US20190309432A1 - Tool for plating resin molded body and method for plating resin molded body using the same - Google Patents

Tool for plating resin molded body and method for plating resin molded body using the same Download PDF

Info

Publication number
US20190309432A1
US20190309432A1 US15/945,808 US201815945808A US2019309432A1 US 20190309432 A1 US20190309432 A1 US 20190309432A1 US 201815945808 A US201815945808 A US 201815945808A US 2019309432 A1 US2019309432 A1 US 2019309432A1
Authority
US
United States
Prior art keywords
plating
tool
molded body
resin molded
plasticizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/945,808
Inventor
Yasuyuki Kuramochi
Hiroshi Ishizuka
Miyoko Izumitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU International Inc
Original Assignee
JCU International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCU International Inc filed Critical JCU International Inc
Priority to US15/945,808 priority Critical patent/US20190309432A1/en
Assigned to JCU INTERNATIONAL, INC. reassignment JCU INTERNATIONAL, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KURAMOCHI, YASUYUKI, ISHIZUKA, HIROSHI, IZUMITANI, MIYOKO
Priority to JP2019017662A priority patent/JP6551622B1/en
Priority to PCT/JP2019/004566 priority patent/WO2019193835A1/en
Publication of US20190309432A1 publication Critical patent/US20190309432A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1621—Protection of inner surfaces of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • the present invention relates to a tool for plating a resin molded body for holding the resin molded body during an operation of plating the resin molded body, and a method for plating a resin molded body using the tool.
  • ABS acrylonitrile-butadiene-styrene
  • PC/ABS polycarbonate/acrylonitrile-butadiene-styrene
  • etching liquid has an adverse effect on the operation environment.
  • a complicated treatment in which harmful hexavalent chromium is reduced to trivalent chromium, and then, the trivalent chromium is precipitated by neutralization, or the like is needed.
  • the operation is performed at a high temperature of 60° C. or higher using harmful hexavalent chromium, and therefore, the operation environment is poor, and also there is a problem that it is necessary to pay attention also to the treatment of the waste water thereof.
  • plating on a surface of a plastic can be performed, but a catalytic metal is adsorbed also on a coating surface of a tool, and therefore, there is a problem that plating is likely to be deposited on the surface of the tool as well as on the surface of the plastic by the subsequent plating step.
  • a small amount of hexavalent chromium remains in an insulation coating portion of a plating tool in an etching treatment step, and this serves as a catalyst poison, and even in the case where an electroless plating catalyst remains in the insulation coating portion of the tool, electroless plating is prevented from depositing on the surface of the tool. Due to this, even in the case where electroplating is performed sequentially, electroplating is not deposited on the plating tool, and electroless plating and electroplating can be performed sequentially.
  • Patent Document 3 JP-A-2009-30151 (Patent Document 3)
  • a special and expensive material is needed, for example, a fluororesin or the like is used for a tool coating part, resulting in high cost, and therefore, such a method is not practical.
  • an object of the present invention is to provide a plating tool which avoids plating deposition on the tool itself while using a general-purpose tool which has been used so far in plating of a resin molded body, and therefore, also eliminates the need to exchange the plating tool.
  • the present inventors found that the above object can be achieved by coating a surface of a plating tool having an insulation coating part which is usually used in plating of a resin molded body with a plasticizer, and thus, completed the present invention.
  • the present invention is directed to a tool for plating a resin molded body, wherein a surface of a plating tool having an insulation coating part is coated with a plasticizer.
  • the present invention is directed to a method for producing a tool for plating a resin molded body, including treating a surface of a plating tool having an insulation coating part with a plasticizer so as to coat the surface of the plating tool having an insulation coating part with the plasticizer.
  • the present invention is directed to a method for plating a resin molded body, including using the tool for plating a resin molded body in plating of the resin molded body.
  • plating deposition on the tool itself does not occur in plating of a resin molded body, and therefore, the plating tool does not need to be exchanged.
  • the tool for plating a resin molded body of the present invention can be favorably used in plating of a resin molded body.
  • a tool for plating a resin molded body of the present invention (hereinafter referred to as “tool of the present invention”) is configured such that a surface of a plating tool having an insulation coating part which is usually used in plating of a resin molded body is coated with a plasticizer.
  • the plating tool having an insulation coating part which is usually used in plating of a resin molded body includes an electricity conducting part, on which the resin molded body is hung and which is provided for conducting electricity to the resin molded body, and an insulation coating part formed by coating a region where plating is not desired to be deposited in the electricity conducting part with an insulator.
  • the shape of the tool is not particularly limited.
  • the electricity conducting part of the usual tool is formed of, for example, a metal capable of conducting electricity, such as SUS or copper.
  • the insulation coating part is formed of an insulator, for example, a fluororesin, a silicone resin, or a thermoplastic resin.
  • thermoplastic resins are preferred, and among these, vinyl chloride is more preferred.
  • the coating of the electricity conducting part with such an insulator can be performed by a conventional method. Further, these insulators may contain a plasticizer.
  • the surface of the usual tool In order to coat the surface of the usual tool with a plasticizer, the surface of the usual tool only need to be treated with the plasticizer.
  • the treatment method is not particularly limited, but examples thereof include a method in which a process for immersing the usual tool in a solution containing a plasticizer, a process for applying a solution containing a plasticizer to the usual tool, or the like is performed, and thereafter, the usual tool is dried or fired, for example, whereby the surface of the usual tool is coated with the plasticizer.
  • the plasticizer does not have any influence on the electricity conducting part; however, when a degreasing treatment is performed after coating, the plasticizer on the electricity conducting part can be removed.
  • the plasticizer used here is not particularly limited; however, ester compounds synthesized from an acid and an alcohol are preferred, and phthalate esters, adipate esters, trimellitate esters, phosphate esters, citrate esters, sebacate esters, azelate esters, maleate esters, and benzoate esters are more preferred. It is only necessary to contain at least one plasticizer among these plasticizers.
  • the concentration of such a plasticizer is not particularly limited, and for example, a commercially available stock solution can be used as it is. Further, the temperature of such a plasticizer is not particularly limited, and is, for example, a normal temperature.
  • the conditions for drying or firing vary depending on the type or concentration of the plasticizer, and therefore are not particularly limited, and may be any condition except for the conditions in which, for example, the plasticizer is volatilized and thus, coating cannot be performed.
  • General examples of such conditions include about one day at a normal temperature in the case of drying, and about 20 minutes at 160° C. in the case of firing. Further, drying or firing may be performed using a usual dryer, electric furnace, or the like other than air drying.
  • the surface of the usual tool is coated with the plasticizer. It can be confirmed whether or not the surface of the tool is coated with the plasticizer by comparison of the external appearance by visual observation, various measurements, etc. However, for example, it is preferred to determine that the surface of the tool is coated with the plasticizer when the deposition area is 5% or less, preferably 0% after performing the procedure up to copper sulfate plating in the method of Example 2 mentioned below. In the case where the surface of the tool is not coated with the plasticizer, the deposition area after copper sulfate plating does not fall within the above-mentioned range.
  • the usual tool is immersed in dioctyl phthalate (stock solution), which is the plasticizer of the same type as contained in vinyl chloride, for 10 to 30 seconds. Subsequently, the usual tool is dried at 140 to 200° C. for 5 to 30 minutes to form a coating film of the plasticizer on the vinyl chloride sol on the surface of the usual tool, and then, the unnecessary plasticizer on the electricity conducting part is removed by a degreasing treatment, whereby the tool of the present invention is obtained.
  • stock solution dioctyl phthalate
  • stock solution is the plasticizer of the same type as contained in vinyl chloride
  • the thus obtained tool of the present invention can be used for plating a resin molded body because even if a treatment such as etching, catalyst impartation, or plating is performed, plating deposition on the tool itself does not occur.
  • the plating of the resin molded body may be any of electroplating, electroless plating, and a combination of these.
  • the type of the plating liquid is also not particularly limited; however, for example, in the case of electroless plating, electroless nickel plating, electroless copper plating, and the like can be exemplified, and in the case of electroplating, copper sulfate plating, nickel electroplating, chromium electroplating, and the like can be exemplified.
  • the resin molded body is not particularly limited; however, for example, molded bodies of ABS, PC/ABS, and the like can be exemplified. Further, as the conditions for the plating of the resin molded body, conventional plating conditions can be used except that the tool of the present invention is used as the tool.
  • the tool of the present invention in so-called plating free from chromic acid etching, in which an etching liquid containing a permanganate as a main component, ozone or the like is used in place of using an etching liquid containing chromic acid in etching of the resin molded body.
  • plating deposition on the tool occurs heavily, and the exchange of the tool is needed; however, in the case where the tool of the present invention is used, plating deposition on the tool does not occur.
  • a tool electrically conducting part: copper (basic skeleton), SUS (branch skeleton) coated with a general-purpose soft vinyl chloride sol (manufactured by MARUISHI KASEIHIN K.K., Product No. G-2330 black, containing dioctyl phthalate as a plasticizer) was immersed in a plasticizer shown in Table 1 for 20 seconds, and thereafter fired at a temperature shown in Table 1 for 20 minutes, and then, the unnecessary plasticizer on the electricity conducting part was removed by a degreasing treatment, whereby the tool of the present invention was produced.
  • a general-purpose soft vinyl chloride sol manufactured by MARUISHI KASEIHIN K.K., Product No. G-2330 black, containing dioctyl phthalate as a plasticizer
  • Tool B dioctyl phthalate 220° C.
  • Tool C dioctyl phthalate 200° C.
  • Tool D dioctyl phthalate 180° C.
  • Tool E dioctyl phthalate 160° C.
  • Tool F trioctyl trimellitate 160° C.
  • Tool G tricresyl phosphate 160° C.
  • Tool H tributyl acetylcitrate 160° C.
  • Tool I dioctyl phthalate 160° C. tributyl acetylcitrate
  • Tool J tricresyl phosphate 160° C. tributyl acetylcitrate
  • the plasticizer was volatilized by firing, and the external appearance thereof was the same as that of the tool A which was not treated with a plasticizer.
  • the external appearances of the tools C to J were different from that of the tool A which was not treated with a plasticizer.
  • the area of the insulation coating part of the tool was assumed to be 100%, and the area in which plating deposition occurred was evaluated into the following five grades by visual observation.
  • the plating deposition state of the material to be plated after electroless nickel plating and after copper sulfate plating was favorable regardless of the tool used.
  • plating deposition on the tool occurred heavily both after electroless nickel plating and after copper sulfate plating.
  • plating deposition on the tool occurred less both after electroless nickel plating and after copper sulfate plating. Further, it was found that even if plating was deposited on the tool after electroless nickel plating, the plating did not extend and the deposition occurred less after copper sulfate plating.
  • the tool of the present invention can be favorably used in plating of a resin molded body.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An object of the present invention is to provide a plating tool which avoids plating deposition on the tool itself in plating of a resin molded body, and therefore, also eliminates the need to exchange the plating tool. The object is achieved by a tool for plating a resin molded body, wherein a surface of a plating tool having an insulation coating part is coated with a plasticizer, and a method for plating a resin molded body using the tool.

Description

    BACKGROUND OF THE INVENTION Field of the Invention
  • The present invention relates to a tool for plating a resin molded body for holding the resin molded body during an operation of plating the resin molded body, and a method for plating a resin molded body using the tool.
    • Background Art
  • Conventionally, in the case where a surface of a resin molded body of an acrylonitrile-butadiene-styrene (ABS) resin, a polycarbonate/acrylonitrile-butadiene-styrene (PC/ABS) resin, or the like is plated, it is known to perform an etching treatment for roughening the surface of the resin molded body with a mixed liquid of chromic acid and sulfuric acid before a plating treatment in order to increase the adhesion between the resin molded body and a plating film.
  • However, a large amount of harmful hexavalent chromium is contained in the above-mentioned etching liquid, and the etching liquid has an adverse effect on the operation environment. Further, in order to safely treat the waste water thereof, a complicated treatment in which harmful hexavalent chromium is reduced to trivalent chromium, and then, the trivalent chromium is precipitated by neutralization, or the like is needed. In this treatment, the operation is performed at a high temperature of 60° C. or higher using harmful hexavalent chromium, and therefore, the operation environment is poor, and also there is a problem that it is necessary to pay attention also to the treatment of the waste water thereof.
  • In light of these problems, it is desired to provide an etchant as a substitute for the mixed liquid of chromic acid and sulfuric acid, and, for example, a plating process free from chromic acid etching in which a treatment is performed with an etchant using a permanganate in place of these etchants and plating is performed has been reported (see JP-A-52-124434 (Patent Document 1) and Japanese Patent No. 5177426 (Patent Document 2)).
  • However, in the above process, plating on a surface of a plastic can be performed, but a catalytic metal is adsorbed also on a coating surface of a tool, and therefore, there is a problem that plating is likely to be deposited on the surface of the tool as well as on the surface of the plastic by the subsequent plating step.
  • In etching with the mixed liquid of chromic acid and sulfuric acid used conventionally, a small amount of hexavalent chromium remains in an insulation coating portion of a plating tool in an etching treatment step, and this serves as a catalyst poison, and even in the case where an electroless plating catalyst remains in the insulation coating portion of the tool, electroless plating is prevented from depositing on the surface of the tool. Due to this, even in the case where electroplating is performed sequentially, electroplating is not deposited on the plating tool, and electroless plating and electroplating can be performed sequentially.
  • On the other hand, in the case where an etching treatment liquid containing a permanganate as a main component is used, a component to serve as a catalyst poison is not contained in the etching treatment liquid. Therefore, when an electroless plating catalyst is adhered to the insulation coating portion of the plating tool, electroless plating is deposited on this portion. Due to this, it is necessary to exchange the tool when the process is shifted from electroless plating to electroplating, and therefore, there is a problem that the workability is very poor.
  • In view of this, several methods for suppressing plating deposition on a tool have been reported (JP-A-2009-30151 (Patent Document 3)); however, in each method, a special and expensive material is needed, for example, a fluororesin or the like is used for a tool coating part, resulting in high cost, and therefore, such a method is not practical.
    • SUMMARY OF THE INVENTION
  • Accordingly, an object of the present invention is to provide a plating tool which avoids plating deposition on the tool itself while using a general-purpose tool which has been used so far in plating of a resin molded body, and therefore, also eliminates the need to exchange the plating tool.
  • As a result of intensive studies for achieving the above object, the present inventors found that the above object can be achieved by coating a surface of a plating tool having an insulation coating part which is usually used in plating of a resin molded body with a plasticizer, and thus, completed the present invention.
  • That is, the present invention is directed to a tool for plating a resin molded body, wherein a surface of a plating tool having an insulation coating part is coated with a plasticizer.
  • Further, the present invention is directed to a method for producing a tool for plating a resin molded body, including treating a surface of a plating tool having an insulation coating part with a plasticizer so as to coat the surface of the plating tool having an insulation coating part with the plasticizer.
  • Still further, the present invention is directed to a method for plating a resin molded body, including using the tool for plating a resin molded body in plating of the resin molded body.
  • According to the tool for plating a resin molded body of the present invention, plating deposition on the tool itself does not occur in plating of a resin molded body, and therefore, the plating tool does not need to be exchanged.
  • Therefore, the tool for plating a resin molded body of the present invention can be favorably used in plating of a resin molded body.
    • DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • A tool for plating a resin molded body of the present invention (hereinafter referred to as “tool of the present invention”) is configured such that a surface of a plating tool having an insulation coating part which is usually used in plating of a resin molded body is coated with a plasticizer.
  • The plating tool having an insulation coating part which is usually used in plating of a resin molded body (hereinafter referred to as “usual tool”) includes an electricity conducting part, on which the resin molded body is hung and which is provided for conducting electricity to the resin molded body, and an insulation coating part formed by coating a region where plating is not desired to be deposited in the electricity conducting part with an insulator. Incidentally, the shape of the tool is not particularly limited.
  • The electricity conducting part of the usual tool is formed of, for example, a metal capable of conducting electricity, such as SUS or copper. Further, the insulation coating part is formed of an insulator, for example, a fluororesin, a silicone resin, or a thermoplastic resin. Among these insulators, thermoplastic resins are preferred, and among these, vinyl chloride is more preferred. The coating of the electricity conducting part with such an insulator can be performed by a conventional method. Further, these insulators may contain a plasticizer.
  • In order to coat the surface of the usual tool with a plasticizer, the surface of the usual tool only need to be treated with the plasticizer.
  • The treatment method is not particularly limited, but examples thereof include a method in which a process for immersing the usual tool in a solution containing a plasticizer, a process for applying a solution containing a plasticizer to the usual tool, or the like is performed, and thereafter, the usual tool is dried or fired, for example, whereby the surface of the usual tool is coated with the plasticizer. Incidentally, the plasticizer does not have any influence on the electricity conducting part; however, when a degreasing treatment is performed after coating, the plasticizer on the electricity conducting part can be removed.
  • The plasticizer used here is not particularly limited; however, ester compounds synthesized from an acid and an alcohol are preferred, and phthalate esters, adipate esters, trimellitate esters, phosphate esters, citrate esters, sebacate esters, azelate esters, maleate esters, and benzoate esters are more preferred. It is only necessary to contain at least one plasticizer among these plasticizers.
  • The concentration of such a plasticizer is not particularly limited, and for example, a commercially available stock solution can be used as it is. Further, the temperature of such a plasticizer is not particularly limited, and is, for example, a normal temperature.
  • The conditions for drying or firing vary depending on the type or concentration of the plasticizer, and therefore are not particularly limited, and may be any condition except for the conditions in which, for example, the plasticizer is volatilized and thus, coating cannot be performed. General examples of such conditions include about one day at a normal temperature in the case of drying, and about 20 minutes at 160° C. in the case of firing. Further, drying or firing may be performed using a usual dryer, electric furnace, or the like other than air drying.
  • After the above-mentioned treatment, the surface of the usual tool is coated with the plasticizer. It can be confirmed whether or not the surface of the tool is coated with the plasticizer by comparison of the external appearance by visual observation, various measurements, etc. However, for example, it is preferred to determine that the surface of the tool is coated with the plasticizer when the deposition area is 5% or less, preferably 0% after performing the procedure up to copper sulfate plating in the method of Example 2 mentioned below. In the case where the surface of the tool is not coated with the plasticizer, the deposition area after copper sulfate plating does not fall within the above-mentioned range.
  • As a preferred embodiment of the tool of the present invention, for example, the following tools are exemplified.
    • <Usual Tool>
    • Electricity conducting part: SUS, copper
    • Insulation part: soft vinyl chloride sol coating (containing dioctyl phthalate as a plasticizer)
    <Tool of the Present Invention>
  • The usual tool is immersed in dioctyl phthalate (stock solution), which is the plasticizer of the same type as contained in vinyl chloride, for 10 to 30 seconds. Subsequently, the usual tool is dried at 140 to 200° C. for 5 to 30 minutes to form a coating film of the plasticizer on the vinyl chloride sol on the surface of the usual tool, and then, the unnecessary plasticizer on the electricity conducting part is removed by a degreasing treatment, whereby the tool of the present invention is obtained.
  • The thus obtained tool of the present invention can be used for plating a resin molded body because even if a treatment such as etching, catalyst impartation, or plating is performed, plating deposition on the tool itself does not occur. The plating of the resin molded body may be any of electroplating, electroless plating, and a combination of these. Further, the type of the plating liquid is also not particularly limited; however, for example, in the case of electroless plating, electroless nickel plating, electroless copper plating, and the like can be exemplified, and in the case of electroplating, copper sulfate plating, nickel electroplating, chromium electroplating, and the like can be exemplified. Further, the resin molded body is not particularly limited; however, for example, molded bodies of ABS, PC/ABS, and the like can be exemplified. Further, as the conditions for the plating of the resin molded body, conventional plating conditions can be used except that the tool of the present invention is used as the tool.
  • In particular, it is preferred to use the tool of the present invention in so-called plating free from chromic acid etching, in which an etching liquid containing a permanganate as a main component, ozone or the like is used in place of using an etching liquid containing chromic acid in etching of the resin molded body. In the case where the usual tool is used as the tool to be used in such plating free from chromic acid etching, plating deposition on the tool occurs heavily, and the exchange of the tool is needed; however, in the case where the tool of the present invention is used, plating deposition on the tool does not occur.
    • EXAMPLES
  • Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is by no means limited to these examples
    • Example 1 Production of Tool
  • A tool (electricity conducting part: copper (basic skeleton), SUS (branch skeleton)) coated with a general-purpose soft vinyl chloride sol (manufactured by MARUISHI KASEIHIN K.K., Product No. G-2330 black, containing dioctyl phthalate as a plasticizer) was immersed in a plasticizer shown in Table 1 for 20 seconds, and thereafter fired at a temperature shown in Table 1 for 20 minutes, and then, the unnecessary plasticizer on the electricity conducting part was removed by a degreasing treatment, whereby the tool of the present invention was produced.
  • TABLE 1
    Firing
    Plasticizer temperature
    Tool A None —
    Tool B dioctyl phthalate 220° C.
    Tool C dioctyl phthalate 200° C.
    Tool D dioctyl phthalate 180° C.
    Tool E dioctyl phthalate 160° C.
    Tool F trioctyl trimellitate 160° C.
    Tool G tricresyl phosphate 160° C.
    Tool H tributyl acetylcitrate 160° C.
    Tool I dioctyl phthalate 160° C.
    tributyl acetylcitrate
    Tool J tricresyl phosphate 160° C.
    tributyl acetylcitrate
  • In the tool B, the plasticizer was volatilized by firing, and the external appearance thereof was the same as that of the tool A which was not treated with a plasticizer. The external appearances of the tools C to J were different from that of the tool A which was not treated with a plasticizer.
    • Example 2 Plating Test
  • To each of the tools A to J produced in Example 1, a flat plate (100 mm×50 mm×3 mm) of an ABS resin (CYCOLAC 3001M, manufactured by UMG ABS, Ltd.) to serve as a material to be plated was attached, and plating was performed under the conditions shown in Table 2. The deposition on the tool after electroless nickel plating and after copper sulfate plating was evaluated by the following method. The results are shown in Table 3.
  • TABLE 2
    Liquid composition Treatment conditions
    Treatment step Component Concentration Temperature Time
    Degreasing ENILEX WE* 10 ml/L 50° C. 10 min
    sulfuric acid 20 ml/L
    Etching potassium permanganate 2 g/L 68° C. 15 min
    sulfuric acid 200 ml/L
    Neutralization ENILEX RD* 10 ml/L 25° C.  1 min
    reduction hydrochloric acid 50 ml/L
    Conditioner D-POP CDV* 10 ml/L 25° C.  1 min
    Catalyzer CT-580* 10 ml/L 35° C.  4 min
    hydrochloric acid 200 ml/L
    Accelerator hydrochloric acid 100 ml/L 35° C.  4 min
    Electroless nickel ENILEX NI-100AM* 140 ml/L 35° C.  5 min
    plating ENILEX NI-100BM* 140 ml/L
    Copper sulfate copper sulfate 225 g/L 25° C. 30 min
    plating sulfuric acid 55 g/L   3 A/dm2
    chlorine 60 ppm
    CU-BRITE EP-30A* 1 ml/L
    CU-BRITE EP-30B* 0.3 ml/L
    CU-BRITE EP-30C* 4 ml/L
    Figure US20190309432A1-20191010-P00001
     A sufficient water washing step is included between the respective steps.
    *Trade name of JCU CORPORATION
    • <Evaluation Method for Deposition on Tool>
  • The area of the insulation coating part of the tool was assumed to be 100%, and the area in which plating deposition occurred was evaluated into the following five grades by visual observation.
    • (Evaluation): (deposition area)
    • A: 0%
    • B: more than 0% and 5% or less
    • C: more than 5% and 10% or less
    • D: more than 10% and 50% or less
    • E: more than 50%
  • TABLE 3
    After After
    electroless copper
    nickel sulfate
    Plasticizer plating plating
    Tool A None E E
    Tool B dioctyl phthalate D D
    (no coating)
    Tool C dioctyl phthalate C B
    Tool D dioctyl phthalate B A
    Tool E dioctyl phthalate A A
    Tool F trioctyl trimellitate B B
    Tool G tricresyl phosphate A A
    Tool H tributyl acetylcitrate B B
    Tool I dioctyl phthalate C B
    tributyl acetylcitrate
    Tool J tricresyl phosphate B B
    tributyl acetylcitrate
  • The plating deposition state of the material to be plated after electroless nickel plating and after copper sulfate plating was favorable regardless of the tool used. However, with respect to the tools, in the case of the tools A and B which were not coated with a plasticizer, plating deposition on the tool occurred heavily both after electroless nickel plating and after copper sulfate plating. On the other hand, in the case of the tools C to J coated with the plasticizer, plating deposition on the tool occurred less both after electroless nickel plating and after copper sulfate plating. Further, it was found that even if plating was deposited on the tool after electroless nickel plating, the plating did not extend and the deposition occurred less after copper sulfate plating.
  • The tool of the present invention can be favorably used in plating of a resin molded body.

Claims (8)

What is claimed is:
1. A tool for plating a resin molded body, wherein a surface of a plating tool having an insulation coating part is coated with a plasticizer.
2. The tool for plating a resin molded body according to claim 1, wherein the plasticizer contains at least one selected from the group consisting of ester compounds synthesized from an acid and an alcohol.
3. The tool for plating a resin molded body according to claim 1, wherein the plasticizer contains at least one selected from the group consisting of phthalate esters, adipate esters, trimellitate esters, phosphate esters, citrate esters, sebacate esters, azelate esters, maleate esters, and benzoate esters.
4. The tool for plating a resin molded body according to any one of claims 1 to 3, wherein the insulation coating part is formed from a thermoplastic resin.
5. The tool for plating a resin molded body according to any one of claims 1 to 3, wherein the tool is used for plating free from chromic acid etching.
6. A method for producing a tool for plating a resin molded body, comprising treating a surface of a plating tool having an insulation coating part with a plasticizer so as to coat the surface of the plating tool having an insulation coating part with the plasticizer.
7. A method for plating a resin molded body, comprising using the tool for plating a resin molded body according to any one of claims 1 to 5 in plating of the resin molded body.
8. The method for plating a resin molded body according to claim 7, wherein the plating of the resin molded body is plating free from chromic acid etching.
US15/945,808 2018-04-05 2018-04-05 Tool for plating resin molded body and method for plating resin molded body using the same Abandoned US20190309432A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/945,808 US20190309432A1 (en) 2018-04-05 2018-04-05 Tool for plating resin molded body and method for plating resin molded body using the same
JP2019017662A JP6551622B1 (en) 2018-04-05 2019-02-04 Jig for resin molded body plating and plating method for resin molded body using the same
PCT/JP2019/004566 WO2019193835A1 (en) 2018-04-05 2019-02-08 Plating jig for resin molded body and method using same for plating resin molded body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/945,808 US20190309432A1 (en) 2018-04-05 2018-04-05 Tool for plating resin molded body and method for plating resin molded body using the same

Publications (1)

Publication Number Publication Date
US20190309432A1 true US20190309432A1 (en) 2019-10-10

Family

ID=67473350

Family Applications (1)

Application Number Title Priority Date Filing Date
US15/945,808 Abandoned US20190309432A1 (en) 2018-04-05 2018-04-05 Tool for plating resin molded body and method for plating resin molded body using the same

Country Status (3)

Country Link
US (1) US20190309432A1 (en)
JP (1) JP6551622B1 (en)
WO (1) WO2019193835A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US20140326069A1 (en) * 2011-09-07 2014-11-06 Bernd Rattay Sensor having a housing seal made of synthetic rubbers having differing elasticity
JP2017052844A (en) * 2015-09-08 2017-03-16 奥野製薬工業株式会社 Composition for film formation of plating tool, plating tool and plating treatment method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6337166A (en) * 1986-08-01 1988-02-17 Asahi Chem Ind Co Ltd Resin composition for coating metal-plating jig
JP5131683B2 (en) * 2007-07-04 2013-01-30 奥野製薬工業株式会社 Plating jig used for plating of resin moldings

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US20140326069A1 (en) * 2011-09-07 2014-11-06 Bernd Rattay Sensor having a housing seal made of synthetic rubbers having differing elasticity
JP2017052844A (en) * 2015-09-08 2017-03-16 奥野製薬工業株式会社 Composition for film formation of plating tool, plating tool and plating treatment method

Also Published As

Publication number Publication date
JP2019183260A (en) 2019-10-24
WO2019193835A1 (en) 2019-10-10
JP6551622B1 (en) 2019-07-31

Similar Documents

Publication Publication Date Title
US3654099A (en) Cathodic activation of stainless steel
US20180087171A1 (en) Electrical connector electroplating process
US3682796A (en) Method for treating chromium-containing baths
US1968483A (en) Plating aluminium and its alloys
EP3168326B1 (en) Resin plating method
TWI586772B (en) Treatment for electroplating racks to avoid rack metallization
JP6750293B2 (en) How to treat plastic surface
US3497425A (en) Electrodes and methods of making same
CN108866585B (en) Refractory metal or stainless steel with electroplated layer on surface and electroplating process for surface of refractory metal or stainless steel
US3650861A (en) Surface treatment of titanium
CA1132087A (en) Plating on aluminum alloys
US4187166A (en) Method of removing copper ions from a bath containing same
US2457059A (en) Method for bonding a nickel electrodeposit to a nickel surface
US20190309432A1 (en) Tool for plating resin molded body and method for plating resin molded body using the same
US2975073A (en) Corrosion resistance of electroless nickel plate
GB2117406A (en) Electrolytic stripping
WO2019045047A1 (en) Plating pretreatment method for abs resin surface, plating treatment method for abs resin surface, and abs resin plated product
JP5657199B2 (en) Copper-zinc alloy electroplating bath
US10287688B2 (en) Plating method
US2966448A (en) Methods of electroplating aluminum and alloys thereof
US1566984A (en) Electroplating method and electroplated articles
US2456281A (en) Removing incrustations from lead anodes used for chromium plating
JPH11302570A (en) Production of antimicrobial coating film
US2762762A (en) Method for electroforming a copper article
US3085949A (en) Surface treatment of titanium or titanium base alloy

Legal Events

Date Code Title Description
AS Assignment

Owner name: JCU INTERNATIONAL, INC., MICHIGAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KURAMOCHI, YASUYUKI;ISHIZUKA, HIROSHI;IZUMITANI, MIYOKO;SIGNING DATES FROM 20180316 TO 20180322;REEL/FRAME:045442/0921

STPP Information on status: patent application and granting procedure in general

Free format text: NON FINAL ACTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: ADVISORY ACTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION