US20180040484A1 - Semiconductor system - Google Patents
Semiconductor system Download PDFInfo
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- US20180040484A1 US20180040484A1 US15/662,504 US201715662504A US2018040484A1 US 20180040484 A1 US20180040484 A1 US 20180040484A1 US 201715662504 A US201715662504 A US 201715662504A US 2018040484 A1 US2018040484 A1 US 2018040484A1
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- semiconductor manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the network communication
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Systems or methods specially adapted for specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Definitions
- the present disclosure relates to a semiconductor system.
- the quality of semiconductor devices may vary due to, for example, individual differences of the semiconductor manufacturing apparatuses or different installation environments of the semiconductor manufacturing apparatuses.
- a semiconductor system including a first semiconductor manufacturing apparatus and a second semiconductor manufacturing apparatus that share information on a semiconductor manufacturing apparatus by directly communicating the information therebetween.
- the first semiconductor manufacturing apparatus includes: a first acquisition unit configured to acquire first information on the first semiconductor manufacturing apparatus; a first storage unit configured to store the first information acquired by the first acquisition unit; and a first communication unit configured to send the first information stored in the first storage unit to the second semiconductor manufacturing apparatus.
- the second semiconductor manufacturing apparatus includes: a second acquisition unit configured to acquire second information on the second semiconductor manufacturing apparatus; a second storage unit configured to store the second information acquired by the second acquisition unit; a second communication unit configured to receive the first information sent from the first semiconductor manufacturing apparatus; an analysis unit configured to analyze a state of the second semiconductor manufacturing apparatus based on the first information received by the second communication unit and the second information stored in the second storage unit; an information generation unit configured to generate information that visualizes an analysis result of the analysis unit; and a display unit configured to display information generated by the information generation unit.
- FIG. 1 is an overall configuration diagram illustrating an example of a semiconductor system according to an exemplary embodiment.
- FIG. 2 is a diagram illustrating an exemplary hardware configuration of an apparatus controller.
- FIG. 3 is a block diagram illustrating an exemplary functional configuration of the apparatus controller.
- FIG. 4 is a flowchart illustrating an exemplary processing by the semiconductor system according to the exemplary embodiment.
- FIG. 5 is a diagram illustrating an exemplary exhaust profile of a semiconductor manufacturing apparatus 1 A.
- FIG. 6 is a diagram illustrating an exemplary exhaust profile of a semiconductor manufacturing apparatus 1 B.
- FIG. 7 is a diagram illustrating a relationship between the exhaust profile of the semiconductor manufacturing apparatus 1 A and the exhaust profile of the semiconductor manufacturing apparatus 1 B.
- FIG. 8 is a diagram illustrating an exemplary correction value table.
- An aspect of the present disclosure provides a semiconductor system capable of performing direct communication among a plurality of semiconductor manufacturing apparatuses.
- a semiconductor system including a first semiconductor manufacturing apparatus and a second semiconductor manufacturing apparatus that share information on a semiconductor manufacturing apparatus by directly communicating the information therebetween.
- the first semiconductor manufacturing apparatus includes: a first acquisition unit configured to acquire first information on the first semiconductor manufacturing apparatus; a first storage unit configured to store the first information acquired by the first acquisition unit; and a first communication unit configured to send the first information stored in the first storage unit to the second semiconductor manufacturing apparatus.
- the second semiconductor manufacturing apparatus includes: a second acquisition unit configured to acquire second information on the second semiconductor manufacturing apparatus; a second storage unit configured to store the second information acquired by the second acquisition unit; a second communication unit configured to receive the first information sent from the first semiconductor manufacturing apparatus; an analysis unit configured to analyze a state of the second semiconductor manufacturing apparatus based on the first information received by the second communication unit and the second information stored in the second storage unit; an information generation unit configured to generate information that visualizes an analysis result of the analysis unit; and a display unit configured to display information generated by the information generation unit.
- the analysis unit compares the second information acquired by the second acquisition unit with the first information received by the second communication unit to determine whether the state of the second semiconductor manufacturing apparatus is identical to a state of the first semiconductor manufacturing apparatus.
- the analysis unit determines that the state of the second semiconductor manufacturing apparatus is identical to the state of the first semiconductor manufacturing apparatus.
- the analysis unit determines that the state of the second semiconductor manufacturing apparatus is different from the state of the first semiconductor manufacturing apparatus.
- the information generation unit when the analysis unit determines that the state of the second semiconductor manufacturing apparatus is different from the state of the first semiconductor manufacturing apparatus, the information generation unit generates a correction value for matching a characteristic of a semiconductor device manufactured by the second semiconductor manufacturing apparatus with a characteristic of a semiconductor device manufactured by the first semiconductor manufacturing apparatus.
- the first information and the second information are set values to be used when controlling operations of respective units of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus.
- the first information and the second information are state logs of respective units of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus when a predetermined operation is executed in the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus.
- the first information and the second information are values that vary depending on an environment in which the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus are installed, respectively.
- FIG. 1 is an overall configuration diagram illustrating an example of a semiconductor system according to the exemplary embodiment.
- the semiconductor system has a plurality of (e.g., three) semiconductor manufacturing apparatuses 1 A, 1 B, and 1 C.
- the semiconductor manufacturing apparatuses 1 A, 1 B, and 1 C perform a predetermined semiconductor processing on a processing target object, and manufacture, for example, a liquid crystal panel, an organic electroluminescence display, and a plasma display panel.
- the processing target object is, for example, a semiconductor wafer or a glass substrate.
- the semiconductor processing may include at least a processing related to a semiconductor.
- As the processing related to a semiconductor for example, a film formation processing, an etching processing, or a thermal oxidation processing may be mentioned.
- the semiconductor manufacturing apparatuses 1 A, 1 B, and 1 C may be a batch type apparatus or a single sheet type apparatus.
- the semiconductor manufacturing apparatuses 1 A, 1 B, and 1 C are provided with apparatus controllers 10 A, 10 B, and 10 C that control operations of respective components of the apparatuses, respectively.
- the apparatus controllers 10 A, 10 B, and 10 C are connected to the same communication network.
- the apparatus controllers 10 A, 10 B, and 10 C are configured to share information on the semiconductor manufacturing apparatuses 1 A, 1 B, and 1 C via a communication network by directly communicating with each other.
- the apparatus controller 10 A and the apparatus controller 10 B share information on the semiconductor manufacturing apparatuses 1 A and 1 B by bidirectionally communicating the information therebetween.
- the apparatus controller 10 A and the apparatus controller 10 C shares information on the semiconductor manufacturing apparatuses 1 A and 1 C by bidirectionally communicating the information therebetween.
- the communication network may be, for example, a network of a manufacturing execution system (MES) that manages manufacturing steps of the entire factory in which the semiconductor system is installed.
- MES manufacturing execution system
- the communication network may be, for example, the Internet, an intranet, or a public telephone line network.
- the apparatus controllers 10 A, 10 B, and 10 C may have the same configuration or may have different configurations. However, a description will be made of a case where the apparatus controllers 10 A, 10 B, and 10 C have the same configuration by way of an example. Hereinafter, among the apparatus controllers 10 A, 10 B, and 10 C having the same configuration, the apparatus controller 10 A will be described, and a description of the apparatus controllers 10 B and 10 C will be omitted.
- FIG. 2 is a diagram illustrating an exemplary hardware configuration of the apparatus controller 10 A.
- the apparatus controller 10 A includes a central processing unit (CPU) 11 , a read only memory (ROM) 12 , a random access memory (RAM) 13 , a hard disk drive (HDD) 14 , a connection interface (I/F) 15 , and a communication I/F 16 which are connected with each other via a bus 17 .
- CPU central processing unit
- ROM read only memory
- RAM random access memory
- HDD hard disk drive
- I/F connection interface
- communication I/F 16 which are connected with each other via a bus 17 .
- the CPU 11 controls the overall operation of the semiconductor manufacturing apparatus 11 A by executing a program stored in, for example, the ROM 12 or the HDD 14 using the RAM 13 as a work area.
- Each component of the semiconductor manufacturing apparatus 1 A is connected to the connection I/F 15 .
- the communication I/F 16 is an interface for communicating with other apparatus controllers 10 B and 10 C by wired or wireless communication.
- a program for causing a processing target object to perform a predetermined semiconductor processing is installed in advance. Then, process managers perform an operation of causing the semiconductor manufacturing apparatus 1 A having a program installed therein to perform various substrate processings via the apparatus controller 10 A.
- FIG. 3 is a block diagram illustrating the functional configuration of the apparatus controller 10 A.
- the function of the apparatus controller 10 A to be described below is implemented by executing a predetermined program in the above-described CPU 11 .
- the program may be acquired via a recording medium, may be acquired via a communication network, or may be incorporated into the ROM 12 .
- the apparatus controller 10 A includes an acquisition unit 101 , a storage unit 102 , a communication unit 103 , an analysis unit 104 , an information generation unit 105 , a display unit 106 , an input reception unit 107 , and a cluster management unit 108 .
- the acquisition unit 101 has a function of acquiring information on the semiconductor manufacturing apparatus 1 A.
- Information on the semiconductor manufacturing apparatus 1 A includes, for example, parameters, history data, and installation environment data.
- the parameters are set values or adjustment values that are used when controlling the operations of respective components of the semiconductor manufacturing apparatus, and may include, for example, the zero points of a heater, a vacuum gauge, and a flow rate controller. By comparing the parameters in a plurality of semiconductor manufacturing apparatuses, the differences between, for example, the apparatus configurations may be grasped.
- the history data is a state log of each component of the semiconductor manufacturing apparatus when the semiconductor manufacturing apparatus is caused to execute a predetermined operation, and may include, for example, the opening degree of an automatic pressure control (APC) valve and the value measured by, for example, a temperature sensor, a pressure sensor, or a flow rate sensor. Further, the history data may be a representative value obtained by performing a predetermined calculation on the opening degree of the APC valve or the value measured by a sensor, for example, an average value or a standard deviation.
- the predetermined operation is determined in advance in accordance with, for example, the type of the history data. By comparing the history data in a plurality of semiconductor manufacturing apparatuses, the differences, for example, in the condition of or in the accumulated substrate processing situation of the respective semiconductor manufacturing apparatuses may be determined.
- the installation environment data is a value that varies depending on the environment in which the semiconductor manufacturing apparatus is installed, and may include, for example, values of exhaust conductance, cooling water supply flow rate, and gas supply pressure.
- the storage unit 102 has a function of storing information on the semiconductor manufacturing apparatus 1 A acquired by the acquisition unit 101 . Further, the storage unit 102 has a function of storing a cluster ID that specifies the cluster to which the semiconductor manufacturing apparatus 1 A belongs.
- the cluster ID may be, for example, an IP address or a communication port.
- the term “cluster” means a system in which a plurality of semiconductor manufacturing apparatuses are grouped.
- the communication unit 103 has a function of sending the information on the semiconductor manufacturing apparatus 1 A and the cluster ID stored in the storage unit 102 to other apparatus controllers, for example, the apparatus controllers 10 B and 10 C. Further, the communication unit 103 has a function of receiving the information on the semiconductor manufacturing apparatuses 1 B and 1 C and the cluster ID received from other apparatus controllers, for example, the apparatus controllers 10 B and 10 C. Meanwhile, the information on the semiconductor manufacturing apparatuses 1 B and 1 C and the cluster ID received by the communication unit 103 may be stored in the storage unit 102 .
- the analysis unit 104 has a function of analyzing the state of the semiconductor manufacturing apparatus 1 A based on the information on the other semiconductor manufacturing apparatuses 1 B and 1 C received by the communication unit 103 and the information on the semiconductor manufacturing apparatus 1 A stored in the storage unit 102 . For example, the analysis unit 104 compares the information on the semiconductor manufacturing apparatus 1 A with the information on the other semiconductor manufacturing apparatus 1 B received by the communication unit 103 to determine whether the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B.
- the difference between the history data of the semiconductor manufacturing apparatus 1 A and the history data of the semiconductor manufacturing apparatus 1 B when the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B are caused to execute the same operation is included in a predetermined range, it is determined that the states of both are the same.
- the difference between the history data of the semiconductor manufacturing apparatus 1 A and the history data of the semiconductor manufacturing apparatus 1 B when the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B are caused to execute the same operation is not included in the predetermined range, it is determined that the states of the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B are different from each other.
- the information generation unit 105 has a function of generating information that visualizes the state of the semiconductor manufacturing apparatus 1 A based on the analysis results of the analysis unit 104 . For example, when it is determined by the analysis unit 104 that the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B, the information generation unit 105 generates information representing that the states of the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B are identical to each other. Further, for example, when it is determined by the analysis unit 104 that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B, the information generation unit 105 generates information representing that the state of the semiconductor manufacturing apparatus 1 A and the state of the semiconductor manufacturing apparatus 1 B are different from each other.
- the information generation unit 105 when it is determined by the analysis unit 104 that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B, the information generation unit 105 generates a correction value to match the characteristic of the semiconductor device manufactured by the semiconductor manufacturing apparatus 1 A with the characteristic of the semiconductor device manufactured by the semiconductor manufacturing apparatus 1 B.
- the display unit 106 has a function of displaying the information generated by the information generation unit 105 .
- the input reception unit 107 has a function of receiving an operation input of process managers.
- the cluster management unit 108 has a function of determining whether one semiconductor manufacturing apparatus belongs to the same cluster as other semiconductor manufacturing apparatuses. For example, when it is determined whether the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B belong to the same cluster, the cluster ID stored in the storage unit 102 of the semiconductor manufacturing apparatus 1 A is compared with the cluster ID stored in the storage unit of the semiconductor manufacturing apparatus 1 B. When the cluster ID of the semiconductor manufacturing apparatus 1 A matches the cluster ID of the semiconductor manufacturing apparatus 1 B, it is determined that the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B belong to the same cluster. Meanwhile, for example, when the semiconductor manufacturing apparatus 1 A is newly added to a specific cluster, the process managers input the network ID of the device which already belongs to the cluster to be joined so that the semiconductor manufacturing apparatus 1 A may join a new cluster.
- the processing by the semiconductor system may be performed as long as information on the semiconductor manufacturing apparatus is directly communicated and shared among a plurality of semiconductor manufacturing apparatuses, but the processing is not limited to matching the state of one semiconductor manufacturing apparatus with the states of the other semiconductor manufacturing apparatuses.
- one semiconductor manufacturing apparatus may refer to another semiconductor manufacturing apparatus, or information on one semiconductor manufacturing apparatus may be copied to another semiconductor manufacturing apparatus.
- FIG. 4 is a flowchart illustrating an exemplary processing by the semiconductor system according to the exemplary embodiment.
- the acquisition unit 101 acquires information on the semiconductor manufacturing apparatus 1 A (step S 1 ).
- the acquisition unit 101 stores the acquired information on the semiconductor manufacturing apparatus 1 A in the storage unit 102 (step S 2 ).
- the communication unit 103 receives information on the semiconductor manufacturing apparatus 1 B (step S 3 ).
- the analysis unit 104 determines whether the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B (step S 4 ).
- step S 4 when the analysis unit 104 determines that the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B, the information generation unit 105 generates information representing that the states of the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B are identical to each other (step S 5 ).
- step S 4 when the analysis unit 104 determines that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B, the information generation unit 105 generates information representing that the states of the semiconductor manufacturing apparatus 1 A and the semiconductor manufacturing apparatus 1 B are different from each other (step S 6 ). Further, the information generation unit 105 generates a correction value to match the characteristic of a semiconductor device manufactured by the semiconductor manufacturing apparatus 1 A with the characteristic of a semiconductor device manufactured by the semiconductor manufacturing apparatus 1 B.
- step S 8 the display unit 106 displays the information generated by the information generation unit 105 (step S 8 ) and ends the processing. That is, in step S 4 , when the analysis unit 104 determines that the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B, the display unit 106 displays first information generated by the information generation unit 105 . In step S 4 , when the analysis unit 104 determines that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B, the display unit 106 displays second information and the correction value generated by the information generation unit 105 .
- step S 7 when the analysis unit 104 determines that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B, the step of generating the correction value by the information generation unit 105 (step S 7 ) may be omitted. In this case, in step S 8 , the display unit 106 displays only the second information generated by the information generation unit 105 .
- a step of storing the first information, the second information, and the correction value generated by the information generation unit 105 in the storage unit 102 may be included.
- step S 1 a step of determining by the cluster management unit 108 whether the semiconductor manufacturing apparatus 1 B belongs to the same cluster as the semiconductor manufacturing apparatus 1 A may be included prior to step S 1 .
- step S 1 is performed.
- the acquisition unit 101 acquires the exhaust profile of the semiconductor manufacturing apparatus 1 A (step S 1 ).
- the exhaust profile of the semiconductor manufacturing apparatus 1 A is a pressure change when the semiconductor manufacturing apparatus 1 A is operated under a plurality of previously prepared conditions.
- FIG. 5 is a diagram illustrating an exemplary exhaust profile of the semiconductor manufacturing apparatus 1 A.
- the exhaust profile of the semiconductor manufacturing apparatus 1 A may be a pressure change in a processing vessel when changing the opening degree of the APC valve and the supply flow rate of an N 2 gas, respectively.
- the unit for the opening degree of the APC valve is a percentage (%)
- the unit for the supply flow rate of the N 2 gas is liter (L)
- the unit for the pressure is pascal (Pa).
- the pressure in the processing vessel is 3.8 Pa. Further, when the opening degree of the APC valve is 4.0% and the supply flow rate of the N 2 gas is y (L), the pressure in the processing vessel is 3.5 Pa.
- the acquisition unit 101 stores the acquired information in the storage unit 102 (step S 2 ).
- the communication unit 103 acquires the exhaust profile of the semiconductor manufacturing apparatus 1 B stored in the storage unit of the apparatus controller 10 B of the semiconductor manufacturing apparatus 1 B (step S 3 ).
- the exhaust profile of the semiconductor manufacturing apparatus 1 B is a pressure change when the semiconductor manufacturing apparatus 1 B is operated under a plurality of previously prepared conditions in the same manner as in the semiconductor manufacturing apparatus 1 A.
- FIG. 6 is a diagram illustrating an exemplary exhaust profile of the semiconductor manufacturing apparatus 1 B. As illustrated in FIG. 6 , the exhaust profile of the semiconductor manufacturing apparatus 1 B may be a pressure change in a processing vessel when changing the opening degree of the APC valve and the supply flow rate of an N 2 gas, respectively. Meanwhile, in FIG.
- the unit for the opening degree of the APC valve is a percentage (%), the unit for the supply flow rate of the N 2 gas is liter (L), and the unit for the pressure is pascal (Pa).
- the pressure in the processing vessel is 4.1 Pa.
- the opening degree of the APC valve is 4.0% and the supply flow rate of the N 2 gas is y (L)
- the pressure in the processing vessel is 3.7 Pa.
- the analysis unit 104 determines whether the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B (step S 4 ).
- a determination on whether the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B may be made, for example, based on whether the difference between the exhaust profile of the semiconductor manufacturing apparatus 1 A and the exhaust profile of the semiconductor manufacturing apparatus 1 B is included in a predetermined range.
- the difference between the exhaust profile of the semiconductor manufacturing apparatus 1 A and the exhaust profile of the semiconductor manufacturing apparatus 1 B is equal to or smaller than 0.1 Pa, it is determined that the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B.
- the difference between the exhaust profile of the semiconductor manufacturing apparatus 1 A and the exhaust profile of the semiconductor manufacturing apparatus 1 B is larger than 0.1 Pa, it may be determined that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B.
- the information generation unit 105 generates information (second information) representing that the state of the semiconductor manufacturing apparatus 1 A is different from the state of the semiconductor manufacturing apparatus 1 B (step S 6 ). Further, the information generation unit 105 generates a correction value to match the characteristic of a semiconductor device manufactured by the semiconductor manufacturing apparatus 1 A with the characteristic of a semiconductor device manufactured by the semiconductor manufacturing apparatus 1 B (step S 7 ).
- FIG. 7 is a diagram illustrating a relationship between the exhaust profile of the semiconductor manufacturing apparatus 1 A and the exhaust profile of the semiconductor manufacturing apparatus 1 B.
- the horizontal axis represents the opening degree % of the APC valve and the vertical axis represents the pressure Pa in the processing vessel of the semiconductor manufacturing apparatuses 1 A and 1 B. As illustrated in FIG.
- the information generation unit 105 calculates the opening degree of the APC valve of the semiconductor manufacturing apparatus 1 B, which has the same pressure as the pressure in the processing vessel when the opening degree of the APC valve of the semiconductor manufacturing apparatus 1 A is 4.0 Pa. Further, the information generation unit 105 calculates the difference between the opening degree of the APC valve of the semiconductor manufacturing apparatus 1 A and the opening degree of the APC valve of the semiconductor manufacturing apparatus 1 B so as to generate the difference as a correction value. In FIG. 7 , the correction value is X1%.
- FIG. 8 is a diagram illustrating an exemplary correction value table. As illustrated in FIG.
- the correction value of the opening degree of the APC valve depends on a relationship among three variables, i.e., the pressure, the supply flow rate of the N 2 gas, and the opening degree of the APC valve, the correction may be made when executing the processing by calculating the correction value per supply flow rate of the N 2 gas.
- the display unit 106 displays the second information and the correction value generated by the information generation unit 105 (step S 8 ) and ends the processing.
- the semiconductor manufacturing apparatus 1 B is an example of a first semiconductor manufacturing apparatus
- the semiconductor manufacturing apparatus 1 A is an example of a second semiconductor manufacturing apparatus.
- the apparatus controller 10 A when the apparatus controller 10 A receives an operation input by the process managers, the apparatus controller 10 A compares the exhaust profile of the semiconductor manufacturing apparatus 1 A with the exhaust profile of the semiconductor manufacturing apparatus 1 B. The apparatus controller 10 A also determines whether the state of the semiconductor manufacturing apparatus 1 A is identical to the state of the semiconductor manufacturing apparatus 1 B. For this reason, engineers skilled in the semiconductor manufacturing apparatus do not need to confirm, for example, the state of each semiconductor manufacturing apparatus, and process managers may easily determine whether it is required to adjust the semiconductor manufacturing apparatus 1 A.
- the apparatus controller 10 A calculates a correction value so that the state of the semiconductor manufacturing apparatus 1 A is equal to the state of the semiconductor manufacturing apparatus 1 B. For this reason, even when the exhaust profile of the semiconductor manufacturing apparatus 1 A is different from the exhaust profile of the semiconductor manufacturing apparatus 1 B, the process managers may easily adjust the semiconductor manufacturing apparatus 1 A. As a result, the occurrence of variations in the quality of the semiconductor manufacturing apparatuses may be suppressed even when manufacturing the semiconductor device using a plurality of semiconductor manufacturing apparatuses.
- the process managers may easily determine whether it required to adjust the semiconductor manufacturing apparatuses and then easily adjust the semiconductor manufacturing apparatuses. This may shorten the time required to carry apparatuses into a semiconductor factory and operate the apparatuses, and may facilitate maintenance and management of the apparatuses.
Abstract
Description
- This application is based on and claims priority from Japanese Patent Application No. 2016-154283 filed on Aug. 5, 2016 with the Japan Patent Office, the disclosure of which is incorporated herein in its entirety by reference.
- The present disclosure relates to a semiconductor system.
- In a semiconductor system in which semiconductor devices are manufactured using a plurality of semiconductor manufacturing apparatuses, the quality of semiconductor devices may vary due to, for example, individual differences of the semiconductor manufacturing apparatuses or different installation environments of the semiconductor manufacturing apparatuses.
- Therefore, in the past, in order to reduce variation in the quality of semiconductor devices, engineers skilled in the semiconductor manufacturing apparatuses check, for example, the state of each semiconductor manufacturing apparatus, and adjust the semiconductor manufacturing apparatus. There is also known a method of connecting a dedicated system to a plurality of semiconductor manufacturing apparatuses and comparing and editing, for example, parameters of the plurality of semiconductor manufacturing apparatuses using a dedicated system (see, e.g., Japanese Patent No. 5436797 and Japanese Patent Laid-open Publication Nos. 2003-217995 and H11-340111).
- According to an aspect of the present disclosure, there is provided a semiconductor system including a first semiconductor manufacturing apparatus and a second semiconductor manufacturing apparatus that share information on a semiconductor manufacturing apparatus by directly communicating the information therebetween. The first semiconductor manufacturing apparatus includes: a first acquisition unit configured to acquire first information on the first semiconductor manufacturing apparatus; a first storage unit configured to store the first information acquired by the first acquisition unit; and a first communication unit configured to send the first information stored in the first storage unit to the second semiconductor manufacturing apparatus. The second semiconductor manufacturing apparatus includes: a second acquisition unit configured to acquire second information on the second semiconductor manufacturing apparatus; a second storage unit configured to store the second information acquired by the second acquisition unit; a second communication unit configured to receive the first information sent from the first semiconductor manufacturing apparatus; an analysis unit configured to analyze a state of the second semiconductor manufacturing apparatus based on the first information received by the second communication unit and the second information stored in the second storage unit; an information generation unit configured to generate information that visualizes an analysis result of the analysis unit; and a display unit configured to display information generated by the information generation unit.
- The foregoing summary is illustrative only and is not intended to be in any way limiting. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features will become apparent by reference to the accompanying drawings and the following detailed description.
-
FIG. 1 is an overall configuration diagram illustrating an example of a semiconductor system according to an exemplary embodiment. -
FIG. 2 is a diagram illustrating an exemplary hardware configuration of an apparatus controller. -
FIG. 3 is a block diagram illustrating an exemplary functional configuration of the apparatus controller. -
FIG. 4 is a flowchart illustrating an exemplary processing by the semiconductor system according to the exemplary embodiment. -
FIG. 5 is a diagram illustrating an exemplary exhaust profile of asemiconductor manufacturing apparatus 1A. -
FIG. 6 is a diagram illustrating an exemplary exhaust profile of asemiconductor manufacturing apparatus 1B. -
FIG. 7 is a diagram illustrating a relationship between the exhaust profile of thesemiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B. -
FIG. 8 is a diagram illustrating an exemplary correction value table. - In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made without departing from the spirit or scope of the subject matter presented here.
- It is undesirable from the viewpoint of time and cost that engineers adjust respective semiconductor manufacturing apparatuses, and the adjustment results tend to vary. In the methods disclosed in Japanese Patent No. 5436797 and Japanese Patent Laid-open Publication Nos. 2003-217995 and H11-340111, it is required to introduce a dedicated system separately from the semiconductor manufacturing apparatuses, which is undesirable from the viewpoint of cost. Therefore, there is a need for a semiconductor system capable of performing direct communication among a plurality of semiconductor manufacturing apparatuses without introducing a dedicated system.
- An aspect of the present disclosure provides a semiconductor system capable of performing direct communication among a plurality of semiconductor manufacturing apparatuses.
- According to an aspect of the present disclosure, there is provided a semiconductor system according to an aspect of the present disclosure including a first semiconductor manufacturing apparatus and a second semiconductor manufacturing apparatus that share information on a semiconductor manufacturing apparatus by directly communicating the information therebetween. The first semiconductor manufacturing apparatus includes: a first acquisition unit configured to acquire first information on the first semiconductor manufacturing apparatus; a first storage unit configured to store the first information acquired by the first acquisition unit; and a first communication unit configured to send the first information stored in the first storage unit to the second semiconductor manufacturing apparatus. The second semiconductor manufacturing apparatus includes: a second acquisition unit configured to acquire second information on the second semiconductor manufacturing apparatus; a second storage unit configured to store the second information acquired by the second acquisition unit; a second communication unit configured to receive the first information sent from the first semiconductor manufacturing apparatus; an analysis unit configured to analyze a state of the second semiconductor manufacturing apparatus based on the first information received by the second communication unit and the second information stored in the second storage unit; an information generation unit configured to generate information that visualizes an analysis result of the analysis unit; and a display unit configured to display information generated by the information generation unit.
- In the above-described semiconductor system, the analysis unit compares the second information acquired by the second acquisition unit with the first information received by the second communication unit to determine whether the state of the second semiconductor manufacturing apparatus is identical to a state of the first semiconductor manufacturing apparatus.
- In the above-described semiconductor system, when a difference between the first information and the second information when the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus are caused to perform the same operation is included in a predetermined range, the analysis unit determines that the state of the second semiconductor manufacturing apparatus is identical to the state of the first semiconductor manufacturing apparatus. When the difference between the first information and the second information when the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus are caused to perform the same operation is not included in the predetermined range, the analysis unit determines that the state of the second semiconductor manufacturing apparatus is different from the state of the first semiconductor manufacturing apparatus.
- In the above-described semiconductor system, when the analysis unit determines that the state of the second semiconductor manufacturing apparatus is different from the state of the first semiconductor manufacturing apparatus, the information generation unit generates a correction value for matching a characteristic of a semiconductor device manufactured by the second semiconductor manufacturing apparatus with a characteristic of a semiconductor device manufactured by the first semiconductor manufacturing apparatus.
- In the above-described semiconductor system, the first information and the second information are set values to be used when controlling operations of respective units of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus.
- In the above-described semiconductor system, the first information and the second information are state logs of respective units of the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus when a predetermined operation is executed in the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus.
- In the above-described semiconductor system, the first information and the second information are values that vary depending on an environment in which the first semiconductor manufacturing apparatus and the second semiconductor manufacturing apparatus are installed, respectively.
- According to a semiconductor system disclosed herein, it is possible to provide a semiconductor system in which direct communication is capable of being performed among a plurality of semiconductor manufacturing apparatuses.
- Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In the present specification and drawings, substantially the same components will be denoted by the same symbols, and redundant descriptions will be omitted.
- (Semiconductor System)
- A semiconductor system according to an exemplary embodiment of the present disclosure will be described.
FIG. 1 is an overall configuration diagram illustrating an example of a semiconductor system according to the exemplary embodiment. - As illustrated in
FIG. 1 , the semiconductor system has a plurality of (e.g., three)semiconductor manufacturing apparatuses - The
semiconductor manufacturing apparatuses semiconductor manufacturing apparatuses - The
semiconductor manufacturing apparatuses apparatus controllers apparatus controllers apparatus controllers semiconductor manufacturing apparatuses apparatus controller 10A and theapparatus controller 10B share information on thesemiconductor manufacturing apparatuses apparatus controller 10A and the apparatus controller 10C shares information on thesemiconductor manufacturing apparatuses 1A and 1C by bidirectionally communicating the information therebetween. Meanwhile, the communication network may be, for example, a network of a manufacturing execution system (MES) that manages manufacturing steps of the entire factory in which the semiconductor system is installed. Further, the communication network may be, for example, the Internet, an intranet, or a public telephone line network. - The
apparatus controllers apparatus controllers apparatus controllers apparatus controller 10A will be described, and a description of theapparatus controllers 10B and 10C will be omitted. - (Apparatus Controller)
- An example of the hardware configuration of the
apparatus controller 10A will be described.FIG. 2 is a diagram illustrating an exemplary hardware configuration of theapparatus controller 10A. - As illustrated in
FIG. 2 , theapparatus controller 10A includes a central processing unit (CPU) 11, a read only memory (ROM) 12, a random access memory (RAM) 13, a hard disk drive (HDD) 14, a connection interface (I/F) 15, and a communication I/F 16 which are connected with each other via abus 17. - The CPU 11 controls the overall operation of the semiconductor manufacturing apparatus 11A by executing a program stored in, for example, the
ROM 12 or theHDD 14 using theRAM 13 as a work area. Each component of thesemiconductor manufacturing apparatus 1A is connected to the connection I/F 15. The communication I/F 16 is an interface for communicating withother apparatus controllers 10B and 10C by wired or wireless communication. - In the
apparatus controller 10A, a program for causing a processing target object to perform a predetermined semiconductor processing is installed in advance. Then, process managers perform an operation of causing thesemiconductor manufacturing apparatus 1A having a program installed therein to perform various substrate processings via theapparatus controller 10A. - An example of a functional configuration of the
apparatus controller 10A will be described.FIG. 3 is a block diagram illustrating the functional configuration of theapparatus controller 10A. The function of theapparatus controller 10A to be described below is implemented by executing a predetermined program in the above-described CPU 11. The program may be acquired via a recording medium, may be acquired via a communication network, or may be incorporated into theROM 12. - As illustrated in
FIG. 3 , theapparatus controller 10A includes anacquisition unit 101, astorage unit 102, acommunication unit 103, ananalysis unit 104, aninformation generation unit 105, adisplay unit 106, aninput reception unit 107, and acluster management unit 108. - The
acquisition unit 101 has a function of acquiring information on thesemiconductor manufacturing apparatus 1A. Information on thesemiconductor manufacturing apparatus 1A includes, for example, parameters, history data, and installation environment data. - The parameters are set values or adjustment values that are used when controlling the operations of respective components of the semiconductor manufacturing apparatus, and may include, for example, the zero points of a heater, a vacuum gauge, and a flow rate controller. By comparing the parameters in a plurality of semiconductor manufacturing apparatuses, the differences between, for example, the apparatus configurations may be grasped.
- The history data is a state log of each component of the semiconductor manufacturing apparatus when the semiconductor manufacturing apparatus is caused to execute a predetermined operation, and may include, for example, the opening degree of an automatic pressure control (APC) valve and the value measured by, for example, a temperature sensor, a pressure sensor, or a flow rate sensor. Further, the history data may be a representative value obtained by performing a predetermined calculation on the opening degree of the APC valve or the value measured by a sensor, for example, an average value or a standard deviation. The predetermined operation is determined in advance in accordance with, for example, the type of the history data. By comparing the history data in a plurality of semiconductor manufacturing apparatuses, the differences, for example, in the condition of or in the accumulated substrate processing situation of the respective semiconductor manufacturing apparatuses may be determined.
- The installation environment data is a value that varies depending on the environment in which the semiconductor manufacturing apparatus is installed, and may include, for example, values of exhaust conductance, cooling water supply flow rate, and gas supply pressure. By comparing the installation environment data of a plurality of semiconductor manufacturing apparatuses under the same condition, for example, a difference in the environments where the respective semiconductor manufacturing apparatuses are installed may be understood.
- The
storage unit 102 has a function of storing information on thesemiconductor manufacturing apparatus 1A acquired by theacquisition unit 101. Further, thestorage unit 102 has a function of storing a cluster ID that specifies the cluster to which thesemiconductor manufacturing apparatus 1A belongs. The cluster ID may be, for example, an IP address or a communication port. In the present specification, the term “cluster” means a system in which a plurality of semiconductor manufacturing apparatuses are grouped. - The
communication unit 103 has a function of sending the information on thesemiconductor manufacturing apparatus 1A and the cluster ID stored in thestorage unit 102 to other apparatus controllers, for example, theapparatus controllers 10B and 10C. Further, thecommunication unit 103 has a function of receiving the information on thesemiconductor manufacturing apparatuses 1B and 1C and the cluster ID received from other apparatus controllers, for example, theapparatus controllers 10B and 10C. Meanwhile, the information on thesemiconductor manufacturing apparatuses 1B and 1C and the cluster ID received by thecommunication unit 103 may be stored in thestorage unit 102. - The
analysis unit 104 has a function of analyzing the state of thesemiconductor manufacturing apparatus 1A based on the information on the othersemiconductor manufacturing apparatuses 1B and 1C received by thecommunication unit 103 and the information on thesemiconductor manufacturing apparatus 1A stored in thestorage unit 102. For example, theanalysis unit 104 compares the information on thesemiconductor manufacturing apparatus 1A with the information on the othersemiconductor manufacturing apparatus 1B received by thecommunication unit 103 to determine whether the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B. Specifically, for example, when the difference between the history data of thesemiconductor manufacturing apparatus 1A and the history data of thesemiconductor manufacturing apparatus 1B when thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B are caused to execute the same operation is included in a predetermined range, it is determined that the states of both are the same. When the difference between the history data of thesemiconductor manufacturing apparatus 1A and the history data of thesemiconductor manufacturing apparatus 1B when thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B are caused to execute the same operation is not included in the predetermined range, it is determined that the states of thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B are different from each other. - The
information generation unit 105 has a function of generating information that visualizes the state of thesemiconductor manufacturing apparatus 1A based on the analysis results of theanalysis unit 104. For example, when it is determined by theanalysis unit 104 that the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B, theinformation generation unit 105 generates information representing that the states of thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B are identical to each other. Further, for example, when it is determined by theanalysis unit 104 that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B, theinformation generation unit 105 generates information representing that the state of thesemiconductor manufacturing apparatus 1A and the state of thesemiconductor manufacturing apparatus 1B are different from each other. In addition, for example, when it is determined by theanalysis unit 104 that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B, theinformation generation unit 105 generates a correction value to match the characteristic of the semiconductor device manufactured by thesemiconductor manufacturing apparatus 1A with the characteristic of the semiconductor device manufactured by thesemiconductor manufacturing apparatus 1B. - The
display unit 106 has a function of displaying the information generated by theinformation generation unit 105. - The
input reception unit 107 has a function of receiving an operation input of process managers. - The
cluster management unit 108 has a function of determining whether one semiconductor manufacturing apparatus belongs to the same cluster as other semiconductor manufacturing apparatuses. For example, when it is determined whether thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B belong to the same cluster, the cluster ID stored in thestorage unit 102 of thesemiconductor manufacturing apparatus 1A is compared with the cluster ID stored in the storage unit of thesemiconductor manufacturing apparatus 1B. When the cluster ID of thesemiconductor manufacturing apparatus 1A matches the cluster ID of thesemiconductor manufacturing apparatus 1B, it is determined that thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B belong to the same cluster. Meanwhile, for example, when thesemiconductor manufacturing apparatus 1A is newly added to a specific cluster, the process managers input the network ID of the device which already belongs to the cluster to be joined so that thesemiconductor manufacturing apparatus 1A may join a new cluster. - (Operation)
- An example of a processing by the semiconductor system according to an exemplary embodiment of the present disclosure will be described. Hereinafter, a description will be made of a case where the state of the
semiconductor manufacturing apparatus 1A is matched with the state of thesemiconductor manufacturing apparatus 1B with reference to the state of thesemiconductor manufacturing apparatus 1B, by way of an example. Meanwhile, the processing by the semiconductor system may be performed as long as information on the semiconductor manufacturing apparatus is directly communicated and shared among a plurality of semiconductor manufacturing apparatuses, but the processing is not limited to matching the state of one semiconductor manufacturing apparatus with the states of the other semiconductor manufacturing apparatuses. For example, one semiconductor manufacturing apparatus may refer to another semiconductor manufacturing apparatus, or information on one semiconductor manufacturing apparatus may be copied to another semiconductor manufacturing apparatus. -
FIG. 4 is a flowchart illustrating an exemplary processing by the semiconductor system according to the exemplary embodiment. - When an operation input is made by the process managers to match the state of the
semiconductor manufacturing apparatus 1A with the state of thesemiconductor manufacturing apparatus 1B by referring to the state of thesemiconductor manufacturing apparatus 1B, theacquisition unit 101 acquires information on thesemiconductor manufacturing apparatus 1A (step S1). - Next, the
acquisition unit 101 stores the acquired information on thesemiconductor manufacturing apparatus 1A in the storage unit 102 (step S2). - Next, the
communication unit 103 receives information on thesemiconductor manufacturing apparatus 1B (step S3). - Next, based on the information on the
semiconductor manufacturing apparatus 1A stored in thestorage unit 102 and the information on thesemiconductor manufacturing apparatus 1B received by thecommunication unit 103, theanalysis unit 104 determines whether the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B (step S4). - In step S4, when the
analysis unit 104 determines that the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B, theinformation generation unit 105 generates information representing that the states of thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B are identical to each other (step S5). - In step S4, when the
analysis unit 104 determines that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B, theinformation generation unit 105 generates information representing that the states of thesemiconductor manufacturing apparatus 1A and thesemiconductor manufacturing apparatus 1B are different from each other (step S6). Further, theinformation generation unit 105 generates a correction value to match the characteristic of a semiconductor device manufactured by thesemiconductor manufacturing apparatus 1A with the characteristic of a semiconductor device manufactured by thesemiconductor manufacturing apparatus 1B. - Next, the
display unit 106 displays the information generated by the information generation unit 105 (step S8) and ends the processing. That is, in step S4, when theanalysis unit 104 determines that the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B, thedisplay unit 106 displays first information generated by theinformation generation unit 105. In step S4, when theanalysis unit 104 determines that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B, thedisplay unit 106 displays second information and the correction value generated by theinformation generation unit 105. - An example of the processing by the semiconductor system according to the exemplary embodiment has been described above, but the processing by the semiconductor system may be changed as follows.
- For example, when the
analysis unit 104 determines that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B, the step of generating the correction value by the information generation unit 105 (step S7) may be omitted. In this case, in step S8, thedisplay unit 106 displays only the second information generated by theinformation generation unit 105. - Further, for example, a step of storing the first information, the second information, and the correction value generated by the
information generation unit 105 in thestorage unit 102 may be included. - In addition, for example, when an operation input is made by the process managers to match the state of the
semiconductor manufacturing apparatus 1A with the state of thesemiconductor manufacturing apparatus 1B by referring to the state of thesemiconductor manufacturing apparatus 1B, a step of determining by thecluster management unit 108 whether thesemiconductor manufacturing apparatus 1B belongs to the same cluster as thesemiconductor manufacturing apparatus 1A may be included prior to step S1. In this case, when thecluster management unit 108 determines that thesemiconductor manufacturing apparatus 1B belongs to the same cluster as thesemiconductor manufacturing apparatus 1A, step S1 is performed. - Next, a specific example of the processing by the semiconductor system will be described. In the following description, an example will be described in which a correction value is calculated by comparing an exhaust profile of the
semiconductor manufacturing apparatus 1A with an exhaust profile of thesemiconductor manufacturing apparatus 1B. The exhaust profile is an example of information on the semiconductor manufacturing apparatus. - First, the
acquisition unit 101 acquires the exhaust profile of thesemiconductor manufacturing apparatus 1A (step S1). The exhaust profile of thesemiconductor manufacturing apparatus 1A is a pressure change when thesemiconductor manufacturing apparatus 1A is operated under a plurality of previously prepared conditions.FIG. 5 is a diagram illustrating an exemplary exhaust profile of thesemiconductor manufacturing apparatus 1A. As illustrated inFIG. 5 , the exhaust profile of thesemiconductor manufacturing apparatus 1A may be a pressure change in a processing vessel when changing the opening degree of the APC valve and the supply flow rate of an N2 gas, respectively. Meanwhile, inFIG. 5 , the unit for the opening degree of the APC valve is a percentage (%), the unit for the supply flow rate of the N2 gas is liter (L), and the unit for the pressure is pascal (Pa). In an exemplary embodiment, as illustrated inFIG. 5 , when the opening degree of the APC valve is 3.0% and the supply flow rate of the N2 gas is y (L), the pressure in the processing vessel is 3.8 Pa. Further, when the opening degree of the APC valve is 4.0% and the supply flow rate of the N2 gas is y (L), the pressure in the processing vessel is 3.5 Pa. - Next, the
acquisition unit 101 stores the acquired information in the storage unit 102 (step S2). - Next, the
communication unit 103 acquires the exhaust profile of thesemiconductor manufacturing apparatus 1B stored in the storage unit of theapparatus controller 10B of thesemiconductor manufacturing apparatus 1B (step S3). The exhaust profile of thesemiconductor manufacturing apparatus 1B is a pressure change when thesemiconductor manufacturing apparatus 1B is operated under a plurality of previously prepared conditions in the same manner as in thesemiconductor manufacturing apparatus 1A.FIG. 6 is a diagram illustrating an exemplary exhaust profile of thesemiconductor manufacturing apparatus 1B. As illustrated inFIG. 6 , the exhaust profile of thesemiconductor manufacturing apparatus 1B may be a pressure change in a processing vessel when changing the opening degree of the APC valve and the supply flow rate of an N2 gas, respectively. Meanwhile, inFIG. 6 , the unit for the opening degree of the APC valve is a percentage (%), the unit for the supply flow rate of the N2 gas is liter (L), and the unit for the pressure is pascal (Pa). In an exemplary embodiment, as illustrated inFIG. 6 , when the opening degree of the APC valve is 3.0% and the supply flow rate of the N2 gas is y (L), the pressure in the processing vessel is 4.1 Pa. Further, when the opening degree of the APC valve is 4.0% and the supply flow rate of the N2 gas is y (L), the pressure in the processing vessel is 3.7 Pa. - Next, based on the exhaust profile of the
semiconductor manufacturing apparatus 1A stored in thestorage unit 102 and the exhaust profile of thesemiconductor manufacturing apparatus 1B received by thecommunication unit 103, theanalysis unit 104 determines whether the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B (step S4). A determination on whether the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B may be made, for example, based on whether the difference between the exhaust profile of thesemiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B is included in a predetermined range. In the exemplary embodiment, for example, when the difference between the exhaust profile of thesemiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B is equal to or smaller than 0.1 Pa, it is determined that the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B. When the difference between the exhaust profile of thesemiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B is larger than 0.1 Pa, it may be determined that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B. In the exemplary embodiment, as illustrated inFIGS. 5 and 6 , since the difference between the exhaust profile of thesemiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B at the same opening degree of the APC valve is larger than 0.1 Pa, it is determined that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B. - Next, the
information generation unit 105 generates information (second information) representing that the state of thesemiconductor manufacturing apparatus 1A is different from the state of thesemiconductor manufacturing apparatus 1B (step S6). Further, theinformation generation unit 105 generates a correction value to match the characteristic of a semiconductor device manufactured by thesemiconductor manufacturing apparatus 1A with the characteristic of a semiconductor device manufactured by thesemiconductor manufacturing apparatus 1B (step S7).FIG. 7 is a diagram illustrating a relationship between the exhaust profile of thesemiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B. InFIG. 7 , the horizontal axis represents the opening degree % of the APC valve and the vertical axis represents the pressure Pa in the processing vessel of thesemiconductor manufacturing apparatuses FIG. 7 , for example, theinformation generation unit 105 calculates the opening degree of the APC valve of thesemiconductor manufacturing apparatus 1B, which has the same pressure as the pressure in the processing vessel when the opening degree of the APC valve of thesemiconductor manufacturing apparatus 1A is 4.0 Pa. Further, theinformation generation unit 105 calculates the difference between the opening degree of the APC valve of thesemiconductor manufacturing apparatus 1A and the opening degree of the APC valve of thesemiconductor manufacturing apparatus 1B so as to generate the difference as a correction value. InFIG. 7 , the correction value is X1%.FIG. 8 is a diagram illustrating an exemplary correction value table. As illustrated inFIG. 8 , since the correction value of the opening degree of the APC valve depends on a relationship among three variables, i.e., the pressure, the supply flow rate of the N2 gas, and the opening degree of the APC valve, the correction may be made when executing the processing by calculating the correction value per supply flow rate of the N2 gas. - Next, the
display unit 106 displays the second information and the correction value generated by the information generation unit 105 (step S8) and ends the processing. - Meanwhile, in the above-described exemplary embodiment, the
semiconductor manufacturing apparatus 1B is an example of a first semiconductor manufacturing apparatus, and thesemiconductor manufacturing apparatus 1A is an example of a second semiconductor manufacturing apparatus. - As described above, in the semiconductor system of the exemplary embodiment, when the
apparatus controller 10A receives an operation input by the process managers, theapparatus controller 10A compares the exhaust profile of thesemiconductor manufacturing apparatus 1A with the exhaust profile of thesemiconductor manufacturing apparatus 1B. Theapparatus controller 10A also determines whether the state of thesemiconductor manufacturing apparatus 1A is identical to the state of thesemiconductor manufacturing apparatus 1B. For this reason, engineers skilled in the semiconductor manufacturing apparatus do not need to confirm, for example, the state of each semiconductor manufacturing apparatus, and process managers may easily determine whether it is required to adjust thesemiconductor manufacturing apparatus 1A. - Further, in the semiconductor system of the exemplary embodiment, based on the exhaust profile of the
semiconductor manufacturing apparatus 1A and the exhaust profile of thesemiconductor manufacturing apparatus 1B, theapparatus controller 10A calculates a correction value so that the state of thesemiconductor manufacturing apparatus 1A is equal to the state of thesemiconductor manufacturing apparatus 1B. For this reason, even when the exhaust profile of thesemiconductor manufacturing apparatus 1A is different from the exhaust profile of thesemiconductor manufacturing apparatus 1B, the process managers may easily adjust thesemiconductor manufacturing apparatus 1A. As a result, the occurrence of variations in the quality of the semiconductor manufacturing apparatuses may be suppressed even when manufacturing the semiconductor device using a plurality of semiconductor manufacturing apparatuses. - Further, in the semiconductor system of the exemplary embodiment, the process managers may easily determine whether it required to adjust the semiconductor manufacturing apparatuses and then easily adjust the semiconductor manufacturing apparatuses. This may shorten the time required to carry apparatuses into a semiconductor factory and operate the apparatuses, and may facilitate maintenance and management of the apparatuses.
- From the foregoing, it will be appreciated that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the following claims.
Claims (7)
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JP6745673B2 (en) | 2020-08-26 |
US11822319B2 (en) | 2023-11-21 |
KR102255938B1 (en) | 2021-05-24 |
KR20180016296A (en) | 2018-02-14 |
JP2018022816A (en) | 2018-02-08 |
US20210043459A1 (en) | 2021-02-11 |
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