US20180240931A1 - Micro-device panel and manufacturing process thereof - Google Patents
Micro-device panel and manufacturing process thereof Download PDFInfo
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- US20180240931A1 US20180240931A1 US15/439,961 US201715439961A US2018240931A1 US 20180240931 A1 US20180240931 A1 US 20180240931A1 US 201715439961 A US201715439961 A US 201715439961A US 2018240931 A1 US2018240931 A1 US 2018240931A1
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000000034 method Methods 0.000 claims description 6
- 238000000206 photolithography Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
- H01L2224/75305—Shape of the pressing surface comprising protrusions
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Definitions
- the invention relates to a micro-device panel and a manufacturing process thereof, in particular, to a micro-device panel and a manufacturing process thereof which has advantages of short manufacturing time and high yield rate.
- micro light emitting diode (micro-LED) display Due to the demand of a thinner, lighter, brighter, and low power display on the market, micro light emitting diode (micro-LED) display has been considering as a potential way to replace liquid-crystal display (LCD) and organic light-emitting diode (OLED) since micro-LED can bring significant improvements in brightness, color contrast, and energy efficiency compared to LCD and even OLED.
- LCD liquid-crystal display
- OLED organic light-emitting diode
- micro-LEDs are not yet in mass production and the transfer technology is not fully matured.
- the micro-LEDs are formed on a transferring substrate and then are transferred by a transfer head onto the active area of the 5 inches Full HD panel.
- a transferring unit 10 including, for example, 100 ⁇ 100 mLEDs is transferred to the active area 20 of the 5 inches Full HD panel, and the size of the active area 20 is much greater than the size of the transferring unit 10 .
- the invention is directed to a micro-device panel and a manufacturing process thereof which has advantages of short manufacturing time and high yield rate.
- the invention provides a manufacturing process of a micro-device panel including the following steps.
- a plurality of micro-device sets are formed on a transferring substrate, and each of the plurality of micro-device sets has at least one micro-device.
- a plurality of receiving blocks are provided.
- the plurality of micro-device sets are respectively transferred from the transferring substrate onto the plurality of receiving blocks to form a plurality of building blocks by a transfer head.
- the plurality of building blocks are placed on a receiving substrate.
- the adjacent building blocks on the receiving substrate are connected by a plurality of connecting devices to form the micro-device panel.
- the plurality of micro-device sets are in one-to-one correspondence with the plurality of receiving blocks
- the step of respectively transferring the plurality of micro-device sets from the transferring substrate onto the plurality of receiving blocks to form the plurality of building blocks by the transfer head further includes the following steps.
- Each of the plurality of micro-device sets is repeatedly transferred from the transferring substrate onto a corresponding receiving block in the plurality of receiving blocks to form one of the building blocks.
- Each of the building blocks is tested, so as to determine a plurality of functional building blocks.
- the at least one micro-device of each of the plurality of micro-device sets fon is a micro-device array
- each of the receiving blocks includes an active area having at least one sub-pixel
- the step of repeatedly transferring each of the plurality of micro-device sets from the transferring substrate onto the corresponding receiving block in the plurality of receiving blocks to form one of the building blocks further includes the following steps.
- One of the plurality of micro-device sets is picked up from the transferring substrate.
- the one of the plurality of micro-device sets is moved and aligned with one of the receiving blocks corresponding to the one of the plurality of micro-device sets.
- the one of the plurality of micro-device sets is placed onto the one of the receiving blocks, so that the micro-device array is corresponding to the active area and the at least one micro-device is disposed corresponding to the at least one sub-pixel.
- the number of the at least one micro-device in the micro-device array of each of the plurality of micro-device sets is equal to the number of the at least one sub-pixel in the active area of the corresponding receiving block in the plurality of receiving blocks.
- the step of placing the plurality of building blocks on the receiving substrate further includes the following step: the plurality of functional building blocks are placed on the same plane of the receiving substrate.
- the step of placing the plurality of building blocks on the receiving substrate further includes the following step: the plurality of functional building blocks are placed on different planes on the same side of the receiving substrate, so that orthogonal projections of the adjacent building blocks onto the receiving substrate overlap with each other.
- the at least one micro-device of each of the building blocks forms a micro-device array, a number of rows of the micro-device array is M, a number of columns of the micro-device array is N, and M and N are positive integers.
- each of the connecting devices includes a plurality of first connecting lines in a first direction and a plurality of second connecting lines in a second direction, a number of the first connecting lines is X, a number of the second connecting lines is Y, and X and Y are positive integers.
- X is greater than or equal to M, and Y is greater than or equal to N.
- the first connecting lines and the second connecting lines are made by a photolithography process.
- each of the micro-device sets is repeatedly transferred from the transferring substrate onto a corresponding receiving block in the receiving blocks to form one of the building blocks, the time for alighting the micro-device set with the active area of the receiving block is greatly reduced.
- the moving distance of the micro-device set in transferring is also reduced, so as to save time and to increase accuracy in the manufacturing process.
- the equipment used in transferring the micro-device set can be smaller to reduce cost but can have better efficiency.
- the moving step of the transfer head can be much greater, for example, greater than 100 micro meters. Therefore, the time for moving the micro-device set is also greatly reduced.
- the number of the micro-devices being transferred can be appropriately selected in the invention, so as to increase the yield rate. Further, since each of the building blocks is tested individually so that only functional building blocks are placed on the receiving substrate to form the micro-device panel. Therefore, it can be guaranteed that each micro-device panel works properly. In other words, the yield rate of the manufacturing process may achieve 100 percent, or at least, the failure rate of the manufacturing process is greatly reduced.
- FIG. 1 is a schematic view illustrating a transferring unit and an active area in conventional technology.
- FIG. 2A to FIG. 2L are schematic top views illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention.
- FIG. 3A to FIG. 3L are schematic front views illustrating the manufacturing process of the micro-device panel depicted in FIG. 2A to FIG. 2L , respectively.
- FIG. 4 is a flowchart diagram illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention.
- FIG. 5A is a schematic view illustrating a micro-device panel according to an embodiment of the invention.
- FIG. 5B is a three-dimensional schematic view illustrating the micro-device panel shown in FIG. 5A .
- FIG. 6 is a three-dimensional schematic view illustrating a micro-device panel according to another embodiment of the invention.
- FIG. 7 is a schematic view illustrating a true ratio between dimensions of a micro-device and dimensions of a sub-pixel according to an embodiment of the invention.
- FIG. 8 is a schematic view illustrating one building block of a micro-device panel according to an embodiment of the invention.
- FIG. 9 is a schematic view illustrating one building block of a micro-device panel according to another embodiment of the invention.
- FIG. 2A to FIG. 2L are schematic top views illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention
- FIG. 3A to FIG. 3L are schematic front views illustrating the manufacturing process of the micro-device panel depicted in FIG. 2A to FIG. 2L
- FIG. 2A to FIG. 2L are respectively corresponding to FIG. 3A to FIG. 3L
- FIG. 2A and FIG. 3A which is corresponding to FIG. 2A , are respectively the schematic top view and the schematic front view illustrating the manufacturing process of the micro-device panel at a specific time point.
- FIG. 4 is a flowchart diagram illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention.
- a plurality of micro-device sets S 1 -S 4 are formed on a transferring substrate 100 , and each of the plurality of micro-device sets S 1 -S 4 has at least one micro-devices (Step S 101 in FIG. 4 ). Specifically, in the present embodiment, there are four micro-device sets S 1 -S 4 formed on the transferring substrate 100 .
- the micro-device set S 1 has four micro-devices M 1 -M 4
- the micro-device set S 2 has four micro-devices M 5 -M 8
- the micro-device set S 3 has four micro-devices M 9 -M 12
- the micro-device set S 4 has four micro-devices M 13 -M 16 .
- there are four micro-device sets S 1 -S 4 and each of the four micro-device sets S 1 -S 4 has four micro-devices in the present embodiment, but the number of the micro-device sets and the number of the micro-devices of each micro-device set are not limited thereto. In other embodiments of the invention, the number of the micro-device sets may be greater than or equal to 2, and each micro-device set has one or more micro-devices.
- the four micro-devices of each of the micro-device sets S 1 -S 4 forms a micro-device array.
- the micro-devices of the micro-device set may form a circular shape, a triangle shape, etc.
- each of the receiving blocks RB 1 -RB 4 includes an active area having at least one sub-pixels.
- four receiving blocks RB 1 -RB 4 are provided.
- the receiving block RB 1 has four sub-pixels SP 1 -SP 4
- the receiving block RB 2 has four sub-pixels SP 5 -SP 8
- the receiving block RB 3 has four sub-pixels SP 9 -SP 12
- the receiving block RB 4 has four sub-pixels SP 13 -SP 16 .
- the plurality of micro-device sets S 1 -S 4 are in one-to-one correspondence with the plurality of receiving blocks RB 1 -RB 4 . That is, the micro-device set S 1 is corresponding to the receiving block RB 1 , the micro-device set S 2 is corresponding to the receiving block RB 2 , the micro-device set S 3 is corresponding to the receiving block RB 3 , and the micro-device set S 4 is corresponding to the receiving block RB 4 .
- there are four receiving blocks depicted in FIGS. 2B and 3B but the number of the receiving blocks in the invention is not limited thereto.
- the number of the receiving blocks may be greater than or equal to 2 as long as the number of the receiving blocks is equal to the number of the micro-device sets. Further, the number of the micro-devices in one micro-device set is equal to the number of the sub-pixels in the corresponding receiving block.
- the plurality of micro-device sets S 1 -S 4 are respectively transferred from the transferring substrate 100 onto the plurality of receiving blocks RB 1 -RB 4 to form a plurality of building blocks BB 1 -BB 4 by a transfer head 200 (Step S 103 in FIG. 4 ).
- a transfer head 200 Step S 103 in FIG. 4 .
- the transfer head 200 is controlled to be in contact with four micro-devices M 1 -M 4 of the micro-device set S 1 .
- the method of controlling the transfer head 200 is not limited in the invention.
- the transfer head 200 picks up the four micro-devices M 1 -M 4 of the micro-device set S 1 from the transferring substrate 100 as shown in FIGS. 2D and 3D , and the transfer head 200 moves the four micro-devices M 1 -M 4 of the micro-device set S 1 along a direction (shown by an arrow in FIG.
- the transfer head 200 places the four micro-devices M 1 -M 4 of the micro-device set S 1 onto the receiving block RB 1 to form the building block BB 1 .
- the micro-device array of the micro-device set S 1 is corresponding to the active area of the receiving block RB 1 and the four micro-devices M 1 -M 4 are disposed corresponding to the four sub-pixels SP 1 -SP 4 .
- the building block BB 1 includes the receiving block RB 1 and the four micro-devices M 1 -M 4 that are respectively disposed in the four sub-pixels SP 1 -SP 4 of the receiving block RB 1 .
- the size of the active area of the receiving block RB 1 is substantially equal to the size of the micro-device array of the micro-device set S 1 . Therefore, the four micro-devices M 1 -M 4 of the micro-device set S 1 are transferred from the transferring substrate 100 onto the receiving block RB 1 , which is corresponding to the micro-device set S 1 , to form the building block BB 1 .
- the building block BB 1 is replaced by the receiving block RB 2 so the receiving block RB 2 is fixed to the position P, and the building block BB 1 is tested to determine whether it properly function.
- the four micro-devices M 5 -M 8 of the micro-device set S 2 are transferred from the transferring substrate 100 onto the receiving block RB 2 so the four micro-devices M 5 -M 8 are respectively disposed in the four sub-pixels SP 5 -SP 8
- the four micro-devices M 9 -M 12 of the micro-device set S 3 are transferred from the transferring substrate 100 onto the receiving block RB 3 so the four micro-devices M 9 -M 12 are respectively disposed in the four sub-pixels SP 9 -SP 12
- the four micro-devices M 13 -M 16 of the micro-device set S 4 are transferred from the transferring substrate 100 onto the receiving block RB 4 so the four micro-devices M 13 -M 16 are respectively disposed in the four sub-pixels SP 13 -SP 16 , as shown in FIGS.
- the micro-device sets S 1 -S 4 are respectively, one by one, transferred onto the receiving blocks RB 1 -RB 4 in order to form the building blocks BB 1 -BB 4 .
- each of the micro-device sets S 1 -S 4 is repeatedly transferred from the transferring substrate 100 onto a corresponding receiving block in the receiving blocks RB 1 -RB 4 to form one of the building blocks BB 1 -BB 4 .
- each of the receiving blocks RB 1 -RB 4 is fixed to one specific position P in order to receive a corresponding micro-device set in the micro-device sets S 1 -S 4 , but the invention is not limited thereto. In other embodiments of the invention, there may have more than two positions that the receiving blocks can be fixed to.
- each of the receiving blocks RB 1 -RB 4 sequentially is fixed to one specific position P in order to receive a corresponding micro-device set in the micro-device sets S 1 -S 4 , the time for aligning the micro-device set with the active area of the receiving block is greatly reduced.
- the size of the active area is much larger than the size of the micro-device array including, for example, 100 ⁇ 100 micro-devices. Therefore, when the micro-device array is moved by the transfer head above the active area, the moving step of the transfer head must be very small, for example, must be smaller than 100 micro meters in order to position the micro-device array.
- the moving step of the transfer head since the size of the active area of each of the receiving blocks RB 1 -RB 4 is substantially equal to the size of the micro-device array of the corresponding one in the micro-device sets S 1 -S 4 , the moving step of the transfer head can be much greater, for example, greater than 100 micro meters. Therefore, the time for moving the micro-device set is also greatly reduced.
- each of the building blocks BB 1 -BB 4 is tested individually so that each of the building blocks BB 1 -BB 4 is determined whether to be functional. If one of the building blocks BB 1 -BB 4 is dysfunctional, it will be replaced by another functional building block formed by the same manufacturing process described above. As a result, four functional building blocks are formed in the present embodiment. For ease of description, it is assumed that the four building blocks BB 1 -BB 4 are all functional in the present embodiment. However, the number of functional building blocks in the invention is not limited thereto, and the number of functional building blocks being formed is based on requirements.
- FIG. 5A is a schematic view illustrating a micro-device panel according to an embodiment of the invention
- FIG. 5B is a three-dimensional schematic view illustrating the micro-device panel shown in FIG. 5A .
- the functional four building blocks BB 1 -BB 4 after being formed are placed on a receiving substrate 300 (Step S 104 in FIG. 4 ).
- the method of placing the building blocks on the receiving substrate is not limited in the present application.
- the four functional building blocks BB 1 -BB 4 are placed on a plane 301 of the receiving substrate 300 .
- the adjacent building blocks (such as the adjacent building blocks BB 1 , BB 2 , and BB 4 , and the adjacent building blocks BB 2 , BB 3 , and BB 4 ) on the receiving substrate 300 are connected by a plurality of connecting devices 401 and 402 to form a micro-device panel 1000 (Step S 105 in FIG. 4 ).
- each of the connecting devices 401 and 402 includes a plurality of first connecting lines in a first direction D 1 and a plurality of second connecting lines in a second direction D 2 , as shown in FIG. 5A and FIG. 5B .
- the first connecting lines in the first direction D 1 of the connecting device 401 are used to connect between the two adjacent building blocks BB 1 and BB 4
- the second connecting lines in the second direction D 2 of the connecting device 401 are used to connect between the two adjacent building blocks BB 1 and BB 2 .
- first connecting lines in the first direction D 1 of the connecting device 402 are used to connect between the two adjacent building blocks BB 2 and BB 3
- second connecting lines in the second direction D 2 of the connecting device 402 are used to connect between the two adjacent building blocks BB 3 and BB 4 .
- the number of the first connecting lines in each of the connecting devices 401 and 402 is five and the number of the second connecting lines in each of the connecting devices 401 and 402 is also five.
- the number of rows of the micro-device array in each of the building blocks BB 1 -BB 4 is two
- the number of columns of the micro-device array in each of the building blocks BB 1 -BB 4 is two.
- the number of the first connecting lines in the first direction D 1 of the connecting device 401 is greater than the number of rows of the micro-device array in each of the two adjacent building blocks BB 1 and BB 4
- the number of the second connecting lines in the second direction D 2 of the connecting device 401 is greater than the number of columns of the micro-device array in each of the two adjacent building blocks BB 1 and BB 2 .
- the number of the first connecting lines in the first direction D 1 of the connecting device 402 is greater than the number of rows of the micro-device array in each of the two adjacent building blocks BB 2 and BB 3
- the number of the second connecting lines in the second direction D 2 of the connecting device 402 is greater than the number of columns of the micro-device array in each of the two adjacent building blocks BB 3 and BB 4 .
- one connecting device connects three adjacent building blocks in the first and second directions by the first connecting lines and the second connecting lines, respectively.
- the number of the first connecting lines is X
- the number of the second connecting lines is Y
- X and Y are positive integers.
- the number of rows of the micro-device array in each of the two adjacent building blocks in the first direction is M
- the number of columns of the micro-device array in each of the two adjacent building blocks in the second direction is N
- M and N are positive integers.
- the conditions X, Y, M, and N must be satisfied are that X is greater than or equal to M, and Y is greater than or equal to N.
- first connecting lines and the second connecting lines are made by the photolithography process in the invention.
- each of the building blocks BB 1 -BB 4 is tested individually so that only functional building blocks are placed on the receiving substrate 300 to form the micro-device panel 1000 . Therefore, it can be guaranteed that each micro-device panel 1000 works properly after being manufactured. In other words, the yield rate of the manufacturing process may achieve 100 percent, or at least the failure rate of the manufacturing process is greatly reduced.
- FIG. 7 is a schematic view illustrating a true ratio between dimensions of a micro-device and dimensions of each sub-pixel according to the present embodiment of the invention.
- FIG. 7 shows one red sub-pixel RSP, one blue sub-pixel BSP, and one green sub-pixel GSP for 5 inches full HD screen (1920 ⁇ 1080), and one micro-device.
- Dimensions of the red sub-pixel RSP, the blue sub-pixel BSP, and the green sub-pixel GSP are substantially equal to each other.
- the width and the length of each of the red sub-pixel RSP, the blue sub-pixel BSP, and the green sub-pixel GSP are 20 micrometres and 60 micrometres, respectively. Additionally, the width and the length of the micro-device are both equal to 10 micrometres.
- FIG. 8 is a schematic view illustrating one building block of the micro-device panel according to an embodiment of the invention.
- the building block BB 1 of the present application has four sub-pixels SP 1 -SP 4 and four micro-devices M 1 -M 4 that are respectively disposed in the four sub-pixels SP 1 -SP 4 .
- one building block may have more than four sub-pixels and more than four micro-devices.
- FIG. 9 is a schematic view illustrating one building block according to another embodiment of the invention.
- a building block BB 11 may have twelve sub-pixels SP 11 -SP 22 , and each of the twelve sub-pixels is categorized as red sub-pixel, blue sub-pixel, or green sub-pixel.
- the combination of one red sub-pixel, one blue sub-pixel, and one green sub-pixel adjacent to each other form one pixel.
- the building block BB 11 may have 4 pixels P 11 -P 14 formed by twelve sub-pixels SP 11 -SP 22 .
- the building block BB 11 may have twelve micro-devices M 11 -M 22 , and the twelve micro-devices M 11 -M 22 are respectively disposed in the 12 sub-pixels SP 11 -SP 22 .
- the micro-devices M 11 -M 22 serve as light sources, for example.
- the invention is not limited there to, the number of micro-devices and the number of sub-pixels in one building block may be greater than or equal one in other embodiments.
- each of the receiving blocks is fixed to one specific position in order to receive a corresponding micro-device set, the time for alighting the micro-device set with the active area of the receiving block is greatly reduced.
- the moving distance of the micro-device set in transferring is also reduced, so as to save time and to increase accuracy in the manufacturing process.
- the equipment used in transferring the micro-device set can be smaller to reduce cost but can have better efficiency.
- the moving step of the transfer head can be much greater, for example, greater than 100 micro meters. Therefore, the time for moving the micro-device set is also greatly reduced.
- the number of the micro-devices being transferred can be appropriately selected in the invention, so as to increase the yield rate. Further, since each of the building blocks is tested individually so that only functional building blocks are placed on the receiving substrate to form the micro-device panel. Therefore, it can be guaranteed that each micro-device panel works properly. In other words, the yield rate of the manufacturing process may achieve 100 percent, or at least, the failure rate of the manufacturing process is greatly reduced.
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Abstract
A manufacturing process for a micro-device panel including the following steps is provided. A plurality of micro-device sets are formed on a transferring substrate, and each of the plurality of micro-device sets has at least one micro-device. A plurality of receiving blocks are provided. The plurality of micro-device sets are respectively transferred from the transferring substrate onto the plurality of receiving blocks to form a plurality of building blocks by a transfer head. The plurality of building blocks are placed on a receiving substrate. Finally, the adjacent building blocks on the receiving substrate are connected by a plurality of connecting devices to form the micro-device panel.
Description
- The invention relates to a micro-device panel and a manufacturing process thereof, in particular, to a micro-device panel and a manufacturing process thereof which has advantages of short manufacturing time and high yield rate.
- Due to the demand of a thinner, lighter, brighter, and low power display on the market, micro light emitting diode (micro-LED) display has been considering as a potential way to replace liquid-crystal display (LCD) and organic light-emitting diode (OLED) since micro-LED can bring significant improvements in brightness, color contrast, and energy efficiency compared to LCD and even OLED.
- However, micro-LEDs are not yet in mass production and the transfer technology is not fully matured. Particularly, in manufacturing a 5 inches Full HD panel including 1080×1920 pixels or 1080×1920×3 subpixels, the micro-LEDs are formed on a transferring substrate and then are transferred by a transfer head onto the active area of the 5 inches Full HD panel. As shown in
FIG. 1 , a transferringunit 10 including, for example, 100×100 mLEDs is transferred to theactive area 20 of the 5 inches Full HD panel, and the size of theactive area 20 is much greater than the size of the transferringunit 10. Hence, when transferring one transferringunit 10, most of the time is wasted on moving and aligning the transferringunit 10, and time for placing the transferringunit 10 onto theactive area 20 is only about 3-4 seconds. In order to manufacturing the 5 inches Full HD panel, around 660 transferring units need transferring. As a result, the manufacturing process takes a long period. - Otherwise, since 100×100 mLEDs of the transferring
unit 10 are placed onto theactive area 20 at once, there are high probability of failure. Therefore, the yield rate cannot achieve 100 percent. If the entire 5 inches Full HD panel is detected to have defect which cannot be repaired, that entire 5 inches Full HD panel must be discarded. - Accordingly, the invention is directed to a micro-device panel and a manufacturing process thereof which has advantages of short manufacturing time and high yield rate.
- The invention provides a manufacturing process of a micro-device panel including the following steps. A plurality of micro-device sets are formed on a transferring substrate, and each of the plurality of micro-device sets has at least one micro-device. A plurality of receiving blocks are provided. The plurality of micro-device sets are respectively transferred from the transferring substrate onto the plurality of receiving blocks to form a plurality of building blocks by a transfer head. The plurality of building blocks are placed on a receiving substrate. Finally, the adjacent building blocks on the receiving substrate are connected by a plurality of connecting devices to form the micro-device panel.
- In one embodiment of the invention, the plurality of micro-device sets are in one-to-one correspondence with the plurality of receiving blocks, and the step of respectively transferring the plurality of micro-device sets from the transferring substrate onto the plurality of receiving blocks to form the plurality of building blocks by the transfer head further includes the following steps. Each of the plurality of micro-device sets is repeatedly transferred from the transferring substrate onto a corresponding receiving block in the plurality of receiving blocks to form one of the building blocks. Each of the building blocks is tested, so as to determine a plurality of functional building blocks.
- In one embodiment of the invention, the at least one micro-device of each of the plurality of micro-device sets fon is a micro-device array, each of the receiving blocks includes an active area having at least one sub-pixel, and the step of repeatedly transferring each of the plurality of micro-device sets from the transferring substrate onto the corresponding receiving block in the plurality of receiving blocks to form one of the building blocks further includes the following steps. One of the plurality of micro-device sets is picked up from the transferring substrate. The one of the plurality of micro-device sets is moved and aligned with one of the receiving blocks corresponding to the one of the plurality of micro-device sets. The one of the plurality of micro-device sets is placed onto the one of the receiving blocks, so that the micro-device array is corresponding to the active area and the at least one micro-device is disposed corresponding to the at least one sub-pixel.
- In one embodiment of the invention, the number of the at least one micro-device in the micro-device array of each of the plurality of micro-device sets is equal to the number of the at least one sub-pixel in the active area of the corresponding receiving block in the plurality of receiving blocks.
- In one embodiment of the invention, the step of placing the plurality of building blocks on the receiving substrate further includes the following step: the plurality of functional building blocks are placed on the same plane of the receiving substrate.
- In one embodiment of the invention, the step of placing the plurality of building blocks on the receiving substrate further includes the following step: the plurality of functional building blocks are placed on different planes on the same side of the receiving substrate, so that orthogonal projections of the adjacent building blocks onto the receiving substrate overlap with each other.
- In one embodiment of the invention, the at least one micro-device of each of the building blocks forms a micro-device array, a number of rows of the micro-device array is M, a number of columns of the micro-device array is N, and M and N are positive integers.
- In one embodiment of the invention, each of the connecting devices includes a plurality of first connecting lines in a first direction and a plurality of second connecting lines in a second direction, a number of the first connecting lines is X, a number of the second connecting lines is Y, and X and Y are positive integers.
- In one embodiment of the invention, X is greater than or equal to M, and Y is greater than or equal to N.
- In one embodiment of the invention, the first connecting lines and the second connecting lines are made by a photolithography process.
- Based on the above, as described in the embodiments of the invention, since each of the micro-device sets is repeatedly transferred from the transferring substrate onto a corresponding receiving block in the receiving blocks to form one of the building blocks, the time for alighting the micro-device set with the active area of the receiving block is greatly reduced. In addition, the moving distance of the micro-device set in transferring is also reduced, so as to save time and to increase accuracy in the manufacturing process. Further, the equipment used in transferring the micro-device set can be smaller to reduce cost but can have better efficiency.
- Additionally, since the size of the active area of the receiving block is substantially equal to the size of the micro-device array of the corresponding micro-device set, the moving step of the transfer head can be much greater, for example, greater than 100 micro meters. Therefore, the time for moving the micro-device set is also greatly reduced.
- Otherwise, the number of the micro-devices being transferred can be appropriately selected in the invention, so as to increase the yield rate. Further, since each of the building blocks is tested individually so that only functional building blocks are placed on the receiving substrate to form the micro-device panel. Therefore, it can be guaranteed that each micro-device panel works properly. In other words, the yield rate of the manufacturing process may achieve 100 percent, or at least, the failure rate of the manufacturing process is greatly reduced.
- The abovementioned features and advantages of the invention will become more obvious and better understood with regard to the following description of the exemplary embodiments and accompanying drawings in the below.
- The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
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FIG. 1 is a schematic view illustrating a transferring unit and an active area in conventional technology. -
FIG. 2A toFIG. 2L are schematic top views illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention. -
FIG. 3A toFIG. 3L are schematic front views illustrating the manufacturing process of the micro-device panel depicted inFIG. 2A toFIG. 2L , respectively. -
FIG. 4 is a flowchart diagram illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention. -
FIG. 5A is a schematic view illustrating a micro-device panel according to an embodiment of the invention. -
FIG. 5B is a three-dimensional schematic view illustrating the micro-device panel shown inFIG. 5A . -
FIG. 6 is a three-dimensional schematic view illustrating a micro-device panel according to another embodiment of the invention. -
FIG. 7 is a schematic view illustrating a true ratio between dimensions of a micro-device and dimensions of a sub-pixel according to an embodiment of the invention. -
FIG. 8 is a schematic view illustrating one building block of a micro-device panel according to an embodiment of the invention. -
FIG. 9 is a schematic view illustrating one building block of a micro-device panel according to another embodiment of the invention. - Reference will now be made in detail to the present preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
-
FIG. 2A toFIG. 2L are schematic top views illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention, andFIG. 3A toFIG. 3L are schematic front views illustrating the manufacturing process of the micro-device panel depicted inFIG. 2A toFIG. 2L . To be more specific,FIG. 2A toFIG. 2L are respectively corresponding toFIG. 3A toFIG. 3L . For example,FIG. 2A andFIG. 3A , which is corresponding toFIG. 2A , are respectively the schematic top view and the schematic front view illustrating the manufacturing process of the micro-device panel at a specific time point. The corresponding figures will be described simultaneously hereinafter. In addition,FIG. 4 is a flowchart diagram illustrating a manufacturing process of a micro-device panel according to an embodiment of the invention. - Referring to
FIGS. 2A and 3A simultaneously, a plurality of micro-device sets S1-S4 are formed on a transferringsubstrate 100, and each of the plurality of micro-device sets S1-S4 has at least one micro-devices (Step S101 inFIG. 4 ). Specifically, in the present embodiment, there are four micro-device sets S1-S4 formed on the transferringsubstrate 100. Further, the micro-device set S1 has four micro-devices M1-M4, the micro-device set S2 has four micro-devices M5-M8, the micro-device set S3 has four micro-devices M9-M12, and the micro-device set S4 has four micro-devices M13-M16. It should be noted here, there are four micro-device sets S1-S4 and each of the four micro-device sets S1-S4 has four micro-devices in the present embodiment, but the number of the micro-device sets and the number of the micro-devices of each micro-device set are not limited thereto. In other embodiments of the invention, the number of the micro-device sets may be greater than or equal to 2, and each micro-device set has one or more micro-devices. - In the present embodiment, the four micro-devices of each of the micro-device sets S1-S4 forms a micro-device array. However, the invention is not limited thereto, the micro-devices of the micro-device set may form a circular shape, a triangle shape, etc.
- Next, referring to
FIGS. 2B and 3B simultaneously, a plurality of receiving blocks RB1-RB4 are provided (Step 102 inFIG. 4 ), and each of the receiving blocks RB1-RB4 includes an active area having at least one sub-pixels. In the present embodiment, four receiving blocks RB1-RB4 are provided. Further, the receiving block RB1 has four sub-pixels SP1-SP4, the receiving block RB2 has four sub-pixels SP5-SP8, the receiving block RB3 has four sub-pixels SP9-SP12, and the receiving block RB4 has four sub-pixels SP13-SP16. - It should be noted here, the plurality of micro-device sets S1-S4 are in one-to-one correspondence with the plurality of receiving blocks RB1-RB4. That is, the micro-device set S1 is corresponding to the receiving block RB1, the micro-device set S2 is corresponding to the receiving block RB2, the micro-device set S3 is corresponding to the receiving block RB3, and the micro-device set S4 is corresponding to the receiving block RB4. Similarly, there are four receiving blocks depicted in
FIGS. 2B and 3B , but the number of the receiving blocks in the invention is not limited thereto. In other embodiments of the invention, the number of the receiving blocks may be greater than or equal to 2 as long as the number of the receiving blocks is equal to the number of the micro-device sets. Further, the number of the micro-devices in one micro-device set is equal to the number of the sub-pixels in the corresponding receiving block. - Referring to
FIG. 2C toFIG. 2L andFIG. 3C toFIG. 3L , the plurality of micro-device sets S1-S4 are respectively transferred from the transferringsubstrate 100 onto the plurality of receiving blocks RB1-RB4 to form a plurality of building blocks BB1-BB4 by a transfer head 200 (Step S103 inFIG. 4 ). The details will be described hereinafter. - Firstly, referring to
FIGS. 2C and 3C simultaneously, the receiving block RB1 is fixed to a position P, thetransfer head 200 is controlled to be in contact with four micro-devices M1-M4 of the micro-device set S1. The method of controlling thetransfer head 200 is not limited in the invention. Next, thetransfer head 200 picks up the four micro-devices M1-M4 of the micro-device set S1 from the transferringsubstrate 100 as shown inFIGS. 2D and 3D , and thetransfer head 200 moves the four micro-devices M1-M4 of the micro-device set S1 along a direction (shown by an arrow inFIG. 3E ) in order to align the micro-device set S1 with the receiving block RB1 at the position P, as shown inFIGS. 2E and 3E . After the alignment, thetransfer head 200 places the four micro-devices M1-M4 of the micro-device set S1 onto the receiving block RB1 to form the building block BB1. At this time, the micro-device array of the micro-device set S1 is corresponding to the active area of the receiving block RB1 and the four micro-devices M1-M4 are disposed corresponding to the four sub-pixels SP1-SP4. In other words, the building block BB1 includes the receiving block RB1 and the four micro-devices M1-M4 that are respectively disposed in the four sub-pixels SP1-SP4 of the receiving block RB1. It should be noted here, the size of the active area of the receiving block RB1 is substantially equal to the size of the micro-device array of the micro-device set S1. Therefore, the four micro-devices M1-M4 of the micro-device set S1 are transferred from the transferringsubstrate 100 onto the receiving block RB1, which is corresponding to the micro-device set S1, to form the building block BB1. After that, the building block BB1 is replaced by the receiving block RB2 so the receiving block RB2 is fixed to the position P, and the building block BB1 is tested to determine whether it properly function. - Sequentially with the same manner, the four micro-devices M5-M8 of the micro-device set S2 are transferred from the transferring
substrate 100 onto the receiving block RB2 so the four micro-devices M5-M8 are respectively disposed in the four sub-pixels SP5-SP8, the four micro-devices M9-M12 of the micro-device set S3 are transferred from the transferringsubstrate 100 onto the receiving block RB3 so the four micro-devices M9-M12 are respectively disposed in the four sub-pixels SP9-SP12, and the four micro-devices M13-M16 of the micro-device set S4 are transferred from the transferringsubstrate 100 onto the receiving block RB4 so the four micro-devices M13-M16 are respectively disposed in the four sub-pixels SP13-SP16, as shown inFIGS. 2G to 2L andFIGS. 3G to 3L . Therefore, the micro-device sets S1-S4 are respectively, one by one, transferred onto the receiving blocks RB1-RB4 in order to form the building blocks BB1-BB4. In other words, each of the micro-device sets S1-S4 is repeatedly transferred from the transferringsubstrate 100 onto a corresponding receiving block in the receiving blocks RB1-RB4 to form one of the building blocks BB1-BB4. - Furthermore, each of the receiving blocks RB1-RB4 is fixed to one specific position P in order to receive a corresponding micro-device set in the micro-device sets S1-S4, but the invention is not limited thereto. In other embodiments of the invention, there may have more than two positions that the receiving blocks can be fixed to.
- In the present embodiment, since each of the receiving blocks RB1-RB4 sequentially is fixed to one specific position P in order to receive a corresponding micro-device set in the micro-device sets S1-S4, the time for aligning the micro-device set with the active area of the receiving block is greatly reduced.
- Otherwise, in conventional technique, the size of the active area is much larger than the size of the micro-device array including, for example, 100×100 micro-devices. Therefore, when the micro-device array is moved by the transfer head above the active area, the moving step of the transfer head must be very small, for example, must be smaller than 100 micro meters in order to position the micro-device array. However, in the present embodiment, since the size of the active area of each of the receiving blocks RB1-RB4 is substantially equal to the size of the micro-device array of the corresponding one in the micro-device sets S1-S4, the moving step of the transfer head can be much greater, for example, greater than 100 micro meters. Therefore, the time for moving the micro-device set is also greatly reduced.
- It should be noted here, after being formed, each of the building blocks BB1-BB4 is tested individually so that each of the building blocks BB1-BB4 is determined whether to be functional. If one of the building blocks BB1-BB4 is dysfunctional, it will be replaced by another functional building block formed by the same manufacturing process described above. As a result, four functional building blocks are formed in the present embodiment. For ease of description, it is assumed that the four building blocks BB1-BB4 are all functional in the present embodiment. However, the number of functional building blocks in the invention is not limited thereto, and the number of functional building blocks being formed is based on requirements.
-
FIG. 5A is a schematic view illustrating a micro-device panel according to an embodiment of the invention, andFIG. 5B is a three-dimensional schematic view illustrating the micro-device panel shown inFIG. 5A . - Next, referring to
FIG. 5A andFIG. 5B , the functional four building blocks BB1-BB4 after being formed are placed on a receiving substrate 300 (Step S104 inFIG. 4 ). The method of placing the building blocks on the receiving substrate is not limited in the present application. - In the present embodiment, as shown in
FIG. 5A andFIG. 5B , the four functional building blocks BB1-BB4 are placed on aplane 301 of the receivingsubstrate 300. - Finally, the adjacent building blocks (such as the adjacent building blocks BB1, BB2, and BB4, and the adjacent building blocks BB2, BB3, and BB4) on the receiving
substrate 300 are connected by a plurality of connectingdevices FIG. 4 ). There are two connectingdevices - To be more specific, each of the connecting
devices FIG. 5A andFIG. 5B . The first connecting lines in the first direction D1 of the connectingdevice 401 are used to connect between the two adjacent building blocks BB1 and BB4, the second connecting lines in the second direction D2 of the connectingdevice 401 are used to connect between the two adjacent building blocks BB1 and BB2. In addition, the first connecting lines in the first direction D1 of the connectingdevice 402 are used to connect between the two adjacent building blocks BB2 and BB3, and the second connecting lines in the second direction D2 of the connectingdevice 402 are used to connect between the two adjacent building blocks BB3 and BB4. As shown inFIG. 5A , the number of the first connecting lines in each of the connectingdevices devices device 401 is greater than the number of rows of the micro-device array in each of the two adjacent building blocks BB1 and BB4, and the number of the second connecting lines in the second direction D2 of the connectingdevice 401 is greater than the number of columns of the micro-device array in each of the two adjacent building blocks BB1 and BB2. Similarly, the number of the first connecting lines in the first direction D1 of the connectingdevice 402 is greater than the number of rows of the micro-device array in each of the two adjacent building blocks BB2 and BB3, and the number of the second connecting lines in the second direction D2 of the connectingdevice 402 is greater than the number of columns of the micro-device array in each of the two adjacent building blocks BB3 and BB4. - In other embodiments of the invention, one connecting device connects three adjacent building blocks in the first and second directions by the first connecting lines and the second connecting lines, respectively. The number of the first connecting lines is X, the number of the second connecting lines is Y, and X and Y are positive integers. The number of rows of the micro-device array in each of the two adjacent building blocks in the first direction is M, the number of columns of the micro-device array in each of the two adjacent building blocks in the second direction is N, and M and N are positive integers. The conditions X, Y, M, and N must be satisfied are that X is greater than or equal to M, and Y is greater than or equal to N.
- It should be noted here, the first connecting lines and the second connecting lines are made by the photolithography process in the invention.
- Further, since each of the building blocks BB1-BB4 is tested individually so that only functional building blocks are placed on the receiving
substrate 300 to form themicro-device panel 1000. Therefore, it can be guaranteed that eachmicro-device panel 1000 works properly after being manufactured. In other words, the yield rate of the manufacturing process may achieve 100 percent, or at least the failure rate of the manufacturing process is greatly reduced. - In another embodiment of the present application, there are six building blocks BB1-BB6 and the six building blocks BB1-BB6 are placed on
different planes substrate 300, so that orthogonal projections of the adjacent building blocks, i.e., the adjacent building blocks BB1 and BB2, onto the receivingsubstrate 300 overlap with each other, as shown inFIG. 6 . -
FIG. 7 is a schematic view illustrating a true ratio between dimensions of a micro-device and dimensions of each sub-pixel according to the present embodiment of the invention.FIG. 7 shows one red sub-pixel RSP, one blue sub-pixel BSP, and one green sub-pixel GSP for 5 inches full HD screen (1920×1080), and one micro-device. Dimensions of the red sub-pixel RSP, the blue sub-pixel BSP, and the green sub-pixel GSP are substantially equal to each other. To be more specific, the width and the length of each of the red sub-pixel RSP, the blue sub-pixel BSP, and the green sub-pixel GSP are 20 micrometres and 60 micrometres, respectively. Additionally, the width and the length of the micro-device are both equal to 10 micrometres. -
FIG. 8 is a schematic view illustrating one building block of the micro-device panel according to an embodiment of the invention. As shown inFIG. 8 , the building block BB1 of the present application has four sub-pixels SP1-SP4 and four micro-devices M1-M4 that are respectively disposed in the four sub-pixels SP1-SP4. - In another embodiment of the invention, one building block may have more than four sub-pixels and more than four micro-devices. For example,
FIG. 9 is a schematic view illustrating one building block according to another embodiment of the invention. As shown inFIG. 9 , a building block BB11 may have twelve sub-pixels SP11-SP22, and each of the twelve sub-pixels is categorized as red sub-pixel, blue sub-pixel, or green sub-pixel. In addition, the combination of one red sub-pixel, one blue sub-pixel, and one green sub-pixel adjacent to each other form one pixel. For example, the building block BB11 may have 4 pixels P11-P14 formed by twelve sub-pixels SP11-SP22. Moreover, the building block BB11 may have twelve micro-devices M11-M22, and the twelve micro-devices M11-M22 are respectively disposed in the 12 sub-pixels SP11-SP22. The micro-devices M11-M22 serve as light sources, for example. However, the invention is not limited there to, the number of micro-devices and the number of sub-pixels in one building block may be greater than or equal one in other embodiments. - Summarily, in the invention, since each of the receiving blocks is fixed to one specific position in order to receive a corresponding micro-device set, the time for alighting the micro-device set with the active area of the receiving block is greatly reduced. In addition, the moving distance of the micro-device set in transferring is also reduced, so as to save time and to increase accuracy in the manufacturing process. Further, the equipment used in transferring the micro-device set can be smaller to reduce cost but can have better efficiency.
- Additionally, since the size of the active area of the receiving block is substantially equal to the size of the micro-device array of the corresponding micro-device set, the moving step of the transfer head can be much greater, for example, greater than 100 micro meters. Therefore, the time for moving the micro-device set is also greatly reduced.
- Otherwise, the number of the micro-devices being transferred can be appropriately selected in the invention, so as to increase the yield rate. Further, since each of the building blocks is tested individually so that only functional building blocks are placed on the receiving substrate to form the micro-device panel. Therefore, it can be guaranteed that each micro-device panel works properly. In other words, the yield rate of the manufacturing process may achieve 100 percent, or at least, the failure rate of the manufacturing process is greatly reduced.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (20)
1. A manufacturing process for a micro-device panel, comprising:
forming a plurality of micro-device sets on a transferring substrate, wherein each of the plurality of micro-device sets has at least one micro-device;
providing a plurality of receiving blocks;
respectively transferring the plurality of micro-device sets from the transferring substrate onto the plurality of receiving blocks to form a plurality of building blocks by a transfer head;
placing the plurality of building blocks on a receiving substrate; and
connecting the adjacent building blocks on the receiving substrate by a plurality of connecting devices to form the micro-device panel.
2. The manufacturing process for the micro-device panel as recited in claim 1 , wherein the plurality of micro-device sets are in one-to-one correspondence with the plurality of receiving blocks, and the step of respectively transferring the plurality of micro-device sets from the transferring substrate onto the plurality of receiving blocks to form the plurality of building blocks by the transfer head further comprises:
repeatedly transferring each of the plurality of micro-device sets from the transferring substrate onto a corresponding receiving block in the plurality of receiving blocks to form one of the building blocks; and
testing each of the building blocks, so as to determine a plurality of functional building blocks.
3. The manufacturing process for the micro-device panel as recited in claim 2 , wherein the at least one micro-device of each of the plurality of micro-device sets forms a micro-device array, each of the receiving blocks comprises an active area having at least one sub-pixel, and the step of repeatedly transferring each of the plurality of micro-device sets from the transferring substrate onto the corresponding receiving block in the plurality of receiving blocks to form one of the building blocks further comprises:
picking up one of the plurality of micro-device sets from the transferring substrate;
moving and aligning the one of the plurality of micro-device sets with one of the receiving blocks corresponding to the one of the plurality of micro-device sets;
placing the one of the plurality of micro-device sets onto the one of the receiving blocks, so that the micro-device array is corresponding to the active area and the at least one micro-device is disposed corresponding to the at least one sub-pixel.
4. The manufacturing process for the micro-device panel as recited in claim 3 , wherein a number of the at least one micro-device in the micro-device array of each of the plurality of micro-device sets is equal to a number of the at least one sub-pixel in the active area of the corresponding receiving block in the plurality of receiving blocks.
5. The manufacturing process for the micro-device panel as recited in claim 2 , wherein the step of placing the plurality of building blocks on the receiving substrate further comprises:
placing the plurality of functional building blocks on a same plane of the receiving substrate.
6. The manufacturing process for the micro-device panel as recited in claim 2 , wherein the step of placing the plurality of building blocks on the receiving substrate further comprises:
placing the plurality of functional building blocks on different planes on a same side of the receiving substrate, so that orthogonal projections of the adjacent building blocks onto the receiving substrate overlap with each other.
7. The manufacturing process for the micro-device panel as recited in claim 1 , wherein the at least one micro-device of each of the building blocks forms a micro-device array, a number of rows of the micro-device array is M, a number of columns of the micro-device array is N, and M and N are positive integers.
8. The manufacturing process for the micro-device panel as recited in claim 7 , wherein each of the connecting devices comprises a plurality of first connecting lines in a first direction and a plurality of second connecting lines in a second direction, a number of the first connecting lines is X, a number of the second connecting lines is Y, and X and Y are positive integers.
9. The manufacturing process for the micro-device panel as recited in claim 8 , wherein X is greater than or equal to M, and Y is greater than or equal to N.
10. The manufacturing process for the micro-device panel as recited in claim 8 , wherein the first connecting lines and the second connecting lines are made by a photolithography process.
11. A micro-device panel, comprising
a receiving substrate;
a plurality of building blocks, disposed on the receiving substrate;
a plurality of micro-device sets, wherein each of the plurality of micro-device sets has at least one micro-device, and each of the plurality of building blocks has one of the plurality of micro-device sets; and
a plurality of connecting devices, connecting the adjacent building blocks on the receiving substrate.
12. The micro-device panel as recited in claim 11 , wherein the at least one micro-device of each of the plurality of micro-device sets forms a micro-device array, a number of rows of the micro-device array is M, a number of columns of the micro-device array is N, and M and N are positive integers.
13. The micro-device panel as recited in claim 12 , wherein each of the connecting devices comprises a plurality of first connecting lines in a first direction and a plurality of second connecting lines in a second direction, a number of the first connecting lines is X, a number of the second connecting lines is Y, and X and Y are positive integers.
14. The micro-device panel as recited in claim 13 , wherein X is greater than or equal to M, and Y is greater than or equal to N.
15. The micro-device panel as recited in claim 13 , wherein the first connecting lines and the second connecting lines are made by a photolithography process.
16. The micro-device panel as recited in claim 11 , wherein the plurality of building blocks are arranged on a same plane of the receiving substrate.
17. The micro-device panel as recited in claim 11 , wherein the plurality of building blocks are arranged on different planes on a same side of the receiving substrate, and orthogonal projections of the adjacent building blocks onto the receiving substrate overlap with each other.
18. The micro-device panel as recited in claim 11 , wherein each of the building blocks further has an active area having at least one sub-pixel, and, in each of the building blocks, the active area is corresponding to the micro-device array so that the at least one micro-device is disposed corresponding to the at least one sub-pixel.
19. The micro-device panel as recited in claim 18 , wherein, in each of the building blocks, a number of the at least one micro-device is equal to a number of the at least one sub-pixel.
20. The micro-device panel as recited in claim 11 , wherein the micro-device set of each of the plurality of building blocks is individually determined to be functional by testing.
Priority Applications (3)
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US15/439,961 US20180240931A1 (en) | 2017-02-23 | 2017-02-23 | Micro-device panel and manufacturing process thereof |
CN201710251836.2A CN108510894B (en) | 2017-02-23 | 2017-04-18 | Micro device panel and method of manufacturing the same |
US16/412,430 US10615136B2 (en) | 2017-02-23 | 2019-05-15 | Micro-device panel and manufacturing process thereof |
Applications Claiming Priority (1)
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US15/439,961 US20180240931A1 (en) | 2017-02-23 | 2017-02-23 | Micro-device panel and manufacturing process thereof |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112216644A (en) * | 2019-07-10 | 2021-01-12 | 美科米尚技术有限公司 | Method for transferring microcomponents of different types |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112967644A (en) * | 2020-11-13 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Correction method and device for tiled display device, storage medium and electronic device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120175650A1 (en) * | 2009-10-09 | 2012-07-12 | Sharp Kabushiki Kaisha | Illuminating device and display device |
US20140048828A1 (en) * | 2012-08-17 | 2014-02-20 | Macroblock Inc. | Led display panel and led display apparatus |
US20160104696A1 (en) * | 2011-10-21 | 2016-04-14 | Santa Barbara Infrared, Inc. | Techniques for tiling arrays of pixel elements and fabricating hybridized tiles |
US9318530B2 (en) * | 2012-08-07 | 2016-04-19 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array and method for manufacturing same |
US9825016B1 (en) * | 2016-05-17 | 2017-11-21 | Samsung Electronics Co., Ltd. | Light emitting device package |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6177359B1 (en) * | 1999-06-07 | 2001-01-23 | Agilent Technologies, Inc. | Method for detaching an epitaxial layer from one substrate and transferring it to another substrate |
JP3906653B2 (en) * | 2000-07-18 | 2007-04-18 | ソニー株式会社 | Image display device and manufacturing method thereof |
JP4491948B2 (en) * | 2000-10-06 | 2010-06-30 | ソニー株式会社 | Device mounting method and image display device manufacturing method |
US9018655B2 (en) * | 2005-02-03 | 2015-04-28 | Epistar Corporation | Light emitting apparatus and manufacture method thereof |
US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
US9620478B2 (en) * | 2011-11-18 | 2017-04-11 | Apple Inc. | Method of fabricating a micro device transfer head |
US9956752B2 (en) * | 2012-10-04 | 2018-05-01 | Guardian Glass, LLC | Methods of making laminated LED array and/or products including the same |
US9252375B2 (en) * | 2013-03-15 | 2016-02-02 | LuxVue Technology Corporation | Method of fabricating a light emitting diode display with integrated defect detection test |
TWI715885B (en) * | 2013-11-18 | 2021-01-11 | 晶元光電股份有限公司 | Light-emitting element array |
US9318475B2 (en) * | 2014-05-15 | 2016-04-19 | LuxVue Technology Corporation | Flexible display and method of formation with sacrificial release layer |
US10804127B2 (en) * | 2015-04-01 | 2020-10-13 | Apple Inc. | Electrostatic cleaning device |
JP6375063B2 (en) * | 2015-05-21 | 2018-08-15 | ゴルテック.インク | Micro light-emitting diode transport method, manufacturing method, apparatus, and electronic apparatus |
TWI646680B (en) * | 2017-01-10 | 2019-01-01 | 英屬開曼群島商錼創科技股份有限公司 | Micro light emitting diode chip and display panel |
-
2017
- 2017-02-23 US US15/439,961 patent/US20180240931A1/en not_active Abandoned
- 2017-04-18 CN CN201710251836.2A patent/CN108510894B/en active Active
-
2019
- 2019-05-15 US US16/412,430 patent/US10615136B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120175650A1 (en) * | 2009-10-09 | 2012-07-12 | Sharp Kabushiki Kaisha | Illuminating device and display device |
US20160104696A1 (en) * | 2011-10-21 | 2016-04-14 | Santa Barbara Infrared, Inc. | Techniques for tiling arrays of pixel elements and fabricating hybridized tiles |
US9318530B2 (en) * | 2012-08-07 | 2016-04-19 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array and method for manufacturing same |
US20140048828A1 (en) * | 2012-08-17 | 2014-02-20 | Macroblock Inc. | Led display panel and led display apparatus |
US9825016B1 (en) * | 2016-05-17 | 2017-11-21 | Samsung Electronics Co., Ltd. | Light emitting device package |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112216644A (en) * | 2019-07-10 | 2021-01-12 | 美科米尚技术有限公司 | Method for transferring microcomponents of different types |
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US10615136B2 (en) | 2020-04-07 |
CN108510894A (en) | 2018-09-07 |
US20190267340A1 (en) | 2019-08-29 |
CN108510894B (en) | 2020-08-04 |
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