US20200035612A1 - Semiconductor structure and manufacturing method thereof - Google Patents
Semiconductor structure and manufacturing method thereof Download PDFInfo
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- US20200035612A1 US20200035612A1 US16/254,007 US201916254007A US2020035612A1 US 20200035612 A1 US20200035612 A1 US 20200035612A1 US 201916254007 A US201916254007 A US 201916254007A US 2020035612 A1 US2020035612 A1 US 2020035612A1
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- H01L23/5226—Via connections in a multilevel interconnection structure
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- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
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Definitions
- the manufacturing operations of the semiconductor device involve many steps and operations on such a small and thin semiconductor device.
- the manufacturing of the semiconductor device in a miniaturized scale becomes more complicated.
- An increase in a complexity of manufacturing the semiconductor device may cause deficiencies such as poor electrical interconnection, misalignment of components or other issues, resulting in a high yield loss of the semiconductor device.
- the semiconductor device is produced in an undesired configuration, which would further exacerbate materials wastage and thus increase the manufacturing cost.
- FIG. 1 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIG. 2 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIG. 3 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIG. 4 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIG. 5 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIGS. 6-19 are schematic views of manufacturing a semiconductor structure by a method of FIG. 5 in accordance with some embodiments of the present disclosure.
- FIG. 20 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure.
- FIGS. 6-17 and 21-23 are schematic views of manufacturing a semiconductor structure by a method of FIG. 20 in accordance with some embodiments of the present disclosure.
- first and second features are formed in direct contact
- additional features may be formed between the first and second features, such that the first and second features may not be in direct contact
- present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- spatially relative terms such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.
- the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
- the apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- the interconnect structure includes several conductive vias extended through one or more layers of the semiconductor structure and connected with conductive lines extended over one of layers of the semiconductor structure.
- the conductive vias extended through different layers and connects the conductive lines at different layers of the semiconductor structure.
- an overall size of the semiconductor structure becomes smaller and smaller.
- an overlay issue may occur between two conductive vias disposed over each other.
- the conductive vias may not be disposed accurately and thus may not vertically align with each other.
- a space between neighboring conductive vias also becomes smaller and smaller. Therefore, the neighboring conductive vias at the same layer may be easily bridged by the conductive via disposed at the above layer, which leads to failure of electrical connection. As a result, reliability of the semiconductor structure would be adversely affected.
- a semiconductor structure in the present disclosure, includes a first conductive member surrounded by a first dielectric layer, and a second conductive member disposed over the first conductive member and surrounded by a second dielectric layer and a third dielectric layer.
- the second conductive member includes a first portion and a second portion disposed over and coupled with the first portion. The first portion is extended through and surrounded by the second dielectric layer, and the second portion is surrounded by the third dielectric layer.
- a contour of the second conductive member with a step is formed by the first portion and the second portion of the second conductive member.
- a width of the first portion is substantially less than a width of the second portion.
- the second conductive member with the step contour can increase a clearance between the second conductive member and a conductive member neigbouring with the first conductive member. Therefore, undesirable contact with the conductive member neigbouring with the first conductive member can be prevented.
- a method of manufacturing a semiconductor structure includes providing a first dielectric layer and a first conductive member surrounded by the first dielectric layer; disposing a first protective layer over the first dielectric layer and the first conductive member; disposing a second dielectric layer over the first protective layer; disposing a second protective layer over the second dielectric layer; disposing a third dielectric layer over the second protective layer; removing a portion of the second dielectric layer; removing a portion of the third dielectric layer; and disposing a conductive material to form a second conductive member.
- the second conductive member includes a first portion surrounded by the second dielectric layer and a second portion surrounded by the third dielectric layer.
- a width of the first portion is substantially less than a width of the second portion.
- a step contour of the second dielectric layer and the third dielectric layer is formed by the removal of the portion of the second dielectric layer and the portion of the third dielectric layer.
- a clearance between the second conductive member and a conductive member neigbouring with the first conductive member can be increased.
- FIG. 1 is a schematic cross sectional view of a semiconductor structure 100 in accordance with various embodiments of the present disclosure.
- the semiconductor structure 100 includes a first dielectric layer 101 , a first conductive member 102 , a first protective layer 103 , a second dielectric layer 104 , a second protective layer 105 , a third dielectric layer 106 and a second conductive member 107 .
- the semiconductor structure 100 is a part of a wafer, a die or a package.
- the semiconductor structure 100 is configured to connect with another semiconductor structure such as a die, a package, a printed circuit board (PCB) or the like.
- PCB printed circuit board
- the semiconductor structure 100 includes a substrate under the first dielectric layer 101 and the first conductive member 101 .
- the substrate includes semiconductive materials such as silicon or other suitable materials.
- the substrate is a silicon substrate or silicon wafer.
- the first dielectric layer 101 surrounds the first conductive member 102 .
- the first dielectric layer 101 includes a low dielectric constant (k) material such as silicon oxide (SiO), porous organosilicate (SiOCH), borophosphosilicate glass (BPSG), phosphosilicate glass (PSG) or the like.
- the first conductive member 102 is extended through and surrounded by the first dielectric layer 101 .
- the first conductive member 102 includes a first surface 102 a and a second surface 102 b opposite to the first surface 102 a.
- the first conductive member 102 is extended between the first surface 102 a and the second surface 102 b.
- the first conductive member 102 includes conductive material such as copper (Cu), aluminum (Al), cobalt (Co), titanium (Ti), tungsten (W), ruthenium (Ru), molybdenum (Mo), iridium (Ir), rhodium (Rh) or the like.
- the second surface 102 b of the first conductive member 102 is exposed. In some embodiments, the second surface 102 b is configured to receive a conductive line or a conductive structure to connect a circuitry of the semiconductor structure 100 with a circuitry of another semiconductor structure. In some embodiments, a height of the first conductive member 102 is substantially the same as a thickness of the first dielectric layer 101 . In some embodiments, the height of the first conductive member 102 and the thickness of the first dielectric layer 101 are respectively about 50 ⁇ to about 500 ⁇ .
- a first barrier layer 102 c surrounds the first conductive member 102 .
- the first barrier layer 102 c is a diffusion barrier layer.
- the first barrier layer 102 c is configured to prevent diffusion from the first conductive member 102 to the first dielectric layer 101 and provide adhesion between the first conductive member 102 and the first dielectric layer 101 .
- the first barrier layer 102 c is disposed between the first conductive member 102 and the first dielectric layer 101 .
- the first barrier layer 102 c includes tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), tantalum (Ta) or the like.
- a capping layer 101 d is disposed over the first conductive member 102 . In some embodiments, the capping layer 101 d is disposed over the first surface 102 a of the first conductive member 102 . In some embodiments, the capping layer 101 d is surrounded by the first dielectric layer 101 . In some embodiments, the capping layer 101 d is disposed over the first barrier layer 102 c. In some embodiments, the capping layer 102 d includes cobalt (Co), tantalum (Ta), tungsten (W), platinum (Pt) or the like.
- the first protective layer 103 is disposed over the first dielectric layer 101 and the first conductive member 102 . In some embodiments, the first protective layer 103 is in contact with the first dielectric layer 101 . In some embodiments, the first protective layer 103 is disposed over and in contact with the capping layer 102 d. In some embodiments, the first protective layer 103 is an etch stop layer configured to stop etching operations. In some embodiments, the first protective layer 103 includes nitride. In some embodiments, the first protective layer 103 includes dielectric material such as silicon nitride (SiN), silicon oxide (SiO), aluminum oxynitride (AlON), silicon carbon nitride (SiCN) or the like.
- the second dielectric layer 104 is disposed over the first protective layer 103 . In some embodiments, the second dielectric layer 104 is disposed over the first dielectric layer 101 and the first conductive member 102 . In some embodiments, the second dielectric layer 104 includes material same as or different from the first dielectric layer 101 . In some embodiments, the first dielectric layer 101 includes a low dielectric constant (k) material such as silicon oxide (SiO), porous organosilicate (SiOCH), borophosphosilicate glass (BPSG), phosphosilicate glass (PSG) or the like.
- k low dielectric constant
- the second protective layer 105 is disposed over the second dielectric layer 104 . In some embodiments, the second protective layer 105 is disposed over the first protective layer 103 , the first conductive member 102 and the first dielectric layer 101 . In some embodiments, the second protective layer 105 is an etch stop layer configured to stop etching operations. In some embodiments, the second protective layer 106 includes material same as or different from the first protective layer 103 . In some embodiments, the second protective layer 105 includes nitride. In some embodiments, the second protective layer 105 includes dielectric material such as silicon nitride (SiN), silicon oxide (SiO), aluminum oxynitride (AlON), silicon carbon nitride (SiCN) or the like.
- the third dielectric layer 106 is disposed over the second dielectric layer 104 . In some embodiments, the third dielectric layer 106 is disposed over the second protective layer 105 , the first protective layer 103 , the first conductive member 102 and the first dielectric layer 101 . In some embodiments, the second protective layer 105 is disposed between the second dielectric layer 104 and the third dielectric layer 106 . In some embodiments, the third dielectric layer 106 surrounds the second conductive member 107 . In some embodiments, the third dielectric layer 106 includes material same as or different from the first dielectric layer 101 and the second dielectric layer 104 .
- the third dielectric layer 106 includes a low dielectric constant (k) material such as silicon oxide (SiO), porous organosilicate (SiOCH), borophosphosilicate glass (BPSG), phosphosilicate glass (PSG) or the like.
- k low dielectric constant
- the second conductive member 107 is disposed over the first dielectric layer 101 and the first conductive member 102 . In some embodiments, the second conductive member 107 is extended through and surrounded by the third dielectric layer 106 , the second protective layer 105 , the second dielectric layer 104 and the first protective layer 103 . In some embodiments, the second conductive member 107 includes conductive material such as copper (Cu), aluminum (Al), cobalt (Co), titanium (Ti), tungsten (W), ruthenium (Ru), molybdenum (Mo), iridium (Ir), rhodium (Rh) or the like.
- the second conductive member 107 includes a first portion 107 a and a second portion 107 b. In some embodiments, the first portion 107 a is extended through and surrounded by the first protective layer 103 and the second dielectric layer 104 . In some embodiments, the first portion 107 is disposed over the first conductive member 102 and the first dielectric layer 101 . In some embodiments, the first portion 107 a covers a portion of the first conductive member 102 and a portion of the first dielectric layer 101 .
- the second portion 107 b is disposed over and coupled with the first portion 107 a. In some embodiments, the second portion 107 b is surrounded by the third dielectric layer 106 and the second dielectric layer 105 . In some embodiments, a first width W 1 of the first portion 107 a of the second conductive member 107 is substantially less than a second width W 2 of the second portion 107 b of the second conductive member 107 . In some embodiments, the first width W 1 is about 10 ⁇ to about 300 ⁇ . In some embodiments, the second width W 2 is about 16 ⁇ to about 600 ⁇ .
- At least a portion of the second portion 107 b of the second conductive member 107 is protruded from the first portion 107 a of the second conductive member 107 . In some embodiments, the portion of the second portion 107 b is protruded from the first portion 107 a in a third width W 3 of about 3 ⁇ to about 150 ⁇ . In some embodiments, at least a portion 104 a of the second dielectric layer 104 is disposed between the first protective layer 103 and the second portion 107 b of the second conductive member 107 . In some embodiments, the portion 104 a of the second dielectric layer 104 is protruded into the second conductive member 107 . In some embodiments, an outer surface of the first portion 107 a and the second portion 107 b includes a step contour.
- the first portion 107 a includes a third surface 107 d interfacing with the first protective layer 103 and the second dielectric layer 104 .
- the second portion 107 b includes a fourth surface 107 e interfacing with the second protective layer 105 and the third dielectric layer 106 .
- the third surface 107 d is substantially parallel to the fourth surface 107 e.
- the third surface 107 d and the fourth surface 107 e are substantially orthogonal to the first surface 102 a of the first conductive member 102 .
- the third surface 107 d and the fourth surface 107 e are vertical surfaces.
- the fourth surface 107 e is protruded from the third surface 107 d.
- the fourth surface 107 e is protruded from the third surface 107 d in the third width W 3 .
- the second conductive member 107 includes a third portion 107 c disposed above the second portion 107 b and the first portion 107 a. In some embodiments, the third portion 107 c is coupled with the second portion 107 b. In some embodiments, the third portion 107 c is surrounded by the third dielectric layer 106 . In some embodiments, a fourth width W 4 of the third portion 107 c is substantially greater than the first width W 1 of the first portion 107 a and the second width W 2 of the second portion 107 b.
- a second barrier layer 107 f surrounds the second conductive member 107 .
- the second barrier layer 107 f is a diffusion barrier layer.
- the second barrier layer 107 f is configured to prevent diffusion from the second conductive member 107 to the third dielectric layer 106 and the second dielectric layer 104 , and provide adhesion between the second conductive member 107 and the third dielectric layer 106 and between the second conductive member 107 and the second dielectric layer 104 .
- the second barrier layer 107 f is disposed between the second conductive member 107 and the third dielectric layer 106 .
- the second barrier layer 107 f is disposed between the second conductive member 107 and the second dielectric layer 104 . In some embodiments, the second barrier layer 107 f is disposed between the second conductive member 107 and the first protective layer 103 . In some embodiments, the second barrier layer 107 f is disposed between the second conductive member 107 and the second protective layer 105 . In some embodiments, the second barrier layer 107 f includes tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), tantalum (Ta) or the like.
- the first portion 107 a of the second conductive member 107 is disposed above the first conductive member 102 and the first dielectric layer 101 . In some embodiments as shown in FIG. 1 , the second conductive member 107 is not vertically aligned with the first conductive member 102 . In some embodiments, a central axis of the second conductive member 107 is deviated from a central axis of the first conductive member 102 . In some embodiments, the first portion 107 a of the second conductive member 107 is not vertically aligned with the first conductive member 102 . In some embodiments, a central axis of the first portion 107 a is deviated from the central axis of the first conductive member 102 . In some embodiments, the first portion 107 is disposed above the first conductive member 102 and the first dielectric layer 101 . In some embodiments, the first portion 107 covers or is in contact with a portion of the first dielectric layer 101 .
- the first portion 107 a of the second conductive member 107 is disposed above the first conductive member 102 .
- the second conductive member 107 is vertically aligned with the first conductive member 102 .
- the central axis of the second conductive member 107 is overlapped and common with the central axis of the first conductive member 102 .
- the first portion 107 a of the second conductive member 107 is vertically aligned with the first conductive member 102 .
- the central axis of the first portion 107 a is overlapped and common with the central axis of the first conductive member 102 .
- the first portion 107 is disposed above the first conductive member 102 .
- the first portion 107 does not cover and is not in contact with the first dielectric layer 101 .
- the second portion 107 b of the second conductive member 107 is tapered towards the first portion 107 a of the second conductive member 107 .
- the first portion 107 of the second conductive member 107 is tapered towards the first conductive member 102 .
- a first angle ⁇ of the third surface 107 d relative to the first surface 102 a of the first conductive member 102 is about 90° to about 160°.
- a second angle ⁇ of the fourth surface 107 e relative to the first surface 102 a of the first conductive member 102 is about 90° to about 160°.
- the first angle ⁇ is substantially the same as the second angle ⁇ .
- the third surface 107 d of the first portion 107 a and the fourth surface 107 e of the second portion 107 b are tilted surfaces.
- the second angle ⁇ is substantially greater than the first angle ⁇ .
- the third surface 107 d is a vertical surface and the fourth surface 107 e is a tilted surface.
- a third conductive member 108 is disposed over the second conductive member 107 .
- the third conductive member 108 is surrounded by the third dielectric layer 106 .
- the second portion 107 b of the second conductive member 107 is protruded into the third conductive member 108 .
- the second portion 107 b includes a dome shaped contour.
- the second portion 107 b includes a convex surface 107 g curving towards the third conductive member 108 .
- the convex surface 107 g is surrounded by the third dielectric layer 106 .
- the third conductive member 108 includes a concave surface 108 a curving away from the second conductive member 107 . In some embodiments, a curved interface is disposed between the second portion 107 b of the second conductive member 107 and the third conductive member 108 .
- the third conductive member 108 includes a fifth width W 5 and a sixth width W 6 .
- the fifth width W 5 is a shortest width of the third conductive member 108 .
- the sixth width W 6 is a longest width of the third conductive member 108 .
- the fifth width W 5 is substantially less than the sixth width W 6 .
- the third conductive member 108 includes conductive material such as copper (Cu), aluminum (Al), cobalt (Co), titanium (Ti), tungsten (W), ruthenium (Ru) , molybdenum (Mo), iridium (Ir), rhodium (Rh) or the like.
- the second portion 107 b of the second conductive member 107 is tapered towards the first portion 107 a of the second conductive member 107 .
- the third conductive member 108 is tapered towards the second conductive member 107 .
- the third conductive member 108 includes a fifth surface 108 c interfacing with the third dielectric layer 106 .
- the fourth surface 107 is substantially parallel to the fifth surface 108 c.
- the fourth surface 107 e of the second portion 107 b and the fifth surface 108 c of the third conductive member 108 are tilted surfaces.
- the fourth surface 107 e and the fifth surface 108 c have substantially the same gradient.
- a third barrier layer 108 b surrounds the third conductive member 108 .
- the third barrier layer 108 b is a diffusion barrier layer.
- the third barrier layer 108 b is configured to prevent diffusion from the third conductive member 108 to the third dielectric layer 106 and provide adhesion between the third conductive member 108 and the third dielectric layer 106 .
- the third barrier layer 108 b is disposed over the second portion 107 b of the second conductive member 107 .
- the second conductive member 107 is separated from the third conductive member 108 by the third barrier layer 108 .
- the third barrier layer 108 b is disposed between the third conductive member 108 and the third dielectric layer 106 . In some embodiments, the third barrier layer 108 b is disposed between the third conductive member 108 and the second conductive member 107 . In some embodiments, the third barrier layer 108 b includes tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), tantalum (Ta) or the like.
- a method of manufacturing a semiconductor structure is also disclosed.
- a semiconductor structure 100 , 200 or 300 is formed by a method 500 .
- the method 500 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations.
- FIG. 5 is an embodiment of the method 500 of manufacturing the semiconductor structure 100 , 200 or 300 .
- the method 500 includes a number of operations ( 501 , 502 , 503 , 504 , 505 , 506 , 507 , 508 , 509 , 510 and 511 ).
- a first dielectric layer 101 and a first conductive member 102 are provided as shown in FIG. 6 .
- the first conductive member 102 is surrounded by the first dielectric layer 101 .
- the first conductive member 102 is extended through the first dielectric layer 101 .
- the first conductive member 102 includes a first surface 102 a and a second surface 102 b opposite to the first surface 102 a.
- the first dielectric layer 101 is formed by spin coating, chemical vapor deposition (CVD), plasma enhanced CVD (PECVD) or any other suitable operations.
- the first conductive member 102 is formed by removing a portion of the first dielectric layer 101 to form a hole and disposing a conductive material into the hole.
- the removal of the portion of the first dielectric layer 101 includes photolithography, etching or any other suitable operations.
- the disposing of the conductive material includes sputtering, electroplating or any other suitable operations.
- a substrate is provided before the disposing of the first dielectric layer 101 and the first conductive member 102 .
- the first dielectric layer 101 and the first conductive member 102 are disposed over the substrate.
- the substrate is configured to support components of the semiconductor structure during the method 500 .
- the components of the semiconductor structure are formed over the substrate during the method 500 .
- a first barrier layer 102 c is formed before the formation of the first conductive member 102 . In some embodiments, the first barrier layer 102 c surrounds the first conductive member 102 . In some embodiments, the first barrier layer 102 c is disposed conformal to the hole of the first dielectric layer 101 , and then the first conductive member 102 is disposed over the first barrier layer 102 c. In some embodiments, the first barrier layer 102 c is disposed by deposition, electroless plating or any other suitable operations.
- a capping layer 102 d is formed over the first conductive member 102 and the first barrier layer 102 c. In some embodiments, the capping layer 102 d is surrounded by the first dielectric layer 101 . In some embodiments, the capping layer 102 d is formed by CVD, sputtering or any other suitable operations. In some embodiments, the first dielectric layer 101 , the first conductive member 102 , the first barrier layer 102 c and the capping layer 102 d are in configurations as described above or shown in FIGS. 1-4 .
- a first protective layer 103 is disposed over the first dielectric layer 101 and the first conductive member 102 as shown in FIG. 7 .
- the first protective layer 103 is disposed over the capping layer 102 d.
- the first protective layer 103 is an etch stop layer configured to stop etching operations.
- the first protective layer 103 is formed by CVD, PECVD or any other suitable operations.
- the first protective layer 103 is in configuration as described above or shown in FIGS. 1-4 .
- a second dielectric layer 104 is disposed over the first protective layer 103 as shown in FIG. 8 .
- the second dielectric layer 104 is disposed conformal to the first protective layer 103 .
- the second dielectric layer 104 is formed by spin coating, CVD, PECVD or any other suitable operations.
- the second dielectric layer 104 is in configuration as described above or shown in FIGS. 1-4 .
- a second protective layer 105 is disposed over the second dielectric layer 104 as shown in FIG. 9 .
- the second protective layer 105 is disposed conformal to the second dielectric layer 104 .
- the second protective layer 105 is an etch stop layer configured to stop etching operations.
- the second protective layer 105 is formed by CVD, PECVD or any other suitable operations.
- the second protective layer 105 is in configuration as described above or shown in FIGS. 1-4 .
- a third dielectric layer 106 is disposed over the second protective layer 105 as shown in FIG. 10 .
- the third dielectric layer 106 is formed by spin coating, CVD, PECVD or any other suitable operations.
- the third dielectric layer 106 is in configuration as described above or shown in FIGS. 1-4 .
- a dielectric mask 109 is disposed over the third dielectric layer 106 , and a hard mask 110 is formed over the dielectric mask 109 as shown in FIG. 11 .
- the dielectric mask 109 is configured to protect the third dielectric layer 106 from removal.
- the dielectric mask 109 includes silicon oxide or any other suitable materials.
- the dielectric mask 109 is formed by CVD or any other suitable operations.
- a portion of the hard mask 110 is removed to pattern the hard mask 110 .
- the hard mask 110 is patterned by disposing a first photoresist over the hard mask 110 , patterning the first photoresist and removing the portion of the hard mask 110 exposed from the patterned first photoresist.
- the first photoresist is disposed by spin coating or any other suitable operations.
- the first photoresist is patterned by exposing a portion of the first photoresist from a photomask, projecting a predetermined electromagnetic radiation towards the photomask and the exposed portion of the first photoresist, and removing the exposed portion of the first photoresist.
- the patterned hard mask 110 is formed as shown in FIG. 11 .
- the dielectric mask 109 covers the third dielectric layer 106 after the patterning of the hard mask 110 .
- the first photoresist is removed after the patterning of the hard mask 110 .
- the first photoresist is removed by wet etching, stripping or any other suitable operations.
- a first portion 106 a of the third dielectric layer 106 is removed to form a first opening 106 b as shown in FIGS. 12-14 .
- a second photoresist 111 is disposed over the hard mask 110 and the dielectric mask 109 .
- the second photoresist 111 is disposed by spin coating or any other suitable operations.
- the second photoresist 111 is patterned by exposing a portion of the second photoresist 111 from a photomask, projecting a predetermined electromagnetic radiation towards the photomask and the exposed portion of the second photoresist 111 , and removing the exposed portion of the second photoresist 111 .
- a patterned second photoresist 111 is formed as shown in FIG. 12 .
- a portion of the dielectric mask 109 is exposed from the patterned second photoresist 111 .
- the exposed portion of the dielectric mask 109 and the first portion 106 a of the third dielectric layer 106 under the exposed portion of the dielectric mask 109 are removed as shown in FIG. 13 .
- the exposed portion of the dielectric mask 109 and the first portion 106 a of the third dielectric layer 106 are removed by dry etching or any other suitable operations.
- the first opening 106 b is formed after the removal of the first portion 106 a of the third dielectric layer 106 .
- the first opening 106 b is extended through the third dielectric layer 106 .
- a first width W 1 the first opening 106 b is about 10 ⁇ to about 300 ⁇ . In some embodiments, the first opening 106 b is not aligned with the first conductive member 102 as shown in FIG. 13 . In some embodiments, the first opening 106 b is disposed above and aligned with the first conductive member 102 . In some embodiments, a first portion 105 a of the second protective layer 105 is exposed after the formation of the first opening 106 b. In some embodiments, the second photoresist 111 is removed after the formation of the first opening 106 b as shown in FIG. 14 . In some embodiments, the second photoresist 111 is removed by wet etching, stripping or any other suitable operations.
- the first portion 105 a of the second protective layer 105 exposed by the first opening 106 b is removed as shown in FIG. 15 .
- the first portion 105 a of the second protective layer 105 is removed by wet etching or any other suitable operations.
- a first portion 104 b of the second dielectric layer 104 is exposed from the second protective layer 105 after the removal of the first portion 105 a of the second protective layer 105 .
- a second portion 106 c of the third dielectric layer 106 is uncovered by the hard mask 110 .
- the second portion 106 c of the third dielectric layer 106 is removed to form a second opening 106 d as shown in FIG. 16 .
- the second portion 106 c of the third dielectric layer 106 is removed by dry etching or any other suitable operations.
- more of the third dielectric layer 106 adjacent to the hard mask 109 is etched compared with the third dielectric layer 106 away from the hard mask 109 and close to the first dielectric layer 101 .
- the second opening 106 d has a step contour after the removal of the second portion 106 c of the third dielectric layer 106 .
- the second opening 106 d is tapered towards the first conductive member 102 and the second dielectric layer 104 .
- a second portion 105 b of the second protective layer 105 is exposed by the second opening 106 d after the removal of the second portion 106 c of the third dielectric layer 106 .
- the dielectric mask 109 uncovered by the hard mask 110 is removed before or upon the removal of the second portion 106 c of the third dielectric layer 106 .
- the first portion 104 b of the second dielectric layer 104 exposed from the second protective layer 105 is removed to form a third opening 104 c as shown in FIG. 16 .
- the first portion 104 b of the second dielectric layer 104 is removed by dry etching or any other suitable operations.
- a portion 103 a of the first protective layer 103 is exposed by the third opening 104 c after removal of the first portion 104 b of the second dielectric layer 104 .
- the second portion 106 c of the third dielectric layer 106 and the first portion 104 b of the second dielectric layer 104 are removed separately or simultaneously.
- the operation 508 and the operation 509 are performed separately or simultaneously.
- a width of the third opening 104 c is substantially the same as the first width W 1 of the first opening 106 b.
- a second width W 2 of the second opening 106 d is substantially greater than the width of the third opening 104 c.
- the second opening 106 d is tapered towards the third opening 104 c.
- the portion 103 a of the first protective layer 103 exposed by the third opening 104 c and a second portion 105 b of the second protective layer 105 exposed by the second opening 106 d are removed as shown in FIG. 17 .
- the portion 103 a of the first protective layer 103 and the second portion 105 b of the second protective layer 105 are removed by wet etching or any other suitable operations.
- the removal of the portion 103 a of the first protective layer 103 and the removal of the second portion 105 b of the second protective layer 105 are performed separately or simultaneously.
- a portion 104 a of the second dielectric layer 104 is exposed by the second opening 106 d after the removal of the second portion 105 b of the second protective layer 105 . In some embodiments, the portion 104 a of the second dielectric layer 104 is laterally protruded. In some embodiments, the first conductive member 102 or the capping layer 102 d is exposed after the removal of the portion 103 a of the first protective layer 103 .
- a conductive material 112 is disposed into the second opening 106 d and the third opening 104 c to form a second conductive member 107 as shown in FIGS. 18-19 .
- the conductive material 112 is disposed over the third dielectric layer 106 .
- the conductive material 112 is disposed over the dielectric mask 109 and the hard mask 110 .
- the conductive material 112 is formed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations.
- a second barrier layer 107 f is disposed conformal to the second opening 106 d and the third opening 104 c before the disposing of the conductive material 112 .
- the second barrier layer 107 f is formed, and then the conductive material 112 is disposed over the second barrier layer 107 f.
- the second barrier layer 107 f is disposed over the third dielectric layer 106 .
- the second barrier layer 107 f is disposed over the dielectric mask 109 and the hard mask 110 .
- the second barrier layer 107 f is disposed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations.
- the second conductive member 107 is formed after planarization of the conductive material 112 . In some embodiments as shown in FIG. 19 , some of the conductive material 112 are removed to form the second conductive member 107 . In some embodiments, some of the second barrier layer 107 f disposed over the third dielectric layer 106 , some of the conductive material 112 disposed over the third dielectric layer 106 , the dielectric mask 109 and the hard mask 110 are removed by chemical mechanical planarization (CMP) or any other suitable operations. In some embodiments, the second conductive member 107 is in configurations as described above or shown in FIGS. 1-3 . In some embodiments, a semiconductor structure 100 described above and shown in FIG. 1 is formed.
- CMP chemical mechanical planarization
- a semiconductor structure 200 having the second conductive member 107 aligned with the first conductive member 102 as described above or shown in FIG. 2 is formed.
- a semiconductor structure 300 having tapered second conductive member 107 as described above or shown in FIG. 3 is formed.
- a method of manufacturing a semiconductor structure is also disclosed.
- a semiconductor structure is formed by a method 600 .
- the method 600 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations.
- FIG. 20 is an embodiment of the method 600 of manufacturing a semiconductor structure.
- the method 600 includes a number of operations ( 601 , 602 , 603 , 604 , 605 , 606 , 607 , 608 , 609 , 610 , 611 and 612 ).
- a first dielectric layer 101 and a first conductive member 102 are provided as shown in FIG. 6 .
- the operation 601 is substantially the same as the operation 501 .
- a first protective layer 103 is disposed over the first dielectric layer 101 and the first conductive member 102 as shown in FIG. 7 .
- the operation 602 is substantially the same as the operation 502 .
- a second dielectric layer 104 is disposed over the first protective layer 103 as shown in FIG. 8 .
- the operation 603 is substantially the same as the operation 503 .
- a second protective layer 105 is disposed over the second dielectric layer 104 as shown in FIG. 9 .
- the operation 604 is substantially the same as the operation 504 .
- a third dielectric layer 106 is disposed over the second protective layer 105 as shown in FIG. 10 .
- the operation 605 is substantially the same as the operation 505 .
- a hard mask 110 is formed over the third dielectric layer 106 as shown in FIG. 11
- a first portion 106 a of the third dielectric layer 106 is removed to form a first opening 106 b as shown in FIGS. 12-14 .
- the operation 606 is substantially the same as the operation 506 .
- operation 607 the first portion 105 a of the second protective layer 105 exposed by the first opening 106 b is removed as shown in FIG. 15 .
- the operation 607 is substantially the same as the operation 507 .
- the second portion 106 c of the third dielectric layer 106 is removed to form a second opening 106 d as shown in FIG. 16 .
- the operation 608 is substantially the same as the operation 508 .
- the first portion 104 b of the second dielectric layer 104 exposed from the second protective layer 105 is removed to form a third opening 104 c as shown in FIG. 16 .
- the operation 609 is substantially the same as the operation 509 .
- a first conductive material is disposed to form a second conductive member 107 as shown in FIG. 21 .
- the first conductive material is disposed into the second opening 106 d and the third opening 104 c to form the second conductive member 107 .
- the first conductive material is disposed by electroless plating, CVD or any other suitable operations.
- the first conductive material is grown within the third opening 104 c and a portion of the second opening 106 d to form the second conductive member 107 .
- the second conductive member 107 is surrounded by the first protective layer 103 , the second dielectric layer 104 , the second protective layer 105 and the third dielectric layer 106 .
- the first conductive material is grown to form the second conductive member 107 having a step contour.
- the second conductive member 107 includes a first portion 107 a and a second portion 107 b over the first portion 107 a.
- the first portion 107 a is surrounded by the first protective layer 103 and the second dielectric layer 104 .
- the second portion 107 b is surrounded by the second protective layer 105 and the third dielectric layer 106 .
- the first conductive material is grown to form the second portion 107 b of the second conductive member 107 having a dome shaped contour.
- the second portion 107 b includes a convex surface 107 g curving towards the second opening 106 d.
- the first portion 107 a includes a third surface 107 d interfacing with the first protective layer 103 and the second dielectric layer 104 .
- the second portion 107 b includes a fourth surface 107 e interfacing with the second protective layer 105 and the third dielectric layer 106 .
- the third surface 107 d is substantially parallel to the fourth surface 107 e.
- the fourth surface 107 e is tapered towards the first conductive member 102 .
- the second conductive member 107 is in configuration as described above or shown in FIG. 4 .
- a second conductive material 112 is disposed to form a third conductive member 108 as shown in FIGS. 22-23 .
- the second conductive member 107 and the third conductive member 108 are separately formed.
- the second conductive material 112 is disposed into the second opening 106 d and over the third dielectric layer 106 .
- the second conductive material 112 is disposed over the dielectric mask 109 and the hard mask 110 .
- the second conductive material 112 is formed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations.
- the third conductive member 108 includes a concave surface 108 a curving away from the second conductive member 107 .
- a third barrier layer 108 b is disposed conformal to the convex surface 107 g of the second conductive member 107 and the second opening 106 d before the disposing of the second conductive material 112 .
- the third barrier layer 108 b is formed, and then the second conductive material 112 is disposed over the second barrier layer 107 f.
- the third barrier layer 108 b is disposed over the third dielectric layer 106 .
- the third barrier layer 108 b is disposed over the dielectric mask 109 and the hard mask 110 .
- the third barrier layer 108 b is disposed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations. Since an interface between the second conductive member 107 and the third conductive member 108 or between the second conductive member 107 and the third barrier layer 108 b is curved, a contacting surface between the second conductive member 107 and the third conductive member 108 or between the second conductive member 107 and the third barrier layer 108 b is increased. As such, adhesion between the second conductive member 107 and the third conductive member 108 or between the second conductive member 107 and the third barrier layer 108 b is improved.
- the third conductive member 108 is formed after planarization of the second conductive material 112 . In some embodiments as shown in FIG. 23 , some of the second conductive material 112 are removed to form the third conductive member 108 . In some embodiments, some of the third barrier layer 108 b disposed over the third dielectric layer 106 , some of the second conductive material 112 disposed over the third dielectric layer 106 , the dielectric mask 109 and the hard mask 110 are removed by chemical mechanical planarization (CMP) or any other suitable operations. In some embodiments, the third conductive member 108 is in configurations as described above or shown in FIG. 4 . In some embodiments, a semiconductor structure 400 described above and shown in FIG. 4 is formed.
- CMP chemical mechanical planarization
- a semiconductor structure includes a first dielectric layer; a first conductive member extended through and surrounded by the first dielectric layer; a first protective layer disposed over the first dielectric layer and the first conductive member; a second dielectric layer disposed over the first protective layer; a third dielectric layer disposed over the second dielectric layer; and a second conductive member disposed over the first dielectric layer and the first conductive member, and surrounded by the first protective layer, the second dielectric layer and the third dielectric layer, wherein the second conductive member includes a first portion and a second portion disposed over and coupled with the first portion, the first portion is extended through and surrounded by the first protective layer and the second dielectric layer, the second portion is surrounded by the third dielectric layer, at least a portion of the second dielectric layer is disposed between the first protective layer and the second portion of the second conductive member.
- a first width of the first portion of the second conductive member is substantially less than a second width of the second portion of the second conductive member. In some embodiments, at least a portion of the second portion of the second conductive member is protruded from the first portion of the second conductive member. In some embodiments, the second portion of the second conductive member is tapered towards the first portion of the second conductive member. In some embodiments, the first portion of the second conductive member is tapered towards the first conductive member. In some embodiments, the first portion of the second conductive member is disposed above the first conductive member. In some embodiments, the first portion of the second conductive member is disposed above the first conductive member and the first dielectric layer.
- the semiconductor structure further includes a second protective layer disposed between the second dielectric layer and the third dielectric layer, wherein the second protective layer surrounds the second portion of the second conductive member.
- the first protective layer and the second protective layer include nitride.
- the second conductive member includes a third portion surrounded by the third dielectric layer, disposed over and coupled with the second portion of the second conductive member.
- a third width of the third portion of the second conductive member is substantially greater than a first width of the first portion of the second conductive member and a second width of the second portion of the second conductive member.
- a semiconductor structure includes a first dielectric layer; a first conductive member extended through and surrounded by the first dielectric layer; a first protective layer disposed over the first dielectric layer and the first conductive member; a second dielectric layer disposed over the first protective layer; a second protective layer disposed over the second dielectric layer; a third dielectric layer disposed over the second dielectric layer; a second conductive member disposed over the first dielectric layer and the first conductive member, and surrounded by the first protective layer, the second dielectric layer, the second protective layer and the third dielectric layer; and a third conductive member disposed over the second conductive member and surrounded by the third dielectric layer, wherein the second conductive member includes a first portion and a second portion disposed over and coupled with the first portion, the first portion is extended through and surrounded by the first protective layer and the second dielectric layer, the second portion is surrounded by the third dielectric layer, at least a portion of the second dielectric layer is disposed between the first protective layer and the second portion of
- a curved interface is disposed between the second portion of the second conductive member and the third conductive member.
- the second portion of the second conductive member includes a convex surface curving towards the third conductive member.
- the third conductive member includes a concave surface curving away from the second conductive member.
- the second portion of the second conductive member is protruded from the first portion of the second conductive member in a length of about 3 ⁇ to about 150 ⁇ .
- the semiconductor structure further includes a barrier layer surrounding the third conductive member, disposed over the second portion of the second conductive member and separating the third conductive member from the second conductive member.
- a method of manufacturing a semiconductor structure includes providing a first dielectric layer and a first conductive member surrounded by the first dielectric layer; disposing a first protective layer over the first dielectric layer and the first conductive member; disposing a second dielectric layer over the first protective layer; disposing a second protective layer over the second dielectric layer; disposing a third dielectric layer over the second protective layer; removing a first portion of the third dielectric layer to form a first opening; removing a first portion of the second protective layer exposed by the first opening; removing a second portion of the third dielectric layer to form a second opening; removing a first portion of the second dielectric layer exposed from the second protective layer to form a third opening; removing a portion of the first protective layer exposed by the third opening and a second portion of the second protective layer exposed by the second opening; and disposing a conductive material into the second opening and the third opening to form a second conductive member.
- a first width of the first opening is substantially less than a second width of the second opening, and the first width is substantially the same as a third width of the third opening.
- a second portion of the second dielectric layer is exposed by the second opening after the removal of the second portion of the second protective layer.
Abstract
Description
- This application claims the benefit of a provisional application Ser. 62/711,098 filed on Jul. 27, 2018, entitled “SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF,” the disclosure of which is hereby incorporated by reference in its entirety.
- Electronic equipments using semiconductor devices are essential for many modern applications. With the advancement of electronic technology, the semiconductor devices are becoming small in size while having many complicated integrated circuitries. Due to the miniaturized scale of the semiconductor device, many semiconductor components are assembled on the semiconductor device. Furthermore, numerous manufacturing operations are implemented within such a small semiconductor device.
- However, the manufacturing operations of the semiconductor device involve many steps and operations on such a small and thin semiconductor device. The manufacturing of the semiconductor device in a miniaturized scale becomes more complicated. An increase in a complexity of manufacturing the semiconductor device may cause deficiencies such as poor electrical interconnection, misalignment of components or other issues, resulting in a high yield loss of the semiconductor device. The semiconductor device is produced in an undesired configuration, which would further exacerbate materials wastage and thus increase the manufacturing cost.
- Since more different small components are involved, a complexity of the manufacturing operations of the semiconductor device is increased. As such, there is a continuous need to modify a structure of the semiconductor devices and improve the manufacturing operations of the semiconductor devices.
- Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
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FIG. 1 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIG. 2 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIG. 3 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIG. 4 is a schematic cross sectional view of a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIG. 5 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIGS. 6-19 are schematic views of manufacturing a semiconductor structure by a method ofFIG. 5 in accordance with some embodiments of the present disclosure. -
FIG. 20 is a flow diagram of a method of manufacturing a semiconductor structure in accordance with some embodiments of the present disclosure. -
FIGS. 6-17 and 21-23 are schematic views of manufacturing a semiconductor structure by a method ofFIG. 20 in accordance with some embodiments of the present disclosure. - The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, the formation of a first feature over or on a second feature in the description that follows may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features may be formed between the first and second features, such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- Further, spatially relative terms, such as “beneath,” “below,” “lower,” “above,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The apparatus may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
- An interconnect structure is involved in a semiconductor structure. The interconnect structure includes several conductive vias extended through one or more layers of the semiconductor structure and connected with conductive lines extended over one of layers of the semiconductor structure. The conductive vias extended through different layers and connects the conductive lines at different layers of the semiconductor structure. However, an overall size of the semiconductor structure becomes smaller and smaller. As such, an overlay issue may occur between two conductive vias disposed over each other. The conductive vias may not be disposed accurately and thus may not vertically align with each other. Further, a space between neighboring conductive vias also becomes smaller and smaller. Therefore, the neighboring conductive vias at the same layer may be easily bridged by the conductive via disposed at the above layer, which leads to failure of electrical connection. As a result, reliability of the semiconductor structure would be adversely affected.
- In the present disclosure, a semiconductor structure is disclosed. The semiconductor structure includes a first conductive member surrounded by a first dielectric layer, and a second conductive member disposed over the first conductive member and surrounded by a second dielectric layer and a third dielectric layer. The second conductive member includes a first portion and a second portion disposed over and coupled with the first portion. The first portion is extended through and surrounded by the second dielectric layer, and the second portion is surrounded by the third dielectric layer.
- A contour of the second conductive member with a step is formed by the first portion and the second portion of the second conductive member. A width of the first portion is substantially less than a width of the second portion. The second conductive member with the step contour can increase a clearance between the second conductive member and a conductive member neigbouring with the first conductive member. Therefore, undesirable contact with the conductive member neigbouring with the first conductive member can be prevented.
- Further, a method of manufacturing a semiconductor structure is disclosed. The method includes providing a first dielectric layer and a first conductive member surrounded by the first dielectric layer; disposing a first protective layer over the first dielectric layer and the first conductive member; disposing a second dielectric layer over the first protective layer; disposing a second protective layer over the second dielectric layer; disposing a third dielectric layer over the second protective layer; removing a portion of the second dielectric layer; removing a portion of the third dielectric layer; and disposing a conductive material to form a second conductive member. The second conductive member includes a first portion surrounded by the second dielectric layer and a second portion surrounded by the third dielectric layer.
- A width of the first portion is substantially less than a width of the second portion. As such, a step contour of the second dielectric layer and the third dielectric layer is formed by the removal of the portion of the second dielectric layer and the portion of the third dielectric layer. As a result, a clearance between the second conductive member and a conductive member neigbouring with the first conductive member can be increased.
-
FIG. 1 is a schematic cross sectional view of asemiconductor structure 100 in accordance with various embodiments of the present disclosure. In some embodiments, thesemiconductor structure 100 includes a firstdielectric layer 101, a firstconductive member 102, a firstprotective layer 103, a seconddielectric layer 104, a secondprotective layer 105, a thirddielectric layer 106 and a secondconductive member 107. In some embodiments, thesemiconductor structure 100 is a part of a wafer, a die or a package. In some embodiments, thesemiconductor structure 100 is configured to connect with another semiconductor structure such as a die, a package, a printed circuit board (PCB) or the like. - In some embodiments, the
semiconductor structure 100 includes a substrate under the firstdielectric layer 101 and the firstconductive member 101. In some embodiments, the substrate includes semiconductive materials such as silicon or other suitable materials. In some embodiments, the substrate is a silicon substrate or silicon wafer. - In some embodiments, the
first dielectric layer 101 surrounds the firstconductive member 102. In some embodiments, thefirst dielectric layer 101 includes a low dielectric constant (k) material such as silicon oxide (SiO), porous organosilicate (SiOCH), borophosphosilicate glass (BPSG), phosphosilicate glass (PSG) or the like. - In some embodiments, the first
conductive member 102 is extended through and surrounded by thefirst dielectric layer 101. In some embodiments, the firstconductive member 102 includes afirst surface 102 a and asecond surface 102 b opposite to thefirst surface 102 a. In some embodiments, the firstconductive member 102 is extended between thefirst surface 102 a and thesecond surface 102 b. In some embodiments, the firstconductive member 102 includes conductive material such as copper (Cu), aluminum (Al), cobalt (Co), titanium (Ti), tungsten (W), ruthenium (Ru), molybdenum (Mo), iridium (Ir), rhodium (Rh) or the like. - In some embodiments, the
second surface 102 b of the firstconductive member 102 is exposed. In some embodiments, thesecond surface 102 b is configured to receive a conductive line or a conductive structure to connect a circuitry of thesemiconductor structure 100 with a circuitry of another semiconductor structure. In some embodiments, a height of the firstconductive member 102 is substantially the same as a thickness of thefirst dielectric layer 101. In some embodiments, the height of the firstconductive member 102 and the thickness of thefirst dielectric layer 101 are respectively about 50 Å to about 500 Å. - In some embodiments, a
first barrier layer 102 c surrounds the firstconductive member 102. In some embodiments, thefirst barrier layer 102 c is a diffusion barrier layer. In some embodiments, thefirst barrier layer 102 c is configured to prevent diffusion from the firstconductive member 102 to thefirst dielectric layer 101 and provide adhesion between the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments, thefirst barrier layer 102 c is disposed between the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments, thefirst barrier layer 102 c includes tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), tantalum (Ta) or the like. - In some embodiments, a capping layer 101 d is disposed over the first
conductive member 102. In some embodiments, the capping layer 101 d is disposed over thefirst surface 102 a of the firstconductive member 102. In some embodiments, the capping layer 101 d is surrounded by thefirst dielectric layer 101. In some embodiments, the capping layer 101 d is disposed over thefirst barrier layer 102 c. In some embodiments, thecapping layer 102 d includes cobalt (Co), tantalum (Ta), tungsten (W), platinum (Pt) or the like. - In some embodiments, the first
protective layer 103 is disposed over thefirst dielectric layer 101 and the firstconductive member 102. In some embodiments, the firstprotective layer 103 is in contact with thefirst dielectric layer 101. In some embodiments, the firstprotective layer 103 is disposed over and in contact with thecapping layer 102 d. In some embodiments, the firstprotective layer 103 is an etch stop layer configured to stop etching operations. In some embodiments, the firstprotective layer 103 includes nitride. In some embodiments, the firstprotective layer 103 includes dielectric material such as silicon nitride (SiN), silicon oxide (SiO), aluminum oxynitride (AlON), silicon carbon nitride (SiCN) or the like. - In some embodiments, the
second dielectric layer 104 is disposed over the firstprotective layer 103. In some embodiments, thesecond dielectric layer 104 is disposed over thefirst dielectric layer 101 and the firstconductive member 102. In some embodiments, thesecond dielectric layer 104 includes material same as or different from thefirst dielectric layer 101. In some embodiments, thefirst dielectric layer 101 includes a low dielectric constant (k) material such as silicon oxide (SiO), porous organosilicate (SiOCH), borophosphosilicate glass (BPSG), phosphosilicate glass (PSG) or the like. - In some embodiments, the second
protective layer 105 is disposed over thesecond dielectric layer 104. In some embodiments, the secondprotective layer 105 is disposed over the firstprotective layer 103, the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments, the secondprotective layer 105 is an etch stop layer configured to stop etching operations. In some embodiments, the secondprotective layer 106 includes material same as or different from the firstprotective layer 103. In some embodiments, the secondprotective layer 105 includes nitride. In some embodiments, the secondprotective layer 105 includes dielectric material such as silicon nitride (SiN), silicon oxide (SiO), aluminum oxynitride (AlON), silicon carbon nitride (SiCN) or the like. - In some embodiments, the third
dielectric layer 106 is disposed over thesecond dielectric layer 104. In some embodiments, the thirddielectric layer 106 is disposed over the secondprotective layer 105, the firstprotective layer 103, the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments, the secondprotective layer 105 is disposed between thesecond dielectric layer 104 and the thirddielectric layer 106. In some embodiments, the thirddielectric layer 106 surrounds the secondconductive member 107. In some embodiments, the thirddielectric layer 106 includes material same as or different from thefirst dielectric layer 101 and thesecond dielectric layer 104. In some embodiments, the thirddielectric layer 106 includes a low dielectric constant (k) material such as silicon oxide (SiO), porous organosilicate (SiOCH), borophosphosilicate glass (BPSG), phosphosilicate glass (PSG) or the like. - In some embodiments, the second
conductive member 107 is disposed over thefirst dielectric layer 101 and the firstconductive member 102. In some embodiments, the secondconductive member 107 is extended through and surrounded by the thirddielectric layer 106, the secondprotective layer 105, thesecond dielectric layer 104 and the firstprotective layer 103. In some embodiments, the secondconductive member 107 includes conductive material such as copper (Cu), aluminum (Al), cobalt (Co), titanium (Ti), tungsten (W), ruthenium (Ru), molybdenum (Mo), iridium (Ir), rhodium (Rh) or the like. - In some embodiments, the second
conductive member 107 includes afirst portion 107 a and asecond portion 107 b. In some embodiments, thefirst portion 107 a is extended through and surrounded by the firstprotective layer 103 and thesecond dielectric layer 104. In some embodiments, thefirst portion 107 is disposed over the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments, thefirst portion 107 a covers a portion of the firstconductive member 102 and a portion of thefirst dielectric layer 101. - In some embodiments, the
second portion 107 b is disposed over and coupled with thefirst portion 107 a. In some embodiments, thesecond portion 107 b is surrounded by the thirddielectric layer 106 and thesecond dielectric layer 105. In some embodiments, a first width W1 of thefirst portion 107 a of the secondconductive member 107 is substantially less than a second width W2 of thesecond portion 107 b of the secondconductive member 107. In some embodiments, the first width W1 is about 10 Å to about 300 Å. In some embodiments, the second width W2 is about 16 Å to about 600 Å. - In some embodiments, at least a portion of the
second portion 107 b of the secondconductive member 107 is protruded from thefirst portion 107 a of the secondconductive member 107. In some embodiments, the portion of thesecond portion 107 b is protruded from thefirst portion 107 a in a third width W3 of about 3 Å to about 150 Å. In some embodiments, at least aportion 104 a of thesecond dielectric layer 104 is disposed between the firstprotective layer 103 and thesecond portion 107 b of the secondconductive member 107. In some embodiments, theportion 104 a of thesecond dielectric layer 104 is protruded into the secondconductive member 107. In some embodiments, an outer surface of thefirst portion 107 a and thesecond portion 107 b includes a step contour. - In some embodiments, the
first portion 107 a includes athird surface 107 d interfacing with the firstprotective layer 103 and thesecond dielectric layer 104. In some embodiments, thesecond portion 107 b includes afourth surface 107 e interfacing with the secondprotective layer 105 and the thirddielectric layer 106. In some embodiments, thethird surface 107 d is substantially parallel to thefourth surface 107 e. In some embodiments, thethird surface 107 d and thefourth surface 107 e are substantially orthogonal to thefirst surface 102 a of the firstconductive member 102. In some embodiments, thethird surface 107 d and thefourth surface 107 e are vertical surfaces. In some embodiments, thefourth surface 107 e is protruded from thethird surface 107 d. In some embodiments, thefourth surface 107 e is protruded from thethird surface 107 d in the third width W3. - In some embodiments, the second
conductive member 107 includes athird portion 107 c disposed above thesecond portion 107 b and thefirst portion 107 a. In some embodiments, thethird portion 107 c is coupled with thesecond portion 107 b. In some embodiments, thethird portion 107 c is surrounded by the thirddielectric layer 106. In some embodiments, a fourth width W4 of thethird portion 107 c is substantially greater than the first width W1 of thefirst portion 107 a and the second width W2 of thesecond portion 107 b. - In some embodiments, a
second barrier layer 107 f surrounds the secondconductive member 107. In some embodiments, thesecond barrier layer 107 f is a diffusion barrier layer. In some embodiments, thesecond barrier layer 107 f is configured to prevent diffusion from the secondconductive member 107 to the thirddielectric layer 106 and thesecond dielectric layer 104, and provide adhesion between the secondconductive member 107 and the thirddielectric layer 106 and between the secondconductive member 107 and thesecond dielectric layer 104. In some embodiments, thesecond barrier layer 107 f is disposed between the secondconductive member 107 and the thirddielectric layer 106. In some embodiments, thesecond barrier layer 107 f is disposed between the secondconductive member 107 and thesecond dielectric layer 104. In some embodiments, thesecond barrier layer 107 f is disposed between the secondconductive member 107 and the firstprotective layer 103. In some embodiments, thesecond barrier layer 107 f is disposed between the secondconductive member 107 and the secondprotective layer 105. In some embodiments, thesecond barrier layer 107 f includes tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), tantalum (Ta) or the like. - In some embodiments, the
first portion 107 a of the secondconductive member 107 is disposed above the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments as shown inFIG. 1 , the secondconductive member 107 is not vertically aligned with the firstconductive member 102. In some embodiments, a central axis of the secondconductive member 107 is deviated from a central axis of the firstconductive member 102. In some embodiments, thefirst portion 107 a of the secondconductive member 107 is not vertically aligned with the firstconductive member 102. In some embodiments, a central axis of thefirst portion 107 a is deviated from the central axis of the firstconductive member 102. In some embodiments, thefirst portion 107 is disposed above the firstconductive member 102 and thefirst dielectric layer 101. In some embodiments, thefirst portion 107 covers or is in contact with a portion of thefirst dielectric layer 101. - In some embodiments, the
first portion 107 a of the secondconductive member 107 is disposed above the firstconductive member 102. In some embodiments as shown inFIG. 2 , the secondconductive member 107 is vertically aligned with the firstconductive member 102. In some embodiments, the central axis of the secondconductive member 107 is overlapped and common with the central axis of the firstconductive member 102. In some embodiments, thefirst portion 107 a of the secondconductive member 107 is vertically aligned with the firstconductive member 102. In some embodiments, the central axis of thefirst portion 107 a is overlapped and common with the central axis of the firstconductive member 102. In some embodiments, thefirst portion 107 is disposed above the firstconductive member 102. In some embodiments, thefirst portion 107 does not cover and is not in contact with thefirst dielectric layer 101. - In some embodiments as shown in
FIG. 3 , thesecond portion 107 b of the secondconductive member 107 is tapered towards thefirst portion 107 a of the secondconductive member 107. In some embodiments, thefirst portion 107 of the secondconductive member 107 is tapered towards the firstconductive member 102. In some embodiments, a first angle θ of thethird surface 107 d relative to thefirst surface 102 a of the firstconductive member 102 is about 90° to about 160°. In some embodiments, a second angle α of thefourth surface 107 e relative to thefirst surface 102 a of the firstconductive member 102 is about 90° to about 160°. In some embodiments, the first angle θ is substantially the same as the second angle α. In some embodiments, thethird surface 107 d of thefirst portion 107 a and thefourth surface 107 e of thesecond portion 107 b are tilted surfaces. In some embodiments, the second angle α is substantially greater than the first angle θ. In some embodiments, thethird surface 107 d is a vertical surface and thefourth surface 107 e is a tilted surface. - In some embodiments as shown in
FIG. 4 , a thirdconductive member 108 is disposed over the secondconductive member 107. In some embodiments, the thirdconductive member 108 is surrounded by the thirddielectric layer 106. In some embodiments, thesecond portion 107 b of the secondconductive member 107 is protruded into the thirdconductive member 108. In some embodiments, thesecond portion 107 b includes a dome shaped contour. In some embodiments, thesecond portion 107 b includes aconvex surface 107 g curving towards the thirdconductive member 108. In some embodiments, theconvex surface 107 g is surrounded by the thirddielectric layer 106. In some embodiments, the thirdconductive member 108 includes aconcave surface 108 a curving away from the secondconductive member 107. In some embodiments, a curved interface is disposed between thesecond portion 107 b of the secondconductive member 107 and the thirdconductive member 108. - In some embodiments, the third
conductive member 108 includes a fifth width W5 and a sixth width W6. In some embodiments, the fifth width W5 is a shortest width of the thirdconductive member 108. In some embodiments, the sixth width W6 is a longest width of the thirdconductive member 108. In some embodiments, the fifth width W5 is substantially less than the sixth width W6. In some embodiments, the thirdconductive member 108 includes conductive material such as copper (Cu), aluminum (Al), cobalt (Co), titanium (Ti), tungsten (W), ruthenium (Ru) , molybdenum (Mo), iridium (Ir), rhodium (Rh) or the like. - In some embodiments, the
second portion 107 b of the secondconductive member 107 is tapered towards thefirst portion 107 a of the secondconductive member 107. In some embodiments, the thirdconductive member 108 is tapered towards the secondconductive member 107. In some embodiments, the thirdconductive member 108 includes afifth surface 108 c interfacing with the thirddielectric layer 106. In some embodiments, thefourth surface 107 is substantially parallel to thefifth surface 108 c. In some embodiments, thefourth surface 107 e of thesecond portion 107 b and thefifth surface 108 c of the thirdconductive member 108 are tilted surfaces. In some embodiments, thefourth surface 107 e and thefifth surface 108 c have substantially the same gradient. - In some embodiments, a
third barrier layer 108 b surrounds the thirdconductive member 108. In some embodiments, thethird barrier layer 108 b is a diffusion barrier layer. In some embodiments, thethird barrier layer 108 b is configured to prevent diffusion from the thirdconductive member 108 to the thirddielectric layer 106 and provide adhesion between the thirdconductive member 108 and the thirddielectric layer 106. In some embodiments, thethird barrier layer 108 b is disposed over thesecond portion 107 b of the secondconductive member 107. In some embodiments, the secondconductive member 107 is separated from the thirdconductive member 108 by thethird barrier layer 108. In some embodiments, thethird barrier layer 108 b is disposed between the thirdconductive member 108 and the thirddielectric layer 106. In some embodiments, thethird barrier layer 108 b is disposed between the thirdconductive member 108 and the secondconductive member 107. In some embodiments, thethird barrier layer 108 b includes tungsten (W), titanium (Ti), aluminum (Al), copper (Cu), tantalum (Ta) or the like. - In the present disclosure, a method of manufacturing a semiconductor structure is also disclosed. In some embodiments, a
semiconductor structure method 500. Themethod 500 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations.FIG. 5 is an embodiment of themethod 500 of manufacturing thesemiconductor structure method 500 includes a number of operations (501, 502, 503, 504, 505, 506, 507, 508, 509, 510 and 511). - In
operation 501, a firstdielectric layer 101 and a firstconductive member 102 are provided as shown inFIG. 6 . In some embodiments, the firstconductive member 102 is surrounded by thefirst dielectric layer 101. In some embodiments, the firstconductive member 102 is extended through thefirst dielectric layer 101. In some embodiments, the firstconductive member 102 includes afirst surface 102 a and asecond surface 102 b opposite to thefirst surface 102 a. - In some embodiments, the
first dielectric layer 101 is formed by spin coating, chemical vapor deposition (CVD), plasma enhanced CVD (PECVD) or any other suitable operations. In some embodiments, the firstconductive member 102 is formed by removing a portion of thefirst dielectric layer 101 to form a hole and disposing a conductive material into the hole. In some embodiments, the removal of the portion of thefirst dielectric layer 101 includes photolithography, etching or any other suitable operations. In some embodiments, the disposing of the conductive material includes sputtering, electroplating or any other suitable operations. - In some embodiments, a substrate is provided before the disposing of the
first dielectric layer 101 and the firstconductive member 102. In some embodiments, thefirst dielectric layer 101 and the firstconductive member 102 are disposed over the substrate. In some embodiments, the substrate is configured to support components of the semiconductor structure during themethod 500. The components of the semiconductor structure are formed over the substrate during themethod 500. - In some embodiments, a
first barrier layer 102 c is formed before the formation of the firstconductive member 102. In some embodiments, thefirst barrier layer 102 c surrounds the firstconductive member 102. In some embodiments, thefirst barrier layer 102 c is disposed conformal to the hole of thefirst dielectric layer 101, and then the firstconductive member 102 is disposed over thefirst barrier layer 102 c. In some embodiments, thefirst barrier layer 102 c is disposed by deposition, electroless plating or any other suitable operations. - In some embodiments, a
capping layer 102 d is formed over the firstconductive member 102 and thefirst barrier layer 102 c. In some embodiments, thecapping layer 102 d is surrounded by thefirst dielectric layer 101. In some embodiments, thecapping layer 102 d is formed by CVD, sputtering or any other suitable operations. In some embodiments, thefirst dielectric layer 101, the firstconductive member 102, thefirst barrier layer 102 c and thecapping layer 102 d are in configurations as described above or shown inFIGS. 1-4 . - In
operation 502, a firstprotective layer 103 is disposed over thefirst dielectric layer 101 and the firstconductive member 102 as shown inFIG. 7 . In some embodiments, the firstprotective layer 103 is disposed over thecapping layer 102 d. In some embodiments, the firstprotective layer 103 is an etch stop layer configured to stop etching operations. In some embodiments, the firstprotective layer 103 is formed by CVD, PECVD or any other suitable operations. In some embodiments, the firstprotective layer 103 is in configuration as described above or shown inFIGS. 1-4 . - In
operation 503, asecond dielectric layer 104 is disposed over the firstprotective layer 103 as shown inFIG. 8 . In some embodiments, thesecond dielectric layer 104 is disposed conformal to the firstprotective layer 103. In some embodiments, thesecond dielectric layer 104 is formed by spin coating, CVD, PECVD or any other suitable operations. In some embodiments, thesecond dielectric layer 104 is in configuration as described above or shown inFIGS. 1-4 . - In
operation 504, a secondprotective layer 105 is disposed over thesecond dielectric layer 104 as shown inFIG. 9 . In some embodiments, the secondprotective layer 105 is disposed conformal to thesecond dielectric layer 104. In some embodiments, the secondprotective layer 105 is an etch stop layer configured to stop etching operations. In some embodiments, the secondprotective layer 105 is formed by CVD, PECVD or any other suitable operations. In some embodiments, the secondprotective layer 105 is in configuration as described above or shown inFIGS. 1-4 . - In
operation 505, a thirddielectric layer 106 is disposed over the secondprotective layer 105 as shown inFIG. 10 . In some embodiments, the thirddielectric layer 106 is formed by spin coating, CVD, PECVD or any other suitable operations. In some embodiments, the thirddielectric layer 106 is in configuration as described above or shown inFIGS. 1-4 . - In some embodiments, a
dielectric mask 109 is disposed over the thirddielectric layer 106, and ahard mask 110 is formed over thedielectric mask 109 as shown inFIG. 11 . In some embodiments, thedielectric mask 109 is configured to protect the thirddielectric layer 106 from removal. In some embodiments, thedielectric mask 109 includes silicon oxide or any other suitable materials. In some embodiments, thedielectric mask 109 is formed by CVD or any other suitable operations. - In some embodiments, a portion of the
hard mask 110 is removed to pattern thehard mask 110. In some embodiments, thehard mask 110 is patterned by disposing a first photoresist over thehard mask 110, patterning the first photoresist and removing the portion of thehard mask 110 exposed from the patterned first photoresist. In some embodiments, the first photoresist is disposed by spin coating or any other suitable operations. In some embodiments, the first photoresist is patterned by exposing a portion of the first photoresist from a photomask, projecting a predetermined electromagnetic radiation towards the photomask and the exposed portion of the first photoresist, and removing the exposed portion of the first photoresist. In some embodiments, the patternedhard mask 110 is formed as shown inFIG. 11 . In some embodiments, thedielectric mask 109 covers the thirddielectric layer 106 after the patterning of thehard mask 110. In some embodiments, the first photoresist is removed after the patterning of thehard mask 110. In some embodiments, the first photoresist is removed by wet etching, stripping or any other suitable operations. - In
operation 506, afirst portion 106 a of the thirddielectric layer 106 is removed to form afirst opening 106 b as shown inFIGS. 12-14 . In some embodiments, asecond photoresist 111 is disposed over thehard mask 110 and thedielectric mask 109. In some embodiments, thesecond photoresist 111 is disposed by spin coating or any other suitable operations. In some embodiments, thesecond photoresist 111 is patterned by exposing a portion of thesecond photoresist 111 from a photomask, projecting a predetermined electromagnetic radiation towards the photomask and the exposed portion of thesecond photoresist 111, and removing the exposed portion of thesecond photoresist 111. In some embodiments, a patternedsecond photoresist 111 is formed as shown inFIG. 12 . - In some embodiments, a portion of the
dielectric mask 109 is exposed from the patternedsecond photoresist 111. In some embodiments, the exposed portion of thedielectric mask 109 and thefirst portion 106 a of the thirddielectric layer 106 under the exposed portion of thedielectric mask 109 are removed as shown inFIG. 13 . In some embodiments, the exposed portion of thedielectric mask 109 and thefirst portion 106 a of the thirddielectric layer 106 are removed by dry etching or any other suitable operations. In some embodiments, thefirst opening 106 b is formed after the removal of thefirst portion 106 a of the thirddielectric layer 106. In some embodiments, thefirst opening 106 b is extended through the thirddielectric layer 106. - In some embodiments, a first width W1 the
first opening 106 b is about 10 Å to about 300 Å. In some embodiments, thefirst opening 106 b is not aligned with the firstconductive member 102 as shown inFIG. 13 . In some embodiments, thefirst opening 106 b is disposed above and aligned with the firstconductive member 102. In some embodiments, afirst portion 105 a of the secondprotective layer 105 is exposed after the formation of thefirst opening 106 b. In some embodiments, thesecond photoresist 111 is removed after the formation of thefirst opening 106 b as shown inFIG. 14 . In some embodiments, thesecond photoresist 111 is removed by wet etching, stripping or any other suitable operations. - In
operation 507, thefirst portion 105 a of the secondprotective layer 105 exposed by thefirst opening 106 b is removed as shown inFIG. 15 . In some embodiments, thefirst portion 105 a of the secondprotective layer 105 is removed by wet etching or any other suitable operations. In some embodiments, afirst portion 104 b of thesecond dielectric layer 104 is exposed from the secondprotective layer 105 after the removal of thefirst portion 105 a of the secondprotective layer 105. In some embodiments, asecond portion 106 c of the thirddielectric layer 106 is uncovered by thehard mask 110. - In
operation 508, thesecond portion 106 c of the thirddielectric layer 106 is removed to form asecond opening 106 d as shown inFIG. 16 . In some embodiments, thesecond portion 106 c of the thirddielectric layer 106 is removed by dry etching or any other suitable operations. In some embodiments, more of the thirddielectric layer 106 adjacent to thehard mask 109 is etched compared with the thirddielectric layer 106 away from thehard mask 109 and close to thefirst dielectric layer 101. As such, thesecond opening 106 d has a step contour after the removal of thesecond portion 106 c of the thirddielectric layer 106. In some embodiments, thesecond opening 106 d is tapered towards the firstconductive member 102 and thesecond dielectric layer 104. In some embodiments, asecond portion 105 b of the secondprotective layer 105 is exposed by thesecond opening 106 d after the removal of thesecond portion 106 c of the thirddielectric layer 106. In some embodiments, thedielectric mask 109 uncovered by thehard mask 110 is removed before or upon the removal of thesecond portion 106 c of the thirddielectric layer 106. - In
operation 509, thefirst portion 104 b of thesecond dielectric layer 104 exposed from the secondprotective layer 105 is removed to form athird opening 104 c as shown inFIG. 16 . In some embodiments, thefirst portion 104 b of thesecond dielectric layer 104 is removed by dry etching or any other suitable operations. In some embodiments, aportion 103 a of the firstprotective layer 103 is exposed by thethird opening 104 c after removal of thefirst portion 104 b of thesecond dielectric layer 104. - In some embodiments, the
second portion 106 c of the thirddielectric layer 106 and thefirst portion 104 b of thesecond dielectric layer 104 are removed separately or simultaneously. In some embodiments, theoperation 508 and theoperation 509 are performed separately or simultaneously. In some embodiments, a width of thethird opening 104 c is substantially the same as the first width W1 of thefirst opening 106 b. In some embodiments, a second width W2 of thesecond opening 106 d is substantially greater than the width of thethird opening 104 c. In some embodiments, thesecond opening 106 d is tapered towards thethird opening 104 c. - In
operation 510, theportion 103 a of the firstprotective layer 103 exposed by thethird opening 104 c and asecond portion 105 b of the secondprotective layer 105 exposed by thesecond opening 106 d are removed as shown inFIG. 17 . In some embodiments, theportion 103 a of the firstprotective layer 103 and thesecond portion 105 b of the secondprotective layer 105 are removed by wet etching or any other suitable operations. In some embodiments, the removal of theportion 103 a of the firstprotective layer 103 and the removal of thesecond portion 105 b of the secondprotective layer 105 are performed separately or simultaneously. In some embodiments, aportion 104 a of thesecond dielectric layer 104 is exposed by thesecond opening 106 d after the removal of thesecond portion 105 b of the secondprotective layer 105. In some embodiments, theportion 104 a of thesecond dielectric layer 104 is laterally protruded. In some embodiments, the firstconductive member 102 or thecapping layer 102 d is exposed after the removal of theportion 103 a of the firstprotective layer 103. - In
operation 511, aconductive material 112 is disposed into thesecond opening 106 d and thethird opening 104 c to form a secondconductive member 107 as shown inFIGS. 18-19 . In some embodiments, theconductive material 112 is disposed over the thirddielectric layer 106. In some embodiments, theconductive material 112 is disposed over thedielectric mask 109 and thehard mask 110. In some embodiments, theconductive material 112 is formed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations. - In some embodiments, a
second barrier layer 107 f is disposed conformal to thesecond opening 106 d and thethird opening 104 c before the disposing of theconductive material 112. In some embodiments, thesecond barrier layer 107 f is formed, and then theconductive material 112 is disposed over thesecond barrier layer 107 f. In some embodiments, thesecond barrier layer 107 f is disposed over the thirddielectric layer 106. In some embodiments, thesecond barrier layer 107 f is disposed over thedielectric mask 109 and thehard mask 110. In some embodiments, thesecond barrier layer 107 f is disposed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations. - In some embodiments, the second
conductive member 107 is formed after planarization of theconductive material 112. In some embodiments as shown inFIG. 19 , some of theconductive material 112 are removed to form the secondconductive member 107. In some embodiments, some of thesecond barrier layer 107 f disposed over the thirddielectric layer 106, some of theconductive material 112 disposed over the thirddielectric layer 106, thedielectric mask 109 and thehard mask 110 are removed by chemical mechanical planarization (CMP) or any other suitable operations. In some embodiments, the secondconductive member 107 is in configurations as described above or shown inFIGS. 1-3 . In some embodiments, asemiconductor structure 100 described above and shown inFIG. 1 is formed. In some embodiments, asemiconductor structure 200 having the secondconductive member 107 aligned with the firstconductive member 102 as described above or shown inFIG. 2 is formed. In some embodiments, asemiconductor structure 300 having tapered secondconductive member 107 as described above or shown inFIG. 3 is formed. - In the present disclosure, a method of manufacturing a semiconductor structure is also disclosed. In some embodiments, a semiconductor structure is formed by a
method 600. Themethod 600 includes a number of operations and the description and illustration are not deemed as a limitation as the sequence of the operations.FIG. 20 is an embodiment of themethod 600 of manufacturing a semiconductor structure. Themethod 600 includes a number of operations (601, 602, 603, 604, 605, 606, 607, 608, 609, 610, 611 and 612). - In
operation 601, a firstdielectric layer 101 and a firstconductive member 102 are provided as shown inFIG. 6 . Theoperation 601 is substantially the same as theoperation 501. - In
operation 602, a firstprotective layer 103 is disposed over thefirst dielectric layer 101 and the firstconductive member 102 as shown inFIG. 7 . Theoperation 602 is substantially the same as theoperation 502. - In
operation 603, asecond dielectric layer 104 is disposed over the firstprotective layer 103 as shown inFIG. 8 . Theoperation 603 is substantially the same as theoperation 503. - In
operation 604, a secondprotective layer 105 is disposed over thesecond dielectric layer 104 as shown inFIG. 9 . Theoperation 604 is substantially the same as theoperation 504. - In
operation 605, a thirddielectric layer 106 is disposed over the secondprotective layer 105 as shown inFIG. 10 . Theoperation 605 is substantially the same as theoperation 505. In some embodiments, ahard mask 110 is formed over the thirddielectric layer 106 as shown inFIG. 11 - In
operation 606, afirst portion 106 a of the thirddielectric layer 106 is removed to form afirst opening 106 b as shown inFIGS. 12-14 . Theoperation 606 is substantially the same as theoperation 506. - In
operation 607, thefirst portion 105 a of the secondprotective layer 105 exposed by thefirst opening 106 b is removed as shown inFIG. 15 . Theoperation 607 is substantially the same as theoperation 507. - In
operation 608, thesecond portion 106 c of the thirddielectric layer 106 is removed to form asecond opening 106 d as shown inFIG. 16 . Theoperation 608 is substantially the same as theoperation 508. - In
operation 609, thefirst portion 104 b of thesecond dielectric layer 104 exposed from the secondprotective layer 105 is removed to form athird opening 104 c as shown inFIG. 16 . Theoperation 609 is substantially the same as theoperation 509. - In
operation 610, theportion 103 a of the firstprotective layer 103 exposed by thethird opening 104 c and asecond portion 105 b of the secondprotective layer 105 exposed by thesecond opening 106 d are removed as shown inFIG. 17 . - In
operation 611, a first conductive material is disposed to form a secondconductive member 107 as shown inFIG. 21 . In some embodiments, the first conductive material is disposed into thesecond opening 106 d and thethird opening 104 c to form the secondconductive member 107. In some embodiments, the first conductive material is disposed by electroless plating, CVD or any other suitable operations. In some embodiments, the first conductive material is grown within thethird opening 104 c and a portion of thesecond opening 106 d to form the secondconductive member 107. In some embodiments, the secondconductive member 107 is surrounded by the firstprotective layer 103, thesecond dielectric layer 104, the secondprotective layer 105 and the thirddielectric layer 106. In some embodiments, the first conductive material is grown to form the secondconductive member 107 having a step contour. - In some embodiments, the second
conductive member 107 includes afirst portion 107 a and asecond portion 107 b over thefirst portion 107 a. In some embodiments, thefirst portion 107 a is surrounded by the firstprotective layer 103 and thesecond dielectric layer 104. In some embodiments, thesecond portion 107 b is surrounded by the secondprotective layer 105 and the thirddielectric layer 106. In some embodiments, the first conductive material is grown to form thesecond portion 107 b of the secondconductive member 107 having a dome shaped contour. In some embodiments, thesecond portion 107 b includes aconvex surface 107 g curving towards thesecond opening 106 d. In some embodiments, In some embodiments, thefirst portion 107 a includes athird surface 107 d interfacing with the firstprotective layer 103 and thesecond dielectric layer 104. In some embodiments, thesecond portion 107 b includes afourth surface 107 e interfacing with the secondprotective layer 105 and the thirddielectric layer 106. In some embodiments, thethird surface 107 d is substantially parallel to thefourth surface 107 e. In some embodiments, thefourth surface 107 e is tapered towards the firstconductive member 102. In some embodiments, the secondconductive member 107 is in configuration as described above or shown inFIG. 4 . - In
operation 612, a secondconductive material 112 is disposed to form a thirdconductive member 108 as shown inFIGS. 22-23 . The secondconductive member 107 and the thirdconductive member 108 are separately formed. In some embodiments, the secondconductive material 112 is disposed into thesecond opening 106 d and over the thirddielectric layer 106. In some embodiments, the secondconductive material 112 is disposed over thedielectric mask 109 and thehard mask 110. In some embodiments, the secondconductive material 112 is formed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations. In some embodiments, the thirdconductive member 108 includes aconcave surface 108 a curving away from the secondconductive member 107. - In some embodiments, a
third barrier layer 108 b is disposed conformal to theconvex surface 107 g of the secondconductive member 107 and thesecond opening 106 d before the disposing of the secondconductive material 112. In some embodiments, thethird barrier layer 108 b is formed, and then the secondconductive material 112 is disposed over thesecond barrier layer 107 f. In some embodiments, thethird barrier layer 108 b is disposed over the thirddielectric layer 106. In some embodiments, thethird barrier layer 108 b is disposed over thedielectric mask 109 and thehard mask 110. In some embodiments, thethird barrier layer 108 b is disposed by sputtering, electroplating, CVD, physical vapor deposition (PVD) or any other suitable operations. Since an interface between the secondconductive member 107 and the thirdconductive member 108 or between the secondconductive member 107 and thethird barrier layer 108 b is curved, a contacting surface between the secondconductive member 107 and the thirdconductive member 108 or between the secondconductive member 107 and thethird barrier layer 108 b is increased. As such, adhesion between the secondconductive member 107 and the thirdconductive member 108 or between the secondconductive member 107 and thethird barrier layer 108 b is improved. - In some embodiments, the third
conductive member 108 is formed after planarization of the secondconductive material 112. In some embodiments as shown inFIG. 23 , some of the secondconductive material 112 are removed to form the thirdconductive member 108. In some embodiments, some of thethird barrier layer 108 b disposed over the thirddielectric layer 106, some of the secondconductive material 112 disposed over the thirddielectric layer 106, thedielectric mask 109 and thehard mask 110 are removed by chemical mechanical planarization (CMP) or any other suitable operations. In some embodiments, the thirdconductive member 108 is in configurations as described above or shown inFIG. 4 . In some embodiments, asemiconductor structure 400 described above and shown inFIG. 4 is formed. - In some embodiments, a semiconductor structure includes a first dielectric layer; a first conductive member extended through and surrounded by the first dielectric layer; a first protective layer disposed over the first dielectric layer and the first conductive member; a second dielectric layer disposed over the first protective layer; a third dielectric layer disposed over the second dielectric layer; and a second conductive member disposed over the first dielectric layer and the first conductive member, and surrounded by the first protective layer, the second dielectric layer and the third dielectric layer, wherein the second conductive member includes a first portion and a second portion disposed over and coupled with the first portion, the first portion is extended through and surrounded by the first protective layer and the second dielectric layer, the second portion is surrounded by the third dielectric layer, at least a portion of the second dielectric layer is disposed between the first protective layer and the second portion of the second conductive member.
- In some embodiments, a first width of the first portion of the second conductive member is substantially less than a second width of the second portion of the second conductive member. In some embodiments, at least a portion of the second portion of the second conductive member is protruded from the first portion of the second conductive member. In some embodiments, the second portion of the second conductive member is tapered towards the first portion of the second conductive member. In some embodiments, the first portion of the second conductive member is tapered towards the first conductive member. In some embodiments, the first portion of the second conductive member is disposed above the first conductive member. In some embodiments, the first portion of the second conductive member is disposed above the first conductive member and the first dielectric layer. In some embodiments, the semiconductor structure further includes a second protective layer disposed between the second dielectric layer and the third dielectric layer, wherein the second protective layer surrounds the second portion of the second conductive member. In some embodiments, the first protective layer and the second protective layer include nitride. In some embodiments, the second conductive member includes a third portion surrounded by the third dielectric layer, disposed over and coupled with the second portion of the second conductive member. In some embodiments, a third width of the third portion of the second conductive member is substantially greater than a first width of the first portion of the second conductive member and a second width of the second portion of the second conductive member.
- In some embodiments, a semiconductor structure includes a first dielectric layer; a first conductive member extended through and surrounded by the first dielectric layer; a first protective layer disposed over the first dielectric layer and the first conductive member; a second dielectric layer disposed over the first protective layer; a second protective layer disposed over the second dielectric layer; a third dielectric layer disposed over the second dielectric layer; a second conductive member disposed over the first dielectric layer and the first conductive member, and surrounded by the first protective layer, the second dielectric layer, the second protective layer and the third dielectric layer; and a third conductive member disposed over the second conductive member and surrounded by the third dielectric layer, wherein the second conductive member includes a first portion and a second portion disposed over and coupled with the first portion, the first portion is extended through and surrounded by the first protective layer and the second dielectric layer, the second portion is surrounded by the third dielectric layer, at least a portion of the second dielectric layer is disposed between the first protective layer and the second portion of the second conductive member.
- In some embodiments, a curved interface is disposed between the second portion of the second conductive member and the third conductive member. In some embodiments, the second portion of the second conductive member includes a convex surface curving towards the third conductive member. In some embodiments, the third conductive member includes a concave surface curving away from the second conductive member. In some embodiments, the second portion of the second conductive member is protruded from the first portion of the second conductive member in a length of about 3 Å to about 150 Å. In some embodiments, the semiconductor structure further includes a barrier layer surrounding the third conductive member, disposed over the second portion of the second conductive member and separating the third conductive member from the second conductive member.
- In some embodiments, a method of manufacturing a semiconductor structure includes providing a first dielectric layer and a first conductive member surrounded by the first dielectric layer; disposing a first protective layer over the first dielectric layer and the first conductive member; disposing a second dielectric layer over the first protective layer; disposing a second protective layer over the second dielectric layer; disposing a third dielectric layer over the second protective layer; removing a first portion of the third dielectric layer to form a first opening; removing a first portion of the second protective layer exposed by the first opening; removing a second portion of the third dielectric layer to form a second opening; removing a first portion of the second dielectric layer exposed from the second protective layer to form a third opening; removing a portion of the first protective layer exposed by the third opening and a second portion of the second protective layer exposed by the second opening; and disposing a conductive material into the second opening and the third opening to form a second conductive member.
- In some embodiments, a first width of the first opening is substantially less than a second width of the second opening, and the first width is substantially the same as a third width of the third opening. In some embodiments, a second portion of the second dielectric layer is exposed by the second opening after the removal of the second portion of the second protective layer.
- The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (20)
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US20230029763A1 (en) * | 2021-07-30 | 2023-02-02 | Cree, Inc. | Interconnect metal openings through dielectric films |
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US20050170642A1 (en) * | 2004-01-29 | 2005-08-04 | Hineman Max F. | Methods for improving metal-to-metal contact in a via, devices made according to the methods, and systems including the same |
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KR100613283B1 (en) * | 2004-12-27 | 2006-08-21 | 동부일렉트로닉스 주식회사 | Method of forming interconnection line for semiconductor device |
US8268722B2 (en) * | 2009-06-03 | 2012-09-18 | Novellus Systems, Inc. | Interfacial capping layers for interconnects |
US10867905B2 (en) * | 2017-11-30 | 2020-12-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interconnect structures and methods of forming the same |
US10381263B1 (en) * | 2018-05-04 | 2019-08-13 | International Business Machines Corporation | Method of forming via contact with resistance control |
US10580696B1 (en) * | 2018-08-21 | 2020-03-03 | Globalfoundries Inc. | Interconnects formed by a metal displacement reaction |
US10804199B2 (en) * | 2018-09-25 | 2020-10-13 | Globalfoundries Inc. | Self-aligned chamferless interconnect structures of semiconductor devices |
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US20050170642A1 (en) * | 2004-01-29 | 2005-08-04 | Hineman Max F. | Methods for improving metal-to-metal contact in a via, devices made according to the methods, and systems including the same |
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US20230029763A1 (en) * | 2021-07-30 | 2023-02-02 | Cree, Inc. | Interconnect metal openings through dielectric films |
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