US20190101341A1 - Liquid cooling device - Google Patents
Liquid cooling device Download PDFInfo
- Publication number
- US20190101341A1 US20190101341A1 US15/792,001 US201715792001A US2019101341A1 US 20190101341 A1 US20190101341 A1 US 20190101341A1 US 201715792001 A US201715792001 A US 201715792001A US 2019101341 A1 US2019101341 A1 US 2019101341A1
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- US
- United States
- Prior art keywords
- liquid cooling
- heat
- upper plate
- lower plate
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/16—Safety or protection arrangements; Arrangements for preventing malfunction for preventing leakage
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
Definitions
- the present invention relates to a cooling device, and more particularly to a slim-type liquid cooling device.
- a liquid cooling device is widely used.
- a liquid cooling device disclosed in U.S. Pat. No. 6,725,682 comprises a liquid cooling head, a liquid cooling radiator and a liquid pump.
- the liquid cooling head, the liquid cooling radiator and the liquid pump are separate components. After the three components are connected with each other through communication pipes, a circular loop is defined.
- the structure of the liquid cooling device inside the electronic device is not applicable. It is necessary to install the liquid cooling device in the narrow space while reducing the number of the communication pipes and avoiding liquid leakage.
- the present invention provides a liquid cooling device.
- the liquid cooling device is a small-size liquid cooling device.
- the liquid cooling device is produced and installed more simply. Moreover, the possibility of leaking the working medium is minimized.
- a liquid cooling device in accordance with an aspect of the present invention, there is provided a liquid cooling device.
- the liquid cooling device includes an upper plate and a lower plate. The upper plate and the lower plate are combined together to define a chamber.
- a liquid working medium is accommodated within the chamber.
- the chamber includes a heat-absorbing section, a heat-radiating section and a driving section.
- the heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element. Consequently, the heat is transferred to the liquid working medium and a temperature of the liquid working medium is increased.
- the heat-radiating section is connected with a heat dissipation device. The heat is removed by the heat dissipation device, so that the temperature of the liquid working medium is decreased.
- the driving section is connected with a driving device. The liquid cooling medium with the decreased temperature is driven by the driving device and returned back to the heat-absorbing section.
- the heat dissipation device includes plural fins and a fan.
- the driving device includes an impeller, and the impeller is disposed within the driving section of the chamber.
- the upper plate and the lower plate are combined together by a laminating process.
- the upper plate includes a top part and a first lateral part
- the lower plate includes a bottom part and a second lateral part.
- the first lateral part and the second lateral part are attached on each other.
- the lower plate includes a bottom part and a lateral part.
- the lateral part of the lower plate and the upper plate are attached on each other.
- the upper plate includes a top part and a lateral part, wherein the lateral part of the upper plate and the lower plate are attached on each other.
- the upper plate includes a top part and a first skirt part
- the lower plate includes a bottom part and a second skirt part. The first skirt part and the second skirt part are attached on each other.
- the upper plate includes a top part and a skirt part.
- the skirt part is attached on the lower plate.
- the lower plate includes a bottom part and a skirt part.
- the skirt part is attached on the upper plate.
- a liquid cooling device in accordance with another aspect of the present invention, there is provided a liquid cooling device.
- the liquid cooling device includes an upper plate, a lower plate, a liquid cooling radiator and a driving device.
- the upper plate and the lower plate are combined together to define a chamber.
- a liquid working medium is accommodated within the chamber.
- the chamber includes a heat-absorbing section, a first extension section and a second extension section.
- the first extension section is arranged downstream of the heat-absorbing section.
- the second extension section is arranged upstream of the heat-absorbing section.
- the heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element. Consequently, the heat is transferred to the liquid working medium, and a temperature of the liquid working medium is increased.
- the liquid cooling radiator is connected with the first extension section.
- the driving device is connected with the liquid cooling radiator and the second extension section.
- the upper plate and the lower plate are combined together by a laminating process.
- the upper plate includes a top part and a first lateral part
- the lower plate includes a bottom part and a second lateral part.
- the first lateral part and the second lateral part are attached on each other.
- the lower plate includes a bottom part and a lateral part.
- the lateral part of the lower plate and the upper plate are attached on each other.
- the upper plate includes a top part and a lateral part.
- the lateral part of the upper plate and the lower plate are attached on each other.
- the upper plate includes a top part and a first skirt part
- the lower plate includes a bottom part and a second skirt part. The first skirt part and the second skirt part are attached on each other.
- the upper plate includes a top part and a skirt part.
- the skirt part is attached on the lower plate.
- the lower plate includes a bottom part and a skirt part.
- the skirt part is attached on the upper plate.
- the liquid cooling device further includes a first communication pipe, a second communication pipe and a third communication pipe.
- the liquid cooling radiator and the first extension section are connected with each other through the first communication pipe.
- the liquid cooling radiator and the driving device are connected with each other through the second communication pipe.
- the driving device and the second extension section are connected with each other through the third communication pipe.
- the present invention provides the liquid cooling device.
- the upper plate and the lower plate are combined as a combined plate structure, which is slim.
- the functions of the liquid cooling head, the liquid cooling radiator and the liquid pump are integrated into the combined plate structure of the upper plate and the lower plate. Consequently, the size of the liquid cooling device is reduced.
- the upper plate and the lower plate are easily and quickly combined together by a laminating process or a welding process. Consequently, the process of assembling the liquid cooling device is simplified, and the possibility of leaking the liquid working medium is minimized.
- FIG. 1 is a schematic perspective view illustrating a liquid cooling device according to a first embodiment of the present invention
- FIG. 2A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device of FIG. 1 and taken along the line 2 A- 2 A;
- FIG. 2B is a schematic cross-sectional view illustrating a variant example of the combination of the upper plate and the lower plate in the liquid cooling device of the first embodiment
- FIG. 2C is a schematic cross-sectional view illustrating another variant example of the combination of the upper plate and the lower plate in the liquid cooling device of the first embodiment
- FIG. 2D is a schematic cross-sectional view illustrating another variant example of the combination of the upper plate and the lower plate in the liquid cooling device of the first embodiment
- FIG. 2E is a schematic cross-sectional view illustrating a driving section and a driving device of the liquid cooling device of FIG. 1 and taken along the line 2 E- 2 E;
- FIG. 3 is a schematic perspective view illustrating a liquid cooling device according to a second embodiment of the present invention.
- FIG. 4A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device of FIG. 3 and taken along the line 4 A- 4 A;
- FIG. 4B is a schematic cross-sectional view illustrating a first extension section of the liquid cooling device of FIG. 3 and taken along the line 4 B- 4 B;
- FIG. 4C is a schematic cross-sectional view illustrating a second extension section of the liquid cooling device of FIG. 3 and taken along the line 4 C- 4 C.
- FIG. 1 is a schematic perspective view illustrating a liquid cooling device according to a first embodiment of the present invention.
- FIG. 2A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device of FIG. 1 and taken along the line 2 A- 2 A.
- the liquid cooling device 1 comprises an upper plate 11 and a lower plate 12 .
- the upper plate 11 and the lower plate 12 are combined together to define a chamber 13 .
- a liquid working medium 14 is accommodated within the chamber 13 .
- the chamber 13 comprises a heat-absorbing section 131 , a heat-radiating section 132 and a driving section 133 .
- the function of the heat-absorbing section 131 is similar to the function of a liquid cooling head.
- the heat-radiating section 132 is connected with a heat dissipation device 15 .
- the heat dissipation device 15 includes plural fins and a fan (not shown).
- the heat of the liquid working medium 14 is dissipated away through the heat dissipation device 15 , and thus the temperature of the liquid working medium 14 is decreased.
- the driving section 133 is connected with a driving device 16 (see FIG. 2E ).
- the driving device 16 is a liquid pump.
- the upper plate 11 and the lower plate 12 are combined as a combined plate structure.
- the functions of the liquid cooling head, the liquid cooling radiator and the liquid pump are integrated into the combined plate structure of the upper plate 11 and the lower plate 12 .
- the upper plate 11 and the lower plate 12 are easily and quickly combined together by a laminating process or a welding process. It is not necessary to additionally connect external pipes. Consequently, the process of assembling the liquid cooling device 1 is simplified, and the possibility of leaking the liquid working medium 14 is minimized.
- the function of the heat-radiating section 132 of the chamber 13 is similar to the function of a liquid cooling radiator.
- the heat-radiating section 132 is connected with the heat dissipation device 15 .
- the heat dissipation device 15 includes plural fins and a fan (not shown).
- the inner structure of the heat-radiating section 132 may be modified to increase the heat dissipating efficacy.
- the heat-radiating section 132 comprises a curvy channel (e.g., an S-shaped channel) and the curvy channel is equipped with fins. Under this circumstance, the heat dissipating efficacy is enhanced.
- the driving section 133 of the chamber 13 has a driving function.
- a built-in small-size driving device 16 is installed in the chamber 13 (see FIG. 2E ).
- the driving device 16 is an impeller or a rotator, which is directly installed in the chamber.
- the liquid cooling medium 14 is driven from the heat-radiating section 132 to the heat-absorbing section 131 . Consequently, the liquid cooling medium 14 can be circulated along a next loop.
- the upper plate 11 of the liquid cooling device 1 comprises a top part 111 and a lateral part 112
- the lower plate 12 of the liquid cooling device 1 comprises a bottom part 121 and a lateral part 122 .
- the lateral part 112 of the upper plate 11 and the lateral part 122 of the lower plate 12 are attached on each other. It is noted that the way of connecting the upper plate 11 and the lower plate 12 and the combined plate structure of the upper plate 11 and the lower plate 12 are not restricted. In the variant example of FIG.
- the upper plate 11 is a flat plate
- the lower plate 12 comprises a bottom part 121 and a lateral part 122 .
- the upper plate 11 and the lateral part 122 of the lower plate 12 are attached on each other.
- the upper plate 11 comprises a top part 111 and a lateral part 112
- the lower plate 12 is a flat plate.
- the variant example of FIG. 2D is also feasible.
- the upper plate 11 comprises a top part 111 and a skirt part 113 .
- the skirt part 113 is externally and downwardly extended from the periphery of the top part 111 .
- the lower plate 12 comprises a bottom part 121 and a skirt part 123 .
- the skirt part 123 is externally and upwardly extended from the periphery of the bottom part 121 .
- one of the upper plate 11 and the lower plate 12 has the skirt part 113 or 123 , and the other of the upper plate 11 and the lower plate 12 is a flat plate.
- the upper plate 11 comprises a top part 111 and a skirt part 113
- the lower plate 12 is a flat plate.
- the skirt part 113 of the upper plate 11 is directly attached on the lower plate 12
- the upper plate 11 and the lower plate 12 are combined together.
- the lower plate 12 comprises a bottom part 121 and a skirt part 123
- the upper plate 11 is a flat plate.
- the slim-type liquid cooling device is defined by the upper plate and the lower plate.
- the liquid cooling radiator or the pump is externally connected with the upper plate and the lower plate.
- a greater portion of the circular loop is defined by the combination of the upper plate and the lower plate. Consequently, the length or the number of the communication pipes is reduced.
- the liquid cooling device of the present invention still has the benefits of the plate-type liquid cooling device (e.g., slimness).
- FIG. 3 is a schematic perspective view illustrating a liquid cooling device according to a second embodiment of the present invention.
- FIG. 4A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device of FIG. 3 and taken along the line 4 A- 4 A.
- FIG. 4B is a schematic cross-sectional view illustrating a first extension section of the liquid cooling device of FIG. 3 and taken along the line 4 B- 4 B.
- FIG. 4C is a schematic cross-sectional view illustrating a second extension section of the liquid cooling device of FIG. 3 and taken along the line 4 C- 4 C.
- the liquid cooling device 3 comprises an upper plate 31 , a lower plate 32 , a liquid cooling radiator 35 and a driving device 36 .
- the upper plate 31 and the lower plate 32 are combined together to define a chamber 33 .
- a liquid working medium 34 is accommodated within the chamber 33 .
- the chamber 33 comprises a heat-absorbing section 331 , a first extension section 332 and a second extension section 333 .
- the first extension section 332 is arranged downstream of the heat-absorbing section 331 , i.e., an outlet side.
- the first extension section 332 is connected with the liquid cooling radiator 35 .
- the second extension section 333 is arranged upstream of the heat-absorbing section 331 , i.e., an inlet side.
- the second extension section 333 is connected with the driving device 36 .
- the driving device 36 is a pump.
- the function of the heat-absorbing section 331 is similar to the function of a liquid cooling head. When the heat-absorbing section 331 is in thermal contact with a heat generation element 4 , the heat from the heat generation element 4 is absorbed by the heat-absorbing section 331 and transferred to the liquid working medium 34 . Consequently, the temperature of the liquid working medium 34 is increased.
- the formation of the heat-absorbing section 331 provides the function of the liquid cooling head.
- the extension sections i.e., the first extension section 332 and the second extension section 333
- the combined plate structure of the upper plate 31 and the lower plate 32 retains and expands the benefits such as slimness. Under this circumstance, the volume of the overall liquid cooling device 3 is reduced. Moreover, since the communication pipe is not too long, the possibility of leaking the liquid working medium 34 is minimized.
- liquid cooling radiator 35 and the first extension section 332 are connected with each other through a first communication pipe 371
- liquid cooling radiator 35 and the driving device 36 are connected with each other through a second communication pipe 372
- driving device 36 and the second extension section 333 are connected with each other through a third communication pipe 373 .
- the driving device 36 is connected with the liquid cooling radiator 35 and the second extension section 333 .
- the driving device 36 the liquid cooling medium 34 is driven from the liquid cooling radiator 35 to the heat-absorbing section 331 . Consequently, the liquid cooling medium 34 can be circulated along a next loop.
- the driving device is a flat or small driving device such as a slim pump.
- the upper plate 31 and the lower plate 32 of the liquid cooling device 3 can be easily and quickly combined together by a laminating process or a welding process.
- the structures of the upper plate and the lower plate may be modified according to the practical requirements.
- at least one of the upper plate and the lower plate comprises a lateral part and a skirt part.
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A liquid cooling device includes an upper plate and a lower plate. The upper plate and the lower plate are combined together to define a chamber. A liquid working medium is accommodated within the chamber. The chamber includes a heat-absorbing section, a heat-radiating section and a driving section. The heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element. The heat is transferred to the liquid working medium, and a temperature of the liquid working medium is increased. The heat-radiating section is connected with a heat dissipation device. The heat is removed by the heat dissipation device, so that the temperature of the liquid working medium is decreased. The driving section is connected with a driving device. The liquid cooling medium with the decreased temperature is driven by the driving device and returned back to the heat-absorbing section.
Description
- The present invention relates to a cooling device, and more particularly to a slim-type liquid cooling device.
- Nowadays, a liquid cooling device is widely used. For example, a liquid cooling device disclosed in U.S. Pat. No. 6,725,682 comprises a liquid cooling head, a liquid cooling radiator and a liquid pump. The liquid cooling head, the liquid cooling radiator and the liquid pump are separate components. After the three components are connected with each other through communication pipes, a circular loop is defined. However, as the trends of designing the electronic device is toward miniaturization, the structure of the liquid cooling device inside the electronic device is not applicable. It is necessary to install the liquid cooling device in the narrow space while reducing the number of the communication pipes and avoiding liquid leakage.
- For solving the drawbacks of the conventional technologies, the present invention provides a liquid cooling device. The liquid cooling device is a small-size liquid cooling device. The liquid cooling device is produced and installed more simply. Moreover, the possibility of leaking the working medium is minimized.
- In accordance with an aspect of the present invention, there is provided a liquid cooling device. The liquid cooling device includes an upper plate and a lower plate. The upper plate and the lower plate are combined together to define a chamber. A liquid working medium is accommodated within the chamber. The chamber includes a heat-absorbing section, a heat-radiating section and a driving section. The heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element. Consequently, the heat is transferred to the liquid working medium and a temperature of the liquid working medium is increased. The heat-radiating section is connected with a heat dissipation device. The heat is removed by the heat dissipation device, so that the temperature of the liquid working medium is decreased. The driving section is connected with a driving device. The liquid cooling medium with the decreased temperature is driven by the driving device and returned back to the heat-absorbing section.
- In an embodiment, the heat dissipation device includes plural fins and a fan.
- In an embodiment, the driving device includes an impeller, and the impeller is disposed within the driving section of the chamber.
- In an embodiment, the upper plate and the lower plate are combined together by a laminating process.
- In an embodiment, the upper plate includes a top part and a first lateral part, and the lower plate includes a bottom part and a second lateral part. The first lateral part and the second lateral part are attached on each other.
- In an embodiment, the lower plate includes a bottom part and a lateral part. The lateral part of the lower plate and the upper plate are attached on each other.
- In an embodiment, the upper plate includes a top part and a lateral part, wherein the lateral part of the upper plate and the lower plate are attached on each other.
- In an embodiment, the upper plate includes a top part and a first skirt part, and the lower plate includes a bottom part and a second skirt part. The first skirt part and the second skirt part are attached on each other.
- In an embodiment, the upper plate includes a top part and a skirt part. The skirt part is attached on the lower plate.
- In an embodiment, the lower plate includes a bottom part and a skirt part. The skirt part is attached on the upper plate.
- In accordance with another aspect of the present invention, there is provided a liquid cooling device. The liquid cooling device includes an upper plate, a lower plate, a liquid cooling radiator and a driving device. The upper plate and the lower plate are combined together to define a chamber. A liquid working medium is accommodated within the chamber. The chamber includes a heat-absorbing section, a first extension section and a second extension section. The first extension section is arranged downstream of the heat-absorbing section. The second extension section is arranged upstream of the heat-absorbing section. The heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element. Consequently, the heat is transferred to the liquid working medium, and a temperature of the liquid working medium is increased. The liquid cooling radiator is connected with the first extension section. The driving device is connected with the liquid cooling radiator and the second extension section.
- In an embodiment, the upper plate and the lower plate are combined together by a laminating process.
- In an embodiment, the upper plate includes a top part and a first lateral part, and the lower plate includes a bottom part and a second lateral part. The first lateral part and the second lateral part are attached on each other.
- In an embodiment, the lower plate includes a bottom part and a lateral part. The lateral part of the lower plate and the upper plate are attached on each other.
- In an embodiment, the upper plate includes a top part and a lateral part. The lateral part of the upper plate and the lower plate are attached on each other.
- In an embodiment, the upper plate includes a top part and a first skirt part, and the lower plate includes a bottom part and a second skirt part. The first skirt part and the second skirt part are attached on each other.
- In an embodiment, the upper plate includes a top part and a skirt part. The skirt part is attached on the lower plate.
- In an embodiment, the lower plate includes a bottom part and a skirt part. The skirt part is attached on the upper plate.
- In an embodiment, the liquid cooling device further includes a first communication pipe, a second communication pipe and a third communication pipe. The liquid cooling radiator and the first extension section are connected with each other through the first communication pipe. The liquid cooling radiator and the driving device are connected with each other through the second communication pipe. The driving device and the second extension section are connected with each other through the third communication pipe.
- From the above descriptions, the present invention provides the liquid cooling device. The upper plate and the lower plate are combined as a combined plate structure, which is slim. Moreover, the functions of the liquid cooling head, the liquid cooling radiator and the liquid pump are integrated into the combined plate structure of the upper plate and the lower plate. Consequently, the size of the liquid cooling device is reduced. In an embodiment, the upper plate and the lower plate are easily and quickly combined together by a laminating process or a welding process. Consequently, the process of assembling the liquid cooling device is simplified, and the possibility of leaking the liquid working medium is minimized.
- The above objects and advantages of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
-
FIG. 1 is a schematic perspective view illustrating a liquid cooling device according to a first embodiment of the present invention; -
FIG. 2A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device ofFIG. 1 and taken along theline 2A-2A; -
FIG. 2B is a schematic cross-sectional view illustrating a variant example of the combination of the upper plate and the lower plate in the liquid cooling device of the first embodiment; -
FIG. 2C is a schematic cross-sectional view illustrating another variant example of the combination of the upper plate and the lower plate in the liquid cooling device of the first embodiment; -
FIG. 2D is a schematic cross-sectional view illustrating another variant example of the combination of the upper plate and the lower plate in the liquid cooling device of the first embodiment; -
FIG. 2E is a schematic cross-sectional view illustrating a driving section and a driving device of the liquid cooling device ofFIG. 1 and taken along theline 2E-2E; -
FIG. 3 is a schematic perspective view illustrating a liquid cooling device according to a second embodiment of the present invention; -
FIG. 4A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device ofFIG. 3 and taken along theline 4A-4A; -
FIG. 4B is a schematic cross-sectional view illustrating a first extension section of the liquid cooling device ofFIG. 3 and taken along theline 4B-4B; and -
FIG. 4C is a schematic cross-sectional view illustrating a second extension section of the liquid cooling device ofFIG. 3 and taken along theline 4C-4C. -
FIG. 1 is a schematic perspective view illustrating a liquid cooling device according to a first embodiment of the present invention.FIG. 2A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device ofFIG. 1 and taken along theline 2A-2A. As shown inFIGS. 1 and 2A , theliquid cooling device 1 comprises anupper plate 11 and alower plate 12. Theupper plate 11 and thelower plate 12 are combined together to define achamber 13. Aliquid working medium 14 is accommodated within thechamber 13. Thechamber 13 comprises a heat-absorbingsection 131, a heat-radiatingsection 132 and adriving section 133. The function of the heat-absorbingsection 131 is similar to the function of a liquid cooling head. When the heat-absorbingsection 131 is in thermal contact with aheat generation element 2, the heat from theheat generation element 2 is absorbed by the heat-absorbingsection 131 and transferred to theliquid working medium 14. Consequently, the temperature of theliquid working medium 14 is increased. The heat-radiatingsection 132 is connected with aheat dissipation device 15. For example, theheat dissipation device 15 includes plural fins and a fan (not shown). The heat of theliquid working medium 14 is dissipated away through theheat dissipation device 15, and thus the temperature of theliquid working medium 14 is decreased. Thedriving section 133 is connected with a driving device 16 (seeFIG. 2E ). For example, the drivingdevice 16 is a liquid pump. By the drivingdevice 16, theliquid cooling medium 14 with the decreased temperature is returned back to the heat-absorbingsection 131. Consequently, theliquid cooling medium 14 can be circulated along a next loop. - The
upper plate 11 and thelower plate 12 are combined as a combined plate structure. In accordance with a feature of the present invention, the functions of the liquid cooling head, the liquid cooling radiator and the liquid pump are integrated into the combined plate structure of theupper plate 11 and thelower plate 12. In an embodiment, theupper plate 11 and thelower plate 12 are easily and quickly combined together by a laminating process or a welding process. It is not necessary to additionally connect external pipes. Consequently, the process of assembling theliquid cooling device 1 is simplified, and the possibility of leaking theliquid working medium 14 is minimized. - In the
liquid cooling device 1, the function of the heat-radiatingsection 132 of thechamber 13 is similar to the function of a liquid cooling radiator. For facilitating transferring the heat to the surroundings, the heat-radiatingsection 132 is connected with theheat dissipation device 15. For example, theheat dissipation device 15 includes plural fins and a fan (not shown). Moreover, the inner structure of the heat-radiatingsection 132 may be modified to increase the heat dissipating efficacy. For example, the heat-radiatingsection 132 comprises a curvy channel (e.g., an S-shaped channel) and the curvy channel is equipped with fins. Under this circumstance, the heat dissipating efficacy is enhanced. - In the
liquid cooling device 1, thedriving section 133 of thechamber 13 has a driving function. For reducing the height of the overallliquid cooling device 1, a built-in small-size driving device 16 is installed in the chamber 13 (seeFIG. 2E ). For example, the drivingdevice 16 is an impeller or a rotator, which is directly installed in the chamber. By actuating the impeller or the rotator from the outside of thechamber 13, theliquid cooling medium 14 is driven from the heat-radiatingsection 132 to the heat-absorbingsection 131. Consequently, theliquid cooling medium 14 can be circulated along a next loop. - Please refer to the cross-sectional view of
FIG. 2A again. Theupper plate 11 of theliquid cooling device 1 comprises atop part 111 and alateral part 112, and thelower plate 12 of theliquid cooling device 1 comprises abottom part 121 and alateral part 122. When theupper plate 11 and thelower plate 12 are combined together to define thechamber 13, thelateral part 112 of theupper plate 11 and thelateral part 122 of thelower plate 12 are attached on each other. It is noted that the way of connecting theupper plate 11 and thelower plate 12 and the combined plate structure of theupper plate 11 and thelower plate 12 are not restricted. In the variant example ofFIG. 2B , theupper plate 11 is a flat plate, and thelower plate 12 comprises abottom part 121 and alateral part 122. When theupper plate 11 and thelower plate 12 are combined together to define thechamber 13, theupper plate 11 and thelateral part 122 of thelower plate 12 are attached on each other. In the variant example ofFIG. 2C , theupper plate 11 comprises atop part 111 and alateral part 112, and thelower plate 12 is a flat plate. When theupper plate 11 and thelower plate 12 are combined together to define thechamber 13, thelateral part 112 of theupper plate 11 and thelower plate 12 are attached on each other. - The variant example of
FIG. 2D is also feasible. Theupper plate 11 comprises atop part 111 and askirt part 113. Theskirt part 113 is externally and downwardly extended from the periphery of thetop part 111. Moreover, thelower plate 12 comprises abottom part 121 and askirt part 123. Theskirt part 123 is externally and upwardly extended from the periphery of thebottom part 121. When theskirt part 113 of theupper plate 11 and theskirt part 123 of thelower plate 12 are attached on each other by a laminating process, theupper plate 11 and thelower plate 12 are combined together more easily. In some other embodiments, one of theupper plate 11 and thelower plate 12 has theskirt part upper plate 11 and thelower plate 12 is a flat plate. For example, in another embodiment, theupper plate 11 comprises atop part 111 and askirt part 113, and thelower plate 12 is a flat plate. When theskirt part 113 of theupper plate 11 is directly attached on thelower plate 12, theupper plate 11 and thelower plate 12 are combined together. In another embodiment, thelower plate 12 comprises abottom part 121 and askirt part 123, and theupper plate 11 is a flat plate. When theskirt part 123 of thelower plate 12 is attached on theupper plate 11, theupper plate 11 and thelower plate 12 are combined together. - In the above embodiment, the slim-type liquid cooling device is defined by the upper plate and the lower plate. In some other embodiments, the liquid cooling radiator or the pump is externally connected with the upper plate and the lower plate. However, a greater portion of the circular loop is defined by the combination of the upper plate and the lower plate. Consequently, the length or the number of the communication pipes is reduced. In other words, the liquid cooling device of the present invention still has the benefits of the plate-type liquid cooling device (e.g., slimness).
-
FIG. 3 is a schematic perspective view illustrating a liquid cooling device according to a second embodiment of the present invention.FIG. 4A is a schematic cross-sectional view illustrating a heat-absorbing section of the liquid cooling device ofFIG. 3 and taken along theline 4A-4A.FIG. 4B is a schematic cross-sectional view illustrating a first extension section of the liquid cooling device ofFIG. 3 and taken along theline 4B-4B.FIG. 4C is a schematic cross-sectional view illustrating a second extension section of the liquid cooling device ofFIG. 3 and taken along theline 4C-4C. - Please refer to
FIGS. 3, 4A, 4B and 4C . In this embodiment, theliquid cooling device 3 comprises anupper plate 31, alower plate 32, aliquid cooling radiator 35 and adriving device 36. Theupper plate 31 and thelower plate 32 are combined together to define achamber 33. Aliquid working medium 34 is accommodated within thechamber 33. Thechamber 33 comprises a heat-absorbingsection 331, afirst extension section 332 and asecond extension section 333. Thefirst extension section 332 is arranged downstream of the heat-absorbingsection 331, i.e., an outlet side. Thefirst extension section 332 is connected with theliquid cooling radiator 35. Thesecond extension section 333 is arranged upstream of the heat-absorbingsection 331, i.e., an inlet side. Thesecond extension section 333 is connected with the drivingdevice 36. For example, the drivingdevice 36 is a pump. The function of the heat-absorbingsection 331 is similar to the function of a liquid cooling head. When the heat-absorbingsection 331 is in thermal contact with aheat generation element 4, the heat from theheat generation element 4 is absorbed by the heat-absorbingsection 331 and transferred to theliquid working medium 34. Consequently, the temperature of theliquid working medium 34 is increased. - When the
upper plate 31 and thelower plate 32 are combined together, the formation of the heat-absorbingsection 331 provides the function of the liquid cooling head. Moreover, while theupper plate 31 and thelower plate 32 are formed, the extension sections (i.e., thefirst extension section 332 and the second extension section 333) that are extended to the positions near theliquid cooling radiator 35 and the drivingdevice 36 are also produced. The combined plate structure of theupper plate 31 and thelower plate 32 retains and expands the benefits such as slimness. Under this circumstance, the volume of the overallliquid cooling device 3 is reduced. Moreover, since the communication pipe is not too long, the possibility of leaking theliquid working medium 34 is minimized. - Moreover, the
liquid cooling radiator 35 and thefirst extension section 332 are connected with each other through afirst communication pipe 371, theliquid cooling radiator 35 and the drivingdevice 36 are connected with each other through asecond communication pipe 372, and the drivingdevice 36 and thesecond extension section 333 are connected with each other through athird communication pipe 373. - In the
liquid cooling device 3, the drivingdevice 36 is connected with theliquid cooling radiator 35 and thesecond extension section 333. By the drivingdevice 36, theliquid cooling medium 34 is driven from theliquid cooling radiator 35 to the heat-absorbingsection 331. Consequently, theliquid cooling medium 34 can be circulated along a next loop. For reducing the overall height of the liquid cooling device, the driving device is a flat or small driving device such as a slim pump. - Similarly, the
upper plate 31 and thelower plate 32 of theliquid cooling device 3 can be easily and quickly combined together by a laminating process or a welding process. The structures of the upper plate and the lower plate may be modified according to the practical requirements. For example, at least one of the upper plate and the lower plate comprises a lateral part and a skirt part. - While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiments. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all modifications and similar structures.
Claims (19)
1. A liquid cooling device, comprising:
an upper plate; and
a lower plate, wherein the upper plate and the lower plate are combined together to define a chamber, a liquid working medium is accommodated within the chamber, and the chamber comprises a heat-absorbing section, a heat-radiating section and a driving section, wherein the heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element, so that the heat is transferred to the liquid working medium and a temperature of the liquid working medium is increased, wherein the heat-radiating section is connected with a heat dissipation device, and the heat is removed by the heat dissipation device, so that the temperature of the liquid working medium is decreased, wherein the driving section is connected with a driving device, and the liquid cooling medium with the decreased temperature is driven by the driving device and returned back to the heat-absorbing section.
2. The liquid cooling device according to claim 1 , wherein the heat dissipation device comprises plural fins and a fan.
3. The liquid cooling device according to claim 1 , wherein the driving device comprises an impeller, and the impeller is disposed within the driving section of the chamber.
4. The liquid cooling device according to claim 1 , wherein the upper plate and the lower plate are combined together by a laminating process.
5. The liquid cooling device according to claim 1 , wherein the upper plate comprises a top part and a first lateral part, and the lower plate comprises a bottom part and a second lateral part, wherein the first lateral part and the second lateral part are attached on each other.
6. The liquid cooling device according to claim 1 , wherein the lower plate comprises a bottom part and a lateral part, wherein the lateral part of the lower plate and the upper plate are attached on each other.
7. The liquid cooling device according to claim 1 , wherein the upper plate comprises a top part and a lateral part, wherein the lateral part of the upper plate and the lower plate are attached on each other.
8. The liquid cooling device according to claim 1 , wherein the upper plate comprises a top part and a first skirt part, and the lower plate comprises a bottom part and a second skirt part, wherein the first skirt part and the second skirt part are attached on each other.
9. The liquid cooling device according to claim 1 , wherein the upper plate comprises a top part and a skirt part, wherein the skirt part is attached on the lower plate.
10. The liquid cooling device according to claim 1 , wherein the lower plate comprises a bottom part and a skirt part, wherein the skirt part is attached on the upper plate.
11. A liquid cooling device, comprising:
an upper plate;
a lower plate, wherein the upper plate and the lower plate are combined together to define a chamber, and a liquid working medium is accommodated within the chamber, wherein the chamber comprises a heat-absorbing section, a first extension section arranged downstream of the heat-absorbing section, and a second extension section arranged upstream of the heat-absorbing section, wherein the heat-absorbing section is in thermal contact with a heat generation element to absorb heat from a heat generation element, so that the heat is transferred to the liquid working medium and a temperature of the liquid working medium is increased;
a liquid cooling radiator connected with the first extension section; and
a driving device connected with the liquid cooling radiator and the second extension section.
12. The liquid cooling device according to claim 11 , wherein the upper plate and the lower plate are combined together by a laminating process.
13. The liquid cooling device according to claim 11 , wherein the upper plate comprises a top part and a first lateral part, and the lower plate comprises a bottom part and a second lateral part, wherein the first lateral part and the second lateral part are attached on each other.
14. The liquid cooling device according to claim 11 , wherein the lower plate comprises a bottom part and a lateral part, wherein the lateral part of the lower plate and the upper plate are attached on each other.
15. The liquid cooling device according to claim 11 , wherein the upper plate comprises a top part and a lateral part, wherein the lateral part of the upper plate and the lower plate are attached on each other.
16. The liquid cooling device according to claim 11 , wherein the upper plate comprises a top part and a first skirt part, and the lower plate comprises a bottom part and a second skirt part, wherein the first skirt part and the second skirt part are attached on each other.
17. The liquid cooling device according to claim 11 , wherein the upper plate comprises a top part and a skirt part, wherein the skirt part is attached on the lower plate.
18. The liquid cooling device according to claim 11 , wherein the lower plate comprises a bottom part and a skirt part, wherein the skirt part is attached on the upper plate.
19. The liquid cooling device according to claim 11 , wherein the liquid cooling device further comprises a first communication pipe, a second communication pipe and a third communication pipe, wherein the liquid cooling radiator and the first extension section are connected with each other through the first communication pipe, the liquid cooling radiator and the driving device are connected with each other through the second communication pipe, and the driving device and the second extension section are connected with each other through the third communication pipe.
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TW106133705 | 2017-09-29 | ||
TW106133705A TWI676246B (en) | 2017-09-29 | 2017-09-29 | Liquid-cooling heat dissipation apparatus |
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US20190101341A1 true US20190101341A1 (en) | 2019-04-04 |
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US15/792,001 Abandoned US20190101341A1 (en) | 2017-09-29 | 2017-10-24 | Liquid cooling device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4390291A1 (en) * | 2022-12-23 | 2024-06-26 | TechN GmbH | Apparatus, system and method for cooling a processor |
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Also Published As
Publication number | Publication date |
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TWI676246B (en) | 2019-11-01 |
TW201916283A (en) | 2019-04-16 |
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