US20210011376A1 - Photosensitive transfer material, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel - Google Patents
Photosensitive transfer material, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel Download PDFInfo
- Publication number
- US20210011376A1 US20210011376A1 US16/984,469 US202016984469A US2021011376A1 US 20210011376 A1 US20210011376 A1 US 20210011376A1 US 202016984469 A US202016984469 A US 202016984469A US 2021011376 A1 US2021011376 A1 US 2021011376A1
- Authority
- US
- United States
- Prior art keywords
- photosensitive layer
- touch panel
- photosensitive
- transfer material
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000463 material Substances 0.000 title claims abstract description 129
- 238000012546 transfer Methods 0.000 title claims abstract description 125
- 230000001681 protective effect Effects 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 134
- -1 thiol compound Chemical class 0.000 claims abstract description 130
- 229920000642 polymer Polymers 0.000 claims abstract description 78
- 239000003999 initiator Substances 0.000 claims abstract description 43
- 239000011230 binding agent Substances 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims description 102
- 239000011347 resin Substances 0.000 claims description 102
- 239000000758 substrate Substances 0.000 claims description 83
- 125000004432 carbon atom Chemical group C* 0.000 claims description 40
- 239000012948 isocyanate Substances 0.000 claims description 34
- 125000000962 organic group Chemical group 0.000 claims description 9
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 341
- 239000010408 film Substances 0.000 description 118
- 238000005452 bending Methods 0.000 description 43
- 238000011161 development Methods 0.000 description 41
- 230000018109 developmental process Effects 0.000 description 41
- 238000011156 evaluation Methods 0.000 description 36
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 33
- 238000000034 method Methods 0.000 description 33
- 239000002253 acid Substances 0.000 description 30
- 238000001723 curing Methods 0.000 description 30
- 229920005992 thermoplastic resin Polymers 0.000 description 29
- 239000000126 substance Substances 0.000 description 23
- 238000010030 laminating Methods 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 21
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 19
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 19
- 239000002904 solvent Substances 0.000 description 19
- 239000011229 interlayer Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 18
- 238000001035 drying Methods 0.000 description 17
- 239000003112 inhibitor Substances 0.000 description 16
- 150000002513 isocyanates Chemical class 0.000 description 16
- 239000011342 resin composition Substances 0.000 description 16
- 239000003513 alkali Substances 0.000 description 15
- 230000035699 permeability Effects 0.000 description 15
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 14
- 125000000217 alkyl group Chemical group 0.000 description 14
- 125000002947 alkylene group Chemical group 0.000 description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 14
- 239000002245 particle Substances 0.000 description 14
- 239000004094 surface-active agent Substances 0.000 description 14
- 239000007983 Tris buffer Substances 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 239000000178 monomer Substances 0.000 description 12
- 239000003960 organic solvent Substances 0.000 description 12
- RQPNXPWEGVCPCX-UHFFFAOYSA-N 3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O RQPNXPWEGVCPCX-UHFFFAOYSA-N 0.000 description 11
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical group OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 11
- 238000005259 measurement Methods 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 11
- 239000004925 Acrylic resin Substances 0.000 description 10
- 229920000178 Acrylic resin Polymers 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical group CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 9
- 238000006116 polymerization reaction Methods 0.000 description 9
- 125000001424 substituent group Chemical group 0.000 description 9
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 8
- SEEVRZDUPHZSOX-WPWMEQJKSA-N [(e)-1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino] acetate Chemical compound C=1C=C2N(CC)C3=CC=C(C(\C)=N\OC(C)=O)C=C3C2=CC=1C(=O)C1=CC=CC=C1C SEEVRZDUPHZSOX-WPWMEQJKSA-N 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 8
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 8
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 125000000623 heterocyclic group Chemical group 0.000 description 7
- 125000005647 linker group Chemical group 0.000 description 7
- 239000012528 membrane Substances 0.000 description 7
- 125000003367 polycyclic group Chemical group 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
- 241000428199 Mustelinae Species 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 125000002843 carboxylic acid group Chemical group 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 125000004386 diacrylate group Chemical group 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910044991 metal oxide Inorganic materials 0.000 description 6
- 150000004706 metal oxides Chemical class 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 150000003573 thiols Chemical class 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 150000002923 oximes Chemical class 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical group OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical group OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- VSHMCEJCHYPYDU-UHFFFAOYSA-N 2-morpholin-4-ylpropanal Chemical compound O=CC(C)N1CCOCC1 VSHMCEJCHYPYDU-UHFFFAOYSA-N 0.000 description 4
- DKIDEFUBRARXTE-UHFFFAOYSA-M 3-mercaptopropionate Chemical compound [O-]C(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-M 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010494 dissociation reaction Methods 0.000 description 4
- 230000005593 dissociations Effects 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 230000036211 photosensitivity Effects 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 3
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 3
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229920002284 Cellulose triacetate Polymers 0.000 description 3
- 235000005956 Cosmos caudatus Nutrition 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002981 blocking agent Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 3
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 3
- 125000001072 heteroaryl group Chemical group 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 229920000620 organic polymer Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 150000003536 tetrazoles Chemical group 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 150000003852 triazoles Chemical group 0.000 description 3
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 2
- DLEWDCPFCNLJEY-UHFFFAOYSA-N 1-morpholin-4-ylpropan-1-one Chemical compound CCC(=O)N1CCOCC1 DLEWDCPFCNLJEY-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- NKMOLEYVYVWWJC-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis[2-(3-sulfanylbutanoyloxy)ethyl]-1,3,5-triazinan-1-yl]ethyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCN1C(=O)N(CCOC(=O)CC(C)S)C(=O)N(CCOC(=O)CC(C)S)C1=O NKMOLEYVYVWWJC-UHFFFAOYSA-N 0.000 description 2
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 2
- WBEKRAXYEBAHQF-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylbutanoic acid Chemical compound CC(S)CC(O)=O.CC(S)CC(O)=O.CC(S)CC(O)=O.CCC(CO)(CO)CO WBEKRAXYEBAHQF-UHFFFAOYSA-N 0.000 description 2
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 2
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- 102100027123 55 kDa erythrocyte membrane protein Human genes 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 101001057956 Homo sapiens 55 kDa erythrocyte membrane protein Proteins 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 2
- IHUNBGSDBOWDMA-AQFIFDHZSA-N all-trans-acitretin Chemical compound COC1=CC(C)=C(\C=C\C(\C)=C\C=C\C(\C)=C\C(O)=O)C(C)=C1C IHUNBGSDBOWDMA-AQFIFDHZSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- HECGKCOICWUUJU-UHFFFAOYSA-N bis(diphenylphosphanylmethyl)-phenylphosphane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 HECGKCOICWUUJU-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 125000001246 bromo group Chemical group Br* 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- VEZUQRBDRNJBJY-UHFFFAOYSA-N cyclohexanone oxime Chemical compound ON=C1CCCCC1 VEZUQRBDRNJBJY-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 125000002883 imidazolyl group Chemical group 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229940057867 methyl lactate Drugs 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- 229920006289 polycarbonate film Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000011164 primary particle Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- UGUHFDPGDQDVGX-UHFFFAOYSA-N 1,2,3-thiadiazole Chemical group C1=CSN=N1 UGUHFDPGDQDVGX-UHFFFAOYSA-N 0.000 description 1
- BVOMRRWJQOJMPA-UHFFFAOYSA-N 1,2,3-trithiane Chemical compound C1CSSSC1 BVOMRRWJQOJMPA-UHFFFAOYSA-N 0.000 description 1
- JRNVQLOKVMWBFR-UHFFFAOYSA-N 1,2-benzenedithiol Chemical compound SC1=CC=CC=C1S JRNVQLOKVMWBFR-UHFFFAOYSA-N 0.000 description 1
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical group C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- SRZXCOWFGPICGA-UHFFFAOYSA-N 1,6-Hexanedithiol Chemical compound SCCCCCCS SRZXCOWFGPICGA-UHFFFAOYSA-N 0.000 description 1
- AMIGDWBXJXRGEN-UHFFFAOYSA-N 1,6-dimethylcyclohexa-2,4-diene-1-thiol Chemical compound CC1(C(C=CC=C1)C)S AMIGDWBXJXRGEN-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- WHFHDVDXYKOSKI-UHFFFAOYSA-N 1-ethenyl-4-ethylbenzene Chemical compound CCC1=CC=C(C=C)C=C1 WHFHDVDXYKOSKI-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- ZMYIIHDQURVDRB-UHFFFAOYSA-N 1-phenylethenylbenzene Chemical group C=1C=CC=CC=1C(=C)C1=CC=CC=C1 ZMYIIHDQURVDRB-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- TZMSYXZUNZXBOL-UHFFFAOYSA-N 10H-phenoxazine Chemical compound C1=CC=C2NC3=CC=CC=C3OC2=C1 TZMSYXZUNZXBOL-UHFFFAOYSA-N 0.000 description 1
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 1
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- CNDCQWGRLNGNNO-UHFFFAOYSA-N 2-(2-sulfanylethoxy)ethanethiol Chemical compound SCCOCCS CNDCQWGRLNGNNO-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LXUNZSDDXMPKLP-UHFFFAOYSA-N 2-Methylbenzenethiol Chemical compound CC1=CC=CC=C1S LXUNZSDDXMPKLP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FXRQXYSJYZPGJZ-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxy]ethenylbenzene Chemical compound CC(C)(C)OC=CC1=CC=CC=C1 FXRQXYSJYZPGJZ-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- MXTOXODEXBYZFX-UHFFFAOYSA-N 2-[2-(2-sulfanylethylsulfanyl)ethylsulfanyl]ethanethiol Chemical compound SCCSCCSCCS MXTOXODEXBYZFX-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SUODCTNNAKSRHB-UHFFFAOYSA-N 2-ethylhexyl 3-sulfanylpropanoate Chemical compound CCCCC(CC)COC(=O)CCS SUODCTNNAKSRHB-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- SDXAWLJRERMRKF-UHFFFAOYSA-N 3,5-dimethyl-1h-pyrazole Chemical compound CC=1C=C(C)NN=1 SDXAWLJRERMRKF-UHFFFAOYSA-N 0.000 description 1
- OFQCJVVJRNPSET-UHFFFAOYSA-N 3,5-dimethyl-4-nitro-1h-pyrazole Chemical compound CC1=NNC(C)=C1[N+]([O-])=O OFQCJVVJRNPSET-UHFFFAOYSA-N 0.000 description 1
- DKIDEFUBRARXTE-UHFFFAOYSA-N 3-mercaptopropanoic acid Chemical compound OC(=O)CCS DKIDEFUBRARXTE-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- BGNGWHSBYQYVRX-UHFFFAOYSA-N 4-(dimethylamino)benzaldehyde Chemical compound CN(C)C1=CC=C(C=O)C=C1 BGNGWHSBYQYVRX-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- RISOHYOEPYWKOB-UHFFFAOYSA-N 4-bromo-3,5-dimethyl-1h-pyrazole Chemical compound CC1=NNC(C)=C1Br RISOHYOEPYWKOB-UHFFFAOYSA-N 0.000 description 1
- DITPLXUFWDEMDN-UHFFFAOYSA-N 4-methoxybutyl 3-sulfanylpropanoate Chemical compound COCCCCOC(=O)CCS DITPLXUFWDEMDN-UHFFFAOYSA-N 0.000 description 1
- XKVUYEYANWFIJX-UHFFFAOYSA-N 5-methyl-1h-pyrazole Chemical compound CC1=CC=NN1 XKVUYEYANWFIJX-UHFFFAOYSA-N 0.000 description 1
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical group NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000218691 Cupressaceae Species 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical group C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical group C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- IYPNRTQAOXLCQW-UHFFFAOYSA-N [4-(sulfanylmethyl)phenyl]methanethiol Chemical compound SCC1=CC=C(CS)C=C1 IYPNRTQAOXLCQW-UHFFFAOYSA-N 0.000 description 1
- VYGUBTIWNBFFMQ-UHFFFAOYSA-N [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O Chemical group [N+](#[C-])N1C(=O)NC=2NC(=O)NC2C1=O VYGUBTIWNBFFMQ-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- FZENGILVLUJGJX-UHFFFAOYSA-N acetaldehyde oxime Chemical compound CC=NO FZENGILVLUJGJX-UHFFFAOYSA-N 0.000 description 1
- 125000002339 acetoacetyl group Chemical group O=C([*])C([H])([H])C(=O)C([H])([H])[H] 0.000 description 1
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- ZWOASCVFHSYHOB-UHFFFAOYSA-N benzene-1,3-dithiol Chemical compound SC1=CC=CC(S)=C1 ZWOASCVFHSYHOB-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010511 deprotection reaction Methods 0.000 description 1
- NFKGQHYUYGYHIS-UHFFFAOYSA-N dibutyl propanedioate Chemical compound CCCCOC(=O)CC(=O)OCCCC NFKGQHYUYGYHIS-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000572 ellipsometry Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- HOXINJBQVZWYGZ-UHFFFAOYSA-N fenbutatin oxide Chemical compound C=1C=CC=CC=1C(C)(C)C[Sn](O[Sn](CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C=1C=CC=CC=1)(CC(C)(C)C=1C=CC=CC=1)CC(C)(C)C1=CC=CC=C1 HOXINJBQVZWYGZ-UHFFFAOYSA-N 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- WOLATMHLPFJRGC-UHFFFAOYSA-N furan-2,5-dione;styrene Chemical compound O=C1OC(=O)C=C1.C=CC1=CC=CC=C1 WOLATMHLPFJRGC-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000005400 gorilla glass Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- CBOIHMRHGLHBPB-UHFFFAOYSA-N hydroxymethyl Chemical group O[CH2] CBOIHMRHGLHBPB-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 125000002346 iodo group Chemical group I* 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- LDTLDBDUBGAEDT-UHFFFAOYSA-N methyl 3-sulfanylpropanoate Chemical compound COC(=O)CCS LDTLDBDUBGAEDT-UHFFFAOYSA-N 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- BZFWSDQZPYVFHP-UHFFFAOYSA-N n,n-dimethyl-4-methylsulfanylaniline Chemical compound CSC1=CC=C(N(C)C)C=C1 BZFWSDQZPYVFHP-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical compound ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SKEQOTBKQUCUGK-UHFFFAOYSA-N o-(2-hydroxyethyl) propanethioate Chemical compound CCC(=S)OCCO SKEQOTBKQUCUGK-UHFFFAOYSA-N 0.000 description 1
- UCUPUEARJPTGKU-UHFFFAOYSA-N octadecyl 3-sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCS UCUPUEARJPTGKU-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- LWNSNYBMYBWJDN-UHFFFAOYSA-N octyl 3-sulfanylpropanoate Chemical compound CCCCCCCCOC(=O)CCS LWNSNYBMYBWJDN-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- MMSLOZQEMPDGPI-UHFFFAOYSA-N p-Mentha-1,3,5,8-tetraene Chemical compound CC(=C)C1=CC=C(C)C=C1 MMSLOZQEMPDGPI-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N propane-1,3-dithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000017550 sodium carbonate Nutrition 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- ACTRVOBWPAIOHC-XIXRPRMCSA-N succimer Chemical compound OC(=O)[C@@H](S)[C@@H](S)C(O)=O ACTRVOBWPAIOHC-XIXRPRMCSA-N 0.000 description 1
- 229960005346 succimer Drugs 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- JJJPTTANZGDADF-UHFFFAOYSA-N thiadiazole-4-thiol Chemical compound SC1=CSN=N1 JJJPTTANZGDADF-UHFFFAOYSA-N 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- PWBHRVGYSMBMIO-UHFFFAOYSA-M tributylstannanylium;acetate Chemical compound CCCC[Sn](CCCC)(CCCC)OC(C)=O PWBHRVGYSMBMIO-UHFFFAOYSA-M 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/0275—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Definitions
- the present disclosure relates to a photosensitive transfer material, an electrode protective film, a laminate, a capacitive input device, and a manufacturing method of a touch panel.
- a tablet type input device is disposed on a surface of a liquid crystal device or the like.
- the input device described above may include a resistance film type input device, a capacitive input device, and the like.
- the capacitive input device is advantageous in that a transmittance conductive film may be simply formed on one sheet of substrate.
- a capacitive input device there is provided a device in which electrode patterns are extended in directions intersecting each other, and which detects an input position by detecting a change of electrostatic capacity between electrodes, in a case where a finger or the like is touched.
- a transparent resin layer is provided on a side opposite to the surface for the inputting with a finger or the like.
- a method for forming a pattern of a cured resin film using a photosensitive resin composition As a method for forming a pattern of a cured resin film using a photosensitive resin composition, a method disclosed in WO20131084872A is used.
- WO2013/084872A discloses a method for forming a pattern of a cured resin film, the method including: a first step of providing a photosensitive layer consisting of a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a thiol compound on a substrate; a second step of curing a predetermined portion of the photosensitive layer by emitting active light; and a third step of removing a portion of the photosensitive layer other than the predetermined portion, and forming a cured film pattern of the predetermined portion of the photosensitive layer, in which the photosensitive resin composition includes an oxime ester compound and/or a phosphine oxide compound as the photopolymerization
- examples of the photosensitive resin composition include those disclosed in JP2008-077067A and WO2015/072533A.
- JP2008-077067A discloses a photosensitive resin composition used in formation of a spacer for a liquid crystal display element, the photosensitive resin composition including: [A] a copolymer having a polymerized unit derived from an ethylenically unsaturated carboxylic acid and/or a polymerized unit derived from an ethylenically unsaturated carboxylic acid anhydride, [B] a polymerizable compound having an ethylenically unsaturated bond; [C] photopolymerization initiator, and [D] a thiol compound represented by Formulae (1) or (2):
- R 1 is a methylene group or art alkylene group having 2 to 20 carbon atoms
- R 2 is a methylene group, or a linear or branched alkylene group having 2 to 6 carbon atoms, and in represents an integer of 1 to 20
- R's are the same or different and a group represented by —H, —OH or Formula (2′).
- R 3 is a methylene group or a linear or branched alkylene group having 2 to 6 carbon atoms, where, at least one of the four R's is a group represented by the Formula (2′)).
- WO2015/072533A discloses a curable composition including: a polymerizable compound having an ethylenically unsaturated bond as a component A; a of initiator as a component B; B thiol compound as a component S; and an organic solvent as a component D, in which the component A includes a hexa- or higher functional urethane (meth)acrylate, a ratio of the hexa- or higher functional urethane (meth)acrylate in the component A is 70 to 100% by mass, and a content of the component S is 1 to 20% by mass with respect to a total solid content of the curable composition.
- An object to be achieved by an embodiment of the invention is to provide a photosensitive transfer material having low tackiness and excellent bending resistance after curing.
- Another object to be achieved by another embodiment of the invention is to provide an electrode protective film using the photosensitive transfer material, a laminate, a capacitive input device, and a manufacturing method of a touch panel.
- a photosensitive transfer material comprising: a temporary support; and a photosensitive layer, in which the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and value of a ratio M RS /M B of a total content M RS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content M B of the binder polymer with respect to the total mass of the photosensitive layer is 0.1 to 2.0.
- n an integer of 1 to 6
- A represents an n-valent organic group having 1 to 15 carbon atoms or a group represented by Formula 2
- R 1 's each independently represent a divalent organic group having 1 to 15 carbon atoms, in a case where A represents a group represented by Formula 2, n represents 3.
- R 2 to R 4 each independently represent a divalent organic group having 1 to 15 carbon atoms, and wavy line parts represent bonding positions to an oxygen atom adjacent to A in Formula 1.
- ⁇ 5> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 4>, in which the value of a ratio M RS /M B is 0.4 to 1.2.
- ⁇ 6> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 5>, in which the content of the thiol compound is 5% by mass to 40% by mass with respect to the total mass of the photosensitive layer.
- ⁇ 7> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 6>, in which the binder polymer includes a resin having a constitutional unit having it radically polymerizable group.
- ⁇ 9> The photosensitive transfer material according to any one of ⁇ 1> to ⁇ 8>, in which the photosensitive transfer material is for forming a protective film of a touch panel.
- a laminate comprising: the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to any one of ⁇ 1> to ⁇ 9>, on a substrate.
- a capacitive input device comprising: the electrode protective film according to ⁇ 10> or the laminate according to ⁇ 11>.
- a manufacturing method for a touch panel comprising: preparing a substrate for a touch panel having a structure in which at least one of an electrode for a touch panel or a wiring for a touch panel is disposed on a substrate; forming a photosensitive layer on a surface of the substrate for a touch panel on a side where at least one of the electrode for a touch panel or the wiring for a touch panel is disposed, using the photosensitive transfer material according to any one of ⁇ 1> to ⁇ 9>; performing pattern-exposing on the photosensitive layer formed on the substrate for a touch panel; and developing the pattern-exposed photosensitive layer to obtain a protective film for a touch panel which protects at least a part of at least one of the electrode for a touch panel or the wiring for a touch panel.
- an electrode protective film using the photosensitive transfer material, a laminate, a capacitive input device, and a manufacturing method of a touch panel.
- FIG. 1 is a schematic cross sectional view showing an example of a photosensitive transfer material according to the disclosure.
- FIG. 2 is a schematic cross sectional view showing a first specific example of a touch panel according to the disclosure.
- FIG. 3 is a schematic cross sectional view showing a second specific example of the touch panel according to the disclosure.
- FIG. 4 is a schematic view showing a state before bending a sample for bending resistance evaluation 102 at a height d in the bending resistance evaluation, in a view from a horizontal direction.
- FIG. 5 is a schematic view showing a state before bending a sample for bending resistance evaluation 102 at a height d in the bending resistance evaluation, in a view from the upper side in a direction of gravity.
- FIG. 6 is a schematic view showing a state after bending a sample for bending resistance evaluation 102 at a height d in the bending resistance evaluation, in a view from a horizontal direction.
- a term “to” showing a range of numerical values is used as a meaning including a lower limit value and an upper limit value disclosed before and after the term.
- the upper limit value or the lower limit value described in one range of numerical values may be replaced with an upper limit value or a lower limit value of the range of numerical values described in other stages.
- the upper limit value or the lower limit value of the range of numerical values may be replaced with values shown in the examples.
- a term with no description of “substituted” and “unsubstituted” includes both a group not including a substituent and a group including a substituent.
- an “alkyl group” not only includes an alkyl group not including a substituent (unsubstituted alkyl group), but also an alkyl group including a substituent (substituted alkyl group).
- % by mass is identical to “% by weight” and “part by mass” is identical to “part by weight”.
- an amount of each component in the composition means a total amount of the plurality of substances present in the composition, unless otherwise noted.
- a term “step” not only includes an independent step, but also includes a step, in a case where the step may not he distinguished from the other step, as long as the expected object of the step is achieved.
- (meth)acrylic acid has a concept including both acrylic acid and a methacrylic acid
- (meth)acrylate has a concept including both acrylate and methacrylate
- (meth)acryloyl group has a concept including both acryloyl group and methacryloyl group.
- a weight-average molecular weight (Mw) and a number average molecular weight (Mn) of the disclosure are detected by a gel permeation chromatography (GPC) analysis device using a column of TSKgel GMHxL, TSKgel G4000HxL, TSKgel G2000HxL (all product names manufactured by Tosoh Corporation), by using tetrahydrofuran (THF) as a solvent and a differential refractometer, and are molecular weights obtained by conversion using polystyrene as a standard substance.
- GPC gel permeation chromatography
- a ratio of the constitutional unit in a resin represents a mass ratio unless otherwise noted.
- the molecular weight in a case where there is a molecular weight distribution, represents the weight-average molecular weight (Mw), unless otherwise noted.
- a photosensitive transfer material comprises: a temporary support; and a photosensitive layer, the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and a value of a ratio of a total content M RS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content M B of the binder polymer with respect to the total mass of the photosensitive layer, M RS /M B , is 0.1 to 2.0.
- the photosensitive transfer material according to the disclosure can be preferably used as a photosensitive transfer material for a touch panel, can be more preferably used as a photosensitive transfer material for forming a protective film in a touch panel, and can be particularly preferably used as a photosensitive transfer material for forming an electrode protective film in a touch panel.
- the photosensitive layer includes 5% by mass or more of a thiol compound
- the thiol compound reacts with a radically polymerizable compound having an ethylenically unsaturated group, a thioether bond is generated, flexibility of the obtained cured film is improved, and excellent bending resistance after curing is obtained.
- M RS /M B the value of the ratio of a total content M RS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to the content M B of the binder polymer with respect to the total mass of the photosensitive layer, M RS /M B , as 0.1 to 2.0, it is possible to have hardness of the photosensitive layer and adhesiveness of the surface in suitable ranges and to decrease tackiness.
- the photosensitive transfer material includes a photosensitive layer, the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and a value of a ratio of a total content M RS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content M B of the binder polymer with respect to the total mass of the photosensitive layer, M RS /M B , is 0.1 to 2.0.
- the photosensitive layer includes a thiol compound.
- the content of the thiol compound in the photosensitive layer is 5% by mass or more, and from a viewpoint of tackiness and bending resistance after curing, is preferably 5% by mass to 40% by mass, more preferably 5% by mass to 35% by mass, even more preferably 5.5% by mass to 30% by mass, and particularly preferably 6.5% by mass to 25% by mass, with respect to a total mass of the photosensitive layer.
- the thiol compounds may be used alone or in combination of two or more thereof.
- the value of the ratio of the total content M RS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to the content M B of the binder polymer with respect to the total mass of the photosensitive layer, M RS /M B is 0.1 to 2.0, and is preferably 0.2 to 1.8, more preferably 0.3 to 1.5, and particularly preferably 0.4 to 1.2, from a viewpoint of tackiness, and bending resistance and hardness after curing.
- the thiol compound a monofunctional thiol compound or a polyfunctional thiol compound is preferably used.
- the thiol compound is preferably a di- or higher functional thiol compound (polyfunctional thiol compound) and more preferably a polyfunctional thiol compound.
- the polyfunctional thiol compound refers to a compound having two or more mercapto groups (thiol groups) in a molecule.
- the polyfunctional thiol compound is preferably a low-molecular-weight compound having a molecular weight of 100 of more, and specifically, the molecular weight thereof is more preferably 100 to 1,500 and even more preferably 150 to 1,000.
- the number of functional groups of the polyfunctional thiol compound is preferably 2 to 10, more preferably 2 to 8, and even more preferably 2 to 6, from a viewpoint of hardness after curing.
- the polyfunctional thiol compound is preferably an aliphatic polyfunctional thiol compound, from viewpoints of tackiness and bending resistance and hardness after curing.
- the thiol compound is more preferably a secondary thiol compound, from a viewpoint of storage stability of the photosensitive transfer material.
- polyfunctional thiol compound examples include trimethylolpropane tris (3-mercaptobutyrate), 1,4-bis (3-mercaptobutyryloxy) butane, pentaerythritol tetrakis (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6 (1H,3H,5H)-trione, trimethylolethanetris (3-mercaptobutyrate), tris [(3-mercaptopropionyloxy) ethyl] isocyanurate, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), ethylene glycol bisthiopropionate,
- trimethylolpropane tris (3-mercaptobutyrate), 1,4-bis (3-mercaptobutyryloxy) butane, pentaerythritol tetrakis (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6 (1H,3H,5H)-trione, trimethylolethanetris (3-mercaptobutyrate), tris [(3-mercaptopropionyloxy) ethyl] isocyanurate, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), and dipentaerythritol hexakis (3-mercaptopropionate) are preferable.
- both an aliphatic thiol compound and an aromatic thiol compound can be used.
- the monofunctional aliphatic thiol compound examples include 1-octanethiol, 1-dodecanethiol, ⁇ -mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.
- Examples of the monofunctional aromatic thiol compound include benzenethiol, toluenethiol, and xylenethiol.
- the thiol compound is preferably a thiol compound having an ester bond and more preferably includes a compound represented by Formula 1, from a viewpoint of tackiness, bending resistance and hardness after curing.
- n represents an integer of 1 to 6
- A represents an n-valent organic group having 1 to 15 carbon atoms or a group represented by Formula 2
- R 1 's each independently represent a divalent organic group having 1 to 15 carbon atoms.
- R 2 to R 4 each independently represent a divalent organic group having 1 to 15 carbon atoms, and wavy line parts represent bonding positions to an oxygen atom adjacent to A in Formula 1.
- A represents a group represented by Formula 2
- n represents 3.
- n in Formula 1 is preferably an integer of 2 to 6.
- a in Formula 1 is preferably an n-valent aliphatic group having 1 to 15 carbon atoms or a group represented by Formula 2, more preferably an n-valent aliphatic group having 4 to 15 carbon atoms or a group represented by Formula 2, even more preferably an n-valent aliphatic group having 4 to 10 carbon atoms or a group represented by Formula 2, and particularly preferably a group represented by Formula 2, from a viewpoint of tackiness, and bending resistance and hardness after curing.
- a in Formula 1 is preferably an n-valent group consisting of a hydrogen atom and a carbon atom or an n-valent group consisting of a hydrogen atom, a carbon atom, and an oxygen atom, more preferably an n-valent group consisting of a hydrogen atom and a carbon atom, and particularly preferably an n-valent aliphatic hydrocarbon group, from a viewpoint of tackiness, bending resistance, and hardness, and moisture permeability after curing.
- R 1 's in Formula 1 are each independently preferably an alkylene group has 1 to 15 carbon atoms, more preferably an alkylene group having 2 to 4 carbon atoms, even more preferably an alkylene group having 3 carbon atoms, and particularly preferably a 1,2-propylene group, from a viewpoint of tackiness, bending resistance and hardness after curing.
- the alkylene group may be linear or branched.
- R 2 to R 4 in Formula 2 are each independently preferably an aliphatic group having 2 to 15 carbon atoms, more preferably an alkylene group liming 2 to 15 carbon atoms or a polyalkyleneoxyalkyl group having 3 to 15 carbon atoms, even more preferably an alkylene group having 2 to 15 carbon atoms, and particularly preferably an ethylene group, from a viewpoints of tackiness, and bending resistance and hardness after curing.
- polyfunctional thiol compound a compound having two or more groups represented by Formula S-1 is preferable.
- R 1S represents a hydrogen atom or an alkyl group
- a 1S represents —CO— or —CH2—
- wavy line parts represent bonding positions to another structure.
- the polyfunctional thiol compound is preferably at compound having 2 to 6 groups represented by Formula S-1.
- the alkyl group of R 1S in Formula S-1 is a linear, branched, or cyclic alkyl group, and a range of the number of carbon atoms is preferably 1 to 16 and more preferably 1 to 10.
- Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, an s-butyl group, a t-butyl group, a pentyl group, a hexyl group, and a 2-ethylhexyl group, and a methyl group, an ethyl group, a propyl group, or an isopropyl group is preferable.
- R 1S a hydrogen atom, a methyl group, an ethyl group, a propyl group, or an isopropyl group is particularly preferable, and a methyl group or an ethyl group is most preferable.
- polyfunctional thiol compound is particularly preferably a compound represented by Formula S-2 having a plurality of groups represented by Formula S-1.
- R 1S 's each independently represent a hydrogen atom or an alkyl group
- a 1S 's each independently represent —CO— or —CH2—
- L IS represents an nS-valent linking group
- nS represents an integer of 2 to 8. From a viewpoint of synthesis, it is preferable that all R 1S 's have the same group, and that all A 1S 's have the same group.
- R 1S in Formula S-2 is same as R 1S in Formula S-1 and the preferred range is also the same.
- nS is preferably an integer of 2 to 6.
- L1S which is an nS-valent linking group in Formula S-2
- examples of L1S include a divalent linking group such as —(CH2)mS— (mS represents an integer of 2 to 6) or —(CH2)mS ⁇ (CH2)mSO ⁇ mT(CH2)mS— (mS and mT each independently represent an integer of 2 to 6), a trivalent linking group such as a trimethylolpropane residue or isocyanuric ring having three of —(CH2)pS— (pS represents an integer of 2 to 6), a tetravalent linking group such as a pentaerythritol residue, and a pentavalent or hexavalent linking group such as a dipentaerythritol residue.
- a divalent linking group such as —(CH2)mS— (mS represents an integer of 2 to 6) or —(CH2)mS ⁇ (CH2)mSO ⁇ mT(CH2)mS— (mS and mT each
- thiol compound preferably include the following compounds, but are not limited thereto.
- the photosensitive layer in the photosensitive transfer material according to the disclosure includes a binder polymer.
- the binder polymer is preferably an alkali soluble resin.
- an acid value of the binder polymer is not particularly limited, but from a viewpoint of developability, the binder polymer is preferably a binder polymer having an acid value of 60 mgKOH/g or more, more preferably an alkali soluble resin having an acid value of 60 mgKOH/g or more, and particularly preferably a carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more.
- the binder polymer having an acid value can be thermally crosslinked with a compound capable of reacting with an acid by heating to increase a three-dimensional crosslink density.
- a carboxyl group of the carboxyl group-containing (meth)acrylic resin is dehydrated and made hydrophobic to contribute to improvement of wet heat resistance.
- the carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more (hereinafter, may be referred to as a specific polymer A) is not particularly limited, as long as the acid value condition is satisfied, and a resin can be selected and used from well-known resins.
- a binder polymer which is a carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more among polymers disclosed in paragraph 0025 of JP2011-095716A, a carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more among polymers disclosed in paragraphs 0033 to 0052 of JP2010-237589A, and the like can be preferably used as the specific polymer A in the embodiment.
- the (meth)acrylic resin indicates to a resin containing at least one of a constitutional unit derived from (meth)acrylic acid or a constitutional unit derived from a (meth)acrylic acid ester.
- a total ratio of the constitutional unit derived from (meth)acrylic acid and the constitutional unit derived from (meth)acrylic acid ester in the (meth)acrylic resin is preferably 30 mol % or more and inure preferably 50 mol % or more.
- a range of a copolymerization ratio of the monomer having a carboxyl group in the specific polymer A is preferably 5% by mass to 50% by mass, more preferably 5% by mass to 40% by mass, and even more preferably 10% by mass to 30% by mass, with respect to a total mass of the specific polymer A.
- the specific polymer A may have a reactive group, and as a method for introducing the reactive group into the specific polymer A, a method for causing a reaction of an epoxy compound, blocked isocyanate, isocyanate, a vinyl sulfone compound, an aldehyde compound, a methylol compound, a carboxylic acid anhydride, or the like with a hydroxyl group, a carboxyl group, a primary amino group, a secondary amino group, an acetoacetyl group, sulfonic acid, or the like is used.
- the reactive group is preferably a radically polymerizable group, more preferably an ethylenically unsaturated group, and particularly preferably a (meth)acryloxy group.
- the binder polymer particularly the specific polymer A, preferably has a constitutional unit haying an aromatic ring, from a viewpoint of moisture permeability and hardness after curing.
- Examples of a monomer forming the constitutional unit having an aromatic ring include styrene, tert-butoxystyrene, methylstyrene, styrene, and benzyl (meth)acrylate.
- constitutional unit having an aromatic ring it is preferable to contain at least one constitutional unit represented by Formula P-2 which will be described later.
- the constitutional unit having an aromatic ring is preferably a constitutional unit derived from a styrene compound.
- a content ratio of the constitutional unit having an aromatic ring is preferably 5% by mass to 90% by mass, and more preferably 10% by mass to 70% by mass, even more preferably 20% by mass to 50% by mass, with respect to a total mass of the binder polymer.
- the binder polymer particularly the specific polymer A, preferably has a constitutional unit having an alicyclic skeleton, from a viewpoint of tackiness and hardness after curing.
- Specific examples of the monomer forming the constitutional unit having an alicyclic skeleton include dicyclopentanyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate.
- Preferred examples of the aliphatic ring included in the constitutional unit having an alicyclic skeleton include a dicyclopentane ring, a cyclohexane ring, an isoborone ring, and a tricyclodecane ring. Among these, a tricyclodecane ring is particularly preferable.
- a ratio of the constitutional unit having an acyclic skeleton is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 80% by mass, and even more preferably 20% by mass to 70% by mass, with respect to a total mass of the binder polymer.
- the binder polymer particularly the specific polymer A, preferably has a constitutional unit baying a radically polymerizable group and more preferably has a constitutional unit having an ethylenically unsaturated group, from a viewpoint of tackiness and hardness after curing.
- the ethylenically unsaturated group is preferably a (meth)acryl group and more preferably a (meth)acryloxy group.
- a ratio of the constitutional unit having an ethylenically unsaturated group is preferably 5% by mass to 70% by mass, and more preferably 10% by mass to 50% by mass, even more preferably 20% by mass to 40% by mass, with respect to a total mass of the binder polymer.
- the specific polymer A is preferably a compound A-1 or a compound A-2 shown below and more preferably the compound A-1.
- a ratio of each constitutional unit shown below can be suitably changed depending on the purpose.
- the ratio of each constitutional unit in he compounds A-1 and A-2 is a mass ratio.
- Me represents a methyl group.
- the acid value of the binder polymer used in the disclosure is preferably 60 mgKOH/g to 200 mgKOH/g, more preferably 60 mgKOH/g to 150 mgKOH/g, and even more preferably 60 mgKOH/g to 110 mgKOH/g.
- the acid value refers to a value measured according to the method disclosed in JIS K0070 (1992).
- the binder polymer includes a binder polymer having an acid value of 60 mgKOH/g or more, it is possible to increase interlaminar adhesion between the photosensitive layer and a transparent resin layer which will be described later, in addition to the above-mentioned advantages, because the transparent resin layer includes a (meth)acrylic resin having an acid group.
- a weight-average molecular weight of the specific polymer A is preferably 10,000 or more and more preferably 20,000 to 100,000.
- any film-forming resin can be suitably selected and used according to the purpose, in addition to the specific polymer.
- a film having good surface hardness and heat resistance is preferable, an alkali soluble resin is more preferable, and among the alkali soluble resins, a well-known photosensitive siloxane resin material can be preferably used.
- the binder polymer used in the disclosure preferably includes a polymer containing a constitutional unit having a carboxylic acid anhydride structure (hereinafter, also referred to as a specific polymer B).
- a specific polymer B By including the specific polymer B, the developability and the hardness after curing are more excellent.
- the carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, and is preferably a cyclic carboxylic acid anhydride structure.
- the ring of the cyclic carboxylic acid anhydride structure is preferably a 5- to 7-membered ring, more preferably a 5-membered ring or a 6-membered ring, and even more preferably a 5-membered ring.
- cyclic carboxylic acid anhydride structure may be condensed or bonded with another ring structure to form a polycyclic structure, but preferably does not form a polycyclic structure.
- the polycyclic structure is preferably a bicyclo structure or a spiro structure.
- the number of other ring structures condensed or bonded to the cyclic carboxylic acid anhydride structure is preferably 1 to 5, and more preferably 1 to 3.
- Examples of the other ring structure include a cyclic hydrocarbon group having 3 to 20 carbon atoms and a heterocyclic group having 3 to 20 carbon atoms.
- the heterocyclic group is not particularly limited, and examples thereof include an aliphatic heterocyclic group and an aromatic heterocyclic group.
- heterocyclic group is preferably a 5-membered ring or a 6-membered ring, and particularly preferably a 5-membered ring.
- heterocyclic group a heterocyclic group containing at least one oxygen atom (for example, an oxolane ring, an oxane ring, or a dioxane ring) is preferable.
- the constitutional unit having a carboxylic acid anhydride structure is preferably a constitutional unit containing a divalent group obtained by removing two hydrogen atoms from a compound represented by Formula P-1 in a main chain, or a constitutional unit in which a monovalent group obtained by removing one hydrogen atom from a compound represented by Formula P-1 is bonded to the main chain directly or via a divalent linking group.
- R A1a represents a substituent and n1a R A1a 's may be the same of different.
- Z 1a represents a divalent group forming a ring containing —C( ⁇ O)—O—C( ⁇ O)—.
- n 1a represents an integer of 0 or more.
- R A1a As a substituent represented by R A1a , the same substituent as the substituent which may be included in the carboxylic acid anhydride structure may be used, and the preferable range is also the same.
- Z 1a is preferably an alkylene group having 2 to 4 carbon atoms, more preferably an alkylene group having 2 or 3 carbon atoms, and particularly preferably an alkylene group having 2 carbon atoms.
- partial structure represented by Formula P-1 may be condensed or bonded with another ring structure to form a polycyclic structure, but preferably does not form a polycyclic structure.
- the same ring structure as the other ring structure described above which may be condensed or bonded to the carboxylic acid anhydride structure may be used, and the preferable range is also the same.
- n 1a represents an integer of 0 or more.
- n 1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and even more preferably 0.
- n 1a represents an integer of 2 or more
- a plurality of R A1a 's existing may be the same or different.
- the plurality of R A1a 's existing may be bonded to each other to form a ring, but it is preferable that they are not bonded to each other to form a ring.
- the constitutional unit having a carboxylic acid anhydride structure is preferably a constitutional unit derived from an unsaturated carboxylic acid anhydride, more preferably a constitutional unit derived from an unsaturated cyclic carboxylic acid anhydride, even more preferably a constitutional unit derived from an unsaturated alicyclic carboxylic acid anhydride, still preferably a constitutional unit derived from maleic anhydride or itaconic anhydride, and particularly preferably a constitutional unit derived from maleic anhydride.
- constitutional unit having a carboxylic acid anhydride structure will be described, but the constitutional unit having a carboxylic acid anhydride structure is not limited to these specific examples.
- Rx represents a hydrogen atom, a methyl group, a CH 2 OH group, or a CF 3 group, and Me represents a methyl group.
- the constitutional unit having a carboxylic acid anhydride structure is preferably at least one of the constitutional units represented by any of Formulae a2-1 to a2-21, and more preferably one of the constitutional units represented by any of Formulae a2-1 to a2-21.
- the constitutional unit having a carboxylic acid anhydride structure preferably has at least one of the constitutional unit represented by Formula a2-1 or the constitutional unit represented by Formula a2-2, and more preferably the constitutional unit represented by Formula a2-1, from a viewpoint of improving sweat resistance of the cured film and reducing the development residue in a case where the photosensitive transfer material is obtained.
- a ratio of constitutional unit having a carboxylic acid anhydride structure in the specific polymer B (in the case of two or more kinds, total ratio thereof. The same applies hereinafter) is more than 0 mol %, preferably 60 mol % or more, more preferably 5 mol % to 40 mol %, and even more preferably 10 mol % to 35 mol %, with respect to a total amount of the specific polymer B.
- the “constitutional unit” in a case where the ratio of the “constitutional unit” is defined by a molar ratio, the “constitutional unit” is synonymous with the “monomer unit”.
- the “monomer unit” may be modified after polymerization by a polymer reaction or the like. The same applies to the followings.
- the specific polymer B it is preferable to contain at least one constitutional unit represented by Formula P-2. This further improves hydrophobicity and hardness of the cured film that is formed.
- R P1 represents a hydroxyl group, an alkyl group, an aryl group, an alkoxy group, a carboxy group, or a halogen atom
- R P2 represents a hydrogen atom, an alkyl group, or an aryl group
- nP represents an integer of 0 to 5. In a case where nP is an integer of 2 or more, two or more existing R P1 's may be the same or different.
- R P1 is preferably an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a carboxy group, an F atom, a Cl atom, a Br atom, or an I atom, and more preferably an alkyl group having 1 to 4 carbon atoms, a phenyl group, an alkoxy group having 1 to 4 carbon atoms, a Cl atom, or a Br atom.
- R P2 is preferably a hydrogen atom, an alkyl group having1 to 10 carbon atoms, or an aryl group having 6 to 12 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, even more preferably a hydrogen atom, a methyl group, or an ethyl group, and particularly preferably a hydrogen atom.
- nP is preferably an integer of 0 to 3, more preferably 0 or 1, and further preferably 0.
- a constitutional unit represented by formula P-2 is preferably a constitutional unit derived from a styrene compound.
- styrene compound examples include styrene, p-methylstyrene, ⁇ -methylstyrene, ⁇ , p-dimethylstyrene, p-ethylstyrene, p-t-butylstyrene, and 1,1-diphenylethylene, styrene or ⁇ -methylstyrene is preferable, and styrene is particularly preferable.
- the styrene compound for forming the constitutional unit represented by Formula P-2 may be only one or two or more kinds thereof.
- a ratio of the constitutional units represented by Formula P-2 in the specific polymer B is preferably 5 mol % to 90 mol %, more preferably 30 mol % to 90 mol %, and even more preferably 40 mol % to 90 mol %, with respect to the total amount of the specific polymer B.
- the specific polymer B may include at least one constitutional unit other than the constitutional unit having a carboxylic acid anhydride structure and the constitutional unit represented by Formula P-2.
- the other constitutional unit preferably does not contain an acid group.
- the other constitutional unit is not particularly limited, and a constitutional unit derived from a monofunctional ethylenically unsaturated compound is used.
- the monofunctional ethylenically unsaturated compound well-known compounds can be used without particular limitation, and examples thereof include a (meth)acrylic acid derivative such as methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, carbitol (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, or epoxy (meth)acrylate; an N-vinyl compound such as N-vinylpyrrolidone or N-vinylcaprolactam; and a derivative of an allyl compound such as allyl glycidyl ether.
- a (meth)acrylic acid derivative such as methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate,
- a ratio of the other constitutional units in the specific polymer B is preferably 10 mol % or more and less than 100 mol %, and more preferably 50 mol % or more and less than 100% by mass, with respect to the total amount of the specific polymer B.
- a weight-average molecular weight of the binder polymer is not particularly limited, and is preferably more than 3,000, more preferably more than 3,000 and 60,000 or more, and even more preferably 5,000 to 50,000.
- the binder polymer may be used alone or in combination of two or more kinds thereof.
- a content of the binder polymer in the photosensitive layer is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 30% by mass to 70% by mass, with respect to the total mass of the photosensitive layer, from a viewpoint of the photosensitivity and the hardness of the cured film.
- the photosensitive layer in the photosensitive transfer material according to the disclosure includes a radically polymerizable compound having an ethylenically unsaturated group (hereinafter, also simply referred to as an “ethylenically unsaturated compound”).
- the radically polymerizable compound having an ethylenically unsaturated group is a component that contributes to photosensitivity (that is, photocuring properties) of the photosensitive layer and the hardness of the cured film.
- the ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups.
- the photosensitive layer preferably includes a di- or higher functional ethylenically unsaturated compound as the ethylenically unsaturated compound.
- the di- or higher functional ethylenically unsaturated compound refers to a compound having two or more ethylenically unsaturated groups in one molecule.
- a (meth)acryloyl group is more preferable.
- a (meth)acrylate compound is preferable.
- the photosensitive layer particularly preferably include a difunctional ethylenically unsaturated compound (preferably a difunctional (meth)acrylate compound) and a tri- or higher functional ethylenically unsaturated compound (preferably a tri- or higher functional (meth)acrylate compound).
- a difunctional ethylenically unsaturated compound preferably a difunctional (meth)acrylate compound
- a tri- or higher functional ethylenically unsaturated compound preferably a tri- or higher functional (meth)acrylate compound
- the difunctional ethylenically unsaturated compound is not particularly limited and can be suitably selected from well-known compounds.
- difunctional ethylenically unsaturated compound examples include tricyclodecane dimethanol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate.
- difunctional ethylenically unsaturated compound examples include tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- A-DCP tricyclodecane dimethanol diacrylate
- DCP tricyclodecane dimethanol dimethacrylate
- A-NOD-N 1,9-nonanediol diacrylate
- A-HD-N manufactured by Shin-Nakamura Chemical Co., Ltd.
- the tri- or higher functional ethylenically unsaturated compound is not particularly limited and can be suitably selected from well-known compounds.
- Examples of the tri- or higher functional ethylenically unsaturated compound include dipentaerythritol (tri/tetra/penta/hexa) (meth)acrylate, pentaerythritol (tri/tetra) (meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and a (meth)acrylate compound of a glycerin tri(meth)acrylate skeleton.
- the “(tri/tetra/penta/hexa) (meth)acrylate” has a concept including tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate
- the “(tri/tetra) (meth)acrylate” has a concept including tri(meth)acrylate and tetra(meth)acrylate.
- Examples of the ethylenically unsaturated compound also include a caprolactone-modified compound of a (meth)acrylate compound (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., or the like), an alkylene oxide-modified compound of a (meth)acrylate compound (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Ltd., or the like), and ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.).
- KAYARAD registered trademark
- DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Naka
- urethane (meth)acrylate compound preferably tri- or higher functional urethane (meth)acrylate compound
- Examples of the tri- or higher functional urethane (meth)acrylate compound include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.).
- the ethylenically unsaturated compound preferably includes an ethylenically unsaturated compound having an acid group, from a viewpoint of improving developability.
- Examples of the acid group include a phosphoric acid group, a sulfonic acid group, and a carboxy group, and a carboxy group is preferable.
- FETA pentaerythritol tri- and tetra-acrylate
- DPHA dipentaerythritol penta- and hexa-acrylate
- the tri- or higher functional Ethylenically unsaturated compound including the acid group may be used in combination with the difunctional ethylenically unsaturated compound including the acid group, as necessary.
- the ethylenically unsaturated compound including the acid group at least one kind selected from the group consisting of di- or higher functional ethylenically unsaturated compound including carboxy group and a carboxylic acid anhydride thereof is preferable. This improves developability and hardness of the cured film.
- the di- or higher functional ethylenically unsaturated compound including a carboxy group is not particularly limited and can be suitably selected from well-known compounds.
- ARONIX registered trademark
- TO-2349 manufactured by Toagosei Co., Ltd.
- ARONIX M-520 manufactured by Toagosei Co., Ltd.
- ARONIX M-510 manufactured by Toagosei Co., Ltd.
- the ethylenically unsaturated compound including the acid group is also preferably a polymerizable compound including an acid group disclosed in paragraphs 0025 to 0030 of JP2004-239942A. The content of this publication is incorporated in this specification.
- a weight-average molecular weight (Mw) of the ethylenically unsaturated compound used in the disclosure is preferably 200 to 3,000, more preferably 250 to 2,600, even more preferably 280 to 2,200, and particularly preferably 300 to 2,200.
- a ratio of the content of the ethylenically unsaturated compound having a molecular weight of 300 or less, among all of the ethylenically unsaturated compound included in the photosensitive layer is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, with respect to all of the ethylenically unsaturated compounds included in the photosensitive layer.
- the ethylenically unsaturated compound may be used alone or in combination of two or more thereof.
- the content of the ethylenically unsaturated compound the photosensitive layer is preferably 1% by mass to 70% by mass, more preferably 5% by mass to 70% by mass, even more preferably 10% by mass to 70% by mass, particularly preferably 20% by mass to 60% by mass, and most preferably 20% by mass to 50% by mass, with respect to a total mass of the photosensitive layer.
- the content of the difunctional ethylenically unsaturated compound is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 85% by mass, and even more preferably 30% by mass to 80% by mass, with respect to all of the ethylenically unsaturated compounds included in the photosensitive layer.
- the content of the tri- or higher functional ethylenically unsaturated compound is preferably 10% by mass to 90% by mass, more preferably 15% by mass to 80% by mass, and even more preferably 20% by mass to 70% by mass, with respect to all of the ethylenically unsaturated compounds included in the photosensitive layer.
- the content of the di- or higher functional ethylenically unsaturated compound is preferably 40% by mass or more and less than 100% by mass, more preferably 40% by mass to 90% by mass, even more preferably 50% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass, with respect to a total content of the di functional ethylenically unsaturated compound and the tri- or higher functional ethylenically unsaturated compound.
- the photosensitive layer may further include a monofunctional ethylenically unsaturated compound.
- the di- or higher functional ethylenically unsaturated compound is preferably the main component in the ethylenically unsaturated compound contained in the photosensitive layer.
- the content of the di- or higher functional ethylenically unsaturated compound is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass with respect to a total content of the ethylenically unsaturated compound included in the photosensitive layer.
- the photosensitive layer includes the ethylenically unsaturated compound including an acid group (preferably, di- or higher functional ethylenically unsaturated compound including a carboxy group or a carboxylic acid anhydride thereof), the content of the ethylenically unsaturated compound including the acid group is preferably 1% by mass to 50% by mass, more preferably 1% by mass to 20% by mass, and even more preferably 1% by mass to 10% by mass, with respect to the photosensitive layer.
- the ethylenically unsaturated compound including the acid group is preferably 1% by mass to 50% by mass, more preferably 1% by mass to 20% by mass, and even more preferably 1% by mass to 10% by mass, with respect to the photosensitive layer.
- the photosensitive layer in the photosensitive transfer material according to the disclosure includes a photopolymerization initiator.
- the photopolymerization initiator is not particularly limited and a well-known photopolymerization initiator can be used.
- the photopolymerization initiator examples include a photopolymerization initiator having an oxime ester structure (hereinafter, also referred to as an “oxime-based photopolymerization initiator”), a photopolymerization initiator having an ⁇ -aminoalkylphenone structure (hereinafter, an “ ⁇ -aminoalkylphenone-based photopolymerization initiator”), a photopolymerization initiator having an ⁇ -hydroxyalkylphenone structure (hereinafter also referred to as an “ ⁇ -hydroxyalkylphenone-based photopolymerization initiator”), a photopolymerization initiator having an acylphosphine oxide structure.
- oxime-based photopolymerization initiator a photopolymerization initiator having an oxime ester structure
- ⁇ -aminoalkylphenone-based photopolymerization initiator a photopolymerization initiator having an ⁇ -aminoalkylphenone structure
- N-phenylglycine-based photopolymerization initiator acylphosphine oxide-based photopolymerization initiator
- N-phenylglycine-based photopolymerization initiator N-phenylglycine-based photopolymerization initiator
- the photopolymerization initiator preferably includes at least one kind selected from the group consisting of the oxime-based photopolymerization initiator, the ⁇ -aminoalkylphenone-based photopolymerization initiator, the ⁇ -hydroxyalkylphenone-based photopolymerization initiator, and the N-phenylglycine-based photopolymerization initiator, and more preferably includes at least one kind selected from the group consisting of the oxime-based photopolymerization initiator, the ⁇ -aminoalkylphenone-based photopolymerization initiator, and the N-phenylglycine-based photopolymerization initiator.
- photopolymerization initiator for example, polymerization initiators disclosed in paragraphs 0031 to 0042 of JP2011-095716A and paragraphs 0064 to 0081 of JP2015-014783A may be used.
- Examples of a commercially available product of the photopolymerization initiator include 1-[4-(phenylthio)-1,2-octanedione-2-(O-benzoyloxime) (product name: IRGACURE (registered trademark) OXE-01, manufactured by BASF Japan Ltd.), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (product name: IRGACURE OXE-02, manufactured by BASF Japan Ltd.), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (product name: IRGACURE 379EG, manufactured by BASF Japan Ltd.), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (product name: IRGACURE 907, manufactured by BASF Japan Ltd.), 2-hydroxy-1-
- the photopolymerization initiator may be used alone or in combination of two or more thereof.
- the content of the photopolymerization initiator in the photosensitive layer is not particularly limited and is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more with respect to a total mass of the photosensitive layer.
- the content of the photopolymerization initiator is preferably equal to or smaller than 10% by mass and more preferably equal to or smaller than 5% by mass, with respect to a total mass of the photosensitive layer.
- the photosensitive layer in the photosensitive transfer material according to the disclosure preferably further includes a blocked isocyanate compound, from a viewpoint of hardness after curing.
- the blocked isocyanate compound refers to a “compound having a structure in which the isocyanate group of isocyanate is protected (masked) with a blocking agent”.
- a dissociation temperature of the blocked isocyanate compound is preferably 100° C. to 160° C. and more preferably 130° C. to 150° C.
- the dissociation temperature of blocked isocyanate of the specification is a “temperature at an endothermic peak accompanied with a deprotection reaction of blocked isocyanate, in a case where the measurement is performed by differential scanning calorimetry (DSC) analysis using a differential scanning calorimeter (manufactured. by Seiko Instruments Inc., DSC6200)”.
- Examples of the blocking agent having a dissociation temperature at 100° C. to 160° C. include a pyrazole compound (3,5-dimethylpyrazole, 3-methylpyrazole, 4-bromo-3,5-dimethylpyrazole, or 4-nitro-3,5-dimethylpyrazole), an active methylene compound (diester malonate (dimethyl malonate, diethyl malonate, di n-butyl malonate, di-2-ethylhexyl malonate)), a triazole compound (1,2,4-triazole), and an oxime compound (compound having a structure represented by —C( ⁇ N—OH)— in a molecule such as formaldoxime, acetoaldoxime, acetoxime, methyl ethyl ketoxime, or cyclohexanone oxime).
- an oxime compound or a pyrazole compound is preferable, and an oxime compound is particularly
- the blocked isocyanate compound has an isocyanurate structure, from a viewpoint of improving brittleness of the film, improving the adhesion with a transfer target, and the like.
- the blocked isocyanate compound having an isocyanurate structure can be prepared, for example, by converting hexamethylene diisocyanate into isocyanurate and protecting it.
- blocked isocyanate compounds having an isocyanurate structure a compound having an oxime structure using an oxime compound as a blocking agent is preferable, since a dissociation temperature is easily set in a preferable range and the development residue is easily reduced, compared to a compound having no oxime structure.
- the blocked isocyanate compound used in the disclosure preferably has a radically polymerizable group, from a viewpoint of hardness after curing.
- the radically polymerizable group is not particularly limited, and well-known polymerizable groups can be used, and examples thereof include a (meth)acryloxy group, a (meth)acrylamide group, an ethylenically unsaturated group such as styryl group, and an epoxy group such as a glycidyl group.
- a (meth)acryloxy group is preferable, and a (meth)acryloxy group is more preferable, from viewpoints of surface shape of the surface of the cured film to be obtained, a development speed, and reactivity.
- blocked isocyanate compound used in the disclosure a commercially available blocked isocyanate compound can also be used. Examples thereof include Karenz AOI-BM, Karenz MOI-BM, Karenz, Karenz MOI-BP (all manufactured by Showa Denko K.K.), and a block type Duranate series (manufactured by Asahi Kasei Chemicals Corporation).
- a molecular weight of the blocked isocyanate compound used in the disclosure is preferably 200 to 3,000, more preferably 250 to 2,600, and particularly preferably 280 to 2,200.
- the blocked isocyanate compound may be used alone or in combination of two or more kinds thereof.
- a content of the blocked isocyanate compound is preferably 1% by mass to50% by mass, and more preferably 5% by mass to 30% by mass, with respect to the total mass of the photosensitive layer.
- the photosensitive layer may include a surfactant.
- surfactant for example, surfactants disclosed in paragraph 0017 of JP4502784B and paragraphs 0060 to 0071 of JP2009-237362A, well-known fluorine-based surfactants, and the like can be used.
- a fluorine-based surfactant is preferable.
- MEGAFACE registered trademark
- F551 manufactured by DIC Corporation
- a content of the surfactant is preferably 0.01% by mass to 3% by mass, more preferably 0.05% by mass to 1% by mass, and even more preferably 0.1% by mass to 0.8% by mass, with respect to the total mass of the photosensitive layer.
- the photosensitive layer may include at least one polymerization inhibitor.
- a thermal polymerization inhibitor (also referred to as a polymerization inhibitor) disclosed in paragraph 0018 of JP4502784B can be used.
- phenothiazine, phenoxazine, or 4-methoxyphenol can be preferably used.
- a content of the polymerization inhibitor is preferably 0.01% by mass to 3% by mass, more preferably 0.01% by mass to 1% by mass, and even more preferably 0.01% by mass to 0.8% by mass, with respect to the total mass of the photosensitive layer.
- the photosensitive layer preferably further includes a metal oxidation inhibitor.
- the metal oxidation inhibitor is preferably a compound having a heteroaromatic ring having a nitrogen atom.
- the compound having a heteroaromatic ring having a nitrogen atom may have a substituent.
- the heteroaromatic ring having a nitrogen atom is preferably an imidazole ring, a triazole ring, a tetrazole ring, a thiazole ring, a thiadiazole ring, or a fused ring of any one of these and another aromatic ring, and more preferably an imidazole ring, a triazole ring, a tetrazole ring, or a fused ring of any one of these and another aromatic ring.
- the “other aromatic ring” forming the fused ring may be a homocyclic ring or a heterocyclic ring, is preferably a homocyclic ring, more preferably a benzene ring or a naphthalene ring, and even more preferably a benzene ring.
- a content of the metal oxidation inhibitor is preferably 0.01% by mass to 20% by mass, more preferably 0.05% by mass to 10% by mass, and even more preferably 0.1% by mass to 5% by mass, with respect to the total mass of the photosensitive layer.
- the photosensitive layer preferably further includes a hydrogen donating compound.
- the hydrogen donating compound has a function of further improving sensitivity of the photopolymerization initiator to active light, or preventing inhibition of polymerization of the polymerizable compound by oxygen.
- Examples of such a hydrogen donating compound include amines, for example. M. R. Sander et al., “Journal of Polymer Society,” Vol. 10, page 3173 (1972), JP1969-020189B (JP-S-44-020189B), JP1976-082102A (JP-S-51-082102A), JP1977-134692A (JP-S-52-134692A), JP1984-138205A (JP-S-59-138205A), JP1985-084305A (JP-S-60-084305A), JP1987-018537A (JP-S-62-018537), JP1989-033104A (JP-S-64-033104A), and Research Disclosure 33825, and specific examples thereof include triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyldimethylaniline, and p-methylthiodimethylaniline.
- the hydrogen donating compound further include an amino acid compound (for example, N-phenylglycine or the like), an organic metal compound disclosed in JP1973-042965B (JP-S-48-042965B) (for example, tributyltin acetate, or the like), a hydrogen donor disclosed in JP1980-034414B (JP-S-55-034414B), and a sulfur compound disclosed in JP1994-308727A (JP-H-6-308727A) (for example, trithiane or the like).
- an amino acid compound for example, N-phenylglycine or the like
- JP-S-48-042965B for example, tributyltin acetate, or the like
- JP1980-034414B JP-S-55-034414B
- a sulfur compound disclosed in JP1994-308727A JP-H-6-308727A
- a content of the hydrogen donating compounds is preferably in a range of 0.1% by mass to 30% by mass, more preferably in a range of 0.1% by mass to 25% by mass, and even more preferably in a range of 0.5% by mass to 20% by mass, with respect to the total mass of the photosensitive layer, from a viewpoint of improving a curing speed with balance between a polymerization growth speed and chain transfer.
- the photosensitive layer may include a component other than the components described above.
- Examples of the other components include a thermal polymerization inhibitor disclosed in paragraph 0018 of JP4502784B, and other additives disclosed in paragraphs 0058 to 0071 of JP2000-310706A.
- the photosensitive layer may include at least one kind of particles (for example, metal oxide particles) as the other component, in order to adjust a refractive index or light transmittance.
- particles for example, metal oxide particles
- the metal of the metal oxide particles also includes semimetal such as B, Si, Ge, As, Sb, or Te.
- an average primary particle diameter of the particles is preferably 1 to 200 nm and more preferably 3 to 80 nm.
- the average primary particle diameter is calculated by measuring particle diameters of 200 random particles using an electron microscope and averaging the measured result. In a case where the shape of the particle is not a spherical shape, the longest side is set as the particle diameter.
- the content of the particles is preferably 0% by mass to 35% by mass, more preferably 0% by mass to 10% by mass, even more preferably 0% by mass to 5% by mass, still more preferably 0% by mass to 1% by mass, and particularly preferably 0% by mass (that is, the photosensitive layer includes no particles), with respect to a total mass of the photosensitive layer.
- the photosensitive layer may include a small amount of colorant (pigment, dye, and the like) as the other component, but it is preferable that a colorant is not substantially included, from a viewpoint of transparency.
- colorant pigment, dye, and the like
- a content of the colorant in the photosensitive layer is preferably smaller than 1% by mass and more preferably smaller than 0.1% by mass with respect to a total mass of the photosensitive layer.
- a thickness of the photosensitive layer is preferably 20 ⁇ m or less, more preferably 15 ⁇ m or less, and particularly preferably 12 ⁇ m or less.
- the thickness of the photosensitive layer is 20 ⁇ m or less, from viewpoints of reducing a thickness of the entire photosensitive transfer material, improving transmittance of the photosensitive layer or the cured film to be obtained, and preventing yellowing of the photosensitive layer or the cured film to be obtained.
- the thickness of the photosensitive layer is preferably 1 ⁇ m or more, more preferably 2 ⁇ m or more, and particularly preferably 3 ⁇ m or more.
- a refractive index of the photosensitive layer is preferably 1.47 to 1.56, more preferably 1.50 to 1.53, even more preferably 1.50 to 1.52, and particularly preferably 1.51 to 1.52.
- the “refractive index” indicates a refractive index at a wavelength of 550 nm.
- a method for forming the photosensitive layer is not particularly limited, and a well-known method can be used.
- a method forming the photosensitive layer by applying a photosensitive resin composition containing a solvent onto a temporary support and then drying, as necessary is used.
- the coating method a well-known method can be used, and examples thereof include a printing method, a spraying method, a roll coating method, a bar coating method, a curtain coating method, a spin coating method, and a die coating method (that is, slit coating method), and a die coating method is preferable.
- drying method a well-known method such as natural drying, heating drying, and drying under reduced pressure can be applied alone or in combination of plural thereof.
- At least one kind of solvent may be included, from a viewpoint of forming the photosensitive layer by coating.
- the solvent is preferably an organic solvent.
- organic solvent examples include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (another name: 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, caprolactam, n-propanol, and 2-propanol.
- the solvent used may include a mixed solvent which is a mixture of these compounds.
- a mixed solvent of methyl ethyl ketone and propylene glycol monomethyl ether acetate, a mixed solvent of methyl ethyl ketone, propylene glycol monomethyl ether acetate, and propylene glycol monomethyl ether, or a mixed solvent of diethylene glycol ethyl methyl ether and propylene glycol monomethyl ether acetate is preferably used.
- a content of solid contents of the photosensitive resin composition is preferably 5% by mass to 80% by mass, more preferably 5% by mass to 40% by mass, and particularly preferably 5% by mass to 30% by mass with respect to a total mass of the photosensitive resin composition.
- a surface tension (25° C.) of the photosensitive resin composition is preferably 5 mN/m to 100 mN/m, more preferably 10 mN/m to 80 mN/m, and particularly preferably 15 mN/m to 40 mN/m, from a viewpoint of coating properties.
- the surface tension is, for example, measured using Automatic Surface Tensiometer CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.).
- an organic solvent having a boiling point of 180° C. to 250° C. can also be used, as necessary.
- the photosensitive transfer material according to the disclosure includes a temporary support.
- the temporary support is preferably a film and more preferably a resin film.
- a film which has flexibility and does not generate significant deformation, shrinkage, or stretching under the pressure or under pressure and heating can be used.
- Examples of such a film include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, a polyimide film, and a polycarbonate film.
- a biaxial stretching polyethylene terephthalate film is particularly preferable.
- the film used as the temporary support does not have deformation such as wrinkles or scratches.
- a thickness of the temporary support is not particularly limited, and is, for example, preferably 5 ⁇ m to 200 ⁇ m, and is particularly preferably 10 ⁇ m to 150 ⁇ m, from viewpoints of ease of handling and general-purpose properties.
- the photosensitive transfer material according to the disclosure may further comprise a transparent resin layer on a side opposite to a side where the temporary support is present, when seen from the photosensitive layer (for example, see specific example of the photosensitive transfer material which will be described later).
- a refractive index adjusting layer is preferably used.
- the transparent electrode pattern is more hardly recognized (that is, concealing properties of the transparent electrode pattern are further improved).
- a phenomenon that the transparent electrode pattern is recognized, is generally referred to as “see-through”.
- JP2014-010814A and JP2014-108541A can be suitably referred to.
- the transparent resin layer is preferably disposed to be adjacent to the photosensitive layer.
- the refractive index of the transparent resin layer is preferably higher than the refractive index of the photosensitive layer, from a viewpoint of preventing the see-through.
- the refractive index of the transparent resin layer is preferably equal to or greater than 1.50, more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60.
- An upper limit of the refractive index of the transparent resin layer is not particularly limited, and is preferably equal to or smaller than 2.10, more preferably equal to or smaller than 1.85, even more preferably equal to or smaller than 1.78, and particularly preferably equal to or smaller than 1.74.
- the transparent resin layer may have photocuring properties (that is, photosensitivity), may have thermosetting properties, or may have both photocuring properties and thermosetting properties.
- the transparent resin layer preferably has photocuring properties.
- the transparent resin layer preferably has thermosetting properties.
- the transparent resin layer preferably has alkali solubility (for example, solubility with respect to weak alkali aqueous solution).
- the embodiment in which the transparent resin layer has photosensitivity has an advantage, from a viewpoint of collectively patterning the photosensitive layer and the transparent resin layer transferred onto the substrate by photolithography at one time, after the transferring.
- a film thickness of the transparent resin layer is preferably equal to or smaller than 500 nm, more preferably equal to or smaller than 110 nm, and particularly preferably equal to or smaller than 100 nm.
- the film thickness of the transparent resin layer is preferably equal to or greater than 20 nm, more preferably equal to or greater than 50 nm, even more preferably equal to or greater than 55 nm, and particularly preferably equal to or greater than 60 nm.
- the refractive index of the transparent resin layer is preferably adjusted in accordance with the refractive index of the transparent electrode pattern.
- the refractive index of the transparent resin layer is preferably equal to or greater than 1.60.
- An upper limit of the refractive index of the transparent resin layer in this case is not particularly limited, and is preferably equal to or smaller than 2.1, more preferably equal to or smaller than 1.85, even more preferably equal to or smaller than 1.78, and particularly preferably equal to or smaller than 1.74.
- the refractive index of the transparent electrode pattern is greater than 2.0, as in a case of the transparent electrode pattern formed of indium zinc oxide (IZO), for example, the refractive index of the transparent resin layer is preferably 1.70 to 1.85.
- a method for controlling the refractive index of the transparent resin layer is not particularly limited, and examples thereof include a method using a resin having a predetermined refractive index alone, a method using a resin and metal oxide particles and metal particles, and a method using a composite of metal salt and a resin.
- the transparent resin layer preferably includes at least one kind selected from the group consisting of inorganic particles having a refractive index equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60), a resin having a refractive index equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60), and a polymerizable monomer having a refractive index equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60).
- the refractive index of the transparent resin layer is easily adjusted to be equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60).
- the transparent resin layer preferably includes a binder polymer, an ethylenically unsaturated compound, and particles.
- components of the transparent resin layer components of a curable transparent resin layer disclosed in paragraphs 0019 to 0040 and 0144 to 0150 of JP2014-108541A, and components of a transparent layer disclosed in paragraphs 0024 to 0035 and 0110 to 0112 of JP2014-010814A, and components of a composition including ammonium salt disclosed in paragraphs 0034 to 0056 of WO20161009980 can be referred to.
- the transparent resin layer preferably includes at least one kind of a metal oxidation inhibitor.
- the transparent resin layer includes the metal oxidation inhibitor
- surface treatment can be performed with respect to a member (for example, conductive member formed on a substrate) in a direct contact with the transparent resin layer, in a case of transferring the transparent resin layer onto the substrate (that is, a target to be transferred).
- This surface treatment applies a metal oxide inhibition function (protection properties) with respect to the member in a direct contact with the transparent resin layer.
- Examples of the metal oxidation inhibitor include those mentioned above.
- the transparent resin layer of the disclosure may include a component other than the components described above.
- the other component which can be included in the transparent resin layer is the same as the other component which can be included in the photosensitive layer described above.
- the transparent resin layer preferably includes a surfactant as the other component.
- a forming method of the transparent resin layer is not particularly limited.
- a method of forming the layer by applying and, as necessary, drying a composition for forming a transparent resin layer of the embodiment including an aqueous solvent, on the photosensitive layer formed on the temporary support is used.
- Specific examples of the coating and drying method are respectively the same as the specific examples of the coating and drying in a case of forming the photosensitive layer.
- composition for forming the transparent resin layer can include each component of the transparent resin layer described above.
- the composition for forming the transparent resin layer for example, includes a binder polymer, an ethylenically unsaturated compound, particles, and an aqueous solvent.
- composition for forming the transparent resin layer a composition including ammonium salt disclosed in paragraphs 0034 to 0056 of WO2016/009980 is also preferable.
- the photosensitive transfer material according to the disclosure may further comprise a protective film on a side of the photosensitive layer opposite to the temporary support.
- the protective film is preferably disposed on a side opposite to the temporary support from the view of the transparent resin layer.
- Examples of the protective film include a polyethylene terephthalate film, a polypropylene film, a polystyrene film, and a polycarbonate film.
- a component disclosed in paragraphs 0083 to 0087 and 0093 of JP2006-259138A may be used, for example.
- the photosensitive transfer material according to the disclosure may further comprise a thermoplastic resin layer between a temporary support and a photosensitive layer.
- the photosensitive transfer material comprises the thermoplastic resin layer and the photosensitive transfer material is transferred to a substrate to form a laminate
- air bubbles are hardly generated on each element of the laminate.
- image unevenness is hardly generated and excellent display properties are obtained.
- thermoplastic resin layer preferably has alkali solubility.
- thermoplastic resin layer functions as a cushion material which absorbs ruggedness of the surface of the substrate at the time of transfer.
- the ruggedness of the surface of the substrate includes an image, an electrode, a wiring, and the like which are formed in advance.
- the thermoplastic resin layer preferably has properties capable of being deformed in accordance with ruggedness.
- the thermoplastic resin layer preferably includes an organic polymer substance disclosed in JP1993-072724A (JP-H5-072724A), and more preferably includes an organic polymer substance having a softening point approximately equal to or lower than 80° C. by a Vicat method (specifically, polymer softening point measurement method using an American Society for Testing and Materials ASTM D1235).
- a thickness of the thermoplastic resin layer is preferably 3 ⁇ m to 30 ⁇ m, more preferably 4 ⁇ m to 25 ⁇ m, and even more preferably 5 ⁇ m to 20 ⁇ m.
- the thickness of the thermoplastic resin layer is equal to or greater than 3 ⁇ m, followability with respect to the ruggedness of the surface of the substrate is improved, and accordingly, the ruggedness of the surface of the substrate can be effectively absorbed.
- thermoplastic resin layer In a case where the thickness of the thermoplastic resin layer is equal to or smaller than 30 ⁇ m, process suitability is further improved. For example, burden of the drying (solvent removal) in a case of applying and forming the thermoplastic resin layer on the temporary support is further reduced, and the development time of the thermoplastic resin layer after the transfer is shortened.
- the thermoplastic resin layer can be formed by applying and, as necessary, drying a composition for forming a thermoplastic resin layer including a solvent and a thermoplastic organic polymer on the temporary support.
- Specific examples of the coating and drying method are respectively the same as the specific examples of the coating and drying in a case of forming the photosensitive layer.
- the solvent is not particularly limited, as long as a polymer component forming the thermoplastic resin layer is dissolved, and examples thereof include organic solvents (for example, methyl ethyl ketone, cyclohexanone, propylene glycol monomethyl ether acetate, n-propanol, and 2-propanol).
- organic solvents for example, methyl ethyl ketone, cyclohexanone, propylene glycol monomethyl ether acetate, n-propanol, and 2-propanol.
- a viscosity of the thermoplastic resin layer measured at 100° C. is preferably 1,000 to 10,000 Pa ⁇ s.
- the viscosity of the thermoplastic resin layer measured at 100° C. is preferably lower than the viscosity of the photosensitive layer measured at 100° C.
- the photosensitive transfer material according to the disclosure may further comprise an interlayer between a temporary support and a photosensitive layer.
- the interlayer is preferably disposed between the thermoplastic resin layer and the photosensitive layer.
- a resin which is a mixture including polyvinyl alcohol, polyvinyl pyrrolidone, cellulose, or at least two kinds thereof.
- JP1993-072724A JP-H5-072724A
- separation layer a component disclosed in JP1993-072724A (JP-H5-072724A) as a “separation layer” can also be used.
- the interlayer can be, for example, formed by applying and, as necessary, drying a composition for forming an interlayer including a solvent which does not dissolve the thermoplastic resin layer, and the resin as the component of the interlayer.
- Specific examples of the coating and drying method are respectively the same as the specific examples of the coating and drying in a case of forming the photosensitive layer.
- the composition for forming a thermoplastic resin layer is applied and dried on the temporary support to form the thermoplastic resin layer.
- the composition for forming an interlayer is applied and dried on this thermoplastic resin layer to form the interlayer.
- the photosensitive resin composition of the embodiment including the organic solvent is applied and dried on the interlayer to form the photosensitive layer.
- the organic solvent in this case is preferably an organic solvent which does not dissolve the interlayer.
- FIG. 1 is a schematic cross sectional view showing a photosensitive transfer material 10 which is a specific example of the. photosensitive transfer material according to the disclosure.
- the photosensitive transfer material 10 has a laminated structure of “protective film 16 /transparent resin layer 20 A/photosensitive layer 18 A/temporary support 12 ” (that is, laminated structure in which a temporary support 12 , a photosensitive layer 18 A, a transparent resin layer 20 A, and a protective film 16 are arranged in this order).
- the photosensitive transfer material according to the disclosure is not limited to the photosensitive transfer material 10 , and the transparent resin layer 20 A and the protective film 16 may be omitted, for example.
- at least one of the thermoplastic resin layer or the interlayer described above may be comprised between the temporary support 12 and the photosensitive layer 18 A.
- the transparent resin layer 20 A is a layer disposed on a side of the photosensitive layer 18 A opposite to the side where the temporary support 12 is present, and a layer having a refractive index at a wavelength of 550 nm equal to or greater than 1.50.
- the photosensitive transfer material 10 is a negative type material (negative type film).
- a manufacturing method of the photosensitive transfer material 10 is not particularly limited.
- the manufacturing method of the photosensitive transfer material 10 includes a step of forming the photosensitive layer 18 A on the temporary support 12 , a step of forming the transparent resin layer 20 A on the photosensitive layer 18 A, and a step of forming the protective film 16 on the transparent resin layer 20 A in this order.
- the manufacturing method of the photosensitive transfer material 10 may include a step of volatilizing ammonia disclosed in a paragraph 0056 of WO2016/009980, between the step of forming the transparent resin layer 20 A and the step of forming the protective film 16 .
- An electrode protective film according to the disclosure is formed by curing the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to the disclosure.
- the electrode protective film according to the disclosure is preferably an electrode protective film of the capacitive input device and more preferably an electrode protective film for a touch panel.
- the laminate according to the disclosure described below includes the electrode protective film according to the disclosure.
- the laminate according to the disclosure includes the photosensitive layer after removing the temporary support from the photosensitive transfer material according to the disclosure on the substrate, in order from the substrate side.
- the photosensitive layer in the laminate may be a cured photosensitive layer (also referred to as a cured film).
- the capacitive input device includes the electrode protective film according to the disclosure or the laminate according to the disclosure.
- the substrate is preferably a substrate including. an electrode of the capacitive input device.
- the electrode of the capacitive input device may be a transparent electrode pattern or a leading wiring.
- the electrode of the capacitive input device is preferably an electrode pattern and more preferably a transparent electrode pattern.
- the laminate according to the disclosure includes a substrate, a transparent electrode pattern, a transparent resin layer disposed to be adjacent to the transparent electrode pattern, and a photosensitive layer disposed to be adjacent to the transparent resin layer, and a refractive index of the transparent resin layer is higher than a refractive index of the photosensitive layer.
- the refractive index of the transparent resin layer is preferably equal to or greater than 1.6.
- a glass substrate or a resin substrate is preferable.
- the substrate is preferably a transparent substrate and more preferably a transparent resin substrate.
- the meaning of the transparency is as described above.
- a refractive index of the substrate is preferably 1.50 to 1.52.
- tempered glass such as GORILLA GLASS (registered trademark) manufactured by Corning incorporated can be used.
- the resin substrate at least one of a component with no optical strains or a component having high transparency is preferably used, and a substrate formed of a resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), triacetyl cellulose (TAC), polyimide (PI), polybenzoxazole (PBO), or cycloolefin polymer (COP) is used, for example.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PC polycarbonate
- TAC triacetyl cellulose
- PI polyimide
- PBO polybenzoxazole
- COP cycloolefin polymer
- a material of the transparent substrate As a material of the transparent substrate, a material disclosed in JP2010-086684A, JP2010-152809A, and JP2010-257492A is preferably used.
- a touch panel is suitably used as the capacitive input device.
- a transparent electrode pattern disposed at least in an image display region of the touch panel is used.
- the electrode for a touch panel may extend from the image display region to a frame portion of the touch panel.
- the leading wiring (lead-out wiring) disposed on the frame portion of the touch panel is used, for example.
- the transparent electrode pattern and the leading wiring are electrically connected to each other by laminating a part of the leading wiring on a portion of the transparent electrode pattern extending to the frame portion of the touch panel, is suitable.
- a metal oxide film of indium tin oxide (ITO) and indium zinc oxide (IZO) is preferable.
- metal is preferable.
- the metal which is the material of the leading wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, and manganese, and alloy formed of two or more kinds of these metal elements.
- copper, molybdenum, aluminum, or titanium is preferable, copper is particularly preferable.
- the electrode protective film for a touch panel according to the disclosure is provided so as to cover the electrode and the like directly or through other layers, in order to protect the electrode and the like (that is, at least one of the electrode for a touch panel or the wiring for a touch panel).
- the preferred range of a thickness of the electrode protective film for a touch panel is the same as the preferred range of a thickness of the photosensitive layer described above.
- the electrode protective film according to the disclosure preferably the electrode protective film for a touch panel may include an opening.
- the opening can be formed by dissolving an unexposed portion of the photosensitive layer with a developer.
- the electrode protective film for touch panel is formed under the laminating condition at a high temperature using the photosensitive transfer material, the development residue of the opening of the electrode protective film for a touch panel is prevented.
- the touch panel may further comprise a first refractive index adjusting layer between the electrode and the like and the electrode protective layer for a touch panel (for example, see first specific example of the touch panel which will be described later).
- the preferred embodiment of the first refractive index adjusting layer is the same as the preferred embodiment of the transparent resin layer included in the photosensitive transfer material.
- the first refractive index adjusting layer may be formed by applying and drying a composition for forming the first refractive index adjusting layer, or may be formed by transferring the refractive index adjusting layer of the photosensitive transfer material comprising the refractive index adjusting layer.
- the touch panel of the embodiment comprising the first refractive index adjusting layer is preferably formed by transferring the photosensitive layer and the transparent resin layer of the photosensitive transfer material by using the photosensitive transfer material according to the disclosure of the embodiment comprising the transparent resin layer.
- the electrode protective layer for a touch panel is formed of the photosensitive layer of the photosensitive transfer material
- the first refractive index adjusting layer is formed of the transparent resin layer of the photosensitive transfer material.
- the touch panel or the substrate for a touch panel may comprise a second refractive index adjusting layer between the substrate and the electrode and the like (for example, see, first specific example of the touch panel which will be described later).
- the preferred embodiment of the second refractive index adjusting layer is the same as the preferred embodiment of the transparent resin layer included in the photosensitive transfer material.
- the embodiment in which the touch panel of the disclosure comprises the first refractive index adjusting layer (more preferably, embodiment of comprising the first refractive index adjusting layer and the second refractive index adjusting layer) has an advantage which the electrode and the like are hardly recognized (that is, so-called see-through is prevented).
- a structure of a capacitive input device disclosed in JP2014-010814A or JP2014-108541A may be referred to.
- FIG. 2 is a schematic cross sectional view of a touch panel 30 which is the first specific example of the touch panel according to the disclosure. More specifically, FIG. 2 is a schematic cross sectional view of an image display region of the touch panel 30 .
- the touch panel 30 has a structure in which a substrate 32 , a second refractive index adjusting layer 36 , a transparent electrode pattern 34 as the electrode for a touch panel, a first refractive index adjusting layer 20 , and an electrode protective film 18 for a touch panel are disposed in this order.
- the electrode protective film 18 for a touch panel and the first refractive index adjusting layer 20 cover the entire transparent electrode pattern 34 .
- the touch panel according to the disclosure is not limited to this embodiment.
- the electrode protective film 18 for a touch panel and the first refractive index adjusting layer 20 may cover at least a portion of the transparent electrode pattern 34 .
- the second refractive index adjusting layer 36 and the first refractive index adjusting layer 20 are preferably respectively continuously coated over a first region 40 in which the transparent electrode pattern 34 is present and a second region 42 in which the transparent electrode pattern 34 is not present directly or through another layer. Accordingly, the transparent electrode pattern 34 is more hardly recognized.
- the second refractive index adjusting layer 36 and the first refractive index adjusting layer 20 are preferably coated directly over both of the first region 40 and the second region 42 , rather than the coating through the other layer.
- the “other layer” include an insulating layer and an electrode pattern other than the transparent electrode pattern 34 .
- the first refractive index adjusting layer 20 is laminated over both of the first region 40 and the second region 42 .
- the first refractive index adjusting layer 20 is adjacent to the second refractive index adjusting layer 36 and is also adjacent to the transparent electrode pattern 34 .
- the first refractive index adjusting layer 20 is preferably laminated along the tapered shape (that is, at the same tilt as the taper angle).
- the ITO transparent electrode pattern is suitable.
- the transparent electrode pattern 34 can be, for example, formed by the following method.
- a thin film for an electrode (for example, ITO film) is formed on the substrate 32 on which the second refractive index adjusting layer 36 is formed by sputtering.
- an etching protective layer is formed. Then, this etching protective layer is patterned in a desired pattern shape by exposure and development. Next, a portion of the thin film for an electrode which is not covered with the patterned etching protective layer is removed by etching. Accordingly, the thin for an electrode is set to have a pattern having a desired shape (that is, transparent electrode pattern 34 ). Then, the patterned etching protective layer is removed by a peeling solution.
- the first refractive index adjusting layer 20 and the electrode protective film 18 for a touch panel are, for example, formed on the substrate 32 (that is, substrate for a touch panel) on which the second refractive index adjusting layer 36 and the transparent electrode pattern 34 are provided in order, as described below.
- the photosensitive transfer material 10 (that is, photosensitive transfer material 10 having a laminated structure of “protective film 16 /transparent resin layer 20 A/photosensitive layer 18 A/temporary support 12 ”) shown in FIG. 1 is prepared.
- the protective film 16 is removed from the photosensitive transfer material 10 .
- the photosensitive transfer material 10 from which the protective film 16 is removed, is laminated on the substrate 32 (that is, substrate for a touch panel) on which the second refractive index adjusting layer 36 and the transparent electrode pattern 34 are provided in order.
- the laminating is performed in a direction in which the transparent resin layer 20 A of the photosensitive transfer material 10 , from which the protective film 16 is removed, and the transparent electrode pattern 34 are in contact with each other.
- a laminate having a laminated structure of “temporary support 12 /photosensitive layer 18 A/transparent resin layer 20 A/transparent electrode pattern 34 /second refractive index adjusting layer 36 /substrate 32 ” is obtained.
- the photosensitive layer 18 A and the transparent resin layer 20 A are cured in a pattern shape.
- the curing of the photosensitive layer 18 A and the transparent resin layer 20 A in a pattern shape may be respectively individually performed by individual pattern exposure, but the curing is preferably performed at the same time by the pattern exposure at one time.
- the electrode protective film 18 for a touch panel which is a patterned cured product of the photosensitive layer 18 A (not shown regarding the pattern shape)
- the first refractive index adjusting layer 20 which is a patterned cured product of the transparent resin layer 20 A (not shown regarding the pattern shape) are respectively obtained.
- the development of the photosensitive layer 18 A and the transparent resin layer 20 A after the pattern exposure may be respectively individually performed by individual development, but the development is preferably performed at the same time by the development at one time.
- a structure of a capacitive input device disclosed in JP2014-010814A or JP2014-108541A may be referred to.
- FIG. 3 is a schematic cross sectional view of a touch panel 90 which is a second specific example of the touch panel according to the disclosure.
- the touch panel 90 includes an image display region 74 and an image non-display region 75 .
- the touch panel 90 comprises the electrode for a touch panel on both surfaces of the substrate 32 .
- the touch panel 90 comprises a first transparent electrode pattern 70 on one surface of the substrate 32 and comprises a second transparent electrode pattern 72 on the other surface thereof.
- a leading wiring 56 is connected to the first transparent electrode pattern 70 and the second transparent electrode pattern 72 , respectively.
- the leading wiring 56 is, for example, a copper wiring.
- the electrode protective film 18 for a touch panel is formed on one surface of the substrate 32 so as to cover the first transparent electrode pattern 70 and the leading wiring 56
- the electrode protective film 18 for a touch panel is formed on the other surface of the substrate 32 so as to cover the second transparent electrode pattern 72 and the leading wiring 56 .
- the first refractive index adjusting layer and the second refractive index adjusting layer of the first specific example may be provided on the one surface and the other surface of the substrate 32 , respectively.
- the method of manufacturing the touch panel according to the disclosure is not particularly limited, and the following manufacturing method is preferable.
- the preferred manufacturing method of the touch panel according to the disclosure includes
- a step for convenience is a step of preparing a substrate for a touch panel having a structure in which the electrode and the like (that is, at least one of the electrode for a touch panel or the wiring for a touch panel) are disposed on a substrate (hereinafter, also referred to as a “preparation step”),
- a step of forming a photosensitive layer on a surface of the substrate for a touch panel, on a side where the electrode and the like are disposed, using the photosensitive transfer material according to the disclosure (hereinafter, also referred to as a “photosensitive layer forming step”),
- a step of performing the pattern exposure with respect to the photosensitive layer formed on the surface of the substrate for a touch panel (hereinafter, also referred to as a “pattern exposure step”), and
- a step of developing the pattern-exposed photosensitive layer to obtain an electrode protective film for a touch panel which protects at least a part of the electrode or the like (hereinafter, also referred to as a “development step”).
- a touch panel comprising the electrode protective film for a touch panel having excellent bending resistance can be manufactured.
- the occurrence of the development residue is prevented in the unexposed portion of the photosensitive layer after the development.
- the preparation step is a step for convenience, and is a step of preparing a substrate for a touch panel having a structure in which the electrode and the like (that is, at least one of the electrode for a touch panel or the wiring for a touch panel) are disposed on a substrate.
- the preparation step may be a step of only simply preparing the substrate for a touch panel manufactured in advance, or may be a step of manufacturing the substrate for a touch panel.
- the preferable embodiment of the substrate for a touch panel is as described in the first specific example of the touch panel and the second specific example of the touch panel.
- the photosensitive layer forming step is a step of forming a photosensitive layer on a surface of the substrate for a touch panel, on a side where the electrode and the like are disposed, using the photosensitive transfer material according to the disclosure.
- the photosensitive layer is formed on the surface by laminating the photosensitive transfer material according to the disclosure on the surface of the substrate for a touch panel on a side on which the electrode and the like are disposed, and transferring the photosensitive layer of the photosensitive transfer material according to the disclosure on the surface.
- the laminating (transfer of the photosensitive layer) can be performed using a well-known laminator such as a vacuum laminator or an auto-cut laminator.
- the laminating condition a general condition can be applied.
- the laminating temperature is preferably 80° C. to 150° C., more preferably 90° C. to 150° C., and particularly preferably 100° C. to 150° C.
- the laminating temperature is a high temperature (for example, 120° C. to 150° C.)
- the occurrence of the development residue due to thermal fogging is prevented.
- the laminating temperature indicates a temperature of the rubber roller.
- a temperature of the substrate in, a case of laminating is not particularly limited.
- the temperature of the substrate at the time of laminating is 10° C. to 150° C., preferably 20° C. to 150° C., and more preferably 30° C. to 150° C.
- the temperature of the substrate at the time of laminating is preferably 10° C. to 80° C., more preferably 20° C. to 60° C., and particularly preferably 30° C. to 50° C.
- linear pressure at the time of laminating is preferably 0.5 N/cm to 20 N/cm, more preferably 1 N/cm to 10 N/cm, and particularly preferably 1 N/cm to 5 N/cm.
- a transportation speed (laminating speed) at the time of laminating is preferably 0.5 m/min to 5 m/min and more preferably 1.5 m/min to 3 m/min.
- the protective film is peeled off from the photosensitive transfer material to expose the photosensitive layer, the photosensitive transfer material and the substrate for a touch panel are bonded to each other so that the exposed photosensitive layer and the surface of the substrate for a touch panel on a side on which the electrode and the like are disposed are in contact with each other, and heating and pressurizing are performed.
- the photosensitive layer of the photosensitive transfer material is transferred onto the surface of the substrate for a touch panel on a side on which the electrode and the like are disposed, and a laminate having a laminated structure of “temporary support/thermoplastic resin layer/interlayer/photosensitive layer/electrode and the like/substrate” is formed.
- the portion of “electrode and the like/substrate” is the substrate for a touch panel.
- the temporary support is peeled off from the laminate, as necessary.
- the pattern exposure which will be described later can be also performed, by leaving the temporary support.
- the pattern exposure step is a step of performing the pattern exposure with respect to the photosensitive layer formed on the substrate for a touch panel.
- the pattern exposure indicates exposure of the embodiment of performing the exposure in a pattern shape, that is, the embodiment in which an exposed portion and an unexposed portion are present.
- the exposed portion of the photosensitive layer on the substrate for a touch panel in the pattern exposure is cured and finally becomes the cured film.
- the unexposed portion of the photosensitive layer on die substrate for a touch panel in the pattern exposure is not cured, and is removed (dissolved) with a developer in the subsequent development step.
- the opening of the cured film can be formed after the development step.
- the pattern exposure may be exposed through a mask or may be digital exposure using a laser or the like.
- a light source of the pattern exposure can be suitably selected, as long as it can emit light at a wavelength region (for example, 365 nm or 405 nm) at which the photosensitive layer can be cured.
- the light source include various lasers, a light emitting diode (LED), an ultra-high pressure mercury lamp, a high pressure mercury lamp, and a metal halide lamp.
- An exposure intensity is preferably 5 mJ/cm 2 to 200 mJ/cm 2 , and more preferably 10 mJ/cm 2 to 200 mJ/cm 2 .
- the pattern exposure may be performed after peeling the temporary support, or the temporary support may be peeled off after performing the exposure before peeling off the temporary support.
- the heat treatment (so-called post exposure bake (PEB)) may be performed with respect to the photosensitive layer after the pattern exposure and before the development.
- PEB post exposure bake
- the development step is a step of obtaining the electrode protective film for a touch panel which protects at least a portion of the electrode and the like, by developing the pattern-exposed photosensitive layer (that is, by dissolving the unexposed portion of the pattern exposure with a developer).
- a developer used in the development is not particularly limited, and a well-known developer such as a developer disclosed in JP1993-072724A (JP-H5-072724A) can be used.
- an alkali aqueous solution is preferably used.
- the pH of the alkali aqueous solution at 25° C. is preferably 8 to 13, more preferably 9 to 12, and particularly preferably 10 to 12.
- a content of the alkali compound in the alkali aqueous solution is preferably 0.1% by mass to 5% by mass and more preferably 0.1% by mass to 3% by mass with respect to a total mass of the alkali aqueous solution.
- the developer may include an organic solvent having miscibility with water.
- organic solvent examples include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, benzyl alcohol, acetone, methyl ethyl ketone, cyclohexanone, e-caprolactone, g-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, e-caprolactam, and N-methylpyrrolidone.
- a concentration of the organic solvent is preferably 0.1% by mass to 30% by mass.
- the developer may include a well-known surfactant.
- a concentration of the surfactant is preferably 0.01% by mass to 10% by mass.
- a liquid temperature of the developer is preferably 20° C. to 40° C.
- Examples of the development method include methods such as puddle development, shower development, shower and spin development, and dip development.
- the unexposed portion of the photosensitive layer is removed by spraying the developer to the photosensitive layer after the pattern exposure as a shower.
- the photosensitive transfer material comprising at least one of the photosensitive layer, the thermoplastic resin layer, or the interlayer
- an alkali solution having a low solubility of the photosensitive layer may be sprayed as a shower, and at least one of the thermoplastic resin layer or the interlayer (both layers, in a case where both layers are present) may be removed in advance.
- the development residue is preferably removed by spraying a cleaning agent with a shower and rubbing with a brush or the like.
- a liquid temperature of the developer is preferably 20° C. to 40° C.
- the development step may include a stage of performing the development, and a stage of performing the heat treatment (hereinafter, also referred to as “post baking”) with respect to the cured film obtained by the development.
- a temperature of the post baking is preferably 100° C. to 160° C. and more preferably 130° C. to 160° C.
- a resistance value of the transparent electrode pattern can also be adjusted by this post baking.
- the photosensitive layer includes a carboxy group-containing (meth)acrylic resin
- at least a part of the carboxy group-containing (meth)acrylic resin can be changed to carboxylic acid anhydride by the post baking. This improves developability and hardness of the cured film.
- the development step may include a stage of performing the development, and a stage of exposing the cured film obtained by the development (hereinafter, also referred to as “post exposure”).
- the post exposure and the post baking are preferably performed in this order.
- the preferred manufacturing method of the touch panel of the disclosure may include a step other than the steps described above.
- a step for example, washing step or the like
- a normal photolithography step can be applied without any particular limitations.
- the image display device comprises the capacitive input device according to the disclosure, preferably, the touch panel according to the disclosure (for example, touch panels of the first and second specific examples).
- a liquid crystal display device having a structure in which the touch panel according to the disclosure is overlapped on a well-known liquid crystal display element is preferable.
- the structure of the image display device comprising the touch panel for example, a structure disclosed in “The latest Touch Panel Technology” (published 6 Jul. 2009, Techno Times), “Technologies and Developments of Touch Panels” supervised by Yuji Mitani, CMC Publishing CO., LTD. (2004, 12), FPD International 2009 Forum T-11 lecture text book, Cypress Semiconductor Corporation application note AN 2292 can be applied.
- a weight-average molecular weight of a resin is a weight-average molecular weight obtained by performing polystyrene conversion of a value measured by gel permeation chromatography (GPC).
- the obtained photosensitive resin composition solution was applied an a temporary support having a thickness of 16 ⁇ m which is a polyethylene terephthalate film by using a slit-shaped nozzle, and accordingly, a photosensitive layer having a film thickness of 8 ⁇ m after drying was formed.
- a protective film (polyethylene phthalate film having a thickness of 16 ⁇ m) of the photosensitive layer was pressure-bonded on the photosensitive layer, and each photosensitive transfer material of Examples 1 to 39 and Comparative Examples 1 to 5 was manufactured.
- the obtained photosensitive transfer material was laminated on both surfaces of COSMO SHINE A4300 (thickness: 50 ⁇ m) of a polyethylene terephthalate film manufactured by Toyobo Co., Ltd., which was heated at 145° C. for 30 minutes, after peeling off the protective film, and a laminate A having a layer structure of temporary support/photosensitive layer having a thickness of 8 ⁇ m/COSMO SHINE A4300 (thickness: 50 ⁇ m)/photosensitive layer having a thickness of 8 ⁇ m/temporary support was formed.
- a laminating roll temperature was set as 110° C.
- a linear pressure was set as 3 N/cm
- a transportation speed was set as 2 m/min.
- both suffices were exposed through the temporary support using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) including an ultra-high pressure mercury lamp with an exposure intensity of 100 mJ/cm2 (i ray). After both surfaces of the temporary support were peeled off, exposure was further performed on both surfaces with an exposure intensity of 375 mJ/cm2 (i ray), and post baking was performed at 145° C. for 30 minutes to cure the photosensitive layer, thereby forming a cured film.
- a proximity type exposure machine manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.
- an ultra-high pressure mercury lamp with an exposure intensity of 100 mJ/cm2 (i ray)
- exposure was further performed on both surfaces with an exposure intensity of 375 mJ/cm2 (i ray)
- post baking was performed at 145° C. for 30 minutes to cure the photosensitive layer, thereby forming a cured film.
- the bending resistance was evaluated as follows using the sample for bending resistance evaluation.
- the sample for bending resistance evaluation described above was cut into a rectangle having a size of 5 cm ⁇ 12 cm. As shown in FIGS. 4 and 5 , the cut sample for bending resistance evaluation 102 was bonded to the upper and lower metal plates 106 with tape via two spacers A 104 having a height of 5 cm, and fixed in a U shape, and a 1 kg weight 108 was loaded on the upper metal plate.
- the sample for bending resistance evaluation 102 , the two spacers A 104 , and the two spacers B 110 are not directly visible in a case where viewed from the upper side in the direction of gravity, but are shown by dotted lines.
- the spacer A 104 was moved outside the metal plate 106 (direction of arrow in FIGS. 4 and 5 ) by hand at the same time, and accordingly, the metal plate 106 on the upper side was freely dropped onto the spacer B 110 (the state shown in FIG. 6 ).
- A has the most excellent bending resistance
- E has the worst bending resistance. Any one of A, B, and C is suitable for practical use, and A is most preferable.
- A The smallest gap at which cracks do not occur is 4 mm or less.
- the smallest gap at which cracks do not occur is greater than 4 mm and 5 mm or less.
- the smallest gap at which cracks do not occur is greater than 6 mm and 7 mm or less.
- the obtained photosensitive transfer material was cut into a size of 4.5 cm ⁇ 9 cm and laminated on glass having a size of 5 cm ⁇ 10 cm (EAGLE XG, manufactured by Corning Incorporated), after the protective film is peeled off, and a laminate having a layer structure of “temporary support/photosensitive layer having a thickness of 8 ⁇ m/glass” was formed.
- a laminating roll temperature was set as 110° C.
- a linear pressure was set as 3 N/cm
- a transportation speed was set as 2 m/min.
- the entire surface was exposed through the temporary support using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) including an ultra-high pressure mercury lamp with an exposure intensity of 100 MJ/cm 2 (i ray).
- a proximity type exposure machine manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.
- exposure was further performed with an exposure intensity of 375 mJ/cm2 (i ray), and post baking was performed at 145° C. for 30 minutes to cure the photosensitive layer, thereby forming a cured film.
- the hardness of the cured film was evaluated as follows using the sample for hardness evaluation.
- HM2000 type hardness tester manufactured by FISCHER Instruments
- an indentation test was performed under the conditions of Berkovich indenter (triangular pyramid indenter), load speed of 20.0 mN/min, and maximum load of 20.0 mN, and Martens hardness (HM) was obtained with the maximum indentation depth.
- any one of A, B, and C is suitable for practical use, and A is most preferable.
- Martens hardness is 190 N/mm 2 or more.
- Martens hardness is 160 N/mm 2 or more and less than 190 N/mm 2 .
- Martens hardness is 130 N/mm 2 or more and less than 160 N/mm 2 .
- Martens hardness is 100 N/mm 2 or more and less than 130 N/mm 2 .
- E Martens hardness is less than 100 N/mm 2 .
- the obtained photosensitive transfer material was cut into a rectangle having a size of 5 cm ⁇ 18 cm, and the protective film was peeled off.
- a polytetrafluoroethylene (PFA) film having a thickness of 500 ⁇ m was cut into a rectangle having a size of 10 cm ⁇ 15 cm and fixed on a horizontal surface.
- the PFA film and the photosensitive transfer material were laminated so that the PFA film and the surface of the cut photosensitive transfer material on which the photosensitive layer was formed were in contact with each other, and a weight of 70 g having a rectangular parallelepiped shape having a bottom having a size of 4 cm ⁇ 6 cm was loaded thereon.
- Force Gauge Stand manufactured by Shimpo the laminated photosensitive transfer material was pulled at a constant speed in a horizontal direction parallel to the long side of the photosensitive transfer film, and a friction force (unit: N) under the load of the weight was measured.
- tackiness index value The value obtained by dividing the friction three by 70 (hereinafter, also referred to as a “tackiness index value”) was set as an index of tackiness.
- any one of A, B, and C is suitable for practical use, and A is most preferable.
- the tackiness index value is less than 2.
- the tackiness index value is 2 or more and less than 4.
- the tackiness index value is 4 or more and less than 6.
- the tackiness index value is 6 or more and less than 10.
- E tackiness index value is 10 or more.
- the photosensitive transfer material of each example or comparative example was laminated on PTFE (tetrafluoroethylene resin) membrane filter FP-10-100 manufactured by Sumitomo Electric Industries, Ltd., after the protective film is peeled off, and a laminate A having a laminated structure of “temporary support/photosensitive layer having a thickness of 8 ⁇ m/membrane filter” was formed.
- a membrane filter temperature was set as 40° C.
- a laminating roll temperature was set as 110° C.
- a linear pressure was set as 3 N/cm
- a transportation speed was set as 2 m/min.
- the temporary support was peeled from the formed laminate A, and the transfer material, from which the protective film was peeled off, was laminated on the photosensitive layer in the same manner as above. This step of peeling off the temporary support and laminating the transfer material was further repeated 3 times to form a laminate B having a laminated structure of temporary support/photosensitive layer having a total film thickness of 40 ⁇ m/membrane filter.
- the measurement of the moisture permeability was performed by a cup method using the sample for measuring moisture permeability, with reference to JIS-Z-0208 (1976). Hereinafter, the details will be described.
- a circular sample having a diameter of 70 mm was cut from the sample for measuring moisture permeability.
- 20 g of dried calcium chloride was put in a measurement cup, and covered with the circular sample, and accordingly, a lid-attached measurement cup was prepared.
- This lid-attached measurement cup was left in a constant-temperature and constant-humidity tank for 24 hours under the condition of 65° C. with 90% RH.
- the water vapor transmission rate (WVTR) of the circular sample (unit: g/m 2 ⁇ day) was calculated from a change in mass of the lid-attached measurement cup before and after the leaving.
- the measurement described above was performed three times and an average value of the WVTRs in three times of the measurement was calculated.
- the water vapor transmission rate (WVTR) was evaluated based on the average value of the WVTR according to the evaluation standards. In the evaluation standard below, any of A, B, and C is preferable, A or B is more preferable, and A is most preferable.
- the WVTR of the circular sample having a laminated structure of “cured film/membrane filter” was measured as described above.
- the WVTR of the membrane filter is extremely higher than the WVTR of the cured film, and accordingly, in the measurement, the WVTR of the cured film is substantially measured.
- Average value of WVTR is 140 g/(m 2 ⁇ day) or more and less than 170 g/(m 2 ⁇ day)
- Average value of WVTR is 170 g/(m 2 ⁇ day) or more and less than 200 g/(m 2 ⁇ day)
- Average value of WVTR is 200 g/(m 2 ⁇ day) or more and less than 250 g/(m 2 ⁇ day)
- the photosensitive transfer materials of Examples 1 to 39 also have excellent hardness and moisture permeability after curing.
- the ratio of each constitutional unit in the compounds A-1 to A-3 is a mass ratio.
- Me represents a methyl group.
- MEGAFACE F551A fluorine-based surfactant, manufactured by DIC Corporation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Computer Networks & Wireless Communication (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
A photosensitive transfer material includes: a temporary support; and a photosensitive layer, in which the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and a value of a ratio MRS/MB of a total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content MB of the binder polymer with respect to the total mass of the photosensitive layer is 0.1 to 2.0.
Description
- This application is a Continuation of PCT international Application No. PCT/JP2019/006758 filed on Feb. 22, 2019, which claims priority under 35 U.S.C § 119(a) to Japanese Patent Application No. 2018-065445 filed on Mar. 29, 2018. Each of the above application(s) is hereby expressly incorporated by reference, in its entirety, into the present application.
- The present disclosure relates to a photosensitive transfer material, an electrode protective film, a laminate, a capacitive input device, and a manufacturing method of a touch panel.
- In recent years, in electronic devices such as a mobile phone, a car navigator, a personal computer, a ticket vending machine, or a terminal of the bank, a tablet type input device is disposed on a surface of a liquid crystal device or the like. There is provided a device to which information corresponding to an instruction image is input, by touching a portion, where the instruction image is displayed, with fingers or a touch pen, while referring to the instruction image displayed in an image display region of a liquid crystal device.
- The input device described above (hereinafter, may be referred to as a touch panel) may include a resistance film type input device, a capacitive input device, and the like. The capacitive input device is advantageous in that a transmittance conductive film may be simply formed on one sheet of substrate. In such a capacitive input device, there is provided a device in which electrode patterns are extended in directions intersecting each other, and which detects an input position by detecting a change of electrostatic capacity between electrodes, in a case where a finger or the like is touched.
- In order to protect electrode patterns or leading wirings (for example, metal wirings such as copper wires) put together on a frame portion of the capacitive input device, a transparent resin layer is provided on a side opposite to the surface for the inputting with a finger or the like.
- In a case using these capacitive input devices, in a case of visually recognizing a surface of a touch panel on a position slightly separated from a vicinity of a regular reflected portion of incident light from a light source, transparent electrode patterns present inside are visually recognized, and this may become an appearance defect. Accordingly, it is necessary to improve concealing properties of the transparent electrode patterns on the surface of a touch panel or the like.
- As a method for forming a pattern of a cured resin film using a photosensitive resin composition, a method disclosed in WO20131084872A is used.
- WO2013/084872A discloses a method for forming a pattern of a cured resin film, the method including: a first step of providing a photosensitive layer consisting of a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a thiol compound on a substrate; a second step of curing a predetermined portion of the photosensitive layer by emitting active light; and a third step of removing a portion of the photosensitive layer other than the predetermined portion, and forming a cured film pattern of the predetermined portion of the photosensitive layer, in which the photosensitive resin composition includes an oxime ester compound and/or a phosphine oxide compound as the photopolymerization
- In addition, examples of the photosensitive resin composition include those disclosed in JP2008-077067A and WO2015/072533A.
- JP2008-077067A discloses a photosensitive resin composition used in formation of a spacer for a liquid crystal display element, the photosensitive resin composition including: [A] a copolymer having a polymerized unit derived from an ethylenically unsaturated carboxylic acid and/or a polymerized unit derived from an ethylenically unsaturated carboxylic acid anhydride, [B] a polymerizable compound having an ethylenically unsaturated bond; [C] photopolymerization initiator, and [D] a thiol compound represented by Formulae (1) or (2):
- (In Formula (1), R1 is a methylene group or art alkylene group having 2 to 20 carbon atoms, R2 is a methylene group, or a linear or branched alkylene group having 2 to 6 carbon atoms, and in represents an integer of 1 to 20)
- (In Formula (2), R's are the same or different and a group represented by —H, —OH or Formula (2′).
- and R3 is a methylene group or a linear or branched alkylene group having 2 to 6 carbon atoms, where, at least one of the four R's is a group represented by the Formula (2′)).
- WO2015/072533A discloses a curable composition including: a polymerizable compound having an ethylenically unsaturated bond as a component A; a of initiator as a component B; B thiol compound as a component S; and an organic solvent as a component D, in which the component A includes a hexa- or higher functional urethane (meth)acrylate, a ratio of the hexa- or higher functional urethane (meth)acrylate in the component A is 70 to 100% by mass, and a content of the component S is 1 to 20% by mass with respect to a total solid content of the curable composition.
- An object to be achieved by an embodiment of the invention is to provide a photosensitive transfer material having low tackiness and excellent bending resistance after curing.
- Another object to be achieved by another embodiment of the invention is to provide an electrode protective film using the photosensitive transfer material, a laminate, a capacitive input device, and a manufacturing method of a touch panel.
- Methods for achieving the objects described above include the following aspects.
- <1> A photosensitive transfer material comprising: a temporary support; and a photosensitive layer, in which the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and value of a ratio MRS/MB of a total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content MB of the binder polymer with respect to the total mass of the photosensitive layer is 0.1 to 2.0.
- <2> The photosensitive transfer material according to <1>, in which the photosensitive layer further includes a blocked isocyanate compound.
- <3> The photosensitive transfer material according to <1> or <2>, in which the thiol compound is a di- or higher functional thiol compound.
- <4> The photosensitive transfer material according to <1> or <2>, in which the thiol compound includes a compound represented by Formula 1.
- In Formula 1, n represents an integer of 1 to 6, A represents an n-valent organic group having 1 to 15 carbon atoms or a group represented by Formula 2, and R1's each independently represent a divalent organic group having 1 to 15 carbon atoms, in a case where A represents a group represented by Formula 2, n represents 3.
- In Formula 2, R2 to R4 each independently represent a divalent organic group having 1 to 15 carbon atoms, and wavy line parts represent bonding positions to an oxygen atom adjacent to A in Formula 1.
- <5> The photosensitive transfer material according to any one of <1> to <4>, in which the value of a ratio MRS/MB is 0.4 to 1.2.
- <6> The photosensitive transfer material according to any one of <1> to <5>, in which the content of the thiol compound is 5% by mass to 40% by mass with respect to the total mass of the photosensitive layer.
- <7> The photosensitive transfer material according to any one of <1> to <6>, in which the binder polymer includes a resin having a constitutional unit having it radically polymerizable group.
- <8> The photosensitive transfer material according to <2>, in which the blocked isocyanate compound includes a radically polymerizable group.
- <9> The photosensitive transfer material according to any one of <1> to <8>, in which the photosensitive transfer material is for forming a protective film of a touch panel.
- <10> An electrode protective film formed by curing the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to any one of <1> to <9>.
- <11> A laminate comprising: the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to any one of <1> to <9>, on a substrate.
- <12> A capacitive input device comprising: the electrode protective film according to <10> or the laminate according to <11>.
- <13> A manufacturing method for a touch panel comprising: preparing a substrate for a touch panel having a structure in which at least one of an electrode for a touch panel or a wiring for a touch panel is disposed on a substrate; forming a photosensitive layer on a surface of the substrate for a touch panel on a side where at least one of the electrode for a touch panel or the wiring for a touch panel is disposed, using the photosensitive transfer material according to any one of <1> to <9>; performing pattern-exposing on the photosensitive layer formed on the substrate for a touch panel; and developing the pattern-exposed photosensitive layer to obtain a protective film for a touch panel which protects at least a part of at least one of the electrode for a touch panel or the wiring for a touch panel.
- According to one embodiment of the invention, it is possible to provide a photosensitive transfer material having low tackiness and excellent in bending resistance after curing.
- In addition, according to another embodiment of the invention, it is possible to provide an electrode protective film using the photosensitive transfer material, a laminate, a capacitive input device, and a manufacturing method of a touch panel.
-
FIG. 1 is a schematic cross sectional view showing an example of a photosensitive transfer material according to the disclosure. -
FIG. 2 is a schematic cross sectional view showing a first specific example of a touch panel according to the disclosure. -
FIG. 3 is a schematic cross sectional view showing a second specific example of the touch panel according to the disclosure. -
FIG. 4 is a schematic view showing a state before bending a sample for bendingresistance evaluation 102 at a height d in the bending resistance evaluation, in a view from a horizontal direction. -
FIG. 5 is a schematic view showing a state before bending a sample for bendingresistance evaluation 102 at a height d in the bending resistance evaluation, in a view from the upper side in a direction of gravity. -
FIG. 6 is a schematic view showing a state after bending a sample forbending resistance evaluation 102 at a height d in the bending resistance evaluation, in a view from a horizontal direction. - Hereinafter, the content of the disclosure will be described in detail. The configuration elements will be described below based on the representative embodiments of the disclosure, but the disclosure is not limited to such embodiments.
- In the disclosure, a term “to” showing a range of numerical values is used as a meaning including a lower limit value and an upper limit value disclosed before and after the term.
- In a range of numerical values described in stages in this specification, the upper limit value or the lower limit value described in one range of numerical values may be replaced with an upper limit value or a lower limit value of the range of numerical values described in other stages. In addition, in a range of numerical values described in this specification, the upper limit value or the lower limit value of the range of numerical values may be replaced with values shown in the examples.
- Regarding a term, group (atomic group) of this disclosure, a term with no description of “substituted” and “unsubstituted” includes both a group not including a substituent and a group including a substituent. For example, an “alkyl group” not only includes an alkyl group not including a substituent (unsubstituted alkyl group), but also an alkyl group including a substituent (substituted alkyl group).
- In addition, in the disclosure, “% by mass” is identical to “% by weight” and “part by mass” is identical to “part by weight”.
- Further, in the disclosure, a combination of two or mare preferable embodiments is the more preferable embodiments.
- In the disclosure, in a case where a plurality of substances corresponding to components are present in a composition, an amount of each component in the composition means a total amount of the plurality of substances present in the composition, unless otherwise noted.
- In the disclosure, a term “step” not only includes an independent step, but also includes a step, in a case where the step may not he distinguished from the other step, as long as the expected object of the step is achieved.
- In the disclosure, “(meth)acrylic acid” has a concept including both acrylic acid and a methacrylic acid, “(meth)acrylate” has a concept including both acrylate and methacrylate, and “(meth)acryloyl group” has a concept including both acryloyl group and methacryloyl group.
- A weight-average molecular weight (Mw) and a number average molecular weight (Mn) of the disclosure, unless otherwise noted, are detected by a gel permeation chromatography (GPC) analysis device using a column of TSKgel GMHxL, TSKgel G4000HxL, TSKgel G2000HxL (all product names manufactured by Tosoh Corporation), by using tetrahydrofuran (THF) as a solvent and a differential refractometer, and are molecular weights obtained by conversion using polystyrene as a standard substance.
- In the disclosure, a ratio of the constitutional unit in a resin represents a mass ratio unless otherwise noted.
- In the disclosure, the molecular weight, in a case where there is a molecular weight distribution, represents the weight-average molecular weight (Mw), unless otherwise noted.
- Hereinafter, the disclosure will be described in detail.
- (Photosensitive Transfer Material)
- A photosensitive transfer material according to the disclosure comprises: a temporary support; and a photosensitive layer, the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and a value of a ratio of a total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content MB of the binder polymer with respect to the total mass of the photosensitive layer, MRS/MB, is 0.1 to 2.0.
- The photosensitive transfer material according to the disclosure can be preferably used as a photosensitive transfer material for a touch panel, can be more preferably used as a photosensitive transfer material for forming a protective film in a touch panel, and can be particularly preferably used as a photosensitive transfer material for forming an electrode protective film in a touch panel.
- As a result of intensive studies, the inventors have found that it is possible to provide a photosensitive transfer material having low tackiness and excellent bending resistance after curing by using the above configuration.
- The mechanism of actions of the excellent effects by this is not clear, but is assumed as follows.
- In a case where the photosensitive layer includes 5% by mass or more of a thiol compound, the thiol compound reacts with a radically polymerizable compound having an ethylenically unsaturated group, a thioether bond is generated, flexibility of the obtained cured film is improved, and excellent bending resistance after curing is obtained. By setting the value of the ratio of a total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to the content MB of the binder polymer with respect to the total mass of the photosensitive layer, MRS/MB, as 0.1 to 2.0, it is possible to have hardness of the photosensitive layer and adhesiveness of the surface in suitable ranges and to decrease tackiness.
- <Photosensitive Layer>
- The photosensitive transfer material according to the disclosure includes a photosensitive layer, the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound; a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and a value of a ratio of a total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content MB of the binder polymer with respect to the total mass of the photosensitive layer, MRS/MB, is 0.1 to 2.0.
- «Thiol Compound»
- The photosensitive layer includes a thiol compound.
- The content of the thiol compound in the photosensitive layer is 5% by mass or more, and from a viewpoint of tackiness and bending resistance after curing, is preferably 5% by mass to 40% by mass, more preferably 5% by mass to 35% by mass, even more preferably 5.5% by mass to 30% by mass, and particularly preferably 6.5% by mass to 25% by mass, with respect to a total mass of the photosensitive layer.
- The thiol compounds may be used alone or in combination of two or more thereof.
- In addition, in the photosensitive layer, the value of the ratio of the total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to the content MB of the binder polymer with respect to the total mass of the photosensitive layer, MRS/MB is 0.1 to 2.0, and is preferably 0.2 to 1.8, more preferably 0.3 to 1.5, and particularly preferably 0.4 to 1.2, from a viewpoint of tackiness, and bending resistance and hardness after curing.
- As the thiol compound, a monofunctional thiol compound or a polyfunctional thiol compound is preferably used. Among them, from a viewpoint of hardness after curing, the thiol compound is preferably a di- or higher functional thiol compound (polyfunctional thiol compound) and more preferably a polyfunctional thiol compound.
- In the disclosure, the polyfunctional thiol compound refers to a compound having two or more mercapto groups (thiol groups) in a molecule. The polyfunctional thiol compound is preferably a low-molecular-weight compound having a molecular weight of 100 of more, and specifically, the molecular weight thereof is more preferably 100 to 1,500 and even more preferably 150 to 1,000.
- The number of functional groups of the polyfunctional thiol compound is preferably 2 to 10, more preferably 2 to 8, and even more preferably 2 to 6, from a viewpoint of hardness after curing.
- In addition, the polyfunctional thiol compound is preferably an aliphatic polyfunctional thiol compound, from viewpoints of tackiness and bending resistance and hardness after curing.
- Further, the thiol compound is more preferably a secondary thiol compound, from a viewpoint of storage stability of the photosensitive transfer material.
- Specific examples of the polyfunctional thiol compound include trimethylolpropane tris (3-mercaptobutyrate), 1,4-bis (3-mercaptobutyryloxy) butane, pentaerythritol tetrakis (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6 (1H,3H,5H)-trione, trimethylolethanetris (3-mercaptobutyrate), tris [(3-mercaptopropionyloxy) ethyl] isocyanurate, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), ethylene glycol bisthiopropionate, 1,2-benzenedithiol, 1,3-benzenedithiol, 1,2-ethanedithiol, 1,3-propanedithiol, 1,6-hexamethylenedithiol, 2,2′-(ethylenedithio) diethanethiol, meso-2,3-dimercaptosuccinic acid, p-xylylenedithiol, m-xylylenedithiol, and di(mercaptoethyl) ether.
- Among these, trimethylolpropane tris (3-mercaptobutyrate), 1,4-bis (3-mercaptobutyryloxy) butane, pentaerythritol tetrakis (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyryloxyethyl)-1,3,5-triazine-2,4,6 (1H,3H,5H)-trione, trimethylolethanetris (3-mercaptobutyrate), tris [(3-mercaptopropionyloxy) ethyl] isocyanurate, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), and dipentaerythritol hexakis (3-mercaptopropionate) are preferable.
- As the monofunctional thiol compound, both an aliphatic thiol compound and an aromatic thiol compound can be used.
- Specific examples of the monofunctional aliphatic thiol compound include 1-octanethiol, 1-dodecanethiol, β-mercaptopropionic acid, methyl-3-mercaptopropionate, 2-ethylhexyl-3-mercaptopropionate, n-octyl-3-mercaptopropionate, methoxybutyl-3-mercaptopropionate, and stearyl-3-mercaptopropionate.
- Examples of the monofunctional aromatic thiol compound include benzenethiol, toluenethiol, and xylenethiol.
- The thiol compound is preferably a thiol compound having an ester bond and more preferably includes a compound represented by Formula 1, from a viewpoint of tackiness, bending resistance and hardness after curing.
- In Formula 1, n represents an integer of 1 to 6, A represents an n-valent organic group having 1 to 15 carbon atoms or a group represented by Formula 2, and R1's each independently represent a divalent organic group having 1 to 15 carbon atoms.
- In Formula 2, R2 to R4 each independently represent a divalent organic group having 1 to 15 carbon atoms, and wavy line parts represent bonding positions to an oxygen atom adjacent to A in Formula 1. Here, in a case where A represents a group represented by Formula 2, n represents 3.
- From a viewpoint of hardness alter curing, n in Formula 1 is preferably an integer of 2 to 6.
- A in Formula 1 is preferably an n-valent aliphatic group having 1 to 15 carbon atoms or a group represented by Formula 2, more preferably an n-valent aliphatic group having 4 to 15 carbon atoms or a group represented by Formula 2, even more preferably an n-valent aliphatic group having 4 to 10 carbon atoms or a group represented by Formula 2, and particularly preferably a group represented by Formula 2, from a viewpoint of tackiness, and bending resistance and hardness after curing.
- In addition, A in Formula 1 is preferably an n-valent group consisting of a hydrogen atom and a carbon atom or an n-valent group consisting of a hydrogen atom, a carbon atom, and an oxygen atom, more preferably an n-valent group consisting of a hydrogen atom and a carbon atom, and particularly preferably an n-valent aliphatic hydrocarbon group, from a viewpoint of tackiness, bending resistance, and hardness, and moisture permeability after curing.
- R1's in Formula 1 are each independently preferably an alkylene group has 1 to 15 carbon atoms, more preferably an alkylene group having 2 to 4 carbon atoms, even more preferably an alkylene group having 3 carbon atoms, and particularly preferably a 1,2-propylene group, from a viewpoint of tackiness, bending resistance and hardness after curing. The alkylene group may be linear or branched.
- R2 to R4 in Formula 2 are each independently preferably an aliphatic group having 2 to 15 carbon atoms, more preferably an alkylene group liming 2 to 15 carbon atoms or a polyalkyleneoxyalkyl group having 3 to 15 carbon atoms, even more preferably an alkylene group having 2 to 15 carbon atoms, and particularly preferably an ethylene group, from a viewpoints of tackiness, and bending resistance and hardness after curing.
- In addition, as the polyfunctional thiol compound, a compound having two or more groups represented by Formula S-1 is preferable.
- In Formula S-1, R1S represents a hydrogen atom or an alkyl group, A1S represents —CO— or —CH2—, and wavy line parts represent bonding positions to another structure.
- The polyfunctional thiol compound is preferably at compound having 2 to 6 groups represented by Formula S-1.
- The alkyl group of R1S in Formula S-1 is a linear, branched, or cyclic alkyl group, and a range of the number of carbon atoms is preferably 1 to 16 and more preferably 1 to 10. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, an s-butyl group, a t-butyl group, a pentyl group, a hexyl group, and a 2-ethylhexyl group, and a methyl group, an ethyl group, a propyl group, or an isopropyl group is preferable.
- As R1S, a hydrogen atom, a methyl group, an ethyl group, a propyl group, or an isopropyl group is particularly preferable, and a methyl group or an ethyl group is most preferable.
- In addition, the polyfunctional thiol compound is particularly preferably a compound represented by Formula S-2 having a plurality of groups represented by Formula S-1.
- In Formula S-2, R1S's each independently represent a hydrogen atom or an alkyl group, A1S's each independently represent —CO— or —CH2—, LIS represents an nS-valent linking group, and nS represents an integer of 2 to 8. From a viewpoint of synthesis, it is preferable that all R1S's have the same group, and that all A1S's have the same group.
- R1S in Formula S-2 is same as R1S in Formula S-1 and the preferred range is also the same. nS is preferably an integer of 2 to 6.
- Examples of L1S, which is an nS-valent linking group in Formula S-2, include a divalent linking group such as —(CH2)mS— (mS represents an integer of 2 to 6) or —(CH2)mS{(CH2)mSO}mT(CH2)mS— (mS and mT each independently represent an integer of 2 to 6), a trivalent linking group such as a trimethylolpropane residue or isocyanuric ring having three of —(CH2)pS— (pS represents an integer of 2 to 6), a tetravalent linking group such as a pentaerythritol residue, and a pentavalent or hexavalent linking group such as a dipentaerythritol residue.
- Specific examples of the thiol compound preferably include the following compounds, but are not limited thereto.
- «Binder Polymer»
- The photosensitive layer in the photosensitive transfer material according to the disclosure includes a binder polymer.
- The binder polymer is preferably an alkali soluble resin.
- An acid value of the binder polymer is not particularly limited, but from a viewpoint of developability, the binder polymer is preferably a binder polymer having an acid value of 60 mgKOH/g or more, more preferably an alkali soluble resin having an acid value of 60 mgKOH/g or more, and particularly preferably a carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more.
- It is assumed that the binder polymer having an acid value can be thermally crosslinked with a compound capable of reacting with an acid by heating to increase a three-dimensional crosslink density. In addition, it is assumed that a carboxyl group of the carboxyl group-containing (meth)acrylic resin is dehydrated and made hydrophobic to contribute to improvement of wet heat resistance.
- The carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more (hereinafter, may be referred to as a specific polymer A) is not particularly limited, as long as the acid value condition is satisfied, and a resin can be selected and used from well-known resins.
- For example, a binder polymer which is a carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more among polymers disclosed in paragraph 0025 of JP2011-095716A, a carboxyl group-containing (meth)acrylic resin having an acid value of 60 mgKOH/g or more among polymers disclosed in paragraphs 0033 to 0052 of JP2010-237589A, and the like can be preferably used as the specific polymer A in the embodiment.
- Here, the (meth)acrylic resin indicates to a resin containing at least one of a constitutional unit derived from (meth)acrylic acid or a constitutional unit derived from a (meth)acrylic acid ester.
- A total ratio of the constitutional unit derived from (meth)acrylic acid and the constitutional unit derived from (meth)acrylic acid ester in the (meth)acrylic resin is preferably 30 mol % or more and inure preferably 50 mol % or more.
- A range of a copolymerization ratio of the monomer having a carboxyl group in the specific polymer A is preferably 5% by mass to 50% by mass, more preferably 5% by mass to 40% by mass, and even more preferably 10% by mass to 30% by mass, with respect to a total mass of the specific polymer A.
- The specific polymer A may have a reactive group, and as a method for introducing the reactive group into the specific polymer A, a method for causing a reaction of an epoxy compound, blocked isocyanate, isocyanate, a vinyl sulfone compound, an aldehyde compound, a methylol compound, a carboxylic acid anhydride, or the like with a hydroxyl group, a carboxyl group, a primary amino group, a secondary amino group, an acetoacetyl group, sulfonic acid, or the like is used.
- Among these, the reactive group is preferably a radically polymerizable group, more preferably an ethylenically unsaturated group, and particularly preferably a (meth)acryloxy group.
- In addition, the binder polymer, particularly the specific polymer A, preferably has a constitutional unit haying an aromatic ring, from a viewpoint of moisture permeability and hardness after curing.
- Examples of a monomer forming the constitutional unit having an aromatic ring include styrene, tert-butoxystyrene, methylstyrene, styrene, and benzyl (meth)acrylate.
- As the constitutional unit having an aromatic ring, it is preferable to contain at least one constitutional unit represented by Formula P-2 which will be described later. The constitutional unit having an aromatic ring is preferably a constitutional unit derived from a styrene compound.
- In a case where the binder polymer includes a constitutional unit having an aromatic ring, a content ratio of the constitutional unit having an aromatic ring is preferably 5% by mass to 90% by mass, and more preferably 10% by mass to 70% by mass, even more preferably 20% by mass to 50% by mass, with respect to a total mass of the binder polymer.
- In addition, the binder polymer, particularly the specific polymer A, preferably has a constitutional unit having an alicyclic skeleton, from a viewpoint of tackiness and hardness after curing.
- Specific examples of the monomer forming the constitutional unit having an alicyclic skeleton include dicyclopentanyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate.
- Preferred examples of the aliphatic ring included in the constitutional unit having an alicyclic skeleton include a dicyclopentane ring, a cyclohexane ring, an isoborone ring, and a tricyclodecane ring. Among these, a tricyclodecane ring is particularly preferable.
- In a case where the binder polymer includes a constitutional unit having an alicyclic skeleton, a ratio of the constitutional unit having an acyclic skeleton is preferably 5% by mass to 90% by mass, more preferably 10% by mass to 80% by mass, and even more preferably 20% by mass to 70% by mass, with respect to a total mass of the binder polymer.
- In addition, the binder polymer, particularly the specific polymer A, preferably has a constitutional unit baying a radically polymerizable group and more preferably has a constitutional unit having an ethylenically unsaturated group, from a viewpoint of tackiness and hardness after curing.
- The ethylenically unsaturated group is preferably a (meth)acryl group and more preferably a (meth)acryloxy group.
- In a case where the binder polymer includes a constitutional unit having an ethylenically unsaturated group, a ratio of the constitutional unit having an ethylenically unsaturated group is preferably 5% by mass to 70% by mass, and more preferably 10% by mass to 50% by mass, even more preferably 20% by mass to 40% by mass, with respect to a total mass of the binder polymer.
- The specific polymer A is preferably a compound A-1 or a compound A-2 shown below and more preferably the compound A-1. A ratio of each constitutional unit shown below can be suitably changed depending on the purpose.
- The ratio of each constitutional unit in he compounds A-1 and A-2 is a mass ratio. Me represents a methyl group.
- The acid value of the binder polymer used in the disclosure is preferably 60 mgKOH/g to 200 mgKOH/g, more preferably 60 mgKOH/g to 150 mgKOH/g, and even more preferably 60 mgKOH/g to 110 mgKOH/g.
- In the specification, the acid value refers to a value measured according to the method disclosed in JIS K0070 (1992).
- Since the binder polymer includes a binder polymer having an acid value of 60 mgKOH/g or more, it is possible to increase interlaminar adhesion between the photosensitive layer and a transparent resin layer which will be described later, in addition to the above-mentioned advantages, because the transparent resin layer includes a (meth)acrylic resin having an acid group.
- A weight-average molecular weight of the specific polymer A is preferably 10,000 or more and more preferably 20,000 to 100,000.
- In addition, as the binder polymer, any film-forming resin can be suitably selected and used according to the purpose, in addition to the specific polymer. From a viewpoint of using the photosensitive transfer material as the electrode protective film of the electrostatic capacitive input device, a film having good surface hardness and heat resistance is preferable, an alkali soluble resin is more preferable, and among the alkali soluble resins, a well-known photosensitive siloxane resin material can be preferably used.
- The binder polymer used in the disclosure preferably includes a polymer containing a constitutional unit having a carboxylic acid anhydride structure (hereinafter, also referred to as a specific polymer B). By including the specific polymer B, the developability and the hardness after curing are more excellent.
- The carboxylic acid anhydride structure may be either a chain carboxylic acid anhydride structure or a cyclic carboxylic acid anhydride structure, and is preferably a cyclic carboxylic acid anhydride structure.
- The ring of the cyclic carboxylic acid anhydride structure is preferably a 5- to 7-membered ring, more preferably a 5-membered ring or a 6-membered ring, and even more preferably a 5-membered ring.
- In addition, the cyclic carboxylic acid anhydride structure may be condensed or bonded with another ring structure to form a polycyclic structure, but preferably does not form a polycyclic structure.
- In a case where another ring structure is condensed or bonded to the cyclic carboxylic acid anhydride structure to form a polycyclic structure, the polycyclic structure is preferably a bicyclo structure or a spiro structure.
- In the polycyclic structure, the number of other ring structures condensed or bonded to the cyclic carboxylic acid anhydride structure is preferably 1 to 5, and more preferably 1 to 3.
- Examples of the other ring structure include a cyclic hydrocarbon group having 3 to 20 carbon atoms and a heterocyclic group having 3 to 20 carbon atoms.
- The heterocyclic group is not particularly limited, and examples thereof include an aliphatic heterocyclic group and an aromatic heterocyclic group.
- In addition, the heterocyclic group is preferably a 5-membered ring or a 6-membered ring, and particularly preferably a 5-membered ring.
- Further, as the heterocyclic group, a heterocyclic group containing at least one oxygen atom (for example, an oxolane ring, an oxane ring, or a dioxane ring) is preferable.
- The constitutional unit having a carboxylic acid anhydride structure is preferably a constitutional unit containing a divalent group obtained by removing two hydrogen atoms from a compound represented by Formula P-1 in a main chain, or a constitutional unit in which a monovalent group obtained by removing one hydrogen atom from a compound represented by Formula P-1 is bonded to the main chain directly or via a divalent linking group.
- In Formula P-1, RA1a represents a substituent and n1a RA1a's may be the same of different.
- Z1a represents a divalent group forming a ring containing —C(═O)—O—C(═O)—. n1a represents an integer of 0 or more.
- As a substituent represented by RA1a, the same substituent as the substituent which may be included in the carboxylic acid anhydride structure may be used, and the preferable range is also the same.
- Z1a is preferably an alkylene group having 2 to 4 carbon atoms, more preferably an alkylene group having 2 or 3 carbon atoms, and particularly preferably an alkylene group having 2 carbon atoms.
- In addition, the partial structure represented by Formula P-1 may be condensed or bonded with another ring structure to form a polycyclic structure, but preferably does not form a polycyclic structure.
- As the other ring structure here, the same ring structure as the other ring structure described above which may be condensed or bonded to the carboxylic acid anhydride structure may be used, and the preferable range is also the same.
- n1a represents an integer of 0 or more.
- In a case where Z1a represents an alkylene group having 2 to 4 carbon atoms, n1a is preferably an integer of 0 to 4, more preferably an integer of 0 to 2, and even more preferably 0.
- In a case where n1a represents an integer of 2 or more, a plurality of RA1a's existing may be the same or different. In addition, the plurality of RA1a's existing may be bonded to each other to form a ring, but it is preferable that they are not bonded to each other to form a ring.
- The constitutional unit having a carboxylic acid anhydride structure is preferably a constitutional unit derived from an unsaturated carboxylic acid anhydride, more preferably a constitutional unit derived from an unsaturated cyclic carboxylic acid anhydride, even more preferably a constitutional unit derived from an unsaturated alicyclic carboxylic acid anhydride, still preferably a constitutional unit derived from maleic anhydride or itaconic anhydride, and particularly preferably a constitutional unit derived from maleic anhydride.
- Hereinafter, specific examples of the constitutional unit having a carboxylic acid anhydride structure will be described, but the constitutional unit having a carboxylic acid anhydride structure is not limited to these specific examples.
- In the following constitutional units, Rx represents a hydrogen atom, a methyl group, a CH2OH group, or a CF3 group, and Me represents a methyl group.
- The constitutional unit having a carboxylic acid anhydride structure is preferably at least one of the constitutional units represented by any of Formulae a2-1 to a2-21, and more preferably one of the constitutional units represented by any of Formulae a2-1 to a2-21.
- The constitutional unit having a carboxylic acid anhydride structure preferably has at least one of the constitutional unit represented by Formula a2-1 or the constitutional unit represented by Formula a2-2, and more preferably the constitutional unit represented by Formula a2-1, from a viewpoint of improving sweat resistance of the cured film and reducing the development residue in a case where the photosensitive transfer material is obtained.
- A ratio of constitutional unit having a carboxylic acid anhydride structure in the specific polymer B (in the case of two or more kinds, total ratio thereof. The same applies hereinafter) is more than 0 mol %, preferably 60 mol % or more, more preferably 5 mol % to 40 mol %, and even more preferably 10 mol % to 35 mol %, with respect to a total amount of the specific polymer B.
- In the disclosure, in a case where the ratio of the “constitutional unit” is defined by a molar ratio, the “constitutional unit” is synonymous with the “monomer unit”. In addition, in the disclosure, the “monomer unit” may be modified after polymerization by a polymer reaction or the like. The same applies to the followings.
- As the specific polymer B, it is preferable to contain at least one constitutional unit represented by Formula P-2. This further improves hydrophobicity and hardness of the cured film that is formed.
- In Formula P-2, RP1 represents a hydroxyl group, an alkyl group, an aryl group, an alkoxy group, a carboxy group, or a halogen atom, RP2 represents a hydrogen atom, an alkyl group, or an aryl group, and nP represents an integer of 0 to 5. In a case where nP is an integer of 2 or more, two or more existing RP1's may be the same or different.
- RP1 is preferably an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a carboxy group, an F atom, a Cl atom, a Br atom, or an I atom, and more preferably an alkyl group having 1 to 4 carbon atoms, a phenyl group, an alkoxy group having 1 to 4 carbon atoms, a Cl atom, or a Br atom.
- RP2 is preferably a hydrogen atom, an alkyl group having1 to 10 carbon atoms, or an aryl group having 6 to 12 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, even more preferably a hydrogen atom, a methyl group, or an ethyl group, and particularly preferably a hydrogen atom.
- nP is preferably an integer of 0 to 3, more preferably 0 or 1, and further preferably 0.
- A constitutional unit represented by formula P-2 is preferably a constitutional unit derived from a styrene compound.
- Examples of the styrene compound include styrene, p-methylstyrene, α-methylstyrene, α, p-dimethylstyrene, p-ethylstyrene, p-t-butylstyrene, and 1,1-diphenylethylene, styrene or α-methylstyrene is preferable, and styrene is particularly preferable.
- The styrene compound for forming the constitutional unit represented by Formula P-2 may be only one or two or more kinds thereof.
- In a case where the specific polymer B includes the constitutional unit represented by Formula P-2, a ratio of the constitutional units represented by Formula P-2 in the specific polymer B (in the case of two or more kinds, total ratio thereof. The same applies hereinafter) is preferably 5 mol % to 90 mol %, more preferably 30 mol % to 90 mol %, and even more preferably 40 mol % to 90 mol %, with respect to the total amount of the specific polymer B.
- The specific polymer B may include at least one constitutional unit other than the constitutional unit having a carboxylic acid anhydride structure and the constitutional unit represented by Formula P-2.
- The other constitutional unit preferably does not contain an acid group.
- The other constitutional unit is not particularly limited, and a constitutional unit derived from a monofunctional ethylenically unsaturated compound is used.
- As the monofunctional ethylenically unsaturated compound, well-known compounds can be used without particular limitation, and examples thereof include a (meth)acrylic acid derivative such as methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, carbitol (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, or epoxy (meth)acrylate; an N-vinyl compound such as N-vinylpyrrolidone or N-vinylcaprolactam; and a derivative of an allyl compound such as allyl glycidyl ether.
- A ratio of the other constitutional units in the specific polymer B (in the case of two or more kinds, total ratio thereof) is preferably 10 mol % or more and less than 100 mol %, and more preferably 50 mol % or more and less than 100% by mass, with respect to the total amount of the specific polymer B.
- A weight-average molecular weight of the binder polymer is not particularly limited, and is preferably more than 3,000, more preferably more than 3,000 and 60,000 or more, and even more preferably 5,000 to 50,000.
- The binder polymer may be used alone or in combination of two or more kinds thereof.
- A content of the binder polymer in the photosensitive layer is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 80% by mass, and even more preferably 30% by mass to 70% by mass, with respect to the total mass of the photosensitive layer, from a viewpoint of the photosensitivity and the hardness of the cured film.
- «Radically Polymerizable Compound Having Ethylenically Unsaturated Group»
- The photosensitive layer in the photosensitive transfer material according to the disclosure includes a radically polymerizable compound having an ethylenically unsaturated group (hereinafter, also simply referred to as an “ethylenically unsaturated compound”).
- The radically polymerizable compound having an ethylenically unsaturated group is a component that contributes to photosensitivity (that is, photocuring properties) of the photosensitive layer and the hardness of the cured film.
- The ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups.
- The photosensitive layer preferably includes a di- or higher functional ethylenically unsaturated compound as the ethylenically unsaturated compound.
- Here, the di- or higher functional ethylenically unsaturated compound refers to a compound having two or more ethylenically unsaturated groups in one molecule.
- As the ethylenically unsaturated group, a (meth)acryloyl group is more preferable.
- As the ethylenically unsaturated compound, a (meth)acrylate compound is preferable.
- From a viewpoint of curability after curing, the photosensitive layer particularly preferably include a difunctional ethylenically unsaturated compound (preferably a difunctional (meth)acrylate compound) and a tri- or higher functional ethylenically unsaturated compound (preferably a tri- or higher functional (meth)acrylate compound).
- The difunctional ethylenically unsaturated compound is not particularly limited and can be suitably selected from well-known compounds.
- Examples of the difunctional ethylenically unsaturated compound include tricyclodecane dimethanol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate.
- Specific examples of the difunctional ethylenically unsaturated compound include tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- The tri- or higher functional ethylenically unsaturated compound is not particularly limited and can be suitably selected from well-known compounds.
- Examples of the tri- or higher functional ethylenically unsaturated compound include dipentaerythritol (tri/tetra/penta/hexa) (meth)acrylate, pentaerythritol (tri/tetra) (meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, and a (meth)acrylate compound of a glycerin tri(meth)acrylate skeleton.
- Here, the “(tri/tetra/penta/hexa) (meth)acrylate” has a concept including tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate, and the “(tri/tetra) (meth)acrylate” has a concept including tri(meth)acrylate and tetra(meth)acrylate.
- Examples of the ethylenically unsaturated compound also include a caprolactone-modified compound of a (meth)acrylate compound (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd., or the like), an alkylene oxide-modified compound of a (meth)acrylate compound (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel-Allnex Ltd., or the like), and ethoxylated glycerin triacrylate (A-GLY-9E manufactured by Shin-Nakamura Chemical Co., Ltd.).
- As the ethylenically unsaturated compound, a urethane (meth)acrylate compound (preferably tri- or higher functional urethane (meth)acrylate compound) is also used.
- Examples of the tri- or higher functional urethane (meth)acrylate compound include 8UX-015A (manufactured by Taisei Fine Chemical Co., Ltd.), UA-32P (manufactured by Shin-Nakamura Chemical Co., Ltd.), and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.).
- In addition, the ethylenically unsaturated compound preferably includes an ethylenically unsaturated compound having an acid group, from a viewpoint of improving developability.
- Examples of the acid group include a phosphoric acid group, a sulfonic acid group, and a carboxy group, and a carboxy group is preferable.
- Examples of the ethylenically unsaturated compound including the acid group include at tri- or tetra-functional ethylenically unsaturated compound including the acid group (component obtained by introducing a carboxy acid group to pentaerythritol tri- and tetra-acrylate (FETA) skeleton (acid value=80 to 120 mgKOH/g)), and a penta- to hexa-functional ethylenically unsaturated compound including the acid group (component obtained by introducing a carboxy group to dipentaerythritol penta- and hexa-acrylate (DPHA) skeleton (acid value=25 to 70 mgKOH/g)).
- The tri- or higher functional Ethylenically unsaturated compound including the acid group may be used in combination with the difunctional ethylenically unsaturated compound including the acid group, as necessary.
- As the ethylenically unsaturated compound including the acid group, at least one kind selected from the group consisting of di- or higher functional ethylenically unsaturated compound including carboxy group and a carboxylic acid anhydride thereof is preferable. This improves developability and hardness of the cured film.
- The di- or higher functional ethylenically unsaturated compound including a carboxy group is not particularly limited and can be suitably selected from well-known compounds.
- For example, as the di- or higher functional ethylenically unsaturated compound including a carboxy group, ARONIX (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), ARONIX M-520 (manufactured by Toagosei Co., Ltd.), or ARONIX M-510 (manufactured by Toagosei Co., Ltd.) can be preferably used.
- The ethylenically unsaturated compound including the acid group is also preferably a polymerizable compound including an acid group disclosed in paragraphs 0025 to 0030 of JP2004-239942A. The content of this publication is incorporated in this specification.
- A weight-average molecular weight (Mw) of the ethylenically unsaturated compound used in the disclosure is preferably 200 to 3,000, more preferably 250 to 2,600, even more preferably 280 to 2,200, and particularly preferably 300 to 2,200.
- In addition, a ratio of the content of the ethylenically unsaturated compound having a molecular weight of 300 or less, among all of the ethylenically unsaturated compound included in the photosensitive layer is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less, with respect to all of the ethylenically unsaturated compounds included in the photosensitive layer.
- The ethylenically unsaturated compound may be used alone or in combination of two or more thereof.
- The content of the ethylenically unsaturated compound the photosensitive layer is preferably 1% by mass to 70% by mass, more preferably 5% by mass to 70% by mass, even more preferably 10% by mass to 70% by mass, particularly preferably 20% by mass to 60% by mass, and most preferably 20% by mass to 50% by mass, with respect to a total mass of the photosensitive layer.
- In addition, in a case where the photosensitive layer includes a difunctional ethylenically unsaturated compound and a tri- or higher functional ethylenically unsaturated compound, the content of the difunctional ethylenically unsaturated compound is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 85% by mass, and even more preferably 30% by mass to 80% by mass, with respect to all of the ethylenically unsaturated compounds included in the photosensitive layer.
- In this case, the content of the tri- or higher functional ethylenically unsaturated compound is preferably 10% by mass to 90% by mass, more preferably 15% by mass to 80% by mass, and even more preferably 20% by mass to 70% by mass, with respect to all of the ethylenically unsaturated compounds included in the photosensitive layer.
- In this case, the content of the di- or higher functional ethylenically unsaturated compound is preferably 40% by mass or more and less than 100% by mass, more preferably 40% by mass to 90% by mass, even more preferably 50% by mass to 80% by mass, and particularly preferably 50% by mass to 70% by mass, with respect to a total content of the di functional ethylenically unsaturated compound and the tri- or higher functional ethylenically unsaturated compound.
- In addition, in a case where the photosensitive layer includes a di- or higher functional ethylenically unsaturated compound, the photosensitive layer may further include a monofunctional ethylenically unsaturated compound.
- Further, in a case where the photosensitive layer includes a di- or higher functional ethylenically unsaturated compound, the di- or higher functional ethylenically unsaturated compound is preferably the main component in the ethylenically unsaturated compound contained in the photosensitive layer.
- Specifically, in a case where the photosensitive layer includes di- or higher functional ethylenically unsaturated compound, the content of the di- or higher functional ethylenically unsaturated compound is preferably 60% by mass to 100% by mass, more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass with respect to a total content of the ethylenically unsaturated compound included in the photosensitive layer.
- In a case where the photosensitive layer includes the ethylenically unsaturated compound including an acid group (preferably, di- or higher functional ethylenically unsaturated compound including a carboxy group or a carboxylic acid anhydride thereof), the content of the ethylenically unsaturated compound including the acid group is preferably 1% by mass to 50% by mass, more preferably 1% by mass to 20% by mass, and even more preferably 1% by mass to 10% by mass, with respect to the photosensitive layer.
- «Photopolymerization Initiator»
- The photosensitive layer in the photosensitive transfer material according to the disclosure includes a photopolymerization initiator.
- The photopolymerization initiator is not particularly limited and a well-known photopolymerization initiator can be used.
- Examples of the photopolymerization initiator include a photopolymerization initiator having an oxime ester structure (hereinafter, also referred to as an “oxime-based photopolymerization initiator”), a photopolymerization initiator having an α-aminoalkylphenone structure (hereinafter, an “α-aminoalkylphenone-based photopolymerization initiator”), a photopolymerization initiator having an α-hydroxyalkylphenone structure (hereinafter also referred to as an “α-hydroxyalkylphenone-based photopolymerization initiator”), a photopolymerization initiator having an acylphosphine oxide structure. (hereinafter, also referred to as an “acylphosphine oxide-based photopolymerization initiator”), and a photopolymerization initiator having an N-phenylglycine structure (hereinafter, “N-phenylglycine-based photopolymerization initiator”).
- The photopolymerization initiator preferably includes at least one kind selected from the group consisting of the oxime-based photopolymerization initiator, the α-aminoalkylphenone-based photopolymerization initiator, the α-hydroxyalkylphenone-based photopolymerization initiator, and the N-phenylglycine-based photopolymerization initiator, and more preferably includes at least one kind selected from the group consisting of the oxime-based photopolymerization initiator, the α-aminoalkylphenone-based photopolymerization initiator, and the N-phenylglycine-based photopolymerization initiator.
- In addition, as the photopolymerization initiator, for example, polymerization initiators disclosed in paragraphs 0031 to 0042 of JP2011-095716A and paragraphs 0064 to 0081 of JP2015-014783A may be used.
- Examples of a commercially available product of the photopolymerization initiator include 1-[4-(phenylthio)-1,2-octanedione-2-(O-benzoyloxime) (product name: IRGACURE (registered trademark) OXE-01, manufactured by BASF Japan Ltd.), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) (product name: IRGACURE OXE-02, manufactured by BASF Japan Ltd.), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (product name: IRGACURE 379EG, manufactured by BASF Japan Ltd.), 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one (product name: IRGACURE 907, manufactured by BASF Japan Ltd.), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one (product name: IRGACURE 127, manufactured by BASF Japan Ltd.), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (product name: IRGACURE 369, manufactured by BASF Japan Ltd.), 2-hydroxy-2-methyl-1-phenyl-propan-1-one (product name: IRGACURE 1173, manufactured by BASF Japan Ltd.), 1-hydroxy cyclohexyl phenyl ketone (product name: IRGACURE 184, manufactured by BASF Japan Ltd.), 2,2-dimethoxy-1,2-diphenylethan-1-one (product name: IRGACURE 651, manufactured by BASF Japan Ltd.), and a product name of an oxime ester type (product name: Lunar 6, manufactured by DKSH Management Ltd.).
- The photopolymerization initiator may be used alone or in combination of two or more thereof.
- The content of the photopolymerization initiator in the photosensitive layer is not particularly limited and is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably 1.0% by mass or more with respect to a total mass of the photosensitive layer.
- In addition, the content of the photopolymerization initiator is preferably equal to or smaller than 10% by mass and more preferably equal to or smaller than 5% by mass, with respect to a total mass of the photosensitive layer.
- «Blocked Isocyanate Compound»
- The photosensitive layer in the photosensitive transfer material according to the disclosure preferably further includes a blocked isocyanate compound, from a viewpoint of hardness after curing.
- The blocked isocyanate compound refers to a “compound having a structure in which the isocyanate group of isocyanate is protected (masked) with a blocking agent”.
- A dissociation temperature of the blocked isocyanate compound is preferably 100° C. to 160° C. and more preferably 130° C. to 150° C.
- The dissociation temperature of blocked isocyanate of the specification is a “temperature at an endothermic peak accompanied with a deprotection reaction of blocked isocyanate, in a case where the measurement is performed by differential scanning calorimetry (DSC) analysis using a differential scanning calorimeter (manufactured. by Seiko Instruments Inc., DSC6200)”.
- Examples of the blocking agent having a dissociation temperature at 100° C. to 160° C. include a pyrazole compound (3,5-dimethylpyrazole, 3-methylpyrazole, 4-bromo-3,5-dimethylpyrazole, or 4-nitro-3,5-dimethylpyrazole), an active methylene compound (diester malonate (dimethyl malonate, diethyl malonate, di n-butyl malonate, di-2-ethylhexyl malonate)), a triazole compound (1,2,4-triazole), and an oxime compound (compound having a structure represented by —C(═N—OH)— in a molecule such as formaldoxime, acetoaldoxime, acetoxime, methyl ethyl ketoxime, or cyclohexanone oxime). Among these, from a viewpoint of preservation stability, an oxime compound or a pyrazole compound is preferable, and an oxime compound is particularly preferable.
- In addition, it is preferable that the blocked isocyanate compound has an isocyanurate structure, from a viewpoint of improving brittleness of the film, improving the adhesion with a transfer target, and the like. The blocked isocyanate compound having an isocyanurate structure can be prepared, for example, by converting hexamethylene diisocyanate into isocyanurate and protecting it.
- Among blocked isocyanate compounds having an isocyanurate structure, a compound having an oxime structure using an oxime compound as a blocking agent is preferable, since a dissociation temperature is easily set in a preferable range and the development residue is easily reduced, compared to a compound having no oxime structure.
- The blocked isocyanate compound used in the disclosure preferably has a radically polymerizable group, from a viewpoint of hardness after curing.
- The radically polymerizable group is not particularly limited, and well-known polymerizable groups can be used, and examples thereof include a (meth)acryloxy group, a (meth)acrylamide group, an ethylenically unsaturated group such as styryl group, and an epoxy group such as a glycidyl group. Among these, as the polymerizable group, an ethylenically unsaturated group is preferable, and a (meth)acryloxy group is more preferable, from viewpoints of surface shape of the surface of the cured film to be obtained, a development speed, and reactivity.
- As the blocked isocyanate compound used in the disclosure, a commercially available blocked isocyanate compound can also be used. Examples thereof include Karenz AOI-BM, Karenz MOI-BM, Karenz, Karenz MOI-BP (all manufactured by Showa Denko K.K.), and a block type Duranate series (manufactured by Asahi Kasei Chemicals Corporation).
- A molecular weight of the blocked isocyanate compound used in the disclosure is preferably 200 to 3,000, more preferably 250 to 2,600, and particularly preferably 280 to 2,200.
- In the disclosure, the blocked isocyanate compound may be used alone or in combination of two or more kinds thereof.
- A content of the blocked isocyanate compound is preferably 1% by mass to50% by mass, and more preferably 5% by mass to 30% by mass, with respect to the total mass of the photosensitive layer.
- «Surfactant»
- The photosensitive layer may include a surfactant.
- As the surfactant, for example, surfactants disclosed in paragraph 0017 of JP4502784B and paragraphs 0060 to 0071 of JP2009-237362A, well-known fluorine-based surfactants, and the like can be used.
- As the surfactant, a fluorine-based surfactant is preferable.
- As a commercially available fluorine-based surfactant, MEGAFACE (registered trademark) F551 (manufactured by DIC Corporation) is used.
- In a case where the photosensitive layer includes a surfactant, a content of the surfactant is preferably 0.01% by mass to 3% by mass, more preferably 0.05% by mass to 1% by mass, and even more preferably 0.1% by mass to 0.8% by mass, with respect to the total mass of the photosensitive layer.
- «Polymerization Inhibitor»
- The photosensitive layer may include at least one polymerization inhibitor.
- As the polymerization inhibitor, for example, a thermal polymerization inhibitor (also referred to as a polymerization inhibitor) disclosed in paragraph 0018 of JP4502784B can be used.
- Among them, phenothiazine, phenoxazine, or 4-methoxyphenol can be preferably used.
- In a case where the photosensitive layer includes a polymerization inhibitor, a content of the polymerization inhibitor is preferably 0.01% by mass to 3% by mass, more preferably 0.01% by mass to 1% by mass, and even more preferably 0.01% by mass to 0.8% by mass, with respect to the total mass of the photosensitive layer.
- «Metal Oxidation Inhibitor»
- The photosensitive layer preferably further includes a metal oxidation inhibitor.
- The metal oxidation inhibitor is preferably a compound having a heteroaromatic ring having a nitrogen atom. The compound having a heteroaromatic ring having a nitrogen atom may have a substituent.
- The heteroaromatic ring having a nitrogen atom is preferably an imidazole ring, a triazole ring, a tetrazole ring, a thiazole ring, a thiadiazole ring, or a fused ring of any one of these and another aromatic ring, and more preferably an imidazole ring, a triazole ring, a tetrazole ring, or a fused ring of any one of these and another aromatic ring.
- The “other aromatic ring” forming the fused ring may be a homocyclic ring or a heterocyclic ring, is preferably a homocyclic ring, more preferably a benzene ring or a naphthalene ring, and even more preferably a benzene ring.
- Specific examples include imidazole, benzimidazole, triazole, benzotriazole, tetrazole, and mercaptothiadiazole.
- In a case where the photosensitive layer includes a metal oxidation inhibitor, a content of the metal oxidation inhibitor is preferably 0.01% by mass to 20% by mass, more preferably 0.05% by mass to 10% by mass, and even more preferably 0.1% by mass to 5% by mass, with respect to the total mass of the photosensitive layer.
- «Hydrogen Donating Compound»
- The photosensitive layer preferably further includes a hydrogen donating compound.
- In the disclosure, the hydrogen donating compound has a function of further improving sensitivity of the photopolymerization initiator to active light, or preventing inhibition of polymerization of the polymerizable compound by oxygen.
- Examples of such a hydrogen donating compound include amines, for example. M. R. Sander et al., “Journal of Polymer Society,” Vol. 10, page 3173 (1972), JP1969-020189B (JP-S-44-020189B), JP1976-082102A (JP-S-51-082102A), JP1977-134692A (JP-S-52-134692A), JP1984-138205A (JP-S-59-138205A), JP1985-084305A (JP-S-60-084305A), JP1987-018537A (JP-S-62-018537), JP1989-033104A (JP-S-64-033104A), and Research Disclosure 33825, and specific examples thereof include triethanolamine, p-dimethylaminobenzoic acid ethyl ester, p-formyldimethylaniline, and p-methylthiodimethylaniline.
- In addition, other examples of the hydrogen donating compound further include an amino acid compound (for example, N-phenylglycine or the like), an organic metal compound disclosed in JP1973-042965B (JP-S-48-042965B) (for example, tributyltin acetate, or the like), a hydrogen donor disclosed in JP1980-034414B (JP-S-55-034414B), and a sulfur compound disclosed in JP1994-308727A (JP-H-6-308727A) (for example, trithiane or the like).
- A content of the hydrogen donating compounds is preferably in a range of 0.1% by mass to 30% by mass, more preferably in a range of 0.1% by mass to 25% by mass, and even more preferably in a range of 0.5% by mass to 20% by mass, with respect to the total mass of the photosensitive layer, from a viewpoint of improving a curing speed with balance between a polymerization growth speed and chain transfer.
- «Other Components»
- The photosensitive layer may include a component other than the components described above.
- Examples of the other components include a thermal polymerization inhibitor disclosed in paragraph 0018 of JP4502784B, and other additives disclosed in paragraphs 0058 to 0071 of JP2000-310706A.
- The photosensitive layer may include at least one kind of particles (for example, metal oxide particles) as the other component, in order to adjust a refractive index or light transmittance.
- The metal of the metal oxide particles also includes semimetal such as B, Si, Ge, As, Sb, or Te. From a viewpoint of transparency of the cured film, an average primary particle diameter of the particles (for example, metal oxide particles) is preferably 1 to 200 nm and more preferably 3 to 80 nm. The average primary particle diameter is calculated by measuring particle diameters of 200 random particles using an electron microscope and averaging the measured result. In a case where the shape of the particle is not a spherical shape, the longest side is set as the particle diameter.
- The content of the particles is preferably 0% by mass to 35% by mass, more preferably 0% by mass to 10% by mass, even more preferably 0% by mass to 5% by mass, still more preferably 0% by mass to 1% by mass, and particularly preferably 0% by mass (that is, the photosensitive layer includes no particles), with respect to a total mass of the photosensitive layer.
- In addition, the photosensitive layer may include a small amount of colorant (pigment, dye, and the like) as the other component, but it is preferable that a colorant is not substantially included, from a viewpoint of transparency.
- Specifically, a content of the colorant in the photosensitive layer is preferably smaller than 1% by mass and more preferably smaller than 0.1% by mass with respect to a total mass of the photosensitive layer.
- A thickness of the photosensitive layer is preferably 20 μm or less, more preferably 15 μm or less, and particularly preferably 12 μm or less.
- It is advantageous in a case where the thickness of the photosensitive layer is 20 μm or less, from viewpoints of reducing a thickness of the entire photosensitive transfer material, improving transmittance of the photosensitive layer or the cured film to be obtained, and preventing yellowing of the photosensitive layer or the cured film to be obtained.
- From a viewpoint of manufacturing suitability, the thickness of the photosensitive layer is preferably 1 μm or more, more preferably 2 μm or more, and particularly preferably 3 μm or more.
- A refractive index of the photosensitive layer is preferably 1.47 to 1.56, more preferably 1.50 to 1.53, even more preferably 1.50 to 1.52, and particularly preferably 1.51 to 1.52.
- In the disclosure, the “refractive index” indicates a refractive index at a wavelength of 550 nm.
- The “refractive index” in the disclosure means a value measured with visible light at a wavelength of 550 nm at a temperature of 23° C. by ellipsometry, unless otherwise noted.
- A method for forming the photosensitive layer is not particularly limited, and a well-known method can be used.
- As an example of the method for forming the photosensitive layer, a method forming the photosensitive layer by applying a photosensitive resin composition containing a solvent onto a temporary support and then drying, as necessary is used.
- As the coating method, a well-known method can be used, and examples thereof include a printing method, a spraying method, a roll coating method, a bar coating method, a curtain coating method, a spin coating method, and a die coating method (that is, slit coating method), and a die coating method is preferable.
- As the drying method, a well-known method such as natural drying, heating drying, and drying under reduced pressure can be applied alone or in combination of plural thereof.
- —Solvent—
- In the formation of the photosensitive layer, at least one kind of solvent may be included, from a viewpoint of forming the photosensitive layer by coating.
- As the solvent, a solvent normally used can be used without particular limitations.
- The solvent is preferably an organic solvent.
- Examples of the organic solvent include methyl ethyl ketone, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (another name: 1-methoxy-2-propyl acetate), diethylene glycol ethyl methyl ether, cyclohexanone, methyl isobutyl ketone, ethyl lactate, methyl lactate, caprolactam, n-propanol, and 2-propanol. In addition, the solvent used may include a mixed solvent which is a mixture of these compounds.
- As the solvent, a mixed solvent of methyl ethyl ketone and propylene glycol monomethyl ether acetate, a mixed solvent of methyl ethyl ketone, propylene glycol monomethyl ether acetate, and propylene glycol monomethyl ether, or a mixed solvent of diethylene glycol ethyl methyl ether and propylene glycol monomethyl ether acetate is preferably used.
- In a case of using the solvent, a content of solid contents of the photosensitive resin composition is preferably 5% by mass to 80% by mass, more preferably 5% by mass to 40% by mass, and particularly preferably 5% by mass to 30% by mass with respect to a total mass of the photosensitive resin composition.
- In a case of using the solvent, a viscosity (25° C.) of the photosensitive resin composition is preferably 1 mPa·s to 50 mPa·s, more preferably 2 mPa·s to 40 mPa·s, and particularly preferably 3 mPa·s to 30 mPa·s, from a viewpoint of coating properties.
- The viscosity is, for example, measured using VISCOMETER TV-22 (manufactured by Toki Sangyo Co. Ltd.).
- In a case where the photosensitive resin composition includes the solvent, a surface tension (25° C.) of the photosensitive resin composition is preferably 5 mN/m to 100 mN/m, more preferably 10 mN/m to 80 mN/m, and particularly preferably 15 mN/m to 40 mN/m, from a viewpoint of coating properties.
- The surface tension is, for example, measured using Automatic Surface Tensiometer CBVP-Z (manufactured by Kyowa Interface Science Co., Ltd.).
- As the solvent, a solvent disclosed in paragraphs 0054 and 0055 of US20051282073A can also be used, and the content of this specification is incorporated in the present specification.
- In addition, as the solvent, an organic solvent (high-boiling-point solvent) having a boiling point of 180° C. to 250° C. can also be used, as necessary.
- <Temporary Support>
- The photosensitive transfer material according to the disclosure includes a temporary support.
- The temporary support is preferably a film and more preferably a resin film.
- As the temporary support, a film which has flexibility and does not generate significant deformation, shrinkage, or stretching under the pressure or under pressure and heating can be used.
- Examples of such a film include a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, a polyimide film, and a polycarbonate film.
- Among these, a biaxial stretching polyethylene terephthalate film is particularly preferable.
- It is preferable that the film used as the temporary support does not have deformation such as wrinkles or scratches.
- A thickness of the temporary support is not particularly limited, and is, for example, preferably 5 μm to 200 μm, and is particularly preferably 10 μm to 150 μm, from viewpoints of ease of handling and general-purpose properties.
- <Transparent Resin Layer>
- The photosensitive transfer material according to the disclosure may further comprise a transparent resin layer on a side opposite to a side where the temporary support is present, when seen from the photosensitive layer (for example, see specific example of the photosensitive transfer material which will be described later).
- As the transparent resin layer, a refractive index adjusting layer is preferably used.
- According to the photosensitive transfer material of the embodiment comprising the refractive index adjusting layer, in a case of forming a protective layer for a touch panel by transferring the refractive index adjusting layer and the photosensitive layer of the photosensitive transfer material to a substrate for a touch panel comprising a transparent electrode pattern, the transparent electrode pattern is more hardly recognized (that is, concealing properties of the transparent electrode pattern are further improved). A phenomenon that the transparent electrode pattern is recognized, is generally referred to as “see-through”.
- Regarding the phenomenon that the transparent electrode pattern is recognized, and the concealing properties of the transparent electrode pattern, JP2014-010814A and JP2014-108541A can be suitably referred to.
- The transparent resin layer is preferably disposed to be adjacent to the photosensitive layer.
- The refractive index of the transparent resin layer is preferably higher than the refractive index of the photosensitive layer, from a viewpoint of preventing the see-through.
- The refractive index of the transparent resin layer is preferably equal to or greater than 1.50, more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60.
- An upper limit of the refractive index of the transparent resin layer is not particularly limited, and is preferably equal to or smaller than 2.10, more preferably equal to or smaller than 1.85, even more preferably equal to or smaller than 1.78, and particularly preferably equal to or smaller than 1.74.
- The transparent resin layer may have photocuring properties (that is, photosensitivity), may have thermosetting properties, or may have both photocuring properties and thermosetting properties.
- From a viewpoint of forming the cured film having excellent hardness by the photocuring after the transfer, the transparent resin layer preferably has photocuring properties.
- From viewpoints of further improving hardness of the cured film by the heat curing, the transparent resin layer preferably has thermosetting properties. The transparent resin layer preferably has alkali solubility (for example, solubility with respect to weak alkali aqueous solution).
- The embodiment in which the transparent resin layer has photosensitivity, has an advantage, from a viewpoint of collectively patterning the photosensitive layer and the transparent resin layer transferred onto the substrate by photolithography at one time, after the transferring.
- A film thickness of the transparent resin layer is preferably equal to or smaller than 500 nm, more preferably equal to or smaller than 110 nm, and particularly preferably equal to or smaller than 100 nm.
- In addition, the film thickness of the transparent resin layer is preferably equal to or greater than 20 nm, more preferably equal to or greater than 50 nm, even more preferably equal to or greater than 55 nm, and particularly preferably equal to or greater than 60 nm.
- The refractive index of the transparent resin layer is preferably adjusted in accordance with the refractive index of the transparent electrode pattern.
- For example, in a case where the refractive index of the transparent electrode pattern is 1.8 to 2.0, as in a case of the transparent electrode pattern formed of ITO, the refractive index of the transparent resin layer is preferably equal to or greater than 1.60. An upper limit of the refractive index of the transparent resin layer in this case is not particularly limited, and is preferably equal to or smaller than 2.1, more preferably equal to or smaller than 1.85, even more preferably equal to or smaller than 1.78, and particularly preferably equal to or smaller than 1.74.
- In addition, in a case where the refractive index of the transparent electrode pattern is greater than 2.0, as in a case of the transparent electrode pattern formed of indium zinc oxide (IZO), for example, the refractive index of the transparent resin layer is preferably 1.70 to 1.85.
- A method for controlling the refractive index of the transparent resin layer is not particularly limited, and examples thereof include a method using a resin having a predetermined refractive index alone, a method using a resin and metal oxide particles and metal particles, and a method using a composite of metal salt and a resin.
- The transparent resin layer preferably includes at least one kind selected from the group consisting of inorganic particles having a refractive index equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60), a resin having a refractive index equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60), and a polymerizable monomer having a refractive index equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60).
- According to this embodiment, the refractive index of the transparent resin layer is easily adjusted to be equal to or greater than 1.50 (more preferably equal to or greater than 1.55, and particularly preferably equal to or greater than 1.60).
- In addition, the transparent resin layer preferably includes a binder polymer, an ethylenically unsaturated compound, and particles.
- Regarding the components of the transparent resin layer, components of a curable transparent resin layer disclosed in paragraphs 0019 to 0040 and 0144 to 0150 of JP2014-108541A, and components of a transparent layer disclosed in paragraphs 0024 to 0035 and 0110 to 0112 of JP2014-010814A, and components of a composition including ammonium salt disclosed in paragraphs 0034 to 0056 of WO20161009980 can be referred to.
- In addition, the transparent resin layer preferably includes at least one kind of a metal oxidation inhibitor.
- In a case where the transparent resin layer includes the metal oxidation inhibitor, surface treatment can be performed with respect to a member (for example, conductive member formed on a substrate) in a direct contact with the transparent resin layer, in a case of transferring the transparent resin layer onto the substrate (that is, a target to be transferred). This surface treatment applies a metal oxide inhibition function (protection properties) with respect to the member in a direct contact with the transparent resin layer.
- Examples of the metal oxidation inhibitor include those mentioned above.
- The transparent resin layer of the disclosure may include a component other than the components described above.
- The other component which can be included in the transparent resin layer is the same as the other component which can be included in the photosensitive layer described above.
- The transparent resin layer preferably includes a surfactant as the other component.
- A forming method of the transparent resin layer is not particularly limited.
- As an example of the forming method of the transparent resin layer, a method of forming the layer by applying and, as necessary, drying a composition for forming a transparent resin layer of the embodiment including an aqueous solvent, on the photosensitive layer formed on the temporary support is used.
- Specific examples of the coating and drying method are respectively the same as the specific examples of the coating and drying in a case of forming the photosensitive layer.
- The composition for forming the transparent resin layer can include each component of the transparent resin layer described above.
- The composition for forming the transparent resin layer, for example, includes a binder polymer, an ethylenically unsaturated compound, particles, and an aqueous solvent.
- In addition, as the composition for forming the transparent resin layer, a composition including ammonium salt disclosed in paragraphs 0034 to 0056 of WO2016/009980 is also preferable.
- <Protective Film>
- The photosensitive transfer material according to the disclosure may further comprise a protective film on a side of the photosensitive layer opposite to the temporary support.
- In a case where the photosensitive transfer material according to the disclosure comprises the transparent resin layer on a side of the photosensitive layer opposite to the temporary support, the protective film is preferably disposed on a side opposite to the temporary support from the view of the transparent resin layer.
- Examples of the protective film include a polyethylene terephthalate film, a polypropylene film, a polystyrene film, and a polycarbonate film.
- As the protective film, a component disclosed in paragraphs 0083 to 0087 and 0093 of JP2006-259138A may be used, for example.
- <Thermoplastic Resin Layer>
- The photosensitive transfer material according to the disclosure may further comprise a thermoplastic resin layer between a temporary support and a photosensitive layer.
- In a case where the photosensitive transfer material comprises the thermoplastic resin layer and the photosensitive transfer material is transferred to a substrate to form a laminate, air bubbles are hardly generated on each element of the laminate. In a case where this laminate is used in an image display device, image unevenness is hardly generated and excellent display properties are obtained.
- The thermoplastic resin layer preferably has alkali solubility.
- The thermoplastic resin layer functions as a cushion material which absorbs ruggedness of the surface of the substrate at the time of transfer.
- The ruggedness of the surface of the substrate includes an image, an electrode, a wiring, and the like which are formed in advance. The thermoplastic resin layer preferably has properties capable of being deformed in accordance with ruggedness.
- The thermoplastic resin layer preferably includes an organic polymer substance disclosed in JP1993-072724A (JP-H5-072724A), and more preferably includes an organic polymer substance having a softening point approximately equal to or lower than 80° C. by a Vicat method (specifically, polymer softening point measurement method using an American Society for Testing and Materials ASTM D1235).
- A thickness of the thermoplastic resin layer is preferably 3 μm to 30 μm, more preferably 4 μm to 25 μm, and even more preferably 5 μm to 20 μm.
- In a case where the thickness of the thermoplastic resin layer is equal to or greater than 3 μm, followability with respect to the ruggedness of the surface of the substrate is improved, and accordingly, the ruggedness of the surface of the substrate can be effectively absorbed.
- In a case where the thickness of the thermoplastic resin layer is equal to or smaller than 30 μm, process suitability is further improved. For example, burden of the drying (solvent removal) in a case of applying and forming the thermoplastic resin layer on the temporary support is further reduced, and the development time of the thermoplastic resin layer after the transfer is shortened.
- The thermoplastic resin layer can be formed by applying and, as necessary, drying a composition for forming a thermoplastic resin layer including a solvent and a thermoplastic organic polymer on the temporary support.
- Specific examples of the coating and drying method are respectively the same as the specific examples of the coating and drying in a case of forming the photosensitive layer.
- The solvent is not particularly limited, as long as a polymer component forming the thermoplastic resin layer is dissolved, and examples thereof include organic solvents (for example, methyl ethyl ketone, cyclohexanone, propylene glycol monomethyl ether acetate, n-propanol, and 2-propanol).
- A viscosity of the thermoplastic resin layer measured at 100° C. is preferably 1,000 to 10,000 Pa·s. In addition, the viscosity of the thermoplastic resin layer measured at 100° C. is preferably lower than the viscosity of the photosensitive layer measured at 100° C.
- <Interlayer>
- The photosensitive transfer material according to the disclosure may further comprise an interlayer between a temporary support and a photosensitive layer.
- In a case where the photosensitive transfer material according to the disclosure comprises the thermoplastic resin layer, the interlayer is preferably disposed between the thermoplastic resin layer and the photosensitive layer.
- As the component of the interlayer, a resin which is a mixture including polyvinyl alcohol, polyvinyl pyrrolidone, cellulose, or at least two kinds thereof.
- In addition, as the interlayer, a component disclosed in JP1993-072724A (JP-H5-072724A) as a “separation layer” can also be used.
- In a case of producing the photosensitive transfer material of the embodiment comprising the thermoplastic resin layer, the interlayer, and the photosensitive layer on the temporary support in this order, the interlayer can be, for example, formed by applying and, as necessary, drying a composition for forming an interlayer including a solvent which does not dissolve the thermoplastic resin layer, and the resin as the component of the interlayer. Specific examples of the coating and drying method are respectively the same as the specific examples of the coating and drying in a case of forming the photosensitive layer.
- In this case, for example, first, the composition for forming a thermoplastic resin layer is applied and dried on the temporary support to form the thermoplastic resin layer. Next, the composition for forming an interlayer is applied and dried on this thermoplastic resin layer to form the interlayer. After that, the photosensitive resin composition of the embodiment including the organic solvent is applied and dried on the interlayer to form the photosensitive layer. The organic solvent in this case is preferably an organic solvent which does not dissolve the interlayer.
- <Specific Example of Photosensitive Transfer Material>
-
FIG. 1 is a schematic cross sectional view showing aphotosensitive transfer material 10 which is a specific example of the. photosensitive transfer material according to the disclosure. - As shown in
FIG. 1 , thephotosensitive transfer material 10 has a laminated structure of “protective film 16/transparent resin layer 20A/photosensitive layer 18A/temporary support 12” (that is, laminated structure in which atemporary support 12, aphotosensitive layer 18A, atransparent resin layer 20A, and aprotective film 16 are arranged in this order). - However, the photosensitive transfer material according to the disclosure is not limited to the
photosensitive transfer material 10, and thetransparent resin layer 20A and theprotective film 16 may be omitted, for example. In addition, at least one of the thermoplastic resin layer or the interlayer described above may be comprised between thetemporary support 12 and thephotosensitive layer 18A. - The
transparent resin layer 20A is a layer disposed on a side of thephotosensitive layer 18A opposite to the side where thetemporary support 12 is present, and a layer having a refractive index at a wavelength of 550 nm equal to or greater than 1.50. - The
photosensitive transfer material 10 is a negative type material (negative type film). - A manufacturing method of the
photosensitive transfer material 10 is not particularly limited. - The manufacturing method of the
photosensitive transfer material 10, for example, includes a step of forming thephotosensitive layer 18A on thetemporary support 12, a step of forming thetransparent resin layer 20A on thephotosensitive layer 18A, and a step of forming theprotective film 16 on thetransparent resin layer 20A in this order. - The manufacturing method of the
photosensitive transfer material 10 may include a step of volatilizing ammonia disclosed in a paragraph 0056 of WO2016/009980, between the step of forming thetransparent resin layer 20A and the step of forming theprotective film 16. - (Electrode Protective Film, Laminate, and Capacitive Input Device)
- An electrode protective film according to the disclosure is formed by curing the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to the disclosure.
- The electrode protective film according to the disclosure is preferably an electrode protective film of the capacitive input device and more preferably an electrode protective film for a touch panel.
- The laminate according to the disclosure described below includes the electrode protective film according to the disclosure.
- The laminate according to the disclosure includes the photosensitive layer after removing the temporary support from the photosensitive transfer material according to the disclosure on the substrate, in order from the substrate side. In addition, the photosensitive layer in the laminate may be a cured photosensitive layer (also referred to as a cured film).
- The capacitive input device according to the disclosure includes the electrode protective film according to the disclosure or the laminate according to the disclosure.
- The substrate is preferably a substrate including. an electrode of the capacitive input device.
- The electrode of the capacitive input device may be a transparent electrode pattern or a leading wiring. In the laminate, the electrode of the capacitive input device is preferably an electrode pattern and more preferably a transparent electrode pattern.
- From a viewpoint of excellent concealing properties of the transparent electrode pattern, it is preferable that the laminate according to the disclosure includes a substrate, a transparent electrode pattern, a transparent resin layer disposed to be adjacent to the transparent electrode pattern, and a photosensitive layer disposed to be adjacent to the transparent resin layer, and a refractive index of the transparent resin layer is higher than a refractive index of the photosensitive layer. The refractive index of the transparent resin layer is preferably equal to or greater than 1.6.
- As the substrate, a glass substrate or a resin substrate is preferable.
- In addition, the substrate is preferably a transparent substrate and more preferably a transparent resin substrate. The meaning of the transparency is as described above.
- A refractive index of the substrate is preferably 1.50 to 1.52.
- As the glass substrate, tempered glass such as GORILLA GLASS (registered trademark) manufactured by Corning incorporated can be used.
- As the resin substrate, at least one of a component with no optical strains or a component having high transparency is preferably used, and a substrate formed of a resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), triacetyl cellulose (TAC), polyimide (PI), polybenzoxazole (PBO), or cycloolefin polymer (COP) is used, for example.
- As a material of the transparent substrate, a material disclosed in JP2010-086684A, JP2010-152809A, and JP2010-257492A is preferably used.
- As the capacitive input device, a touch panel is suitably used.
- As the electrode for a touch panel, a transparent electrode pattern disposed at least in an image display region of the touch panel is used. The electrode for a touch panel may extend from the image display region to a frame portion of the touch panel.
- As the wiring for a touch panel, the leading wiring (lead-out wiring) disposed on the frame portion of the touch panel is used, for example.
- As a preferred embodiment of the substrate for a touch panel and the touch panel, an embodiment in which the transparent electrode pattern and the leading wiring are electrically connected to each other by laminating a part of the leading wiring on a portion of the transparent electrode pattern extending to the frame portion of the touch panel, is suitable.
- As a material of the transparent electrode pattern, a metal oxide film of indium tin oxide (ITO) and indium zinc oxide (IZO) is preferable.
- As a material of the leading wiring, metal is preferable. Examples of the metal which is the material of the leading wiring include gold, silver, copper, molybdenum, aluminum, titanium, chromium, zinc, and manganese, and alloy formed of two or more kinds of these metal elements. As the material of the leading wiring, copper, molybdenum, aluminum, or titanium is preferable, copper is particularly preferable.
- The electrode protective film for a touch panel according to the disclosure is provided so as to cover the electrode and the like directly or through other layers, in order to protect the electrode and the like (that is, at least one of the electrode for a touch panel or the wiring for a touch panel).
- The preferred range of a thickness of the electrode protective film for a touch panel is the same as the preferred range of a thickness of the photosensitive layer described above.
- The electrode protective film according to the disclosure, preferably the electrode protective film for a touch panel may include an opening.
- The opening can be formed by dissolving an unexposed portion of the photosensitive layer with a developer.
- In this case, in a case where the electrode protective film for touch panel is formed under the laminating condition at a high temperature using the photosensitive transfer material, the development residue of the opening of the electrode protective film for a touch panel is prevented.
- The touch panel may further comprise a first refractive index adjusting layer between the electrode and the like and the electrode protective layer for a touch panel (for example, see first specific example of the touch panel which will be described later).
- The preferred embodiment of the first refractive index adjusting layer is the same as the preferred embodiment of the transparent resin layer included in the photosensitive transfer material. The first refractive index adjusting layer may be formed by applying and drying a composition for forming the first refractive index adjusting layer, or may be formed by transferring the refractive index adjusting layer of the photosensitive transfer material comprising the refractive index adjusting layer.
- The touch panel of the embodiment comprising the first refractive index adjusting layer is preferably formed by transferring the photosensitive layer and the transparent resin layer of the photosensitive transfer material by using the photosensitive transfer material according to the disclosure of the embodiment comprising the transparent resin layer. In this case, the electrode protective layer for a touch panel is formed of the photosensitive layer of the photosensitive transfer material, and the first refractive index adjusting layer is formed of the transparent resin layer of the photosensitive transfer material.
- In addition, the touch panel or the substrate for a touch panel may comprise a second refractive index adjusting layer between the substrate and the electrode and the like (for example, see, first specific example of the touch panel which will be described later).
- The preferred embodiment of the second refractive index adjusting layer is the same as the preferred embodiment of the transparent resin layer included in the photosensitive transfer material.
- The embodiment in which the touch panel of the disclosure comprises the first refractive index adjusting layer (more preferably, embodiment of comprising the first refractive index adjusting layer and the second refractive index adjusting layer) has an advantage which the electrode and the like are hardly recognized (that is, so-called see-through is prevented).
- Regarding the structure of the touch panel, a structure of a capacitive input device disclosed in JP2014-010814A or JP2014-108541A may be referred to.
- <First Specific Example of Touch Panel>
-
FIG. 2 is a schematic cross sectional view of atouch panel 30 which is the first specific example of the touch panel according to the disclosure. More specifically,FIG. 2 is a schematic cross sectional view of an image display region of thetouch panel 30. - As shown in
FIG. 2 . thetouch panel 30 has a structure in which asubstrate 32, a second refractiveindex adjusting layer 36, atransparent electrode pattern 34 as the electrode for a touch panel, a first refractive index adjusting layer 20, and an electrodeprotective film 18 for a touch panel are disposed in this order. - In the
touch panel 30, the electrodeprotective film 18 for a touch panel and the first refractive index adjusting layer 20 cover the entiretransparent electrode pattern 34. However, the touch panel according to the disclosure is not limited to this embodiment. The electrodeprotective film 18 for a touch panel and the first refractive index adjusting layer 20 may cover at least a portion of thetransparent electrode pattern 34. - In addition, the second refractive
index adjusting layer 36 and the first refractive index adjusting layer 20 are preferably respectively continuously coated over afirst region 40 in which thetransparent electrode pattern 34 is present and asecond region 42 in which thetransparent electrode pattern 34 is not present directly or through another layer. Accordingly, thetransparent electrode pattern 34 is more hardly recognized. - The second refractive
index adjusting layer 36 and the first refractive index adjusting layer 20 are preferably coated directly over both of thefirst region 40 and thesecond region 42, rather than the coating through the other layer. Examples of the “other layer” include an insulating layer and an electrode pattern other than thetransparent electrode pattern 34. - The first refractive index adjusting layer 20 is laminated over both of the
first region 40 and thesecond region 42. The first refractive index adjusting layer 20 is adjacent to the second refractiveindex adjusting layer 36 and is also adjacent to thetransparent electrode pattern 34. - In a case where the shape of the end portion of the
transparent electrode pattern 34 at a portion in contact with the second refractiveindex adjusting layer 36 is a tapered shape as shown inFIG. 2 , the first refractive index adjusting layer 20 is preferably laminated along the tapered shape (that is, at the same tilt as the taper angle). - As the
transparent electrode pattern 34, the ITO transparent electrode pattern is suitable. - The
transparent electrode pattern 34 can be, for example, formed by the following method. - A thin film for an electrode (for example, ITO film) is formed on the
substrate 32 on which the second refractiveindex adjusting layer 36 is formed by sputtering. By applying a photosensitive resist for etching or transferring a photosensitive film for etching onto the thin film for an electrode, an etching protective layer is formed. Then, this etching protective layer is patterned in a desired pattern shape by exposure and development. Next, a portion of the thin film for an electrode which is not covered with the patterned etching protective layer is removed by etching. Accordingly, the thin for an electrode is set to have a pattern having a desired shape (that is, transparent electrode pattern 34). Then, the patterned etching protective layer is removed by a peeling solution. - The first refractive index adjusting layer 20 and the electrode
protective film 18 for a touch panel are, for example, formed on the substrate 32 (that is, substrate for a touch panel) on which the second refractiveindex adjusting layer 36 and thetransparent electrode pattern 34 are provided in order, as described below. - First, the photosensitive transfer material 10 (that is,
photosensitive transfer material 10 having a laminated structure of “protective film 16/transparent resin layer 20A/photosensitive layer 18A/temporary support 12”) shown inFIG. 1 is prepared. - Next, the
protective film 16 is removed from thephotosensitive transfer material 10. - Then, the
photosensitive transfer material 10, from which theprotective film 16 is removed, is laminated on the substrate 32 (that is, substrate for a touch panel) on which the second refractiveindex adjusting layer 36 and thetransparent electrode pattern 34 are provided in order. The laminating is performed in a direction in which thetransparent resin layer 20A of thephotosensitive transfer material 10, from which theprotective film 16 is removed, and thetransparent electrode pattern 34 are in contact with each other. By this laminating, a laminate having a laminated structure of “temporary support 12/photosensitive layer 18A/transparent resin layer 20A/transparent electrode pattern 34/second refractiveindex adjusting layer 36/substrate 32” is obtained. - Next, the
temporary support 12 is removed from the laminate. - Then, by performing the pattern exposure with respect to the laminate, from which the
temporary support 12 is removed, thephotosensitive layer 18A and thetransparent resin layer 20A are cured in a pattern shape. The curing of thephotosensitive layer 18A and thetransparent resin layer 20A in a pattern shape may be respectively individually performed by individual pattern exposure, but the curing is preferably performed at the same time by the pattern exposure at one time. - Next, by removing the unexposed portion (that is, uncured portion) of the
photosensitive layer 18A and thetransparent resin layer 20A by the development, the electrodeprotective film 18 for a touch panel which is a patterned cured product of thephotosensitive layer 18A (not shown regarding the pattern shape), and the first refractive index adjusting layer 20 which is a patterned cured product of thetransparent resin layer 20A (not shown regarding the pattern shape) are respectively obtained. The development of thephotosensitive layer 18A and thetransparent resin layer 20A after the pattern exposure may be respectively individually performed by individual development, but the development is preferably performed at the same time by the development at one time. - The preferred embodiments of the laminating, the pattern exposure, and the development will be described later.
- Regarding the structure of the touch panel, a structure of a capacitive input device disclosed in JP2014-010814A or JP2014-108541A may be referred to.
- <Second Specific Example of Touch Panel>
-
FIG. 3 is a schematic cross sectional view of atouch panel 90 which is a second specific example of the touch panel according to the disclosure. - As shown in
FIG. 3 , thetouch panel 90 includes animage display region 74 and animage non-display region 75. - As shown in
FIG. 3 , thetouch panel 90 comprises the electrode for a touch panel on both surfaces of thesubstrate 32. Specifically, thetouch panel 90 comprises a firsttransparent electrode pattern 70 on one surface of thesubstrate 32 and comprises a secondtransparent electrode pattern 72 on the other surface thereof. - In the
touch panel 90, a leadingwiring 56 is connected to the firsttransparent electrode pattern 70 and the secondtransparent electrode pattern 72, respectively. The leadingwiring 56 is, for example, a copper wiring. - In the
touch panel 90, the electrodeprotective film 18 for a touch panel is formed on one surface of thesubstrate 32 so as to cover the firsttransparent electrode pattern 70 and the leadingwiring 56, and the electrodeprotective film 18 for a touch panel is formed on the other surface of thesubstrate 32 so as to cover the secondtransparent electrode pattern 72 and the leadingwiring 56. - The first refractive index adjusting layer and the second refractive index adjusting layer of the first specific example may be provided on the one surface and the other surface of the
substrate 32, respectively. - <Manufacturing Method of Touch Panel>
- The method of manufacturing the touch panel according to the disclosure is not particularly limited, and the following manufacturing method is preferable.
- The preferred manufacturing method of the touch panel according to the disclosure includes
- a step for convenience, and is a step of preparing a substrate for a touch panel having a structure in which the electrode and the like (that is, at least one of the electrode for a touch panel or the wiring for a touch panel) are disposed on a substrate (hereinafter, also referred to as a “preparation step”),
- a step of forming a photosensitive layer on a surface of the substrate for a touch panel, on a side where the electrode and the like are disposed, using the photosensitive transfer material according to the disclosure (hereinafter, also referred to as a “photosensitive layer forming step”),
- a step of performing the pattern exposure with respect to the photosensitive layer formed on the surface of the substrate. for a touch panel (hereinafter, also referred to as a “pattern exposure step”), and
- a step of developing the pattern-exposed photosensitive layer to obtain an electrode protective film for a touch panel which protects at least a part of the electrode or the like (hereinafter, also referred to as a “development step”).
- According to the preferred manufacturing method, a touch panel comprising the electrode protective film for a touch panel having excellent bending resistance can be manufactured.
- In addition, in the preferred manufacturing method, even in a case where the photosensitive layer is formed under the laminating condition at a high temperature using the photosensitive transfer material according to the disclosure, the occurrence of the development residue is prevented in the unexposed portion of the photosensitive layer after the development.
- Hereinafter, each step of the preferred manufacturing method will be described.
- <Preparation Step>
- The preparation step is a step for convenience, and is a step of preparing a substrate for a touch panel having a structure in which the electrode and the like (that is, at least one of the electrode for a touch panel or the wiring for a touch panel) are disposed on a substrate.
- The preparation step may be a step of only simply preparing the substrate for a touch panel manufactured in advance, or may be a step of manufacturing the substrate for a touch panel.
- The preferable embodiment of the substrate for a touch panel is as described in the first specific example of the touch panel and the second specific example of the touch panel.
- <Photosensitive Layer Forming Step>
- The photosensitive layer forming step is a step of forming a photosensitive layer on a surface of the substrate for a touch panel, on a side where the electrode and the like are disposed, using the photosensitive transfer material according to the disclosure.
- Hereinafter, in the photosensitive layer forming step, the embodiment using the photosensitive transfer material according to the disclosure will be described.
- In this embodiment, the photosensitive layer is formed on the surface by laminating the photosensitive transfer material according to the disclosure on the surface of the substrate for a touch panel on a side on which the electrode and the like are disposed, and transferring the photosensitive layer of the photosensitive transfer material according to the disclosure on the surface.
- The laminating (transfer of the photosensitive layer) can be performed using a well-known laminator such as a vacuum laminator or an auto-cut laminator.
- As the laminating condition, a general condition can be applied.
- The laminating temperature is preferably 80° C. to 150° C., more preferably 90° C. to 150° C., and particularly preferably 100° C. to 150° C.
- As described above, in the embodiment using the photosensitive transfer material according to the disclosure, even in a case where the laminating temperature is a high temperature (for example, 120° C. to 150° C.), the occurrence of the development residue due to thermal fogging is prevented.
- In a case of using a laminator comprising a rubber roller, the laminating temperature indicates a temperature of the rubber roller.
- A temperature of the substrate in, a case of laminating is not particularly limited. The temperature of the substrate at the time of laminating is 10° C. to 150° C., preferably 20° C. to 150° C., and more preferably 30° C. to 150° C. In a case of using a resin substrate as the substrate, the temperature of the substrate at the time of laminating is preferably 10° C. to 80° C., more preferably 20° C. to 60° C., and particularly preferably 30° C. to 50° C.
- In addition, linear pressure at the time of laminating is preferably 0.5 N/cm to 20 N/cm, more preferably 1 N/cm to 10 N/cm, and particularly preferably 1 N/cm to 5 N/cm.
- In addition, a transportation speed (laminating speed) at the time of laminating is preferably 0.5 m/min to 5 m/min and more preferably 1.5 m/min to 3 m/min.
- In a case of using the photosensitive transfer material having a laminated structure of “the protective film/photosensitive layer/interlayer/thermoplastic resin layer/temporary support”, first, the protective film is peeled off from the photosensitive transfer material to expose the photosensitive layer, the photosensitive transfer material and the substrate for a touch panel are bonded to each other so that the exposed photosensitive layer and the surface of the substrate for a touch panel on a side on which the electrode and the like are disposed are in contact with each other, and heating and pressurizing are performed. Accordingly, the photosensitive layer of the photosensitive transfer material is transferred onto the surface of the substrate for a touch panel on a side on which the electrode and the like are disposed, and a laminate having a laminated structure of “temporary support/thermoplastic resin layer/interlayer/photosensitive layer/electrode and the like/substrate” is formed. In this laminated structure, the portion of “electrode and the like/substrate” is the substrate for a touch panel.
- After that, the temporary support is peeled off from the laminate, as necessary. However, the pattern exposure which will be described later can be also performed, by leaving the temporary support.
- As an example of the method of transferring the photosensitive layer of the photosensitive transfer material on the substrate for a touch panel and performing pattern exposure and development, a description disclosed in paragraphs 0035 to 0051 of JP2006-023696A can also be referred to.
- <Pattern Exposure Step>
- The pattern exposure step is a step of performing the pattern exposure with respect to the photosensitive layer formed on the substrate for a touch panel.
- Here, the pattern exposure indicates exposure of the embodiment of performing the exposure in a pattern shape, that is, the embodiment in which an exposed portion and an unexposed portion are present.
- The exposed portion of the photosensitive layer on the substrate for a touch panel in the pattern exposure is cured and finally becomes the cured film.
- Meanwhile, the unexposed portion of the photosensitive layer on die substrate for a touch panel in the pattern exposure is not cured, and is removed (dissolved) with a developer in the subsequent development step. With the unexposed portion, the opening of the cured film can be formed after the development step.
- The pattern exposure may be exposed through a mask or may be digital exposure using a laser or the like.
- As a light source of the pattern exposure, a light source can be suitably selected, as long as it can emit light at a wavelength region (for example, 365 nm or 405 nm) at which the photosensitive layer can be cured. Examples of the light source include various lasers, a light emitting diode (LED), an ultra-high pressure mercury lamp, a high pressure mercury lamp, and a metal halide lamp. An exposure intensity is preferably 5 mJ/cm2 to 200 mJ/cm2, and more preferably 10 mJ/cm2 to 200 mJ/cm2.
- In a case where the photosensitive layer is formed on the substrate using the photosensitive transfer material, the pattern exposure may be performed after peeling the temporary support, or the temporary support may be peeled off after performing the exposure before peeling off the temporary support.
- In addition, in the exposure step, the heat treatment (so-called post exposure bake (PEB)) may be performed with respect to the photosensitive layer after the pattern exposure and before the development.
- <Development Step>
- The development step is a step of obtaining the electrode protective film for a touch panel which protects at least a portion of the electrode and the like, by developing the pattern-exposed photosensitive layer (that is, by dissolving the unexposed portion of the pattern exposure with a developer).
- A developer used in the development is not particularly limited, and a well-known developer such as a developer disclosed in JP1993-072724A (JP-H5-072724A) can be used.
- As the developer, an alkali aqueous solution is preferably used.
- Examples of the alkali compound which can be included in the alkali aqueous solution include sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogencarbonate, tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide, tetrapropyl ammonium hydroxide, tetrabutylammonium hydroxide, and choline (2-hydroxyethyltrimethylammonium hydroxide).
- The pH of the alkali aqueous solution at 25° C. is preferably 8 to 13, more preferably 9 to 12, and particularly preferably 10 to 12.
- A content of the alkali compound in the alkali aqueous solution is preferably 0.1% by mass to 5% by mass and more preferably 0.1% by mass to 3% by mass with respect to a total mass of the alkali aqueous solution.
- The developer may include an organic solvent having miscibility with water.
- Examples of the organic solvent include methanol, ethanol, 2-propanol, 1-propanol, butanol, diacetone alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-butyl ether, benzyl alcohol, acetone, methyl ethyl ketone, cyclohexanone, e-caprolactone, g-butyrolactone, dimethylformamide, dimethylacetamide, hexamethylphosphoramide, ethyl lactate, methyl lactate, e-caprolactam, and N-methylpyrrolidone.
- A concentration of the organic solvent is preferably 0.1% by mass to 30% by mass.
- The developer may include a well-known surfactant. A concentration of the surfactant is preferably 0.01% by mass to 10% by mass.
- A liquid temperature of the developer is preferably 20° C. to 40° C.
- Examples of the development method include methods such as puddle development, shower development, shower and spin development, and dip development.
- In a case of the shower development, the unexposed portion of the photosensitive layer is removed by spraying the developer to the photosensitive layer after the pattern exposure as a shower. In a case of using the photosensitive transfer material comprising at least one of the photosensitive layer, the thermoplastic resin layer, or the interlayer, after the transfer of these layers onto the substrate and before the development of the photosensitive layer, an alkali solution having a low solubility of the photosensitive layer may be sprayed as a shower, and at least one of the thermoplastic resin layer or the interlayer (both layers, in a case where both layers are present) may be removed in advance.
- In addition, after the development, the development residue is preferably removed by spraying a cleaning agent with a shower and rubbing with a brush or the like.
- A liquid temperature of the developer is preferably 20° C. to 40° C.
- The development step may include a stage of performing the development, and a stage of performing the heat treatment (hereinafter, also referred to as “post baking”) with respect to the cured film obtained by the development.
- In a case where the substrate is a resin substrate, a temperature of the post baking is preferably 100° C. to 160° C. and more preferably 130° C. to 160° C.
- A resistance value of the transparent electrode pattern can also be adjusted by this post baking.
- In addition, in a case where the photosensitive layer includes a carboxy group-containing (meth)acrylic resin, at least a part of the carboxy group-containing (meth)acrylic resin can be changed to carboxylic acid anhydride by the post baking. This improves developability and hardness of the cured film.
- In addition, the development step may include a stage of performing the development, and a stage of exposing the cured film obtained by the development (hereinafter, also referred to as “post exposure”).
- In a case where the development step includes a stage of performing the post exposure and a stage of performing the post baking, the post exposure and the post baking are preferably performed in this order.
- Regarding the pattern exposure and the development, a description disclosed in paragraphs 0035 to 0051 of JP2006-023696A can be referred to, for example.
- The preferred manufacturing method of the touch panel of the disclosure may include a step other than the steps described above. As the other step, a step (for example, washing step or the like) which may be provided in a normal photolithography step can be applied without any particular limitations.
- (Image Display Device)
- The image display device according to the disclosure comprises the capacitive input device according to the disclosure, preferably, the touch panel according to the disclosure (for example, touch panels of the first and second specific examples).
- As the image display device according to the disclosure, a liquid crystal display device having a structure in which the touch panel according to the disclosure is overlapped on a well-known liquid crystal display element is preferable.
- As the structure of the image display device comprising the touch panel, for example, a structure disclosed in “The latest Touch Panel Technology” (published 6 Jul. 2009, Techno Times), “Technologies and Developments of Touch Panels” supervised by Yuji Mitani, CMC Publishing CO., LTD. (2004, 12), FPD International 2009 Forum T-11 lecture text book, Cypress Semiconductor Corporation application note AN 2292 can be applied.
- Hereinafter, the disclosure will be described more specifically with reference to examples. The material, the amount used, the ratio, the process contents, the process procedure, and the like shown in the following examples can be suitably changed, within a range not departing from a gist of the disclosure. Accordingly, the range of the disclosure is not limited to specific examples shown below. “part” and “%” are based on mass, unless otherwise noted.
- In the following examples, a weight-average molecular weight of a resin is a weight-average molecular weight obtained by performing polystyrene conversion of a value measured by gel permeation chromatography (GPC).
- The materials were mixed so that the solid content ratios shown in Tables 1 to 3 are obtained, and an organic solvent was further added thereto to obtain a solution including 25.5 parts by mass of propylene glycol monomethyl ether acetate (PGMEA, manufactured by Daicel Corp.), 67.8 parts by mass of propylene glycol monomethyl ether (MFG, manufactured by Wako Pure Chemical Industries, Ltd.), and 151.5 parts by mass of methyl ethyl ketone (MEK, manufactured by Maruzen Petrochemical Co., Ltd.) per 100 parts by mass of the solid content, and accordingly, photosensitive resin composition solutions of Examples 1 to 39 and Comparative Examples 1 to 5 were prepared.
- <Producing of Photosensitive Transfer Material>
- The obtained photosensitive resin composition solution was applied an a temporary support having a thickness of 16 μm which is a polyethylene terephthalate film by using a slit-shaped nozzle, and accordingly, a photosensitive layer having a film thickness of 8 μm after drying was formed. A protective film (polyethylene phthalate film having a thickness of 16 μm) of the photosensitive layer was pressure-bonded on the photosensitive layer, and each photosensitive transfer material of Examples 1 to 39 and Comparative Examples 1 to 5 was manufactured.
- <Evaluation of Bending Resistance>
- The obtained photosensitive transfer material was laminated on both surfaces of COSMO SHINE A4300 (thickness: 50 μm) of a polyethylene terephthalate film manufactured by Toyobo Co., Ltd., which was heated at 145° C. for 30 minutes, after peeling off the protective film, and a laminate A having a layer structure of temporary support/photosensitive layer having a thickness of 8 μm/COSMO SHINE A4300 (thickness: 50 μm)/photosensitive layer having a thickness of 8 μm/temporary support was formed. In the lamination conditions, a laminating roll temperature was set as 110° C., a linear pressure was set as 3 N/cm, and a transportation speed was set as 2 m/min.
- After that, both suffices were exposed through the temporary support using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) including an ultra-high pressure mercury lamp with an exposure intensity of 100 mJ/cm2 (i ray). After both surfaces of the temporary support were peeled off, exposure was further performed on both surfaces with an exposure intensity of 375 mJ/cm2 (i ray), and post baking was performed at 145° C. for 30 minutes to cure the photosensitive layer, thereby forming a cured film.
- By doing so, a sample for bending resistance evaluation consisting of a cured photosensitive layer having a thickness of 8 μm/COSMO SHINE A4300 (thickness: 50 μm)/cured photosensitive layer having a thickness of 8 μm was obtained.
- The bending resistance was evaluated as follows using the sample for bending resistance evaluation.
- The sample for bending resistance evaluation described above was cut into a rectangle having a size of 5 cm×12 cm. As shown in
FIGS. 4 and 5 , the cut sample for bendingresistance evaluation 102 was bonded to the upper andlower metal plates 106 with tape via two spacers A104 having a height of 5 cm, and fixed in a U shape, and a 1kg weight 108 was loaded on the upper metal plate. - In
FIG. 5 , the sample for bendingresistance evaluation 102, the two spacers A104, and the two spacers B110 are not directly visible in a case where viewed from the upper side in the direction of gravity, but are shown by dotted lines. - Next, as shown in
FIGS. 4 and 5 , after placing two spacers B110 having a specified gap (height d) on themetal plate 106, the spacer A104 was moved outside the metal plate 106 (direction of arrow inFIGS. 4 and 5 ) by hand at the same time, and accordingly, themetal plate 106 on the upper side was freely dropped onto the spacer B110 (the state shown inFIG. 6 ). - Regarding the sample for bending resistance evaluation after repeating the above operation (repeating the state of
FIG. 4 and the state ofFIG. 6 ) 15 times, the tape was peeled off from themetal plate 106, and then presence or absence of cracks on the surface of the sample for bendingresistance evaluation 102 was visually confirmed. - The above operation was performed while changing the nap (height d) of the spacer B110, and the smallest gap (height d of the spacer B110) at which cracks did not occur was obtained. In the following evaluation criteria, A has the most excellent bending resistance, and E has the worst bending resistance. Any one of A, B, and C is suitable for practical use, and A is most preferable.
- A: The smallest gap at which cracks do not occur is 4 mm or less.
- B: The smallest gap at which cracks do not occur is greater than 4 mm and 5 mm or less.
- C: The smallest gap at which cracks do not occur is greater than 5 mm and 6 mm or less.
- D: The smallest gap at which cracks do not occur is greater than 6 mm and 7 mm or less.
- E: The smallest gap at which cracks do not occur is greater than 7 mm.
- <Evaluation of Hardness>
- The obtained photosensitive transfer material was cut into a size of 4.5 cm×9 cm and laminated on glass having a size of 5 cm×10 cm (EAGLE XG, manufactured by Corning Incorporated), after the protective film is peeled off, and a laminate having a layer structure of “temporary support/photosensitive layer having a thickness of 8 μm/glass” was formed. In the lamination conditions, a laminating roll temperature was set as 110° C., a linear pressure was set as 3 N/cm, and a transportation speed was set as 2 m/min.
- After that, the entire surface was exposed through the temporary support using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) including an ultra-high pressure mercury lamp with an exposure intensity of 100 MJ/cm2 (i ray). After the temporary support was peeled off, exposure was further performed with an exposure intensity of 375 mJ/cm2 (i ray), and post baking was performed at 145° C. for 30 minutes to cure the photosensitive layer, thereby forming a cured film.
- By doing so, a sample for hardness evaluation having a layer structure of photosensitive layer having a thickness of 8 μm/glass layer was obtained.
- The hardness of the cured film was evaluated as follows using the sample for hardness evaluation.
- Using HM2000 type hardness tester manufactured by FISCHER Instruments, an indentation test was performed under the conditions of Berkovich indenter (triangular pyramid indenter), load speed of 20.0 mN/min, and maximum load of 20.0 mN, and Martens hardness (HM) was obtained with the maximum indentation depth.
- In the evaluation criteria below, any one of A, B, and C is suitable for practical use, and A is most preferable.
- A: Martens hardness is 190 N/mm2 or more.
- B: Martens hardness is 160 N/mm2 or more and less than 190 N/mm2.
- C: Martens hardness is 130 N/mm2 or more and less than 160 N/mm2.
- D: Martens hardness is 100 N/mm2 or more and less than 130 N/mm2.
- E: Martens hardness is less than 100 N/mm2.
- <Evaluation of Tackiness>
- The obtained photosensitive transfer material was cut into a rectangle having a size of 5 cm×18 cm, and the protective film was peeled off. A polytetrafluoroethylene (PFA) film having a thickness of 500 μm was cut into a rectangle having a size of 10 cm×15 cm and fixed on a horizontal surface. The PFA film and the photosensitive transfer material were laminated so that the PFA film and the surface of the cut photosensitive transfer material on which the photosensitive layer was formed were in contact with each other, and a weight of 70 g having a rectangular parallelepiped shape having a bottom having a size of 4 cm×6 cm was loaded thereon. Using Force Gauge Stand manufactured by Shimpo, the laminated photosensitive transfer material was pulled at a constant speed in a horizontal direction parallel to the long side of the photosensitive transfer film, and a friction force (unit: N) under the load of the weight was measured.
- The value obtained by dividing the friction three by 70 (hereinafter, also referred to as a “tackiness index value”) was set as an index of tackiness. In the evaluation criteria below, any one of A, B, and C is suitable for practical use, and A is most preferable.
- A: The tackiness index value is less than 2.
- B: The tackiness index value is 2 or more and less than 4.
- C: The tackiness index value is 4 or more and less than 6.
- D: The tackiness index value is 6 or more and less than 10.
- E: tackiness index value is 10 or more.
- <Evaluation of Moisture Permeability> (Manufacturing of Sample for Measuring Moisture Permeability)
- The photosensitive transfer material of each example or comparative example was laminated on PTFE (tetrafluoroethylene resin) membrane filter FP-10-100 manufactured by Sumitomo Electric Industries, Ltd., after the protective film is peeled off, and a laminate A having a laminated structure of “temporary support/photosensitive layer having a thickness of 8 μm/membrane filter” was formed. In the lamination conditions, a membrane filter temperature was set as 40° C., a laminating roll temperature was set as 110° C., a linear pressure was set as 3 N/cm, and a transportation speed was set as 2 m/min.
- The temporary support was peeled from the formed laminate A, and the transfer material, from which the protective film was peeled off, was laminated on the photosensitive layer in the same manner as above. This step of peeling off the temporary support and laminating the transfer material was further repeated 3 times to form a laminate B having a laminated structure of temporary support/photosensitive layer having a total film thickness of 40 μm/membrane filter.
- The photosensitive layer of the obtained laminate B was exposed through the temporary support using a proximity type exposure machine (manufactured by Hitachi High-Tech Electronics Engineering Co., Ltd.) including an ultra-high pressure mercury lamp with an exposure intensity of 100 mJ/cm2 (i ray). After the temporary support was peeled off, exposure was further performed with an exposure intensity of 375 mJ/cm2 (i ray), and post baking was performed at 145° C. for 30 minutes to cure the photosensitive layer, thereby forming a cured film.
- Accordingly, a sample for measuring moisture permeability having a laminated structure of “cured film having a total film thickness of 40 μm/membrane filter” was obtained.
- The measurement of the moisture permeability was performed by a cup method using the sample for measuring moisture permeability, with reference to JIS-Z-0208 (1976). Hereinafter, the details will be described.
- First, a circular sample having a diameter of 70 mm was cut from the sample for measuring moisture permeability. Next, 20 g of dried calcium chloride was put in a measurement cup, and covered with the circular sample, and accordingly, a lid-attached measurement cup was prepared.
- This lid-attached measurement cup was left in a constant-temperature and constant-humidity tank for 24 hours under the condition of 65° C. with 90% RH. The water vapor transmission rate (WVTR) of the circular sample (unit: g/m2·day) was calculated from a change in mass of the lid-attached measurement cup before and after the leaving.
- The measurement described above was performed three times and an average value of the WVTRs in three times of the measurement was calculated. The water vapor transmission rate (WVTR) was evaluated based on the average value of the WVTR according to the evaluation standards. In the evaluation standard below, any of A, B, and C is preferable, A or B is more preferable, and A is most preferable.
- In the measurement, the WVTR of the circular sample having a laminated structure of “cured film/membrane filter” was measured as described above. However, the WVTR of the membrane filter is extremely higher than the WVTR of the cured film, and accordingly, in the measurement, the WVTR of the cured film is substantially measured.
- A: Average value of WVTR is less than 140 g/(m2·day)
- B: Average value of WVTR is 140 g/(m2·day) or more and less than 170 g/(m2·day)
- C: Average value of WVTR is 170 g/(m2·day) or more and less than 200 g/(m2·day)
- D: Average value of WVTR is 200 g/(m2·day) or more and less than 250 g/(m2·day)
- E: Average value of WVTR is 250 g/(m2·day) or more
- The evaluation results are shown in Tables 1 to 3.
-
TABLE 1 Examples 1 2 3 4 5 6 7 8 9 Ethylenically Tricyclodecane dimethanol 19.07 19.07 19.07 19.07 13.59 8.59 3.59 2.76 10.55 unsaturated diacrylate (A-DCP, manufactured compound by Shin-Nakamura Chemical Co., Ltd.) Urethane acrylate 8UX-015A — 4.52 3.52 2.52 — — — — — (manufactured by Taisei Fine Chemical Co., Ltd.) Aronix TO-2349 (monomer 3.17 3.17 3.17 3.17 3.17 3.17 3.17 3.17 3.17 having carboxylic acid group, manufactured by Toagosei Co., Ltd.) Binder A-1 (Mw = 20,000) 52.96 52.96 52.96 52.96 52.96 52.96 52.96 84.94 73.97 polymer Photopoly- 1-[9-ethyl-6-(2-methyl- 0.38 0.38 0.38 0.38 0.38 0.38 0.38 0.38 0.38 merization benzoyl)-9H-carbazol-3- initiator yl]ethanone-1-(O-acetyloxime) (OXE-02, manufactured by BASF Japan Ltd.) 2-methyl-1-(4-methylthiophenyl)- 0.72 0.72 0.72 0.72 0.72 0.72 0.72 0.72 0.72 2-morpholinopropan-1-one (Irgacure 907, manufactured by BASF Japan Ltd.) Blocked Karenz AOI-BM (manufactured 12.50 12.50 12.50 12.50 12.50 12.50 12.50 — — isocyanate by Showa Denko K.K., compound photopolymerizable blocked isocyanate) Thiol Trimethylolpropane tris 9.52 5000 6.00 7.00 15.00 20.00 25.00 9.52 9.52 compound (3-mercaptobutyrate) (TPMB, manufactured by Showa Denko K.K.) Other N-phenylglycine (manufactured 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 components by Junsei Chemical Co., Ltd.) 1,2,4-triazole (manufactured by 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 Otsuka Chemical Co., Ltd.) SMA EF-40 (manufactured by 1.21 1.21 1.21 1.21 1.21 1.21 1.21 1.21 1.21 Cray Valley) MEGAFACE F551A 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.17 (manufactured by DIC Corporation) MRS/MB 0.84 0.84 0.84 0.84 0.84 0.84 0.84 0.14 0.31 Evaluation Bending resistance A C B A A A A C B result Hardness A A A A A A A C 8 Tackiness A A A A A A A A A Moisture permeability A A A A A A A C B Examples 10 11 12 13 14 15 Ethylenically Tricyclodecane dimethanol 3.07 12.07 23.07 27.55 33.07 39.55 unsaturated diacrylate (A-DCP, manufactured compound by Shin-Nakamura Chemical Co., Ltd.) Urethane acrylate 8UX-015A — — — — — — (manufactured by Taisei Fine Chemical Co., Ltd.) Aronix TO-2349 (monomer 3.17 3.17 3.17 3.17 3.17 3.17 having carboxylic acid group, manufactured by Toagosei Co., Ltd.) Binder A-1 (Mw = 20,000) 68.96 59.96 48.96 44.47 38.96 32.47 polymer Photopoly- 1-[9-ethyl-6-(2-methyl- 0.38 0.38 0.38 0.38 0.38 0.38 merization benzoyl)-9H-carbazol-3- initiator yl]ethanone-1-(O-acetyloxime) (OXE-02, manufactured by BASF Japan Ltd.) 2-methyl-1-(4-methylthiophenyl)- 0.72 0.72 0.72 0.72 0.72 0.72 2-morpholinopropan-1-one (Irgacure 907, manufactured by BASF Japan Ltd.) Blocked Karenz AOI-BM (manufactured 12.50 12.50 12.50 12.50 12.50 12.50 isocyanate by Showa Denko K.K., compound photopolymerizable blocked isocyanate) Thiol Trimethylolpropane tris 9.52 9.52 9.52 9.52 9.52 9.52 compound (3-mercaptobutyrate) (TPMB, manufactured by Showa Denko K.K.) Other N-phenylglycine (manufactured 0.10 0.10 0.10 0.10 0.10 0.10 components by Junsei Chemical Co., Ltd.) 1,2,4-triazole (manufactured by 0.21 0.21 0.21 0.21 0.21 0.21 Otsuka Chemical Co., Ltd.) SMA EF-40 (manufactured by 1.21 1.21 1.21 1.21 1.21 1.21 Cray Valley) MEGAFACE F551A 0.17 0.17 0.17 0.17 0.17 0.17 (manufactured by DIC Corporation) MRS/MB 0.41 0.62 0.99 1.19 1.50 1.99 Evaluation Bending resistance A A A A A A result Hardness A A A A A A Tackiness A A A A B C Moisture permeability A A A A A A -
TABLE 2 Examples 16 17 18 19 20 21 22 23 24 Ethylenically Tricyclodecane dimethanol 31.55 26.55 15.55 11.55 19.07 19.07 19.07 19.07 19.07 unsaturated diacrylate (A-DCP, manufactured compound by Shin-Nakamura Chemical Co., Ltd.) Aronix TO-2349 (monomer 3.17 3.17 3.17 3.17 3.17 317 3.17 3.17 3.17 having carboxylic acid group, manufactured by Toagosei Co., Ltd.) Binder A-1 (Mw = 20,000) 52.97 52.97 52.97 52.97 52.96 52.96 52.96 52.96 52.96 polymer Photopoly- 1-[9-ethyl-6-(2-methyl- 0.38 0.38 0.38 0.38 0.38 0.38 0.38 0.38 0.38 merization benzoyl)-9H-carbazol-3- initiator yl]ethanone-1-(0-acetyloxime) (OXE-02, manufactured by BASF Japan Ltd.) 2-methyl-1-(4-methylthiophenyl)- 0.72 0.72 0.72 0.72 0.72 0.72 0.72 0.72 0.72 2-morpholinopropan-1-one (IRGACURE 907, manufactured by BASF Japan Ltd.) Blocked Karenz AOI-BM (manufactured — 5.00 16.00 20.00 — 12.50 12.50 12.50 12.50 isocyanate by Showa Denko K.K., compound photopolymerizable blocked isocyanate) Duranate TPA-B80E — — — — 12.50 — — — — (manufactured by Asahi Kasei Chemicals Corporation) Thiol Trimethylolpropane tris 9.52 9.52 9.52 9.52 9.52 — — — — compound (3-mercaptobutyrate) (TPMB, manufactured by Showa Denko K.K.) 1,4-bis (3-mercaptobutyryloxy) — — — — — 9.52 — — — butane (Karenz MT-BD1, manufactured by Showa Denko K.K.) Pentaerythritol tetrakis — — — — — — 9.52 — — (3-mercaptobutyrate) (Karenz MT-PE1, manufactured by Showa Denko K.K.) 1,3,5-tris (3-mercaptobutylyl- — — — — — — — 9.52 — oxyethyl)-1,3,5-triazine-2,4,6 (1H, 3H, 5H)-trione (Karenz MT-NR1, manufactured by Showa Denko K.K.) Trimethylolethanetris — — — — — — — — 9.52 (3-mercaptobutyrate) (TEMB, manufactured by Showa Denko K.K.) Tris [(3-mercaptopropionyloxy) — — — — — — — — — ethyl] isocyanurate (TEMPIC, manufactured by Sakai Chemical Industry Co., Ltd.) Trimethylolpropane tris — — — — — — — — — (3-mercaptopropionate) (TMMP, manufactured by Sakai Chemical Industry Co., Ltd.) Pentaerythritol tetrakis — — — — — — — — — (3-mercaptopropionate) (PEMP, manufactured by Sakai Chemical Industry Co., Ltd.) Tetraethylene glycol bis — — — — — — — — — (3-mercaptopropionate) (EGMP-4, manufactured by Sakai Chemical Industry Co., Ltd.) Dipentaerythritol hexakis — — — — — — — — — (3-mercaptopropionate) (DPMP, manufactured by Sakai Chemical Industry Co., Ltd.) 1-dodecanethiol (manufactured by — — — — — — — — — Tokyo Chemical Industry Co., Ltd.) Other N-phenylglycine (manufactured by 0.10 9.52 9.52 9.52 9.52 9.52 9.52 9.52 9.52 components Junsei Chemical Co., Ltd.) 1,2,4-triazole (manufactured by 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 0.21 Otsuka Chemical Co., Ltd.) SMA EF-40 (manufactured by Cray 1.21 1.21 1.21 1.21 1.21 1.21 1.21 1.21 1.21 Valley) MEGAFACE F551A 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.17 (manufactured by DIC Corporation) MRS/MB 0.835 0.84 0.84 0.84 0.60 0.84 0.84 0.84 0.84 Evaluation Bending resistance A A A A B A A A A result Hardness C A A A A A A A A Tackiness A A A A A A A A A Moisture permeability B A A A B A A A A Examples 25 26 27 28 29 30 Ethylenically Tricyclodecane dimethanol 19.07 19.07 19.07 19.07 19.07 19.07 unsaturated diacrylate (A-DCP, manufactured compound by Shin-Nakamura Chemical Co., Ltd.) Aronix TO-2349 (monomer 3.17 3.17 317 3.17 3.17 3.17 having carboxylic acid group, manufactured by Toagosei Co., Ltd.) Binder A-1 (Mw = 20,000) 52.96 52.96 52.96 52.96 52.96 52.96 polymer Photopoly- 1-[9-ethyl-6-(2-methyl- 0.38 0.38 0.38 0.38 0.38 0.38 merization benzoyl)-9H-carbazol-3- initiator yl]ethanone-1-(0-acetyloxime) (OXE-02, manufactured by BASF Japan Ltd.) 2-methyl-1-(4-methylthiophenyl)- 0.72 0.72 0.72 0.72 0.72 0.72 2-morpholinopropan-1-one (IRGACURE 907, manufactured by BASF Japan Ltd.) Blocked Karenz AOI-BM (manufactured 12.50 12.50 12.50 12.50 12.50 12.50 isocyanate by Showa Denko K.K., compound photopolymerizable blocked isocyanate) Duranate TPA-B80E — — — — — — (manufactured by Asahi Kasei Chemicals Corporation) Thiol Trimethylolpropane tris — — — — — — compound (3-mercaptobutyrate) (TPMB, manufactured by Showa Denko K.K.) 1,4-bis (3-mercaptobutyryloxy) — — — — — — butane (Karenz MT-BD1, manufactured by Showa Denko K.K.) Pentaerythritol tetrakis — — — — — — (3-mercaptobutyrate) (Karenz MT-PE1, manufactured by Showa Denko K.K.) 1,3,5-tris (3-mercaptobutylyl- — — — — — — oxyethyl)-1,3,5-triazine-2,4,6 (1H, 3H, 5H)-trione (Karenz MT-NR1, manufactured by Showa Denko K.K.) Trimethylolethanetris — — — — — — (3-mercaptobutyrate) (TEMB, manufactured by Showa Denko K.K.) Tris [(3-mercaptopropionyloxy) 9.52 — — — — — ethyl] isocyanurate (TEMPIC, manufactured by Sakai Chemical Industry Co., Ltd.) Trimethylolpropane tris — 9.52 — — — — (3-mercaptopropionate) (TMMP, manufactured by Sakai Chemical Industry Co., Ltd.) Pentaerythritol tetrakis — — 9.52 — — — (3-mercaptopropionate) (PEMP, manufactured by Sakai Chemical Industry Co., Ltd.) Tetraethylene glycol bis — — — 9.52 — — (3-mercaptopropionate) (EGMP-4, manufactured by Sakai Chemical Industry Co., Ltd.) Dipentaerythritol hexakis — — — — 9.52 — (3-mercaptopropionate) (DPMP, manufactured by Sakai Chemical Industry Co., Ltd.) 1-dodecanethiol (manufactured by — — — — — 9.52 Tokyo Chemical Industry Co., Ltd.) Other N-phenylglycine (manufactured by 9.52 9.52 9.52 9.52 9.52 9.52 components Junsei Chemical Co., Ltd.) 1,2,4-triazole (manufactured by 0.21 0.21 0.21 0.21 0.21 0.21 Otsuka Chemical Co., Ltd.) SMA EF-40 (manufactured by Cray 1.21 1.21 1.21 1.21 1.21 1.21 Valley) MEGAFACE F551A 0.17 0.17 0.17 0.17 0.17 0.17 (manufactured by DIC Corporation) MRS/MB 0.84 0.84 0.84 0.84 0.84 0.84 Evaluation Bending resistance A A A A A A result Hardness A A A A A C Tackiness A A A A A A Moisture permeability A A A B B A -
TABLE 3 Examples 31 32 33 34 35 36 37 38 39 Ethylenically Tricyclodecane dimethanol 19.07 19.07 19.07 19.07 19.07 19.07 19.07 19.07 19.07 unsaturated diacrylate (A-DCP, manufactured compound by Shin-Nakamura Chemical Co., Ltd.) Urethane acrylate 8UX-015A — — — — — — — — — (manufactured by Taisei Fine Chemical Co., Ltd.) Aronix TO-2349 (monomer having 3.17 3.17 3.17 3.17 3.17 3.17 3.17 3.17 3.17 carboxylic acid group, manufactured by Toagosei Co., Ltd.) Ditrimethylolpropane tetraacrylate 2.52 — — — — — — — — (AD-TMP, manufactured by Shin-Nakamura Chemical Co., Ltd.) Binder A-1 (Mw = 20,000) 52.96 — — 52.96 52.96 53.10 53.10 54.47 53.58 polymer A-2 (Mw = 27,000) — 52.96 — — — — — — — A-3 (Mw = 20,000) — — 52.96 — — — — — — Photopoly- 1-[9-ethyl-6-(2-methyl- 0.38 0.38 0.38 — — 0.38 0.38 0.38 — merization benzoyl)-9H-carbazol-3- initiator yl]ethanone-1-(O-acetyloxime) (OXE-02, manufactured by BASF Japan Ltd.) 2-methyl-1-(4-methylthiophenyl)-2- 0.72 0.72 0.72 0.72 0.72 0.72 0.72 0.72 morpholinopropan-1-one (Irgacure 907, manufactured by BASF Japan Ltd.) 1-[4-(phenylthio)-1,2-octane- — — — 0.38 — — — — 1.00 dione-2-(O-benzoyloxime) (OXE-01, manufactured by BASF Japan Ltd.) 2-(dimethylamino)-2-[(4-methyl- — — — — 0.38 — — — 1.00 phenyl)methyl]-1-[4-(4-morpho- linyl)phenyl]-1-butanone (Irgacure 379EG, manufactured by BASF Japan Ltd.) Blocked Karenz AOI-BM (manufactured by 12.50 12.50 12.50 12.50 12.50 12.50 12.50 12.50 12.50 isocyanate Showa Denko K.K., compound photopolymerizable blocked isocyanate) Thiol Trimethylolpropane tris 7.00 9.52 9.52 9.52 9.52 9.52 9.52 9.52 9.52 compound (3-mercaptobutyrate) (TPMB, manufactured by Showa Denko K.K.) Other N-phenylglycine (manufactured by 0.10 0.10 0.10 0.10 0.10 0.10 0.10 — — components Junsei Chemical Co., Ltd.) 1,2,4-triazole (manufactured by 0.21 0.21 0.21 0.21 0.21 — — — — Otsuka Chemical Co., Ltd.) Benzimidazole (manufactured by — — — — — 0.06 — — — Tokyo Chemical Industry Co., Ltd.) 5-amino-1H-tetrazole (HAT, — — — — — — 0.06 — — manufactured by Toyobo Co., Ltd.) SMA EF-40 (manufactured by Cray 1.21 1.21 1.21 1.21 1.21 1.21 1.21 — — Valley) MEGAFACE F551A (manufactured 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.17 0.17 by DIC Corporation) MRS/MB 0.84 0.84 0.84 0.84 0.84 0.84 0.84 0.81 0.81 Evaluation Bending resistance A A B A A A A A A result Hardness A A A A A A A A A Tackiness A A A A A A A A A Moisture permeability A B B A A A A A A Comparative Examples 1 2 3 4 5 Ethylenically Tricyclodecane dimethanol 19.07 19.07 25.37 1.24 51.55 unsaturated diacrylate (A-DCP, manufactured compound by Shin-Nakamura Chemical Co., Ltd.) Urethane acrylate 8UX-015A 9.52 4.62 42.38 — — (manufactured by Taisei Fine Chemical Co., Ltd.) Aronix TO-2349 (monomer having 3.17 3.17 8.48 — 3.17 carboxylic acid group, manufactured by Toagosei Co., Ltd.) Ditrimethylolpropane tetraacrylate — — — — — (AD-TMP, manufactured by Shin-Nakamura Chemical Co., Ltd.) Binder A-1 (Mw = 20,000) 52.96 52.96 — 88.97 31.97 polymer A-2 (Mw = 27,000) — — — — — A-3 (Mw = 20,000) — — — — — Photopoly- 1-[9-ethyl-6-(2-methyl- 0.38 0.38 0.38 0.38 0.38 merization benzoyl)-9H-carbazol-3- initiator yl]ethanone-1-(O-acetyloxime) (OXE-02, manufactured by BASF Japan Ltd.) 2-methyl-1-(4-methylthiophenyl)-2- 0.72 0.72 0.72 0.72 0.72 morpholinopropan-1-one (Irgacure 907, manufactured by BASF Japan Ltd.) 1-[4-(phenylthio)-1,2-octane- — — — — — dione-2-(O-benzoyloxime) (OXE-01, manufactured by BASF Japan Ltd.) 2-(dimethylamino)-2-[(4-methyl- — — — — — phenyl)methyl]-1-[4-(4-morpho- linyl)phenyl]-1-butanone (Irgacure 379EG, manufactured by BASF Japan Ltd.) Blocked Karenz AOI-BM (manufactured by 12.50 12.50 12.50 — 1.00 isocyanate Showa Denko K.K., compound photopolymerizable blocked isocyanate) Thiol Trimethylolpropane tris — 4.90 8.48 7.00 9.52 compound (3-mercaptobutyrate) (TPMB, manufactured by Showa Denko K.K.) Other N-phenylglycine (manufactured by 0.10 0.10 0.10 0.10 0.10 components Junsei Chemical Co., Ltd.) 1,2,4-triazole (manufactured by 0.21 0.21 0.21 0.21 0.21 Otsuka Chemical Co., Ltd.) Benzimidazole (manufactured by — — — — — Tokyo Chemical Industry Co., Ltd.) 5-amino-1H-tetrazole (HAT, — — — — — manufactured by Toyobo Co., Ltd.) SMA EF-40 (manufactured by Cray 1.21 1.21 1.21 1.21 1.21 Valley) MEGAFACE F551A (manufactured 0.17 0.17 0.17 0.17 0.17 by DIC Corporation) MRS/MB 0.84 0.84 — 0.09 2.04 Evaluation Bending resistance E D Could D A result not be evaluated Hardness E D Could D A not be evaluated Tackiness A A Could A D not be evaluated Moisture permeability B 8 Could E A not be evaluated - From Tables 1 to 3, it is found that the photosensitive transfer materials of Examples 1 to 39 have low tackiness and excellent bending resistance after curing, compared to the photosensitive transfer materials of Comparative Examples 1 to 5.
- In addition, from Tables 1 to 3, the photosensitive transfer materials of Examples 1 to 39 also have excellent hardness and moisture permeability after curing.
- Hereinafter, details of the components shown in Tables 1 to 3 other than the above will be described.
- A-1: Resin having the structure shown below (Mw=20,000)
- A-2: Resin having the structure shown below (Mw=27,000)
- A-3: Resin having the structure shown below (Mw=20,000)
- The ratio of each constitutional unit in the compounds A-1 to A-3 is a mass ratio. Me represents a methyl group.
- SMA EF-40: copolymer of styrene/maleic anhydride=4:1 (molar ratio), acid anhydride value: 1.94 mmol/g, weight-average molecular weight: 10,500, manufactured by Cray Valley
- MEGAFACE F551A (fluorine-based surfactant, manufactured by DIC Corporation)
- 10: Photosensitive transfer material
- 12: temporary support
- 16: protective film
- 18: photosensitive layer (electrode protective film for touch panel)
- 20, 20A: transparent resin layer (first refractive index adjusting layer)
- 30: touch panel
- 32: substrate
- 34: transparent electrode pattern
- 36: second refractive index adjusting layer
- 40: first region where transparent electrode pattern is present
- 42: second region where transparent electrode pattern is not present
- 56: leading wiring
- 70: first transparent electrode pattern
- 72: second transparent electrode pattern
- 74: image display region
- 75: image non-display region
- 90: touch panel
- 102: sample for bending resistance evaluation
- 104: Spacer A
- 106: Metal plate
- 108: Weight
- 110: Spacer B
- d: Gap (height)
Claims (14)
1. A photosensitive transfer material comprising:
a temporary support; and
a photosensitive layer,
wherein the photosensitive layer includes a binder polymer, a radically polymerizable compound having an ethylenically unsaturated group, a photopolymerization initiator, and a thiol compound,
a content of the thiol compound is 5% by mass or more with respect to a total mass of the photosensitive layer, and
a value of a ratio MRS/MB of a total content MRS of the radically polymerizable compound and the thiol compound with respect to the total mass of the photosensitive layer to a content MB of the binder polymer with respect to the total mass of the photosensitive layer is 0.1 to 2.0.
2. The photosensitive transfer material according to claim 1 ,
wherein the photosensitive layer further includes a blocked isocyanate compound.
3. The photosensitive transfer material according to claim 1 ,
wherein the thiol compound is a di- or higher functional thiol compound.
4. The photosensitive transfer material according to claim 1 ,
wherein the thiol compound includes a compound represented by Formula 1,
in Formula 1, n represents an integer of 1 to 6, A represents an n-valent organic group having 1 to 15 carbon atoms or a group represented by Formula 2, and R1's each independently represent a divalent organic group having 1 to 15 carbon atoms, in a case where A represents a group represented by Formula 2, n represents 3, and
5. The photosensitive transfer material according to claim 1 ,
wherein the value of a ratio MRS/MB is 0.4 to 2.0.
6. The photosensitive transfer material according to claim 1 ,
wherein the content of the thiol compound is 5% by mass to 40% by mass with respect to the total mass of the photosensitive layer.
7. The photosensitive transfer material according to claim 1 ,
wherein the binder polymer includes a resin having a constitutional unit having a radically polymerizable group.
8. The photosensitive transfer material according to claim 2 ,
wherein the blocked isocyanate compound includes a radically polymerizable group.
9. The photosensitive transfer material according to claim 1 ,
wherein the photosensitive transfer material is for forming a protective film of a touch panel.
10. An electrode protective film formed by curing the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to claim 1 .
11. A laminate comprising:
the photosensitive layer obtained by removing the temporary support from the photosensitive transfer material according to claim 1 , on a substrate.
12. A capacitive input device comprising:
the electrode protective film according to claim 10 .
13. A capacitive input device comprising:
the laminate according to claim 11 .
14. A manufacturing method for a touch panel, comprising:
preparing a substrate for a touch panel having a structure in which at least one of an electrode for a touch panel or a wiring for a touch panel is disposed on a substrate;
forming a photosensitive layer on a surface of the substrate for a touch panel, on a side where at least one of the electrode for a touch panel or the wiring for a touch panel is disposed, by using the photosensitive transfer material according to claim 1 ;
performing pattern-exposing on the photosensitive layer formed on the substrate for a touch panel; and
developing the pattern-exposed photosensitive layer to obtain a protective film for a touch panel protecting at least a part of at least one of the electrode for a touch panel or the wiring for a touch panel.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-065445 | 2018-03-29 | ||
JP2018065445 | 2018-03-29 | ||
PCT/JP2019/006758 WO2019187851A1 (en) | 2018-03-29 | 2019-02-22 | Photosensitive transfer material, electrode protective film, laminate body, capacitive input device, and touch panel manufacturing method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/006758 Continuation WO2019187851A1 (en) | 2018-03-29 | 2019-02-22 | Photosensitive transfer material, electrode protective film, laminate body, capacitive input device, and touch panel manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
US20210011376A1 true US20210011376A1 (en) | 2021-01-14 |
Family
ID=68059943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/984,469 Abandoned US20210011376A1 (en) | 2018-03-29 | 2020-08-04 | Photosensitive transfer material, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210011376A1 (en) |
JP (1) | JP7048723B2 (en) |
CN (1) | CN111742261A (en) |
TW (1) | TW201942142A (en) |
WO (1) | WO2019187851A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021125168A1 (en) * | 2019-12-18 | 2021-06-24 | 富士フイルム株式会社 | Photosensitive transfer material, method for producing same, method for producing metal conductive material with pattern, film, touch panel, deterioration suppressing method, and multilayer body |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014002285A (en) * | 2012-06-19 | 2014-01-09 | Hitachi Chemical Co Ltd | Barrier rib forming material, photosensitive element using the same, method for forming barrier rib and method of manufacturing image display device |
WO2017038278A1 (en) * | 2015-08-28 | 2017-03-09 | 富士フイルム株式会社 | Transfer film, electrode protection film for capacitance-type input device, laminated body, method for manufacturing laminated body, and capacitance-type input device |
JP2017181959A (en) * | 2016-03-31 | 2017-10-05 | 日立化成株式会社 | Photosensitive resin composition, photosensitive resin film, production method of cured product, laminate, and electronic component |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996040528A1 (en) * | 1995-06-07 | 1996-12-19 | Pt Sub, Inc. | Thiol-containing photosensitive polymeric foam compositions |
JP5179080B2 (en) * | 2007-03-22 | 2013-04-10 | 株式会社ムラカミ | Photosensitive resin composition, photosensitive film, and stencil for screen printing |
WO2010043274A1 (en) * | 2008-10-17 | 2010-04-22 | Huntsman Advanced Materials (Switzerland) Gmbh | Improvements for rapid prototyping apparatus |
JP5475350B2 (en) * | 2009-07-02 | 2014-04-16 | 太陽ホールディングス株式会社 | Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them |
JP2012073589A (en) * | 2010-08-31 | 2012-04-12 | Fujifilm Corp | Photosensitive composition, photosensitive film, photosensitive laminate, method for forming permanent pattern, and printed board |
JP5313285B2 (en) | 2011-03-29 | 2013-10-09 | 富士フイルム株式会社 | Positive photosensitive resin composition, pattern manufacturing method, MEMS structure and manufacturing method thereof, dry etching method, wet etching method, MEMS shutter device, and image display device |
JP6788971B2 (en) * | 2016-01-14 | 2020-11-25 | 東京応化工業株式会社 | Photosensitive composition |
WO2018008376A1 (en) | 2016-07-06 | 2018-01-11 | 富士フイルム株式会社 | Photosensitive composition, transfer film, cured film, touch panel, and method for manufacturing touch panel |
-
2019
- 2019-02-22 CN CN201980014044.0A patent/CN111742261A/en active Pending
- 2019-02-22 JP JP2020510447A patent/JP7048723B2/en active Active
- 2019-02-22 WO PCT/JP2019/006758 patent/WO2019187851A1/en active Application Filing
- 2019-03-05 TW TW108107293A patent/TW201942142A/en unknown
-
2020
- 2020-08-04 US US16/984,469 patent/US20210011376A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014002285A (en) * | 2012-06-19 | 2014-01-09 | Hitachi Chemical Co Ltd | Barrier rib forming material, photosensitive element using the same, method for forming barrier rib and method of manufacturing image display device |
WO2017038278A1 (en) * | 2015-08-28 | 2017-03-09 | 富士フイルム株式会社 | Transfer film, electrode protection film for capacitance-type input device, laminated body, method for manufacturing laminated body, and capacitance-type input device |
US20180157171A1 (en) * | 2015-08-28 | 2018-06-07 | Fujifilm Corporation | Transfer film, electrode protective film for electrostatic capacitance-type input device, laminate, method for manufacturing laminate, and electrostatic capacitance-type input device |
JP2017181959A (en) * | 2016-03-31 | 2017-10-05 | 日立化成株式会社 | Photosensitive resin composition, photosensitive resin film, production method of cured product, laminate, and electronic component |
Non-Patent Citations (2)
Title |
---|
English Machine Translation of JP-2014002285-A (Year: 2014) * |
English Machine Translation of JP-2017181959-A (Year: 2017) * |
Also Published As
Publication number | Publication date |
---|---|
WO2019187851A1 (en) | 2019-10-03 |
TW201942142A (en) | 2019-11-01 |
CN111742261A (en) | 2020-10-02 |
JPWO2019187851A1 (en) | 2021-01-07 |
JP7048723B2 (en) | 2022-04-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11762291B2 (en) | Transfer film, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel | |
US20200363721A1 (en) | Photosensitive transfer material, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel | |
US20210171690A1 (en) | Photosensitive resin composition, cured film, laminate, transfer film, and manufacturing method of touch panel | |
US11604413B2 (en) | Photosensitive composition, transfer film, cured film, and manufacturing method of touch panel | |
US20190171103A1 (en) | Photosensitive resin composition, transfer film, protective film for touch panel, touch panel, manufacturing method of the same, and image display apparatus | |
US20210198406A1 (en) | Transfer film, manufacturing method of cured film, manufacturing method of laminate, and manufacturing method of touch panel | |
US20220004099A1 (en) | Photosensitive resin composition, transfer film, cured film, laminate, and manufacturing method of touch panel | |
JP7010796B2 (en) | A method for manufacturing a photosensitive resin composition, a cured film, a laminate, a transfer film, and a touch panel. | |
US11703759B2 (en) | Transfer film, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel | |
JP7122819B2 (en) | Photosensitive composition, transfer film, cured film, touch panel and manufacturing method thereof | |
US20210011376A1 (en) | Photosensitive transfer material, electrode protective film, laminate, capacitive input device, and manufacturing method of touch panel | |
US20210187919A1 (en) | Laminate, method for manufacturing laminate, and capacitive input device | |
JP2020091322A (en) | Photosensitive resin composition, transfer film, cured film, laminate, and touch panel manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FUJIFILM CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHIMOYAMA, TATSUYA;REEL/FRAME:053395/0799 Effective date: 20200713 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: APPLICATION DISPATCHED FROM PREEXAM, NOT YET DOCKETED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |