US20200398498A1 - Hot Melt Apparatus and Method of Use - Google Patents
Hot Melt Apparatus and Method of Use Download PDFInfo
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- US20200398498A1 US20200398498A1 US17/010,641 US202017010641A US2020398498A1 US 20200398498 A1 US20200398498 A1 US 20200398498A1 US 202017010641 A US202017010641 A US 202017010641A US 2020398498 A1 US2020398498 A1 US 2020398498A1
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- thermoplastic material
- hot melt
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- 239000012943 hotmelt Substances 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims description 30
- 239000012815 thermoplastic material Substances 0.000 claims abstract description 106
- 239000007787 solid Substances 0.000 claims abstract description 23
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 3
- 239000000126 substance Substances 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 230000037361 pathway Effects 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 2
- 238000003303 reheating Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 abstract description 3
- 230000001960 triggered effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4855—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical properties, e.g. being electrically-conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/524—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined
- B29C65/525—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by applying the adhesive from an outlet device in contact with, or almost in contact with, the surface of the part to be joined by extrusion coating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
Definitions
- a hot melt device comprising a heating device that is automatically or manually triggered to heat a pre-formed thermoplastic feedstock is recognized as an existing technology. Applications using such devices allow connection of objects to provide mechanical and./or electrical bonding and incorporate flexibility, repeatability and reusability of the connections.
- a hot melt apparatus typically includes a structural body, a heating element of various designs, and an automatic or manual control system to melt thermoplastic materials.
- mechanical extrusion of a heated thermoplastic material onto a surface to be joined as the thermoplastic material cools and solidifies is used.
- FIG. 1 is a block diagrammatic view in partial perspective of a first exemplary system
- FIG. 2 is an illustration of various shapes adapted to improve a bond of thermoplastic material 2 with a the contacted surface
- FIG. 3 is a block diagrammatic view in partial perspective of a second exemplary system where one or more interchangeable interfaces 5 are disposed intermediate structural body 3 and heater 4 and comprises upper portion 5 a connected to structural body 3 and lower portion 5 b connected to heater 4 , where upper portion 5 a and lower portion 5 n are selectively disconnectable from each other;
- FIG. 4 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a separable interface
- FIG. 5 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a mechanical integrator
- FIG. 6 is a block diagrammatic view in partial perspective of a further exemplary system illustrating an electrical integrator
- FIG. 7 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a mechanical integrator
- FIG. 8 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a mechanical integrator and an electrical integrator
- FIG. 9 is a block diagrammatic view in partial perspective of a further exemplary system illustrating use of a cable manager
- FIG. 10 is a block diagrammatic view in partial perspective of a further exemplary system illustrating an electrical integrator and various electrical ground paths;
- FIG. 11 is a block diagrammatic view in partial perspective of a further exemplary system
- FIG. 12 is a block diagrammatic view in partial perspective of an exemplary system
- FIG. 13 is a block diagrammatic view in partial perspective of a further exemplary system integrated within a common structural body 3 with thermoplastic material 2 at both ends to create a double sided hot melt apparatus 15 ;
- FIG. 14 is a view in partial perspective of an exemplary system illustrating that system in use.
- hot melt apparatus 1 comprises structural body 3 ; thermoplastic material 2 , in a solid form, connected to structural body 3 , where the solid form thermoplastic material 2 is mechanically extrudable onto a surface to be joined as the heated solid form thermoplastic material 2 cools and solidifies; and controllable heater 4 connected to the structural body and to the solid form thermoplastic material 2 , heater 4 controllable to heat the solid form thermoplastic material 2 to a temperature above its melting temperature and to allow the heated solid form thermoplastic material 2 to cool and solidify without the use of a solvent.
- solid form thermoplastic material 2 may comprise a shaped thermoplastic material 2 , where the shape is adapted to improve a bond of thermoplastic material 2 with a the contacted surface.
- the shape may comprises a geometric profile and/or pattern and may further comprise varying thicknesses when melted wherein the connection of rough or uneven surfaces are completed.
- Heater 4 may be an electro-chemical heater activated using a low power electrical signal. In other embodiments, heater 4 may be chemical based and activated through mixing of various chemicals.
- hot melt apparatus 1 may further comprise one or more interchangeable interfaces 5 disposed intermediate structural body 3 and heater 4 .
- Interchangeable interface 5 may comprises upper portion 5 a connected to structural body 3 and lower portion 5 b connected to heater 4 , where upper portion 5 a and lower portion 5 n are selectively disconnectable from each other.
- heater 4 and thermoplastic material 2 are integral and may be integrated to, but remain separable from, structural body 3 .
- separable interface 6 is present and disposed intermediate heater 4 and thermoplastic material 2 .
- separable interface 6 is adapted to create an evenly distributed thermal transfer of heat into thermoplastic material 2 .
- Separable interface 6 comprises a metal, a plastic, a ceramic, or a composite, or the like, or a combination thereof.
- separable interface 6 comprises upper portion 6 a connected to heater 4 and lower portion 6 b selectively detachable from upper portion 6 a , where lower portion 6 b is substantially permanently attached to thermoplastic material 2 .
- separable interface 6 further comprises a thermally conductive material and a heating element operative to melt thermoplastic material by transferring heat to the hot melt pad.
- separable interface 6 comprises an electrically conductive material and the hot melt pad comprises a heater.
- separable interface 6 further comprises an electrically conductive separable interface configured to provide a grounding path through the hot melt apparatus.
- hot melt apparatus 1 comprises mechanical integrator 7 which is configured to allow hot melt apparatus 1 to be mechanically integrated to object 8 such as to become a tool or structural extension of object 8 .
- hot melt apparatus 1 comprises electrical integrator 9 which is configured to allow hot melt apparatus 1 to be electrically integrated to object 8 .
- Electrical integrator 9 provides a power and/or a ground path where power, and/or a ground, may be obtained from object 8 to support the operation of hot melt apparatus 1 .
- Electrically conductive cable 13 may also be present in such embodiments and operatively in communication with electrical integrator 9 at a first end and with object 8 at a second end. Electrically conductive cable 13 may be used to implement an electrical ground path between object 8 and secondary object 14 ( FIG. 10 ).
- electrical integrators 9 of the pair of hot melt apparatuses 1 may be operatively connected by electrically conductive cable 13 which may further be operative to create an electrical ground path when the pair of hot melt apparatuses 1 are bonded separately to object 8 and secondary object 14 .
- the plurality of hot melt apparatuses 1 may be connected by mechanical integrators 7 and electrical integrators 9 and one or more of the plurality of hot melt apparatuses 1 used to bond object 8 to secondary object 14 .
- These multiple hot melt apparatus 1 may be integrated in a number equal to the number of objects 8 , 14 to be joined.
- the plurality of paired hot melt apparatuses may be equal in number to a number of objects 8 to be joined.
- the plurality of hot melt apparatus 1 which may be a pair, may further be integrated within a common structural body 3 with thermoplastic material 2 at both ends to create a double sided hot melt apparatus 15 which may be used to bond object 8 to secondary object 14 .
- Double sided hot melt apparatus 15 may achieve an electrical ground path between object 8 and secondary object 14 .
- cable manager 11 may be present and operatively connected to hot melt apparatus 1 , where cable manager 11 is configured to provide positioning, placement and retention of cables, ropes, or tethers.
- cable manager 11 comprises a hook shape.
- hot melt apparatus 1 further comprises material manager 12 operatively connected to hot melt apparatus 1 .
- Material manager 12 may comprise a plow or similar shape to aid in providing for the movement, lifting, and retention of moveable surface materials of object 8 .
- thermoplastic material 2 may comprise an electrically conductive material which may further provide a grounding path through thermoplastic material 2 .
- thermoplastic material may be applied to a surface using hot melt apparatus 1 as described above in its various embodiments, where the various embodiments and their application methods illustrate a departure from the current art.
- Thermoplastic material 2 is brought in its solid form into contact with a surface via mechanical extrusion of thermoplastic material 2 and heater 4 used to heat thermoplastic material 2 to a temperature at or above a melting temperature of thermoplastic material 2 while maintaining the contact of thermoplastic material 2 with the surface.
- Thermoplastic material 2 may be electrically conductive and providing a grounding path through the electrically conductive thermoplastic material 2 .
- thermoplastic material 2 is allowed to cool to a temperature that is below thermoplastic material's 2 melting temperature and the heated thermoplastic material 2 allowed to bond hot melt apparatus 1 to the contacted surface 14 without a solvent or use of a curing chemical reaction when the heated thermoplastic material 2 is cooled to below the melting temperature of thermoplastic material 2 .
- Thermoplastic material 2 in solid form may further comprise a predetermined shape selected to comprise as shape that improves the bond of thermoplastic material 2 with the contacted surface.
- the shape typically comprises a predetermined geometric pattern.
- the method may further comprise varying a thickness of the selected shape of thermoplastic material 2 wherein the connection of rough or uneven surfaces are completed.
- separable interface 6 may be disposed intermediate heater 4 and thermoplastic material 2 , where separable interface 6 comprises upper portion 6 a connected to heater 4 and lower portion 6 b selectively attachable and detachable from upper portion 6 a which is substantially permanently attached to thermoplastic material 2 .
- separable interface 6 may be used to create an evenly distributed thermal transfer of heat into thermoplastic material 2 .
- hot melt apparatus 1 may be mechanically integrated onto and/or in to object 8 using mechanical integrator 7 to become a tool or structural extension of object 8 .
- hot melt apparatus 1 may be temporarily attached to placement device 10 using mechanical integrator 7 and subsequently disconnected from placement device 10 after a bond comprising thermoplastic material 2 is created to object 8 .
- hot melt apparatus 1 may be electrically integrated with object 8 using electrical integrator 9 and one or more electrical pathways provided from object 8 to support the operation of hot melt apparatus 1 . This may include temporarily attaching hot melt apparatus 1 to placement device 10 using electrical integrator 9 disconnecting placement device 10 from hot melt apparatus 1 after a bond comprising thermoplastic material 2 is created to object 8 .
- one or more electrically conductive cables 13 may be used to operatively interconnect electrical integrator 9 of a first hot melt apparatus 1 of the plurality of hot melt apparatuses 1 to electrical integrator 9 a second hot melt apparatus 1 of the plurality of hot melt apparatuses 1 .
- one or more electrical ground paths may be created through electrically conductive cable 13 when one or more of the plurality of hot melt apparatuses 1 are bonded separately to object 8 and, optionally, secondary object 14 .
- two or more of the plurality of hot melt apparatuses 1 may be interconnected by mechanical integrators 7 and electrical integrators 9 and used to bond object 8 to secondary object 1 .
- two or more hot melt apparatus 1 may be integrated within a common structural body 3 with thermoplastic material 2 at both ends to create a double-sided hot melt apparatus 15 .
- the double-sided hot melt apparatus 15 may be used to bond object 8 to secondary object 14 .
- heater 4 comprises an electro-chemical heater
- heater 4 may be activated using a low power electrical signal.
- heater 4 may be activated through mixing of chemicals in heater 4 .
- cooled thermoplastic material 2 may be reheated to allow removal of hot melt apparatus 1 from surface to which the thermoplastic material 2 has been bonded.
- multiple heating and cooling cycles of hot melt apparatus 1 may be allowed, further allowing use and reuse of hot melt apparatus 1 multiple times.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
- This application is a divisional application of U.S. patent application Ser. No. 16/037,930 filed on 17 Jul. 2018 and claims priority through U.S. Provisional Application 62/533,608, filed Jul. 17, 2017.
- A hot melt device comprising a heating device that is automatically or manually triggered to heat a pre-formed thermoplastic feedstock is recognized as an existing technology. Applications using such devices allow connection of objects to provide mechanical and./or electrical bonding and incorporate flexibility, repeatability and reusability of the connections.
- A hot melt apparatus typically includes a structural body, a heating element of various designs, and an automatic or manual control system to melt thermoplastic materials. In operation, mechanical extrusion of a heated thermoplastic material onto a surface to be joined as the thermoplastic material cools and solidifies is used.
- Various figures are included herein which illustrate aspects of embodiments of the disclosed inventions.
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FIG. 1 is a block diagrammatic view in partial perspective of a first exemplary system; -
FIG. 2 is an illustration of various shapes adapted to improve a bond ofthermoplastic material 2 with a the contacted surface; -
FIG. 3 is a block diagrammatic view in partial perspective of a second exemplary system where one or moreinterchangeable interfaces 5 are disposed intermediatestructural body 3 andheater 4 and comprisesupper portion 5 a connected tostructural body 3 andlower portion 5 b connected toheater 4, whereupper portion 5 a and lower portion 5 n are selectively disconnectable from each other; -
FIG. 4 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a separable interface; -
FIG. 5 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a mechanical integrator; -
FIG. 6 is a block diagrammatic view in partial perspective of a further exemplary system illustrating an electrical integrator; -
FIG. 7 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a mechanical integrator; -
FIG. 8 is a block diagrammatic view in partial perspective of a further exemplary system illustrating a mechanical integrator and an electrical integrator; -
FIG. 9 is a block diagrammatic view in partial perspective of a further exemplary system illustrating use of a cable manager; -
FIG. 10 is a block diagrammatic view in partial perspective of a further exemplary system illustrating an electrical integrator and various electrical ground paths; -
FIG. 11 is a block diagrammatic view in partial perspective of a further exemplary system; -
FIG. 12 is a block diagrammatic view in partial perspective of an exemplary system; -
FIG. 13 is a block diagrammatic view in partial perspective of a further exemplary system integrated within a commonstructural body 3 withthermoplastic material 2 at both ends to create a double sidedhot melt apparatus 15; and -
FIG. 14 is a view in partial perspective of an exemplary system illustrating that system in use. - Referring now to
FIG. 1 , in a first embodimenthot melt apparatus 1 comprisesstructural body 3;thermoplastic material 2, in a solid form, connected tostructural body 3, where the solid formthermoplastic material 2 is mechanically extrudable onto a surface to be joined as the heated solid formthermoplastic material 2 cools and solidifies; andcontrollable heater 4 connected to the structural body and to the solid formthermoplastic material 2,heater 4 controllable to heat the solid formthermoplastic material 2 to a temperature above its melting temperature and to allow the heated solid formthermoplastic material 2 to cool and solidify without the use of a solvent. - Referring additionally to
FIG. 2 , solid formthermoplastic material 2 may comprise a shapedthermoplastic material 2, where the shape is adapted to improve a bond ofthermoplastic material 2 with a the contacted surface. By way of example and not limitation, the shape may comprises a geometric profile and/or pattern and may further comprise varying thicknesses when melted wherein the connection of rough or uneven surfaces are completed. -
Heater 4 may be an electro-chemical heater activated using a low power electrical signal. In other embodiments,heater 4 may be chemical based and activated through mixing of various chemicals. - Referring additionally to
FIG. 3 , in embodimentshot melt apparatus 1 may further comprise one or moreinterchangeable interfaces 5 disposed intermediatestructural body 3 andheater 4.Interchangeable interface 5 may comprisesupper portion 5 a connected tostructural body 3 andlower portion 5 b connected toheater 4, whereupper portion 5 a and lower portion 5 n are selectively disconnectable from each other. In some of these embodiments,heater 4 andthermoplastic material 2 are integral and may be integrated to, but remain separable from,structural body 3. - Referring additionally to
FIG. 4 , in embodimentsseparable interface 6 is present and disposedintermediate heater 4 andthermoplastic material 2. Typically,separable interface 6 is adapted to create an evenly distributed thermal transfer of heat intothermoplastic material 2.Separable interface 6 comprises a metal, a plastic, a ceramic, or a composite, or the like, or a combination thereof. - In certain of these embodiments,
separable interface 6 comprisesupper portion 6 a connected toheater 4 andlower portion 6 b selectively detachable fromupper portion 6 a, wherelower portion 6 b is substantially permanently attached tothermoplastic material 2. - In embodiments
separable interface 6 further comprises a thermally conductive material and a heating element operative to melt thermoplastic material by transferring heat to the hot melt pad. - In other embodiments,
separable interface 6 comprises an electrically conductive material and the hot melt pad comprises a heater. For some of these embodiments,separable interface 6 further comprises an electrically conductive separable interface configured to provide a grounding path through the hot melt apparatus. - Referring additionally to
FIGS. 5 and 7 , in further embodimentshot melt apparatus 1 comprisesmechanical integrator 7 which is configured to allowhot melt apparatus 1 to be mechanically integrated toobject 8 such as to become a tool or structural extension ofobject 8. - Referring additionally to
FIGS. 6 and 10 in further embodimentshot melt apparatus 1 compriseselectrical integrator 9 which is configured to allowhot melt apparatus 1 to be electrically integrated toobject 8.Electrical integrator 9 provides a power and/or a ground path where power, and/or a ground, may be obtained fromobject 8 to support the operation ofhot melt apparatus 1. Electricallyconductive cable 13 may also be present in such embodiments and operatively in communication withelectrical integrator 9 at a first end and withobject 8 at a second end. Electricallyconductive cable 13 may be used to implement an electrical ground path betweenobject 8 and secondary object 14 (FIG. 10 ). - Referring additionally to
FIG. 11 , in embodiments comprising a pair ofhot melt apparatuses 1,electrical integrators 9 of the pair ofhot melt apparatuses 1 may be operatively connected by electricallyconductive cable 13 which may further be operative to create an electrical ground path when the pair ofhot melt apparatuses 1 are bonded separately toobject 8 andsecondary object 14. - In other embodiments where there is a plurality of
hot melt apparatuses 1, the plurality ofhot melt apparatuses 1 may be connected bymechanical integrators 7 andelectrical integrators 9 and one or more of the plurality ofhot melt apparatuses 1 used to bondobject 8 tosecondary object 14. These multiplehot melt apparatus 1 may be integrated in a number equal to the number ofobjects objects 8 to be joined. - Referring additionally to
FIG. 13 , the plurality ofhot melt apparatus 1, which may be a pair, may further be integrated within a commonstructural body 3 withthermoplastic material 2 at both ends to create a double sidedhot melt apparatus 15 which may be used to bondobject 8 tosecondary object 14. Double sidedhot melt apparatus 15 may achieve an electrical ground path betweenobject 8 andsecondary object 14. - Referring additionally to
FIG. 9 , for embodiments with cables,cable manager 11 may be present and operatively connected tohot melt apparatus 1, wherecable manager 11 is configured to provide positioning, placement and retention of cables, ropes, or tethers. In certain embodiments,cable manager 11 comprises a hook shape. - Still referring to
FIG. 9 , in one or more embodimentshot melt apparatus 1 further comprisesmaterial manager 12 operatively connected tohot melt apparatus 1.Material manager 12 may comprise a plow or similar shape to aid in providing for the movement, lifting, and retention of moveable surface materials ofobject 8. - In most of these embodiments,
thermoplastic material 2 may comprise an electrically conductive material which may further provide a grounding path throughthermoplastic material 2. - In the operation of exemplary embodiments, referring generally to
FIG. 14 , a thermoplastic material may be applied to a surface usinghot melt apparatus 1 as described above in its various embodiments, where the various embodiments and their application methods illustrate a departure from the current art. -
Thermoplastic material 2 is brought in its solid form into contact with a surface via mechanical extrusion ofthermoplastic material 2 andheater 4 used to heatthermoplastic material 2 to a temperature at or above a melting temperature ofthermoplastic material 2 while maintaining the contact ofthermoplastic material 2 with the surface.Thermoplastic material 2 may be electrically conductive and providing a grounding path through the electrically conductivethermoplastic material 2. - Once applied, as illustrated in
FIG. 2 , heatedthermoplastic material 2 is allowed to cool to a temperature that is below thermoplastic material's 2 melting temperature and the heatedthermoplastic material 2 allowed to bondhot melt apparatus 1 to the contactedsurface 14 without a solvent or use of a curing chemical reaction when the heatedthermoplastic material 2 is cooled to below the melting temperature ofthermoplastic material 2. -
Thermoplastic material 2 in solid form may further comprise a predetermined shape selected to comprise as shape that improves the bond ofthermoplastic material 2 with the contacted surface. The shape typically comprises a predetermined geometric pattern. Where the surface comprises a rough or uneven surface, the method may further comprise varying a thickness of the selected shape ofthermoplastic material 2 wherein the connection of rough or uneven surfaces are completed. - If present, as illustrated in
FIG. 4 ,separable interface 6 may be disposedintermediate heater 4 andthermoplastic material 2, whereseparable interface 6 comprisesupper portion 6 a connected toheater 4 andlower portion 6 b selectively attachable and detachable fromupper portion 6 a which is substantially permanently attached tothermoplastic material 2. In such embodiments,separable interface 6 may be used to create an evenly distributed thermal transfer of heat intothermoplastic material 2. - In embodiments comprising
mechanical integrator 7 and referring generally toFIG. 5 ,hot melt apparatus 1 may be mechanically integrated onto and/or in to object 8 usingmechanical integrator 7 to become a tool or structural extension ofobject 8. - In other embodiments,
hot melt apparatus 1 may be temporarily attached toplacement device 10 usingmechanical integrator 7 and subsequently disconnected fromplacement device 10 after a bond comprisingthermoplastic material 2 is created toobject 8. - In embodiments where
hot melt apparatus 1 further compriseselectrical integrator 9, and as generally illustrated inFIG. 8 ,hot melt apparatus 1 may be electrically integrated withobject 8 usingelectrical integrator 9 and one or more electrical pathways provided fromobject 8 to support the operation ofhot melt apparatus 1. This may include temporarily attachinghot melt apparatus 1 toplacement device 10 usingelectrical integrator 9disconnecting placement device 10 fromhot melt apparatus 1 after a bond comprisingthermoplastic material 2 is created toobject 8. - In embodiments comprising a plurality of
hot melt apparatuses 1, and as generally illustrated inFIG. 11 , one or more electricallyconductive cables 13 may be used to operatively interconnectelectrical integrator 9 of a firsthot melt apparatus 1 of the plurality ofhot melt apparatuses 1 to electrical integrator 9 a secondhot melt apparatus 1 of the plurality ofhot melt apparatuses 1. Additionally, one or more electrical ground paths may be created through electricallyconductive cable 13 when one or more of the plurality ofhot melt apparatuses 1 are bonded separately to object 8 and, optionally,secondary object 14. In other of these embodiments, two or more of the plurality ofhot melt apparatuses 1 may be interconnected bymechanical integrators 7 andelectrical integrators 9 and used tobond object 8 tosecondary object 1. - In other contemplated embodiments, and as generally illustrated in
FIGS. 13 and 14 , two or morehot melt apparatus 1 may be integrated within a commonstructural body 3 withthermoplastic material 2 at both ends to create a double-sidedhot melt apparatus 15. The double-sidedhot melt apparatus 15 may be used tobond object 8 tosecondary object 14. - Where
heater 4 comprises an electro-chemical heater,heater 4 may be activated using a low power electrical signal. - Where
heater 4 comprises a chemical based heater,heater 4 may be activated through mixing of chemicals inheater 4. - In most of the contemplated embodiments, cooled
thermoplastic material 2 may be reheated to allow removal ofhot melt apparatus 1 from surface to which thethermoplastic material 2 has been bonded. In these embodiments, multiple heating and cooling cycles ofhot melt apparatus 1 may be allowed, further allowing use and reuse ofhot melt apparatus 1 multiple times. - The foregoing disclosure and description of the inventions are illustrative and explanatory. Various changes in the size, shape, and materials, as well as in the details of the illustrative construction and/or an illustrative method may be made without departing from the spirit of the invention.
Claims (17)
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US17/010,641 US20200398498A1 (en) | 2017-07-17 | 2020-09-02 | Hot Melt Apparatus and Method of Use |
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US16/037,930 US10987875B2 (en) | 2017-07-17 | 2018-07-17 | Hot melt apparatus and method of use |
US17/010,641 US20200398498A1 (en) | 2017-07-17 | 2020-09-02 | Hot Melt Apparatus and Method of Use |
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US (4) | US10987875B2 (en) |
EP (2) | EP3797992A1 (en) |
WO (1) | WO2019018421A1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US10987875B2 (en) * | 2017-07-17 | 2021-04-27 | Oceaneering International, Inc. | Hot melt apparatus and method of use |
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US20110028061A1 (en) * | 2009-07-29 | 2011-02-03 | Airbus Operations Limited | Adjustable shim |
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DE2522357C3 (en) * | 1975-05-21 | 1980-04-24 | Hoechst Ag, 6000 Frankfurt | Blow extruder |
US4804110A (en) * | 1986-01-08 | 1989-02-14 | Charles R. Sperry | Apparatus, method and article for applying a melted adhesive |
CA2121222A1 (en) * | 1993-06-07 | 1994-12-08 | Bhalchandra B. Patil | Pipe wrap having a solid primer-adhesive layer |
US5691881A (en) * | 1995-05-16 | 1997-11-25 | Hewlett-Packard Company | Electronic device having E-PAC chassis for spatial arrangement of components and cable organization including channel with retaining wall preventing cable from dislodging from an edge connector |
US5691567A (en) * | 1995-09-19 | 1997-11-25 | National Semiconductor Corporation | Structure for attaching a lead frame to a heat spreader/heat slug structure |
WO1997042793A1 (en) * | 1996-05-06 | 1997-11-13 | Goldberg David A | Method of radiation heating substrates and applying extruded material |
US6499629B1 (en) * | 1999-05-28 | 2002-12-31 | Nordson Corporation | Dispensing apparatus for viscous liquids |
US20030086673A1 (en) * | 2001-11-07 | 2003-05-08 | Edward Zah | Method and apparatus for managing fiber optic cables |
US7626143B2 (en) * | 2005-02-17 | 2009-12-01 | Scott Richard Miller | Apparatus and method for processing hot melt adhesives |
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ES2624624T3 (en) * | 2012-12-05 | 2017-07-17 | Woodwelding Ag | Union of objects together |
US8905103B1 (en) * | 2013-02-14 | 2014-12-09 | The United States Of America As Represented By The Secretary Of The Navy | Tool for fastening an attachment element to a surface |
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US9845142B2 (en) * | 2014-08-15 | 2017-12-19 | The Boeing Company | Conductive thermoplastic ground plane for use in an aircraft |
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US20170131211A1 (en) * | 2015-11-10 | 2017-05-11 | University Of Washington | Systems for cell lysis and analyte detection and associated methods |
GB2547774B (en) * | 2016-01-11 | 2021-07-28 | Xergy Ltd | Advanced metal hydride heat transfer system utilizing an electrochemical hydrogen compressor |
DE102016008847A1 (en) * | 2016-07-23 | 2018-01-25 | Florian Eichenhofer | glue gun |
US10160160B1 (en) * | 2016-08-29 | 2018-12-25 | The United States Of America As Represented By The Secretary Of The Navy | Minimally invasive surface attachment apparatus |
US10987875B2 (en) * | 2017-07-17 | 2021-04-27 | Oceaneering International, Inc. | Hot melt apparatus and method of use |
-
2018
- 2018-07-17 US US16/037,930 patent/US10987875B2/en active Active
- 2018-07-17 EP EP20187539.0A patent/EP3797992A1/en active Pending
- 2018-07-17 EP EP18835348.6A patent/EP3655219A4/en active Pending
- 2018-07-17 WO PCT/US2018/042526 patent/WO2019018421A1/en unknown
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2020
- 2020-09-02 US US17/010,641 patent/US20200398498A1/en not_active Abandoned
- 2020-12-23 US US17/133,274 patent/US20210114310A1/en active Pending
- 2020-12-23 US US17/133,295 patent/US20210114311A1/en active Pending
Patent Citations (2)
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EP0504957A2 (en) * | 1991-03-19 | 1992-09-23 | The Boeing Company | Composite panels having aluminum fasteners and induction heating method of attachment |
US20110028061A1 (en) * | 2009-07-29 | 2011-02-03 | Airbus Operations Limited | Adjustable shim |
Also Published As
Publication number | Publication date |
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EP3655219A1 (en) | 2020-05-27 |
US10987875B2 (en) | 2021-04-27 |
US20210114311A1 (en) | 2021-04-22 |
EP3797992A1 (en) | 2021-03-31 |
US20190016060A1 (en) | 2019-01-17 |
WO2019018421A1 (en) | 2019-01-24 |
US20210114310A1 (en) | 2021-04-22 |
EP3655219A4 (en) | 2021-06-30 |
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