US20220082307A1 - Air-conditioned garment having semiconductor cooling system - Google Patents

Air-conditioned garment having semiconductor cooling system Download PDF

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Publication number
US20220082307A1
US20220082307A1 US17/420,434 US202017420434A US2022082307A1 US 20220082307 A1 US20220082307 A1 US 20220082307A1 US 202017420434 A US202017420434 A US 202017420434A US 2022082307 A1 US2022082307 A1 US 2022082307A1
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Prior art keywords
semiconductor cooling
air
cold air
garment body
module
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Abandoned
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US17/420,434
Inventor
Yonggen CHEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Qiyi Special Clothing Co Ltd
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Zhejiang Qiyi Special Clothing Co Ltd
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Filing date
Publication date
Application filed by Zhejiang Qiyi Special Clothing Co Ltd filed Critical Zhejiang Qiyi Special Clothing Co Ltd
Publication of US20220082307A1 publication Critical patent/US20220082307A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D13/00—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches
    • A41D13/002—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment
    • A41D13/005—Professional, industrial or sporting protective garments, e.g. surgeons' gowns or garments protecting against blows or punches with controlled internal environment with controlled temperature
    • A41D13/0053—Cooled garments

Definitions

  • This invention generally relates to the technical field of air-conditioned clothing, and more particularly, to an air-conditioned garment having a semiconductor cooling system.
  • the air-conditioned clothes sold on the market primarily consists of three types: a vortex-cooled type, a bag-inserting type and a direct air-cooled type.
  • the vortex-cooled type air-conditioned clothes have shortcomings such as having loud noise, overly strong airflow, limited motion range and presents potential safety hazards.
  • the bag-inserting type air-conditioned clothes are bulky, uncomfortable and inconvenient to carry.
  • the direct air-cooled type air-conditioned clothes only speed up the heat dissipation, but lacks cooling or heating function and are uncomfortable to wear. All three types of air-conditioned clothes only have a cooling function or even do not even have a cooling function.
  • the purpose of the present invention is to provide an air-conditioned garment having a semiconductor cooling system.
  • an air-conditioned garment having a semiconductor cooling system comprising a garment body and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprises a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module for generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module, wherein the heat conduction module is attached to a second surface of the semiconductor cooling device, and the heat dissipation fan is fixedly arranged on the heat conduction module for generating a second directional airflow, wherein the first flow guide air cover guides the first directional airflow
  • the semiconductor cooling unit further comprises a power supply, a controller and control buttons.
  • the cold air guide module and the heat conduction module are provided with a plurality of airflow channels, and the direction of the airflow channels is directed to the exterior of the garment body from the interior of the garment body.
  • the cold air fan is located on one side of the airflow channel of the cold air guide module facing the exterior of the garment body, and the heat dissipation fan is located on one side of the airflow channel of the heat conduction module facing the interior of the garment body.
  • the first flow guide air cover is fixedly arranged on the outer side of the airflow channel of the cold air guide module.
  • the second flow guide air cover further comprises a flow guide plate fixedly arranged on the outer side of the airflow channel of the heat conduction module.
  • the cold air guide module and the heat conduction module are heat dissipation fins.
  • the heat dissipation fins are made of aluminum or copper.
  • the present invention has the following advantages:
  • FIG. 1 is a conceptual diagram illustrating a three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 2 is another conceptual diagram illustrating a three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 3 is a conceptual diagram illustrating an internal three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 4 is another conceptual diagram illustrating an internal three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 5 is a conceptual diagram illustrating a top view of the internal structure of the semiconductor cooling unit of the present invention.
  • FIG. 6 is a conceptual diagram illustrating a mounting structure of the semiconductor cooling unit of the present invention.
  • first and second are used for descriptive purposes only and cannot be understood as the indication or implication of relative importance or the implication of the number of indicated technical features.
  • An air-conditioned garment having a semiconductor cooling system comprises a garment body 8 and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body 8 .
  • the semiconductor cooling unit further comprises a semiconductor cooling device 1 , a cold air guide module 2 , a cold air fan 3 , a heat conduction module 4 , a heat dissipation fan 5 , a first flow guide air cover 6 and a second flow guide air cover 7 .
  • the cold air guide module 2 is attached to a first surface 11 of the semiconductor cooling device, and the cold air fan 3 is fixedly arranged on the cold air guide module 2 for generating a first directional airflow.
  • the first directional airflow enters the garment body 8 after passing through the exterior of the garment body 8 and the surface of the cold air guide module 2 .
  • the first directional airflow is cooled after flowing through the surface of the cold air guide module 2 , and the cooled first directional airflow continues to enter the garment body 8 to cool the garment body, thereby making a user feel comfortable.
  • the heat conduction module 4 is attached to a second surface 12 of the semiconductor cooling device, and the heat dissipation fan 5 is fixedly arranged on the heat conduction module 4 for generating a second directional airflow.
  • the first flow guide air cover 6 guides the first directional airflow.
  • the second flow guide air cover 7 covers the exterior of the heat dissipation fan 5 , and the inlet of the second flow guide air cover 7 extends to the exterior of the garment body.
  • the second directional airflow flows out from the garment body 8 after passing through the inlet 71 and the outlet 72 of the second flow guide air cover as well as the surface of the heat conduction module 4 . Therefore, when the air passes through the surface of the heat conduction module 4 , the heat of the heat conduction module 4 is absorbed and finally taken out from the garment body 8 such that the heat dissipation and cooling of the heat conduction module are achieved.
  • the air-conditioned garment of the present invention further comprises a power supply, a controller and control buttons. Through tapping the control buttons, various functions can be selected by the user.
  • the power supply supplies power to the controller, and the controller controls the semiconductor cooling device 1 , the cold air fan 3 and the heat dissipation fan 5 to operate coordinately.
  • the semiconductor cooling device 1 is connected to the controller through a wire 13 .
  • the power supply is a rechargeable battery, and more preferably, the power supply is a lithium battery.
  • the cold air guide module 2 and the heat conduction module 4 are provided with a plurality of airflow channels 21 / 41 , and the direction of the airflow channels 21 / 41 is directed to the exterior of the garment body from the interior of the garment body.
  • the cold air fan 3 is located on one side of the airflow channel 21 of the cold air guide module facing the exterior of the garment body
  • the heat dissipation fan 5 is located on one side of the airflow channel 41 of the heat conduction module facing the interior of the garment body.
  • the first flow guide air cover 6 is fixedly arranged on the outer side of the airflow channel 21 of the cold air guide module, thus enabling the first directional airflow to sufficiently enter the garment body from the exterior of the garment body along the airflow channel 21 of the cold air guide module. In this way, the cooled first directional airflow is prevented from flowing towards the exterior of the garment body such that the utilization rate of the cooling capacity is enhanced and the cooling effect is improved.
  • the second flow guide air cover 7 further comprises a flow guide plate 73 fixedly arranged on the outer side of the airflow channel 41 of the heat conduction module. More preferably, the cold air guide module and the heat conduction module are heat dissipation fins, and the heat dissipation fins are made of aluminum or copper.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Physical Education & Sports Medicine (AREA)
  • Textile Engineering (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)

Abstract

An air-conditioned garment having a semiconductor cooling system comprising a garment body and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprises a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module for generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module.

Description

    TECHNICAL FIELD
  • This invention generally relates to the technical field of air-conditioned clothing, and more particularly, to an air-conditioned garment having a semiconductor cooling system.
    • BACKGROUND
  • For people who work outdoors or in the wild such as policemen, soldiers and geological explorers, and for people work in special environments such as steelworkers and foundrymen, conventional air conditioners cannot accommodate their needs. Therefore, various air-conditioned clothes capable of adjusting the temperature of human microenvironment are developed.
  • Presently, the air-conditioned clothes sold on the market primarily consists of three types: a vortex-cooled type, a bag-inserting type and a direct air-cooled type. The vortex-cooled type air-conditioned clothes have shortcomings such as having loud noise, overly strong airflow, limited motion range and presents potential safety hazards. The bag-inserting type air-conditioned clothes are bulky, uncomfortable and inconvenient to carry. The direct air-cooled type air-conditioned clothes only speed up the heat dissipation, but lacks cooling or heating function and are uncomfortable to wear. All three types of air-conditioned clothes only have a cooling function or even do not even have a cooling function.
    • SUMMARY
  • The purpose of the present invention is to provide an air-conditioned garment having a semiconductor cooling system.
  • The present invention adopts the following technical solution: an air-conditioned garment having a semiconductor cooling system comprising a garment body and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprises a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module for generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module, wherein the heat conduction module is attached to a second surface of the semiconductor cooling device, and the heat dissipation fan is fixedly arranged on the heat conduction module for generating a second directional airflow, wherein the first flow guide air cover guides the first directional airflow, wherein the second flow guide air cover covers the exterior of the heat dissipation fan, and the inlet of the second flow guide air cover extends to the exterior of the garment body, wherein the second directional airflow flows out from the garment body after passing through the inlet and the outlet of the second flow guide air cover as well as the surface of the heat conduction module.
  • In another preferred embodiment, the semiconductor cooling unit further comprises a power supply, a controller and control buttons.
  • In another preferred embodiment, the cold air guide module and the heat conduction module are provided with a plurality of airflow channels, and the direction of the airflow channels is directed to the exterior of the garment body from the interior of the garment body. The cold air fan is located on one side of the airflow channel of the cold air guide module facing the exterior of the garment body, and the heat dissipation fan is located on one side of the airflow channel of the heat conduction module facing the interior of the garment body.
  • In another preferred embodiment, the first flow guide air cover is fixedly arranged on the outer side of the airflow channel of the cold air guide module.
  • In another preferred embodiment, the second flow guide air cover further comprises a flow guide plate fixedly arranged on the outer side of the airflow channel of the heat conduction module.
  • In another preferred embodiment, the cold air guide module and the heat conduction module are heat dissipation fins.
  • In another preferred embodiment, the heat dissipation fins are made of aluminum or copper.
  • Compared with the prior art, the present invention has the following advantages:
      • (1) A semiconductor cooling device is used to cool the air blown into the garment body, thereby effectively cooling the garment body and significantly improves the comfort of wearing the air-conditioned garment in hot.
      • (2) Because greater temperature difference between the first end and the second end (cold end and hot end) of the semiconductor cooling device produces higher cooling efficiency, by means of the novel design of the semiconductor cooling unit of the present invention, the heat dissipation performance of the second end (hot end) of the semiconductor cooling device is significantly enhanced. Cooling efficiency and effectiveness of the first end of the semiconductor cooling device are significantly improved.
    BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a conceptual diagram illustrating a three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 2 is another conceptual diagram illustrating a three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 3 is a conceptual diagram illustrating an internal three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 4 is another conceptual diagram illustrating an internal three-dimensional structure of the semiconductor cooling unit of the present invention.
  • FIG. 5 is a conceptual diagram illustrating a top view of the internal structure of the semiconductor cooling unit of the present invention.
  • FIG. 6 is a conceptual diagram illustrating a mounting structure of the semiconductor cooling unit of the present invention.
    •  DETAILED DESCRIPTION
  • To make the purpose, technical solution and benefits of the present invention clearer, detailed embodiments are combined hereinafter to clearly and completely describe the techniques of the present invention. Obviously, the described embodiments are merely a representative part but not all of the embodiments of the present invention. The specification of the present invention allows those skilled in the art to obtain other embodiments without paying creative labor, and thus all of which shall fall into the scope of the present invention.
  • In the description of the present invention, it should be understood that the orientations or positions indicated by the terms “upper” and “lower” are based on the orientations or positions shown in the figures. They are merely for the convenience of describing and simplifying the description of the present invention, but not indicating or implying that the equipment or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Thus, they cannot be understood as a limitation of the present invention.
  • In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as the indication or implication of relative importance or the implication of the number of indicated technical features.
  • An air-conditioned garment having a semiconductor cooling system comprises a garment body 8 and a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body 8. The semiconductor cooling unit further comprises a semiconductor cooling device 1, a cold air guide module 2, a cold air fan 3, a heat conduction module 4, a heat dissipation fan 5, a first flow guide air cover 6 and a second flow guide air cover 7. The cold air guide module 2 is attached to a first surface 11 of the semiconductor cooling device, and the cold air fan 3 is fixedly arranged on the cold air guide module 2 for generating a first directional airflow. The first directional airflow enters the garment body 8 after passing through the exterior of the garment body 8 and the surface of the cold air guide module 2. The first directional airflow is cooled after flowing through the surface of the cold air guide module 2, and the cooled first directional airflow continues to enter the garment body 8 to cool the garment body, thereby making a user feel comfortable. The heat conduction module 4 is attached to a second surface 12 of the semiconductor cooling device, and the heat dissipation fan 5 is fixedly arranged on the heat conduction module 4 for generating a second directional airflow. The first flow guide air cover 6 guides the first directional airflow. The second flow guide air cover 7 covers the exterior of the heat dissipation fan 5, and the inlet of the second flow guide air cover 7 extends to the exterior of the garment body. The second directional airflow flows out from the garment body 8 after passing through the inlet 71 and the outlet 72 of the second flow guide air cover as well as the surface of the heat conduction module 4. Therefore, when the air passes through the surface of the heat conduction module 4, the heat of the heat conduction module 4 is absorbed and finally taken out from the garment body 8 such that the heat dissipation and cooling of the heat conduction module are achieved.
  • To achieve the control of the semiconductor cooling unit, in this embodiment, the air-conditioned garment of the present invention further comprises a power supply, a controller and control buttons. Through tapping the control buttons, various functions can be selected by the user. The power supply supplies power to the controller, and the controller controls the semiconductor cooling device 1, the cold air fan 3 and the heat dissipation fan 5 to operate coordinately. The semiconductor cooling device 1 is connected to the controller through a wire 13. To allow the user to move flexibly and conveniently when wearing the air-conditioned garment, preferably, the power supply is a rechargeable battery, and more preferably, the power supply is a lithium battery.
  • Further, preferably, the cold air guide module 2 and the heat conduction module 4 are provided with a plurality of airflow channels 21/41, and the direction of the airflow channels 21/41 is directed to the exterior of the garment body from the interior of the garment body. The cold air fan 3 is located on one side of the airflow channel 21 of the cold air guide module facing the exterior of the garment body, and the heat dissipation fan 5 is located on one side of the airflow channel 41 of the heat conduction module facing the interior of the garment body. Through adopting this arrangement, the airflow of the semiconductor cooling unit becomes more reasonable, the heat of the semiconductor cooling device is effectively dissipated, the cooling efficiency is significantly enhanced and the cooling effect of the air-conditioned garment is greatly improved.
  • In this embodiment, preferably, the first flow guide air cover 6 is fixedly arranged on the outer side of the airflow channel 21 of the cold air guide module, thus enabling the first directional airflow to sufficiently enter the garment body from the exterior of the garment body along the airflow channel 21 of the cold air guide module. In this way, the cooled first directional airflow is prevented from flowing towards the exterior of the garment body such that the utilization rate of the cooling capacity is enhanced and the cooling effect is improved. Additionally, the second flow guide air cover 7 further comprises a flow guide plate 73 fixedly arranged on the outer side of the airflow channel 41 of the heat conduction module. More preferably, the cold air guide module and the heat conduction module are heat dissipation fins, and the heat dissipation fins are made of aluminum or copper.
  • The above embodiments are merely preferred embodiments of the present invention, which do not limit the scope of the present invention. Therefore, all equivalent changes made according to the structure, shape and principle of the present invention shall fall into the scope of the present invention.

Claims (7)

What is claimed is:
1. An air-conditioned garment having a semiconductor cooling system, comprising:
a garment body, and
a semiconductor cooling unit, wherein the semiconductor cooling unit is fixedly arranged on the garment body, wherein the semiconductor cooling unit further comprising:
a semiconductor cooling device, a cold air guide module, a cold air fan, a heat conduction module, a heat dissipation fan, a first flow guide air cover and a second flow guide air cover, wherein the cold air guide module is attached to a first surface of the semiconductor cooling device, and the cold air fan is fixedly arranged on the cold air guide module, wherein the cold air fan is capable of generating a first directional airflow, wherein the first directional airflow enters the garment body after passing through the exterior of the garment body and the surface of the cold air guide module, wherein the heat conduction module is attached to a second surface of the semiconductor cooling device, and the heat dissipation fan is fixedly arranged on the heat conduction module, wherein the heat dissipation fan is capable of generating a second directional airflow, wherein the first flow guide air cover guides the first directional airflow, wherein the second flow guide air cover covers the exterior of the heat dissipation fan, and wherein an inlet of the second flow guide air cover extends to the exterior of the garment body, wherein the second directional airflow flows out from the garment body after passing through the inlet, the outlet of the second flow guide air cover and the surface of the heat conduction module.
2. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the semiconductor cooling unit further comprising a power supply, a controller and control buttons.
3. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the cold air guide module and the heat conduction module are provided with a plurality of airflow channels, and the direction of the airflow channels is directed to the exterior of the garment body from the interior of the garment body, wherein the cold air fan is located on one side of the airflow channel of the cold air guide module facing the exterior of the garment body, and wherein the heat dissipation fan is located on one side of the airflow channel of the heat conduction module facing the interior of the garment body.
4. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the first flow guide air cover is fixedly arranged on an outer side of the airflow channel of the cold air guide module.
5. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the second flow guide air cover further comprising a flow guide plate fixedly arranged on an outer side of the airflow channel of the heat conduction module.
6. The air-conditioned garment having a semiconductor cooling system of claim 5, wherein the cold air guide module and the heat conduction module are heat dissipation fins.
7. The air-conditioned garment having a semiconductor cooling system of claim 1, wherein the heat dissipation fins are made of aluminum or copper.
US17/420,434 2019-12-16 2020-07-21 Air-conditioned garment having semiconductor cooling system Abandoned US20220082307A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201911295615.0A CN111000304A (en) 2019-12-16 2019-12-16 Air conditioning clothes with semiconductor refrigerating system
CN201911295615.0 2019-12-16
PCT/CN2020/103213 WO2021120616A1 (en) 2019-12-16 2020-07-21 Air-conditioned garment with semiconductor refrigeration system

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WO (1) WO2021120616A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111000304A (en) * 2019-12-16 2020-04-14 浙江奇翼特种服装有限公司 Air conditioning clothes with semiconductor refrigerating system

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US20080006036A1 (en) * 2005-10-03 2008-01-10 The United States Of America As Represented By The Secretary Of The Navy Personal portable environmental control system
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CN111000304A (en) 2020-04-14

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