US20200033541A1 - Thermal interface - Google Patents
Thermal interface Download PDFInfo
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- US20200033541A1 US20200033541A1 US16/533,696 US201916533696A US2020033541A1 US 20200033541 A1 US20200033541 A1 US 20200033541A1 US 201916533696 A US201916533696 A US 201916533696A US 2020033541 A1 US2020033541 A1 US 2020033541A1
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- United States
- Prior art keywords
- cap
- gasket
- openings
- thermal interface
- base
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4273—Thermal aspects, temperature control or temperature monitoring with heat insulation means to thermally decouple or restrain the heat from spreading
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/50—Transmitters
- H04B10/501—Structural aspects
Definitions
- Communication modules such as electronic or optoelectronic transceivers or transponder modules, are increasingly used in electronic and optoelectronic communication.
- Each communication module typically communicates with a host device printed circuit board by transmitting and/or receiving electrical data signals to and/or from the host device printed circuit board.
- the communication module can also transmit electrical data signals outside a host device as optical and/or electrical data signals.
- Many communication modules include optical subassemblies (individually, an “OSA”) such as transmitter optical subassemblies (individually, a “TOSA”) and/or receiver optical subassemblies (individually, a “ROSA”) to convert between the electrical and optical domains.
- OSA optical subassemblies
- TOSA transmitter optical subassemblies
- ROSA receiver optical subassemblies
- a ROSA transforms an optical signal received from an optical fiber or other source to an electrical signal provided to the host device
- a TOSA transforms an electrical signal received from the host device to an optical signal emitted onto an optical fiber or other transmission medium.
- a photodiode or similar optical receiver contained by the ROSA transforms the optical signal to the electrical signal.
- a laser diode or similar optical transmitter contained within the optical subassembly is driven to emit an optical signal representing the electrical signal received from the host device.
- Embodiments may include a thermal interface may including a thermally conductive cap.
- the thermally conductive cap may include a base, a finger, and an extension.
- the base may define a plurality of cap openings.
- the finger may extend from the base.
- the extension may extend from the base.
- the thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.
- FIG. 1A illustrates a bottom perspective view of an optoelectronic module.
- FIG. 1B illustrates a partial bottom perspective view of the optoelectronic module of FIG. 1A .
- FIG. 1C illustrates a partial exploded bottom perspective view of the optoelectronic module of FIG. 1A .
- FIGS. 2A and 2B illustrate side perspective views of an assembly including a transmitter optical subassembly (TOSA), a cap, and a gasket.
- TOSA transmitter optical subassembly
- FIG. 2C illustrates an exploded side view of the assembly of FIGS. 2A and 2B .
- FIG. 3 illustrates an exploded perspective view of the cap and the gasket of FIGS. 2A-2C .
- FIG. 4 illustrates an exploded perspective view of an assembly including the assembly of FIGS. 2A-2C and a printed circuit board (PCB) and connector.
- PCB printed circuit board
- the process of converting optical signals to electrical signals and electrical signals to optical signals can generate thermal energy in optical subassemblies (individually, an “OSA”) such as transmitter optical subassemblies (individually, a “TOSA”) and/or receiver optical subassemblies (individually, a “ROSA”).
- OSA optical subassemblies
- TOSA transmitter optical subassemblies
- ROSA receiver optical subassemblies
- the thermal energy generated in the optical subassembly may potentially cause damage to the optical subassembly.
- high-temperature environments can create unstable thermal conditions that can cause ineffective optical subassembly function.
- a high temperature environment can reduce laser performance or can cause premature laser failure.
- High temperatures may also cause problems to epoxies, solder, and/or other bonding materials in the optical subassembly. These high temperatures may become too great to be effectively dissipated and controlled by a thermoelectric cooler (TEC) installed in the optical subassembly.
- TEC thermoelectric cooler
- Some embodiments may include a thermal interface to dissipate heat produced by an optical subassembly.
- the thermal interface may conduct heat from an optical subassembly, such as a TOSA, to a shell or housing of the communication module housing the optical subassembly.
- the optical subassembly may also include a TEC. Where a TEC is included, the thermal interface may facilitate more effective heat dissipation and control by the TEC. For example, the thermal interface may encourage relatively manageable heat levels.
- FIGS. 1A-1C illustrate various bottom perspective views of an example optoelectronic module 100 .
- FIG. 1A illustrates a bottom perspective view of the optoelectronic module 100 , including a housing 102 that may include a shell 104 and a shell cover 106 attached together.
- the optoelectronic module 100 may include a latch mechanism 114 movingly positioned relative to the housing 102 .
- the latch mechanism 114 may allow the optoelectronic module 100 to be selectively secured relative to a host device.
- the housing 102 may at least partially surround receiver and/or transmitter circuitry, including a printed circuit board (PCB) 110 having an edge connector 112 configured to be electrically coupled to the host device.
- PCB printed circuit board
- the optoelectronic module 100 may be configured to be inserted into a host device cage of the host device such that the edge connector 112 may be electrically coupled to a connector of a host printed circuit board.
- the optoelectronic module 100 may be employed in the communication of optical signals and the conversion of optical signals to and from electrical signals.
- the host device may be employed in the communication of corresponding electrical signals.
- the optoelectronic module 100 may include a transmit port and a receive port at a front of the optoelectronic module 100 .
- the optoelectronic module 100 may be configured for optical signal transmission and reception via the transmit port and the receive port at a variety of data rates including, but not limited to, 1.25 Gb/s, 2.125 Gb/s, 2.5 Gb/s, 2.7 Gb/s, 4.25 Gb/s, 8.5 Gb/s, 10.3 Gb/s, 10.5 Gb/s, 11.3 Gb/s, 14.025 Gb/s, or 100 Gb/s or higher.
- the optoelectronic module 100 may be configured for optical signal transmission and reception at various wavelengths including, but not limited to, 850 nm, 1310 nm, 1470 nm, 1490 nm, 1510 nm, 1530 nm, 1550 nm, 1570 nm, 1520-1570 nm, 1590 nm, or 1610 nm.
- the optoelectronic module 100 may be configured to support various communication protocols including, but not limited to, Optical Fast Ethernet, Optical Gigabit Ethernet, 10 Gigabit Ethernet, and 1x, 2x, 4x, 8x, and 16x Fibre Channel.
- the optoelectronic module 100 may alternatively be configured in a variety of different form factors that are substantially compliant with other MSAs including, but not limited to, the QSFP MSA, the QSFP+MSA, the CFP MSA, the CFP2 MSA, the CFP4 MSA, the XFP MSA, or the SFP+MSA.
- the optoelectronic module 100 is illustrated as a pluggable optoelectronic transceiver module, example embodiments disclosed herein may alternatively be employed, for example, in connection with other communications modules, other optoelectronic devices, or the like.
- FIG. 1B illustrates a bottom perspective view of the optoelectronic module 100 of FIG. 1A with the shell cover 106 and the latch mechanism 114 omitted.
- the optoelectronic module 100 includes a TOSA 108 and a ROSA 109 .
- the TOSA 108 may include a TEC.
- a body of the header 111 of the TOSA 108 may be formed from a nickel-cobalt ferrous alloy associated with the trademark Kovar, which is owned by CRS Holdings, Inc.
- the alloy may be employed, at least in part, for its thermal expansion properties, which may closely resemble the thermal expansion properties of glass, and which may facilitate glass-to-alloy assemblies capable of being exposed to a range of temperatures.
- the body of the header 111 may include other materials.
- the material used in the header 111 may exhibit a relatively low thermal conductivity.
- Kovar may exhibit a thermal conductivity approximately half that of copper.
- a thermally conductive connection between the TOSA 108 and the shell 104 that relies significantly on conductive heat transfer through the header 111 may exhibit relative inefficiency.
- a connector 116 may communicatively connect the TOSA 108 to the PCB 110 .
- the TOSA 108 may exchange signals with and/or receive electrical power from the PCB 110 via the connector 116 .
- the connector 116 may include a flex PCB that is soldered to the PCB 110 and soldered to the TOSA 108 .
- FIG. 1C illustrates an exploded bottom perspective view of the optoelectronic module 100 of FIG. 1B .
- a thermal interface 118 may include a cap 120 , a gasket 122 , and a pad 124 .
- the use of the term gasket does not imply that the gasket 122 facilitates a fluid-tight connection.
- the pad 124 may include a pliant thermal interface material (TIM) and may exhibit a relatively high thermal conductivity.
- the pad 124 may be located within a seat of the shell 104 . When the TOSA 108 , including the cap 120 , is positioned within the shell 104 during assembly, the pad 124 may be compressed such that the TOSA 108 and the cap 120 are accommodated.
- the pad 124 may include multiple portions, as illustrated. Alternatively, the pad 124 may be one piece.
- FIGS. 2A and 2B illustrate side perspective views of the TOSA 108 , the cap 120 , and the gasket 122 of FIGS. 1A-1C .
- FIG. 2C is an exploded side view of the TOSA 108 , the cap 120 , and the gasket 122 .
- the cap 120 may exhibit a relatively high thermal conductivity.
- the cap 120 may be formed from copper, plated copper, one or more copper alloys, and/or one or more other materials exhibiting a relatively high thermal conductivity.
- the cap 120 may be manufactured at least in part via one or more stamping processes.
- the cap 120 may include one or more fingers 128 and an extension 126 .
- the fingers 128 may be sized and shaped to be positioned at the side of the header 111 .
- the fingers 128 may have a length approximately equal to the length of the header 111 and/or a relatively wide portion of the header 111 .
- the fingers 128 may have a length approximately equal to a base portion of the header 111 .
- the fingers 128 may have some other length that may facilitate the positioning of the cap 120 on the header 111 .
- the extension 126 may also be sized and shaped to be positioned at a side of the header 111 .
- the extension 126 may have a longer length than the fingers 128 .
- the extension 126 may have a length longer than the header 111 or longer than a base portion of the header 111 .
- the width of the extension 126 may correlate with the size of a corresponding seat width of the shell 104 of FIGS. 1A-1C .
- the extension 126 may include a length suitable for facilitating a desired rate of thermal energy transfer from the portion of the cap 120 in contact with the header 111 to the pad 124 and shell 104 .
- the cap 120 includes a base 121 located on an end face 113 (shown in FIG. 2C ) of the header 111 , which may be an external face of a wall of the header 111 that includes electrically conductive leads 130 (described herein as an end wall).
- the leads 130 may be attached to the connector 116 and allow the TOSA 108 to be operated.
- the leads 130 are conductively attached to components, such as a laser, a TEC, controlling circuitry, and the like.
- components such as a laser, a TEC, controlling circuitry, and the like.
- Most or all of the TOSA 108 components may be located on or near an internal face of the end wall of the header 111 .
- the end wall and the end face 113 may receive relatively more thermal energy generated by the TOSA 108 components than other portions of the header 111 .
- Thermal energy from the end wall and nearby portions of the header 111 may flow to the base 121 of the cap 120 . From there, thermal energy may flow to the extension 126 .
- portions of the cap 120 may be located relatively closer to the source of heat within the header 111 relative to conventional heat transfer devices. Furthermore, the cap 120 may exhibit a relatively large area of contact to the end face 113 and sides of the header 111 , which may encourage a relatively high rate of heat transfer from the header 111 to the cap 120 via conduction.
- the pad 124 may be shaped to contact both the shell 104 and the extension 126 of the cap 120 and thermal energy may transfer conductively from the extension 126 of the cap 120 to the shell 104 via the pad 124 . Compressing the pad 124 may reduce or eliminate air-filled gaps, which may inhibit the transfer of thermal energy, between the pad 124 and the cap 120 and/or the shell 104 .
- the pad 124 may facilitate a relatively more efficient thermally-conductive connection between the cap 120 and the shell 104 than direct contact between the cap 120 and shell 104 .
- direct contact between the cap 120 and the shell 104 may be imperfect and may result in air-filled gaps between the cap 120 and the shell 104 .
- direct contact between the cap 120 and the shell 104 may cause deviations in the thermal conductivity exhibited by the connection when the optoelectronic module 100 is subjected to movement.
- the pad 124 may be omitted.
- direct contact may be made between the cap 120 and the shell 104 .
- the configuration of the thermal interface 118 may facilitate a floating OSA configuration of optoelectronic module 100 .
- the TOSA 108 may not be overly mechanically restrained and may accommodate variations in connector dimensions, manufacturing tolerances, or the like.
- the configuration of the thermal interface 118 may resist deviations in the thermal conductivity exhibited by the thermal interface 118 when the optoelectronic module 100 is subjected to movement.
- the thermal interface 118 may facilitate a reduction of power consumption by the optoelectronic module 100 .
- power consumption may be reduced by up to 26.4 milliwatts (mW). Alternately, power consumption may be reduced by more than 26.4 mW.
- the thermal interface 118 may facilitate a reduction in yield loss.
- the thermal interface 118 may be employed in communication modules having a high power transistor outline-can (TO-can) based OSA.
- TO-can transistor outline-can
- FIG. 3 is an exploded perspective view of the cap 120 and the gasket 122 .
- Openings 125 formed in the cap 120 (described herein as “cap openings 125 ”) and corresponding openings 127 formed in the gasket 122 (described herein as “gasket openings 127 ”) may be configured to allow the leads 130 of the header 111 , (shown in FIGS. 2A-2C ), to pass through the cap 120 and the gasket 122 such that the leads 130 may be soldered to the connector 116 ( FIGS. 1B-1C ).
- the gasket 122 may be attached to the cap 120 via an adhesive 123 , such as an adhesive tape, an epoxy, or the like. Alternately, the gasket 122 may be attached to the cap 120 by other means.
- the gasket 122 may be attached to the cap 120 such that the gasket openings 127 are positioned over the cap openings 125 .
- the gasket openings 127 and the cap openings 125 may be circular and may be substantially axially aligned.
- the gasket openings 127 may be relatively smaller than the cap openings 125 .
- the relatively larger cap openings 125 may provide clearance for the leads 130 of the header 111 , such that the cap 120 may not contact one or more of the leads 130 and create an undesirable conductive connection between the cap 120 and the leads 130 .
- the cap 120 may be configured to contact one or more of the leads 130 to create a particular conductive connection.
- the cap 120 may be conductively connected to a ground lead of the leads 130 .
- the relatively smaller gasket openings 127 and the position of the gasket 122 on the cap 120 may facilitate positioning the leads 130 in a desired position relative to the cap openings 125 .
- the gasket 122 may be attached to the cap 120 such that each of the gasket openings 127 may be approximately centered relative to one of the cap openings 125 .
- the leads 130 when the leads 130 are located within the gasket openings 127 , the leads 130 may be located approximately in the center of the cap openings 125 .
- the assembled cap 120 and gasket 122 may be positioned on the header 111 by inserting the leads 130 into the openings formed in the gasket 122 and sliding the assembled cap 120 and gasket 122 into place.
- the fingers 128 and/or the extension 126 may be soldered to the header 111 .
- each side along the length of each of the fingers 128 may be soldered to the header 111 .
- both sides of the extension 126 may be soldered to the header 111 where the extension 126 is near or in contact with the header 111 .
- FIG. 4 is an exploded perspective view of the TOSA 108 , the cap 120 , the gasket 122 , the PCB 110 , and the connector 116 .
- the connector 116 may be soldered to the PCB 110 as a step in the assembly process.
- the assembled TOSA 108 , cap 120 , and gasket 122 may be soldered to the assembled connector 116 and PCB 110 at a subsequent step.
- the gasket 122 may discourage the connector 116 from making a conductive connection with the cap 120 .
- the gasket 122 may facilitate a particular conductive connection between the connector 116 and the cap 120 . For example, a ground of the connector 116 may form a conductive connection with the cap 120 .
- the assembled TOSA 108 and PCB 110 may be positioned and secured relative to the shell 104 and the pad 124 .
- Other components, such as the ROSA 109 , the latch mechanism 114 , and the shell cover 106 may also be positioned and secured relative to the shell 104 to form the assembled optoelectronic module 100 .
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- This application is a Continuation of U.S. patent application Ser. No. 15/457,717, filed Mar. 13, 2017, titled THERMAL INTERFACE, which claims the benefit of U.S. Provisional Patent Application No. 62/307,063, filed Mar. 11, 2016, titled THERMAL INTERFACE FOR COMMUNICATION MODULE, both of which are incorporated herein by reference in their entirety.
- Communication modules, such as electronic or optoelectronic transceivers or transponder modules, are increasingly used in electronic and optoelectronic communication. Each communication module typically communicates with a host device printed circuit board by transmitting and/or receiving electrical data signals to and/or from the host device printed circuit board. The communication module can also transmit electrical data signals outside a host device as optical and/or electrical data signals. Many communication modules include optical subassemblies (individually, an “OSA”) such as transmitter optical subassemblies (individually, a “TOSA”) and/or receiver optical subassemblies (individually, a “ROSA”) to convert between the electrical and optical domains.
- Generally, a ROSA transforms an optical signal received from an optical fiber or other source to an electrical signal provided to the host device, while a TOSA transforms an electrical signal received from the host device to an optical signal emitted onto an optical fiber or other transmission medium. A photodiode or similar optical receiver contained by the ROSA transforms the optical signal to the electrical signal. A laser diode or similar optical transmitter contained within the optical subassembly is driven to emit an optical signal representing the electrical signal received from the host device.
- This Summary is provided to introduce a selection of concepts in a simplified form that are further described below. This Summary is not intended to identify key features or essential characteristics of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
- Embodiments may include a thermal interface may including a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.
- Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The features and advantages of the invention may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. These and other features of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of the invention as set forth hereinafter.
- To further clarify the above and other advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. These drawings depict only example embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail through the use of the accompanying drawings.
-
FIG. 1A illustrates a bottom perspective view of an optoelectronic module. -
FIG. 1B illustrates a partial bottom perspective view of the optoelectronic module ofFIG. 1A . -
FIG. 1C illustrates a partial exploded bottom perspective view of the optoelectronic module ofFIG. 1A . -
FIGS. 2A and 2B illustrate side perspective views of an assembly including a transmitter optical subassembly (TOSA), a cap, and a gasket. -
FIG. 2C illustrates an exploded side view of the assembly ofFIGS. 2A and 2B . -
FIG. 3 illustrates an exploded perspective view of the cap and the gasket ofFIGS. 2A-2C . -
FIG. 4 illustrates an exploded perspective view of an assembly including the assembly ofFIGS. 2A-2C and a printed circuit board (PCB) and connector. - The process of converting optical signals to electrical signals and electrical signals to optical signals can generate thermal energy in optical subassemblies (individually, an “OSA”) such as transmitter optical subassemblies (individually, a “TOSA”) and/or receiver optical subassemblies (individually, a “ROSA”). The thermal energy generated in the optical subassembly may potentially cause damage to the optical subassembly. Additionally, high-temperature environments can create unstable thermal conditions that can cause ineffective optical subassembly function.
- For example, for a TOSA, a high temperature environment can reduce laser performance or can cause premature laser failure. High temperatures may also cause problems to epoxies, solder, and/or other bonding materials in the optical subassembly. These high temperatures may become too great to be effectively dissipated and controlled by a thermoelectric cooler (TEC) installed in the optical subassembly.
- Some embodiments may include a thermal interface to dissipate heat produced by an optical subassembly. In some configurations, the thermal interface may conduct heat from an optical subassembly, such as a TOSA, to a shell or housing of the communication module housing the optical subassembly. In some embodiments, the optical subassembly may also include a TEC. Where a TEC is included, the thermal interface may facilitate more effective heat dissipation and control by the TEC. For example, the thermal interface may encourage relatively manageable heat levels.
- Reference is made to the drawings, where similar or equivalent components are referenced using the same reference numbers.
-
FIGS. 1A-1C illustrate various bottom perspective views of an exampleoptoelectronic module 100. -
FIG. 1A illustrates a bottom perspective view of theoptoelectronic module 100, including ahousing 102 that may include ashell 104 and ashell cover 106 attached together. Theoptoelectronic module 100 may include alatch mechanism 114 movingly positioned relative to thehousing 102. Thelatch mechanism 114 may allow theoptoelectronic module 100 to be selectively secured relative to a host device. - The
housing 102 may at least partially surround receiver and/or transmitter circuitry, including a printed circuit board (PCB) 110 having anedge connector 112 configured to be electrically coupled to the host device. For example, theoptoelectronic module 100 may be configured to be inserted into a host device cage of the host device such that theedge connector 112 may be electrically coupled to a connector of a host printed circuit board. - In general, the
optoelectronic module 100 may be employed in the communication of optical signals and the conversion of optical signals to and from electrical signals. In connection, the host device may be employed in the communication of corresponding electrical signals. - The
optoelectronic module 100 may include a transmit port and a receive port at a front of theoptoelectronic module 100. Theoptoelectronic module 100 may be configured for optical signal transmission and reception via the transmit port and the receive port at a variety of data rates including, but not limited to, 1.25 Gb/s, 2.125 Gb/s, 2.5 Gb/s, 2.7 Gb/s, 4.25 Gb/s, 8.5 Gb/s, 10.3 Gb/s, 10.5 Gb/s, 11.3 Gb/s, 14.025 Gb/s, or 100 Gb/s or higher. - The
optoelectronic module 100 may be configured for optical signal transmission and reception at various wavelengths including, but not limited to, 850 nm, 1310 nm, 1470 nm, 1490 nm, 1510 nm, 1530 nm, 1550 nm, 1570 nm, 1520-1570 nm, 1590 nm, or 1610 nm. Theoptoelectronic module 100 may be configured to support various communication protocols including, but not limited to, Optical Fast Ethernet, Optical Gigabit Ethernet, 10 Gigabit Ethernet, and 1x, 2x, 4x, 8x, and 16x Fibre Channel. - In addition, although one example of the
optoelectronic module 100 is configured to have a form factor that is substantially compliant with the SFP MSA, theoptoelectronic module 100 may alternatively be configured in a variety of different form factors that are substantially compliant with other MSAs including, but not limited to, the QSFP MSA, the QSFP+MSA, the CFP MSA, the CFP2 MSA, the CFP4 MSA, the XFP MSA, or the SFP+MSA. Finally, although theoptoelectronic module 100 is illustrated as a pluggable optoelectronic transceiver module, example embodiments disclosed herein may alternatively be employed, for example, in connection with other communications modules, other optoelectronic devices, or the like. -
FIG. 1B illustrates a bottom perspective view of theoptoelectronic module 100 ofFIG. 1A with theshell cover 106 and thelatch mechanism 114 omitted. Theoptoelectronic module 100 includes aTOSA 108 and aROSA 109. - The
TOSA 108 may include a TEC. A body of theheader 111 of theTOSA 108 may be formed from a nickel-cobalt ferrous alloy associated with the trademark Kovar, which is owned by CRS Holdings, Inc. The alloy may be employed, at least in part, for its thermal expansion properties, which may closely resemble the thermal expansion properties of glass, and which may facilitate glass-to-alloy assemblies capable of being exposed to a range of temperatures. Alternately or additionally, the body of theheader 111 may include other materials. The material used in theheader 111 may exhibit a relatively low thermal conductivity. For example, Kovar may exhibit a thermal conductivity approximately half that of copper. Thus, for example, a thermally conductive connection between theTOSA 108 and theshell 104 that relies significantly on conductive heat transfer through theheader 111 may exhibit relative inefficiency. - A
connector 116 may communicatively connect theTOSA 108 to thePCB 110. Thus, for example, theTOSA 108 may exchange signals with and/or receive electrical power from thePCB 110 via theconnector 116. Theconnector 116 may include a flex PCB that is soldered to thePCB 110 and soldered to theTOSA 108. -
FIG. 1C illustrates an exploded bottom perspective view of theoptoelectronic module 100 ofFIG. 1B . In some embodiments, athermal interface 118 may include acap 120, agasket 122, and apad 124. The use of the term gasket does not imply that thegasket 122 facilitates a fluid-tight connection. Thepad 124 may include a pliant thermal interface material (TIM) and may exhibit a relatively high thermal conductivity. Thepad 124 may be located within a seat of theshell 104. When theTOSA 108, including thecap 120, is positioned within theshell 104 during assembly, thepad 124 may be compressed such that theTOSA 108 and thecap 120 are accommodated. In some embodiments, thepad 124 may include multiple portions, as illustrated. Alternatively, thepad 124 may be one piece. -
FIGS. 2A and 2B illustrate side perspective views of theTOSA 108, thecap 120, and thegasket 122 ofFIGS. 1A-1C .FIG. 2C is an exploded side view of theTOSA 108, thecap 120, and thegasket 122. - With reference to
FIGS. 2A-2C , thecap 120 may exhibit a relatively high thermal conductivity. For example, thecap 120 may be formed from copper, plated copper, one or more copper alloys, and/or one or more other materials exhibiting a relatively high thermal conductivity. In some embodiments, thecap 120 may be manufactured at least in part via one or more stamping processes. - The
cap 120 may include one ormore fingers 128 and anextension 126. Thefingers 128 may be sized and shaped to be positioned at the side of theheader 111. In some embodiments, thefingers 128 may have a length approximately equal to the length of theheader 111 and/or a relatively wide portion of theheader 111. For example, thefingers 128 may have a length approximately equal to a base portion of theheader 111. Alternately, thefingers 128 may have some other length that may facilitate the positioning of thecap 120 on theheader 111. Theextension 126 may also be sized and shaped to be positioned at a side of theheader 111. Theextension 126 may have a longer length than thefingers 128. For example, theextension 126 may have a length longer than theheader 111 or longer than a base portion of theheader 111. The width of theextension 126 may correlate with the size of a corresponding seat width of theshell 104 ofFIGS. 1A-1C . Theextension 126 may include a length suitable for facilitating a desired rate of thermal energy transfer from the portion of thecap 120 in contact with theheader 111 to thepad 124 andshell 104. - The
cap 120 includes a base 121 located on an end face 113 (shown inFIG. 2C ) of theheader 111, which may be an external face of a wall of theheader 111 that includes electrically conductive leads 130 (described herein as an end wall). The leads 130 may be attached to theconnector 116 and allow theTOSA 108 to be operated. - Within the body of the
header 111, some or all of theleads 130 are conductively attached to components, such as a laser, a TEC, controlling circuitry, and the like. Most or all of theTOSA 108 components may be located on or near an internal face of the end wall of theheader 111. Thus, for example, the end wall and theend face 113 may receive relatively more thermal energy generated by theTOSA 108 components than other portions of theheader 111. Thermal energy from the end wall and nearby portions of theheader 111 may flow to thebase 121 of thecap 120. From there, thermal energy may flow to theextension 126. - In some embodiments, portions of the
cap 120, such as thebase 121, may be located relatively closer to the source of heat within theheader 111 relative to conventional heat transfer devices. Furthermore, thecap 120 may exhibit a relatively large area of contact to theend face 113 and sides of theheader 111, which may encourage a relatively high rate of heat transfer from theheader 111 to thecap 120 via conduction. - With reference to
FIGS. 1B-1C and 2A-2C , thepad 124 may be shaped to contact both theshell 104 and theextension 126 of thecap 120 and thermal energy may transfer conductively from theextension 126 of thecap 120 to theshell 104 via thepad 124. Compressing thepad 124 may reduce or eliminate air-filled gaps, which may inhibit the transfer of thermal energy, between thepad 124 and thecap 120 and/or theshell 104. - The
pad 124 may facilitate a relatively more efficient thermally-conductive connection between thecap 120 and theshell 104 than direct contact between thecap 120 andshell 104. For example, direct contact between thecap 120 and theshell 104 may be imperfect and may result in air-filled gaps between thecap 120 and theshell 104. Alternately or additionally, direct contact between thecap 120 and theshell 104 may cause deviations in the thermal conductivity exhibited by the connection when theoptoelectronic module 100 is subjected to movement. In some embodiments, thepad 124 may be omitted. For example, direct contact may be made between thecap 120 and theshell 104. - In some embodiments, the configuration of the
thermal interface 118 may facilitate a floating OSA configuration ofoptoelectronic module 100. Thus, for example, theTOSA 108 may not be overly mechanically restrained and may accommodate variations in connector dimensions, manufacturing tolerances, or the like. Alternately or additionally, the configuration of thethermal interface 118 may resist deviations in the thermal conductivity exhibited by thethermal interface 118 when theoptoelectronic module 100 is subjected to movement. - In some embodiments, the
thermal interface 118 may facilitate a reduction of power consumption by theoptoelectronic module 100. In some embodiments, power consumption may be reduced by up to 26.4 milliwatts (mW). Alternately, power consumption may be reduced by more than 26.4 mW. Thus, for example, thethermal interface 118 may facilitate a reduction in yield loss. In some embodiments, thethermal interface 118 may be employed in communication modules having a high power transistor outline-can (TO-can) based OSA. -
FIG. 3 is an exploded perspective view of thecap 120 and thegasket 122.Openings 125 formed in the cap 120 (described herein as “cap openings 125”) andcorresponding openings 127 formed in the gasket 122 (described herein as “gasket openings 127”) may be configured to allow theleads 130 of theheader 111, (shown inFIGS. 2A-2C ), to pass through thecap 120 and thegasket 122 such that theleads 130 may be soldered to the connector 116 (FIGS. 1B-1C ). Thegasket 122 may be attached to thecap 120 via an adhesive 123, such as an adhesive tape, an epoxy, or the like. Alternately, thegasket 122 may be attached to thecap 120 by other means. Thegasket 122 may be attached to thecap 120 such that thegasket openings 127 are positioned over thecap openings 125. In some embodiments, thegasket openings 127 and thecap openings 125 may be circular and may be substantially axially aligned. - The
gasket openings 127 may be relatively smaller than thecap openings 125. With reference toFIGS. 2A-2C and 3 , the relativelylarger cap openings 125 may provide clearance for theleads 130 of theheader 111, such that thecap 120 may not contact one or more of theleads 130 and create an undesirable conductive connection between thecap 120 and theleads 130. In some embodiments, thecap 120 may be configured to contact one or more of theleads 130 to create a particular conductive connection. For example, in some embodiments, thecap 120 may be conductively connected to a ground lead of theleads 130. - The relatively
smaller gasket openings 127 and the position of thegasket 122 on thecap 120 may facilitate positioning theleads 130 in a desired position relative to thecap openings 125. For example, thegasket 122 may be attached to thecap 120 such that each of thegasket openings 127 may be approximately centered relative to one of thecap openings 125. Thus, for example, when theleads 130 are located within thegasket openings 127, theleads 130 may be located approximately in the center of thecap openings 125. - As may be best seen in
FIGS. 2A-2C , the assembledcap 120 andgasket 122 may be positioned on theheader 111 by inserting theleads 130 into the openings formed in thegasket 122 and sliding the assembledcap 120 andgasket 122 into place. In some embodiments, thefingers 128 and/or theextension 126 may be soldered to theheader 111. For example, each side along the length of each of thefingers 128 may be soldered to theheader 111. Alternately or additionally, both sides of theextension 126 may be soldered to theheader 111 where theextension 126 is near or in contact with theheader 111. -
FIG. 4 is an exploded perspective view of theTOSA 108, thecap 120, thegasket 122, thePCB 110, and theconnector 116. In some embodiments, theconnector 116 may be soldered to thePCB 110 as a step in the assembly process. In some embodiments, the assembledTOSA 108,cap 120, andgasket 122 may be soldered to the assembledconnector 116 andPCB 110 at a subsequent step. Thegasket 122 may discourage theconnector 116 from making a conductive connection with thecap 120. In some embodiments, thegasket 122 may facilitate a particular conductive connection between theconnector 116 and thecap 120. For example, a ground of theconnector 116 may form a conductive connection with thecap 120. - As may be best seen in
FIGS. 1A-1C , the assembledTOSA 108 andPCB 110 may be positioned and secured relative to theshell 104 and thepad 124. Other components, such as theROSA 109, thelatch mechanism 114, and theshell cover 106 may also be positioned and secured relative to theshell 104 to form the assembledoptoelectronic module 100.
Claims (17)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US16/533,696 US20200033541A1 (en) | 2016-03-11 | 2019-08-06 | Thermal interface |
Applications Claiming Priority (3)
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US201662307063P | 2016-03-11 | 2016-03-11 | |
US15/457,717 US10371909B2 (en) | 2016-03-11 | 2017-03-13 | Thermal interface |
US16/533,696 US20200033541A1 (en) | 2016-03-11 | 2019-08-06 | Thermal interface |
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US15/457,717 Continuation US10371909B2 (en) | 2016-03-11 | 2017-03-13 | Thermal interface |
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US20200033541A1 true US20200033541A1 (en) | 2020-01-30 |
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US15/457,717 Active US10371909B2 (en) | 2016-03-11 | 2017-03-13 | Thermal interface |
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EP (1) | EP3427099A1 (en) |
JP (1) | JP6694969B2 (en) |
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CA (1) | CA3017370A1 (en) |
WO (1) | WO2017156542A1 (en) |
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CN108306144B (en) * | 2017-02-16 | 2019-10-01 | 番禺得意精密电子工业有限公司 | Electric connector combination |
US10856055B2 (en) * | 2019-03-20 | 2020-12-01 | Mellanox Technologies, Ltd. | Apparatuses for improved thermal performance of dynamic network connections |
US11275223B1 (en) * | 2020-09-04 | 2022-03-15 | Prime World International Holdings Ltd. | Optical transceiver |
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Also Published As
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JP2019516234A (en) | 2019-06-13 |
JP6694969B2 (en) | 2020-05-20 |
EP3427099A1 (en) | 2019-01-16 |
US10371909B2 (en) | 2019-08-06 |
CN109073840A (en) | 2018-12-21 |
US20170261711A1 (en) | 2017-09-14 |
CA3017370A1 (en) | 2017-09-14 |
WO2017156542A1 (en) | 2017-09-14 |
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