US20220045112A1 - Camera assembly, lens module, and electronic device - Google Patents
Camera assembly, lens module, and electronic device Download PDFInfo
- Publication number
- US20220045112A1 US20220045112A1 US17/450,819 US202117450819A US2022045112A1 US 20220045112 A1 US20220045112 A1 US 20220045112A1 US 202117450819 A US202117450819 A US 202117450819A US 2022045112 A1 US2022045112 A1 US 2022045112A1
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- United States
- Prior art keywords
- photosensitive
- photosensitive chip
- functional components
- rdl structure
- camera assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Definitions
- the present disclosure generally relates to the field of lens modules and, in particular, to a camera assembly, a lens module, and an electronic device.
- the design level of the lens module plays an important role for determining quality of photographs taken by the electronic devices.
- the lens module often includes a camera assembly having a photosensitive chip and a lens assembly mounted on the camera assembly, used to capture images of photographed objects.
- a photosensitive chip having a larger imaging area is needed, and passive components, such as resistors and capacitors, and peripheral chips are usually disposed in the lens module.
- One aspect of the present disclosure provides a packaging method of a camera assembly, including: providing a carrier substrate and forming a redistribution layer (RDL) structure on carrier substrate; providing functional components having solder pads; forming a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip, that the photosensitive chip has solder pads facing the optical filter; temporarily bonding the optical filter of the photosensitive unit with the carrier substrate, and placing the functional components on the RDL structure, that each of the solder pads of the photosensitive chip and the solder pads of the functional components faces the RDL structure and electrically connects with the RDL structure; forming an encapsulation layer covering the carrier substrate, that the encapsulation layer is coplanar with a highest top of the photosensitive chip and the functional components; and removing the carrier substrate.
- RDL redistribution layer
- a camera assembly including: a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure.
- the photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip, the RDL structure and the optical filter are exposed from a top surface of the encapsulation layer, and a highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer.
- the photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.
- a lens module including: the camera assembly according to exemplary embodiments of the present disclosure; and a lens assembly, including a support member.
- the support member is mounted on a top surface of the encapsulation layer and surrounds the photosensitive unit and the functional components.
- the lens assembly is electrically connected to the photosensitive chip and the functional components.
- Another aspect of the present disclosure further provides an electronic device, including: the lens module according to exemplary embodiments of the present disclosure.
- FIGS. 1-13 illustrate schematic cross-sectional views of structures corresponding to certain stages during an exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure
- FIGS. 14-16 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure
- FIGS. 17-20 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure
- FIG. 21 is a schematic cross-sectional view of a lens module according to an exemplary embodiment of the present disclosure.
- FIG. 22 is a schematic cross-sectional view of an electronic device according to an exemplary embodiment of the present disclosure.
- the performance of a conventional lens module needs to be improved, and the conventional lens module is difficult to meet the needs of miniaturization and thinning of the lens module. The reasons are described as follows.
- a conventional lens module is mainly assembled by a circuit board, a photosensitive chip, functional components (for example, peripheral chips), and a lens assembly.
- the peripheral chips are usually mounted on a peripheral motherboard, and the photosensitive chip and the functional components are separated from each other.
- the circuit board is used to support the photosensitive chip, the functional components, and the lens assembly.
- the circuit board is also used to realize electrical connections between the photosensitive chip, the functional components, and the lens module.
- the photosensitive chip is usually disposed inside a support member in the lens module, and the peripheral chips are usually disposed outside the support member, so that there is a certain distance between the peripheral chips and the photosensitive chip, thereby reducing the speed of signal transmission.
- the peripheral chips usually include digital signal processor (DSP) chips and memory chips, so that it is easy to adversely affect the shooting speed and the storage speed, thereby reducing the performance of the lens module.
- DSP digital signal processor
- Exemplary embodiments of the present disclosure provide a camera assembly, a packaging method thereof, a lens module, and an electronic device, while improving the performance of the lens module and reducing the overall thickness of the lens module.
- a photosensitive chip and functional components are integrated in an encapsulation layer, and a redistribution layer structure is used to realize electrical connections.
- the exemplary embodiments of the present disclosure reduce the distance between the photosensitive chip and the functional components, and accordingly shorten the distance of the electrical connections between the photosensitive chip and the functional components, thereby significantly increasing the speed of signal transmission, thereby improving the performance of the lens module (for example, improving the shooting speed and the storage speed).
- the circuit board is omitted, thereby reducing the overall thickness of the lens module to meet the needs of miniaturization and thinning of the lens module.
- FIGS. 1-13 illustrate schematic cross-sectional views of structures corresponding to certain stages during an exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure.
- FIG. 2 is an enlarged view of a photosensitive chip of FIG. 1
- FIG. 4 is an enlarged view of an optical filter of FIG. 3
- a photosensitive unit 250 (shown in FIG. 5 ) is formed and includes a photosensitive chip 200 (shown in FIG. 5 ) and an optical filter 400 (shown in FIG. 5 ) mounted on the photosensitive chip 200 .
- the photosensitive chip 200 has solder pads facing the optical filter 400 .
- the photosensitive chip 200 is an image sensor chip.
- the photosensitive chip 200 is a CMOS image sensor (CIS) chip.
- the photosensitive chip may also be a charge coupled device (CCD) image sensor chip.
- the photosensitive chip 200 has an optical signal receiving surface 201 (shown in FIG. 2 ), and the photosensitive chip 200 receives and senses optical radiation signal through the optical signal receiving; surface 201 .
- the photosensitive chip 200 includes a photosensitive region 200 C and a peripheral region 200 E surrounding the photosensitive region 200 C, and the optical signal receiving surface 201 is located at the photosensitive region 200 C.
- the photosensitive chip 200 includes a plurality of pixel units, and thus the photosensitive chip 200 includes a plurality of semiconductor photosensitive devices (not shown), and a plurality of optical filter films (not shown) on the plurality of semiconductor photosensitive device.
- the plurality of optical filter films is used to selectively absorb and pass optical signal received by the optical signal receiving surface 201 .
- the photosensitive chip 200 further includes a plurality of microlens 210 on the plurality of optical filter films, and the plurality of microlens 210 is in one-to-one correspondence with the plurality of semiconductor photosensitive devices, thereby focusing the received optical radiation signal light to the corresponding plurality of semiconductor photosensitive devices.
- the optical signal receiving surface 201 corresponds to a top surface of the plurality of microlens 210 .
- the photosensitive chip 200 is generally a silicon-based chip and is fabricated by an integrated circuit fabrication technology.
- the photosensitive chip 200 has solder pads for electrically connecting the photosensitive chip 200 with other chips or components.
- the photosensitive chip 200 has first chip solder pads 220 formed on the peripheral region 200 E, and the first chip solder pads 220 are facing the optical filter 400 .
- a surface of the photosensitive chip 200 located on the same side of the optical signal receiving surface 201 exposes the first chip solder pads 220 .
- the photosensitive chip 200 is generally obtained by cutting a device wafer integrated with a plurality of photosensitive chips 200 .
- a first UV film 310 (shown in FIG. 1 ) is laminated to a surface of the device wafer facing away from the optical signal receiving surface 201 , and used to position the device wafer, thereby improving the cutting precision, and also fix and position the plurality of photosensitive chips 200 after the cutting.
- the first UV film 310 is laminated to the surface of the device wafer facing away from the optical signal receiving surface 201 by using a film laminating machine.
- the first UV film 310 is also laminated to a. bottom of a first frame 315 with a larger diameter, and the first frame 315 is used as a stretch film, so that the plurality of photosensitive chips 200 can be discretely fixed on the first UV film 310 after the cutting.
- Any suitable UV film and frame may be used for the disclosed first UV film 310 and first frame 315 without limitation according to various embodiments of the present disclosure.
- the optical filter 400 is mounted on the photosensitive chip 200 to prevent subsequent packaging processes from contaiminating the optical signal receiving surface 201 , and is also beneficial for reducing the overall thickness of the subsequent lens module to meet the needs of miniaturization and thinning the lens module.
- the optical filter 400 is one of an infrared filter glass sheet and a fully transparent glass sheet.
- the optical filter 400 is an infrared filter glass sheet, and is also used to eliminate the influence of infrared light in the incident light on the performance of the photosensitive chip 200 , thereby improving the imaging effect.
- the optical filter 400 is an infrared cut filter (IRCF), and the infrared cut filter may be a blue glass infrared cut fitter, or may include a glass sheet and an IR cut coating on a surface of the glass sheet.
- IRCF infrared cut filter
- the optical filter 400 includes a mounting surface 401 (shown in FIG. 3 ).
- the mounting surface 401 is a surface for mounting with the photosensitive chip 200 , that is, a surface for facing the photosensitive chip 200 .
- the optical filter 400 is a blue glass infrared cut filter
- a surface of the blue glass infrared cut filter is coated with an antireflection coating or an antireflection film, and a surface opposite to the surface coated with the antireflection coating or the antireflection film is the mounting surface 401 .
- the optical filter 400 includes a glass sheet and an IR cut coating on a surface of the glass sheet
- a surface of the glass sheet opposite to the IR cut coating is the mounting surface 401 .
- either surface of the fully transparent glass sheet may be a mounting surface.
- the optical filter 400 includes a light transmitting region 400 C and an edge region 400 E surrounding the light transmitting region 400 C.
- the light transmitting region 400 C is configured to transmit external incident light, so that the optical signal receiving surface 201 of the photosensitive chip 200 receives optical signal, to ensure the normal use function of the lens module.
- the edge region 400 E is a reserved space to mount the optical filter 400 on the photosensitive chip 200 .
- the optical filter 400 is mounted on the photosensitive chip 200 by an adhesive structure 410 , and the adhesive structure 410 surrounds the optical signal receiving surface 201 .
- the adhesive structure 410 is used to realize physical connection of the optical filter 400 and the photosensitive chip 200 .
- the optical filter 400 , the adhesive structure 410 , and the photosensitive chip 200 enclose a cavity (not labeled), avoiding direct contact of the optical filter 400 and the photosensitive chip 200 , thereby preventing the optical filter 400 from adversely affecting the performance of the photosensitive chip 200 .
- the adhesive structure 410 surrounds the optical signal receiving surface 201 , so that the optical filter 400 above the optical signal receiving surface 201 is located on the photosensitive path of the photosensitive chip 200 , therefore the performance of the photosensitive chip 200 is guaranteed.
- the material of the adhesive structure 410 is a photolithographic material.
- the adhesive structure 410 can be formed by a photolithography process, which not only may help in improving the morphological quality and the dimensional accuracy of the adhesive structure 410 , and in improving packaging efficiency and production capacity, but also may reduce the impact on the bonding strength of the adhesive structure 410 .
- the material of the adhesive structure 410 is a photolithographic dry film.
- the material of the adhesive structure may also be one of a photolithographic polyimide, a photolithographic polybenzoxazole (PBO), and a photolithographic benzocyclobutene (BCB).
- the adhesive structure 410 is formed on the optical filter 400 .
- the mounting steps include: as shown in FIG. 3 , providing a first carrier substrate 340 ; temporarily bonding a surface of the optical filter 400 opposite to the mounting surface 401 with the first carrier substrate 340 ; forming the annular adhesive structure 410 in the edge region 400 E (shown in FIG, 4 ) of the optical filter 400 , after the temporary bonding; and as shown in FIG. 5 , forming the photosensitive unit 250 , by facing the optical signal receiving surface 201 of the photosensitive chip 200 to the annular adhesive structure 410 and mounting the peripheral region 200 E (shown in FIG. of the photosensitive chip 200 to the annular adhesive structure 410 .
- the first carrier substrate 340 is used to provide a process platform for the formation of the adhesive structure 410 and the mounting steps.
- the first carrier substrate 340 is a carrier wafer.
- the first carrier substrate may also be other types of substrates.
- the optical filter 400 is temporarily bonded with the first carrier substrate 340 via a first temporary bonding layer 345 .
- the first temporary bonding layer 345 serves as a peeling layer to facilitate subsequent debonding.
- the first temporary bonding layer 345 is a foamed film.
- the foamed film includes a micro-adhesive surface and a foamed surface that are opposite to each other.
- the foamed film is adhesive at normal temperature, and the foamed surface is attached to the first carrier substrate 340 . Subsequently the foaming film is heated to cause the foamed surface to lose adhesiveness, thus debonding is achieved.
- the first temporary bonding layer may also be a die attach film (DAF).
- the packaging method further includes forming first conductive bumps 362 on the first chip solder pads 220 .
- the first conductive bumps 362 protrude from a surface of the photosensitive chip 200 , serve as external electrodes of the photosensitive chip 200 , are prepared for electrical connections of the first chip solder pads 220 and a subsequent redistribution layer structure, and are beneficial to improve the electrical connection reliability of the first chip solder pads 220 and the subsequent redistribution layer structure.
- the first conductive bumps 362 are formed by a ball planting process.
- the overall thickness of the optical filter 400 and the adhesive structure 410 is large (for example, between about 200 micrometers and about 300 micrometers), and the first conductive bumps 362 formed by the ball bonding process are bulky, thereby being easy to realize contact between the first conductive bumps 362 and the redistribution layer structure.
- the first conductive bumps 362 are formed on a surface of the first chip solder pads 220 corresponding to the photosensitive chip 200 before the device wafer integrated with the plurality of photosensitive chip 200 is cut.
- the ball planting process includes a reflow step.
- the process temperature of the reflow step is generally in a range of about 180° C. to about 350° C.
- the process temperature of the reflow step is high.
- the photosensitive chip 200 is attached to a second UV film 320 , before the first carrier substrate 340 (shown in FIG. 5 ) is removed by performing a first debonding process.
- the second UV film 320 By attaching to the second UV film 320 , it is advantageous to improve the positional accuracy of the photosensitive unit 250 on another carrier substrate.
- the adhesiveness of the second UV film 320 can be weakened under ultraviolet light, and the photosensitive unit 250 can be easily removed from the second UV film 320 in a sequent process.
- the second UV film 320 is in close contact with the surface of the photosensitive chip 200 facing away from the optical signal receiving surface 201 , and is also attached to a bottom of a second frame 325 having a larger diameter.
- the second frame 325 serves as a stretch film, and the photosensitive unit 250 is discretely fixed to the second UV film 320 .
- Any suitable UV film and frame may be used for the disclosed second UV film 320 and second frame 325 without limitation according to various embodiments of the present disclosure.
- the first temporary bonding layer 345 (shown in FIG. 5 ) is a foamed film, and thus the first debonding process is performed by using a pyrolysis bonding process.
- the first temporary bonding layer 345 is subjected to a heat treatment to lose the adhesiveness of the foamed surface of the foamed film, thereby removing the first carrier substrate 340 , and then removing the first temporary bonding layer 345 by peeling.
- the packaging method further includes forming a stress buffer layer 420 covering sidewalls of the optical filter 400 .
- the stress buffer layer 42 . 0 is beneficial to reduce the stress generated by a subsequently formed encapsulation layer on the optical filter 400 to reduce the probability of the optical filter 400 being broken, thereby improving the reliability and the yield of the packaging process.
- the optical filter 400 is an infrared filter glass sheet or a fully transparent glass sheet, and the glass sheet is highly susceptible to being broken due to stress, and the stress buffer layer 420 can significantly reduce the probability of the optical filter 400 being broken.
- the stress buffer layer 420 is adhesive to ensure its adhesion on the optical filter 400 .
- the material of the stress buffer layer 420 is an epoxy adhesive.
- the epoxy adhesive is an epoxy resin adhesive.
- the epoxy adhesive has a variety of forms. By changing the composition of the epoxy adhesive, materials with different elastic modulus can be obtained, so the stress on the optical filter 400 can be regulated according to actual conditions.
- the stress buffer layer 420 also covers sidewalls of the adhesive structure 410 to reduce the stress generated by the encapsulation layer on the adhesive structure 410 to further improve the reliability and the yield of the packaging process.
- the stress buffer layer 420 is formed by a dispensing process.
- the dispensing process the compatibility of forming the stress buffer layer 420 with the current packaging process is improved, and the process is simple.
- a second carrier substrate 330 is provided, and a redistribution layer (RDL) structure 360 (shown in FIG. 8 ) is formed on the second carrier substrate 330 .
- RDL redistribution layer
- the second carrier substrate 330 is used to provide a process platform to form the RDL structure 360 .
- the second carrier substrate 330 is a carrier wafer.
- the second carrier substrate may also be other types of substrates.
- the packaging method further includes forming a second temporary bonding layer 331 on the second carrier substrate 330 .
- the second temporary bonding layer 331 serves as a peeling layer to facilitate subsequent separation of the RDL structure 360 and the second carrier substrate 330 .
- the second temporary bonding layer 331 may be a foamed film.
- a passivation layer is formed on the second carrier substrate, before forming the second temporary bonding layer.
- the probability of contaminating the second carrier substrate during the process of forming the second temporary bonding layer is reduced by the passivation layer, thereby increasing the reuse rate of the second carrier substrate.
- the material of the passivation layer may be one of silicon oxide and silicon nitride.
- the RDL structure 360 is used to implement electrical integration of the formed camera assembly, and to improve the feasibility of the electrical connection process while reducing the distance between chips and components. In addition, compared to a wire drawing process, the RDL structure 360 can realize mass production and improve packaging efficiency.
- forming the RDL structure 360 includes: forming a first dielectric layer 332 on the second temporary bonding layer 331 (as shown in FIG. 7 ); patterning the first dielectric layer 332 , to form an interconnect trench 335 in the first dielectric layer 332 (as shown in FIG. 7 ) through a thickness of the first dielectric layer 332 ; filling a conductive material in the interconnect trench 335 to form the RDL structure 360 ; and removing the first dielectric layer 332 .
- the interconnect trench 335 in the first dielectric layer 332 is used to define the shape, the location, and the dimensions of the RDL structure 360 .
- the material of the first dielectric layer 332 is a photosensitive material, and correspondingly patterning can be realized by a photolithography process.
- the material of the first dielectric layer 332 is one of photosensitive polyimide, photosensitive benzocyclobutene, and photosensitive polybenzoxazole.
- the RDL structure 360 is formed in the interconnect trench 335 , and the RDL structure 360 is correspondingly an interconnect line, thereby reducing the process complexity of forming the RDL structure 360 .
- the interconnect trench 335 is filled with a conductive material by an electroplating process.
- the material of the RDL structure 360 is copper. By selecting copper, it is advantageous to improve the electrical connection reliability and the electrical conductivity of the RDL structure 360 . In addition, the filling property of copper is better, and the filling quality of the conductive material in the interconnect trench 335 can be correspondingly improved. In other embodiments, the material of the RDL structure may also be other applicable conductive materials.
- the material of the first dielectric layer 332 has high corrosion resistance. Therefore, in one embodiment, after the RDL structure 360 is formed, the first dielectric layer 332 is removed by a reactive ion etching process to expose the second temporary bonding layer 331 to make process preparation for subsequent processes.
- the RDL structure may be formed directly by an etching.
- forming the RDL structure may include: forming a conductive layer on the second temporary bonding layer; and etching the conductive layer, so that, the remaining conductive layer after etching can be used as the RDL structure.
- the material of the RDL structure may be a conductive material such as aluminum that can be easily patterned by an etching process.
- the functional components have solder pads.
- the optical filter 400 in the photosensitive unit 250 (shown in FIG. 5 ) is temporarily bonded with the second carrier substrate 330 and the functional components are placed on the RDL structure 360 .
- the solder pads of the photosensitive chip 200 and the solder pads of the functional components face the RDL structure 360 and electrically connect with the ROL structure 360 .
- the second UV film 320 (shown in FIG. 6 ) at the position of each single photosensitive unit 250 is irradiated with ultraviolet light to deactivate the second UV film 320 irradiated with ultraviolet light, and then the photosensitive unit 250 is sequentially peeled off from the second UV film 320 and placed at a predetermined position on the second carrier substrate 330 .
- the photosensitive unit 250 By placing the photosensitive unit 250 one by one on the second carrier substrate 330 , it is advantageous to improve the positional accuracy of the photosensitive unit 250 on the second carrier substrate 330 .
- the first conductive bumps 362 are in contact with the RDL structure 360 .
- One embodiment only illustrates one photosensitive unit 250 .
- the number of photosensitive units may be two or more.
- the functional components are components having specific functions other than the photosensitive chip 200 in the camera assembly, and include at least one of peripheral chips 230 and passive components 240 .
- the functional components include peripheral chips 230 and passive components 240 .
- the peripheral chips 230 are active components, and are used to provide peripheral circuits to the photosensitive chip 200 after being electrically connected with the photosensitive chip 200 , for example, analog power supply circuits and digital power supply circuits, voltage buffer circuits, shutter circuits, shutter driving circuits, etc.
- the peripheral chips 230 include one or two of digital signal processor chips and memory chips. In other embodiments, the peripheral chips may also include chips of other functional types. Only one peripheral chip 230 is illustrated in FIG. 9 , but the number of peripheral chips 230 is not limited to one.
- the peripheral chips 230 are typically silicon-based chips fabricated using integrated circuit fabrication techniques and also have solder pads for electrically connecting the peripheral chips 230 with other chips or components.
- the peripheral chips 230 include second chip solder pads 235 .
- the second chip solder pads 235 face the RDL structure 360 after the peripheral chips 230 are placed on the RDL structure 360 .
- the passive components 240 are used to play a specific role in the photographic operation of the photosensitive chip 200 .
- the passive components 240 can include smaller electronic components such as resistors, capacitors, inductors, diodes, transistors, potentiometers, relays, or drivers. Only one passive component 240 is illustrated in FIG. 9 , but the number of passive components 240 is not limited to one.
- the passive components 240 also have solder pads for electrical connections of the passive components 240 with other chips or components.
- the solder pads of the passive component 240 are electrodes 245 . After the passive components 240 are placed on the RDL structure 360 , the electrodes 245 face the RDL structure 360 .
- second conductive bumps 363 are formed on the second chip solder pads 235 and the electrodes 245 .
- the second conductive bumps 363 protrude from the surface of the peripheral chips 230 and the surface of the passive components 240 as external electrodes of the peripheral chips 230 and the passive components 240 , and improve the subsequent electrical connection reliability of the peripheral chips 230 and the passive components 240 with the RDL structure 360 .
- the height difference between a surface of the peripheral chips 230 and the passive components 240 facing away from the second carrier substrate 330 and a surface of the photosensitive chip 200 facing away from the second carrier substrate 330 is reduced by the second conductive bumps 363 , thereby being beneficial to reduce process complexity of a subsequent bonding process.
- the second conductive bumps 363 are formed by a ball planting process.
- the volumes of the balls are generally large, and it is easy to reduce the height difference between the surface of the peripheral chips 230 and the passive elements 240 facing away from the second carrier substrate 330 and the surface of the photosensitive chip 200 facing away from the second carrier substrate 330 .
- the second conductive bumps 363 are formed before placing the peripheral chips 230 and the passive components 240 on the RDL structure 360 , to avoid the influence of the reflow step to adhesiveness of the second temporary bonding layer 331 , and other chips or components. In addition, the accuracy of the positions at which the second conductive bumps 363 are formed can be improved. For a detailed description of the second conductive bumps 363 , reference may be made to the related description of the first conductive bumps 362 , and details are not described herein again.
- the second conductive bumps 363 are in contact with the RDL structure 360 .
- the first conductive bumps 362 and the second conductive bumps 363 are bonded with the RDL structure 360 .
- the bonding step is performed using a metal bonding process.
- the first conductive bumps 362 and the second conductive bumps 363 are bonded with the RDL structure 360 in a same metal bonding process step, thereby improving packaging efficiency and avoiding negative effects of the process temperature of multiple metal bonding processes.
- the metal bonding process is a thermocompression bonding process.
- the contact surfaces of the first conductive bumps 362 , the second conductive bumps 363 , and the RDL structure 360 are plastically deformed under pressure, so that atoms at contact surfaces contact with each other.
- the bonding process temperature increases, atomic diffusion at the contact surfaces accelerates, and cross-border diffusion is achieved.
- lattice at the contact surfaces is reorganized, thereby achieving bonding, with high bonding strength, high electrical and thermal conductivity, high electromigration resistance, and high mechanical connection properties.
- the bonding process temperature increases, the atoms at the contact surfaces get more energy, and the diffusion between the atoms is increased.
- the increase of the bonding process temperature can also promote growth of crystal grains, and the crystal grains that obtain energy can grow across the interface, which helps to eliminate the interface and integrate the materials at the contact surfaces.
- the bonding process temperature is too high, it is easy to adversely affect the performance of the photosensitive chip 200 and the peripheral chips 230 , especially for the sensitive components in the formed camera assembly.
- the too-high bonding process temperature may cause thermal stress, causing problems such as decreased alignment accuracy, increased process cost, and reduced production efficiency.
- the metal bonding process is a metal low temperature bonding process, and a bonding process temperature of the metal bonding process is less than or equal to about 250° C. As long as the lowest value of the bonding process temperature is sufficient to achieve the bonding.
- a bonding process pressure of the metal bonding process is greater than or equal to about 200 kPa. The pressure is generated by a pressing tool.
- a bonding process time of the metal bonding process is greater than or equal to about 30 minutes.
- the bonding process temperature, the bonding process pressure, and the bonding process time can be reasonably adjusted and matched to each other, thereby ensuring the quality and the efficiency of the metal bonding process. It should also be noted that to reduce the probability of oxidation or contamination of the contact surfaces, the metal bonding process may be performed in a vacuum environment.
- an encapsulation layer 350 is formed to cover the second carrier substrate 330 .
- the encapsulation layer 350 is coplanar with a highest top of the photosensitive chip 200 and the functional components (not labeled).
- the encapsulation layer 350 plays a role to fix the photosensitive chip 200 and the functional components (for example, the peripheral chips 230 and the passive components 240 ) for implementing package integration of the photosensitive chip 200 and the functional components.
- the functional components for example, the peripheral chips 230 and the passive components 240
- the encapsulation layer 350 can reduce the space occupied by a support member in a lens assembly, and can also omit a circuit board (for example, a printed circuit board (PCB)), thereby significantly reducing the overall thickness of the subsequently formed lens module to meet the needs for miniaturization and thinning the lens module.
- a circuit board for example, a printed circuit board (PCB)
- PCB printed circuit board
- the distance between the photosensitive chip 200 and the functional components can be reduced, thereby being beneficial to accordingly shorten the distance of the electrical connections between the photosensitive chip and the functional components, to significantly increase the speed of signal transmission, and improve the performance of the lens module (for example, improving the shooting speed and the storage speed).
- the encapsulation layer 350 is made of a molding material, and can also function as an insulator, a seal, and a moisture barrier, thereby improving the reliability of the lens module.
- the material of the encapsulation layer 350 is an epoxy resin.
- An epoxy resin has the advantages of low shrinkage, good adhesion, good corrosion resistance, excellent electrical properties, and low cost, so it is widely used as an encapsulating material for electronic devices and integrated circuits.
- forming the encapsulation layer 350 includes: forming an encapsulation material layer 355 (shown in FIG. 10 ), covering the second carrier substrate 330 , the photosensitive chip 200 , and the functional components; and performing a planarizing process on the encapsulation material layer 355 to form the encapsulation layer 350 , which is coplanar with the highest top of the photosensitive chip 200 and the functional components.
- the encapsulating material layer 355 is formed by an injection molding process.
- the injection molding process has the characteristics of high production speed, high efficiency, and automation of operation. Through the injection molding process, it is beneficial to increase the output and reduce the process cost.
- the encapsulation layer may also be formed using other molding processes.
- the encapsulating material layer 355 covers the photosensitive chip 200 and the functional components, and the process of forming the encapsulating layer 350 is prevented from being affected by the thickness difference between the photosensitive chip 200 and the functional components. Accordingly, it is not required to customize molds for the injection molding process and the process is simple.
- the encapsulation layer 350 also covers the sidewalls of the optical filter 400 , thereby improving the sealing property of the cavity in the photosensitive unit 250 , and reducing the probability of water vapor, oxidizing gas, etc., entering the cavity. The performance of the photosensitive chip 200 is guaranteed.
- the photosensitive unit 250 , the functional components, and the RDL structure 360 are all located in the encapsulation layer 350 , so that the photosensitive unit 250 , the functional components, and the RDL, structure 360 are all protected, which is beneficial to improve the reliability and the stability of the camera assembly.
- the encapsulation layer 350 a circuit board is omitted, and the overall thickness of the lens module can be reduced. Therefore, the photosensitive chip 200 and the peripheral chips 230 don't need to be thinned. The mechanical strength and the reliability of the photosensitive chip 200 and the peripheral chips 230 are improved. In other embodiments, the thickness of the photosensitive chip and the peripheral chips may be appropriately reduced according to process requirements, but the amount of thinning is small to ensure that the mechanical strength and the reliability are not affected.
- the thickness of the encapsulation layer 350 is made small by the planarizing process, thereby further reducing the overall thickness of the formed lens module.
- the planarizing process may not be performed to simplify the packaging process, and the formed encapsulation layer correspondingly covers the photosensitive chip and the functional components.
- a second debonding process is performed to remove the second carrier substrate 330 (shown in FIG. 11 ).
- the second debonding process includes sequentially removing the second carrier substrate 330 and the second temporary bonding layer 331 (as shown in FIG. 11 ).
- the second debonding process includes sequentially removing the second carrier substrate 330 and the second temporary bonding layer 331 (as shown in FIG. 11 ).
- a dicing process is performed on the encapsulation layer 350 .
- a single camera assembly 260 sized to meet the process requirements is formed to prepare the process for subsequent assembly of the lens assembly.
- the dicing process is performed using a laser cutting process.
- a flexible printed circuit (FPC) board 510 is bonded with a portion of the RUL structure 360 exposed from the encapsulation layer 350 .
- the FPC board 510 is configured to implement electrical connections between the camera assembly 260 and subsequent lens components and electrical connections between a formed lens module and other components in the case when a circuit board is omitted. After subsequently forming the lens module, the lens module can also be electrically connected with other components in an electronic device by the FPC board 510 , thereby implementing a normal camera function of the electronic device.
- the FPC board 510 has a circuit structure. Therefore, the FPC board 510 is bonded with the RDL structure 360 by a metal bonding process, thereby achieving electrical connection.
- the FPC board 510 is bonded with the RDL structure 360 after the second debonding process and the dicing process.
- a connector 520 is formed on the FPC board 510 for electrically connecting the FPC board 510 with other circuit components.
- the connector 520 is electrically connected with the motherboard of the electronic device, thereby realizing information transmission between the lens module and other components in the electronic device, to transmit image information from the lens module to the electronic device.
- the connector 520 can be a golden finger connector.
- FIGS. 14-16 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure.
- One embodiment differs from the foregoing embodiments in that a plurality of conductive bumps 365 a (shown in FIG. 15 ) is formed on a RDL structure 360 a.
- forming the plurality of conductive bumps 365 a on the RDL structure 360 a is described as follows.
- a second dielectric layer 333 a is formed to cover a second carrier substrate 330 a and the RDL structure 360 a.
- the second dielectric layer 333 a is patterned, and interconnect vias 385 a are formed in the second dielectric layer 333 a to expose a portion of the RDL structure 360 a.
- the interconnect vias 385 a are used to provide space to form subsequent conductive bumps.
- a conductive material is filled in the interconnect vias 385 a (shown in FIG. 14 ) to form the plurality of conductive bumps 365 a.
- the conductive material is filled by an electroplating process.
- the material of the plurality of conductive bumps 365 a may also be the same as the material of the RDL structure 360 a.
- the second dielectric layer 333 a is removed (as shown in FIG. 14 ).
- the second dielectric layer 333 a is removed by a reactive ion etching process.
- solder pads of the photosensitive chip and solder pads of the functional components are bonded with the corresponding plurality of conductive bumps 365 a.
- FIGS. 17-20 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure.
- a formed RDL structure 360 b includes an interconnection line 361 b and conductive pillars 365 b protruding from the interconnection line 361 b.
- forming the RDL structure 360 b on a second carrier substrate 330 b is described as follows.
- a first dielectric layer 332 b is formed on the second carrier substrate 330 b .
- the first dielectric layer 332 b is patterned, and an interconnect trench 335 b is formed in the first dielectric layer 332 b through a thickness of the first dielectric layer 332 b.
- the interconnect trench 335 b is used to define the shape, the location, and the dimensions of a subsequently formed interconnect line.
- first dielectric layer 332 b For a detailed description of the first dielectric layer 332 b , reference may be made to the corresponding description in the foregoing embodiments, and details are not described herein again.
- a conductive material 366 b is filled into the interconnect trench 335 b (shown in FIG. 17 ), and the conductive material 366 b also covers a top of the first dielectric layer 332 b.
- a patterned mask layer 367 b is formed on the conductive material 366 b and the patterned mask layer 367 b blocks the conductive material 366 b at locations of subsequent conductive pillars.
- the interconnect trench 335 b is filled with the conductive material 366 b by an electroplating process.
- the conductive material 366 b is copper.
- copper it is beneficial to improve the reliability of the electrical connection of the RDL structure.
- the resistivity of copper is low, so that the electrical conductivity of the RDL structure is also improved.
- the filling property of copper is good, the filling effect of the conductive material 366 b in the interconnect trench 335 b can be accordingly improved.
- other suitable conductive materials may also be selected.
- the patterned mask layer 367 b is used as an etching mask to subsequently etch the conductive material 366 b .
- the material of the patterned mask layer 367 is a photoresist.
- the mask layer may also be selected from other materials suitable for the etching process, and the mask layer may be a single layer structure or a laminated structure.
- the conductive material 366 b (shown in FIG. 18 ) is etched to the first dielectric layer 332 b by using the patterned mask layer 367 b as a mask, to form the interconnection line 361 b in the interconnect trench 335 b (shown in FIG. 17 ) and the conductive pillars 365 b protruding from the interconnect line 361 b .
- the interconnect line 361 b and the conductive pillars 365 b constitute the RDL structure 360 b.
- the conductive material 366 b may be etched by a dry etching to improve the morphological quality of the RDL structure 360 b.
- the patterned mask layer 367 b (shown in FIG. 19 ) and the first dielectric layer 332 b (shown in FIG. 19 ) are removed.
- the material of the patterned mask layer 367 b is a photoresist, so the patterned mask layer 367 b can be removed by an ashing or a wet stripping.
- the material of the first dielectric layer 332 b has strong corrosion resistance. Therefore, the first dielectric layer 332 b is removed by a reactive ion etching process, and the interconnect line 361 b is exposed from the second carrier substrate 330 b , thereby preparing the process for subsequent electrical connection process.
- solder pads of the photosensitive unit and solder pads of the functional components are bonded with the corresponding conductive pillars 365 b.
- one embodiment of the present disclosure further provides a camera assembly.
- a schematic cross-sectional view of a camera assembly according to one embodiment of the present disclosure is shown.
- a camera assembly 260 includes an encapsulation layer 350 , embedded with a photosensitive unit 250 (shown in FIG. 5 ), functional components (not labeled), and a RDL structure 360 .
- the photosensitive unit 250 includes a photosensitive chip 200 and an optical filter 400 mounted on the photosensitive chip 200 .
- a top surface of the encapsulation layer 350 exposes the RDL structure 360 and the optical filter 400
- a bottom surface of the encapsulation layer 350 exposes a highest top of the photosensitive chip 200 and the functional components.
- the photosensitive chip 200 and the functional components have solder pads facing the RDL structure 360 and electrically connecting with the RDL structure 360 .
- the encapsulation layer 350 plays a role to fix the photosensitive chip 200 , the functional components, and the RIX, structure 360 for implementing package integration of the photosensitive chip 200 , the functional components, and the RDL structure 360 .
- the encapsulation layer 350 reduces the space occupied by a support member in a lens assembly, and also omits a circuit board, thereby reducing the overall thickness of a lens module and meeting the needs of miniaturization and thinning of the lens module.
- the material of the encapsulation layer 350 is a plastic encapsulation material, and the encapsulation layer 350 can also function as an insulator, a seal, and a moisture barrier, thereby also improving the reliability of the lens module.
- the material of the encapsulation layer 350 is an epoxy resin.
- the encapsulation layer 350 includes a top surface and a. bottom surface opposite to each other.
- the top surface of the encapsulation layer 350 is a surface for mounting the lens assembly.
- the top surface of the encapsulation layer 350 exposes the RDL structure 360 and the optical filter 400
- the bottom surface of the encapsulation layer 350 exposes the highest top of the photosensitive chip 200 and the functional components.
- the process of forming the encapsulation layer 350 is prevented from being affected by the thickness difference between the photosensitive chip 200 and the functional components. In the process of forming the encapsulation layer 350 , a customized mold is not required, and the process is simple.
- the encapsulation layer 350 also covers sidewalls of the optical filter 400 , thereby improving the sealing property of the cavity in the photosensitive unit 250 , reducing the probability of water vapor, oxidizing gas, etc., entering the cavity, so that, the performance of the photosensitive chip 200 is guaranteed.
- the photosensitive unit 250 , the functional components, and the RDL structure 360 are all located within the encapsulation layer 350 to improve the reliability and the stability of the camera assembly.
- the photosensitive chip 200 is an image sensor chip. In some embodiments, the photosensitive chip 200 is a CMOS image sensor chip. In other embodiments, the photosensitive chip may also be a CCD image sensor chip.
- the photosensitive chip 200 includes a photosensitive region 200 C (shown in FIG. 2 ) and a peripheral region 200 E (shown in FIG. 2 ) surrounding the photosensitive region 200 C.
- the photosensitive chip 200 further has an optical signal receiving surface 201 located at the photosensitive region 200 C.
- the photosensitive chip 200 is typically a silicon-based chip, and solder pads of the photosensitive chip 200 are used to electrically connect the photosensitive chip 200 with other chips or components.
- the photosensitive chip 200 has first chip solder pads 220 located in the peripheral region 200 E.
- the first chip solder pads 220 face the RDL structure 360 , thereby achieving electrical connections between the first chip solder pads 220 and the RDL structure 360 .
- the optical signal receiving surface 201 of the photosensitive chip 200 faces the optical filter 400 , and the photosensitive chip 200 is attached to the optical filter 400 to prevent the packaging process from contaiminating the optical signal receiving surface 201 .
- the overall thickness of the lens module is reduced.
- the optical filter 400 can be an infrared filter glass sheet or a fully transparent glass sheet.
- the optical filter 400 is an infrared filter glass sheet, and is also used to eliminate the influence of infrared light in the incident light on the performance of the photosensitive chip 200 , and is advantageous for improving the imaging effect.
- the optical filter 400 and the photosensitive chip 200 are combined by an adhesive structure 410 disposed therebetween, and the adhesive structure 410 surrounds the optical signal receiving surface 201 of the photosensitive chip 200 .
- the adhesive structure 410 is used to achieve physical connection between the optical filter 400 and the photosensitive chip 200 . Moreover, the optical filter 400 is prevented from being in direct contact with the photosensitive chip 200 , thereby avoiding adverse effects on the performance of the photosensitive chip 200 .
- the material of the adhesive structure 410 is a photolithographic dry film. In other embodiments, the material of the adhesive structure may also be one of a photolithographic polyimide, a photolithographic polybenzoxazole, and a photolithographic benzocyclobutene.
- the adhesive structure 410 surrounds the optical signal receiving surface 201 such that the optical filter 400 above the optical signal receiving surface 201 is located on the photosensitive path of the photosensitive chip 200 , therefore the performance of the photosensitive chip 200 is guaranteed.
- one embodiment only illustrates one photosensitive unit 250 .
- the number of photosensitive units may be two or more.
- the camera assembly 260 further includes a stress buffer layer 420 between the encapsulation layer 350 and sidewalls of the optical filter 400 .
- the stress buffer layer 420 is advantageous for reducing stress generated by the encapsulation layer 350 on the optical filter 400 to reduce the probability of the optical filter 400 being broken, thereby improving the reliability of the camera assembly 260 .
- the stress buffer layer 420 is a photosensitive buffer.
- the material of the stress buffer layer 420 is an epoxy adhesive.
- An epoxy adhesive is an epoxy resin.
- An epoxy adhesive also has a variety of forms. By changing the composition, materials with different elastic modulus can be obtained, so that the stress received by the optical filter 400 can be regulated according to actual conditions,
- the stress buffer layer 420 is further located between the encapsulation layer 350 and the sidewalk of the adhesive structure 410 , thereby reducing the stress generated by the encapsulation layer 350 on the adhesive structure 410 , which is beneficial to further improve the reliability and the yield of the camera assembly 260 .
- the RDL structure 360 is used to implement electrical connections between the various chips and components in the camera assembly 260 .
- the feasibility of the electrical connection process can be improved while reducing the distance between the chips and the components.
- the RDL structure 360 can realize mass production and improve packaging efficiency.
- the RDL structure 360 is an interconnect line, thereby reducing the process complexity of forming the RDL structure 360 .
- the material of the RDL structure 360 is copper.
- the camera assembly 260 further includes: first conductive bumps 362 located between the first chip solder pads 220 and the RDL structure 360 .
- the first conductive bumps 362 are planting balls. By selecting the planting balls, the volumes of the first conductive bumps 362 are made larger, and the contact of the first conductive bumps 362 with the RDL structure 360 is easily realized.
- the functional components are components having specific functions other than the photosensitive chip 200 in the camera assembly, and include at least one of peripheral chips 230 and passive components 240 ,
- the functional components include the peripheral chips 230 and the passive components 240 .
- the peripheral chips 230 are active components for providing peripheral circuits to the photosensitive chip 200 .
- the peripheral chips 230 include one or two of digital signal processor chips and memory chips. In other embodiments, the peripheral chips may also include chips of other functional types. Only one peripheral chip 230 is illustrated in FIG. 13 , but the number of peripheral chips 230 is not limited to one.
- the peripheral chips 230 are typically silicon-based chips, and solder pads of the peripheral chips 230 are used to realize electrical connections of the peripheral chips 230 with other chips or components.
- the peripheral chips 230 include second chip solder pads 235 , and the second chip solder pads 235 face the RDL structure 360 , thereby achieving electrical connections between the second chip solder pads 235 and the RDL structure 360 .
- the passive components 240 are used to play a specific role for the photographic operation of the photosensitive chip 200 .
- the passive components 240 can include smaller electronic components such as resistors, capacitors, inductors, diodes, transistors, potentiometers, relays, or drivers. Only one passive component 240 is illustrated in FIG. 13 , but the number of passive components 240 is not :limited to one.
- solder pads of the passive components 240 are used to realize electrical connections of the passive components 240 with other chips or components.
- the solder pads of the passive components 240 are electrodes 245 , and the electrodes 245 face the RDL structure 360 , thereby achieving electrical connections between the electrodes 245 and the RDL structure 360 .
- the camera assembly 260 further includes: second conductive bumps 363 between the second chip solder pads 235 and the RDL structure 360 , and between the electrodes 245 and the RDL structure 360 .
- the second conductive bumps 363 protrude from a. surface of the peripheral chips 230 and a surface of the passive components 240 , improving the reliability of electrical connections of the peripheral chips 230 , the passive components 240 , and the RDL structure 360 .
- the second conductive bumps 363 are planting balls.
- the RDL structure may also include an interconnect line and conductive pillars protruding from the interconnect line, and the conductive pillars are located between the interconnect line and the corresponding solder pads.
- the camera assembly correspondingly does not include the first conductive bumps and the second conductive bumps.
- the camera assembly 260 further includes a flexible printed circuit (FPC) board 510 located on the RDL structure 360
- the FPC board 510 is used to realize electrical connection between the camera assembly 260 and the lens assembly, and electrical connection between the lens module and other components in the case when a circuit board is omitted.
- the FPC board 510 is bonded with the RDL structure 360 .
- the FPC board 510 is an FPC board.
- the lens module is electrically connected with other components in an electronic device through the FPC board 510 , thereby implementing a normal camera function of the electronic device.
- the FPC board 510 is provided with a connector 520 .
- the connector 520 can be a golden finger connector.
- the camera assembly according to one embodiment may be formed by using the packaging method described in the foregoing embodiments, or may be formed by other packaging methods.
- the packaging method described in the foregoing embodiments or may be formed by other packaging methods.
- one exemplary embodiment of the present disclosure further provides a lens module.
- a lens module Referring to FIG. 21 , a schematic cross-sectional view of a lens module according to an exemplary embodiment of the present disclosure is shown.
- a lens module 600 includes: a camera assembly according to examplary embodiments of the present disclosure (shown by a dash line in FIG. 21 ); and a lens assembly 530 including a support member 535 .
- the support member 535 is mounted on a top surface of an encapsulation layer (not labeled) and surrounds a photosensitive unit (not labeled) and functional components.
- the lens assembly 530 is electrically connected with the photosensitive unit (not labeled) and the functional components (not labeled).
- the lens assembly 530 generally includes the support member 535 , a motor (not shown) mounted on the support member 535 , and a lens group (not labeled) mounted on the motor.
- the support member 535 is used to achieve assembly of the lens assembly 530 and place the lens group on the photosensitive path of the photosensitive unit.
- the thickness of the camera assembly is small, and the thickness of the lens assembly 530 is reduced by the encapsulation layer, thereby reducing the overall thickness of the lens module 600 .
- the photosensitive unit and the functional components are disposed inside the support member 535 , thereby improving the signal transmission speed of the lens module 600 , thereby improving the performance of the lens module 600 (for example, improving the shooting speed and the storage speed).
- the photosensitive unit, the functional components, and a RDL structure are integrated in the encapsulation layer and disposed inside the support member 535 , so that the photosensitive unit, the functional components, and the RDL structure are protected, which is beneficial to improve the reliability and the stability of the lens module 600 and ensure the imaging quality of the lens module 600 .
- a flexible printed circuit (FPC) board is bonded with the RDL structure, so that one part of the support member 535 is mounted on the encapsulation layer, and another part of the support member 535 is mounted on the FPC board.
- the motor in the lens assembly 530 is electrically connected with the photosensitive unit and the functional components through the FPC board, thereby achieving electrical connection between the lens assembly 530 and the camera assembly.
- one exemplary embodiment of the present disclosure further provides an electronic device.
- FIG. 22 a schematic cross-sectional view of an electronic device according to an exemplary embodiment of the present disclosure is shown.
- an electronic device 700 includes a lens module 600 according to one embodiment of the present disclosure.
- the reliability and the performance of the lens module 600 are relatively high, and the shooting quality, the shooting speed, and the storage speed of the electronic device 700 are correspondingly improved. Moreover, the overall thickness of the lens module 600 is small, which is beneficial to improve user experience.
- the electronic device 700 may be various devices having a camera function such as a mobile phone, a tablet computer, a camera, or a video camera.
- a camera function such as a mobile phone, a tablet computer, a camera, or a video camera.
- the photosensitive chip and the functional components are integrated in the encapsulation layer, and the RDL structure is used to realize the electrical connections.
- the exemplary embodiments of the present disclosure reduce the distance between the photosensitive chip and the functional components, accordingly shorten the distance of the electrical connections between the photosensitive chip and the functional components, thereby significantly increasing the speed of signal transmission, thereby improving the performance of the lens module (for example, improving the shooting speed and the storage speed).
- a circuit board for example, a Printed Circuit Board (PCB)
- PCB Printed Circuit Board
Abstract
The present disclosure provides a camera assembly, a lens module, and an electronic device. The camera assembly includes a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure. The photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip. The RDL structure and the optical filter are exposed from a top surface of the encapsulation layer. A highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer. The photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.
Description
- This application is a divisional of U.S. patent application Ser. No. 16/234,904, filed on Dec. 28, 2018, which is a continuation application of PCT Patent Application No. PCT/CN2018/119988, filed on Dec. 10, 2018, which claims priority to Chinese patent application No. 201811386732.3, filed on Nov. 20, 2018, the entirety of all of which is incorporated herein by reference.
- The present disclosure generally relates to the field of lens modules and, in particular, to a camera assembly, a lens module, and an electronic device.
- With the continuous improvement of people's living standards and abundance of hobbies, photo-capturing has gradually become a common means for people to record their outings and various aspects of their daily life. Thus, electronic devices (e.g., mobile phones, tablets, and cameras) with camera functions are widely used in people's daily life and work, and gradually become indispensable tools nowadays.
- Electronic devices with camera functions are often configured with a lens module. The design level of the lens module plays an important role for determining quality of photographs taken by the electronic devices. The lens module often includes a camera assembly having a photosensitive chip and a lens assembly mounted on the camera assembly, used to capture images of photographed objects.
- Moreover, to improve the imaging capability of the lens module, a photosensitive chip having a larger imaging area is needed, and passive components, such as resistors and capacitors, and peripheral chips are usually disposed in the lens module.
- One aspect of the present disclosure provides a packaging method of a camera assembly, including: providing a carrier substrate and forming a redistribution layer (RDL) structure on carrier substrate; providing functional components having solder pads; forming a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip, that the photosensitive chip has solder pads facing the optical filter; temporarily bonding the optical filter of the photosensitive unit with the carrier substrate, and placing the functional components on the RDL structure, that each of the solder pads of the photosensitive chip and the solder pads of the functional components faces the RDL structure and electrically connects with the RDL structure; forming an encapsulation layer covering the carrier substrate, that the encapsulation layer is coplanar with a highest top of the photosensitive chip and the functional components; and removing the carrier substrate.
- Another aspect of the present disclosure provides a camera assembly, including: a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure. The photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip, the RDL structure and the optical filter are exposed from a top surface of the encapsulation layer, and a highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer. The photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.
- Another aspect of the present disclosure provides a lens module, including: the camera assembly according to exemplary embodiments of the present disclosure; and a lens assembly, including a support member. The support member is mounted on a top surface of the encapsulation layer and surrounds the photosensitive unit and the functional components. The lens assembly is electrically connected to the photosensitive chip and the functional components.
- Another aspect of the present disclosure further provides an electronic device, including: the lens module according to exemplary embodiments of the present disclosure.
- Other aspects of the present disclosure can be understood by those skilled in the art in light of the description, the claims, and the drawings of the present disclosure.
- The following drawings are merely examples for illustrative purposes according to various disclosed embodiments and are not intended to limit the scope of the present disclosure.
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FIGS. 1-13 illustrate schematic cross-sectional views of structures corresponding to certain stages during an exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure; -
FIGS. 14-16 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure; -
FIGS. 17-20 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure; -
FIG. 21 is a schematic cross-sectional view of a lens module according to an exemplary embodiment of the present disclosure; and -
FIG. 22 is a schematic cross-sectional view of an electronic device according to an exemplary embodiment of the present disclosure. - The performance of a conventional lens module needs to be improved, and the conventional lens module is difficult to meet the needs of miniaturization and thinning of the lens module. The reasons are described as follows.
- A conventional lens module is mainly assembled by a circuit board, a photosensitive chip, functional components (for example, peripheral chips), and a lens assembly. The peripheral chips are usually mounted on a peripheral motherboard, and the photosensitive chip and the functional components are separated from each other. The circuit board is used to support the photosensitive chip, the functional components, and the lens assembly. The circuit board is also used to realize electrical connections between the photosensitive chip, the functional components, and the lens module.
- However, with the needs of high-pixel and ultra-thin lens modules, the imaging requirements of the lens module are getting higher, the area of the photosensitive chip is correspondingly increased, and the number of functional components is correspondingly increased, resulting in a larger size of the lens module and being difficult to meet the needs of miniaturization and thinning of the lens module. Moreover, the photosensitive chip is usually disposed inside a support member in the lens module, and the peripheral chips are usually disposed outside the support member, so that there is a certain distance between the peripheral chips and the photosensitive chip, thereby reducing the speed of signal transmission. The peripheral chips usually include digital signal processor (DSP) chips and memory chips, so that it is easy to adversely affect the shooting speed and the storage speed, thereby reducing the performance of the lens module.
- Exemplary embodiments of the present disclosure provide a camera assembly, a packaging method thereof, a lens module, and an electronic device, while improving the performance of the lens module and reducing the overall thickness of the lens module.
- In exemplary embodiments of the present disclosure, a photosensitive chip and functional components are integrated in an encapsulation layer, and a redistribution layer structure is used to realize electrical connections. Compared to a scheme in which the functional components are mounted on a peripheral motherboard, the exemplary embodiments of the present disclosure reduce the distance between the photosensitive chip and the functional components, and accordingly shorten the distance of the electrical connections between the photosensitive chip and the functional components, thereby significantly increasing the speed of signal transmission, thereby improving the performance of the lens module (for example, improving the shooting speed and the storage speed). By using the encapsulation layer and the redistribution layer structure, the circuit board is omitted, thereby reducing the overall thickness of the lens module to meet the needs of miniaturization and thinning of the lens module.
- To make the above described objects, features and advantages of the present disclosure easier to be understood, the exemplary embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
-
FIGS. 1-13 illustrate schematic cross-sectional views of structures corresponding to certain stages during an exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure. - Referring to
FIG. 1 toFIG. 5 ,FIG. 2 is an enlarged view of a photosensitive chip ofFIG. 1 , andFIG. 4 is an enlarged view of an optical filter ofFIG. 3 . A photosensitive unit 250 (shown inFIG. 5 ) is formed and includes a photosensitive chip 200 (shown inFIG. 5 ) and an optical filter 400 (shown inFIG. 5 ) mounted on thephotosensitive chip 200. Thephotosensitive chip 200 has solder pads facing theoptical filter 400. - The
photosensitive chip 200 is an image sensor chip. In some embodiments, thephotosensitive chip 200 is a CMOS image sensor (CIS) chip. In other embodiments, the photosensitive chip may also be a charge coupled device (CCD) image sensor chip. - In one embodiment, the
photosensitive chip 200 has an optical signal receiving surface 201 (shown inFIG. 2 ), and thephotosensitive chip 200 receives and senses optical radiation signal through the optical signal receiving;surface 201. - For example, as shown in
FIG. 2 . thephotosensitive chip 200 includes aphotosensitive region 200C and aperipheral region 200E surrounding thephotosensitive region 200C, and the opticalsignal receiving surface 201 is located at thephotosensitive region 200C. - The
photosensitive chip 200 includes a plurality of pixel units, and thus thephotosensitive chip 200 includes a plurality of semiconductor photosensitive devices (not shown), and a plurality of optical filter films (not shown) on the plurality of semiconductor photosensitive device. The plurality of optical filter films is used to selectively absorb and pass optical signal received by the opticalsignal receiving surface 201. Thephotosensitive chip 200 further includes a plurality ofmicrolens 210 on the plurality of optical filter films, and the plurality ofmicrolens 210 is in one-to-one correspondence with the plurality of semiconductor photosensitive devices, thereby focusing the received optical radiation signal light to the corresponding plurality of semiconductor photosensitive devices. The opticalsignal receiving surface 201 corresponds to a top surface of the plurality ofmicrolens 210. - It should be noted that the
photosensitive chip 200 is generally a silicon-based chip and is fabricated by an integrated circuit fabrication technology. Thephotosensitive chip 200 has solder pads for electrically connecting thephotosensitive chip 200 with other chips or components. In one embodiment, thephotosensitive chip 200 has firstchip solder pads 220 formed on theperipheral region 200E, and the firstchip solder pads 220 are facing theoptical filter 400. For example, a surface of thephotosensitive chip 200 located on the same side of the opticalsignal receiving surface 201 exposes the firstchip solder pads 220. - The
photosensitive chip 200 is generally obtained by cutting a device wafer integrated with a plurality ofphotosensitive chips 200. Correspondingly, before the cutting, a first UV film 310 (shown inFIG. 1 ) is laminated to a surface of the device wafer facing away from the opticalsignal receiving surface 201, and used to position the device wafer, thereby improving the cutting precision, and also fix and position the plurality ofphotosensitive chips 200 after the cutting. - For example, as shown in
FIG. 1 , thefirst UV film 310 is laminated to the surface of the device wafer facing away from the opticalsignal receiving surface 201 by using a film laminating machine. Thefirst UV film 310 is also laminated to a. bottom of afirst frame 315 with a larger diameter, and thefirst frame 315 is used as a stretch film, so that the plurality ofphotosensitive chips 200 can be discretely fixed on thefirst UV film 310 after the cutting. Any suitable UV film and frame may be used for the disclosedfirst UV film 310 andfirst frame 315 without limitation according to various embodiments of the present disclosure. - The
optical filter 400 is mounted on thephotosensitive chip 200 to prevent subsequent packaging processes from contaiminating the opticalsignal receiving surface 201, and is also beneficial for reducing the overall thickness of the subsequent lens module to meet the needs of miniaturization and thinning the lens module. - The
optical filter 400 is one of an infrared filter glass sheet and a fully transparent glass sheet. In one embodiment, theoptical filter 400 is an infrared filter glass sheet, and is also used to eliminate the influence of infrared light in the incident light on the performance of thephotosensitive chip 200, thereby improving the imaging effect. For example, theoptical filter 400 is an infrared cut filter (IRCF), and the infrared cut filter may be a blue glass infrared cut fitter, or may include a glass sheet and an IR cut coating on a surface of the glass sheet. - In one embodiment, the
optical filter 400 includes a mounting surface 401 (shown inFIG. 3 ). The mountingsurface 401 is a surface for mounting with thephotosensitive chip 200, that is, a surface for facing thephotosensitive chip 200. - For example, in the case when the
optical filter 400 is a blue glass infrared cut filter, a surface of the blue glass infrared cut filter is coated with an antireflection coating or an antireflection film, and a surface opposite to the surface coated with the antireflection coating or the antireflection film is the mountingsurface 401. In the case when theoptical filter 400 includes a glass sheet and an IR cut coating on a surface of the glass sheet, a surface of the glass sheet opposite to the IR cut coating is the mountingsurface 401. In other embodiments, when the optical filter is a fully transparent glass sheet, either surface of the fully transparent glass sheet may be a mounting surface. - As shown in
FIG. 4 , theoptical filter 400 includes alight transmitting region 400C and anedge region 400E surrounding thelight transmitting region 400C. Thelight transmitting region 400C is configured to transmit external incident light, so that the opticalsignal receiving surface 201 of thephotosensitive chip 200 receives optical signal, to ensure the normal use function of the lens module. Theedge region 400E is a reserved space to mount theoptical filter 400 on thephotosensitive chip 200. - As shown in
FIG. 5 , in one embodiment, theoptical filter 400 is mounted on thephotosensitive chip 200 by anadhesive structure 410, and theadhesive structure 410 surrounds the opticalsignal receiving surface 201. - The
adhesive structure 410 is used to realize physical connection of theoptical filter 400 and thephotosensitive chip 200. Theoptical filter 400, theadhesive structure 410, and thephotosensitive chip 200 enclose a cavity (not labeled), avoiding direct contact of theoptical filter 400 and thephotosensitive chip 200, thereby preventing theoptical filter 400 from adversely affecting the performance of thephotosensitive chip 200. - In one embodiment, the
adhesive structure 410 surrounds the opticalsignal receiving surface 201, so that theoptical filter 400 above the opticalsignal receiving surface 201 is located on the photosensitive path of thephotosensitive chip 200, therefore the performance of thephotosensitive chip 200 is guaranteed. - For example, the material of the
adhesive structure 410 is a photolithographic material. Theadhesive structure 410 can be formed by a photolithography process, which not only may help in improving the morphological quality and the dimensional accuracy of theadhesive structure 410, and in improving packaging efficiency and production capacity, but also may reduce the impact on the bonding strength of theadhesive structure 410. - In one embodiment, the material of the
adhesive structure 410 is a photolithographic dry film. In other embodiments, the material of the adhesive structure may also be one of a photolithographic polyimide, a photolithographic polybenzoxazole (PBO), and a photolithographic benzocyclobutene (BCB). - In one embodiment, to reduce the process difficulty of forming the
adhesive structure 410. simplify the process steps, and reduce the influence of the forming process of theadhesive structure 410 on the opticalsignal receiving surface 201, theadhesive structure 410 is formed on theoptical filter 400. - For example, the mounting steps include: as shown in
FIG. 3 , providing afirst carrier substrate 340; temporarily bonding a surface of theoptical filter 400 opposite to the mountingsurface 401 with thefirst carrier substrate 340; forming theannular adhesive structure 410 in theedge region 400E (shown in FIG, 4) of theoptical filter 400, after the temporary bonding; and as shown inFIG. 5 , forming thephotosensitive unit 250, by facing the opticalsignal receiving surface 201 of thephotosensitive chip 200 to theannular adhesive structure 410 and mounting theperipheral region 200E (shown in FIG. of thephotosensitive chip 200 to theannular adhesive structure 410. - The
first carrier substrate 340 is used to provide a process platform for the formation of theadhesive structure 410 and the mounting steps. In one embodiment, thefirst carrier substrate 340 is a carrier wafer. In other embodiments, the first carrier substrate may also be other types of substrates. - example, the
optical filter 400 is temporarily bonded with thefirst carrier substrate 340 via a firsttemporary bonding layer 345. The firsttemporary bonding layer 345 serves as a peeling layer to facilitate subsequent debonding. - In one embodiment, the first
temporary bonding layer 345 is a foamed film. The foamed film includes a micro-adhesive surface and a foamed surface that are opposite to each other. The foamed film is adhesive at normal temperature, and the foamed surface is attached to thefirst carrier substrate 340. Subsequently the foaming film is heated to cause the foamed surface to lose adhesiveness, thus debonding is achieved. In other embodiments, the first temporary bonding layer may also be a die attach film (DAF). - With reference to
FIG. 1 andFIG. 2 , in one embodiment, the packaging method further includes forming firstconductive bumps 362 on the firstchip solder pads 220. - The first
conductive bumps 362 protrude from a surface of thephotosensitive chip 200, serve as external electrodes of thephotosensitive chip 200, are prepared for electrical connections of the firstchip solder pads 220 and a subsequent redistribution layer structure, and are beneficial to improve the electrical connection reliability of the firstchip solder pads 220 and the subsequent redistribution layer structure. - In one embodiment, the first
conductive bumps 362 are formed by a ball planting process. The overall thickness of theoptical filter 400 and theadhesive structure 410 is large (for example, between about 200 micrometers and about 300 micrometers), and the firstconductive bumps 362 formed by the ball bonding process are bulky, thereby being easy to realize contact between the firstconductive bumps 362 and the redistribution layer structure. - In one embodiment, the first
conductive bumps 362 are formed on a surface of the firstchip solder pads 220 corresponding to thephotosensitive chip 200 before the device wafer integrated with the plurality ofphotosensitive chip 200 is cut. - The ball planting process includes a reflow step. The process temperature of the reflow step is generally in a range of about 180° C. to about 350° C. The process temperature of the reflow step is high. By forming the first
conductive bumps 362 before the cutting, the impact of the high temperature to the adhesiveness of thefirst UV film 310 to the first temporary bonding layer 345 (shown inFIG. 5 ) is avoided. Moreover, by forming the firstconductive bumps 362 on the surface of the firstchip solder pads 220, the accuracy of the position of the firstconductive bumps 362 can be improved, thereby being advantageous for improving the feasibility of subsequent electrical connection process and the electrical connection reliability. - Referring to
FIG. 6 , after thephotosensitive unit 250 is formed (as shown inFIG. 5 ), thephotosensitive chip 200 is attached to asecond UV film 320, before the first carrier substrate 340 (shown inFIG. 5 ) is removed by performing a first debonding process. - By attaching to the
second UV film 320, it is advantageous to improve the positional accuracy of thephotosensitive unit 250 on another carrier substrate. The adhesiveness of thesecond UV film 320 can be weakened under ultraviolet light, and thephotosensitive unit 250 can be easily removed from thesecond UV film 320 in a sequent process. - For example, the
second UV film 320 is in close contact with the surface of thephotosensitive chip 200 facing away from the opticalsignal receiving surface 201, and is also attached to a bottom of asecond frame 325 having a larger diameter. Thesecond frame 325 serves as a stretch film, and thephotosensitive unit 250 is discretely fixed to thesecond UV film 320. Any suitable UV film and frame may be used for the disclosedsecond UV film 320 andsecond frame 325 without limitation according to various embodiments of the present disclosure. - In one embodiment, the first temporary bonding layer 345 (shown in
FIG. 5 ) is a foamed film, and thus the first debonding process is performed by using a pyrolysis bonding process. For example, the firsttemporary bonding layer 345 is subjected to a heat treatment to lose the adhesiveness of the foamed surface of the foamed film, thereby removing thefirst carrier substrate 340, and then removing the firsttemporary bonding layer 345 by peeling. - With continued reference to
FIG. 6 , the packaging method further includes forming astress buffer layer 420 covering sidewalls of theoptical filter 400. - The stress buffer layer 42.0 is beneficial to reduce the stress generated by a subsequently formed encapsulation layer on the
optical filter 400 to reduce the probability of theoptical filter 400 being broken, thereby improving the reliability and the yield of the packaging process. In particular, theoptical filter 400 is an infrared filter glass sheet or a fully transparent glass sheet, and the glass sheet is highly susceptible to being broken due to stress, and thestress buffer layer 420 can significantly reduce the probability of theoptical filter 400 being broken. - The
stress buffer layer 420 is adhesive to ensure its adhesion on theoptical filter 400. In one embodiment, the material of thestress buffer layer 420 is an epoxy adhesive. The epoxy adhesive is an epoxy resin adhesive. The epoxy adhesive has a variety of forms. By changing the composition of the epoxy adhesive, materials with different elastic modulus can be obtained, so the stress on theoptical filter 400 can be regulated according to actual conditions. - In one embodiment, the
stress buffer layer 420 also covers sidewalls of theadhesive structure 410 to reduce the stress generated by the encapsulation layer on theadhesive structure 410 to further improve the reliability and the yield of the packaging process. - In one embodiment, after the photosensitive unit 250 (shown in
FIG. 5 ) is attached to thesecond UV film 320, thestress buffer layer 420 is formed by a dispensing process. By selecting the dispensing process, the compatibility of forming thestress buffer layer 420 with the current packaging process is improved, and the process is simple. - Referring to
FIG. 7 andFIG. 8 , asecond carrier substrate 330 is provided, and a redistribution layer (RDL) structure 360 (shown inFIG. 8 ) is formed on thesecond carrier substrate 330. - The
second carrier substrate 330 is used to provide a process platform to form theRDL structure 360. In one embodiment, thesecond carrier substrate 330 is a carrier wafer. In other embodiments, the second carrier substrate may also be other types of substrates. - In one embodiment, the packaging method further includes forming a second
temporary bonding layer 331 on thesecond carrier substrate 330. The secondtemporary bonding layer 331 serves as a peeling layer to facilitate subsequent separation of theRDL structure 360 and thesecond carrier substrate 330. The secondtemporary bonding layer 331 may be a foamed film. For a detailed description of the secondtemporary bonding layer 331, reference may be made to corresponding description of the first temporary bonding layer 345 (shown inFIG. 5 ) and is not reduntanly described here. - It should be noted that, in other embodiments, a passivation layer is formed on the second carrier substrate, before forming the second temporary bonding layer. The probability of contaminating the second carrier substrate during the process of forming the second temporary bonding layer is reduced by the passivation layer, thereby increasing the reuse rate of the second carrier substrate. The material of the passivation layer may be one of silicon oxide and silicon nitride.
- The
RDL structure 360 is used to implement electrical integration of the formed camera assembly, and to improve the feasibility of the electrical connection process while reducing the distance between chips and components. In addition, compared to a wire drawing process, theRDL structure 360 can realize mass production and improve packaging efficiency. - For example, forming the
RDL structure 360 includes: forming a firstdielectric layer 332 on the second temporary bonding layer 331 (as shown inFIG. 7 ); patterning thefirst dielectric layer 332, to form aninterconnect trench 335 in the first dielectric layer 332 (as shown inFIG. 7 ) through a thickness of thefirst dielectric layer 332; filling a conductive material in theinterconnect trench 335 to form theRDL structure 360; and removing thefirst dielectric layer 332. - The
interconnect trench 335 in thefirst dielectric layer 332 is used to define the shape, the location, and the dimensions of theRDL structure 360. In one embodiment, the material of thefirst dielectric layer 332 is a photosensitive material, and correspondingly patterning can be realized by a photolithography process. For example, the material of thefirst dielectric layer 332 is one of photosensitive polyimide, photosensitive benzocyclobutene, and photosensitive polybenzoxazole. - In one embodiment, the
RDL structure 360 is formed in theinterconnect trench 335, and theRDL structure 360 is correspondingly an interconnect line, thereby reducing the process complexity of forming theRDL structure 360. For example, theinterconnect trench 335 is filled with a conductive material by an electroplating process. - In one embodiment, the material of the
RDL structure 360 is copper. By selecting copper, it is advantageous to improve the electrical connection reliability and the electrical conductivity of theRDL structure 360. In addition, the filling property of copper is better, and the filling quality of the conductive material in theinterconnect trench 335 can be correspondingly improved. In other embodiments, the material of the RDL structure may also be other applicable conductive materials. - The material of the
first dielectric layer 332 has high corrosion resistance. Therefore, in one embodiment, after theRDL structure 360 is formed, thefirst dielectric layer 332 is removed by a reactive ion etching process to expose the secondtemporary bonding layer 331 to make process preparation for subsequent processes. - It should be noted that, in other embodiments, the RDL structure may be formed directly by an etching. For example, forming the RDL structure may include: forming a conductive layer on the second temporary bonding layer; and etching the conductive layer, so that, the remaining conductive layer after etching can be used as the RDL structure. In those embodiments, the material of the RDL structure may be a conductive material such as aluminum that can be easily patterned by an etching process.
- Referring to
FIG. 9 , functional components (not labeled) are provided, and the functional components have solder pads. Theoptical filter 400 in the photosensitive unit 250 (shown inFIG. 5 ) is temporarily bonded with thesecond carrier substrate 330 and the functional components are placed on theRDL structure 360. The solder pads of thephotosensitive chip 200 and the solder pads of the functional components face theRDL structure 360 and electrically connect with theROL structure 360. - For example, the second UV film 320 (shown in
FIG. 6 ) at the position of each singlephotosensitive unit 250 is irradiated with ultraviolet light to deactivate thesecond UV film 320 irradiated with ultraviolet light, and then thephotosensitive unit 250 is sequentially peeled off from thesecond UV film 320 and placed at a predetermined position on thesecond carrier substrate 330. By placing thephotosensitive unit 250 one by one on thesecond carrier substrate 330, it is advantageous to improve the positional accuracy of thephotosensitive unit 250 on thesecond carrier substrate 330. - In one embodiment, after the
optical filter 400 is temporarily bonded with thesecond carrier substrate 330, the firstconductive bumps 362 are in contact with theRDL structure 360. - One embodiment only illustrates one
photosensitive unit 250. In other embodiments, when the formed lens module is applied to a dual-camera or array module product, the number of photosensitive units may be two or more. - The functional components are components having specific functions other than the
photosensitive chip 200 in the camera assembly, and include at least one ofperipheral chips 230 andpassive components 240. - In one embodiment, the functional components include
peripheral chips 230 andpassive components 240. - The
peripheral chips 230 are active components, and are used to provide peripheral circuits to thephotosensitive chip 200 after being electrically connected with thephotosensitive chip 200, for example, analog power supply circuits and digital power supply circuits, voltage buffer circuits, shutter circuits, shutter driving circuits, etc. - In one embodiment, the
peripheral chips 230 include one or two of digital signal processor chips and memory chips. In other embodiments, the peripheral chips may also include chips of other functional types. Only oneperipheral chip 230 is illustrated inFIG. 9 , but the number ofperipheral chips 230 is not limited to one. - The
peripheral chips 230 are typically silicon-based chips fabricated using integrated circuit fabrication techniques and also have solder pads for electrically connecting theperipheral chips 230 with other chips or components. In one embodiment, theperipheral chips 230 include secondchip solder pads 235. The secondchip solder pads 235 face theRDL structure 360 after theperipheral chips 230 are placed on theRDL structure 360. - The
passive components 240 are used to play a specific role in the photographic operation of thephotosensitive chip 200. Thepassive components 240 can include smaller electronic components such as resistors, capacitors, inductors, diodes, transistors, potentiometers, relays, or drivers. Only onepassive component 240 is illustrated inFIG. 9 , but the number ofpassive components 240 is not limited to one. - The
passive components 240 also have solder pads for electrical connections of thepassive components 240 with other chips or components. In one embodiment, the solder pads of thepassive component 240 areelectrodes 245. After thepassive components 240 are placed on theRDL structure 360, theelectrodes 245 face theRDL structure 360. - In one embodiment, before the
peripheral chips 230 and thepassive components 240 are placed on theRDL structure 360, secondconductive bumps 363 are formed on the secondchip solder pads 235 and theelectrodes 245. - The second
conductive bumps 363 protrude from the surface of theperipheral chips 230 and the surface of thepassive components 240 as external electrodes of theperipheral chips 230 and thepassive components 240, and improve the subsequent electrical connection reliability of theperipheral chips 230 and thepassive components 240 with theRDL structure 360. - Moreover, the height difference between a surface of the
peripheral chips 230 and thepassive components 240 facing away from thesecond carrier substrate 330 and a surface of thephotosensitive chip 200 facing away from thesecond carrier substrate 330 is reduced by the secondconductive bumps 363, thereby being beneficial to reduce process complexity of a subsequent bonding process. - In one embodiment, the second
conductive bumps 363 are formed by a ball planting process. The volumes of the balls are generally large, and it is easy to reduce the height difference between the surface of theperipheral chips 230 and thepassive elements 240 facing away from thesecond carrier substrate 330 and the surface of thephotosensitive chip 200 facing away from thesecond carrier substrate 330. - The second
conductive bumps 363 are formed before placing theperipheral chips 230 and thepassive components 240 on theRDL structure 360, to avoid the influence of the reflow step to adhesiveness of the secondtemporary bonding layer 331, and other chips or components. In addition, the accuracy of the positions at which the secondconductive bumps 363 are formed can be improved. For a detailed description of the secondconductive bumps 363, reference may be made to the related description of the firstconductive bumps 362, and details are not described herein again. - Correspondingly, after the
peripheral chips 230 and thepassive components 240 are placed on theRDL structure 360, the secondconductive bumps 363 are in contact with theRDL structure 360. - In one embodiment, after the
optical filter 400 is temporarily bonded with thesecond carrier substrate 330 and the functional components are placed on theRDL structure 360, the firstconductive bumps 362 and the secondconductive bumps 363 are bonded with theRDL structure 360. - For example, the bonding step is performed using a metal bonding process.
- In one embodiment, the first
conductive bumps 362 and the secondconductive bumps 363 are bonded with theRDL structure 360 in a same metal bonding process step, thereby improving packaging efficiency and avoiding negative effects of the process temperature of multiple metal bonding processes. - For example, the metal bonding process is a thermocompression bonding process. During the metal bonding process, the contact surfaces of the first
conductive bumps 362, the secondconductive bumps 363, and theRDL structure 360 are plastically deformed under pressure, so that atoms at contact surfaces contact with each other. As the bonding process temperature increases, atomic diffusion at the contact surfaces accelerates, and cross-border diffusion is achieved. When a certain bonding process time is reached, lattice at the contact surfaces is reorganized, thereby achieving bonding, with high bonding strength, high electrical and thermal conductivity, high electromigration resistance, and high mechanical connection properties. - It should be noted that as the bonding process temperature increases, the atoms at the contact surfaces get more energy, and the diffusion between the atoms is increased. The increase of the bonding process temperature can also promote growth of crystal grains, and the crystal grains that obtain energy can grow across the interface, which helps to eliminate the interface and integrate the materials at the contact surfaces. However, if the bonding process temperature is too high, it is easy to adversely affect the performance of the
photosensitive chip 200 and theperipheral chips 230, especially for the sensitive components in the formed camera assembly. Also the too-high bonding process temperature may cause thermal stress, causing problems such as decreased alignment accuracy, increased process cost, and reduced production efficiency. Therefore, in one embodiment, the metal bonding process is a metal low temperature bonding process, and a bonding process temperature of the metal bonding process is less than or equal to about 250° C. As long as the lowest value of the bonding process temperature is sufficient to achieve the bonding. - At a set bonding process temperature, mutual diffusion between the atoms becomes easier by increasing pressure, thereby improving the bonding quality between the first
conductive bumps 362, the secondconductive bumps 363, and theRDL structure 360. Therefore, in one embodiment, a bonding process pressure of the metal bonding process is greater than or equal to about 200 kPa. The pressure is generated by a pressing tool. - Increasing the bonding process time also improves the bonding quality. In one embodiment, a bonding process time of the metal bonding process is greater than or equal to about 30 minutes.
- It should be noted that, in the actual process, the bonding process temperature, the bonding process pressure, and the bonding process time can be reasonably adjusted and matched to each other, thereby ensuring the quality and the efficiency of the metal bonding process. It should also be noted that to reduce the probability of oxidation or contamination of the contact surfaces, the metal bonding process may be performed in a vacuum environment.
- Referring to FIG, 10 and
FIG. 11 , anencapsulation layer 350 is formed to cover thesecond carrier substrate 330. Theencapsulation layer 350 is coplanar with a highest top of thephotosensitive chip 200 and the functional components (not labeled). - The
encapsulation layer 350 plays a role to fix thephotosensitive chip 200 and the functional components (for example, theperipheral chips 230 and the passive components 240) for implementing package integration of thephotosensitive chip 200 and the functional components. - The
encapsulation layer 350 can reduce the space occupied by a support member in a lens assembly, and can also omit a circuit board (for example, a printed circuit board (PCB)), thereby significantly reducing the overall thickness of the subsequently formed lens module to meet the needs for miniaturization and thinning the lens module. Moreover, compared to a scheme of mounting the functional components on a peripheral motherboard, by integrating the photosensitive chip and the functional components in theencapsulation layer 350, the distance between thephotosensitive chip 200 and the functional components can be reduced, thereby being beneficial to accordingly shorten the distance of the electrical connections between the photosensitive chip and the functional components, to significantly increase the speed of signal transmission, and improve the performance of the lens module (for example, improving the shooting speed and the storage speed). - The
encapsulation layer 350 is made of a molding material, and can also function as an insulator, a seal, and a moisture barrier, thereby improving the reliability of the lens module. In one embodiment, the material of theencapsulation layer 350 is an epoxy resin. An epoxy resin has the advantages of low shrinkage, good adhesion, good corrosion resistance, excellent electrical properties, and low cost, so it is widely used as an encapsulating material for electronic devices and integrated circuits. - For example, forming the
encapsulation layer 350 includes: forming an encapsulation material layer 355 (shown inFIG. 10 ), covering thesecond carrier substrate 330, thephotosensitive chip 200, and the functional components; and performing a planarizing process on theencapsulation material layer 355 to form theencapsulation layer 350, which is coplanar with the highest top of thephotosensitive chip 200 and the functional components. - In one embodiment, the encapsulating
material layer 355 is formed by an injection molding process. The injection molding process has the characteristics of high production speed, high efficiency, and automation of operation. Through the injection molding process, it is beneficial to increase the output and reduce the process cost. In other embodiments, the encapsulation layer may also be formed using other molding processes. - The encapsulating
material layer 355 covers thephotosensitive chip 200 and the functional components, and the process of forming theencapsulating layer 350 is prevented from being affected by the thickness difference between thephotosensitive chip 200 and the functional components. Accordingly, it is not required to customize molds for the injection molding process and the process is simple. - Moreover, the
encapsulation layer 350 also covers the sidewalls of theoptical filter 400, thereby improving the sealing property of the cavity in thephotosensitive unit 250, and reducing the probability of water vapor, oxidizing gas, etc., entering the cavity. The performance of thephotosensitive chip 200 is guaranteed. - In addition, the
photosensitive unit 250, the functional components, and theRDL structure 360 are all located in theencapsulation layer 350, so that thephotosensitive unit 250, the functional components, and the RDL,structure 360 are all protected, which is beneficial to improve the reliability and the stability of the camera assembly. - It should be noted that, with use of the
encapsulation layer 350, a circuit board is omitted, and the overall thickness of the lens module can be reduced. Therefore, thephotosensitive chip 200 and theperipheral chips 230 don't need to be thinned. The mechanical strength and the reliability of thephotosensitive chip 200 and theperipheral chips 230 are improved. In other embodiments, the thickness of the photosensitive chip and the peripheral chips may be appropriately reduced according to process requirements, but the amount of thinning is small to ensure that the mechanical strength and the reliability are not affected. - In one embodiment, the thickness of the
encapsulation layer 350 is made small by the planarizing process, thereby further reducing the overall thickness of the formed lens module. In other embodiments, the planarizing process may not be performed to simplify the packaging process, and the formed encapsulation layer correspondingly covers the photosensitive chip and the functional components. - Referring to FIG, 12, a second debonding process is performed to remove the second carrier substrate 330 (shown in
FIG. 11 ). - In one embodiment, the second debonding process includes sequentially removing the
second carrier substrate 330 and the second temporary bonding layer 331 (as shown inFIG. 11 ). For a detailed description of the second debonding process, reference may be made to the foregoing description of the first debonding, process, and details are not described herein again. - Referring to
FIG. 13 , after the second debonding process, a dicing process is performed on theencapsulation layer 350. - Through the dicing process, a
single camera assembly 260 sized to meet the process requirements is formed to prepare the process for subsequent assembly of the lens assembly. In one embodiment, the dicing process is performed using a laser cutting process. - Continuing to refer to
FIG. 13 after thesecond carrier substrate 330 is removed (as shown inFIG. 11 ), a flexible printed circuit (FPC)board 510 is bonded with a portion of theRUL structure 360 exposed from theencapsulation layer 350. - The
FPC board 510 is configured to implement electrical connections between thecamera assembly 260 and subsequent lens components and electrical connections between a formed lens module and other components in the case when a circuit board is omitted. After subsequently forming the lens module, the lens module can also be electrically connected with other components in an electronic device by theFPC board 510, thereby implementing a normal camera function of the electronic device. - In one embodiment, the
FPC board 510 has a circuit structure. Therefore, theFPC board 510 is bonded with theRDL structure 360 by a metal bonding process, thereby achieving electrical connection. - In one embodiment, to improve process feasibility, the
FPC board 510 is bonded with theRDL structure 360 after the second debonding process and the dicing process. - It should be noted that a
connector 520 is formed on theFPC board 510 for electrically connecting theFPC board 510 with other circuit components. When the lens module is applied to an electronic device, theconnector 520 is electrically connected with the motherboard of the electronic device, thereby realizing information transmission between the lens module and other components in the electronic device, to transmit image information from the lens module to the electronic device. For example, theconnector 520 can be a golden finger connector. -
FIGS. 14-16 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure. - Same steps of another exemplary packaging method according to some exemplary embodiments as those according to the foregoing embodiments are not described herein again. One embodiment differs from the foregoing embodiments in that a plurality of
conductive bumps 365 a (shown inFIG. 15 ) is formed on aRDL structure 360 a. - For example, forming the plurality of
conductive bumps 365 a on theRDL structure 360 a is described as follows. - Referring to
FIG. 14 , asecond dielectric layer 333 a is formed to cover asecond carrier substrate 330 a and theRDL structure 360 a. Thesecond dielectric layer 333 a is patterned, and interconnect vias 385 a are formed in thesecond dielectric layer 333 a to expose a portion of theRDL structure 360 a. - The interconnect vias 385 a are used to provide space to form subsequent conductive bumps.
- a detailed description of the
second dielectric layer 333 a and the process of forming the interconnect vias 385 a, reference may be made to the related description of the first dielectric layer and the interconnect trench in the foregoing embodiments, and details are not described herein again. - Referring to
FIG. 15 , a conductive material is filled in the interconnect vias 385 a (shown inFIG. 14 ) to form the plurality ofconductive bumps 365 a. - In one embodiment, the conductive material is filled by an electroplating process. Correspondingly, the material of the plurality of
conductive bumps 365 a may also be the same as the material of theRDL structure 360 a. - Referring to
FIG. 16 , thesecond dielectric layer 333 a is removed (as shown inFIG. 14 ). - In one embodiment, the
second dielectric layer 333 a is removed by a reactive ion etching process. - Correspondingly, subsequently after an optical filter of a photosensitive unit is temporarily bonded with the
second carrier substrate 330 a, and functional components are placed on theRDL structure 360 a, solder pads of the photosensitive chip and solder pads of the functional components are bonded with the corresponding plurality ofconductive bumps 365 a. - For a detailed description of the subsequent steps, reference may be made to the corresponding description in the foregoing embodiments, and details are not described herein again.
-
FIGS. 17-20 illustrate schematic cross-sectional views of structures corresponding to certain stages during another exemplary packaging method of a camera assembly according to some exemplary embodiments of the present disclosure. - Same steps of another exemplary packaging method according to some exemplary embodiments as those according to the foregoing embodiments are not described herein again. One embodiment differs from the foregoing embodiments in that, as shown in
FIG. 20 , a formedRDL structure 360 b includes aninterconnection line 361 b andconductive pillars 365 b protruding from theinterconnection line 361 b. - For example, forming the
RDL structure 360 b on asecond carrier substrate 330 b is described as follows. - Referring to
FIG. 17 , a firstdielectric layer 332 b is formed on thesecond carrier substrate 330 b. Thefirst dielectric layer 332 b is patterned, and aninterconnect trench 335 b is formed in thefirst dielectric layer 332 b through a thickness of thefirst dielectric layer 332 b. - The
interconnect trench 335 b is used to define the shape, the location, and the dimensions of a subsequently formed interconnect line. - For a detailed description of the
first dielectric layer 332 b, reference may be made to the corresponding description in the foregoing embodiments, and details are not described herein again. - Referring to
FIG. 18 , aconductive material 366 b is filled into theinterconnect trench 335 b (shown inFIG. 17 ), and theconductive material 366 b also covers a top of thefirst dielectric layer 332 b. A patternedmask layer 367 b is formed on theconductive material 366 b and the patternedmask layer 367 b blocks theconductive material 366 b at locations of subsequent conductive pillars. - In one embodiment, the
interconnect trench 335 b is filled with theconductive material 366 b by an electroplating process. - In one embodiment, the
conductive material 366 b is copper. By selecting copper, it is beneficial to improve the reliability of the electrical connection of the RDL structure. The resistivity of copper is low, so that the electrical conductivity of the RDL structure is also improved. In addition, the filling property of copper is good, the filling effect of theconductive material 366 b in theinterconnect trench 335 b can be accordingly improved. In other embodiments, other suitable conductive materials may also be selected. - The patterned
mask layer 367 b is used as an etching mask to subsequently etch theconductive material 366 b. In one embodiment, the material of the patterned mask layer 367 is a photoresist. In other embodiments, the mask layer may also be selected from other materials suitable for the etching process, and the mask layer may be a single layer structure or a laminated structure. - Referring to
FIG. 19 , theconductive material 366 b (shown inFIG. 18 ) is etched to thefirst dielectric layer 332 b by using the patternedmask layer 367 b as a mask, to form theinterconnection line 361 b in theinterconnect trench 335 b (shown inFIG. 17 ) and theconductive pillars 365 b protruding from theinterconnect line 361 b. Theinterconnect line 361 b and theconductive pillars 365 b constitute theRDL structure 360 b. - In one embodiment, the
conductive material 366 b may be etched by a dry etching to improve the morphological quality of theRDL structure 360 b. - Referring to
FIG. 20 , the patternedmask layer 367 b (shown inFIG. 19 ) and thefirst dielectric layer 332 b (shown inFIG. 19 ) are removed. - In one embodiment, the material of the patterned
mask layer 367 b is a photoresist, so the patternedmask layer 367 b can be removed by an ashing or a wet stripping. - The material of the
first dielectric layer 332 b has strong corrosion resistance. Therefore, thefirst dielectric layer 332 b is removed by a reactive ion etching process, and theinterconnect line 361 b is exposed from thesecond carrier substrate 330 b, thereby preparing the process for subsequent electrical connection process. - Correspondingly, subsequently after an optical filter of a photosensitive unit is temporarily bonded with the
second carrier substrate 330 b and functional components are placed on theRDL structure 360 b, solder pads of the photosensitive unit and solder pads of the functional components are bonded with the correspondingconductive pillars 365 b. - For a detailed description of the subsequent steps, reference may be made to the corresponding description in the foregoing embodiments, and details are not described herein again.
- Correspondingly, one embodiment of the present disclosure further provides a camera assembly. With continued reference to
FIG. 13 , a schematic cross-sectional view of a camera assembly according to one embodiment of the present disclosure is shown. - A
camera assembly 260 includes anencapsulation layer 350, embedded with a photosensitive unit 250 (shown inFIG. 5 ), functional components (not labeled), and aRDL structure 360. Thephotosensitive unit 250 includes aphotosensitive chip 200 and anoptical filter 400 mounted on thephotosensitive chip 200. A top surface of theencapsulation layer 350 exposes theRDL structure 360 and theoptical filter 400, and a bottom surface of theencapsulation layer 350 exposes a highest top of thephotosensitive chip 200 and the functional components. Thephotosensitive chip 200 and the functional components have solder pads facing theRDL structure 360 and electrically connecting with theRDL structure 360. - The
encapsulation layer 350 plays a role to fix thephotosensitive chip 200, the functional components, and the RIX,structure 360 for implementing package integration of thephotosensitive chip 200, the functional components, and theRDL structure 360. Theencapsulation layer 350 reduces the space occupied by a support member in a lens assembly, and also omits a circuit board, thereby reducing the overall thickness of a lens module and meeting the needs of miniaturization and thinning of the lens module. - The material of the
encapsulation layer 350 is a plastic encapsulation material, and theencapsulation layer 350 can also function as an insulator, a seal, and a moisture barrier, thereby also improving the reliability of the lens module. In one embodiment, the material of theencapsulation layer 350 is an epoxy resin. - In one embodiment, the
encapsulation layer 350 includes a top surface and a. bottom surface opposite to each other. The top surface of theencapsulation layer 350 is a surface for mounting the lens assembly. - In one embodiment, the top surface of the
encapsulation layer 350 exposes theRDL structure 360 and theoptical filter 400, and the bottom surface of theencapsulation layer 350 exposes the highest top of thephotosensitive chip 200 and the functional components. Correspondingly, the process of forming theencapsulation layer 350 is prevented from being affected by the thickness difference between thephotosensitive chip 200 and the functional components. In the process of forming theencapsulation layer 350, a customized mold is not required, and the process is simple. - Correspondingly, the
encapsulation layer 350 also covers sidewalls of theoptical filter 400, thereby improving the sealing property of the cavity in thephotosensitive unit 250, reducing the probability of water vapor, oxidizing gas, etc., entering the cavity, so that, the performance of thephotosensitive chip 200 is guaranteed. In addition, thephotosensitive unit 250, the functional components, and theRDL structure 360 are all located within theencapsulation layer 350 to improve the reliability and the stability of the camera assembly. - The
photosensitive chip 200 is an image sensor chip. In some embodiments, thephotosensitive chip 200 is a CMOS image sensor chip. In other embodiments, the photosensitive chip may also be a CCD image sensor chip. - In one embodiment, the
photosensitive chip 200 includes aphotosensitive region 200C (shown inFIG. 2 ) and aperipheral region 200E (shown inFIG. 2 ) surrounding thephotosensitive region 200C. Thephotosensitive chip 200 further has an opticalsignal receiving surface 201 located at thephotosensitive region 200C. - The
photosensitive chip 200 is typically a silicon-based chip, and solder pads of thephotosensitive chip 200 are used to electrically connect thephotosensitive chip 200 with other chips or components. In one embodiment, thephotosensitive chip 200 has firstchip solder pads 220 located in theperipheral region 200E. - In one embodiment, the first
chip solder pads 220 face theRDL structure 360, thereby achieving electrical connections between the firstchip solder pads 220 and theRDL structure 360. - The optical
signal receiving surface 201 of thephotosensitive chip 200 faces theoptical filter 400, and thephotosensitive chip 200 is attached to theoptical filter 400 to prevent the packaging process from contaiminating the opticalsignal receiving surface 201. By a means of attaching, the overall thickness of the lens module is reduced. - The
optical filter 400 can be an infrared filter glass sheet or a fully transparent glass sheet. In one embodiment, theoptical filter 400 is an infrared filter glass sheet, and is also used to eliminate the influence of infrared light in the incident light on the performance of thephotosensitive chip 200, and is advantageous for improving the imaging effect. - In one embodiment, the
optical filter 400 and thephotosensitive chip 200 are combined by anadhesive structure 410 disposed therebetween, and theadhesive structure 410 surrounds the opticalsignal receiving surface 201 of thephotosensitive chip 200. - The
adhesive structure 410 is used to achieve physical connection between theoptical filter 400 and thephotosensitive chip 200. Moreover, theoptical filter 400 is prevented from being in direct contact with thephotosensitive chip 200, thereby avoiding adverse effects on the performance of thephotosensitive chip 200. In one embodiment, the material of theadhesive structure 410 is a photolithographic dry film. In other embodiments, the material of the adhesive structure may also be one of a photolithographic polyimide, a photolithographic polybenzoxazole, and a photolithographic benzocyclobutene. - In one embodiment, the
adhesive structure 410 surrounds the opticalsignal receiving surface 201 such that theoptical filter 400 above the opticalsignal receiving surface 201 is located on the photosensitive path of thephotosensitive chip 200, therefore the performance of thephotosensitive chip 200 is guaranteed. - It should be noted that one embodiment only illustrates one
photosensitive unit 250. In other embodiments, when the lens module is applied to a dual-camera or array module product, the number of photosensitive units may be two or more. - In one embodiment, the
camera assembly 260 further includes astress buffer layer 420 between theencapsulation layer 350 and sidewalls of theoptical filter 400. Thestress buffer layer 420 is advantageous for reducing stress generated by theencapsulation layer 350 on theoptical filter 400 to reduce the probability of theoptical filter 400 being broken, thereby improving the reliability of thecamera assembly 260. In one embodiment, thestress buffer layer 420 is a photosensitive buffer. - For example, the material of the
stress buffer layer 420 is an epoxy adhesive. An epoxy adhesive is an epoxy resin. An epoxy adhesive also has a variety of forms. By changing the composition, materials with different elastic modulus can be obtained, so that the stress received by theoptical filter 400 can be regulated according to actual conditions, - In one embodiment, the
stress buffer layer 420 is further located between theencapsulation layer 350 and the sidewalk of theadhesive structure 410, thereby reducing the stress generated by theencapsulation layer 350 on theadhesive structure 410, which is beneficial to further improve the reliability and the yield of thecamera assembly 260. - The
RDL structure 360 is used to implement electrical connections between the various chips and components in thecamera assembly 260. By selecting theRDL structure 360, the feasibility of the electrical connection process can be improved while reducing the distance between the chips and the components. TheRDL structure 360 can realize mass production and improve packaging efficiency. - In one embodiment, the
RDL structure 360 is an interconnect line, thereby reducing the process complexity of forming theRDL structure 360. - In one embodiment, the material of the
RDL structure 360 is copper. - In one embodiment, to improve the electrical connection reliability of first
chip solder pads 220 and theRDL structure 360, thecamera assembly 260 further includes: firstconductive bumps 362 located between the firstchip solder pads 220 and theRDL structure 360. - In one embodiment, the first
conductive bumps 362 are planting balls. By selecting the planting balls, the volumes of the firstconductive bumps 362 are made larger, and the contact of the firstconductive bumps 362 with theRDL structure 360 is easily realized. - The functional components are components having specific functions other than the
photosensitive chip 200 in the camera assembly, and include at least one ofperipheral chips 230 andpassive components 240, - In one embodiment, the functional components include the
peripheral chips 230 and thepassive components 240. - The
peripheral chips 230 are active components for providing peripheral circuits to thephotosensitive chip 200. - In one embodiment, the
peripheral chips 230 include one or two of digital signal processor chips and memory chips. In other embodiments, the peripheral chips may also include chips of other functional types. Only oneperipheral chip 230 is illustrated inFIG. 13 , but the number ofperipheral chips 230 is not limited to one. - The
peripheral chips 230 are typically silicon-based chips, and solder pads of theperipheral chips 230 are used to realize electrical connections of theperipheral chips 230 with other chips or components. In one embodiment, theperipheral chips 230 include secondchip solder pads 235, and the secondchip solder pads 235 face theRDL structure 360, thereby achieving electrical connections between the secondchip solder pads 235 and theRDL structure 360. - The
passive components 240 are used to play a specific role for the photographic operation of thephotosensitive chip 200. Thepassive components 240 can include smaller electronic components such as resistors, capacitors, inductors, diodes, transistors, potentiometers, relays, or drivers. Only onepassive component 240 is illustrated inFIG. 13 , but the number ofpassive components 240 is not :limited to one. - Solder pads of the
passive components 240 are used to realize electrical connections of thepassive components 240 with other chips or components. In one embodiment, the solder pads of thepassive components 240 areelectrodes 245, and theelectrodes 245 face theRDL structure 360, thereby achieving electrical connections between theelectrodes 245 and theRDL structure 360. - In one embodiment, the
camera assembly 260 further includes: secondconductive bumps 363 between the secondchip solder pads 235 and theRDL structure 360, and between theelectrodes 245 and theRDL structure 360. The secondconductive bumps 363 protrude from a. surface of theperipheral chips 230 and a surface of thepassive components 240, improving the reliability of electrical connections of theperipheral chips 230, thepassive components 240, and theRDL structure 360. - In one embodiment, the second
conductive bumps 363 are planting balls. - It should be noted that, in other embodiments, the RDL structure may also include an interconnect line and conductive pillars protruding from the interconnect line, and the conductive pillars are located between the interconnect line and the corresponding solder pads. In those embodiments, the camera assembly correspondingly does not include the first conductive bumps and the second conductive bumps.
- In one embodiment, the
camera assembly 260 further includes a flexible printed circuit (FPC)board 510 located on theRDL structure 360 TheFPC board 510 is used to realize electrical connection between thecamera assembly 260 and the lens assembly, and electrical connection between the lens module and other components in the case when a circuit board is omitted. - For example, the
FPC board 510 is bonded with theRDL structure 360. - In one embodiment, the
FPC board 510 is an FPC board. The lens module is electrically connected with other components in an electronic device through theFPC board 510, thereby implementing a normal camera function of the electronic device. - It should be noted that the
FPC board 510 is provided with aconnector 520. For example, theconnector 520 can be a golden finger connector. - The camera assembly according to one embodiment may be formed by using the packaging method described in the foregoing embodiments, or may be formed by other packaging methods. For a detailed description of the camera assembly of one embodiment, reference may be made to the corresponding description in the foregoing embodiments, and details are not described herein again.
- Correspondingly, one exemplary embodiment of the present disclosure further provides a lens module. Referring to
FIG. 21 , a schematic cross-sectional view of a lens module according to an exemplary embodiment of the present disclosure is shown. - A
lens module 600 includes: a camera assembly according to examplary embodiments of the present disclosure (shown by a dash line inFIG. 21 ); and alens assembly 530 including asupport member 535. Thesupport member 535 is mounted on a top surface of an encapsulation layer (not labeled) and surrounds a photosensitive unit (not labeled) and functional components. Thelens assembly 530 is electrically connected with the photosensitive unit (not labeled) and the functional components (not labeled). - The
lens assembly 530 generally includes thesupport member 535, a motor (not shown) mounted on thesupport member 535, and a lens group (not labeled) mounted on the motor. Thesupport member 535 is used to achieve assembly of thelens assembly 530 and place the lens group on the photosensitive path of the photosensitive unit. - In one embodiment, the thickness of the camera assembly is small, and the thickness of the
lens assembly 530 is reduced by the encapsulation layer, thereby reducing the overall thickness of thelens module 600. - Moreover, the photosensitive unit and the functional components are disposed inside the
support member 535, thereby improving the signal transmission speed of thelens module 600, thereby improving the performance of the lens module 600 (for example, improving the shooting speed and the storage speed). - The photosensitive unit, the functional components, and a RDL structure are integrated in the encapsulation layer and disposed inside the
support member 535, so that the photosensitive unit, the functional components, and the RDL structure are protected, which is beneficial to improve the reliability and the stability of thelens module 600 and ensure the imaging quality of thelens module 600. - In one embodiment, a flexible printed circuit (FPC) board is bonded with the RDL structure, so that one part of the
support member 535 is mounted on the encapsulation layer, and another part of thesupport member 535 is mounted on the FPC board. The motor in thelens assembly 530 is electrically connected with the photosensitive unit and the functional components through the FPC board, thereby achieving electrical connection between thelens assembly 530 and the camera assembly. - It should be noted that, for a detailed description of the camera assembly according to one embodiment, reference may be made to the corresponding; description in the foregoing embodiments, and details are not described herein again.
- Correspondingly, one exemplary embodiment of the present disclosure further provides an electronic device. Referring to
FIG. 22 , a schematic cross-sectional view of an electronic device according to an exemplary embodiment of the present disclosure is shown. - In one embodiment, an
electronic device 700 includes alens module 600 according to one embodiment of the present disclosure. - The reliability and the performance of the
lens module 600 are relatively high, and the shooting quality, the shooting speed, and the storage speed of theelectronic device 700 are correspondingly improved. Moreover, the overall thickness of thelens module 600 is small, which is beneficial to improve user experience. - For example, the
electronic device 700 may be various devices having a camera function such as a mobile phone, a tablet computer, a camera, or a video camera. - As disclosed, the technical solution of the exemplary embodiments of the present disclosure has the following advantages.
- In exemplary embodiments of the present disclosure, the photosensitive chip and the functional components are integrated in the encapsulation layer, and the RDL structure is used to realize the electrical connections. Compared to a scheme of mounting the functional components on a peripheral motherboard, the exemplary embodiments of the present disclosure reduce the distance between the photosensitive chip and the functional components, accordingly shorten the distance of the electrical connections between the photosensitive chip and the functional components, thereby significantly increasing the speed of signal transmission, thereby improving the performance of the lens module (for example, improving the shooting speed and the storage speed). Moreover, through the encapsulation layer and the RDL structure, a circuit board (for example, a Printed Circuit Board (PCB)) is omitted, thereby reducing the overall thickness of the lens module, to meet the needs of miniaturization and thinning of the lens module.
- Although the present disclosure has been disclosed above, the present disclosure is not limited thereto. Any changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the disclosure, and the scope of the disclosure should be determined by the scope of the claims.
Claims (9)
1. A camera assembly, comprising:
a photosensitive unit, functional components, a redistribution layer (RDL) structure, and an encapsulation layer, embedded with the photosensitive unit, the functional components, and the RDL structure, wherein:
the photosensitive unit includes a photosensitive chip and an optical filter mounted on the photosensitive chip;
the RDL structure and the optical filter are exposed from a top surface of the encapsulation layer; and
a highest top of the photosensitive chip and the functional components is exposed from a bottom surface of the encapsulation layer,
wherein the photosensitive chip and the functional components have solder pads facing the RDL structure and electrically connecting with the RDL structure.
2. The camera assembly according to claim 1 , wherein the RDL structure includes an interconnect line.
3. The camera assembly according to claim 2 , further comprising:
conductive bumps between the RDL, structure and the corresponding solder pads, wherein the conductive bumps are planting balls.
4. The camera assembly according to claim 1 , wherein the RDL structure comprises an interconnection line and conductive pillars protruding from the interconnection line, and the conductive pillars are located between the interconnection line and the corresponding solder pads.
5. The camera assembly according to claim 1 , further comprising:
a stress buffer layer, between sidewalk of the optical filter and the encapsulation layer.
6. The camera assembly according to claim 1 , wherein the functional components comprise at least one of peripheral chips and passive components, and the peripheral chips comprise one or two of digital signal processor chips and memory chips.
7. The camera assembly according to claim 1 , further comprising:
a flexible printed circuit (FPC) board, bonded with a portion of the RDL structure exposed from the encapsulation layer.
8. A lens module, comprising:
the camera assembly according to claim I; and
a lens assembly, comprising a support member, wherein the support member is mounted on a top surface of the encapsulation layer and surrounds the photosensitive unit and the functional components, and the lens assembly electrically connects with the photosensitive chip and the functional components.
9. An electronic device, comprising the lens module according to claim 8 .
Priority Applications (1)
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US17/450,819 US20220045112A1 (en) | 2018-11-20 | 2021-10-13 | Camera assembly, lens module, and electronic device |
Applications Claiming Priority (5)
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CN201811386732.3A CN111199986B (en) | 2018-11-20 | 2018-11-20 | Camera shooting assembly, packaging method thereof, lens module and electronic equipment |
CN201811386732.3 | 2018-11-20 | ||
PCT/CN2018/119988 WO2020103215A1 (en) | 2018-11-20 | 2018-12-10 | Photographing assembly and packaging method therefor, lens module, and electronic device |
US16/234,904 US11171166B2 (en) | 2018-11-20 | 2018-12-28 | Camera assembly and packaging method thereof, lens module, electronic device |
US17/450,819 US20220045112A1 (en) | 2018-11-20 | 2021-10-13 | Camera assembly, lens module, and electronic device |
Related Parent Applications (1)
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US16/234,904 Division US11171166B2 (en) | 2018-11-20 | 2018-12-28 | Camera assembly and packaging method thereof, lens module, electronic device |
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US20220045112A1 true US20220045112A1 (en) | 2022-02-10 |
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US17/450,819 Abandoned US20220045112A1 (en) | 2018-11-20 | 2021-10-13 | Camera assembly, lens module, and electronic device |
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US (1) | US20220045112A1 (en) |
JP (1) | JP7004335B2 (en) |
KR (1) | KR102250533B1 (en) |
CN (1) | CN111199986B (en) |
WO (1) | WO2020103215A1 (en) |
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CN113471152B (en) * | 2021-06-30 | 2022-11-11 | 上海中航光电子有限公司 | Packaging structure and packaging method, camera module and electronic equipment |
CN113471153B (en) * | 2021-06-30 | 2022-11-11 | 上海中航光电子有限公司 | Packaging structure and packaging method, camera module and electronic equipment |
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CN111199986A (en) | 2020-05-26 |
CN111199986B (en) | 2022-10-18 |
JP2021511653A (en) | 2021-05-06 |
KR102250533B1 (en) | 2021-05-13 |
WO2020103215A1 (en) | 2020-05-28 |
JP7004335B2 (en) | 2022-01-21 |
KR20200063104A (en) | 2020-06-04 |
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