting Methods 0.000 claims description 6
- 241000894006 Bacteria Species 0.000 claims description 4
- 230000001464 adherent effect Effects 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000006386 neutralization reaction Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 230000000845 anti-microbial effect Effects 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000008246 gaseous mixture Substances 0.000 claims 2
- 229920001519 homopolymer Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000002344 surface layer Substances 0.000 description 8
- 238000010276 construction Methods 0.000 description 6
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- AKEJUJNQAAGONA-UHFFFAOYSA-N sulfur trioxide Chemical compound O=S(=O)=O AKEJUJNQAAGONA-UHFFFAOYSA-N 0.000 description 6
- 239000002609 medium Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000012267 brine Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000000813 microbial effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000002906 microbiologic effect Effects 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 229920003300 Plexar® Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 101100386054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CYS3 gene Proteins 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002581 algistatic effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000001998 anti-microbiological effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 230000003385 bacteriostatic effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000002538 fungal effect Effects 0.000 description 1
- 230000001408 fungistatic effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000000266 injurious effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920000092 linear low density polyethylene Polymers 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 230000001647 sporostatic effect Effects 0.000 description 1
- 101150035983 str1 gene Proteins 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000005029 tin-free steel Substances 0.000 description 1
- 239000000814 tuberculostatic agent Substances 0.000 description 1
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 1
- 230000001790 virustatic effect Effects 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D21/0015—Heat and mass exchangers, e.g. with permeable walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/02—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
- F28F19/04—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/30—Iron, e.g. steel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Definitions
- the present invention relates to a plastic clad metal laminate suitable for use in forming heat transfer partitions for apparatus capable of simultaneous heat and mass transfer More particularly it relates to such a plastic clad metal laminate usefully employed in the construction of an apparatus for cooling and conditioning air used in habitable dwellings, i.e., an air conditioner.
- plastic film or metal foils are employed as a heat transfer partition in an apparatus for simultaneous heat and mass transfer, particularly one involving the movement of air in contact with such heat transfer partitions, plastic film or metal foils have proven unacceptable for use.
- metal foils usually possess insufficient resistance to corrosive effects of the brine or water employed for heat transfer means.
- Plastic films on the other hand although noncorrosive have higher heat capacities, and lower thermal conductivities compared to metals. They have proven unacceptable in through that when prepared in a suitably thin section necessary for adequate heat conduction through the heat transfer partition, the plastic has insufficient strength to resist damage or vibration due to the motion of air past the heat transfer partition.
- plastic film is difficult to form into permanent creases.
- thermoplastic resin film surfaces are hydrophobic. This fact prevents the water or brine solution from forming a continuous wetting surface on the heat transfer partition to maximize for improved heat conduction.
- this material be corrosion resistant to brine and aqueous medium.
- FIG. 1 depicts a laminate according to the invention.
- FIGS. 2 depicts in schematic form a continuous process for sulfonating a thermoplastic resin film for use in forming the thermoplastic resin layer in laminate of the present invention.
- a plastic clad, metal laminate suitable for forming into heat transfer partitions for use in apparatus for simultaneous heat and mass transfer comprising a metal substrate of a thickness of from 0.001 to 0.1 inch (0.025 to 2.5 mm) having adhered to one or both sides thereof a thermoplastic resin layer of a thickness of from 0.00001 to 0.003 inch (0.00025 to 0.050 mm) comprising one or more sublayers of one or more thermoplastic resins with one sublayer forming an exposed surface having a surface wettability as measured by ASTM D-2578 of at least 50 dyne/cm.
- the exposed sublayer surface is resistant to microbial growth.
- thermoplastic resin layer comprising: a surface sublayer, 4, and an intermediate layer, 6.
- the thermoplastic resin layer, 5, is adhered to the metal substrate, 1, by means of an adhesive, 7.
- metal substrate Any metal or metal alloy having suitable strength characteristics may be employed as the metal substrate in the present invention.
- examples include steel, aluminum, copper, bronze, etc.
- Preferred metals include steel, particularly tin-free steel and aluminum.
- the metal substrate has a thickness from 0.005 to 0.050 inch (0.025 to 0.125 mm).
- the thermoplastic resin layer is generally prepared by one of the suitable film forming processes such as the blown film or extrusion casting technique.
- suitable resins that will adhere to metals by extrusion coating or heat bonding include the well known copolymers of an ⁇ -olefin and a polar comonomer such as acrylic acid, methacrylic acid, C 1-4 esters of acrylic acid or methacrylic acid, carbon monoxide, vinyl acetate, etc.
- Additional suitable metal adherent thermoplastic resins include grafted or chemically modified olefin polymers, in particular polymers and copolymers of ethylene modified by grafting, reacting or blending with anhydride monomers or anhydride containing copolymers. Such compositions may additionally include rubbery materials.
- Such a class of compounds are commercially available under the trade name Plexar, available from Quantum Chemical.
- the thermoplastic resin layer may be comprised of single or multiple sublayers of one or more thermoplastic resins.
- the multilayered thermoplastic films are prepared according to known techniques in the art such as feed block coextrusion or other suitable technique.
- the extruded film may be drawn and oriented by bubble expansion, calendering or other known techniques.
- Multiple layer films may be prepared in order to provide an exposed surface layer having different properties such as surface wettability, abrasion resistance or toughness from the sublayer in contact with the metal substrate: to employ less expensive resins in the thermoplastic resin layer construction: to bury scrap resin in an intermediate layer that will not affect film properties.
- the use of such multilayered film construction is a preferred embodiment of the present invention.
- Resins that may be suitably employed as an exposed surface layer include the foregoing copolymers of an ⁇ -olefin and a polar comonomer and grafted or chemically modified olefin polymers as well as copolymers of vinyl aromatic monomers particularly block copolymer of vinyl aromatic monomers and conjugated diolefins, such as block copolymers of styrene and butadiene; polyesters, especially polyethylene terephthalate, and compatible blends of the foregoing resins.
- one or more intermediate layers of resins designed to achieve interlayer adhesion may be employed.
- Such intermediate layers are comprised of resins selected from the group consisting of polyethylene and ethylene copolymers (high density, low density, linear low density and ultra low density polyethylenes); copolymers of an ⁇ -olefin and a polar comonomer and grafted or chemically modified olefin polymers.
- the intermediate resin comprises a blend of the resins employed in the sublayer contacting the metal and the surface layer.
- thermoplastic resins which normally are difficultly sulfonatable may result in the formation of a surface that is more readily water wettable by incorporation therein of aromatic compounds which are easily sulfonated.
- thermoplastic resin layer By incorporating such compounds only in the sublayer that will constitute the surface layer, it is possible to reduce the quantity of sulfonating agents employed in preparing the sulfonated polymer and to contain the sulfonated agents only in the surface layer, so as not to effect metal adhesion or other properties of the thermoplastic resin layer.
- aromatic compounds that may be added, particularly to olefin resins, to provide enhanced surface wettability upon sulfonation may be inert aromatic compounds serving no other purpose in the thermoplastic resin formulation or they may be phenolic type antioxidants or aromatic dyes or coloring pigments which are coincidentally subject to sulfonation.
- phenolic antioxidants such as alkyl substituted phenolic compounds or phenolic ethers or thioethers
- pigments such as the phthalocyanine blue having a structure corresponding to the following figure are also subject to sulfonation. ##STR1##
- aromatic compounds useful for antioxidation, coloring or other purposes, but the same allow the normally poorly sulfonatable olefin polymer film to attain a satisfactory level of sulfonation.
- Sulfonation of the thermoplastic resin film in one embodiment is obtained by contacting the film, preferably predominantly on one side thereof, with sulfur trioxide, preferably gaseous sulfur trioxide.
- the process may be conducted in a batch or a continuous manner.
- the sulfur trioxide may be diluted with a suitable medium, preferably an inert volatile compound such as a chlorofluorocarbon.
- thermoplastic resin film contacted with the sulfonating agent comprises an alkenyl aromatic resin, or the aforementioned aromatic compounds
- suitable surface wettabilities can be obtained with films containing an aromatic content (monomer or additive) of from 0.050 to 10 percent based on resin weight, with a resin film exposure time of from 0.01 sec to 10 minutes at a concentration of sulfonating agent of from 1 to 10 weight percent in the atmosphere contacting the film surface.
- Any suitable technique for sulfonating the thermoplastic resin film may be employed, such as the conditions disclosed in U.S. Pat. No. 4,615,914 or 4,902,493.
- FIG. 2 wherein there is depicted a continuous film sulfonation process.
- a film of the desired thermoplastic resin from supply roll, 1 is passed by guide roller, 2, through a sulfonation chamber, 3, by the guide roller, 4, onto uptake roller 5.
- the film causes substantially complete bifurcation of the sulfonation chamber, 3.
- Sulfonating agent atmosphere is introduced on one side of the film by source 6, and dry air or inert gas is introduced at source 8, into the opposite side of the bifurcated chamber.
- the inert gas prevents substantial contact of sulfonating agent with the side of the thermoplastic resin film opposite to the sulfonating agent atmosphere.
- a neutralizing agent such as ammonia
- an antimicrobial agent may be introduced into the thermoplastic resin surface.
- this addition is simultaneous with or as a result of the neutralization process.
- the alkenyl aromatic monomer containing resin or aromatic compound is added to the thermoplastic resin forming the surface sublayer of the thermoplastic resin layer in an amount to provide from 0.5 to 10 percent by weight of sulfonated neutralized aromatic functionality.
- thermoplastic resin layer film may be first sulfonated and thereafter laminated to the metal substrate without detrimental effect to the lamination process. This allows the operator to avoid exposing the metal containing laminate to further mechanical handling and possible contact with the corrosive sulfonation environment.
- Suitable systems for laminating include the method of heat lamination in which the thermoplastic resin layer film is contacted with the surface of the heated metal substrate.
- adhesive resins may be employed to coat the substrate or thermoplastic resin layer prior to contacting with the metal substrate. Whether or not the technique of heat lamination or use of an adhesive resin is employed, it is desirable that the thermoplastic resin layer be adhered to the metal substrate by force of at least 1 to and preferably 5 pounds per lineal inch as determined according to ASTM F-88.
- Preferred plastic clad metal laminates according to the present invention possess a surface wettability of at least 55 dynes/cm.
- other suitable additives or methods may be employed to increase the surface wettability of the thermoplastic resin layers employed in the present invention.
- the use of antimicrobial agents to increase resistance to microbial growth may at the same time improve the surface wettability of the polymeric resins employed according to the present invention.
- antimicrobial agents include bacteriostatic, fungistatic, virostatic, algistatic, sporostatic, and tuberculostatic agents which may be incorporated into or coated onto the surface sublayer or entire thermoplastic resin layer. More particular examples of antimicrobiological agents are silanes, siloxanes, quaternary ammonium compounds, silicone containing quaternary ammonium compounds, etc.
- the surface sublayer of the thermoplastic resin layer substantially prevent growth of bacteria, particularly the Legionnaires bacterium.
- improved antimicrobial activity of the present invention is achieved due to the fact that the surface wettability of the polymer surface is at least 50 dyne/cm, thereby allowing thorough contact between the entire film surface containing the antimicrobial agent and the wetting medium.
- the laminate according to the present invention may be cut into any suitable size for formation into the heat transfer partitions for use in the apparatus for simultaneous and mass transfer as previously disclosed.
- the laminate is formed into a multiplicity of parallel folds so as to increase the total surface area exposed to the heat transfer medium and air or other mass being heated or cooled. Because of the metal substrate contained in the laminate of the present invention, such folding or pleating operation renders the article permanently formed into the desired folded or pleated shape having high surface area. The pleating or folding serves to give the laminate increased surface area and structural strength to resist vibration or damage by moving air or aqueous solution.
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Abstract
A water wettable corrosion resistant plastic clad metal laminate suitable for forming into heat transfer partitions for use in apparatus for simultaneous heat and mass transfer.
Description
The present invention relates to a plastic clad metal laminate suitable for use in forming heat transfer partitions for apparatus capable of simultaneous heat and mass transfer More particularly it relates to such a plastic clad metal laminate usefully employed in the construction of an apparatus for cooling and conditioning air used in habitable dwellings, i.e., an air conditioner.
In U.S. Pat. No. 4,832,115 to Walter F. Albers, et al. there is disclosed an apparatus for simultaneous heat and mass transfer In particular there is disclosed an apparatus for changing at least one selected property of two wetting substances, said apparatus comprising one or more heat transfer partitions as well as associated means for moving air, wetting means, etc. In the embodiment of the foregoing apparatus particularly adapted for use in conditioning air for habitable dwellings the aforementioned heat transfer partitions generally describe a compartment and may be subjected to heating or cooling by contacting with a heat transfer medium particularly brine or salt solution. In the aforementioned patent at column 2, lines 49-51 it is disclosed that heat transfer partitions can be made of inexpensive plastic film or metal foils.
Disadvantageously when the aforementioned plastic film or metal foils are employed as a heat transfer partition in an apparatus for simultaneous heat and mass transfer, particularly one involving the movement of air in contact with such heat transfer partitions, plastic film or metal foils have proven unacceptable for use. In particular metal foils usually possess insufficient resistance to corrosive effects of the brine or water employed for heat transfer means. Plastic films on the other hand although noncorrosive have higher heat capacities, and lower thermal conductivities compared to metals. They have proven unacceptable in through that when prepared in a suitably thin section necessary for adequate heat conduction through the heat transfer partition, the plastic has insufficient strength to resist damage or vibration due to the motion of air past the heat transfer partition. In addition, in an embodiment whereby increased surface area is provided by folding the heat transfer partition in parallel folds or pleats, plastic film is difficult to form into permanent creases.
A further difficulty with the use of inexpensive plastic film is the fact that generally insufficient heat transfer from the wetting substance results due to the fact that many thermoplastic resin film surfaces are hydrophobic. This fact prevents the water or brine solution from forming a continuous wetting surface on the heat transfer partition to maximize for improved heat conduction.
Lastly it is desirable in the construction of a suitable apparatus for simultaneous heat and mass transfer to prevent formation of microbiological growth such as fungal or bacterial growth on the heat transfer partitions. Not only does such microbial growth inhibit heat transfer through the heat transfer partition but certain microbiological organisms are also considered to be injurious to human health, such as Legionnaires Bacterium which has been found to be capable of growth in wet environments involving mist and recycling of water.
Thus it would be desirable if there were provided a material suitable for forming into heat transfer partitions for use in apparatus for simultaneous heat and mass transfer which is capable of efficient transfer of heat therethrough and is resistant to vibration or damage caused by the motion of air or liquid at high velocity, which additionally is easily fabricated or formed into pleated or folded sections having increased surface area for contact with the moving air or liquid heat transfer medium.
In addition it would be desirable if there were provided a material suitable for forming into heat transfer partitions that has a surface wettability to achieve rapid and thorough dispersion of aqueous heat transfer solutions or water in order to achieve efficient heat transfer.
Finally it would be highly desirable that this material be corrosion resistant to brine and aqueous medium.
FIG. 1 depicts a laminate according to the invention.
FIGS. 2 depicts in schematic form a continuous process for sulfonating a thermoplastic resin film for use in forming the thermoplastic resin layer in laminate of the present invention.
According to the present invention there is provided a plastic clad, metal laminate suitable for forming into heat transfer partitions for use in apparatus for simultaneous heat and mass transfer, said laminate comprising a metal substrate of a thickness of from 0.001 to 0.1 inch (0.025 to 2.5 mm) having adhered to one or both sides thereof a thermoplastic resin layer of a thickness of from 0.00001 to 0.003 inch (0.00025 to 0.050 mm) comprising one or more sublayers of one or more thermoplastic resins with one sublayer forming an exposed surface having a surface wettability as measured by ASTM D-2578 of at least 50 dyne/cm.
In a further embodiment of the present invention the exposed sublayer surface is resistant to microbial growth.
The construction and method of use of the apparatus for simultaneous heat and mass transfer are fully disclosed in U.S. Pat. Nos. 4,832,115, 3,860,492, and 4,363,703, the teachings of which are herein incorporated in their entirety by reference thereto. Such apparatus have attained energy savings of 50 percent or more compared to similar apparatus employing compressors and also employing chlorofluorocarbon refrigerants. Accordingly it is projected that such apparatus may become of increased commercial importance as such efficiencies in energy utilization and avoidance of chlorofluorocarbon refrigerants are fully realized.
The construction of the present invention in one embodiment is readily illustrated by reference to FIG. 1 wherein an edge view of a section of laminate is illustrated. Depicted are the metal substrate, 1, having adhered to one major surface thereof thermoplastic resin layer, 2, comprising sublayers, 3 and 4 wherein 4 is a surface sublayer and 3 is a suitable thermoplastic adhesive for lamination of the thermoplastic resin layer, 2, to the metal substrate. On the remaining surface of the metal substrate, 1, there is adhered thermoplastic resin layer, 5, comprising: a surface sublayer, 4, and an intermediate layer, 6. The thermoplastic resin layer, 5, is adhered to the metal substrate, 1, by means of an adhesive, 7.
Any metal or metal alloy having suitable strength characteristics may be employed as the metal substrate in the present invention. Examples include steel, aluminum, copper, bronze, etc. Preferred metals include steel, particularly tin-free steel and aluminum. Most preferably the metal substrate has a thickness from 0.005 to 0.050 inch (0.025 to 0.125 mm).
The thermoplastic resin layer is generally prepared by one of the suitable film forming processes such as the blown film or extrusion casting technique. Suitable resins that will adhere to metals by extrusion coating or heat bonding include the well known copolymers of an α-olefin and a polar comonomer such as acrylic acid, methacrylic acid, C1-4 esters of acrylic acid or methacrylic acid, carbon monoxide, vinyl acetate, etc. Additional suitable metal adherent thermoplastic resins include grafted or chemically modified olefin polymers, in particular polymers and copolymers of ethylene modified by grafting, reacting or blending with anhydride monomers or anhydride containing copolymers. Such compositions may additionally include rubbery materials. Such a class of compounds are commercially available under the trade name Plexar, available from Quantum Chemical.
The thermoplastic resin layer may be comprised of single or multiple sublayers of one or more thermoplastic resins. The multilayered thermoplastic films are prepared according to known techniques in the art such as feed block coextrusion or other suitable technique. The extruded film may be drawn and oriented by bubble expansion, calendering or other known techniques. Multiple layer films may be prepared in order to provide an exposed surface layer having different properties such as surface wettability, abrasion resistance or toughness from the sublayer in contact with the metal substrate: to employ less expensive resins in the thermoplastic resin layer construction: to bury scrap resin in an intermediate layer that will not affect film properties. The use of such multilayered film construction is a preferred embodiment of the present invention.
Resins that may be suitably employed as an exposed surface layer include the foregoing copolymers of an α-olefin and a polar comonomer and grafted or chemically modified olefin polymers as well as copolymers of vinyl aromatic monomers particularly block copolymer of vinyl aromatic monomers and conjugated diolefins, such as block copolymers of styrene and butadiene; polyesters, especially polyethylene terephthalate, and compatible blends of the foregoing resins.
Often due to the inability of certain resins used in the exposed surface layer to bond adequately to the sublayer in contact with the metal substrate, one or more intermediate layers of resins designed to achieve interlayer adhesion may be employed. Typically such intermediate layers are comprised of resins selected from the group consisting of polyethylene and ethylene copolymers (high density, low density, linear low density and ultra low density polyethylenes); copolymers of an α-olefin and a polar comonomer and grafted or chemically modified olefin polymers. Often the intermediate resin comprises a blend of the resins employed in the sublayer contacting the metal and the surface layer.
In order to provide desired wettability to the outer surface of the metal adherent thermoplastic resin layer it may be desirable to employ a chemically modified thermoplastic resin in the sublayer which constitutes the surface of the resulting plastic clad metal laminate. For example it has been discovered that thermoplastic resins which normally are difficultly sulfonatable may result in the formation of a surface that is more readily water wettable by incorporation therein of aromatic compounds which are easily sulfonated. By incorporating such compounds only in the sublayer that will constitute the surface layer, it is possible to reduce the quantity of sulfonating agents employed in preparing the sulfonated polymer and to contain the sulfonated agents only in the surface layer, so as not to effect metal adhesion or other properties of the thermoplastic resin layer.
The aromatic compounds that may be added, particularly to olefin resins, to provide enhanced surface wettability upon sulfonation, may be inert aromatic compounds serving no other purpose in the thermoplastic resin formulation or they may be phenolic type antioxidants or aromatic dyes or coloring pigments which are coincidentally subject to sulfonation. For example it has now been discovered that phenolic antioxidants, such as alkyl substituted phenolic compounds or phenolic ethers or thioethers, are readily sulfonated when incorporated into a thermoplastic resin and exposed to standard sulfonation conditions. Similarly pigments such as the phthalocyanine blue having a structure corresponding to the following figure are also subject to sulfonation. ##STR1## Not only are the foregoing aromatic compounds useful for antioxidation, coloring or other purposes, but the same allow the normally poorly sulfonatable olefin polymer film to attain a satisfactory level of sulfonation.
Sulfonation of the thermoplastic resin film in one embodiment is obtained by contacting the film, preferably predominantly on one side thereof, with sulfur trioxide, preferably gaseous sulfur trioxide. The process may be conducted in a batch or a continuous manner. The sulfur trioxide may be diluted with a suitable medium, preferably an inert volatile compound such as a chlorofluorocarbon. Where the surface layer of the thermoplastic resin film contacted with the sulfonating agent comprises an alkenyl aromatic resin, or the aforementioned aromatic compounds, suitable surface wettabilities can be obtained with films containing an aromatic content (monomer or additive) of from 0.050 to 10 percent based on resin weight, with a resin film exposure time of from 0.01 sec to 10 minutes at a concentration of sulfonating agent of from 1 to 10 weight percent in the atmosphere contacting the film surface. Any suitable technique for sulfonating the thermoplastic resin film may be employed, such as the conditions disclosed in U.S. Pat. No. 4,615,914 or 4,902,493.
Reference is now made to FIG. 2 wherein there is depicted a continuous film sulfonation process. In the process a film of the desired thermoplastic resin from supply roll, 1, is passed by guide roller, 2, through a sulfonation chamber, 3, by the guide roller, 4, onto uptake roller 5. The film causes substantially complete bifurcation of the sulfonation chamber, 3. Sulfonating agent atmosphere is introduced on one side of the film by source 6, and dry air or inert gas is introduced at source 8, into the opposite side of the bifurcated chamber. The inert gas prevents substantial contact of sulfonating agent with the side of the thermoplastic resin film opposite to the sulfonating agent atmosphere. A neutralizing agent, such as ammonia, may be introduced at the final stages of the sulfonation via line, 7, to neutralize the sulfonating groups formed on the film surface. Alternatively, concurrently or additionally, an antimicrobial agent may be introduced into the thermoplastic resin surface. Preferably this addition is simultaneous with or as a result of the neutralization process. By utilizing multiple layer thermoplastic resin films containing relatively easily sulfonated groups or polymers on only the surface sublayer in combination with this sulfonation chamber design, it is possible to substantially sulfonate only one side of the thermoplastic resin film.
As previously mentioned, following sulfonation of the surface layer of the thermoplastic resin, it is desirable to neutralize the sulfonic acid groups present on the film surface. Such neutralization may be readily done by contacting the resin surface with a suitable amine or ammonia or other suitable neutralizing agent such as a metal halide. Preferred neutralizing agents are C1-6 alkyl or aryl amines particularly tertiary amines and ammonia. In a preferred embodiment of the invention the alkenyl aromatic monomer containing resin or aromatic compound is added to the thermoplastic resin forming the surface sublayer of the thermoplastic resin layer in an amount to provide from 0.5 to 10 percent by weight of sulfonated neutralized aromatic functionality. A desirable feature according to the present invention is that the thermoplastic resin layer film may be first sulfonated and thereafter laminated to the metal substrate without detrimental effect to the lamination process. This allows the operator to avoid exposing the metal containing laminate to further mechanical handling and possible contact with the corrosive sulfonation environment. Suitable systems for laminating include the method of heat lamination in which the thermoplastic resin layer film is contacted with the surface of the heated metal substrate. In addition adhesive resins may be employed to coat the substrate or thermoplastic resin layer prior to contacting with the metal substrate. Whether or not the technique of heat lamination or use of an adhesive resin is employed, it is desirable that the thermoplastic resin layer be adhered to the metal substrate by force of at least 1 to and preferably 5 pounds per lineal inch as determined according to ASTM F-88.
Preferred plastic clad metal laminates according to the present invention possess a surface wettability of at least 55 dynes/cm. In addition to the foregoing technique of sulfonation, other suitable additives or methods may be employed to increase the surface wettability of the thermoplastic resin layers employed in the present invention. For example the use of antimicrobial agents to increase resistance to microbial growth may at the same time improve the surface wettability of the polymeric resins employed according to the present invention.
The technique of incorporating antimicrobial agents into thermoplastic resins to provide polymers having improved resistance to microbiological organisms is previously known and taught in the art. Examples of suitable antimicrobial agents, include bacteriostatic, fungistatic, virostatic, algistatic, sporostatic, and tuberculostatic agents which may be incorporated into or coated onto the surface sublayer or entire thermoplastic resin layer. More particular examples of antimicrobiological agents are silanes, siloxanes, quaternary ammonium compounds, silicone containing quaternary ammonium compounds, etc These and other compounds and techniques for rendering surfaces effective in controlling microbial growth are disclosed in U.S. Pat. Nos. 4,847,088, 4,631,297, 4,632,273, 4,259,103, 4,377,608 and 3,817,739 the teachings of which are incorporated herein in their entirety by reference thereto. In a preferred embodiment of the present invention it is particularly desirable that the surface sublayer of the thermoplastic resin layer substantially prevent growth of bacteria, particularly the Legionnaires bacterium. In this regard it should be noted that improved antimicrobial activity of the present invention is achieved due to the fact that the surface wettability of the polymer surface is at least 50 dyne/cm, thereby allowing thorough contact between the entire film surface containing the antimicrobial agent and the wetting medium.
After having been prepared in sheet form, the laminate according to the present invention may be cut into any suitable size for formation into the heat transfer partitions for use in the apparatus for simultaneous and mass transfer as previously disclosed. Preferably the laminate is formed into a multiplicity of parallel folds so as to increase the total surface area exposed to the heat transfer medium and air or other mass being heated or cooled. Because of the metal substrate contained in the laminate of the present invention, such folding or pleating operation renders the article permanently formed into the desired folded or pleated shape having high surface area. The pleating or folding serves to give the laminate increased surface area and structural strength to resist vibration or damage by moving air or aqueous solution.
Claims (13)
1. A plastic clad metal laminate suitable for forming into heat transfer partitions for use in an apparatus for simultaneous heat and mass transfer said laminate comprising a metal substrate of a thickness from 0.001 to 0.1 inch (0.025 to 2.5 mm) having adhered to one or both sides thereof a metal adherent thermoplastic resin layer of a thickness of from 0.00001 t 0.003 inch (0.00025 to 0.050 mm) comprising one or more sublayers of one or more thermoplastic resins with one sublayer forming an exposed surface having a surface wettability as measured by ASTM D-2578 of at least 50 dyne/cm, said thermoplastic resin of said sublayer comprising a sulfonated, neutralized, aromatic monomer containing resin or aromatic compound.
2. A laminate according to claim 1 having a surface wettability of at least 55 dyne/cm.
3. A laminate according to claim 1 wherein the metal is steel or aluminum.
4. A laminate according to claim 1 wherein the sulfonation is caused by contacting the thermoplastic resin surface with SO3 followed by neutralization with ammonia.
5. A laminate according to claim 1 wherein the surface sublayer comprises a sulfonated, neutralized phenolic or phthalooyanine compound.
6. A laminate according to claim 1 wherein the surface sublayer comprises an ethylene homopolymer or copolymer and from 0.5 to 10 percent by weight of sulfonated neutralized aromatic compound.
7. A laminate according to claim 1 comprising a multiplicity of parallel folds.
8. A laminate according to claim 1 wherein the metal adherent thermoplastic resin layer is sulfonated on the surface to be exposed and the opposite surface is laminated to the metal substrate.
9. A laminate according to claim 8 wherein the thermoplastic resin layer is sulfonated by contacting an exposed surface to a gaseous mixture of SO3.
10. A laminate according to claim 9 wherein the gaseous mixture comprises a chlorofluorocarbon.
11. A laminate according to claim 2 wherein the surface sublayer additionally comprises an antimicrobial additive.
12. A laminate according to claim 2 wherein the surface sublayer is effective to prevent growth of Legionnaires Bacterium.
13. In an apparatus for changing at least one selected property of two wetting surfaces comprising at least one heat transferring partition the improvement wherein the heat transferring partition comprises a plastic clad metal laminate according to claim 1, 7 or 11.
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/499,849 US5082740A (en) | 1990-03-26 | 1990-03-26 | Plastic clad metal laminate for heat transfer partitions |
EP19910302175 EP0449459B1 (en) | 1990-03-26 | 1991-03-14 | Plastic clad metal laminated heat transfer partitions |
DE69117205T DE69117205T2 (en) | 1990-03-26 | 1991-03-14 | Plastic coated metal laminates as heat transfer compartment assemblies |
DK91302175T DK0449459T3 (en) | 1990-03-26 | 1991-03-14 | Heat transfer partition of plastic coated metal laminate |
ES91302175T ES2083521T3 (en) | 1990-03-26 | 1991-03-14 | HEAT TRANSFER WALLS OF METAL SHEETS COATED WITH PLASTIC. |
AT91302175T ATE134343T1 (en) | 1990-03-26 | 1991-03-14 | PLASTIC COVERED METAL AMINATES AS HEAT TRANSFER COMPARTMENT ARRANGEMENTS |
JP3052205A JPH04222395A (en) | 1990-03-26 | 1991-03-18 | Heat-transfer partition wall, in which plastic clad metal is laminated |
BR9101148A BR9101148A (en) | 1990-03-26 | 1991-03-18 | PARTICIPATION OF HEAT TRANSFER FOR USE IN SIMULTANEOUS TRANSFER OF HEAT AND MASS AND APPARATUS FOR CHANGING AT LEAST ONE SELECTED PROPERTY OF TWO MOISTED SURFACES |
KR1019910004658A KR910016478A (en) | 1990-03-26 | 1991-03-25 | Plastic-clad Metal Laminate Heat Transfer Bulkhead |
AU73818/91A AU7381891A (en) | 1990-03-26 | 1991-03-25 | Plastic clad metal laminated heat transfer partitions |
CA 2039018 CA2039018A1 (en) | 1990-03-26 | 1991-03-25 | Plastic clad metal laminated heat transfer partitions |
GR960401062T GR3019683T3 (en) | 1990-03-26 | 1996-04-19 | Plastic clad metal laminated heat transfer partitions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/499,849 US5082740A (en) | 1990-03-26 | 1990-03-26 | Plastic clad metal laminate for heat transfer partitions |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US99317092A Division | 1990-03-27 | 1992-12-18 | |
US99332492A Division | 1990-03-27 | 1992-12-18 |
Publications (1)
Publication Number | Publication Date |
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US5082740A true US5082740A (en) | 1992-01-21 |
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ID=23986996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US07/499,849 Expired - Fee Related US5082740A (en) | 1990-03-26 | 1990-03-26 | Plastic clad metal laminate for heat transfer partitions |
Country Status (12)
Country | Link |
---|---|
US (1) | US5082740A (en) |
EP (1) | EP0449459B1 (en) |
JP (1) | JPH04222395A (en) |
KR (1) | KR910016478A (en) |
AT (1) | ATE134343T1 (en) |
AU (1) | AU7381891A (en) |
BR (1) | BR9101148A (en) |
CA (1) | CA2039018A1 (en) |
DE (1) | DE69117205T2 (en) |
DK (1) | DK0449459T3 (en) |
ES (1) | ES2083521T3 (en) |
GR (1) | GR3019683T3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5930692A (en) * | 1994-12-16 | 1999-07-27 | Qualcomm Incorporated | Method and apparatus for increasing receiver immunity to interference |
US20080171835A1 (en) * | 2007-01-16 | 2008-07-17 | Sulfo Technologies, Llc | Method of sulfonation of polymer substrate to impart a hydrophilic layer in said substrate with improvement in at least one of anti-fog, anti-static, wettability, lubricity anti-microbial properties, and articles made thereby |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE50207053D1 (en) * | 2001-03-27 | 2006-07-20 | Behr Gmbh & Co Kg | Heat exchanger, in particular intercooler |
FR2827360B1 (en) | 2001-07-11 | 2005-10-28 | Valeo Thermique Moteur Sa | CONTROL VALVE FOR A FLUID CIRCUIT CIRCUIT, ESPECIALLY FOR A COOLING CIRCUIT OF AN ENGINE |
FR2873797B1 (en) * | 2004-07-30 | 2006-11-24 | Valeo Climatisation Sa | METHOD FOR MANUFACTURING A HEAT EXCHANGER HAVING SURFACE TREATMENT, AND HEAT EXCHANGER THUS OBTAINED |
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US3860492A (en) * | 1973-06-27 | 1975-01-14 | Jr Alvin Lowi | Liquid separation system |
US4363703A (en) * | 1980-11-06 | 1982-12-14 | Institute Of Gas Technology | Thermal gradient humidification-dehumidification desalination system |
US4449014A (en) * | 1981-01-19 | 1984-05-15 | The Dow Chemical Company | Plastic/metal laminates, cable shielding or armoring tapes, and electrical cables made therewith |
US4666452A (en) * | 1986-03-12 | 1987-05-19 | Kimberly-Clark Corporation | Hydrophilic surface - modified polyolefin structures |
US4832115A (en) * | 1986-07-09 | 1989-05-23 | Albers Technologies Corporation | Method and apparatus for simultaneous heat and mass transfer |
Family Cites Families (2)
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SE396129B (en) * | 1971-11-22 | 1977-09-05 | Schladitz Hermann J | VERME TRANSFER ELEMENT |
US4846267A (en) * | 1987-04-01 | 1989-07-11 | The Boc Group, Inc. | Enhanced heat transfer surfaces |
-
1990
- 1990-03-26 US US07/499,849 patent/US5082740A/en not_active Expired - Fee Related
-
1991
- 1991-03-14 AT AT91302175T patent/ATE134343T1/en not_active IP Right Cessation
- 1991-03-14 DK DK91302175T patent/DK0449459T3/en active
- 1991-03-14 EP EP19910302175 patent/EP0449459B1/en not_active Expired - Lifetime
- 1991-03-14 DE DE69117205T patent/DE69117205T2/en not_active Expired - Fee Related
- 1991-03-14 ES ES91302175T patent/ES2083521T3/en not_active Expired - Lifetime
- 1991-03-18 BR BR9101148A patent/BR9101148A/en unknown
- 1991-03-18 JP JP3052205A patent/JPH04222395A/en active Pending
- 1991-03-25 AU AU73818/91A patent/AU7381891A/en not_active Abandoned
- 1991-03-25 CA CA 2039018 patent/CA2039018A1/en not_active Abandoned
- 1991-03-25 KR KR1019910004658A patent/KR910016478A/en not_active Application Discontinuation
-
1996
- 1996-04-19 GR GR960401062T patent/GR3019683T3/en unknown
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US3860492A (en) * | 1973-06-27 | 1975-01-14 | Jr Alvin Lowi | Liquid separation system |
US4363703A (en) * | 1980-11-06 | 1982-12-14 | Institute Of Gas Technology | Thermal gradient humidification-dehumidification desalination system |
US4449014A (en) * | 1981-01-19 | 1984-05-15 | The Dow Chemical Company | Plastic/metal laminates, cable shielding or armoring tapes, and electrical cables made therewith |
US4666452A (en) * | 1986-03-12 | 1987-05-19 | Kimberly-Clark Corporation | Hydrophilic surface - modified polyolefin structures |
US4832115A (en) * | 1986-07-09 | 1989-05-23 | Albers Technologies Corporation | Method and apparatus for simultaneous heat and mass transfer |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5930692A (en) * | 1994-12-16 | 1999-07-27 | Qualcomm Incorporated | Method and apparatus for increasing receiver immunity to interference |
US20080171835A1 (en) * | 2007-01-16 | 2008-07-17 | Sulfo Technologies, Llc | Method of sulfonation of polymer substrate to impart a hydrophilic layer in said substrate with improvement in at least one of anti-fog, anti-static, wettability, lubricity anti-microbial properties, and articles made thereby |
Also Published As
Publication number | Publication date |
---|---|
KR910016478A (en) | 1991-11-05 |
DK0449459T3 (en) | 1996-05-20 |
BR9101148A (en) | 1991-11-05 |
GR3019683T3 (en) | 1996-07-31 |
CA2039018A1 (en) | 1991-09-27 |
EP0449459A1 (en) | 1991-10-02 |
DE69117205T2 (en) | 1996-07-25 |
JPH04222395A (en) | 1992-08-12 |
DE69117205D1 (en) | 1996-03-28 |
ES2083521T3 (en) | 1996-04-16 |
EP0449459B1 (en) | 1996-02-21 |
ATE134343T1 (en) | 1996-03-15 |
AU7381891A (en) | 1991-10-03 |
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