US3806429A - Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating - Google Patents
Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating Download PDFInfo
- Publication number
- US3806429A US3806429A US00380631A US38063173A US3806429A US 3806429 A US3806429 A US 3806429A US 00380631 A US00380631 A US 00380631A US 38063173 A US38063173 A US 38063173A US 3806429 A US3806429 A US 3806429A
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- United States
- Prior art keywords
- iron
- nickel
- bath
- bright
- electrodeposition
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
Definitions
- the iron-nickel alloy bath contains ions of iron and ions of nickel, and an iron complexing agent containing complexing groups such as carboxy and hydroxy groups.
- Applicants invention is directed to the electrodeposition of a bright iron-nickel alloy deposit of from 5 to about 50% by weight iron preferabl about 15 to about 35% by weight which can be used as the basis for subsequent electrodeposition of chromium in order to impart desirable decorative and/or corrosion resistant properties to substrates, such as metallic substrates.
- the bath and process of the present invention can also be used in the electrodeposition of a nickel-iron alloy for plastics.
- plastic substrate such as acryloare nitrile butadiene-styrene, polyethylene, polypropylene, polyvinyl chloride, phenol-formaldehyde polymers is pretreated by applying a conductive metallic deposit onto the plastic substrate such as, nickel or copper.
- the ironnickel deposit may then be used as a subsequent coating onto the conductive metallic deposit.
- the bath that may be employed in the present invention utilizes one or more salts of nickel, one or more salts of iron, and a complexing agent.
- any bath soluble iron or nickel containing compound may be employed providing the corresponding anion is not detrimental to the bath.
- inorganic nickel salts may be employed, such as, nickel sulfate, nickel chloride, and the like as well as other nickel materials such as nickel sulfamate and the like.
- nickel sulfate salts When nickel sulfate salts are used they are normally present in amounts ranging from 40 to 300 grams per liter (calculated as nickel sulfate 6H O); nickel chloride may also be used and is present in an amount ranging from about to 250 grams per liter.
- the chloride or halide ions are employed in order to obtain satisfactory conductivity of the solution and at the same time to obtain satisfactory corrosion properties of the soluble anodes.
- the inorganic salts of iron are employed, such as, ferrous salts, such as, ferrous sulfate, ferrous chloride, and the like. These salts are present in an amount ranging from about 3 to 60 grams per liter.
- Other bath soluble iron salts that may be employed, such as, soluble ferrous fluoborate, or sulfamate, and the like.
- the iron complexing agent that is employed in the present invention is one that is bath soluble and contains complexing groups independently selected from the group consisting of carboxy and hydroxy provided at least 1 of the complexing groups is a carboxy group and further provided that there are at least two complexing groups.
- the complexing agent that may be employed is present in amount ranging from about 10 to about grams per liter.
- Suitable complexing agents are hydroxy substituted lower aliphatic carboxylic acids having from 2 to 8 carbon atoms, from 1 to 6 hydroxyl groups and from 1 to 3 carboxyl groups such as, ascorbic acid, isoascorbic acid, citric acid, malic acid, glutaric acid, gluconic acid, muconic, glutamic, gluheptonate, glycollic acid, aspartic acid and the like as well as amine containing complexing agents, such as nitrilotriacetic acid, ethylene diamine tetra-acetic acid, as well as the water soluble salts thereof such as ammonium and the alkali metal salts such as potassium, sodium, lithium, and the like. It can also be appreciated that the iron may be introduced into the bath as a salt of the complexing agent.
- carboxy is meant the group-COOH. However, it is to be appreciated that in solution, the proton disassociates from the carboxy group and therefore this group is to 'be included in the meaning of carboxy.
- the purpose of the complexing agent is to keep the metal ions, in particular, the ferrous and ferric ions in solution. It has been found that as the pH of a normal Watts nickel-plating bath increases above a pH of 3.0, ferric ions tend to precipitate as ferric hydroxide. The complexing agent will prevent the precipitation from taking place and therefore makes the iron and nickel ions available for electrodeposition from the complexing agent.
- ferrous salt While the iron is always introduced as the ferrous salt, it has been established that a portion of the iron in solution is almost always oxidized from the ferrous to ferric state.
- concentration of ferric ion in solution is determined by a number of factors, and particularly by the operating pH of the solution.
- the type and amount of anode area in the solution will also affect the relative concentration of ferric ion. We believe this may be due to the oxidizing of ferrous to ferric ion at the anode.
- ferric ion it is found that at least 5% of the total iron in solution is present as ferric ions, and it is preferred that the ferric ion not exceed 30 to 40% of the total iron in the bath, although it has been established in work performed to date that acceptable results may be obtained when even as much as 60% of the iron in the solution is present as ferric ions. It has been observed that the relative concentration of ferric ion will be higher in an air agitated solution than one that is dependent on only cathode agitation. The exact structure which is formed by the interaction of the ferric ion with the complexing agent is not known. The literature reports a number of possible structures under different conditions; for instance, the structure reported in water solution may be different from that determined in biological applications. We also have reason to believe that the structure in a plating solution changes during electrolysis. Regardless of the exact structure, the ferric ion is not precipitated from the solution, as the hydroxide, even at a pH of 5.
- the pH of the bath preferably ranges from about 2.5 to about 5.5 and even more preferably about 3 to about 4.6.
- the temperature of the bath may range from about 120 F. to about 180 F. preferably about 160 F.
- the average cathode current density may range from about to about 70 amps per square foot preferably about 45 amps per square foot.
- the complexing agent concentration should be at least three times the total iron ion concentration in the bath.
- the complexing agent concentration ratio to total iron ion concentration may range from 3 to 50:1.
- the bath may also contain various buffers such as boric acid and sodium acetate and the like ranging in amount from about 30' to 60 grams per liter, preferably 40 grams per liter.
- the ratio of nickel ions to iron ions ranges from about 5 to about 50 to 1.
- While the bath may be operated without agitation, various means of agitation may be employed such as mechanical agitation, air agitation, cathode rod movement and the like.
- Suitable additives are the sulfo-oxygen compounds as are described as brighteners of the first class described in Modern Electroplating, published by John Wiley and Sons, second edition, page 272.
- the amount of sulfo-oxygen compounds employed in the present invention ranges from about 0.5 to about 10 grams per liter. It has been found that saccharin may be used in amounts ranging from 0.5 to about 5 grams per liter resulting in a bright ductile deposit. When other sulfooxygen compounds are employed, such as, naphthalenetrisulfonic, sulfobenzaldehyde, dibenzenesulfonamide, good brightness is obtained but the ductility is not as good as with saccharin.
- the bath soluble sulfa-oxygen compound that may be used in the present invention are those such as the unsaturated aliphatic sulfonic acids, mononuclear and binuclear aromatic sulfonic acids, mononuclear aromatic sulfinic acids, mononuclear aromatic sulfonamides and sulfonimides, and the like.
- acetylenic nickel brighteners may also be used in amounts ranging from about 10 to about 500 milligrams per liter. Suitable compounds are the acetylenic sulfo-oxygen compounds mentioned in U.S. 2,800,440. These nickel brighteners are the oxygen containing acetylenic sulfo-oxygen compounds. Other acetylenic nickel brighteners are those described in U.S.
- 3,366,557 such as the polyethers resulting from the condensation reaction of acetylenic alcohols and diols such as, propargyl alcohol, butyndiol, and the like and lower alkylene oxides such as, epichlorohydrin, ethylene oxide, propylene oxide and the like.
- nitrogen heterocyclic quaternary or betaine nickel brighteners may also be used in amounts ranging from about 1 to about 50 milligrams per liter. Suitable compounds are those nickel brihgteners described in U.S. 2,647,866 and the nitrogen heterocyclic sulfonates described in U.S. 3,023,151. Preferred compounds described therein are the pyridine quaternaries or betaines or the pyridine sulfobetaines.
- Suitable quaternaries that may be employed are quinaldine propane sultone, quinaldine dimethyl sulfate, quinaldine allyl bromide, pyridine allyl bromide, isoquinaldine propane sultone, isoquinaldine dimethyl sulfate, isoquinaldine allyl bromide, and the like.
- organic sulfide nickel brighteners are employed in amounts ranging from about 0.5 to about 40 milligrams per liter of the electroplating bath composition. These organic sulfides are of the formula:
- R is hydrogen or a carbon atom of an organic radical
- R is nitrogen or a carbon atom of an organic radical
- R is a carbon atom of an organic radical.
- R and R or R may be linked together through a single organic radical.
- bath soluble organic sulfide compounds used are 2-amine thiazoles and isothioureas having the formula:
- R is selected from H, lower alkyl sulfonic acid groups, aryl sulfonic acid groups, lower alkoxy aryl sulfonic acid groups and the salts thereof;
- R and R are selected from H, halogen, lower alkyl groups and the bivalent radical I I I Bio 10 10 B10 in which the R groups are selected from H, halogen and lower alkyl groups; R is selected from the lower alkyl sulfonic acid groups and lower alkyl carboxy acid groups and the salts thereof; and R and R are selected from H, halogen, lower alkyl groups and the bivalent radical in which the R groups are selected from H, halogen and lower alkyl groups.
- halogen it is intended to include chlorine, bromine, fluorine and iodine, although chlorine is generally preferred.
- lower alkyl or alkoxy groups it is intended to include groups containing from about 1 to 6 carbon atoms in a straight or branched chain, with from about 1 to 4 carbon atoms being preferred.
- sulfonic or carboxy acids and their salts it is intended to include those sulfonic and carboxy acids which have halogen substituents on their alkyl, alkoxy or aryl groups and wherein the salts are exemplified by the alkali metal salts, sodium, potassium, lithium, cesium and rubidium, particularly sodium.
- the bivalent radicals above a six-membered ring is formed when R and R are joined and a five membered ring is formed when R and R are joined.
- Suitable compounds are those of the formulae appearing below.
- compound (1), 2-aminothiazole and compound (2), 2- aminobenzothiazole can be reacted with bromethane sulfonate, propane sultone, benzyl chloride, dimethylsulfate, diethyl sulfate, methyl bromide, propargyl bromide, ethylene dibromide, allyl bromide, methyl chloro acetate, sulfophenoxyethylenc bromide, the latter, for example, can be reacted with compound 1) to give compound (3), etc., to form compounds that give even improved results over compounds (1) and (2).
- substituted 2-aminothiazoles and Z-aminobenzothiazoles such as 2-amino-5- chlorothiazole, 2-amino-4-methylthiazole, etc.
- substituted 2-aminothiazoles and Z-aminobenzothiazoles can be used instead of compounds (1) and (2).
- thiourea can be reacted with propiolactone, butyrolactone, chloroacetic acid, chloropropionic acid, propane sultone, dimethyl sulfate, etc.
- phenyl thiourea, methyl thiourea, allyl thiourea and other similar substituted thioureas may be used in the reactions to form compounds similar to types (5) and (6).
- nickel brighteners must be soluble in the electroplating bath and may be introduced into the bath, when an acid is involved, as the acid itself or as a salt having bath soluble cations, such as ammonium ions of the alkali metal ion, such as, lithium, potassium, sodium, and the like.
- relatively thin coatings of bright nickeliron having less than about 0.'5-mil thickness (such as 0.1-mil thickness) with an alloy content of about 20 to 45% iron function more effectively than an equivalent bright nickel coating when copper or brass undercoats are employed.
- the iron content is about 35% or more, the alloy deposits corrode more preferentially to copper or brass undercoats than does bright nickel. This action delays penetration to the basis metal.
- These bright nickel-iron coatings also function well as the thin top coat on semi-bright sulfur free nickel deposits.
- the bright nickel-iron is very effective in such a composite electroplate when overplated with microdiscontinuous chromium coatings such as that described in US. Pats. 3,563,864 and 3,151,971-3.
- the microdiscontinuous chromium coatings may be achieved by thin nickel deposits which induce micro-porosity or microcracking in the chromium or by plating the chromium deposit from a specific solution which deposits a microcracked chromium.
- nickel salts may be substituted with minor amounts up to 50% of the nickel salts with cobalt salts in order to achieve different corrosion behavior.
- a suitable composition that may be employed in the present invention is as follows:
- soluble iron anodes or nickel-iron alloy anodes should be employed.
- the ratio of nickel to iron in the anode area should be maintained at approximately 4 to 1.
- dual (nickel and iron) anodes are used and the iron anodes should be insulated and connected to the anode rail through a highly electrically resistant device such as a nickel-chrome wire or controlled by a separate rheostat to maintain a total current to the iron anodes of about 8 to about 30% preferably about 10% to 25% of the total anode current.
- Anode bags, filter bags, hoses, tank linings etc. should be those which are generally employed in other bright nickel processes.
- a bright iron-nickel bath was formulated as follows:
- test panel J-steel plated from this bath gave a bright level deposit with excellent ductility and clean recess areas.
- the iron content of the plated deposit was approximately 20-25%.
- a nickel-iron plating bath having a high iron concentration was tested in a pilot plating laboratory.
- the composition of the bath was as follows:
- a I-type steel panel plated at 50 ASF was overall bright, leveled, very ductile, with a part skipped recess area.
- the iron included in these deposits was approximately 38-47%.
- a bath was formulated as follows:
- a J-shaped panel was plated at 40 ASF and obtained was a full bright lustrous deposit in the high current density area and a low current density cloud.
- Adduct of propargyl alcohol and epichlorohydrin Adduct of butyne diol and epichlorohydrin (1.2
- Example No. 6 Test panels were plated from each solution for 10 minutes at 45 ASF. Results showed both deposits to be overall bright with clean recess areas, with Panel A having better leveling than Panel B. Both panels had excellent ductility. As can be seen in Example No. 6 a plurality of complexmg agents may be used to obtain desirable results. It has also been determined that the gluconate complexing agent tends after long periods of electrolysis to form insoluble materials such as nickel salt of a gluconate degradation product. To continue to obtain desirable results a combination of complexing agents may be employed, such as, citrate and gluconate.
- An aqueous acidic bath suitable for the electrodeposition of a bright iron-nickel electrodeposit onto a substrate susceptible to corrosion which comprises iron ions and nickel ions, the ratio of nickel ions to iron ions being from about to about 50 to 1 and wherein at least 5% of total iron in solution is present as ferric ions, a bath soluble primary nickel brightener including 0.5 to g./l. of a sulfo-oxygen compound, and 10 to 100 g./l.
- a bath soluble non-reducing complexing agent which is a saturated aliphatic carboxylic acid having 1 to 3 carboxyl groups, 2 to 8 carbon atoms and 1 to 6 bydroxyl groups, the ratio of complexing agent to iron ions concentration in the bath being from 3 to about 50 to 1 and the bath having a pH from 3.0 to about 4.6.
- a process for producing a bright iron-nickel alloy electrodeposit comprising passing a current through the bath of claim 1 and electrodepositing an iron-nickel alloy onto a cathodic surface.
- a process for producing an iron-nickel alloy, chromium coated article compriing electrodepositing an ironnickel alloy onto a substrate in the bath of claim 1 and subsequently electrodepositing chromium upon the ironnickel coating.
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US00380631A US3806429A (en) | 1972-07-03 | 1973-07-19 | Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating |
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US26834872A | 1972-07-03 | 1972-07-03 | |
US00380631A US3806429A (en) | 1972-07-03 | 1973-07-19 | Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating |
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Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3922209A (en) * | 1974-08-20 | 1975-11-25 | M & T Chemicals Inc | Electrode position of alloys of nickel, cobalt or nickel and cobalt with iron and electrolytes therefor |
FR2284691A1 (en) * | 1974-09-16 | 1976-04-09 | M & T Chemicals Inc | NEW METHOD AND COMPOSITION FOR THE ELECTRODEPOSITION OF NICKEL OR COBALT ALLOYS OR NICKEL AND COBALT WITH IRON |
US3969198A (en) * | 1975-01-09 | 1976-07-13 | Permalite Chemicals Ltd. | Ni-Fe electro-plating |
US3974044A (en) * | 1975-03-31 | 1976-08-10 | Oxy Metal Industries Corporation | Bath and method for the electrodeposition of bright nickel-iron deposits |
DE2826464A1 (en) * | 1977-06-24 | 1979-01-11 | M & T Chemicals Inc | METHOD FOR GALVANIC SEPARATION OF AN IRON AND / OR COBALT CONTAINING RAIN AND BATHROOM SUITABLE FOR THIS |
US4179343A (en) * | 1979-02-12 | 1979-12-18 | Oxy Metal Industries Corporation | Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits |
US4189359A (en) * | 1975-08-13 | 1980-02-19 | Societe Metallurgique Le Nickel-Sln | Process for the electrodeposition of ferro-nickel alloys |
FR2501241A1 (en) * | 1981-03-06 | 1982-09-10 | Langbein Pfanhauser Werke Ag | GALVANOPLASTY BATH FOR REMOVING PALLADIUM-NICKEL ALLOYS, METHOD OF USING SUCH A BATH |
US4372826A (en) * | 1980-03-07 | 1983-02-08 | Statni Vyzkumny Ustav Materialu | Electrolyte for cathodic deposition of nickel alloys with iron |
US4434030A (en) | 1982-11-12 | 1984-02-28 | Institute Po Physikochimia | Bath for the electrodeposition of bright nickel iron alloy |
US4450050A (en) * | 1983-02-03 | 1984-05-22 | M&T Chemicals Inc. | Process for bonding high efficiency chromium electrodeposits |
US4450051A (en) * | 1981-01-13 | 1984-05-22 | Omi International Corporation | Bright nickel-iron alloy electroplating bath and process |
DE3347593A1 (en) * | 1983-01-03 | 1984-07-05 | Omi International Corp., Warren, Mich. | AQUEOUS ALKALINE CYANIDE-FREE COPPER ELECTROLYTE AND METHOD FOR GALVANICALLY DEPOSITING A GRAIN-REFINED DUCTILE AND ADHESIVE COPPER LAYER ON A CONDUCTIVE SUBSTRATE |
US4462874A (en) * | 1983-11-16 | 1984-07-31 | Omi International Corporation | Cyanide-free copper plating process |
US6045682A (en) * | 1998-03-24 | 2000-04-04 | Enthone-Omi, Inc. | Ductility agents for nickel-tungsten alloys |
US20060135282A1 (en) * | 2004-12-17 | 2006-06-22 | Integran Technologies, Inc. | Article comprising a fine-grained metallic material and a polymeric material |
US7144489B1 (en) | 2001-10-27 | 2006-12-05 | Enpirion, Inc. | Photochemical reduction of Fe(III) for electroless or electrodeposition of iron alloys |
US7771289B2 (en) | 2004-12-17 | 2010-08-10 | Integran Technologies, Inc. | Sports articles formed using nanostructured materials |
US8637165B2 (en) | 2011-09-30 | 2014-01-28 | Apple Inc. | Connector with multi-layer Ni underplated contacts |
US20140269228A1 (en) * | 2013-03-14 | 2014-09-18 | Seiko Instruments Inc. | Metal structure, method of manufacturing metal structure, spring component, chronograph coupling lever for timepiece, and timepiece |
US9004960B2 (en) | 2012-08-10 | 2015-04-14 | Apple Inc. | Connector with gold-palladium plated contacts |
-
1973
- 1973-07-19 US US00380631A patent/US3806429A/en not_active Expired - Lifetime
Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3922209A (en) * | 1974-08-20 | 1975-11-25 | M & T Chemicals Inc | Electrode position of alloys of nickel, cobalt or nickel and cobalt with iron and electrolytes therefor |
FR2284691A1 (en) * | 1974-09-16 | 1976-04-09 | M & T Chemicals Inc | NEW METHOD AND COMPOSITION FOR THE ELECTRODEPOSITION OF NICKEL OR COBALT ALLOYS OR NICKEL AND COBALT WITH IRON |
US3969198A (en) * | 1975-01-09 | 1976-07-13 | Permalite Chemicals Ltd. | Ni-Fe electro-plating |
US3974044A (en) * | 1975-03-31 | 1976-08-10 | Oxy Metal Industries Corporation | Bath and method for the electrodeposition of bright nickel-iron deposits |
US4189359A (en) * | 1975-08-13 | 1980-02-19 | Societe Metallurgique Le Nickel-Sln | Process for the electrodeposition of ferro-nickel alloys |
DE2826464A1 (en) * | 1977-06-24 | 1979-01-11 | M & T Chemicals Inc | METHOD FOR GALVANIC SEPARATION OF AN IRON AND / OR COBALT CONTAINING RAIN AND BATHROOM SUITABLE FOR THIS |
US4179343A (en) * | 1979-02-12 | 1979-12-18 | Oxy Metal Industries Corporation | Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits |
FR2448584A1 (en) * | 1979-02-12 | 1980-09-05 | Oxy Metal Industries Corp | PROCESS FOR PRODUCING NICKEL-IRON ELECTROLYTIC DEPOSITS AND BATHS USED FOR THIS PURPOSE, INCLUDING IN PARTICULAR A TARTRATE AND A REDUCING MONO OR DISACCHARIDE |
US4372826A (en) * | 1980-03-07 | 1983-02-08 | Statni Vyzkumny Ustav Materialu | Electrolyte for cathodic deposition of nickel alloys with iron |
US4450051A (en) * | 1981-01-13 | 1984-05-22 | Omi International Corporation | Bright nickel-iron alloy electroplating bath and process |
FR2501241A1 (en) * | 1981-03-06 | 1982-09-10 | Langbein Pfanhauser Werke Ag | GALVANOPLASTY BATH FOR REMOVING PALLADIUM-NICKEL ALLOYS, METHOD OF USING SUCH A BATH |
US4434030A (en) | 1982-11-12 | 1984-02-28 | Institute Po Physikochimia | Bath for the electrodeposition of bright nickel iron alloy |
DE3347593A1 (en) * | 1983-01-03 | 1984-07-05 | Omi International Corp., Warren, Mich. | AQUEOUS ALKALINE CYANIDE-FREE COPPER ELECTROLYTE AND METHOD FOR GALVANICALLY DEPOSITING A GRAIN-REFINED DUCTILE AND ADHESIVE COPPER LAYER ON A CONDUCTIVE SUBSTRATE |
WO1984003109A1 (en) * | 1983-02-03 | 1984-08-16 | M & T Chemicals Inc | Process for bonding high efficiency chromium electrodeposits |
US4450050A (en) * | 1983-02-03 | 1984-05-22 | M&T Chemicals Inc. | Process for bonding high efficiency chromium electrodeposits |
US4462874A (en) * | 1983-11-16 | 1984-07-31 | Omi International Corporation | Cyanide-free copper plating process |
US6045682A (en) * | 1998-03-24 | 2000-04-04 | Enthone-Omi, Inc. | Ductility agents for nickel-tungsten alloys |
US7144489B1 (en) | 2001-10-27 | 2006-12-05 | Enpirion, Inc. | Photochemical reduction of Fe(III) for electroless or electrodeposition of iron alloys |
US20060135282A1 (en) * | 2004-12-17 | 2006-06-22 | Integran Technologies, Inc. | Article comprising a fine-grained metallic material and a polymeric material |
US7354354B2 (en) | 2004-12-17 | 2008-04-08 | Integran Technologies Inc. | Article comprising a fine-grained metallic material and a polymeric material |
US20080090066A1 (en) * | 2004-12-17 | 2008-04-17 | Integran Technologies, Inc. | Article comprising a fine-grained metallic material and a polymeric material |
US20080254310A1 (en) * | 2004-12-17 | 2008-10-16 | Integran Technologies, Inc. | Article comprising a fine-Grained metallic material and a polymeric material |
US7553553B2 (en) | 2004-12-17 | 2009-06-30 | Integran Technologies, Inc. | Article comprising a fine-grained metallic material and a polymeric material |
US7771289B2 (en) | 2004-12-17 | 2010-08-10 | Integran Technologies, Inc. | Sports articles formed using nanostructured materials |
US8637165B2 (en) | 2011-09-30 | 2014-01-28 | Apple Inc. | Connector with multi-layer Ni underplated contacts |
US9004960B2 (en) | 2012-08-10 | 2015-04-14 | Apple Inc. | Connector with gold-palladium plated contacts |
US20140269228A1 (en) * | 2013-03-14 | 2014-09-18 | Seiko Instruments Inc. | Metal structure, method of manufacturing metal structure, spring component, chronograph coupling lever for timepiece, and timepiece |
US9310772B2 (en) * | 2013-03-14 | 2016-04-12 | Seiko Instruments Inc. | Metal structure, method of manufacturing metal structure, spring component, chronograph coupling lever for timepiece, and timepiece |
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