US3324530A - Connector support assembly for transistor connector and method of making the support assembly - Google Patents

Connector support assembly for transistor connector and method of making the support assembly Download PDF

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Publication number
US3324530A
US3324530A US385095A US38509564A US3324530A US 3324530 A US3324530 A US 3324530A US 385095 A US385095 A US 385095A US 38509564 A US38509564 A US 38509564A US 3324530 A US3324530 A US 3324530A
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Prior art keywords
connector
photosensitive resist
support
transistor
connectors
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Expired - Lifetime
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US385095A
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Ralph L Sherwood
Daniel C Hughes
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Definitions

  • This invention relates to a throwaway jig and connector supporting assembly for the connectors to a transistor and the method of making the connector support assembly.
  • One object of the invention is to provide a support for the connectors for use with transistors that will ease the assembly operation.
  • Another object of the invention is to provide a support for the connectors for use with transistors that Will simplify and decrease the cost of assembly of transistors.
  • FIG. 1 shows a plan view of the throwaway jig and connector support device of the invention
  • FIG. 2 is a sectional view of the device of FIG. 1 along the line 2-2;
  • FIG. 3 shows the mask used for preparing the upper surface of the device of FIG. 1;
  • FIG. 4 shows the mask used for preparing the lower surface of the device of FIG. 1;
  • FIG. 5 shows the device of FIG. 1 as it is used in connecting the leads to the transistor.
  • a number of connectors arranged to suit the geometry of the device with which they are to be used are supported on an alignment device or jig. Shear holes and breakaway supports are provided so that the connectors can be separated from the alignment device after the connectors are secured to the tran sistor and the wire leads.
  • FIG. 1 of the drawing shows a support jig and connector assembly having a support 11 and alignment holes 12, 13 and 14.
  • An emitter connector 15 is supported on the support 11 at 16.
  • the base connector 17 is supported at 18 and the collector connector 21) is supported by a pair of breakaway support strips 21 and 22.
  • Shear holes 23 and 24 are provided in the emitter and base leads 15 and 17 respectively.
  • a photosensitive resist 30 is coated on one side of steel sheet 26 which may, for example, be stainless steel.
  • the sheet is then masked with the mask 31 shown in FIG. 3 and exposed.
  • the unexposed portions are then removed by washing and gold is electro-formed onto the exposed areas to the desired thickness.
  • the back of the steel plate 26 is then coated with a photosensitive resist 34, masked with mask 35, having an area corresponding generally to the area of the electrodes except for the area of the supports at 16, 18 and portions of support strips 21 and 22, shown in FIG. 4.
  • the back coating is then exposed.
  • the unexposed portions corresponding to areas 37, 38, 39, 40 as shown on mask 35 are then removed by washing.
  • the assembly is then subjected to an etchant such as ferric chloride which attacks the stainless steel but has no effect on the gold.
  • an etchant such as ferric chloride which attacks the stainless steel but has no effect on the gold.
  • the etching removes the stainless steel material in the holes and under the three gold connectors.
  • the support and connector assembly is then ready for use.
  • the device is used as shown in FIG. 5.
  • the jig and connector assembly is aligned over the transistor 42, by aligning holes 12, 13 and 14 on a fixture, not shown.
  • the emitter and base connectors 15 and 17 are resistance welded to the wire leads 43 and 44 respectively and the collector connector 20 is resistance Welded to the top of collector lead 46.
  • the connectors 15, 17 and 20 are then sheared from support 11 at shear holes 23 and 24 and support strips 21 and 22. The connectors are then bonded to the transistor. The support 11 which remains is discarded as scrap.
  • a throwaway jig and connector support assembly for the connectors of a transistor comprising a steel support member; a plurality of alignment holes in said steel support member; an opening substantially centrally located in said support; gold emitter and base transistor connector members, supported on said steel support member, projecting into said opening; said emitter and base connector members having shear holes therein whereby said connectors may be removed from said support member; a gold collector connector member projecting into said openings and a plurality of breakable tab means supporting said collector connector member on said support member adjacent said opening.
  • the method for making a connector support assembly for the connectors of a transistor comprising: coating one surface of a steel support member with a photosensitive resist; masking said photosensitive resist with a mask having the desired opaque electrode and electrode support pattern thereon; exposing said photosensitive resist to light to harden the unmasked regions; washing the unhardened coating from the masked regions; electro-forming gold onto the steel support member in the uncoated regions; coating the back surface of said steel support with a photosensitive resist; masking the photosensitive resist on the back of said support member with a mask having areas corresponding to a plurality of alignment holes and an area corresponding generally to the area of said connectors except for small support portions; exposing said photosensitive resist to light to harden the unmasked regions; washing the unhardened coating from the masked regions; and etching the exposed areas of the steel support with ferric chloride etch.
  • the method for providing connectors for a transistor comprising: coating one surface of a steel support member with a photosensitive resist; masking said photosensitive resist with a mask having the desired opaque electrode and electrode support pattern thereon; exposing said photosensitive resist to light to harden the unmasked regions; washing the unhardened coating from the masked regions; electro-forming gold onto the steel wire leads of a transistor; shearing said support from said connectors and bonding said connectors to corresponding regions of the transistor.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)

Description

June 1967 R. L. SHERWOOD ETAL I 3, 5%
CONNECTOR SUPPORT ASSEMBLY FOR TRANSISTOR CONNECTOR AND METHOD OF MAKING THE SUPPORT ASSEMBLY Filed July 24, 1964 2 SheetsSheet 1 M I I :Fi 51 23 2o 6 24 KIIIHIIH III/ ,1 I} \\l k T 30 A..-.-..-a4 E1 INVENTORS @041 ,1. 5/764? woao u 1967 R. L. SHERWOOD ETAL 3,
CONNECTOR SUPPORT ASSEMBLY FOR TRANSISTOR CONNECTOR AND METHOD OF MAKING THE SUPPORT ASSEMBLY Filed July 24, 1964 2 Sheets-Sheet 2 o ngae' -3 38 40 g m E INVENTORS 1941p l. JAQDPWQOO 019N652 E. A! 5,019.
3!3:Z\4,53" Patented June 13, 1967 Force Filed July 24, 1964-, Ser. No. 385,095 3 Claims. ((Cl. 29-4555) This invention relates to a throwaway jig and connector supporting assembly for the connectors to a transistor and the method of making the connector support assembly.
One object of the invention is to provide a support for the connectors for use with transistors that will ease the assembly operation.
Another object of the invention is to provide a support for the connectors for use with transistors that Will simplify and decrease the cost of assembly of transistors.
These and other objects Will be more fully understood from the following detailed description taken with the drawings wherein:
FIG. 1 shows a plan view of the throwaway jig and connector support device of the invention;
FIG. 2 is a sectional view of the device of FIG. 1 along the line 2-2;
FIG. 3 shows the mask used for preparing the upper surface of the device of FIG. 1;
FIG. 4 shows the mask used for preparing the lower surface of the device of FIG. 1; and
FIG. 5 shows the device of FIG. 1 as it is used in connecting the leads to the transistor.
In the assembly of most transistor devices it is necessary to make various connections between the crystal or pellet of the transistor and the wire leads. These connections are generally made with various wire forms.
According to this invention a number of connectors, arranged to suit the geometry of the device with which they are to be used are supported on an alignment device or jig. Shear holes and breakaway supports are provided so that the connectors can be separated from the alignment device after the connectors are secured to the tran sistor and the wire leads.
With reference to FIG. 1 of the drawing reference number shows a support jig and connector assembly having a support 11 and alignment holes 12, 13 and 14. An emitter connector 15 is supported on the support 11 at 16. The base connector 17 is supported at 18 and the collector connector 21) is supported by a pair of breakaway support strips 21 and 22. Shear holes 23 and 24 are provided in the emitter and base leads 15 and 17 respectively.
In making the device of FIG. 1 a photosensitive resist 30 is coated on one side of steel sheet 26 which may, for example, be stainless steel. The sheet is then masked with the mask 31 shown in FIG. 3 and exposed. The unexposed portions are then removed by washing and gold is electro-formed onto the exposed areas to the desired thickness. The back of the steel plate 26 is then coated with a photosensitive resist 34, masked with mask 35, having an area corresponding generally to the area of the electrodes except for the area of the supports at 16, 18 and portions of support strips 21 and 22, shown in FIG. 4. The back coating is then exposed. The unexposed portions corresponding to areas 37, 38, 39, 40 as shown on mask 35 are then removed by washing. The assembly is then subjected to an etchant such as ferric chloride which attacks the stainless steel but has no effect on the gold. The etching removes the stainless steel material in the holes and under the three gold connectors. The support and connector assembly is then ready for use.
The device is used as shown in FIG. 5. The jig and connector assembly is aligned over the transistor 42, by aligning holes 12, 13 and 14 on a fixture, not shown. The emitter and base connectors 15 and 17 are resistance welded to the wire leads 43 and 44 respectively and the collector connector 20 is resistance Welded to the top of collector lead 46. The connectors 15, 17 and 20 are then sheared from support 11 at shear holes 23 and 24 and support strips 21 and 22. The connectors are then bonded to the transistor. The support 11 which remains is discarded as scrap.
There is thus provided a jig and connector support assembly for the connectors of a transistor.
While a certain specific embodiment has been described in detail it is obvious that numerous changes may be made without departing from the general principles and scope of the invention.
We claim:
1. A throwaway jig and connector support assembly for the connectors of a transistor: comprising a steel support member; a plurality of alignment holes in said steel support member; an opening substantially centrally located in said support; gold emitter and base transistor connector members, supported on said steel support member, projecting into said opening; said emitter and base connector members having shear holes therein whereby said connectors may be removed from said support member; a gold collector connector member projecting into said openings and a plurality of breakable tab means supporting said collector connector member on said support member adjacent said opening.
2. The method for making a connector support assembly for the connectors of a transistor comprising: coating one surface of a steel support member with a photosensitive resist; masking said photosensitive resist with a mask having the desired opaque electrode and electrode support pattern thereon; exposing said photosensitive resist to light to harden the unmasked regions; washing the unhardened coating from the masked regions; electro-forming gold onto the steel support member in the uncoated regions; coating the back surface of said steel support with a photosensitive resist; masking the photosensitive resist on the back of said support member with a mask having areas corresponding to a plurality of alignment holes and an area corresponding generally to the area of said connectors except for small support portions; exposing said photosensitive resist to light to harden the unmasked regions; washing the unhardened coating from the masked regions; and etching the exposed areas of the steel support with ferric chloride etch.
3. The method for providing connectors for a transistor comprising: coating one surface of a steel support member with a photosensitive resist; masking said photosensitive resist with a mask having the desired opaque electrode and electrode support pattern thereon; exposing said photosensitive resist to light to harden the unmasked regions; washing the unhardened coating from the masked regions; electro-forming gold onto the steel wire leads of a transistor; shearing said support from said connectors and bonding said connectors to corresponding regions of the transistor.
References Cited UNITED STATES PATENTS 5/1961 McMahon 317-235 1/1963 Kilby 317--235 0 WILLIAM I. BROOKS, Primary Examiner.

Claims (1)

  1. 2. THE METHOD FOR MAKING A CONNECTOR SUPPORT ASSEMBLY FOR THE CONNECTORS OF A TRANSISTOR COMPRISING: COATING ONE SURFACE OF A STEEL SUPPORT MEMBER WITH A PHOTOSENSITIVE RESIST; MASKING SAID PHOTOSENSITIVE RESIST WITH A MASK HAVING THE DESIRED OPAQUE ELECTRODE AND ELECTRODE SUPPORT PATTERN THEREON; EXPOSING SAID PHOTOSENSITIVE RESIST TO LIGHT TO HARDEN THE UNMASKED REGIONS; WASHING THE UNHARDENED COATING FROM THE MASKED REGIONS; ELECTRO-FORMING GOLD ONTO THE STEEL SUPPORT MEMBER IN THE UNCOATED REGIONS; COATING THE BACK SURFACE OF SAID STEEL SUPPORT WITH A PHOTOSENSITIVE RESIST; MASKING THE PHOTOSENSITIVE RESIST ON THE BACK OF SAID SUPPORT MEMBER WITH A MASK HAVING AREAS CORRESPONDING TO A PLURALITY OF ALIGNMENT HOLES AND AN AREA CORRESPONDING GENERALLY TO THE AREA OF SAID CONNECTORS EXCEPT FOR SMALL SUPPORT PORTIONS; EXPOSING SAID PHOTOSENSITIVE RESIST TO LIGHT TO HARDEN THE UNMASKED REGIONS; WASHING THE UNHARDENED COATING FROM THE MASKED REGIONS; AND ETCHING THE EXPOSED AREAS OF THE STEEL SUPPORT WITH FERRIC CHLORIE ETCH.
US385095A 1964-07-24 1964-07-24 Connector support assembly for transistor connector and method of making the support assembly Expired - Lifetime US3324530A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3678346A (en) * 1964-11-10 1972-07-18 Trw Inc Semiconductor device and method of making the same
US4045863A (en) * 1971-06-03 1977-09-06 Siemens Aktiengesellschaft Method of producing metallic carrier system for a multi-electrode semiconductor strip
US4308339A (en) * 1980-02-07 1981-12-29 Westinghouse Electric Corp. Method for manufacturing tape including lead frames

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3072832A (en) * 1959-05-06 1963-01-08 Texas Instruments Inc Semiconductor structure fabrication

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3072832A (en) * 1959-05-06 1963-01-08 Texas Instruments Inc Semiconductor structure fabrication

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3678346A (en) * 1964-11-10 1972-07-18 Trw Inc Semiconductor device and method of making the same
US4045863A (en) * 1971-06-03 1977-09-06 Siemens Aktiengesellschaft Method of producing metallic carrier system for a multi-electrode semiconductor strip
US4308339A (en) * 1980-02-07 1981-12-29 Westinghouse Electric Corp. Method for manufacturing tape including lead frames

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