US3586611A - Process for the electrolytic deposition of gold-copper-cadmium alloys - Google Patents
Process for the electrolytic deposition of gold-copper-cadmium alloys Download PDFInfo
- Publication number
- US3586611A US3586611A US826280A US3586611DA US3586611A US 3586611 A US3586611 A US 3586611A US 826280 A US826280 A US 826280A US 3586611D A US3586611D A US 3586611DA US 3586611 A US3586611 A US 3586611A
- Authority
- US
- United States
- Prior art keywords
- cyanide
- gold
- copper
- potassium
- cadmium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- the bath has a pH of 9 to 11 and a current density of 0.5 to 1.5 a./dm. during the cathodic phase of 4 to 20 seconds as well as a current density of 0.75 to 3.75 a./dm. preferably 1.0 to 3.0 a./dm. during the anodic phase of 0.5 to 2 seconds.
- the ratio of cathodic to anodic current density is preferably less than 1:15.
- a disadvantage of the described process consists in that the permanent bright current density range is relatively small so that it can only be used for electroplating small and as much as possible simple formed parts. Besides the deposition of reddish coatings sets tight boundaries for their film thickness and finally the roughness of the coating at greater film thickness are increased.
- This addition can be in the form of potassium silver cyanide or other silver salts compatible with the rest of the bath composition.
- concentration of the bath in silver should be between 0.01 and 0.1 gram/liter. This silver content must be maintained over the entire useful life of the bath that the supplemental addition of silver corresponds to an amount of 0.2 to 2% of the content of gold and alloying metals.
- EXAMPLE 1 An aqueous bath containing 1.5 grams per liter of gold as potassium gold cyanide, 10.5 grams per liter of copper as potassium copper cyanide, 0.3 gram per liter of cadmium as potassium cadmium cyanide, 0.05 gram per liter of silver as potassium silver cyanide and 5.0 grams per liter of free potassium cyanide was electrolyzed with a cur- Patented June 22, 1971 ice Percent Gold 74 Copper 15 Cadmium 10 Silver 1 A portion of the alloying metals exists in the supplementary additive in the form of a simple, non-cyanide, in aqueous solution acid reacting salt, e.g. salts of sulfuric acid in order to keep the free cyanide content of the bath and the pH value within the necessary limits. The silver content of the bath can be supplemented with the remaining metals or separately.
- acid reacting salt e.g. salts of sulfuric acid
- film thicknesses of 20 or higher in a relatively wide brilliant current density range highly lustrous, smooth, yellow to red about 18 carat gold coating of especially high hardness.
- the conditions of operation are l to 3 grams per liter of gold as potassium gold cyanide 5 to 15 grams per liter, preferably 8 to 13 grams per liter of copper as potassium copper cyanide or sodium copper cyanide 0.1 to 0.8 gram per liter of cadmium as potassium cadmium cyanide or sodium cadmium cyanide, 0.01 to 0.1 gram per liter of silver as potassium silver cyanide.
- the temperature can be between 60 and C.
- the supplementary additive can for instance consist in two solutions.
- the first of these solutions contains 40 grams per liter of gold as potassium gold cyanide, 0.5 gram per liter of silver as potassium silver cyanide and 10 grams per liter of copper as potassium copper cyanide or sodium copper cyanide.
- the second solution contains 3 grams per liter of cadmium as cadmium sulfate or cadmium nitrate or cadmium acetate. For supplementation equal amounts of the two solutions are added to the bath.
- each cathodic phase being 4 to 20 seconds and the duration of each anodic phase being 0.5 to 2 seconds and maintaining References Cited a current density of 0.5 to 1.5 a./dm. during the cathodic phase and a current density of 0.75 to 3.75 a./dm. during UNITED f PATENTS the anodic phase 3,056,733 10/1962 Hellmann 20444 2.
Abstract
THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM ALLOYS ACCORDING TO HEILMANN U.S. PAT. 3,056,733 IS IMPROVED BY INCLUDING SMALL AMOUNTS OF SILVER IN THE AQUEOUS ALKALINE CYANIDE BATH.
Description
United States Patent US. Cl. 204-44 2 Claims ABSTRACT OF THE DISCLOSURE The electrolytic deposition of gold-copper-cadmium alloys according to Heilmann US. Pat. 3,056,733 is improved by including small amounts of silver in the aqueous alkaline cyanide bath.
In Heilmann US. Pat. 3,056,733 (German Pat. 1,141,- 849) there is described a process for the electrolytic deposition of gold-copper-cadmium alloys from an aqueous alkaline cyanide bath by means of a periodically reversed current density using insoluble anodes. This process is characterized by use of a bath containing 1 to 3 grams/ liter of gold as potassium gold cyanide, 5 to 15, preferably 8 to 13 grams/liter of copper as potassium copper cyanide or sodium copper cyanide, 0.1 to 0.8 gram/liter of cadmium as potassium cadmium cyanide or sodium cadmium cyanide and 3 to 8 grams/liter of free cyanide calculated as potassium cyanide. The bath has a pH of 9 to 11 and a current density of 0.5 to 1.5 a./dm. during the cathodic phase of 4 to 20 seconds as well as a current density of 0.75 to 3.75 a./dm. preferably 1.0 to 3.0 a./dm. during the anodic phase of 0.5 to 2 seconds. The ratio of cathodic to anodic current density is preferably less than 1:15.
A disadvantage of the described process consists in that the permanent bright current density range is relatively small so that it can only be used for electroplating small and as much as possible simple formed parts. Besides the deposition of reddish coatings sets tight boundaries for their film thickness and finally the roughness of the coating at greater film thickness are increased.
Unexpectedly it has turned out that these disadvantages can be avoided if one adds a small amount of silver to the bath. This addition can be in the form of potassium silver cyanide or other silver salts compatible with the rest of the bath composition. The concentration of the bath in silver should be between 0.01 and 0.1 gram/liter. This silver content must be maintained over the entire useful life of the bath that the supplemental addition of silver corresponds to an amount of 0.2 to 2% of the content of gold and alloying metals.
Unless otherwise indicated, all parts and percentages are by weight.
EXAMPLE 1 An aqueous bath containing 1.5 grams per liter of gold as potassium gold cyanide, 10.5 grams per liter of copper as potassium copper cyanide, 0.3 gram per liter of cadmium as potassium cadmium cyanide, 0.05 gram per liter of silver as potassium silver cyanide and 5.0 grams per liter of free potassium cyanide was electrolyzed with a cur- Patented June 22, 1971 ice Percent Gold 74 Copper 15 Cadmium 10 Silver 1 A portion of the alloying metals exists in the supplementary additive in the form of a simple, non-cyanide, in aqueous solution acid reacting salt, e.g. salts of sulfuric acid in order to keep the free cyanide content of the bath and the pH value within the necessary limits. The silver content of the bath can be supplemented with the remaining metals or separately.
There are also obtained with film thicknesses of 20 or higher in a relatively wide brilliant current density range, highly lustrous, smooth, yellow to red about 18 carat gold coating of especially high hardness.
The conditions of operation are l to 3 grams per liter of gold as potassium gold cyanide 5 to 15 grams per liter, preferably 8 to 13 grams per liter of copper as potassium copper cyanide or sodium copper cyanide 0.1 to 0.8 gram per liter of cadmium as potassium cadmium cyanide or sodium cadmium cyanide, 0.01 to 0.1 gram per liter of silver as potassium silver cyanide.
3 to 8 grams per liter of free cyanide as potassium cyanide.
Current density of 0.5 to 1.5 a./dm. during the cathodic phase of 4 to 20 seconds.
Current density of 0.75 to 3.75 a./dm. preferably 1.0 to 3.0 a./dm. during the anodic phase of 0.5 to 2 seconds.
The temperature can be between 60 and C.
The supplementary additive can for instance consist in two solutions. The first of these solutions contains 40 grams per liter of gold as potassium gold cyanide, 0.5 gram per liter of silver as potassium silver cyanide and 10 grams per liter of copper as potassium copper cyanide or sodium copper cyanide. The second solution contains 3 grams per liter of cadmium as cadmium sulfate or cadmium nitrate or cadmium acetate. For supplementation equal amounts of the two solutions are added to the bath.
What is claimed is:
1. In a process for the electrolytic deposition of goldcopper-cadmium alloys from aqueous alkaline cyanide baths using periodically reversed direct current, the steps which comprise electrolytically depositing a gold-coppercadmium alloy from an aqueous cyanide bath maintained at a pH of 9-11 and containing 1 to 3 grams per liter of gold as potassium gold cyanide, 5 to 15 grams per liter of copper as potassium or sodium copper cyanide. 0.1 to 0.8 gram per liter of cadmium as potassium or sodium cadmium cyanide, 0.01 to 0.1 gram per liter of silver as potassium silver cyanide and 3 to 8 grams per liter of free cyanide as potassium cyanide, the duration of each cathodic phase being 4 to 20 seconds and the duration of each anodic phase being 0.5 to 2 seconds and maintaining References Cited a current density of 0.5 to 1.5 a./dm. during the cathodic phase and a current density of 0.75 to 3.75 a./dm. during UNITED f PATENTS the anodic phase 3,056,733 10/1962 Hellmann 20444 2. A process according to claim 1 wherein the bath 5 concentration is maintained by adding supplementary ad- GERALD KAPLAN Primary Exammer ditives containing salts of gold, silver, cadmium and copper U S Cl X R and wherein the silver is 0.2 to 2% based on the total of 75 165 t the gold and alloying metals.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19681771712 DE1771712C3 (en) | 1968-06-28 | Process for the galvanic deposition of gold-copper-cadmium alloy coatings | |
DE283841X | 1968-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3586611A true US3586611A (en) | 1971-06-22 |
Family
ID=25755604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US826280A Expired - Lifetime US3586611A (en) | 1968-06-28 | 1969-05-20 | Process for the electrolytic deposition of gold-copper-cadmium alloys |
Country Status (7)
Country | Link |
---|---|
US (1) | US3586611A (en) |
AT (1) | AT283841B (en) |
CH (1) | CH522740A (en) |
FR (1) | FR2011755A1 (en) |
GB (1) | GB1279141A (en) |
NL (1) | NL6906666A (en) |
SE (1) | SE345697B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4179344A (en) * | 1973-07-02 | 1979-12-18 | Lea-Ronal, Inc. | Gold alloy plating compositions and method |
US4486275A (en) * | 1983-02-07 | 1984-12-04 | Heinz Emmenegger | Solution for electroplating a gold-copper-cadmium alloy |
US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
US5006208A (en) * | 1989-09-06 | 1991-04-09 | Degussa Aktiengesellschaft | Galvanic gold alloying bath |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH529843A (en) * | 1971-07-09 | 1972-10-31 | Oxy Metal Finishing Europ S A | Bath for the electrolytic deposition of gold alloys and its use in electroplating |
CH662583A5 (en) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS. |
ATE220736T1 (en) | 1995-11-03 | 2002-08-15 | Enthone Omi Inc | ELECTROPLATTING METHODS, COMPOSITIONS AND COATINGS |
GB2369239A (en) * | 2000-11-17 | 2002-05-22 | Univ Hong Kong Polytechnic | Nickel oxyhydroxide and cadmium electrodes for storage cells |
-
1969
- 1969-04-18 CH CH588369A patent/CH522740A/en not_active IP Right Cessation
- 1969-05-01 NL NL6906666A patent/NL6906666A/xx unknown
- 1969-05-20 US US826280A patent/US3586611A/en not_active Expired - Lifetime
- 1969-06-16 FR FR6919987A patent/FR2011755A1/fr not_active Withdrawn
- 1969-06-24 GB GB31750/69A patent/GB1279141A/en not_active Expired
- 1969-06-26 SE SE9091/69A patent/SE345697B/xx unknown
- 1969-06-27 AT AT617369A patent/AT283841B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4179344A (en) * | 1973-07-02 | 1979-12-18 | Lea-Ronal, Inc. | Gold alloy plating compositions and method |
US4547436A (en) * | 1982-11-19 | 1985-10-15 | E. I. Du Pont De Nemours And Company | Conductive element metallized with a thick film gold composition |
US4486275A (en) * | 1983-02-07 | 1984-12-04 | Heinz Emmenegger | Solution for electroplating a gold-copper-cadmium alloy |
US5006208A (en) * | 1989-09-06 | 1991-04-09 | Degussa Aktiengesellschaft | Galvanic gold alloying bath |
Also Published As
Publication number | Publication date |
---|---|
GB1279141A (en) | 1972-06-28 |
SE345697B (en) | 1972-06-05 |
AT283841B (en) | 1970-08-25 |
FR2011755A1 (en) | 1970-03-06 |
NL6906666A (en) | 1969-12-30 |
CH522740A (en) | 1972-06-30 |
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