US20190333785A1 - Substrate processing apparatus - Google Patents
Substrate processing apparatus Download PDFInfo
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- US20190333785A1 US20190333785A1 US16/394,320 US201916394320A US2019333785A1 US 20190333785 A1 US20190333785 A1 US 20190333785A1 US 201916394320 A US201916394320 A US 201916394320A US 2019333785 A1 US2019333785 A1 US 2019333785A1
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- edge ring
- spring
- middle edge
- processing apparatus
- substrate processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
Definitions
- the present disclosure relates to a substrate processing apparatus.
- an edge ring is provided around an outer circumference of a wafer (see Patent Document 1, for example).
- the edge ring controls plasma in a vicinity of the outer circumference of the wafer, and improves uniformity of an etching rate on a surface of the wafer.
- the present disclosure aims at providing a technique for securing thermal contact and electrical contact of separated edge rings.
- a substrate processing apparatus including an inner edge ring provided in a vicinity of a substrate to be placed on a stage in a processing chamber; a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism; an outer edge ring arranged outside the middle edge ring; a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring.
- FIG. 1 is a diagram illustrating an example of a substrate processing apparatus according to an embodiment
- FIG. 2 is a diagram illustrating a structure of an edge ring and its vicinity according to the embodiment
- FIG. 3A is a perspective view of the edge ring according to the embodiment.
- FIG. 3B is a plan view of the edge ring according to the embodiment.
- FIGS. 3C to 3D are cross-sectional views of the edge ring according to the embodiment.
- FIGS. 4A and 4B are diagrams illustrating vertical movement of the edge ring according to the embodiment
- FIGS. 5A and 5B are diagrams illustrating contacting members of an edge ring according to Example 1;
- FIGS. 6A and 6B are diagrams illustrating contacting members of an edge ring according to Example 2.
- FIGS. 7A and 7B are graphs each illustrating a load characteristic of springs.
- FIGS. 8A and 8B are diagrams for explaining contact resistance of the contacting member according to the embodiment.
- FIG. 1 is a diagram illustrating a structure of the substrate processing apparatus 5 according to the embodiment.
- the present embodiment describes a case in which the substrate processing apparatus 5 is a capacitively coupled plasma type parallel-flat plate substrate processing apparatus.
- the substrate processing apparatus 5 includes a chamber 10 which is a cylindrical vacuum vessel made from metal such as aluminum or stainless steel.
- the chamber 10 is an example of a processing vessel.
- An inside of the chamber 10 is a processing chamber for performing a plasma process.
- the chamber 10 is grounded.
- a disc shaped stage 12 is provided at a center of a lower portion in the chamber 10 .
- the stage 12 is a base for holding a substrate, and the stage 12 also acts as a lower electrode.
- the stage 12 is made from aluminum, for example.
- the stage 12 is supported by a cylindrical conductive supporting member 16 that extends upward from the bottom of the chamber 10 , and by a housing 100 adjacently provided at an inside of the cylindrical conductive supporting member 16 .
- annular exhaust path 18 is formed between the cylindrical conductive supporting member 16 and a side wall of the chamber 10 .
- annular baffle plate 20 is provided at an upper portion or an entrance of the exhaust path 18 .
- At a bottom of the exhaust path 18 at least one exhaust port 22 is provided.
- multiple exhaust ports 22 are provided at regular intervals in a circumferential direction.
- An exhaust device 26 is connected to each of the exhaust ports 22 via an exhaust pipe 24 .
- the exhaust device 26 includes a vacuum pump such as a turbomolecular pump, and can reduce pressure of a plasma generating space S in the chamber 10 to a desirable quality of vacuum.
- a gate valve 28 is provided at the side wall of the chamber 10 , which is used for opening and/or closing a loading/unloading port 27 for a wafer W.
- a second high frequency power source 30 is electrically connected to the stage 12 via a matching unit 32 and a feeder 34 .
- the second high frequency power source 30 supplies high frequency electric power LF of a first frequency (such as a radio frequency at 13.56 MHz) suitable for controlling energy of ions to be attracted to a wafer W.
- the high frequency electric power LF output from the second high frequency power source 30 is variable.
- the matching unit 32 includes a variable reactance matching circuit to cause impedance of the second high frequency power source 30 to match impedance of a load (plasma and the like).
- the stage 12 includes an electrostatic chuck 36 for holding a wafer W by using electrostatic force.
- the electrostatic chuck 36 is provided on an upper surface of the stage 12 .
- the electrostatic chuck 36 is made by sandwiching an electrode 36 a formed of a conductive film between a pair of insulating films 36 b .
- a direct-current (DC) power source 40 is electrically connected to the electrode 36 a via a switch 42 and a coated wire 43 .
- the electrostatic chuck 36 generates electrostatic force by DC voltage supplied from the DC power source 40 , and a wafer W is attracted to and held by the electrostatic chuck 36 by the generated electrostatic force.
- an annular coolant passage 44 extending, for example, in a circumferential direction is provided.
- coolant such as cooling water cw is supplied to the coolant passage 44 at a predetermined temperature, and the coolant circulates in the coolant passage 44 via pipes 46 and 48 , in order to control a temperature of a wafer W placed on the electrostatic chuck 36 by a temperature of the coolant.
- a heater may also be provided in the stage 12 .
- heat transmitting gas such as He gas
- a heat transmitting gas supply unit via a gas supply pipe 50 .
- a pusher pin capable of moving up and down, and an elevation mechanism for the pusher pin are provided at the stage 12 .
- the pusher pin is used for loading and unloading a wafer.
- the pusher pin is provided so as to penetrate the stage in a vertical direction.
- a shower head 51 is mounted at a ceiling of the chamber 10 via a shield ring 54 covering a periphery of the shower head 51 , such that an opening of the ceiling of the chamber 10 is closed with the shower head 51 .
- the shower head 51 may be formed of aluminum or silicon.
- the shower head 51 also acts as an upper electrode facing the stage 12 acting as the lower electrode.
- a gas inlet 56 for introducing gas is formed at the shower head 51 .
- a diffusion chamber 58 branching from the gas inlet 56 is provided inside the shower head 51 .
- Gas output from a gas supply source 66 is supplied to the diffusion chamber 58 via the gas inlet 56 , and diffuses in the diffusion chamber 58 . Then the gas is introduced from the large number of gas holes 52 to the plasma generating space S.
- a first high frequency power source 57 is electrically connected to the shower head 51 via a matching unit 59 and a feeder 60 .
- the first high frequency power source 57 outputs high frequency electric power HF of a second frequency (such as a radio frequency at 40 MHz) higher than the first frequency, which is suitable for generating plasma by high frequency discharge.
- the first high frequency power source 57 can output the high frequency electric power HF by a variable amount.
- the matching unit 59 includes a variable reactance matching circuit to cause impedance of the first high frequency power source 57 to match impedance of a load (plasma and the like).
- a control unit 74 includes a microcomputer for example, and controls operations of each component of the substrate processing apparatus 5 and an operation of the entirety of the substrate processing apparatus 5 .
- Examples of the components in the substrate processing apparatus 5 include the exhaust device 26 , the first high frequency power source 57 , the second high frequency power source 30 , the matching unit 32 , the matching unit 59 , the switch 42 for the electrostatic chuck, the gas supply source 66 , the chiller unit, and the heat transmitting gas supply unit.
- the gate valve 28 is opened first, a wafer W is loaded into the chamber 10 , and the wafer W is placed on the electrostatic chuck 36 . Subsequently, after the gate valve 28 is closed, a predetermined gas is introduced from the gas supply source 66 to the chamber 10 , at a predetermined flow rate or a flow ratio of gases, and pressure in the chamber 10 is reduced to a predetermined value by the exhaust device 26 . Further, the first high frequency power source 57 is turned on to output the high frequency electric power HF for generating plasma at predetermined magnitude, and to supply the high frequency electric power HF to the shower head 51 via the matching unit 59 and the feeder 60 .
- the second high frequency power source 30 When the high frequency electric power LF for attracting ions is applied, the second high frequency power source 30 is turned on to output the high frequency electric power LF at predetermined magnitude, and to supply the high frequency electric power LF to the stage 12 via the matching unit 32 and the feeder 34 . Further, heat transmitting gas is supplied to a contacting surface between the electrostatic chuck 36 and the wafer W, from the heat transmitting gas supply unit. In addition, the switch 42 is turned on, to apply DC voltage to the electrode 36 a of the electrostatic chuck 36 , and to enclose the heat transmitting gas at the contacting surface by electrostatic force between the wafer W and the electrostatic chuck 36 .
- An edge ring 38 is disposed at an outer circumference of the stage 12 so as to annularly surround a periphery of a wafer W placed on the stage 12 .
- the edge ring 38 is arranged in a vicinity of the wafer W.
- the edge ring 38 controls plasma at the outer circumference of the wafer W, and improves uniformity of a process such as etching on a surface of the wafer W.
- the edge ring 38 includes three separated rings, an inner edge ring 38 i , a middle edge ring 38 m , and an outer edge ring 380 .
- the inner edge ring 38 i is arranged in the vicinity of the wafer W placed on the stage 12 in the chamber 10 .
- the middle edge ring 38 m is provided outside the inner edge ring 38 i , and can be moved vertically (up and down) by an actuation mechanism 200 .
- the outer edge ring 38 o is provided outside the middle edge ring 38 m.
- the actuation mechanism 200 includes a lift pin 102 .
- the lift pin 102 is moved vertically by a driving force of a piezo actuator 101 via a member 104 ( 104 a ) and a bushing 105 .
- a connecting member 103 moves vertically, and thereby the middle edge ring 38 m connected to the connecting member 103 moves vertically.
- edge ring 38 Next, a structure of the edge ring 38 and its peripheral parts will be described with reference to FIG. 2 and FIGS. 3A to 3D . Also, vertical movement of the middle edge ring 38 m will be described with reference to FIGS. 4A and 4B .
- FIG. 2 is an enlarged view of a vertical cross section of an example of the edge ring 38 and its vicinity according to the present embodiment.
- the edge ring 38 according to the present embodiment, the actuation mechanism 200 , and the piezo actuator 101 are illustrated.
- FIG. 3A illustrates a perspective view of each of the pieces of the edge ring 38
- FIG. 3B is a plan view of each of the three separated rings of the edge ring 38
- FIG. 3C is a cross sectional view taken along a line I-I in FIG. 3B
- FIG. 3D illustrates a cross sectional view taken along a line II-II in FIG. 3B .
- the inner edge ring 38 i is an innermost member of the edge ring 38 , which is provided in the vicinity of an outer circumference of a wafer W so as to surround the wafer W below the wafer W.
- the middle edge ring 38 m is a member provided outside the inner edge ring 38 i so as to surround the inner edge ring 38 i .
- the outer edge ring 38 o is an outermost member of the edge ring 38 , which is provided outside the middle edge ring 38 m .
- the inner edge ring 38 i and the outer edge ring 38 o are fixed on the upper surface of the electrostatic chuck 36 , via a heat transfer sheet 39 i and a heat transfer sheet 390 respectively.
- the middle edge ring 38 m is configured to be movable vertically by the actuation mechanism 200 .
- the middle edge ring 38 m includes a ring portion 38 m 1 surrounding a periphery of the wafer W, and three tabs 38 m 2 .
- the tabs 38 m 2 are rectangular members projecting outward from the ring portion 38 m 1 , and are arranged at an outer circumference of the ring portion 38 m 1 at regular intervals.
- a vertical cross section (a cross section taken along the vertical direction) of the ring portion 38 m 1 is of an L-shape.
- the middle edge ring 38 m is moved upward from a state in which an L-shaped step of the ring portion 38 m 1 is in contact with a step of the inner edge ring 38 i having an L-shaped vertical cross section, the step of the ring portion 38 m 1 is apart from the step of the inner edge ring 38 i.
- the tab 38 m 2 of the middle edge ring 38 m is connected to the annular connecting member 103 .
- the connecting member 103 vertically moves in a space 16 a provided in the cylindrical conductive supporting member 16 .
- the actuation mechanism 200 is for moving the middle edge ring 38 m vertically, and includes the lift pin 102 and the bushing 105 .
- the actuation mechanism 200 is fitted to the housing 100 provided around the stage 12 , and is configured to be moved vertically by the driving force of the piezo actuator 101 attached to the housing 100 .
- the lift pin 102 may be formed of sapphire.
- the housing 100 is made from insulating material such as alumina.
- the housing 100 is adjacently provided inside the cylindrical conductive supporting member 16 such that a side surface and a bottom surface of the housing 100 touch the cylindrical conductive supporting member 16 .
- the actuation mechanism 200 is provided in the housing 100 .
- the lift pin 102 penetrates the housing 100 and the stage 12 , and is in contact with a bottom surface of the connecting member 103 in the space 16 a provided in the cylindrical conductive supporting member 16 .
- the bushing 105 is fitted to the member 104 a provided inside the housing 100 . In a hole for the lift pin 102 , an 0 ring 111 for separating vacuum space from atmosphere is provided.
- a bottom end of the lift pin 102 is fitted from above.
- the lift pin 102 moves vertically via the member 104 a by a positioning operation of the piezo actuator 101 , the lift pin 102 moves vertically, and the lift pin 102 pushes the bottom surface of the connecting member 103 upward, or pulls the bottom surface of the connecting member 103 downward. Accordingly, the middle edge ring 38 m moves vertically via the connecting member 103 .
- the piezo actuator 101 is bolted to the member 104 a with a screw 104 c , and a bottom end of the piezo actuator 101 is bolted to a member 104 b with a screw 104 d . Accordingly, the piezo actuator 101 is fixed to the housing 100 between the member 104 a and the member 104 b.
- the piezo actuator 101 is an element for positioning, which utilizes piezoelectric effect, and can perform positioning at a resolution of 0.006 mm (6 ⁇ m).
- the lift pin 102 moves vertically in accordance with an amount of vertical displacement of the piezo actuator 101 . Accordingly, the middle edge ring 38 m moves vertically by 0.006 mm unit at minimum.
- the corresponding lift pin 102 For each of the three tabs 38 m 2 arranged on the circumference of the ring portion 38 m 1 at regular intervals in the circumferential direction, the corresponding lift pin 102 is provided. Accordingly, the lift pins 102 push the middle edge ring 38 m upward at three points, via the annular connecting member 103 , and the middle edge ring 38 m is raised to a desired height.
- recesses 138 are formed at locations corresponding to the tabs 38 m 2 of the middle edge ring 38 m .
- the recess 138 is wider than the tab 38 m 2 .
- FIG. 3D which illustrates the cross sectional view taken along the line II-II in FIG. 3B , the lift pin 102 and the recess 138 are not present.
- FIG. 3D illustrates a state in which the annular connecting member 103 is raised upward in the space 16 a of the cylindrical conductive supporting member 16 because the lift pin 102 has moved upward.
- the corresponding piezo actuator 101 is provided in a space of the housing 100 below the lift pin 102 . That is, three actuation mechanisms 200 and the three piezo actuators 101 , which correspond to the lift pins 102 disposed at three locations respectively, are provided in the housing 100 .
- the member 104 a and the member 104 b are annular members, and the member 104 b is positioned below the member 104 a .
- the three piezo actuators 101 are disposed between the members 104 a and 104 b , and bolted on the members 104 a and 104 b .
- the three piezo actuators 101 are connected with each other via the members 104 a and 104 b .
- the piezo actuator 101 according to the present embodiment is an example of an actuating unit.
- the stage 12 (including the electrostatic chuck 36 ) is supported by the housing 100 , and the actuation mechanisms 200 and the actuating units are fitted to the housing 100 . Accordingly, only the middle edge ring 38 m can be moved vertically by using the existing electrostatic chuck 36 , without requiring a design modification of the electrostatic chuck 36 .
- the middle edge ring 38 m can be moved to not only an upward direction but also a downward direction. Accordingly, the middle edge ring 38 m can be moved in the predetermined space to not only an upward direction but also a downward direction by a predetermined amount. Because the middle edge ring 38 m can be moved to not only an upward direction but also a downward direction, a range of controlling a sheath can be extended.
- an actuating unit is not limited to the piezo actuators 101 , and a motor capable of performing positioning control at a resolution of 0.006 mm may be used as an actuating unit.
- the number of actuating units may be one, or more than one.
- a motor for vertically moving a pusher pin used for raising a wafer W may be used as an actuating unit for moving the middle edge ring 38 m .
- a mechanism such as a gear or a driving force switching unit, for switching a destination of transmitting a driving force of the motor between the pusher pin used for raising a wafer W and the lift pin 102 for the middle edge ring 38 m , is required.
- a mechanism for controlling vertical movement of the lift pin 102 at a resolution of 0.006 mm is required.
- a diameter of the middle edge ring 38 m arranged around an outer circumference of a 300 mm wafer W is large, approximately 310 mm, an actuating unit for the lift pin 102 and an actuating unit for the pusher pin used for raising a wafer W are preferably separate.
- the control unit 74 may control positioning of the piezo actuators 101 such that a vertical displacement amount of the piezo actuators 101 is in accordance with amount of abrasion of the middle edge ring 38 m .
- the control unit 74 may determine a vertical displacement amount of the piezo actuators 101 in accordance with a process condition, regardless of amount of abrasion of the middle edge ring 38 m.
- a height of a sheath on the wafer W and a height of a sheath on the edge ring 38 during an etching process can become the same.
- uniformity of an etching rate on a surface of a wafer W can be improved.
- an edge portion on a wafer W refers to a ring-shaped region on the wafer W, which is 140 mm to 150 mm away from a center of the wafer W in a radial direction.
- the middle edge ring 38 m is raised by an amount corresponding to amount of abrasion of the edge ring 38 , to align a height of the sheath on the wafer W and a height of the sheath on the edge ring 38 . Accordingly, occurrence of a sharp increase of an etching rate at the edge portion of the wafer W, or tilting in the etching profile can be avoided.
- the piezo actuator 101 may be controlled such that the middle edge ring 38 m is moved upward by 1.0 mm.
- the middle edge ring 38 m is moved upward by 1.0 mm.
- the inner edge ring 38 i and the outer edge ring 38 o are fixed on the electrostatic chuck 36 , with the inner edge ring 38 i and the outer edge ring 38 o contacted via the heat transfer sheet 39 i and the heat transfer sheet 390 respectively.
- the inner edge ring 38 i and the outer edge ring 38 o which are immovable members, are thermally and electrically stable.
- the middle edge ring 38 m may become thermally and electrically unstable, and controllability of temperature of the middle edge ring 38 m may deteriorate.
- controllability of temperature of the middle edge ring 38 m deteriorates, especially in a deposition process, control of an edge portion of a wafer W becomes difficult.
- process characteristics among wafers W in a production lot vary, and productivity decreases.
- a technique for making the middle edge ring 38 m thermally and electrically stable will be described.
- the edge ring 38 of Example 1 includes a contacting member 37 a disposed between the the inner edge ring 38 i and the middle edge ring 38 m , and a contacting member 37 b disposed between the middle edge ring 38 m and the outer edge ring 380 .
- the contacting member 37 a is disposed between a horizontal surface of the inner edge ring 38 i and a horizontal surface of the middle edge ring 38 m .
- the contacting member 37 b is disposed between a horizontal surface of the middle edge ring 38 m and a horizontal surface of the outer edge ring 380 .
- FIG. 5A A cross section of the edge ring 38 taken along a line I-I in FIG. 3B is illustrated in FIG. 5A .
- a diagram (a-1) of FIG. 5A illustrates a state of the edge ring 38 in which the middle edge ring 38 m is not raised by the lift pin 102 (Down (0 mm) state).
- a diagram (a-2) of FIG. 5A illustrates a state of the edge ring 38 in which the middle edge ring 38 m is raised by the lift pin 102 , that is, an Up state (1 mm up, for example).
- FIG. 5B A cross section of the edge ring 38 taken along a line II-II in FIG. 3B is illustrated in FIG. 5B .
- a diagram (b-1) of FIG. 5B illustrates a state of the edge ring 38 in which the middle edge ring 38 m is not raised by the lift pin 102 , that is, a Down state.
- a diagram (b-2) of FIG. 5B illustrates a state of the edge ring 38 in which the middle edge ring 38 m is raised by the lift pin 102 , that is, an Up state.
- the actuation mechanism 200 can raise the middle edge ring 38 m at a resolution of 0.006 mm.
- the contacting member 37 a is pressed between the horizontal surfaces of the inner edge ring 38 i and the middle edge ring 38 m , and is deformed. Accordingly, contacting area of the contacting member 37 a with the inner edge ring 38 i and the middle edge ring 38 m is enlarged, and thermal contact and electrical contact of the middle edge ring 38 m becomes larger.
- a degree of deformation of the contacting member 37 b is small (note that, in the following description, deformation of the contacting member 37 a or 37 b may be referred to as “displacement”, and a degree of deformation of the contacting member 37 a or 37 b may be referred to as a “displacement amount”).
- the contacting member 37 b is interposed between the middle edge ring 38 m and the outer edge ring 38 o , thermal contact and electrical contact between the middle edge ring 38 m and the electrostatic chuck 36 via the outer edge ring 38 o is stably secured.
- the contacting member 37 b is pressed between the horizontal surfaces of the middle edge ring 38 m and the outer edge ring 38 o , and is deformed. Accordingly, contacting area of the contacting member 37 b with the middle edge ring 38 m and the outer edge ring 38 o is enlarged, and thermal contact and electrical contact of the middle edge ring 38 m becomes larger.
- a degree of deformation of the contacting member 37 a is small.
- the contacting member 37 a is interposed between the inner edge ring 38 i and the middle edge ring 38 m , thermal contact and electrical contact between the middle edge ring 38 m and the electrostatic chuck 36 via the inner edge ring 38 i is stably secured.
- Example 1 because the contacting member 37 a and the contacting member 37 b are arranged in a circumferential direction over an entire circumference of the middle edge ring 38 m , the movable middle edge ring 38 m can be caused to be in stable thermal and electrical contact with the inner edge ring 38 i and the outer edge ring 38 o stably. Accordingly, heat conductivity between the stage 12 (electrostatic chuck 36 ) and the middle edge ring 38 m improves, and controllability of temperature of the edge ring 38 can be improved. As a result, excellent process control at an edge portion of a wafer W is realized, variance of process characteristics among wafers W in a production lot can be reduced, and productivity improves.
- the contacting member 37 a and the contacting member 37 b may not necessarily be provided over an entire circumference of the middle edge ring 38 m . However, in order that the middle edge ring 38 m is caused to be in stable thermal and electrical contact with the stage 12 stably, it is preferable that the contacting member 37 a and the contacting member 37 b are arranged in the circumferential direction over the entire circumference of the middle edge ring 38 m.
- the contacting member 37 a in Example 1 is an example of a first spring provided between the inner edge ring 38 i and the middle edge ring 38 m .
- the contacting member 37 b in Example 1 is an example of a second spring provided between the middle edge ring 38 m and the outer edge ring 380 .
- the edge ring 38 of Example 2 includes a contacting member 37 a disposed between the stage 12 and the middle edge ring 38 m , and a contacting member 37 b disposed between the middle edge ring 38 m and the outer edge ring 380 .
- the contacting member 37 a is disposed between a horizontal surface of the stage 12 (electrostatic chuck 36 ) and a horizontal surface of the middle edge ring 38 m .
- the contacting member 37 b is disposed between a horizontal surface of the middle edge ring 38 m and a horizontal surface of the outer edge ring 380 .
- FIG. 6A A cross section of the edge ring 38 taken along the line I-I in FIG. 3B is illustrated in FIG. 6A .
- a diagram (a-1) of FIG. 6A illustrates a state of the edge ring 38 in which the middle edge ring 38 m is not raised by the lift pin 102 (Down (0 mm) state).
- a diagram (a-2) of FIG. 6A illustrates a state of the edge ring 38 in which the middle edge ring 38 m is raised by the lift pin 102 , that is, an Up state (1 mm up, for example).
- FIG. 6B A cross section of the edge ring 38 taken along the line II-II in FIG. 3B is illustrated in FIG. 6B .
- a diagram (b-1) of FIG. 6B illustrates a state of the edge ring 38 in which the middle edge ring 38 m is not raised by the lift pin 102 , that is, a Down state.
- a diagram (b-2) of FIG. 6B illustrates a state of the edge ring 38 in which the middle edge ring 38 m is raised by the lift pin 102 , that is, an Up state.
- the contacting member 37 a is pressed between the horizontal surfaces of the electrostatic chuck 36 (stage 12 ) and the middle edge ring 38 m , and is deformed. Accordingly, contacting area of the contacting member 37 a with the electrostatic chuck 36 (stage 12 ) and the middle edge ring 38 m is enlarged, and thermal contact and electrical contact of the middle edge ring 38 m becomes larger.
- the contacting member 37 b is not strongly pressed between the horizontal surfaces of the middle edge ring 38 m and the outer edge ring 38 o , a degree of deformation of the contacting member 37 b is small. However, because the contacting member 37 b is interposed between the middle edge ring 38 m and the outer edge ring 38 o , thermal contact and electrical contact between the middle edge ring 38 m and the electrostatic chuck 36 via the outer edge ring 38 o is stably secured.
- the contacting member 37 b is pressed between the horizontal surfaces of the middle edge ring 38 m and the outer edge ring 38 o , and is deformed. Accordingly, contacting area of the contacting member 37 b with the middle edge ring 38 m and the outer edge ring 38 o is enlarged, and thermal contact and electrical contact of the middle edge ring 38 m becomes larger.
- a degree of deformation of the contacting member 37 a is small.
- the contacting member 37 a is interposed between the electrostatic chuck 36 (stage 12 ) and the middle edge ring 38 m , thermal contact and electrical contact between the stage 12 (electrostatic chuck 36 ) and the middle edge ring 38 m is stably secured.
- Example 2 because the contacting member 37 a and the contacting member 37 b are disposed at the middle edge ring 38 m (specifically, at the tabs 38 m 2 ), the movable middle edge ring 38 m can be caused to be in stable thermal and electrical contact with the stage 12 (electrostatic chuck 36 ) via the inner edge ring 38 i and the outer edge ring 380 . Accordingly, controllability of temperature of the edge ring 38 can be improved, and excellent process control at an edge portion of a wafer W is realized. As a result, variance of process characteristics among wafers W in a production lot can be reduced, and productivity improves.
- Example 2 thermal contact and electrical contact between the stage 12 and the middle edge ring 38 m are secured by the contacting members 37 a and 37 b .
- each of a plural number of contacting members 37 a and of contacting members 37 b are arranged at the middle edge ring 38 m along a circumferential direction. Specifically, the contacting members 37 a and the contacting members 37 b are disposed at the three tabs 38 m 2 provided on the outer circumference of the middle edge ring 38 m .
- the contacting member 37 a in Example 2 is an example of a first spring provided between the stage 12 and the middle edge ring 38 m .
- the contacting member 37 b in Example 2 is an example of a second spring provided between the middle edge ring 38 m and the outer edge ring 380 .
- the contacting members 37 a and 37 b according to Examples 1 and 2 illustrated in FIGS. 5A to 6B may have the following characteristics.
- the contacting members 37 a and 37 b according to Examples 1 and 2 are preferably coil-shaped elastic members.
- the contacting members 37 a and 37 b are preferably canted coils.
- the contacting members 37 a and 37 b may be canted coil springs in which a wire is obliquely wound.
- the contacting members 37 a and 37 b may be coils arranged in a circumferential direction in a canted state.
- the contacting members 37 a and 37 b are preferably arranged in the circumferential direction over an entire circumference.
- the contacting members 37 a and 37 b may be made from beryllium copper (BeCu), tungsten (W), or tantalum (Ta).
- the movable middle edge ring 38 m can be in stable thermal and electrical contact with the stage 12 , by avoiding the middle edge ring 38 m becoming in a thermally and electrically floating state.
- temperature control of the entire edge ring 38 is improved, and occurrence of abnormal discharge can be prevented.
- a place in which the contacting members 37 a and 37 b are disposed is not limited to the horizontal surface of the middle edge ring 38 m .
- a recess may be formed on a side wall (vertical surface) of the recess 138 of the outer edge ring 38 o where the tab 38 m 2 is inserted, and the contacting member 37 b may be embedded on the recess on the side wall.
- the contacting member 37 b is disposed between a vertical surface of the middle edge ring 38 m and a vertical surface of the outer edge ring 380 . In this configuration, thermal and electrical contact between the middle edge ring 38 m and the outer edge ring 38 o can also be stably maintained.
- an elastic member in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is small, is used as the contacting members 37 a and 37 b , rather than an elastic member in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is large.
- an elastic member to be used as the contacting members 37 a and 37 b may have a characteristic that a ratio of a range of a displacement of the elastic member with respect to a predetermined range of force applied to the elastic member to a maximum amount of displacement of the elastic member is greater than or equal to a specific value (specific ratio).
- a spring C is an example of an elastic member having a wide range of displacement in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is large.
- a spring D is an example of an elastic member having a wide range of displacement in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is small.
- a ratio of a range of a displacement (D 1 ) with respect to the predetermined range of force (P) to the maximum amount of displacement (Dm) is greater than or equal to the specific value (0.7). Therefore, because a variation of restoring force of the spring D with respect to a displacement of the spring D is small, the characteristic of the spring D is suitable for the contacting members 37 a and 37 b.
- restoring force of the contacting members 37 a and 37 b is small. If the restoring force of the contacting members 37 a and 37 b is large, it is difficult for the motor to perform actuation smoothly.
- a curve D 12 in FIG. 7B represents a characteristic of a combination of springs D 1 and D 2 each having the same characteristics as the spring D. That is, the curve D 12 represents a case in which the springs D 1 and D 2 are used as the contacting members 37 a and 37 b respectively. In the following, the combination of the springs D 1 and D 2 will be referred to as a “spring D 12 ”.
- a curve C 12 in FIG. 7B represents a characteristic of a combination of springs C 1 and C 2 each having the same characteristics as the spring C. That is, the curve C 12 represents a case in which the springs C 1 and C 2 are used as the contacting members 37 a and 37 b respectively. In the following, the combination of the springs C 1 and C 2 will be referred to as a “spring C 12 ”.
- the spring D 12 has a wide range of displacement relative to a maximum displacement of the spring D 12 , in which a variation of restoring force of the spring D 12 with respect to a displacement of the spring D 12 is small. Accordingly, by using the spring D 12 , load applied to the edge ring 38 can be reduced. For example, within a predetermined range of displacement derived from the characteristic of the spring D 12 , restoring force of the spring D 12 becomes almost constant.
- the actuating unit for the actuation mechanism 200 such as the piezo actuator 101 or a motor can be driven stably.
- the spring C 12 generates large restoring force, it is difficult to improve accuracy of vertical movement of the middle edge ring 38 m.
- FIGS. 8A and 8B are diagrams for explaining contact resistance of the contacting members 37 a and 37 b according to the embodiment.
- FIG. 8A illustrates a comparative example, in which leaf springs 137 a and 137 b are used as the contacting members 37 a and 37 b respectively.
- FIG. 8B illustrates a case in which a canted coil spring is used as each of the contacting members 37 a and 37 b .
- Both FIG. 8A and FIG. 8B illustrate a case in which the contacting members 37 a and 37 b are in equilibrium, and a case in which the middle edge ring 38 is lowered.
- a diagram (a-1) of FIG. 8A illustrates a case in which the leaf springs 137 a and 137 b according to the comparative example are interposed between the inner edge ring 38 i and the middle edge ring 38 m , and between the middle edge ring 38 m and the outer edge ring 38 o respectively, and in which the leaf springs 137 a and 137 b are in equilibrium.
- the leaf spring 137 a When the middle edge ring 38 m is lowered as illustrated in a diagram (a-2) of FIG. 8A , the leaf spring 137 a is pressed from above, and an area of contact between the leaf spring 137 a and the inner edge ring 38 i and between the leaf spring 137 a and the middle edge ring 38 m increases. As a result, contact resistance (heat resistance) between the inner edge ring 38 i and the middle edge ring 38 m is reduced, and heat conductance improves. Contact between the middle edge ring 38 m and the outer edge ring 38 o is secured by the leaf spring 137 b.
- a spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is small is used as the contacting members 37 a and 37 b .
- a canted coil spring is used as the contacting members 37 a and 37 b .
- a diagram (b-1) of FIG. 8B illustrates a case in which the contacting members 37 a and 37 b are interposed between the inner edge ring 38 i and the middle edge ring 38 m , and between the middle edge ring 38 m and the outer edge ring 38 o respectively, and in which the contacting members 37 a and 37 b are in equilibrium.
- contacting pressure of the contacting members 37 a and 37 b formed of canted coil springs according to the present embodiment do not largely vary when a range of displacement (degree of deformation) of the contacting members 37 a and 37 b is within an appropriate range, variation of heat resistance is small.
- the movable middle edge ring 38 m can be caused to stably contact the stage 12 thermally and electrically, via the immovable inner edge ring 38 i and the immovable outer edge ring 380 .
- a leaf spring is introduced as an example of a spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is large.
- a leaf spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is small is not included.
- a spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is small is not limited to a canted coil spring.
- An elastic member having a characteristic that a ratio of a range of a displacement of the elastic member with respect to a predetermined range of force (load) applied to the elastic member to a maximum amount of displacement of the elastic member is greater than or equal to a specific value, can be used as the contacting members 37 a and 37 b according to the present embodiment.
- the movable middle edge ring 38 m can be caused to stably contact the stage 12 thermally and electrically. Accordingly, controllability of temperature of the edge ring 38 improves, and excellent process control at an edge portion of a wafer W is realized. As a result, variance of process characteristics among wafers W in a production lot can be reduced, and productivity improves.
- the middle edge ring 38 m is stably in contact with the stage 12 thermally and electrically, occurrence of abnormal discharge can be suppressed, and breakage of the edge ring 38 can be reduced.
- the substrate processing apparatus can be applicable to any type of substrate processing apparatus, such as a capacitively coupled plasma (CCP) type, an inductively coupled plasma (ICP) type, a radial line slot antenna type, an electron cyclotron resonance plasma (ECR) type, and a helicon wave plasma (HWP) type.
- CCP capacitively coupled plasma
- ICP inductively coupled plasma
- ECR electron cyclotron resonance plasma
- HWP helicon wave plasma
- a wafer W is referred to as an example of a substrate.
- the substrate is not limited to the wafer.
- Examples of the substrate may include various types of substrates used in an LCD (Liquid Crystal Display) or a FPD (Flat Panel Display), a CD substrate, or a printed circuit board.
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Abstract
Description
- This patent application is based on and claims priority to Japanese Patent Application No. 2018-087467 filed on Apr. 27, 2018, the entire contents of which are incorporated herein by reference.
- The present disclosure relates to a substrate processing apparatus.
- In a plasma etching apparatus, an edge ring is provided around an outer circumference of a wafer (see
Patent Document 1, for example). The edge ring controls plasma in a vicinity of the outer circumference of the wafer, and improves uniformity of an etching rate on a surface of the wafer. -
- [Patent Document 1] Japanese Laid-open Patent Application Publication No. 2008-244274
- The present disclosure aims at providing a technique for securing thermal contact and electrical contact of separated edge rings.
- According to an aspect of the present disclosure, there is provision of a substrate processing apparatus including an inner edge ring provided in a vicinity of a substrate to be placed on a stage in a processing chamber; a middle edge ring arranged outside the inner edge ring, the middle edge ring being configured to be moved vertically by an actuation mechanism; an outer edge ring arranged outside the middle edge ring; a first spring provided between the inner edge ring and the middle edge ring; and a second spring provided between the middle edge ring and the outer edge ring.
-
FIG. 1 is a diagram illustrating an example of a substrate processing apparatus according to an embodiment; -
FIG. 2 is a diagram illustrating a structure of an edge ring and its vicinity according to the embodiment; -
FIG. 3A is a perspective view of the edge ring according to the embodiment; -
FIG. 3B is a plan view of the edge ring according to the embodiment; -
FIGS. 3C to 3D are cross-sectional views of the edge ring according to the embodiment; -
FIGS. 4A and 4B are diagrams illustrating vertical movement of the edge ring according to the embodiment; -
FIGS. 5A and 5B are diagrams illustrating contacting members of an edge ring according to Example 1; -
FIGS. 6A and 6B are diagrams illustrating contacting members of an edge ring according to Example 2; -
FIGS. 7A and 7B are graphs each illustrating a load characteristic of springs; and -
FIGS. 8A and 8B are diagrams for explaining contact resistance of the contacting member according to the embodiment. - In the following, embodiments of the present disclosure will be described with reference to the drawings. Note that in the following descriptions and the drawings, elements having substantially identical features are given the same reference symbols and overlapping descriptions may be omitted.
- First, an example of a
substrate processing apparatus 5 according to an embodiment will be described with reference toFIG. 1 .FIG. 1 is a diagram illustrating a structure of thesubstrate processing apparatus 5 according to the embodiment. The present embodiment describes a case in which thesubstrate processing apparatus 5 is a capacitively coupled plasma type parallel-flat plate substrate processing apparatus. - The
substrate processing apparatus 5 includes achamber 10 which is a cylindrical vacuum vessel made from metal such as aluminum or stainless steel. Thechamber 10 is an example of a processing vessel. An inside of thechamber 10 is a processing chamber for performing a plasma process. Thechamber 10 is grounded. - A disc shaped
stage 12 is provided at a center of a lower portion in thechamber 10. Thestage 12 is a base for holding a substrate, and thestage 12 also acts as a lower electrode. Thestage 12 is made from aluminum, for example. Thestage 12 is supported by a cylindrical conductive supportingmember 16 that extends upward from the bottom of thechamber 10, and by ahousing 100 adjacently provided at an inside of the cylindrical conductive supportingmember 16. - Between the cylindrical conductive supporting
member 16 and a side wall of thechamber 10, anannular exhaust path 18 is formed. At an upper portion or an entrance of theexhaust path 18, anannular baffle plate 20 is provided. At a bottom of theexhaust path 18, at least oneexhaust port 22 is provided. In order to make gas flow in thechamber 10 axially symmetrical with a central axis of a wafer W on thestage 12, it is preferable thatmultiple exhaust ports 22 are provided at regular intervals in a circumferential direction. - An
exhaust device 26 is connected to each of theexhaust ports 22 via anexhaust pipe 24. Theexhaust device 26 includes a vacuum pump such as a turbomolecular pump, and can reduce pressure of a plasma generating space S in thechamber 10 to a desirable quality of vacuum. Further, agate valve 28 is provided at the side wall of thechamber 10, which is used for opening and/or closing a loading/unloadingport 27 for a wafer W. - A second high
frequency power source 30 is electrically connected to thestage 12 via a matchingunit 32 and afeeder 34. The second highfrequency power source 30 supplies high frequency electric power LF of a first frequency (such as a radio frequency at 13.56 MHz) suitable for controlling energy of ions to be attracted to a wafer W. The high frequency electric power LF output from the second highfrequency power source 30 is variable. The matchingunit 32 includes a variable reactance matching circuit to cause impedance of the second highfrequency power source 30 to match impedance of a load (plasma and the like). - The
stage 12 includes anelectrostatic chuck 36 for holding a wafer W by using electrostatic force. Theelectrostatic chuck 36 is provided on an upper surface of thestage 12. Theelectrostatic chuck 36 is made by sandwiching anelectrode 36 a formed of a conductive film between a pair ofinsulating films 36 b. A direct-current (DC)power source 40 is electrically connected to theelectrode 36 a via aswitch 42 and a coatedwire 43. Theelectrostatic chuck 36 generates electrostatic force by DC voltage supplied from theDC power source 40, and a wafer W is attracted to and held by theelectrostatic chuck 36 by the generated electrostatic force. - In the
stage 12, anannular coolant passage 44 extending, for example, in a circumferential direction is provided. From a chiller unit, coolant such as cooling water cw is supplied to thecoolant passage 44 at a predetermined temperature, and the coolant circulates in thecoolant passage 44 viapipes electrostatic chuck 36 by a temperature of the coolant. A heater may also be provided in thestage 12. - Further, heat transmitting gas (such as He gas) is supplied to a space between an upper surface of the
electrostatic chuck 36 and a bottom surface of the wafer W, from a heat transmitting gas supply unit via agas supply pipe 50. Also, a pusher pin capable of moving up and down, and an elevation mechanism for the pusher pin, are provided at thestage 12. The pusher pin is used for loading and unloading a wafer. The pusher pin is provided so as to penetrate the stage in a vertical direction. - A
shower head 51 is mounted at a ceiling of thechamber 10 via ashield ring 54 covering a periphery of theshower head 51, such that an opening of the ceiling of thechamber 10 is closed with theshower head 51. Theshower head 51 may be formed of aluminum or silicon. Theshower head 51 also acts as an upper electrode facing thestage 12 acting as the lower electrode. - A
gas inlet 56 for introducing gas is formed at theshower head 51. Inside theshower head 51, adiffusion chamber 58 branching from thegas inlet 56 is provided. Gas output from agas supply source 66 is supplied to thediffusion chamber 58 via thegas inlet 56, and diffuses in thediffusion chamber 58. Then the gas is introduced from the large number ofgas holes 52 to the plasma generating space S. - A first high
frequency power source 57 is electrically connected to theshower head 51 via amatching unit 59 and afeeder 60. The first highfrequency power source 57 outputs high frequency electric power HF of a second frequency (such as a radio frequency at 40 MHz) higher than the first frequency, which is suitable for generating plasma by high frequency discharge. The first highfrequency power source 57 can output the high frequency electric power HF by a variable amount. The matchingunit 59 includes a variable reactance matching circuit to cause impedance of the first highfrequency power source 57 to match impedance of a load (plasma and the like). - A
control unit 74 includes a microcomputer for example, and controls operations of each component of thesubstrate processing apparatus 5 and an operation of the entirety of thesubstrate processing apparatus 5. Examples of the components in thesubstrate processing apparatus 5 include theexhaust device 26, the first highfrequency power source 57, the second highfrequency power source 30, the matchingunit 32, the matchingunit 59, theswitch 42 for the electrostatic chuck, thegas supply source 66, the chiller unit, and the heat transmitting gas supply unit. - When a process such as etching is performed in the
substrate processing apparatus 5, thegate valve 28 is opened first, a wafer W is loaded into thechamber 10, and the wafer W is placed on theelectrostatic chuck 36. Subsequently, after thegate valve 28 is closed, a predetermined gas is introduced from thegas supply source 66 to thechamber 10, at a predetermined flow rate or a flow ratio of gases, and pressure in thechamber 10 is reduced to a predetermined value by theexhaust device 26. Further, the first highfrequency power source 57 is turned on to output the high frequency electric power HF for generating plasma at predetermined magnitude, and to supply the high frequency electric power HF to theshower head 51 via thematching unit 59 and thefeeder 60. - When the high frequency electric power LF for attracting ions is applied, the second high
frequency power source 30 is turned on to output the high frequency electric power LF at predetermined magnitude, and to supply the high frequency electric power LF to thestage 12 via thematching unit 32 and thefeeder 34. Further, heat transmitting gas is supplied to a contacting surface between theelectrostatic chuck 36 and the wafer W, from the heat transmitting gas supply unit. In addition, theswitch 42 is turned on, to apply DC voltage to theelectrode 36 a of theelectrostatic chuck 36, and to enclose the heat transmitting gas at the contacting surface by electrostatic force between the wafer W and theelectrostatic chuck 36. - [3-Piece Edge Ring]
- An
edge ring 38 is disposed at an outer circumference of thestage 12 so as to annularly surround a periphery of a wafer W placed on thestage 12. Theedge ring 38 is arranged in a vicinity of the wafer W. Theedge ring 38 controls plasma at the outer circumference of the wafer W, and improves uniformity of a process such as etching on a surface of the wafer W. - The
edge ring 38 includes three separated rings, aninner edge ring 38 i, amiddle edge ring 38 m, and anouter edge ring 380. Theinner edge ring 38 i is arranged in the vicinity of the wafer W placed on thestage 12 in thechamber 10. Themiddle edge ring 38 m is provided outside theinner edge ring 38 i, and can be moved vertically (up and down) by anactuation mechanism 200. The outer edge ring 38 o is provided outside themiddle edge ring 38 m. - The
actuation mechanism 200 includes alift pin 102. Thelift pin 102 is moved vertically by a driving force of apiezo actuator 101 via a member 104 (104 a) and abushing 105. In accordance with movement of thelift pin 102, a connectingmember 103 moves vertically, and thereby themiddle edge ring 38 m connected to the connectingmember 103 moves vertically. - (Edge Ring Structure)
- Next, a structure of the
edge ring 38 and its peripheral parts will be described with reference toFIG. 2 andFIGS. 3A to 3D . Also, vertical movement of themiddle edge ring 38 m will be described with reference toFIGS. 4A and 4B . -
FIG. 2 is an enlarged view of a vertical cross section of an example of theedge ring 38 and its vicinity according to the present embodiment. InFIG. 2 , theedge ring 38 according to the present embodiment, theactuation mechanism 200, and thepiezo actuator 101 are illustrated. -
FIG. 3A illustrates a perspective view of each of the pieces of theedge ring 38,FIG. 3B is a plan view of each of the three separated rings of theedge ring 38,FIG. 3C is a cross sectional view taken along a line I-I inFIG. 3B , andFIG. 3D illustrates a cross sectional view taken along a line II-II inFIG. 3B . - As illustrated in
FIG. 2 andFIGS. 3A to 3D, theinner edge ring 38 i is an innermost member of theedge ring 38, which is provided in the vicinity of an outer circumference of a wafer W so as to surround the wafer W below the wafer W. Themiddle edge ring 38 m is a member provided outside theinner edge ring 38 i so as to surround theinner edge ring 38 i. The outer edge ring 38 o is an outermost member of theedge ring 38, which is provided outside themiddle edge ring 38 m. Theinner edge ring 38 i and the outer edge ring 38 o are fixed on the upper surface of theelectrostatic chuck 36, via aheat transfer sheet 39 i and aheat transfer sheet 390 respectively. Themiddle edge ring 38 m is configured to be movable vertically by theactuation mechanism 200. - As illustrated in
FIG. 3A andFIG. 3B , themiddle edge ring 38 m includes aring portion 38m 1 surrounding a periphery of the wafer W, and threetabs 38m 2. Thetabs 38m 2 are rectangular members projecting outward from thering portion 38m 1, and are arranged at an outer circumference of thering portion 38m 1 at regular intervals. As illustrated inFIG. 2 , a vertical cross section (a cross section taken along the vertical direction) of thering portion 38m 1 is of an L-shape. In a case in which themiddle edge ring 38 m is moved upward from a state in which an L-shaped step of thering portion 38m 1 is in contact with a step of theinner edge ring 38 i having an L-shaped vertical cross section, the step of thering portion 38m 1 is apart from the step of theinner edge ring 38 i. - (Actuation Mechanism and Actuating Unit)
- The
tab 38m 2 of themiddle edge ring 38 m is connected to the annular connectingmember 103. The connectingmember 103 vertically moves in aspace 16 a provided in the cylindrical conductive supportingmember 16. - The
actuation mechanism 200 is for moving themiddle edge ring 38 m vertically, and includes thelift pin 102 and thebushing 105. Theactuation mechanism 200 is fitted to thehousing 100 provided around thestage 12, and is configured to be moved vertically by the driving force of thepiezo actuator 101 attached to thehousing 100. Thelift pin 102 may be formed of sapphire. - The
housing 100 is made from insulating material such as alumina. Thehousing 100 is adjacently provided inside the cylindrical conductive supportingmember 16 such that a side surface and a bottom surface of thehousing 100 touch the cylindrical conductive supportingmember 16. Theactuation mechanism 200 is provided in thehousing 100. Thelift pin 102 penetrates thehousing 100 and thestage 12, and is in contact with a bottom surface of the connectingmember 103 in thespace 16 a provided in the cylindrical conductive supportingmember 16. Thebushing 105 is fitted to themember 104 a provided inside thehousing 100. In a hole for thelift pin 102, an 0ring 111 for separating vacuum space from atmosphere is provided. - To a
recess 105 a provided at a tip of thebushing 105, a bottom end of thelift pin 102 is fitted from above. When thebushing 105 moves vertically via themember 104 a by a positioning operation of thepiezo actuator 101, thelift pin 102 moves vertically, and thelift pin 102 pushes the bottom surface of the connectingmember 103 upward, or pulls the bottom surface of the connectingmember 103 downward. Accordingly, themiddle edge ring 38 m moves vertically via the connectingmember 103. - An upper end of the
piezo actuator 101 is bolted to themember 104 a with ascrew 104 c, and a bottom end of thepiezo actuator 101 is bolted to amember 104 b with ascrew 104 d. Accordingly, thepiezo actuator 101 is fixed to thehousing 100 between themember 104 a and themember 104 b. - The
piezo actuator 101 is an element for positioning, which utilizes piezoelectric effect, and can perform positioning at a resolution of 0.006 mm (6 μm). Thelift pin 102 moves vertically in accordance with an amount of vertical displacement of thepiezo actuator 101. Accordingly, themiddle edge ring 38 m moves vertically by 0.006 mm unit at minimum. - For each of the three
tabs 38m 2 arranged on the circumference of thering portion 38m 1 at regular intervals in the circumferential direction, thecorresponding lift pin 102 is provided. Accordingly, the lift pins 102 push themiddle edge ring 38 m upward at three points, via the annular connectingmember 103, and themiddle edge ring 38 m is raised to a desired height. - On a bottom surface of the outer edge ring 38 o, recesses 138 are formed at locations corresponding to the
tabs 38m 2 of themiddle edge ring 38 m. Therecess 138 is wider than thetab 38m 2. When the lift pins 102 push themiddle edge ring 38 m upward and themiddle edge ring 38 m is raised to its maximum level, thetabs 38m 2 are stored into therecesses 138. Accordingly, themiddle edge ring 38 m can be moved upward while the outer edge ring 38 o is fixed. - In
FIG. 3D , which illustrates the cross sectional view taken along the line II-II inFIG. 3B , thelift pin 102 and therecess 138 are not present.FIG. 3D illustrates a state in which the annular connectingmember 103 is raised upward in thespace 16 a of the cylindrical conductive supportingmember 16 because thelift pin 102 has moved upward. - Referring back to
FIG. 2 , for each of the lift pins 102, the correspondingpiezo actuator 101 is provided in a space of thehousing 100 below thelift pin 102. That is, threeactuation mechanisms 200 and the threepiezo actuators 101, which correspond to the lift pins 102 disposed at three locations respectively, are provided in thehousing 100. Themember 104 a and themember 104 b are annular members, and themember 104 b is positioned below themember 104 a. The threepiezo actuators 101 are disposed between themembers members piezo actuators 101 are connected with each other via themembers piezo actuator 101 according to the present embodiment is an example of an actuating unit. - According to the structure described above, the stage 12 (including the electrostatic chuck 36) is supported by the
housing 100, and theactuation mechanisms 200 and the actuating units are fitted to thehousing 100. Accordingly, only themiddle edge ring 38 m can be moved vertically by using the existingelectrostatic chuck 36, without requiring a design modification of theelectrostatic chuck 36. - Also, in the present embodiment, because a predetermined space is provided between the upper surface of the
electrostatic chuck 36 and the bottom surface of themiddle edge ring 38 m as illustrated inFIG. 2 , themiddle edge ring 38 m can be moved to not only an upward direction but also a downward direction. Accordingly, themiddle edge ring 38 m can be moved in the predetermined space to not only an upward direction but also a downward direction by a predetermined amount. Because themiddle edge ring 38 m can be moved to not only an upward direction but also a downward direction, a range of controlling a sheath can be extended. - However, an actuating unit is not limited to the
piezo actuators 101, and a motor capable of performing positioning control at a resolution of 0.006 mm may be used as an actuating unit. Also, the number of actuating units may be one, or more than one. Further, a motor for vertically moving a pusher pin used for raising a wafer W may be used as an actuating unit for moving themiddle edge ring 38 m. In this case, a mechanism, such as a gear or a driving force switching unit, for switching a destination of transmitting a driving force of the motor between the pusher pin used for raising a wafer W and thelift pin 102 for themiddle edge ring 38 m, is required. Also, a mechanism for controlling vertical movement of thelift pin 102 at a resolution of 0.006 mm is required. However, as a diameter of themiddle edge ring 38 m arranged around an outer circumference of a 300 mm wafer W is large, approximately 310 mm, an actuating unit for thelift pin 102 and an actuating unit for the pusher pin used for raising a wafer W are preferably separate. - The
control unit 74 may control positioning of thepiezo actuators 101 such that a vertical displacement amount of thepiezo actuators 101 is in accordance with amount of abrasion of themiddle edge ring 38 m. Alternatively, thecontrol unit 74 may determine a vertical displacement amount of thepiezo actuators 101 in accordance with a process condition, regardless of amount of abrasion of themiddle edge ring 38 m. - In a case in which an upper surface of a wafer W and an upper surface of the
edge ring 38 are at the same level, a height of a sheath on the wafer W and a height of a sheath on theedge ring 38 during an etching process can become the same. By the height of the sheath being the same at both locations, uniformity of an etching rate on a surface of a wafer W can be improved. - In a case in which a brand-
new edge ring 38 is used, because a height of a sheath on the wafer W during an etching process and a height of a sheath on theedge ring 38 are the same, an etching rate on a surface of the wafer W becomes uniform. In this case, as illustrated in a diagram (a-1) ofFIG. 4A , themiddle edge ring 38 m is not moved upward (0 mm) by the lift pins 102. Note that diagrams inFIG. 4A illustrate a state of a cross section of theedge ring 38 taken along a line I-I inFIG. 3B , and diagrams inFIG. 4B illustrate a state of a cross section of theedge ring 38 taken along a line II-II inFIG. 3B . - However, when the
edge ring 38 is abraded by a plasma process such as etching, a height of the sheath on theedge ring 38 becomes lower than a height of the sheath on the wafer W. In this case, an etching rate at an edge portion of the wafer W may increase sharply, or tilting may occur in an etching profile. The tilting in an etching profile means a phenomenon in which a sheath on an edge portion of a wafer W inclines because of abrasion of an edge ring, in which ions are introduced to the wafer W from an oblique direction, and in which an etching profile becomes not vertical but slanted. Note that, in the present embodiment, an edge portion on a wafer W refers to a ring-shaped region on the wafer W, which is 140 mm to 150 mm away from a center of the wafer W in a radial direction. - Thus, in the present embodiment, the
middle edge ring 38 m is raised by an amount corresponding to amount of abrasion of theedge ring 38, to align a height of the sheath on the wafer W and a height of the sheath on theedge ring 38. Accordingly, occurrence of a sharp increase of an etching rate at the edge portion of the wafer W, or tilting in the etching profile can be avoided. - For example, in a case in which amount of abrasion of the
middle edge ring 38 m is 1.0 mm, thepiezo actuator 101 may be controlled such that themiddle edge ring 38 m is moved upward by 1.0 mm. As a result, as illustrated in the diagram (a-2) ofFIG. 4A and the diagram (b-2) ofFIG. 4B , themiddle edge ring 38 m is moved upward by 1.0 mm. - [Contacting Structure of Middle Edge Ring]
- With respect to the
edge ring 38 having the above-described structure, theinner edge ring 38 i and the outer edge ring 38 o are fixed on theelectrostatic chuck 36, with theinner edge ring 38 i and the outer edge ring 38 o contacted via theheat transfer sheet 39 i and theheat transfer sheet 390 respectively. Thus, theinner edge ring 38 i and the outer edge ring 38 o, which are immovable members, are thermally and electrically stable. - Conversely, as the
middle edge ring 38 m can be moved vertically, themiddle edge ring 38 m may become thermally and electrically unstable, and controllability of temperature of themiddle edge ring 38 m may deteriorate. When the controllability of temperature of themiddle edge ring 38 m deteriorates, especially in a deposition process, control of an edge portion of a wafer W becomes difficult. Thus, process characteristics among wafers W in a production lot vary, and productivity decreases. In the following description, a technique for making themiddle edge ring 38 m thermally and electrically stable will be described. - First, a structure of an
edge ring 38 according to Example 1 of the present embodiment will be described with reference toFIGS. 5A and 5B . Theedge ring 38 of Example 1 includes a contactingmember 37 a disposed between the theinner edge ring 38 i and themiddle edge ring 38 m, and a contactingmember 37 b disposed between themiddle edge ring 38 m and theouter edge ring 380. - The contacting
member 37 a is disposed between a horizontal surface of theinner edge ring 38 i and a horizontal surface of themiddle edge ring 38 m. The contactingmember 37 b is disposed between a horizontal surface of themiddle edge ring 38 m and a horizontal surface of theouter edge ring 380. - A cross section of the
edge ring 38 taken along a line I-I inFIG. 3B is illustrated inFIG. 5A . A diagram (a-1) ofFIG. 5A illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is not raised by the lift pin 102 (Down (0 mm) state). A diagram (a-2) ofFIG. 5A illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is raised by thelift pin 102, that is, an Up state (1 mm up, for example). - A cross section of the
edge ring 38 taken along a line II-II inFIG. 3B is illustrated inFIG. 5B . A diagram (b-1) ofFIG. 5B illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is not raised by thelift pin 102, that is, a Down state. A diagram (b-2) ofFIG. 5B illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is raised by thelift pin 102, that is, an Up state. Theactuation mechanism 200 can raise themiddle edge ring 38 m at a resolution of 0.006 mm. - When the
middle edge ring 38 m is in the Down state, in which themiddle edge ring 38 m is not raised by thelift pin 102 as illustrated in the diagram (a-1) ofFIG. 5A and the diagram (b-1) ofFIG. 5B , the contactingmember 37 a is pressed between the horizontal surfaces of theinner edge ring 38 i and themiddle edge ring 38 m, and is deformed. Accordingly, contacting area of the contactingmember 37 a with theinner edge ring 38 i and themiddle edge ring 38 m is enlarged, and thermal contact and electrical contact of themiddle edge ring 38 m becomes larger. - Conversely, as the contacting
member 37 b is not strongly pressed between the horizontal surfaces of themiddle edge ring 38 m and the outer edge ring 38 o, a degree of deformation of the contactingmember 37 b is small (note that, in the following description, deformation of the contactingmember member member 37 b is interposed between themiddle edge ring 38 m and the outer edge ring 38 o, thermal contact and electrical contact between themiddle edge ring 38 m and theelectrostatic chuck 36 via the outer edge ring 38 o is stably secured. - When the
middle edge ring 38 m is in the Up state, in which themiddle edge ring 38 m is raised by thelift pin 102 as illustrated in the diagram (a-2) ofFIG. 5A and the diagram (b-2) ofFIG. 5B , the contactingmember 37 b is pressed between the horizontal surfaces of themiddle edge ring 38 m and the outer edge ring 38 o, and is deformed. Accordingly, contacting area of the contactingmember 37 b with themiddle edge ring 38 m and the outer edge ring 38 o is enlarged, and thermal contact and electrical contact of themiddle edge ring 38 m becomes larger. - Conversely, as the contacting
member 37 a is not strongly pressed between the horizontal surfaces of theinner edge ring 38 i and themiddle edge ring 38 m, a degree of deformation of the contactingmember 37 a is small. However, because the contactingmember 37 a is interposed between theinner edge ring 38 i and themiddle edge ring 38 m, thermal contact and electrical contact between themiddle edge ring 38 m and theelectrostatic chuck 36 via theinner edge ring 38 i is stably secured. - In Example 1, because the contacting
member 37 a and the contactingmember 37 b are arranged in a circumferential direction over an entire circumference of themiddle edge ring 38 m, the movablemiddle edge ring 38 m can be caused to be in stable thermal and electrical contact with theinner edge ring 38 i and the outer edge ring 38 o stably. Accordingly, heat conductivity between the stage 12 (electrostatic chuck 36) and themiddle edge ring 38 m improves, and controllability of temperature of theedge ring 38 can be improved. As a result, excellent process control at an edge portion of a wafer W is realized, variance of process characteristics among wafers W in a production lot can be reduced, and productivity improves. - Further, although deflection would tend to occur at the
tab 38m 2, and the deflection would make it difficult to position themiddle edge ring 38 m at a desired position precisely, because the contactingmembers tab 38m 2, positioning of themiddle edge ring 38 m can be performed more precisely. - Further, under a process condition in which large electrical power of high frequency is applied, abnormal discharge occurs if the
middle edge ring 38 m is electrically floating. By providing the contactingmembers edge ring 38 can be reduced. - The contacting
member 37 a and the contactingmember 37 b may not necessarily be provided over an entire circumference of themiddle edge ring 38 m. However, in order that themiddle edge ring 38 m is caused to be in stable thermal and electrical contact with thestage 12 stably, it is preferable that the contactingmember 37 a and the contactingmember 37 b are arranged in the circumferential direction over the entire circumference of themiddle edge ring 38 m. - Note that the contacting
member 37 a in Example 1 is an example of a first spring provided between theinner edge ring 38 i and themiddle edge ring 38 m. The contactingmember 37 b in Example 1 is an example of a second spring provided between themiddle edge ring 38 m and theouter edge ring 380. - Next, a structure of an
edge ring 38 according to Example 2 of the present embodiment will be described with reference toFIGS. 6A and 6B . Theedge ring 38 of Example 2 includes a contactingmember 37 a disposed between thestage 12 and themiddle edge ring 38 m, and a contactingmember 37 b disposed between themiddle edge ring 38 m and theouter edge ring 380. - The contacting
member 37 a is disposed between a horizontal surface of the stage 12 (electrostatic chuck 36) and a horizontal surface of themiddle edge ring 38 m. The contactingmember 37 b is disposed between a horizontal surface of themiddle edge ring 38 m and a horizontal surface of theouter edge ring 380. - A cross section of the
edge ring 38 taken along the line I-I inFIG. 3B is illustrated inFIG. 6A . A diagram (a-1) ofFIG. 6A illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is not raised by the lift pin 102 (Down (0 mm) state). A diagram (a-2) ofFIG. 6A illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is raised by thelift pin 102, that is, an Up state (1 mm up, for example). - A cross section of the
edge ring 38 taken along the line II-II inFIG. 3B is illustrated inFIG. 6B . A diagram (b-1) ofFIG. 6B illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is not raised by thelift pin 102, that is, a Down state. A diagram (b-2) ofFIG. 6B illustrates a state of theedge ring 38 in which themiddle edge ring 38 m is raised by thelift pin 102, that is, an Up state. - When the
middle edge ring 38 m is in the Down state, in which themiddle edge ring 38 m is not raised by thelift pin 102 as illustrated in the diagram (a-1) ofFIG. 6A and the diagram (b-1) ofFIG. 6B , the contactingmember 37 a is pressed between the horizontal surfaces of the electrostatic chuck 36 (stage 12) and themiddle edge ring 38 m, and is deformed. Accordingly, contacting area of the contactingmember 37 a with the electrostatic chuck 36 (stage 12) and themiddle edge ring 38 m is enlarged, and thermal contact and electrical contact of themiddle edge ring 38 m becomes larger. - Conversely, as the contacting
member 37 b is not strongly pressed between the horizontal surfaces of themiddle edge ring 38 m and the outer edge ring 38 o, a degree of deformation of the contactingmember 37 b is small. However, because the contactingmember 37 b is interposed between themiddle edge ring 38 m and the outer edge ring 38 o, thermal contact and electrical contact between themiddle edge ring 38 m and theelectrostatic chuck 36 via the outer edge ring 38 o is stably secured. - When the
middle edge ring 38 m is in the Up state, in which themiddle edge ring 38 m is raised by thelift pin 102 as illustrated in the diagram (a-2) ofFIG. 6A and the diagram (b-2) ofFIG. 6B , the contactingmember 37 b is pressed between the horizontal surfaces of themiddle edge ring 38 m and the outer edge ring 38 o, and is deformed. Accordingly, contacting area of the contactingmember 37 b with themiddle edge ring 38 m and the outer edge ring 38 o is enlarged, and thermal contact and electrical contact of themiddle edge ring 38 m becomes larger. - Conversely, as the contacting
member 37 a is not strongly pressed between the horizontal surfaces of the electrostatic chuck 36 (stage 12) and themiddle edge ring 38 m, a degree of deformation of the contactingmember 37 a is small. However, because the contactingmember 37 a is interposed between the electrostatic chuck 36 (stage 12) and themiddle edge ring 38 m, thermal contact and electrical contact between the stage 12 (electrostatic chuck 36) and themiddle edge ring 38 m is stably secured. - As described above, in Example 2, because the contacting
member 37 a and the contactingmember 37 b are disposed at themiddle edge ring 38 m (specifically, at thetabs 38 m 2), the movablemiddle edge ring 38 m can be caused to be in stable thermal and electrical contact with the stage 12 (electrostatic chuck 36) via theinner edge ring 38 i and theouter edge ring 380. Accordingly, controllability of temperature of theedge ring 38 can be improved, and excellent process control at an edge portion of a wafer W is realized. As a result, variance of process characteristics among wafers W in a production lot can be reduced, and productivity improves. - In addition, in Example 2, thermal contact and electrical contact between the
stage 12 and themiddle edge ring 38 m are secured by the contactingmembers middle edge ring 38 m under a process condition in which large electrical power of high frequency is applied, is suppressed, and breakage of theedge ring 38 can be reduced. - In Example 2, each of a plural number of contacting
members 37 a and of contactingmembers 37 b are arranged at themiddle edge ring 38 m along a circumferential direction. Specifically, the contactingmembers 37 a and the contactingmembers 37 b are disposed at the threetabs 38m 2 provided on the outer circumference of themiddle edge ring 38 m. Note that the contactingmember 37 a in Example 2 is an example of a first spring provided between thestage 12 and themiddle edge ring 38 m. The contactingmember 37 b in Example 2 is an example of a second spring provided between themiddle edge ring 38 m and theouter edge ring 380. - [Characteristics of Contacting Member]
- The contacting
members FIGS. 5A to 6B may have the following characteristics. First, the contactingmembers members members members members members - According to the configuration, the movable
middle edge ring 38 m can be in stable thermal and electrical contact with thestage 12, by avoiding themiddle edge ring 38 m becoming in a thermally and electrically floating state. Thus, temperature control of theentire edge ring 38 is improved, and occurrence of abnormal discharge can be prevented. - In Examples 1 and 2, a case in which the contacting
members middle edge ring 38 m is described, but a place in which the contactingmembers middle edge ring 38 m. For example, a recess may be formed on a side wall (vertical surface) of therecess 138 of the outer edge ring 38 o where thetab 38m 2 is inserted, and the contactingmember 37 b may be embedded on the recess on the side wall. In this case, the contactingmember 37 b is disposed between a vertical surface of themiddle edge ring 38 m and a vertical surface of theouter edge ring 380. In this configuration, thermal and electrical contact between themiddle edge ring 38 m and the outer edge ring 38 o can also be stably maintained. - It is preferable that an elastic member, in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is small, is used as the contacting
members members -
FIGS. 7A and 7B are graphs each illustrating a load characteristic of springs. Horizontal axes of the graphs indicate displacement of springs, and vertical axes indicate restoring force of springs (=load applied to springs). A spring C is an example of an elastic member having a wide range of displacement in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is large. A spring D is an example of an elastic member having a wide range of displacement in which a variation of restoring force of the elastic member with respect to a displacement of the elastic member is small. - For example, as illustrated in
FIG. 7A , suppose a case in which a maximum amount of displacement is Dm, and in which the aforementioned predetermined range of force applied to the elastic member is P (threshold P). In a case in which the aforementioned specific value (ratio) is 0.7, with respect to the spring C, a ratio of a range of a displacement (D2) with respect to the predetermined range of force (P) to the maximum amount of displacement (Dm) is smaller than the specific value (0.7). Therefore, because a variation of restoring force of the spring C with respect to a displacement of the spring C is large, the characteristic of the spring C is not suitable for the contactingmembers - Conversely, with respect to the spring D, a ratio of a range of a displacement (D1) with respect to the predetermined range of force (P) to the maximum amount of displacement (Dm) is greater than or equal to the specific value (0.7). Therefore, because a variation of restoring force of the spring D with respect to a displacement of the spring D is small, the characteristic of the spring D is suitable for the contacting
members - In a case in which a motor or the like for driving the
actuation mechanism 200 is actuated, it is preferable that restoring force of the contactingmembers members - A curve D12 in
FIG. 7B represents a characteristic of a combination of springs D1 and D2 each having the same characteristics as the spring D. That is, the curve D12 represents a case in which the springs D1 and D2 are used as the contactingmembers - A curve C12 in
FIG. 7B represents a characteristic of a combination of springs C1 and C2 each having the same characteristics as the spring C. That is, the curve C12 represents a case in which the springs C1 and C2 are used as the contactingmembers - The spring D12 has a wide range of displacement relative to a maximum displacement of the spring D12, in which a variation of restoring force of the spring D12 with respect to a displacement of the spring D12 is small. Accordingly, by using the spring D12, load applied to the
edge ring 38 can be reduced. For example, within a predetermined range of displacement derived from the characteristic of the spring D12, restoring force of the spring D12 becomes almost constant. Because of the characteristic of the spring D12, if the springs D1 and D2 are used as the contactingmembers members middle edge ring 38 m is moved to any vertical position, the actuating unit for theactuation mechanism 200 such as thepiezo actuator 101 or a motor can be driven stably. On the other hand, as the spring C12 generates large restoring force, it is difficult to improve accuracy of vertical movement of themiddle edge ring 38 m. -
FIGS. 8A and 8B are diagrams for explaining contact resistance of the contactingmembers FIG. 8A illustrates a comparative example, in whichleaf springs members FIG. 8B illustrates a case in which a canted coil spring is used as each of the contactingmembers FIG. 8A andFIG. 8B illustrate a case in which the contactingmembers middle edge ring 38 is lowered. - A diagram (a-1) of
FIG. 8A illustrates a case in which theleaf springs inner edge ring 38 i and themiddle edge ring 38 m, and between themiddle edge ring 38 m and the outer edge ring 38 o respectively, and in which theleaf springs - When the
middle edge ring 38 m is lowered as illustrated in a diagram (a-2) ofFIG. 8A , theleaf spring 137 a is pressed from above, and an area of contact between theleaf spring 137 a and theinner edge ring 38 i and between theleaf spring 137 a and themiddle edge ring 38 m increases. As a result, contact resistance (heat resistance) between theinner edge ring 38 i and themiddle edge ring 38 m is reduced, and heat conductance improves. Contact between themiddle edge ring 38 m and the outer edge ring 38 o is secured by theleaf spring 137 b. - In a spring such as the
leaf spring - In the present embodiment, a spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is small is used as the contacting
members FIG. 8B , a canted coil spring is used as the contactingmembers FIG. 8B illustrates a case in which the contactingmembers inner edge ring 38 i and themiddle edge ring 38 m, and between themiddle edge ring 38 m and the outer edge ring 38 o respectively, and in which the contactingmembers - When the
middle edge ring 38 m is lowered as illustrated in a diagram (b-2) ofFIG. 8B , the contactingmember 37 a of a canted coil spring is pressed from above, and an area of contact between the contactingmember 37 a and theinner edge ring 38 i and between the contactingmember 37 a and themiddle edge ring 38 m increases. As a result, contact resistance (heat resistance) between theinner edge ring 38 i and themiddle edge ring 38 m is reduced, and heat conductance improves. Contact between themiddle edge ring 38 m and the outer edge ring 38 o is secured by the contactingmember 37 b. - In a canted coil spring used as the contacting
member - That is, as illustrated in
FIG. 7B , because contacting pressure of the contactingmembers members middle edge ring 38 m can be caused to stably contact thestage 12 thermally and electrically, via the immovableinner edge ring 38 i and the immovableouter edge ring 380. - In the above description, a leaf spring is introduced as an example of a spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is large. However, a leaf spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is small is not included. Also, a spring having a wide range of displacement in which a variation of restoring force of the spring with respect to its displacement is small is not limited to a canted coil spring. An elastic member, having a characteristic that a ratio of a range of a displacement of the elastic member with respect to a predetermined range of force (load) applied to the elastic member to a maximum amount of displacement of the elastic member is greater than or equal to a specific value, can be used as the contacting
members - As described above, in the
substrate processing apparatus 5 according to the present embodiment, the movablemiddle edge ring 38 m can be caused to stably contact thestage 12 thermally and electrically. Accordingly, controllability of temperature of theedge ring 38 improves, and excellent process control at an edge portion of a wafer W is realized. As a result, variance of process characteristics among wafers W in a production lot can be reduced, and productivity improves. - Further, because the
middle edge ring 38 m is stably in contact with thestage 12 thermally and electrically, occurrence of abnormal discharge can be suppressed, and breakage of theedge ring 38 can be reduced. - The substrate processing apparatus according to the embodiment described above should be understood to be exemplary and not to be restrictive. Various changes or enhancements to the aforementioned embodiment can be made without departing from the spirit and scope of the claims. Matters described in the above embodiment may be changed to other configurations, and may be combined unless inconsistency occurs.
- The substrate processing apparatus according to the present disclosure can be applicable to any type of substrate processing apparatus, such as a capacitively coupled plasma (CCP) type, an inductively coupled plasma (ICP) type, a radial line slot antenna type, an electron cyclotron resonance plasma (ECR) type, and a helicon wave plasma (HWP) type.
- In this specification, a wafer W is referred to as an example of a substrate. However, the substrate is not limited to the wafer. Examples of the substrate may include various types of substrates used in an LCD (Liquid Crystal Display) or a FPD (Flat Panel Display), a CD substrate, or a printed circuit board.
Claims (12)
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JPJP2018-087467 | 2018-04-27 | ||
JP2018087467A JP6995008B2 (en) | 2018-04-27 | 2018-04-27 | Board processing equipment |
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US20190333785A1 true US20190333785A1 (en) | 2019-10-31 |
US11257691B2 US11257691B2 (en) | 2022-02-22 |
Family
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Family Applications (1)
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US16/394,320 Active 2039-10-24 US11257691B2 (en) | 2018-04-27 | 2019-04-25 | Substrate processing apparatus |
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US (1) | US11257691B2 (en) |
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KR20190125216A (en) | 2019-11-06 |
TW201946209A (en) | 2019-12-01 |
JP2019192881A (en) | 2019-10-31 |
JP6995008B2 (en) | 2022-01-14 |
US11257691B2 (en) | 2022-02-22 |
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