US20210173242A1 - Light emitting apparatus and window - Google Patents
Light emitting apparatus and window Download PDFInfo
- Publication number
- US20210173242A1 US20210173242A1 US17/173,718 US202117173718A US2021173242A1 US 20210173242 A1 US20210173242 A1 US 20210173242A1 US 202117173718 A US202117173718 A US 202117173718A US 2021173242 A1 US2021173242 A1 US 2021173242A1
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- US
- United States
- Prior art keywords
- liquid crystal
- layer
- electrode
- sacrificial
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 147
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000011521 glass Substances 0.000 claims description 19
- 229920000642 polymer Polymers 0.000 claims description 12
- -1 poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 36
- 238000000034 method Methods 0.000 description 28
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000000178 monomer Substances 0.000 description 14
- 239000002243 precursor Substances 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- XXQBEVHPUKOQEO-UHFFFAOYSA-N potassium superoxide Chemical compound [K+].[K+].[O-][O-] XXQBEVHPUKOQEO-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- LJRSZGKUUZPHEB-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxypropoxy)propoxy]propyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COC(C)COC(=O)C=C LJRSZGKUUZPHEB-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000000053 physical method Methods 0.000 description 3
- SLBOQBILGNEPEB-UHFFFAOYSA-N 1-chloroprop-2-enylbenzene Chemical compound C=CC(Cl)C1=CC=CC=C1 SLBOQBILGNEPEB-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000002042 Silver nanowire Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 description 2
- AFSIMBWBBOJPJG-UHFFFAOYSA-N ethenyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC=C AFSIMBWBBOJPJG-UHFFFAOYSA-N 0.000 description 2
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 2
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229960002796 polystyrene sulfonate Drugs 0.000 description 2
- 239000011970 polystyrene sulfonate Substances 0.000 description 2
- 229920000123 polythiophene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000012966 redox initiator Substances 0.000 description 2
- 238000006479 redox reaction Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- FYYZTOOGFNLGII-UHFFFAOYSA-N (1,6-dihydroxy-1-prop-2-enoyloxyhexyl) prop-2-enoate Chemical compound OCCCCCC(O)(OC(=O)C=C)OC(=O)C=C FYYZTOOGFNLGII-UHFFFAOYSA-N 0.000 description 1
- LGXVIGDEPROXKC-UHFFFAOYSA-N 1,1-dichloroethene Chemical compound ClC(Cl)=C LGXVIGDEPROXKC-UHFFFAOYSA-N 0.000 description 1
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- MTPIZGPBYCHTGQ-UHFFFAOYSA-N 2-[2,2-bis(2-prop-2-enoyloxyethoxymethyl)butoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCC(CC)(COCCOC(=O)C=C)COCCOC(=O)C=C MTPIZGPBYCHTGQ-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002567 K2S2O8 Inorganic materials 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920001157 Poly(2-vinylnaphthalene) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- XNGJNGFXWWYBJS-UHFFFAOYSA-N phosphoroso-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=C(C(=O)P=O)C(C)=C1 XNGJNGFXWWYBJS-UHFFFAOYSA-N 0.000 description 1
- 229920000075 poly(4-vinylpyridine) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1334—Constructional arrangements; Manufacturing methods based on polymer dispersed liquid crystals, e.g. microencapsulated liquid crystals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/0102—Constructional details, not otherwise provided for in this subclass
- G02F1/0105—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/03—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels effect or Kerr effect
- G02F1/0305—Constructional arrangements
- G02F1/0316—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/44—Arrangements combining different electro-active layers, e.g. electrochromic, liquid crystal or electroluminescent layers
-
- H01L51/0001—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Definitions
- the present disclosure herein relates to manufacturing of a liquid crystal device, and more particularly, to manufacturing of an apparatus including a liquid crystal device.
- Liquid crystals may be materials that are in a mesophase between crystal and liquid phases.
- the term ‘liquid crystal’ is derived from characteristics of liquidity of liquid and anisotropy of a crystal. Liquid crystals have order in position and direction in a crystal phase. However, liquid crystals have disorder in position and direction in a liquid phase.
- Liquid crystals may be used in a polymer dispersed liquid crystal (PDLC) display device.
- the PDLC display device may be a device in which electric fields are applied to a layer, in which polymers and liquid crystals are uniformly mixed with each other, to change refractive indexes of the polymers and the liquid crystals so that light is scattered or transmitted.
- the present disclosure provides a miniaturized light emitting apparatus and a method for manufacturing the same.
- the present disclosure also provides a miniaturized window and a method for manufacturing the same.
- a light emitting apparatus, a method for manufacturing the light emitting apparatus, and a window are provided.
- An embodiment of the inventive concept provides a method for manufacturing a light emitting apparatus including: preparing a liquid crystal device including a support substrate, a first electrode, a liquid crystal layer, and a sacrificial structure; separating the sacrificial structure from the liquid crystal layer to expose one surface of the liquid crystal layer; and forming a second electrode on the one surface of the liquid crystal layer.
- the method may further include forming a light emitting layer on the second electrode.
- the first electrode may be in physical contact with the liquid crystal layer and the light emitting layer.
- the method may further include forming a third electrode on the light emitting layer.
- the sacrificial structure may include a sacrificial layer and a sacrificial substrate on the sacrificial layer.
- the separating of the sacrificial structure may include thermally treating the sacrificial structure under a temperature greater than a glass transition temperature or melting point of the sacrificial layer.
- the separating of the sacrificial structure may be performed by a physical method.
- the sacrificial layer may include a polymer, and the sacrificial layer may have a glass transition temperature of about 300° C. to about 700° C.
- the preparing of the liquid crystal device may include: forming a sacrificial layer on a sacrificial substrate; and rubbing a first surface of the sacrificial layer.
- the separating of the sacrificial structure may include: applying electrical fields to the liquid crystal layer; and applying physical force to the sacrificial structure.
- the preparing of the liquid crystal device may include: providing a precursor between the first electrode and the sacrificial structure to form a precursor layer; and applying heat or light to the precursor layer to form the liquid crystal layer.
- a light emitting apparatus includes: a support substrate; a first electrode on the support substrate; a liquid crystal layer on the first electrode; a second electrode disposed on the liquid crystal layer and being in physical contact with the liquid crystal layer; and a light emitting device disposed on the second electrode and being in physical contact with the second electrode.
- the liquid crystal layer may include a polymer and a liquid crystal group within the polymer, and the liquid crystal group may include a plurality of liquid crystal molecules.
- the light emitting device may have a first surface be in contact with the second electrode, and the first surface of the light emitting device may have a curved surface.
- the support substrate, the first electrode, and the second electrode may be transparent.
- a window includes: a glass layer; a liquid crystal device disposed on the glass layer and including a support substrate, a first electrode, and a liquid crystal layer, which are stacked; and a second electrode disposed between the glass layer and the liquid crystal device, wherein the second electrode is in physical direct contact with the glass layer and the liquid crystal layer.
- the liquid crystal layer may include a polymer and liquid crystal molecules.
- FIGS. 1A to 1E are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to an embodiment of the inventive concept
- FIGS. 2A and 2B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to another embodiment of the inventive concept
- FIGS. 3A and 3B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to further another embodiment of the inventive concept
- FIG. 4 is a cross-sectional view of a light emitting apparatus according to an embodiment of the inventive concept
- FIG. 5 is a cross-sectional view of a light emitting apparatus according to another embodiment of the inventive concept.
- FIG. 6 is a cross-sectional view of a window according to an embodiment of the inventive concept.
- regions and the layers are not limited to these terms. These terms are used only to discriminate one region or layer (or film) from another region or layer (or film). Therefore, a layer referred to as a first layer in one embodiment can be referred to as a second layer in another embodiment.
- An embodiment described and exemplified herein includes a complementary embodiment thereof. Like reference numerals refer to like elements throughout.
- FIGS. 1A to 1E are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to an embodiment of the inventive concept.
- a first electrode 120 may be formed on a support substrate 110 to form an electrode structure 100 .
- the support substrate 110 may be transparent.
- the support substrate 110 may include glass or plastic.
- the first electrode 120 may include transparent conductive oxide such as indium tin oxide or indium zinc oxide.
- the first electrode 120 may include silver nanowire, carbon nanotube, graphene, poly(3,4-ethylenedioxythiophene): polystyrene sulfonate (PEDOT:PSS), polyaniline, polythiophene, or a combination thereof
- a sacrificial layer 220 may be formed on a sacrificial substrate 210 to form a sacrificial structure 200 .
- the sacrificial substrate 210 may include glass or plastic.
- the sacrificial layer 220 may include a polymer.
- the sacrificial layer 220 may include polyethylene, polypropylene, poly(1-dodecane), poly(3-methyl-1-butene), poly(4-methyl-1-pentene), poly(3,3-dimethyl-1-butene), poly(5-methyl-1-hexene), poly(4,4-dimethyl-1-pentene), poly(vinyl alcohol), poly(vinyl chloride), poly(vinyl t-butyl ether), poly(vinyl n-butyl ether), polystyrene, poly(2-vinylnaphthalene), poly(4-vinylpyridine), poly(methyl methacrylate), poly(ether methacrylate), poly(t-butyl methacrylate), poly(vinyl acetate), Nylon 6 , polycarbonate, poly(ethylene terephthalate), poly(ethylene naphthalate), epoxy, urea, and/or phenol resin.
- the sacrificial layer 220 may have
- the sacrificial layer 220 may have a thickness of about 0.005 pm to about 10 ⁇ m.
- a precursor layer 301 may be formed between the electrode structure 100 and the sacrificial structure 200 .
- the sacrificial structure 200 may be disposed on the electrode structure 100 .
- the sacrificial layer 220 may be vertically spaced apart from the first electrode 120 .
- the electrode structure 100 may be formed as illustrated in FIG. 1A .
- the sacrificial structure 200 may be formed as illustrated in FIG. 1B .
- a precursor solution may be provided between the first electrode 120 and the sacrificial layer 220 to form the precursor layer 301 .
- the precursor layer 301 may include a monomer 311 , liquid crystal molecules 321 , and an initiator (not shown).
- the monomer 311 may include an acrylic-based monomer, an aromatic-based monomer, an acrylonitrile-based monomer, and/or a chloride-based monomer.
- the acrylic-based monomer may include triethylopropane triacrylate (TMPTA), tri(propylene glycol) diacrylate (TPGDA), penthaerithritol triacrylate (PETA), trimethylolpropane ethoxylate triacrylate(TMPEOTA), methyl methacrylate (MMA), methacrylate (MA), tri(propylene glycol) glycerolate diacrylate (TPGDA), vinylacrylate (VA), ethylene glycol dimethacrylate (EGDA), epoxy acrylate monomer or oligomer, and/or 1,6-hexandiol diacrylate (HAD).
- TMPTA triethylopropane triacrylate
- TPGDA tri(propylene glycol) diacrylate
- PETA penthaerithrito
- the aromatic-based monomer may include styrene (ST) and/or divinyl benzene (DVB).
- the acrylonitrile-based monomer may include acrylonitrile (AN).
- the chloride-based monomer may include vinylidene chloride
- VDC vinyl stearate
- VBC vinylbenzyl chloride
- the monomer may include vinyl stearate (VS) and/or vinyl propionate (VP).
- the initiator may include a photoinitiator, a thermal initiator, and/or a redox initiator using redox reaction.
- the photoinitiator may include 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, benzophenone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1propanone, methylbenzoylformate (MBF), alpha, alpha-dimethoxy-alpha-phenylacetophenone, 2-benzyl-2-(dimethylamino)-1-[4-(morpholinyl) phenyl]-1-butanone, diphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide, phenyl bis(2,4,6-trimethyl benzoyl phosphine oxide, Irgacure 819), bis(.eta.5-2,4-cyclopentadien-1-yl)bis[2,6-di
- the liquid crystal layer 300 may include a polymer 310 and a liquid crystal group 320 .
- the monomer 311 may be polymerized by the heat or light to form the polymer 310 .
- the liquid crystal molecules 321 may be phase-separated from the polymer 310 to form the liquid crystal group 320 .
- the liquid crystal group 320 may be provided in the polymer 310 .
- the liquid crystal group 320 may include the plurality of liquid crystal molecules 321 .
- the liquid crystal layer 300 may have one surface 300 a and the other surface 300 b, which face each other.
- the one surface 300 a of the liquid crystal layer 300 may face the sacrificial layer 220 .
- the sacrificial structure 200 may be thermally treated to be separated from the liquid crystal layer 300 .
- a thermal treating process of the sacrificial structure 200 may be performed in a separate process that is different from the formation process of the liquid crystal layer 300 , which are described with reference to FIG. 1D .
- the sacrificial structure 200 may be thermally treated under a temperature that is greater than the glass transition temperature or the melting point of the sacrificial layer 220 .
- the sacrificial structure 200 may be thermally treated at a temperature of about 100° C. to about 150° C.
- the sacrificial layer 220 may be transitioned to glass or melted by the thermal treatment.
- the sacrificial structure 200 may be easily removed from the liquid crystal layer 300 . If the sacrificial layer 220 is omitted, the liquid crystal layer 300 may be damaged during the separation of the sacrificial structure 200 , or it may be difficult to separate the sacrificial structure 200 . The liquid crystal layer 300 may not be damaged by the sacrificial layer 220 during the separation of the sacrificial layer 220 .
- the sacrificial substrate 210 and the sacrificial layer 220 may be removed at the same time or at different times. When the sacrificial structure 200 is removed, the one surface 300 a of the liquid crystal layer 300 may be exposed.
- the liquid crystal device 1000 may be manufactured by the afore-described process. Since the sacrificial structure 200 is removed, the liquid crystal device 1000 may be thinned. In addition, the liquid crystal device 1000 may be reduced in mass.
- FIGS. 2A and 2B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to another embodiment of the inventive concept.
- the duplicated descriptions which have been described already, will be omitted.
- a liquid crystal layer 300 may be formed between an electrode structure 100 and a sacrificial structure 200 .
- a sacrificial layer 220 may be applied to a sacrificial substrate 210 to form the sacrificial structure 200 .
- the sacrificial layer 200 may have a glass transition temperature of about 300° C. to about 700° C.
- the formation of the sacrificial layer 200 may include formation of an intermediate layer (not shown) by applying a monomer solution to the sacrificial substrate 210 and reaction of materials within the intermediate layer.
- the reaction may be performed by applying heat, but is not limited thereto.
- the reaction within the intermediate layer may be at least a part of polymerization.
- the sacrificial layer 200 While the sacrificial layer 200 is formed, stress may be applied to the sacrificial layer 220 .
- the sacrificial layer 220 may have large stress. The stress may be tensile stress.
- the sacrificial layer 220 may include polyimide, polyarylate, cyclic olefin copolymer, and/or polynorbornene.
- the sacrificial layer 220 may have a thickness of about 0.005 ⁇ m to about 10 ⁇ m.
- the liquid crystal layer 300 may be formed as illustrated in FIG. 1C .
- the sacrificial structure 200 may be separated from the liquid crystal layer 300 by a physical method to expose one surface 300 a of the liquid crystal layer 300 . Since the sacrificial layer 220 has large stress, bonding strength between the sacrificial layer 220 and the sacrificial substrate 210 may be greater than that between the sacrificial layer 220 and the liquid crystal layer 300 . When the sacrificial layer 220 has a glass transition temperature of about 300° C. or less, the bonding strength between the sacrificial layer 220 and the liquid crystal layer 300 may increase. According to an embodiment, since the sacrificial layer 220 has a glass transition temperature of about 300° C.
- the bonding strength between the sacrificial layer 220 and the liquid crystal layer 300 may be reduced. Since the process of separating the sacrificial layer 220 is performed under a temperature less than a phase transition temperature of liquid crystal molecules 321 , the bonding strength between the sacrificial layer 220 and the liquid crystal layer 300 may be further reduced. For example, the separation process of the sacrificial layer 220 may be performed under a temperature of about 110° C. or less. Thus, the sacrificial layer 220 may be easily separated from the liquid crystal layer 300 . While the sacrificial layer 220 is separated, the liquid crystal layer 300 may not be damaged.
- the liquid crystal device 1000 may be manufactured according to the example described above.
- FIGS. 3A and 3B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to further another embodiment of the inventive concept.
- the duplicated descriptions which have been described already, will be omitted.
- a sacrificial structure 200 may be prepared.
- the formation of the sacrificial structure 200 may include formation of a sacrificial layer 220 on a sacrificial substrate 210 and rubbing of a first surface 220 b of the sacrificial layer 220 .
- the sacrificial layer 220 may include polyimide, polyvinyl alcohol, silicon oxide, and/or silicon nitride.
- the sacrificial layer 220 may have a rubbing axis.
- the rubbing axis may be parallel to a first direction D 1 .
- the first direction D 1 may be parallel to a top surface of a support substrate 110 .
- a second direction D 2 may be parallel to the top surface of the support substrate 110 and cross the first direction D 1 .
- the second direction D 2 may be perpendicular to the first direction D 1 .
- the sacrificial structure 200 may be disposed to be spaced apart from an electrode structure 100 .
- the liquid crystal layer 300 may be formed between the electrode structure 100 and the sacrificial structure 200 .
- the first surface 220 b of the sacrificial layer 220 may physically come into contact with a liquid crystal layer 300 .
- Liquid crystal molecules 321 adjacent to the sacrificial layer 220 may have orientation.
- the liquid crystal molecules 321 on one surface 300 a of the liquid crystal layer 300 may have orientation.
- the liquid crystal molecules 321 may be orientated parallel to the rubbing axis of the sacrificial layer 200 .
- the liquid crystal molecules 321 may be orientated parallel to the first direction D 1 .
- the sacrificial structure 200 may be separated from the liquid crystal layer 300 by a physical method to expose one surface 300 a of the liquid crystal layer 300 .
- Physical force may be applied to one end of the sacrificial structure 200 to separate the sacrificial structure 200 .
- the sacrificial structure 200 may be separated in the second direction D 2 .
- the other end of the sacrificial structure 200 may be spaced apart from the liquid crystal layer 300 .
- the one end and the other end of the sacrificial structure 200 may be adjacent to a first side surface 200 c and a second side surface 200 d of the sacrificial structure 200 , respectively.
- the first and second side surfaces 200 c and 200 d of the sacrificial structure 200 may be parallel to the first direction D 1 . Bonding strength between the liquid crystal layer 300 and the sacrificial layer 220 when the liquid crystal molecules 321 are parallel to the first direction D 1 may be less than that between the liquid crystal layer 300 and the sacrificial layer 220 when the liquid crystal molecules 321 are parallel to the second direction D 2 .
- the sacrificial layer 220 may be easily separated from the liquid crystal layer 300 .
- the separation process of the sacrificial layer 220 electrical fields may be more applied to the liquid crystal layer 300 .
- the orientation of the liquid crystal molecules 321 may be more improved by the electrical fields.
- the sacrificial layer 200 may be more easily separated.
- the separation process of the sacrificial layer 220 may be performed under a temperature less than a phase transition temperature of the liquid crystal molecules 321 .
- the liquid crystal device 1000 may be manufactured according to the example described above. After the sacrificial structure 200 is separated, the liquid crystal molecules 321 on the one surface 300 a of the liquid crystal layer 300 may be randomly oriented.
- FIG. 4 is a cross-sectional view of a light emitting apparatus according to an embodiment of the inventive concept.
- the duplicated descriptions which have been described already, will be omitted.
- a light emitting apparatus 1 may include a liquid crystal device 1000 , a second electrode 400 , and a light emitting device 2000 .
- the liquid crystal device 1000 may include a support substrate 110 , a first electrode 120 , and a liquid crystal layer 300 .
- the light emitting device 2000 may include a light emitting layer 500 and a third electrode 600 .
- the third electrode 600 may be disposed on the light emitting layer 500 .
- the light emitting device 2000 may include an organic light emitting diode device, a field emission display (FED) device, or a plasma display panel (PDP) device.
- the light emitting device 2000 may emit light to the liquid crystal device 1000 through the second electrode 400 .
- the second electrode 400 may be disposed between the liquid crystal device 1000 and the light emitting device 2000 .
- the second electrode 400 may be in physical contact with the liquid crystal layer 300 and the light emitting layer 500 .
- the second electrode 400 may be transparent.
- the second electrode 400 may include transparent conductive oxide such as indium tin oxide or indium zinc oxide.
- the second electrode 400 may include silver nanowire, carbon nanotube, graphene, poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS), polyaniline, polythiophene, or a combination thereof.
- the second electrode 400 may function as an electrode of the liquid crystal device 1000 and an electrode of the light emitting device 2000 .
- orientation of liquid crystal molecules 321 may be adjusted by a voltage difference between the first electrode 120 and the second electrode 400 .
- the liquid crystal layer 300 may be adjusted in transmissivity.
- Emission of light of the light emitting layer 500 may be determined by a voltage difference between the second electrode 400 and the third electrode 600 .
- the liquid crystal device 1000 and the light emitting device 2000 may share the second electrode 400 , and thus, an additional electrode may not be provided between the liquid crystal device 1000 and the light emitting device 2000 .
- the light emitting apparatus 1 may be miniaturized. Since an additional substrate (for example, the sacrificial substrate (see reference numeral 210 of FIG. 1E ) is not disposed between the liquid crystal device 1000 and the light emitting device 2000 , the light emitting apparatus 1 may be more miniaturized.
- a process of forming the light emitting apparatus 1 may include a process of forming a second electrode 400 on a light emitting device 2000 , a process of preparing a liquid crystal device 1000 , and a process of disposing the second electrode 400 on a liquid crystal layer 300 .
- the liquid crystal device 1000 may be manufactured as the examples described with reference to FIGS. 1A to 1E , FIGS. 2A and 2B , or FIGS. 3A and 3B .
- the second electrode 400 may come into direct contact with the one surface 300 a of the liquid crystal layer 300 .
- the process of forming the second electrode 400 on the light emitting device 200 may be performed before or after the second electrode 400 is disposed on the liquid crystal layer 300 .
- the light emitting apparatus 1 may be used in various fields such as display apparatuses, lighting fixtures, and/or signboards.
- FIG. 5 is a cross-sectional view of a light emitting apparatus according to another embodiment of the inventive concept.
- the duplicated descriptions which have been described already, will be omitted.
- a light emitting apparatus 2 may include a liquid crystal device 1000 , a second electrode 400 , and a light emitting device 2001 .
- a first surface 2001 a of the light emitting device 2001 has a curved surface.
- the second electrode 400 may be disposed on the light emitting device 2001 and be in physical contact with the first surface 2001 a of the light emitting device 2001 .
- the second electrode 400 may be flexible.
- the second electrode 400 may have a shape corresponding to that of the first surface 2001 a of the light emitting device 2001 .
- a bottom surface 400 b of the second electrode 400 may have a curved surface.
- the liquid crystal device 1000 may be disposed on the bottom surface 400 b of the second electrode 400 .
- the liquid crystal device 1000 may include a support substrate 110 , a first electrode 120 , and a liquid crystal layer 300 .
- One surface 300 a of the liquid crystal layer 300 may be in physical contact with the second electrode 400 .
- the liquid crystal device 1000 may be flexible.
- a bottom surface 1000 b of the liquid crystal device 1000 may have a curved surface.
- the light emitting apparatus 2 may be formed through substantially the same method as described with reference to FIG. 4 .
- a process of forming the light emitting apparatus 2 may include a process of forming a second electrode 400 on a light emitting device 2001 , a process of preparing a liquid crystal device 1000 , and a process of disposing the second electrode 400 on a liquid crystal layer 300 of the liquid crystal device 1000 .
- FIG. 6 is a cross-sectional view of a window according to an embodiment of the inventive concept.
- the duplicated descriptions which have been described already, will be omitted.
- a window 3 may include a liquid crystal device 1000 , a second electrode 400 , and a glass layer 3000 .
- the glass layer 3000 may be transparent. Light may pass through the glass layer 3000 and then be incident into the second electrode 400 .
- the second electrode 400 may be formed on the glass layer 3000 .
- the second electrode 400 may be formed through a deposition process.
- the second electrode 400 may come into direct contact with the glass layer 3000 .
- the second electrode 400 may be transparent. Light may pass through the second electrode 400 and then be incident into the liquid crystal device 1000 .
- the liquid crystal device 1000 may be disposed on the glass layer 3000 .
- the liquid crystal device 1000 may be manufactured according to the example described above.
- the liquid crystal device 1000 may be attached to the second electrode 400 so that one surface 300 a of the liquid crystal layer 300 is in physical direct contact with the second electrode 400 .
- the liquid crystal layer 300 may be adjusted in transmissivity by a voltage difference between the first electrode 120 and the second electrode 400 .
- an additional substrate may not be disposed between the liquid crystal layer 300 and the glass layer 3000 . Therefore, the window 3 may be reduced in thickness.
- the sacrificial structure may be removed to expose one surface of the liquid crystal layer.
- the light emitting apparatus or the window may be manufactured by using the liquid crystal device.
- the second electrode may be in physical direct contact with the liquid crystal layer and the light emitting device.
- the liquid crystal device and the light emitting device may share the second electrode.
- the light emitting apparatus may be miniaturized. Since an additional substrate is not provided between the liquid crystal device and the light emitting device, the light emitting apparatus may be more miniaturized.
- the second electrode may be in physical direct contact with the liquid crystal device and the glass layer. Therefore, the window may be miniaturized.
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Abstract
Description
- This is a division of U.S. application Ser. No. 16/528,220, filed on Jul. 31, 2019 (allowed on Nov. 30, 2020), which is a division of Ser. No. 15/654,831, filed on Jul. 20, 2017 (issued on Sep. 10, 2019 as U.S. Pat. No. 10,409,116), and claims priority under 35 U.S.C. § 119 of Korean Patent Application No. 10-2016-0163024, filed on Dec. 1, 2016, the entire contents of which are hereby incorporated by reference.
- The present disclosure herein relates to manufacturing of a liquid crystal device, and more particularly, to manufacturing of an apparatus including a liquid crystal device.
- Liquid crystals may be materials that are in a mesophase between crystal and liquid phases. The term ‘liquid crystal’ is derived from characteristics of liquidity of liquid and anisotropy of a crystal. Liquid crystals have order in position and direction in a crystal phase. However, liquid crystals have disorder in position and direction in a liquid phase.
- Liquid crystals may be used in a polymer dispersed liquid crystal (PDLC) display device. The PDLC display device may be a device in which electric fields are applied to a layer, in which polymers and liquid crystals are uniformly mixed with each other, to change refractive indexes of the polymers and the liquid crystals so that light is scattered or transmitted.
- The present disclosure provides a miniaturized light emitting apparatus and a method for manufacturing the same.
- The present disclosure also provides a miniaturized window and a method for manufacturing the same.
- A light emitting apparatus, a method for manufacturing the light emitting apparatus, and a window are provided. An embodiment of the inventive concept provides a method for manufacturing a light emitting apparatus including: preparing a liquid crystal device including a support substrate, a first electrode, a liquid crystal layer, and a sacrificial structure; separating the sacrificial structure from the liquid crystal layer to expose one surface of the liquid crystal layer; and forming a second electrode on the one surface of the liquid crystal layer.
- In an embodiment, the method may further include forming a light emitting layer on the second electrode.
- In an embodiment, the first electrode may be in physical contact with the liquid crystal layer and the light emitting layer.
- In an embodiment, the method may further include forming a third electrode on the light emitting layer.
- In an embodiment, the sacrificial structure may include a sacrificial layer and a sacrificial substrate on the sacrificial layer.
- In an embodiment, the separating of the sacrificial structure may include thermally treating the sacrificial structure under a temperature greater than a glass transition temperature or melting point of the sacrificial layer.
- In an embodiment, the separating of the sacrificial structure may be performed by a physical method.
- In an embodiment, the sacrificial layer may include a polymer, and the sacrificial layer may have a glass transition temperature of about 300° C. to about 700° C.
- In an embodiment, the preparing of the liquid crystal device may include: forming a sacrificial layer on a sacrificial substrate; and rubbing a first surface of the sacrificial layer.
- In an embodiment, the separating of the sacrificial structure may include: applying electrical fields to the liquid crystal layer; and applying physical force to the sacrificial structure.
- In an embodiment, the preparing of the liquid crystal device may include: providing a precursor between the first electrode and the sacrificial structure to form a precursor layer; and applying heat or light to the precursor layer to form the liquid crystal layer.
- In an embodiment of the inventive concept, a light emitting apparatus includes: a support substrate; a first electrode on the support substrate; a liquid crystal layer on the first electrode; a second electrode disposed on the liquid crystal layer and being in physical contact with the liquid crystal layer; and a light emitting device disposed on the second electrode and being in physical contact with the second electrode.
- In an embodiment, the liquid crystal layer may include a polymer and a liquid crystal group within the polymer, and the liquid crystal group may include a plurality of liquid crystal molecules.
- In an embodiment, the light emitting device may have a first surface be in contact with the second electrode, and the first surface of the light emitting device may have a curved surface.
- In an embodiment, the support substrate, the first electrode, and the second electrode may be transparent.
- In an embodiment of the inventive concept, a window includes: a glass layer; a liquid crystal device disposed on the glass layer and including a support substrate, a first electrode, and a liquid crystal layer, which are stacked; and a second electrode disposed between the glass layer and the liquid crystal device, wherein the second electrode is in physical direct contact with the glass layer and the liquid crystal layer.
- In an embodiment, the liquid crystal layer may include a polymer and liquid crystal molecules.
- The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain principles of the inventive concept. In the drawings:
-
FIGS. 1A to 1E are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to an embodiment of the inventive concept; -
FIGS. 2A and 2B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to another embodiment of the inventive concept; -
FIGS. 3A and 3B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to further another embodiment of the inventive concept; -
FIG. 4 is a cross-sectional view of a light emitting apparatus according to an embodiment of the inventive concept; -
FIG. 5 is a cross-sectional view of a light emitting apparatus according to another embodiment of the inventive concept; and -
FIG. 6 is a cross-sectional view of a window according to an embodiment of the inventive concept. - Exemplary embodiments of the present invention will be described with reference to the accompanying drawings so as to sufficiently understand constitutions and effects of the present invention. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Further, the present invention is only defined by scopes of claims. A person with ordinary skill in the technical field of the present invention pertains will be understood that the present invention can be carried out under any appropriate environments.
- In the following description, the technical terms are used only for explaining a specific exemplary embodiment while not limiting the present invention. In this specification, the terms of a singular form may include plural forms unless specifically mentioned. The meaning of ‘comprises’ and/or ‘comprising’ specifies a component, a step, an operation and/or an element does not exclude other components, steps, operations and/or elements.
- In the specification, it will be understood that when a layer (or film) is referred to as being ‘on’ another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.
- Also, though terms like a first, a second, and a third are used to describe various regions and layers (or films) in various embodiments of the present invention, the regions and the layers are not limited to these terms. These terms are used only to discriminate one region or layer (or film) from another region or layer (or film). Therefore, a layer referred to as a first layer in one embodiment can be referred to as a second layer in another embodiment. An embodiment described and exemplified herein includes a complementary embodiment thereof. Like reference numerals refer to like elements throughout.
- Unless terms used in embodiments of the present invention are differently defined, the terms may be construed as meanings that are commonly known to a person skilled in the art.
- Hereinafter, a liquid crystal device according to the inventive concept and a method for manufacturing the same will be described.
-
FIGS. 1A to 1E are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to an embodiment of the inventive concept. - Referring to
FIG. 1A , afirst electrode 120 may be formed on asupport substrate 110 to form anelectrode structure 100. Thesupport substrate 110 may be transparent. Thesupport substrate 110 may include glass or plastic. Thefirst electrode 120 may include transparent conductive oxide such as indium tin oxide or indium zinc oxide. For another example, thefirst electrode 120 may include silver nanowire, carbon nanotube, graphene, poly(3,4-ethylenedioxythiophene): polystyrene sulfonate (PEDOT:PSS), polyaniline, polythiophene, or a combination thereof - Referring to
FIG. 1B , asacrificial layer 220 may be formed on asacrificial substrate 210 to form asacrificial structure 200. Thesacrificial substrate 210 may include glass or plastic. Thesacrificial layer 220 may include a polymer. - For example, the
sacrificial layer 220 may include polyethylene, polypropylene, poly(1-dodecane), poly(3-methyl-1-butene), poly(4-methyl-1-pentene), poly(3,3-dimethyl-1-butene), poly(5-methyl-1-hexene), poly(4,4-dimethyl-1-pentene), poly(vinyl alcohol), poly(vinyl chloride), poly(vinyl t-butyl ether), poly(vinyl n-butyl ether), polystyrene, poly(2-vinylnaphthalene), poly(4-vinylpyridine), poly(methyl methacrylate), poly(ether methacrylate), poly(t-butyl methacrylate), poly(vinyl acetate), Nylon 6, polycarbonate, poly(ethylene terephthalate), poly(ethylene naphthalate), epoxy, urea, and/or phenol resin. Thesacrificial layer 220 may have a glass transition temperature of about 100° C. to about 150° C. For another example, thesacrificial layer 220 may have a melting point of about 100° C. to about 150° C. - The
sacrificial layer 220 may have a thickness of about 0.005 pm to about 10 μm. - Referring to
FIG. 1C , aprecursor layer 301 may be formed between theelectrode structure 100 and thesacrificial structure 200. Thesacrificial structure 200 may be disposed on theelectrode structure 100. Here, thesacrificial layer 220 may be vertically spaced apart from thefirst electrode 120. Theelectrode structure 100 may be formed as illustrated inFIG. 1A . Thesacrificial structure 200 may be formed as illustrated inFIG. 1B . A precursor solution may be provided between thefirst electrode 120 and thesacrificial layer 220 to form theprecursor layer 301. Theprecursor layer 301 may include amonomer 311,liquid crystal molecules 321, and an initiator (not shown). For example, themonomer 311 may include an acrylic-based monomer, an aromatic-based monomer, an acrylonitrile-based monomer, and/or a chloride-based monomer. For example, the acrylic-based monomer may include triethylopropane triacrylate (TMPTA), tri(propylene glycol) diacrylate (TPGDA), penthaerithritol triacrylate (PETA), trimethylolpropane ethoxylate triacrylate(TMPEOTA), methyl methacrylate (MMA), methacrylate (MA), tri(propylene glycol) glycerolate diacrylate (TPGDA), vinylacrylate (VA), ethylene glycol dimethacrylate (EGDA), epoxy acrylate monomer or oligomer, and/or 1,6-hexandiol diacrylate (HAD). The aromatic-based monomer may include styrene (ST) and/or divinyl benzene (DVB). The acrylonitrile-based monomer may include acrylonitrile (AN). The chloride-based monomer may include vinylidene chloride - (VDC) and/or vinylbenzyl chloride (VBC). For another example, the monomer may include vinyl stearate (VS) and/or vinyl propionate (VP). The initiator may include a photoinitiator, a thermal initiator, and/or a redox initiator using redox reaction. The photoinitiator may include 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, benzophenone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1propanone, methylbenzoylformate (MBF), alpha, alpha-dimethoxy-alpha-phenylacetophenone, 2-benzyl-2-(dimethylamino)-1-[4-(morpholinyl) phenyl]-1-butanone, diphenyl(2,4,6-trimethylbenzoyl)-phosphine oxide, phenyl bis(2,4,6-trimethyl benzoyl phosphine oxide, Irgacure 819), bis(.eta.5-2,4-cyclopentadien-1-yl)bis[2,6-difluoro-3-(1H-pyrrol-1-yl)phenyl]titanium, 1-hydroxy-cyclohexylphenyl-ketone (CPA), and/or a combination thereof The thermal initiator may include benzoyl peroxide (BP), acetyl peroxide (AP), diauryl peroxide (DP), di-tert-butyl peroxide (t-BTP), cumyl hydroperoxide (CHP), hydrogen peroxide (HP), potassium peroxide (PP), 2,2′-azobisisobutyronitrile (AIBN), azocompound, and/or silver alkyls. The redox initiator using the redox reaction may include persulfates (K2S2O8).
- Referring to
FIG. 1D , heat or light may be applied to the precursor layer (seereference numeral 301 ofFIG. 1C ) to form aliquid crystal layer 300. Theliquid crystal layer 300 may include apolymer 310 and aliquid crystal group 320. Themonomer 311 may be polymerized by the heat or light to form thepolymer 310. Theliquid crystal molecules 321 may be phase-separated from thepolymer 310 to form theliquid crystal group 320. Theliquid crystal group 320 may be provided in thepolymer 310. Theliquid crystal group 320 may include the plurality ofliquid crystal molecules 321. Theliquid crystal layer 300 may have onesurface 300 a and the other surface 300b, which face each other. The onesurface 300 a of theliquid crystal layer 300 may face thesacrificial layer 220. - Referring to
FIG. 1E , thesacrificial structure 200 may be thermally treated to be separated from theliquid crystal layer 300. A thermal treating process of thesacrificial structure 200 may be performed in a separate process that is different from the formation process of theliquid crystal layer 300, which are described with reference toFIG. 1D . Thesacrificial structure 200 may be thermally treated under a temperature that is greater than the glass transition temperature or the melting point of thesacrificial layer 220. For example, thesacrificial structure 200 may be thermally treated at a temperature of about 100° C. to about 150° C. Thesacrificial layer 220 may be transitioned to glass or melted by the thermal treatment. Thus, thesacrificial structure 200 may be easily removed from theliquid crystal layer 300. If thesacrificial layer 220 is omitted, theliquid crystal layer 300 may be damaged during the separation of thesacrificial structure 200, or it may be difficult to separate thesacrificial structure 200. Theliquid crystal layer 300 may not be damaged by thesacrificial layer 220 during the separation of thesacrificial layer 220. Thesacrificial substrate 210 and thesacrificial layer 220 may be removed at the same time or at different times. When thesacrificial structure 200 is removed, the onesurface 300 a of theliquid crystal layer 300 may be exposed. Theliquid crystal device 1000 may be manufactured by the afore-described process. Since thesacrificial structure 200 is removed, theliquid crystal device 1000 may be thinned. In addition, theliquid crystal device 1000 may be reduced in mass. -
FIGS. 2A and 2B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to another embodiment of the inventive concept. Hereinafter, the duplicated descriptions, which have been described already, will be omitted. - Referring to
FIG. 2A , aliquid crystal layer 300 may be formed between anelectrode structure 100 and asacrificial structure 200. Asacrificial layer 220 may be applied to asacrificial substrate 210 to form thesacrificial structure 200. However, thesacrificial layer 200 may have a glass transition temperature of about 300° C. to about 700° C. The formation of thesacrificial layer 200 may include formation of an intermediate layer (not shown) by applying a monomer solution to thesacrificial substrate 210 and reaction of materials within the intermediate layer. For example, the reaction may be performed by applying heat, but is not limited thereto. The reaction within the intermediate layer may be at least a part of polymerization. While thesacrificial layer 200 is formed, stress may be applied to thesacrificial layer 220. Thesacrificial layer 220 may have large stress. The stress may be tensile stress. Thesacrificial layer 220 may include polyimide, polyarylate, cyclic olefin copolymer, and/or polynorbornene. Thesacrificial layer 220 may have a thickness of about 0.005 μm to about 10 μm. Theliquid crystal layer 300 may be formed as illustrated inFIG. 1C . - Referring to
FIG. 2B , thesacrificial structure 200 may be separated from theliquid crystal layer 300 by a physical method to expose onesurface 300 a of theliquid crystal layer 300. Since thesacrificial layer 220 has large stress, bonding strength between thesacrificial layer 220 and thesacrificial substrate 210 may be greater than that between thesacrificial layer 220 and theliquid crystal layer 300. When thesacrificial layer 220 has a glass transition temperature of about 300° C. or less, the bonding strength between thesacrificial layer 220 and theliquid crystal layer 300 may increase. According to an embodiment, since thesacrificial layer 220 has a glass transition temperature of about 300° C. or more, the bonding strength between thesacrificial layer 220 and theliquid crystal layer 300 may be reduced. Since the process of separating thesacrificial layer 220 is performed under a temperature less than a phase transition temperature ofliquid crystal molecules 321, the bonding strength between thesacrificial layer 220 and theliquid crystal layer 300 may be further reduced. For example, the separation process of thesacrificial layer 220 may be performed under a temperature of about 110° C. or less. Thus, thesacrificial layer 220 may be easily separated from theliquid crystal layer 300. While thesacrificial layer 220 is separated, theliquid crystal layer 300 may not be damaged. Theliquid crystal device 1000 may be manufactured according to the example described above. -
FIGS. 3A and 3B are cross-sectional views illustrating a method for manufacturing a liquid crystal device according to further another embodiment of the inventive concept. Hereinafter, the duplicated descriptions, which have been described already, will be omitted. - Referring to
FIG. 3A , asacrificial structure 200 may be prepared. The formation of thesacrificial structure 200 may include formation of asacrificial layer 220 on asacrificial substrate 210 and rubbing of afirst surface 220 b of thesacrificial layer 220. Thesacrificial layer 220 may include polyimide, polyvinyl alcohol, silicon oxide, and/or silicon nitride. Thesacrificial layer 220 may have a rubbing axis. The rubbing axis may be parallel to a first direction D1. The first direction D1 may be parallel to a top surface of asupport substrate 110. A second direction D2 may be parallel to the top surface of thesupport substrate 110 and cross the first direction D1. For example, the second direction D2 may be perpendicular to the first direction D1. - The
sacrificial structure 200 may be disposed to be spaced apart from anelectrode structure 100. Theliquid crystal layer 300 may be formed between theelectrode structure 100 and thesacrificial structure 200. Thefirst surface 220 b of thesacrificial layer 220 may physically come into contact with aliquid crystal layer 300.Liquid crystal molecules 321 adjacent to thesacrificial layer 220 may have orientation. For example, theliquid crystal molecules 321 on onesurface 300 a of theliquid crystal layer 300 may have orientation. Theliquid crystal molecules 321 may be orientated parallel to the rubbing axis of thesacrificial layer 200. Theliquid crystal molecules 321 may be orientated parallel to the first direction D1. - Referring to
FIG. 3B , thesacrificial structure 200 may be separated from theliquid crystal layer 300 by a physical method to expose onesurface 300 a of theliquid crystal layer 300. Physical force may be applied to one end of thesacrificial structure 200 to separate thesacrificial structure 200. In view of the plane, thesacrificial structure 200 may be separated in the second direction D2. For example, after the one end of thesacrificial structure 200 is spaced apart from theliquid crystal layer 300, the other end of thesacrificial structure 200 may be spaced apart from theliquid crystal layer 300. Here, the one end and the other end of thesacrificial structure 200 may be adjacent to afirst side surface 200 c and asecond side surface 200 d of thesacrificial structure 200, respectively. The first and second side surfaces 200 c and 200 d of thesacrificial structure 200 may be parallel to the first direction D1. Bonding strength between theliquid crystal layer 300 and thesacrificial layer 220 when theliquid crystal molecules 321 are parallel to the first direction D1 may be less than that between theliquid crystal layer 300 and thesacrificial layer 220 when theliquid crystal molecules 321 are parallel to the second direction D2. Thus, thesacrificial layer 220 may be easily separated from theliquid crystal layer 300. In the separation process of thesacrificial layer 220, electrical fields may be more applied to theliquid crystal layer 300. In this case, the orientation of theliquid crystal molecules 321 may be more improved by the electrical fields. Thesacrificial layer 200 may be more easily separated. The separation process of thesacrificial layer 220 may be performed under a temperature less than a phase transition temperature of theliquid crystal molecules 321. Theliquid crystal device 1000 may be manufactured according to the example described above. After thesacrificial structure 200 is separated, theliquid crystal molecules 321 on the onesurface 300 a of theliquid crystal layer 300 may be randomly oriented. - Hereinafter, a light emitting apparatus including a liquid crystal device and manufacturing of the light emitting apparatus will be described.
-
FIG. 4 is a cross-sectional view of a light emitting apparatus according to an embodiment of the inventive concept. Hereinafter, the duplicated descriptions, which have been described already, will be omitted. - Referring to
FIG. 4 , alight emitting apparatus 1 may include aliquid crystal device 1000, asecond electrode 400, and alight emitting device 2000. Theliquid crystal device 1000 may include asupport substrate 110, afirst electrode 120, and aliquid crystal layer 300. Thelight emitting device 2000 may include alight emitting layer 500 and athird electrode 600. Thethird electrode 600 may be disposed on thelight emitting layer 500. Thelight emitting device 2000 may include an organic light emitting diode device, a field emission display (FED) device, or a plasma display panel (PDP) device. Thelight emitting device 2000 may emit light to theliquid crystal device 1000 through thesecond electrode 400. - The
second electrode 400 may be disposed between theliquid crystal device 1000 and thelight emitting device 2000. Thesecond electrode 400 may be in physical contact with theliquid crystal layer 300 and thelight emitting layer 500. Thesecond electrode 400 may be transparent. Thesecond electrode 400 may include transparent conductive oxide such as indium tin oxide or indium zinc oxide. For another example, thesecond electrode 400 may include silver nanowire, carbon nanotube, graphene, poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS), polyaniline, polythiophene, or a combination thereof. Thesecond electrode 400 may function as an electrode of theliquid crystal device 1000 and an electrode of thelight emitting device 2000. For example, orientation ofliquid crystal molecules 321 may be adjusted by a voltage difference between thefirst electrode 120 and thesecond electrode 400. Thus, theliquid crystal layer 300 may be adjusted in transmissivity. Emission of light of thelight emitting layer 500 may be determined by a voltage difference between thesecond electrode 400 and thethird electrode 600. Theliquid crystal device 1000 and thelight emitting device 2000 may share thesecond electrode 400, and thus, an additional electrode may not be provided between theliquid crystal device 1000 and thelight emitting device 2000. Thus, thelight emitting apparatus 1 may be miniaturized. Since an additional substrate (for example, the sacrificial substrate (seereference numeral 210 ofFIG. 1E ) is not disposed between theliquid crystal device 1000 and thelight emitting device 2000, thelight emitting apparatus 1 may be more miniaturized. - A process of forming the
light emitting apparatus 1 may include a process of forming asecond electrode 400 on alight emitting device 2000, a process of preparing aliquid crystal device 1000, and a process of disposing thesecond electrode 400 on aliquid crystal layer 300. Theliquid crystal device 1000 may be manufactured as the examples described with reference toFIGS. 1A to 1E ,FIGS. 2A and 2B , orFIGS. 3A and 3B . Thesecond electrode 400 may come into direct contact with the onesurface 300 a of theliquid crystal layer 300. The process of forming thesecond electrode 400 on thelight emitting device 200 may be performed before or after thesecond electrode 400 is disposed on theliquid crystal layer 300. - The
light emitting apparatus 1 may be used in various fields such as display apparatuses, lighting fixtures, and/or signboards. -
FIG. 5 is a cross-sectional view of a light emitting apparatus according to another embodiment of the inventive concept. Hereinafter, the duplicated descriptions, which have been described already, will be omitted. - Referring to
FIG. 5 , alight emitting apparatus 2 may include aliquid crystal device 1000, asecond electrode 400, and alight emitting device 2001. Afirst surface 2001a of thelight emitting device 2001 has a curved surface. Thesecond electrode 400 may be disposed on thelight emitting device 2001 and be in physical contact with thefirst surface 2001a of thelight emitting device 2001. Thesecond electrode 400 may be flexible. Thesecond electrode 400 may have a shape corresponding to that of thefirst surface 2001a of thelight emitting device 2001. For example, abottom surface 400 b of thesecond electrode 400 may have a curved surface. - The
liquid crystal device 1000 may be disposed on thebottom surface 400 b of thesecond electrode 400. Theliquid crystal device 1000 may include asupport substrate 110, afirst electrode 120, and aliquid crystal layer 300. Onesurface 300 a of theliquid crystal layer 300 may be in physical contact with thesecond electrode 400. Theliquid crystal device 1000 may be flexible. Abottom surface 1000 b of theliquid crystal device 1000 may have a curved surface. - The
light emitting apparatus 2 may be formed through substantially the same method as described with reference toFIG. 4 . For example, a process of forming thelight emitting apparatus 2 may include a process of forming asecond electrode 400 on alight emitting device 2001, a process of preparing aliquid crystal device 1000, and a process of disposing thesecond electrode 400 on aliquid crystal layer 300 of theliquid crystal device 1000. - Hereinafter, a window including a liquid crystal device and manufacturing of the window will be described.
-
FIG. 6 is a cross-sectional view of a window according to an embodiment of the inventive concept. Hereinafter, the duplicated descriptions, which have been described already, will be omitted. - Referring to
FIG. 6 , a window 3 may include aliquid crystal device 1000, asecond electrode 400, and aglass layer 3000. Theglass layer 3000 may be transparent. Light may pass through theglass layer 3000 and then be incident into thesecond electrode 400. Thesecond electrode 400 may be formed on theglass layer 3000. For example, thesecond electrode 400 may be formed through a deposition process. Thesecond electrode 400 may come into direct contact with theglass layer 3000. Thesecond electrode 400 may be transparent. Light may pass through thesecond electrode 400 and then be incident into theliquid crystal device 1000. - The
liquid crystal device 1000 may be disposed on theglass layer 3000. Theliquid crystal device 1000 may be manufactured according to the example described above. Theliquid crystal device 1000 may be attached to thesecond electrode 400 so that onesurface 300 a of theliquid crystal layer 300 is in physical direct contact with thesecond electrode 400. Theliquid crystal layer 300 may be adjusted in transmissivity by a voltage difference between thefirst electrode 120 and thesecond electrode 400. According to the embodiments, an additional substrate may not be disposed between theliquid crystal layer 300 and theglass layer 3000. Therefore, the window 3 may be reduced in thickness. - According to the inventive concept, the sacrificial structure may be removed to expose one surface of the liquid crystal layer. The light emitting apparatus or the window may be manufactured by using the liquid crystal device. The second electrode may be in physical direct contact with the liquid crystal layer and the light emitting device. The liquid crystal device and the light emitting device may share the second electrode. The light emitting apparatus may be miniaturized. Since an additional substrate is not provided between the liquid crystal device and the light emitting device, the light emitting apparatus may be more miniaturized.
- According to the embodiments, the second electrode may be in physical direct contact with the liquid crystal device and the glass layer. Therefore, the window may be miniaturized.
- Although the exemplary embodiments of the present invention have been described, it is understood that the present invention should not be limited to these exemplary embodiments but various changes and modifications can be made without departing from the spirit of the invention. Furthermore, the appended claims should be appreciated as a step including even another embodiment.
Claims (2)
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US17/173,718 US20210173242A1 (en) | 2016-12-01 | 2021-02-11 | Light emitting apparatus and window |
US17/700,118 US11604386B2 (en) | 2016-12-01 | 2022-03-21 | Light emitting apparatus and window |
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KR10-2016-0163024 | 2016-12-01 | ||
KR1020160163024A KR102301967B1 (en) | 2016-12-01 | 2016-12-01 | Method for manufacturing light emitting apparatus, Light emitting apparatus, and Window |
US15/654,831 US10409116B2 (en) | 2016-12-01 | 2017-07-20 | Method for manufacturing light emitting apparatus, light emitting apparatus, and window |
US16/528,220 US10948784B2 (en) | 2016-12-01 | 2019-07-31 | Light emitting apparatus and window |
US17/173,718 US20210173242A1 (en) | 2016-12-01 | 2021-02-11 | Light emitting apparatus and window |
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US16/528,220 Division US10948784B2 (en) | 2016-12-01 | 2019-07-31 | Light emitting apparatus and window |
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US20210173242A1 true US20210173242A1 (en) | 2021-06-10 |
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US15/654,831 Expired - Fee Related US10409116B2 (en) | 2016-12-01 | 2017-07-20 | Method for manufacturing light emitting apparatus, light emitting apparatus, and window |
US16/528,220 Active US10948784B2 (en) | 2016-12-01 | 2019-07-31 | Light emitting apparatus and window |
US17/173,718 Abandoned US20210173242A1 (en) | 2016-12-01 | 2021-02-11 | Light emitting apparatus and window |
US17/700,118 Active US11604386B2 (en) | 2016-12-01 | 2022-03-21 | Light emitting apparatus and window |
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KR102301967B1 (en) * | 2016-12-01 | 2021-09-17 | 한국전자통신연구원 | Method for manufacturing light emitting apparatus, Light emitting apparatus, and Window |
CN110989235A (en) * | 2019-12-09 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | Transparent display panel and preparation method thereof |
CN111176035B (en) * | 2020-02-24 | 2022-06-24 | 北京京东方技术开发有限公司 | Peep-proof and anti-theft listening device, glass, automobile and peep-proof method |
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JPH0615031U (en) * | 1992-07-24 | 1994-02-25 | 旭硝子株式会社 | LCD light control glass window |
AU2002362195A1 (en) * | 2001-12-28 | 2003-07-24 | Asahi Glass Company, Limited | Dimmer element and production method therefor |
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CN208044203U (en) * | 2018-04-28 | 2018-11-02 | 北京京东方光电科技有限公司 | Display equipment, optical system and virtual reality wear display equipment |
-
2016
- 2016-12-01 KR KR1020160163024A patent/KR102301967B1/en active IP Right Grant
-
2017
- 2017-07-20 US US15/654,831 patent/US10409116B2/en not_active Expired - Fee Related
-
2019
- 2019-07-31 US US16/528,220 patent/US10948784B2/en active Active
-
2021
- 2021-02-11 US US17/173,718 patent/US20210173242A1/en not_active Abandoned
-
2022
- 2022-03-21 US US17/700,118 patent/US11604386B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20180063430A (en) | 2018-06-12 |
KR102301967B1 (en) | 2021-09-17 |
US10948784B2 (en) | 2021-03-16 |
US20220214571A1 (en) | 2022-07-07 |
US11604386B2 (en) | 2023-03-14 |
US20190361277A1 (en) | 2019-11-28 |
US10409116B2 (en) | 2019-09-10 |
US20180157076A1 (en) | 2018-06-07 |
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