US20190321941A1 - Multiple Nozzle Slurry Dispense Scheme - Google Patents
Multiple Nozzle Slurry Dispense Scheme Download PDFInfo
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- US20190321941A1 US20190321941A1 US16/458,989 US201916458989A US2019321941A1 US 20190321941 A1 US20190321941 A1 US 20190321941A1 US 201916458989 A US201916458989 A US 201916458989A US 2019321941 A1 US2019321941 A1 US 2019321941A1
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- United States
- Prior art keywords
- slurry
- polishing pad
- wafer
- multiple nozzles
- dispensing arm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Definitions
- the present disclosure relates generally to an integrated circuit fabrication and more particularly to a slurry dispensing scheme.
- CMP chemical mechanical polishing
- slurry is used with a polishing pad to polish a wafer.
- the slurry flow on the polishing pad influences the removal rate, uniformity, and cost.
- a slurry dispensing scheme to improve uniformity and save cost is desired.
- FIG. 1 is a schematic diagram of an exemplary multiple nozzle slurry dispensing scheme according to some embodiments
- FIG. 2 is a schematic diagram of an exemplary slurry dispensing arm in FIG. 1 according to some embodiments.
- FIG. 3 is a flowchart of an operation method of the exemplary multiple nozzle slurry dispensing scheme in FIG. 1 according to some embodiments.
- the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
- the formation of a feature on, connected to, and/or coupled to another feature in the present disclosure that follows may include embodiments in which the features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the features, such that the features may not be in direct contact.
- spatially relative terms for example, “lower,” “upper,” “horizontal,” “vertical,” “above,” “over,” “below,” “beneath,” “up,” “down,” “top,” “bottom,” etc.
- FIG. 1 is a schematic diagram of a chemical mechanical polishing (CMP) set up 100 with an exemplary multiple nozzle slurry dispensing scheme according to some embodiments.
- the CMP setup 100 includes a slurry dispensing arm 102 , multiple nozzles 104 formed on the slurry dispensing arm 102 , a slurry supply module 103 connected to the slurry dispensing arm 102 , a polishing pad 106 , a pad conditioner 110 , a pad conditioner arm 108 , and a wafer holder 112 . As shown in FIG.
- wafer holder 112 can be positioned above a polishing surface of polishing pad 106 on an opposite side of the polishing pad than the slurry dispensing arm 102 , such that the dispensed slurry 114 can spread out after being dispensed to be under the whole of the wafer.
- the slurry supply module 103 is configured to provide slurry 114 to the multiple nozzles 104 through the slurry dispensing arm 102 , and the slurry 114 is dispensed from the multiple nozzles 104 to the polishing pad 106 .
- the multiple nozzles are facing down toward the polishing pad 106 in some embodiments. In some embodiments, the multiple nozzles are facing upward away from the polishing pad 106 , such as pictured in FIG. 1 .
- the polishing pad 106 , the wafer holder 112 , and the pad conditioner 110 rotate during the polishing process in some embodiments.
- a wafer 101 that is being polished is loaded upside-down in the wafer holder 112 (indicated by wafer 101 being illustrated with dotted lines, as wafer 101 is under wafer holder 112 from the perspective illustrated in FIG. 1 ).
- the wafer 101 is pressed against the polishing pad 106 during the polishing process.
- the wafer 101 can be held by vacuum by the wafer holder 112 to prevent unwanted particles from building up on the wafer surface.
- the slurry 114 is dispensed on the polishing pad 106 from the multiple nozzles of the slurry dispensing arm 102 . Both the polishing pad 106 and the wafer holder 112 are then rotated and the wafer holder 112 is kept oscillating as indicated by an arrow 111 in some embodiments.
- a downward pressure/force is applied to the wafer holder 112 , pushing the wafer 101 against the polishing pad 106 .
- the down force can be an average force or a local pressure can be applied, and the down force depends on the contact area and the surface structures of the wafer 101 and the polishing pad 106 .
- the polishing pad 106 is made from porous polymeric materials with a pore size between 30 ⁇ m and 50 ⁇ m in some embodiments.
- the polishing pad 106 wears down in the polishing process, and is regularly reconditioned by the pad conditioner 110 .
- the pad conditioner 110 has abrasive material such as diamond on its surface to maintain the desired roughness of the polishing pad 106 .
- the slurry 114 can be distributed on the polishing pad 106 relatively uniformly, e.g., compared to a single nozzle dispensing apparatus.
- the slurry is distributed across the polishing pad such that an inner edge of the slurry is distributed on the polishing pad in a wave outline and an outer edge of the slurry is distributed on the polishing pad in a curvilinear outline, such as shown in FIG. 1 .
- the dispensed slurry 114 can cover the polishing pad 106 faster than with single nozzle dispensing and reduce the amount of wasted slurry.
- the exemplary slurry dispensing arm 102 with 7 nozzles 104 saved 30% of slurry usage by dispensing 70 ml/min, compared to 100 ml/min of a conventional single nozzle dispenser.
- FIG. 2 is a schematic diagram of an exemplary slurry dispensing arm 102 in FIG. 1 according to some embodiments.
- the slurry dispensing arm 102 has multiple nozzles 104 .
- An arrow 202 indicates the direction of slurry movement. As indicated by the arrow 202 , the direction of slurry movement in the slurry dispensing arm 102 may be in only one direction from the proximal or base end of the slurry arm toward the distal end of the slurry arm where the multiple nozzles 104 are located.
- the slurry dispensing arm 102 comprises plastic, metal, or any other suitable material.
- the number of the multiple nozzles 104 ranges from 5 to 10 in some embodiments.
- the number of the multiple nozzles 104 can be different, e.g., 2-4 or more than 10, depending on applications.
- the multiple nozzles 104 can begin from a distal end of the slurry dispensing arm 102 spaced back toward a proximal end of the slurry dispensing arm 102 .
- the direction of slurry movement 202 through the slurry dispensing arm 102 is from the proximal end toward the distal end of the slurry dispensing arm 102 .
- a slurry outlet for each of the nozzles 104 may be disposed in a same plane as a surface of the slurry dispensing arm 102 .
- the surface may be the top surface of the arm (such as illustrated in FIG. 2 ) or the bottom surface of the arm (such as discussed above when the multiple nozzles 104 are facing down toward the polishing pad 106 ).
- FIG. 2 also illustrates that the slurry dispensing arm 102 may have a concave surface between each adjacent pair of the multiple nozzles 104 .
- the slurry dispensing arm 102 has 7 nozzles (or holes) with a 1 mm diameter Ld and a 7 mm spacing Ls for a polishing process of 8 inch wafer size. In another example, the slurry dispensing arm 102 has 10 nozzles (or holes) with similar dimensions for a polishing process of 12 inch wafer size.
- the percentage of the total combined length Lt of the multiple nozzles 104 of the slurry dispensing arm 102 over the wafer radius of the wafer under polishing ranges from 20% to 70% in some embodiments. The percentage ranges from 40% to 60% in some embodiments.
- the exemplary slurry dispensing arm 102 with the multiple nozzles 104 saved slurry usage by 10%-50% compared to conventional slurry dispensing arms. In one example, the exemplary slurry dispensing arm 102 with 7 nozzles 104 saved 30% of slurry usage by dispensing 70 ml/min, compared to 100 ml/min of a conventional single nozzle dispenser.
- the slurry dispensing arm 102 has 7 nozzles (or holes) with a 1 mm diameter Ld and a 7 mm spacing Ls for a polishing process of 8 inch wafer size.
- the combined length Lt of the multiple nozzles 104 on the slurry dispensing arm 102 ranges from 45 mm to 80 mm.
- FIG. 3 is a flowchart of an operation method of the exemplary multiple nozzle slurry dispense scheme in FIG. 1 according to some embodiments.
- slurry 114 is supplied to the slurry dispense arm 102 (from the slurry supply module 103 ).
- the slurry 114 is dispensed from the multiple nozzles 104 of the slurry dispense arm 102 .
- Both the polishing pad 106 and the wafer holder 112 are then rotated and the wafer holder 112 is kept oscillating as indicated by an arrow 111 in FIG. 1 in some embodiments.
- a downward pressure/force is applied to the wafer holder 112 , pushing the wafer 101 against the polishing pad 106 .
- the down force can be an average force or a local pressure can be applied, and the down force depends on the contact area and the surface structures of the wafer 101 and the polishing pad 106 .
- an apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm.
- the slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
- a method includes supplying slurry to a slurry dispensing arm that has multiple nozzles.
- the slurry is dispensed from the multiple nozzles of the slurry dispensing arm to a polishing pad.
- an apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a polishing pad.
- the slurry dispensing arm is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry on the polishing pad.
- an apparatus includes a polishing pad having a polishing surface, a wafer holder positioned over the polishing pad, a slurry dispensing arm positioned over the polishing pad, multiple nozzles formed on the slurry dispensing arm, where each of the multiple nozzles is configured to dispense slurry in an upward direction away from the polishing pad, and a slurry supply module connected to the slurry dispensing arm.
- a method includes supplying slurry to a slurry dispensing arm that has multiple nozzles disposed along a top surface thereof. Slurry is dispensed from the multiple nozzles of the slurry dispensing arm in an upward direction away from a polishing pad, the slurry flowing to a polishing surface of the polishing pad. The polishing pad is rotated to spread the slurry across the polishing pad. A wafer is pressed against the polishing pad to polish the wafer using the slurry.
- an apparatus includes a polishing pad, configured to rotate during a polishing process.
- the apparatus also includes a wafer holder, configured to hold a wafer against the polishing pad during the polishing process.
- the apparatus further includes a slurry dispensing arm configured to provide slurry from a base of the slurry dispensing arm toward a distal end of the slurry dispensing arm during the polishing process.
- the apparatus also includes multiple nozzles formed in an upper surface of the slurry dispensing arm, the multiple nozzles configured to dispense slurry in an upward direction away from the polishing pad during the polishing process.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
- This application is a continuation of U.S. patent application Ser. No. 14/179,348, entitled “Multiple Nozzle Slurry Dispense Scheme,” filed on Feb. 12, 2014, which application is incorporated herein by reference
- The present disclosure relates generally to an integrated circuit fabrication and more particularly to a slurry dispensing scheme.
- For a chemical mechanical polishing (CMP) process, slurry is used with a polishing pad to polish a wafer. The slurry flow on the polishing pad influences the removal rate, uniformity, and cost. A slurry dispensing scheme to improve uniformity and save cost is desired.
- Reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
-
FIG. 1 is a schematic diagram of an exemplary multiple nozzle slurry dispensing scheme according to some embodiments; -
FIG. 2 is a schematic diagram of an exemplary slurry dispensing arm inFIG. 1 according to some embodiments; and -
FIG. 3 is a flowchart of an operation method of the exemplary multiple nozzle slurry dispensing scheme inFIG. 1 according to some embodiments. - The making and using of various embodiments are discussed in detail below. It should be appreciated, however, that the present disclosure provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use, and do not limit the scope of the disclosure.
- In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Moreover, the formation of a feature on, connected to, and/or coupled to another feature in the present disclosure that follows may include embodiments in which the features are formed in direct contact, and may also include embodiments in which additional features may be formed interposing the features, such that the features may not be in direct contact. In addition, spatially relative terms, for example, “lower,” “upper,” “horizontal,” “vertical,” “above,” “over,” “below,” “beneath,” “up,” “down,” “top,” “bottom,” etc. as well as derivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,” etc.) are used for ease of the present disclosure of one features relationship to another feature. The spatially relative terms are intended to cover different orientations of the device including the features.
-
FIG. 1 is a schematic diagram of a chemical mechanical polishing (CMP) set up 100 with an exemplary multiple nozzle slurry dispensing scheme according to some embodiments. TheCMP setup 100 includes a slurry dispensingarm 102,multiple nozzles 104 formed on theslurry dispensing arm 102, aslurry supply module 103 connected to theslurry dispensing arm 102, apolishing pad 106, apad conditioner 110, apad conditioner arm 108, and awafer holder 112. As shown inFIG. 1 , in some embodiments,wafer holder 112 can be positioned above a polishing surface ofpolishing pad 106 on an opposite side of the polishing pad than theslurry dispensing arm 102, such that the dispensedslurry 114 can spread out after being dispensed to be under the whole of the wafer. - The
slurry supply module 103 is configured to provideslurry 114 to themultiple nozzles 104 through the slurry dispensingarm 102, and theslurry 114 is dispensed from themultiple nozzles 104 to thepolishing pad 106. The multiple nozzles are facing down toward thepolishing pad 106 in some embodiments. In some embodiments, the multiple nozzles are facing upward away from thepolishing pad 106, such as pictured inFIG. 1 . - The
polishing pad 106, thewafer holder 112, and thepad conditioner 110 rotate during the polishing process in some embodiments. Awafer 101 that is being polished is loaded upside-down in the wafer holder 112 (indicated bywafer 101 being illustrated with dotted lines, aswafer 101 is underwafer holder 112 from the perspective illustrated inFIG. 1 ). Thewafer 101 is pressed against thepolishing pad 106 during the polishing process. During the process of loading and unloading thewafer 101 onto thewafer holder 112, thewafer 101 can be held by vacuum by thewafer holder 112 to prevent unwanted particles from building up on the wafer surface. - For the polishing process, the
slurry 114 is dispensed on thepolishing pad 106 from the multiple nozzles of theslurry dispensing arm 102. Both thepolishing pad 106 and thewafer holder 112 are then rotated and thewafer holder 112 is kept oscillating as indicated by anarrow 111 in some embodiments. A downward pressure/force is applied to thewafer holder 112, pushing thewafer 101 against thepolishing pad 106. The down force can be an average force or a local pressure can be applied, and the down force depends on the contact area and the surface structures of thewafer 101 and thepolishing pad 106. - The
polishing pad 106 is made from porous polymeric materials with a pore size between 30 μm and 50 μm in some embodiments. Thepolishing pad 106 wears down in the polishing process, and is regularly reconditioned by thepad conditioner 110. Thepad conditioner 110 has abrasive material such as diamond on its surface to maintain the desired roughness of thepolishing pad 106. - By using
multiple nozzles 104 of theslurry dispensing arm 102, theslurry 114 can be distributed on thepolishing pad 106 relatively uniformly, e.g., compared to a single nozzle dispensing apparatus. In some embodiments, the slurry is distributed across the polishing pad such that an inner edge of the slurry is distributed on the polishing pad in a wave outline and an outer edge of the slurry is distributed on the polishing pad in a curvilinear outline, such as shown inFIG. 1 . Also, the dispensedslurry 114 can cover thepolishing pad 106 faster than with single nozzle dispensing and reduce the amount of wasted slurry. In one example, the exemplary slurry dispensingarm 102 with 7nozzles 104 saved 30% of slurry usage by dispensing 70 ml/min, compared to 100 ml/min of a conventional single nozzle dispenser. -
FIG. 2 is a schematic diagram of an exemplary slurry dispensingarm 102 inFIG. 1 according to some embodiments. The slurry dispensingarm 102 hasmultiple nozzles 104. Anarrow 202 indicates the direction of slurry movement. As indicated by thearrow 202, the direction of slurry movement in theslurry dispensing arm 102 may be in only one direction from the proximal or base end of the slurry arm toward the distal end of the slurry arm where themultiple nozzles 104 are located. The slurry dispensingarm 102 comprises plastic, metal, or any other suitable material. The number of themultiple nozzles 104 ranges from 5 to 10 in some embodiments. In other embodiments, the number of themultiple nozzles 104 can be different, e.g., 2-4 or more than 10, depending on applications. Themultiple nozzles 104 can begin from a distal end of theslurry dispensing arm 102 spaced back toward a proximal end of theslurry dispensing arm 102. In some embodiments, the direction ofslurry movement 202 through the slurry dispensingarm 102 is from the proximal end toward the distal end of the slurry dispensingarm 102. As can be seen inFIG. 2 , a slurry outlet for each of thenozzles 104 may be disposed in a same plane as a surface of theslurry dispensing arm 102. The surface may be the top surface of the arm (such as illustrated inFIG. 2 ) or the bottom surface of the arm (such as discussed above when themultiple nozzles 104 are facing down toward the polishing pad 106).FIG. 2 also illustrates that theslurry dispensing arm 102 may have a concave surface between each adjacent pair of themultiple nozzles 104. - In one example, the
slurry dispensing arm 102 has 7 nozzles (or holes) with a 1 mm diameter Ld and a 7 mm spacing Ls for a polishing process of 8 inch wafer size. In another example, theslurry dispensing arm 102 has 10 nozzles (or holes) with similar dimensions for a polishing process of 12 inch wafer size. - The percentage of the total combined length Lt of the
multiple nozzles 104 of theslurry dispensing arm 102 over the wafer radius of the wafer under polishing ranges from 20% to 70% in some embodiments. The percentage ranges from 40% to 60% in some embodiments. The exemplary slurry dispensingarm 102 with themultiple nozzles 104 saved slurry usage by 10%-50% compared to conventional slurry dispensing arms. In one example, the exemplary slurry dispensingarm 102 with 7nozzles 104 saved 30% of slurry usage by dispensing 70 ml/min, compared to 100 ml/min of a conventional single nozzle dispenser. In this example, theslurry dispensing arm 102 has 7 nozzles (or holes) with a 1 mm diameter Ld and a 7 mm spacing Ls for a polishing process of 8 inch wafer size. In some embodiments, the combined length Lt of themultiple nozzles 104 on theslurry dispensing arm 102 ranges from 45 mm to 80 mm. -
FIG. 3 is a flowchart of an operation method of the exemplary multiple nozzle slurry dispense scheme inFIG. 1 according to some embodiments. Atstep 302,slurry 114 is supplied to the slurry dispense arm 102 (from the slurry supply module 103). Atstep 304, theslurry 114 is dispensed from themultiple nozzles 104 of the slurry dispensearm 102. Both thepolishing pad 106 and thewafer holder 112 are then rotated and thewafer holder 112 is kept oscillating as indicated by anarrow 111 inFIG. 1 in some embodiments. A downward pressure/force is applied to thewafer holder 112, pushing thewafer 101 against thepolishing pad 106. The down force can be an average force or a local pressure can be applied, and the down force depends on the contact area and the surface structures of thewafer 101 and thepolishing pad 106. - According to some embodiments, an apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a slurry supply module connected to the slurry dispensing arm. The slurry supply module is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry.
- According to some embodiments, a method includes supplying slurry to a slurry dispensing arm that has multiple nozzles. The slurry is dispensed from the multiple nozzles of the slurry dispensing arm to a polishing pad.
- According to some embodiments, an apparatus includes a slurry dispensing arm, multiple nozzles formed on the slurry dispensing arm, and a polishing pad. The slurry dispensing arm is configured to provide slurry to the multiple nozzles and the multiple nozzles are configured to dispense the slurry on the polishing pad.
- According to some embodiments, an apparatus includes a polishing pad having a polishing surface, a wafer holder positioned over the polishing pad, a slurry dispensing arm positioned over the polishing pad, multiple nozzles formed on the slurry dispensing arm, where each of the multiple nozzles is configured to dispense slurry in an upward direction away from the polishing pad, and a slurry supply module connected to the slurry dispensing arm.
- According to some embodiments, a method includes supplying slurry to a slurry dispensing arm that has multiple nozzles disposed along a top surface thereof. Slurry is dispensed from the multiple nozzles of the slurry dispensing arm in an upward direction away from a polishing pad, the slurry flowing to a polishing surface of the polishing pad. The polishing pad is rotated to spread the slurry across the polishing pad. A wafer is pressed against the polishing pad to polish the wafer using the slurry.
- According to some embodiments, an apparatus includes a polishing pad, configured to rotate during a polishing process. The apparatus also includes a wafer holder, configured to hold a wafer against the polishing pad during the polishing process. The apparatus further includes a slurry dispensing arm configured to provide slurry from a base of the slurry dispensing arm toward a distal end of the slurry dispensing arm during the polishing process. The apparatus also includes multiple nozzles formed in an upper surface of the slurry dispensing arm, the multiple nozzles configured to dispense slurry in an upward direction away from the polishing pad during the polishing process.
- A skilled person in the art will appreciate that there can be many embodiment variations of this disclosure. Although the embodiments and their features have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the embodiments. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, and composition of matter, means, methods, and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosed embodiments, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure.
- The above method embodiment shows exemplary steps, but they are not necessarily required to be performed in the order shown. Steps may be added, replaced, changed order, and/or eliminated as appropriate, in accordance with the spirit and scope of embodiment of the disclosure. Embodiments that combine different claims and/or different embodiments are within the scope of the disclosure and will be apparent to those skilled in the art after reviewing this disclosure.
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US16/458,989 US11318579B2 (en) | 2014-02-12 | 2019-07-01 | Multiple nozzle slurry dispense scheme |
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US14/179,348 US10335920B2 (en) | 2014-02-12 | 2014-02-12 | Multiple nozzle slurry dispense scheme |
US16/458,989 US11318579B2 (en) | 2014-02-12 | 2019-07-01 | Multiple nozzle slurry dispense scheme |
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US14/179,348 Continuation US10335920B2 (en) | 2014-02-12 | 2014-02-12 | Multiple nozzle slurry dispense scheme |
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US11318579B2 US11318579B2 (en) | 2022-05-03 |
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US20170355059A1 (en) * | 2016-06-14 | 2017-12-14 | Confluense Llc | Slurry Slip Stream Controller For CMP System |
JP7162465B2 (en) * | 2018-08-06 | 2022-10-28 | 株式会社荏原製作所 | Polishing device and polishing method |
WO2024049719A2 (en) * | 2022-08-29 | 2024-03-07 | Rajeev Bajaj | Advanced fluid delivery |
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US1628118A (en) * | 1924-02-19 | 1927-05-10 | Walter H Coles | Lawn-sprinkling device |
JP2647050B2 (en) * | 1995-03-31 | 1997-08-27 | 日本電気株式会社 | Wafer polishing equipment |
US6053801A (en) * | 1999-05-10 | 2000-04-25 | Applied Materials, Inc. | Substrate polishing with reduced contamination |
US6283840B1 (en) * | 1999-08-03 | 2001-09-04 | Applied Materials, Inc. | Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus |
JP2001191276A (en) | 1999-10-29 | 2001-07-17 | Sony Corp | Robot system, robot device and exterior thereof |
US6669538B2 (en) * | 2000-02-24 | 2003-12-30 | Applied Materials Inc | Pad cleaning for a CMP system |
US6398627B1 (en) * | 2001-03-22 | 2002-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry dispenser having multiple adjustable nozzles |
US6506098B1 (en) * | 2002-05-20 | 2003-01-14 | Taiwan Semiconductor Manufacturing Company | Self-cleaning slurry arm on a CMP tool |
US6884152B2 (en) * | 2003-02-11 | 2005-04-26 | Micron Technology, Inc. | Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces |
US6984166B2 (en) * | 2003-08-01 | 2006-01-10 | Chartered Semiconductor Manufacturing Ltd. | Zone polishing using variable slurry solid content |
US20050113006A1 (en) * | 2003-11-21 | 2005-05-26 | Wang Michael S. | Chemical mechanical polishing apparatus and method to minimize slurry accumulation and scratch excursions |
US20100011291A1 (en) * | 2008-07-10 | 2010-01-14 | Nokia Corporation | User interface, device and method for a physically flexible device |
US8523639B2 (en) * | 2008-10-31 | 2013-09-03 | Applied Materials, Inc. | Self cleaning and adjustable slurry delivery arm |
US8277286B2 (en) * | 2009-02-13 | 2012-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method |
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US10335920B2 (en) | 2019-07-02 |
US11318579B2 (en) | 2022-05-03 |
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