US20170338135A1 - Thermal coupled quartz dome heat sink - Google Patents
Thermal coupled quartz dome heat sink Download PDFInfo
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- US20170338135A1 US20170338135A1 US15/673,801 US201715673801A US2017338135A1 US 20170338135 A1 US20170338135 A1 US 20170338135A1 US 201715673801 A US201715673801 A US 201715673801A US 2017338135 A1 US2017338135 A1 US 2017338135A1
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- United States
- Prior art keywords
- lamp housing
- optically transparent
- transparent window
- process chamber
- cooling fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4411—Cooling of the reaction chamber walls
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
Definitions
- Embodiments of the present invention generally relate to methods and apparatus for heating substrates, such as semiconductor substrates.
- One method of processing substrates includes depositing a material, for example, an epitaxial material, on a substrate surface.
- Deposited film quality is dependent upon several factors, including process conditions such as temperature. As transistor size decreases, temperature control becomes more important in forming high quality films. Temperature control becomes more difficult as throughput increases, particularly due to the demands of rapid substrate temperature increases and decreases (e.g., substrate ramp up and cool down).
- the substrate heating rate can be increased by adjusting lamp settings.
- substrate cooling is largely dependent on the ambient temperature, which may be difficult or expensive to reduce. To further exacerbate cooling issues, the ambient temperature in close proximity to a substrate is influenced by heated chamber components, particularly a heated lower dome. The absorbed heat radiates to a substrate during cooling, which undesirably extends the time to sufficiently cool a substrate.
- Embodiments described herein generally relate to apparatus for processing substrates.
- the apparatus generally include a process chamber having a substrate support therein.
- a plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support.
- the plurality of lamps are positioned in a lamp housing.
- a cooling channel is formed in the lamp housing.
- a surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween.
- the gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window.
- Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
- a process chamber comprises a chamber body including an optically transparent window and a lamp housing disposed adjacent to the optically transparent window. A gap is formed between the optically transparent window and the lamp housing. A plurality of lamps and one or more cooling channels are disposed within the lamp housing.
- the process chamber also includes a cooling fluid source adapted to provide a cooling fluid to the gap between the optically transparent window and the lamp housing.
- a method of cooling comprises circulating a cooling fluid within a space between an optically transparent window and a lamp housing having at least one cooling channel formed therein.
- a surface of the lamp housing includes one or more turbulence inducing features to cause a turbulent flow of the cooling fluid.
- the cooling fluid thermally couples the optically transparent window and the at least one cooling channel.
- FIG. 1 is a schematic sectional view of a process chamber according to one embodiment of the invention.
- FIG. 2A is a partial sectional schematic view of an upper surface of lamp housings, according to embodiments of the invention.
- FIG. 2B is an enlarged view of a reflector, according to one embodiment of the invention.
- FIGS. 3A-3C illustrate enlarged schematic views of an upper surface of a lamp housing, according to embodiments of the invention.
- Embodiments described herein generally relate to apparatus for processing substrates.
- the apparatus generally include a process chamber having a substrate support therein.
- a plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support.
- the plurality of lamps are positioned in a lamp housing.
- a cooling channel is formed in the lamp housing.
- a surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween.
- the gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window.
- Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
- FIG. 1 is a schematic sectional view of a process chamber 100 according to one embodiment of the invention.
- the process chamber 100 may be used to process one or more substrates, including the deposition of a material on an upper surface of a substrate.
- the process chamber 100 includes a chamber body 101 and a lid or upper dome 102 formed from a material such as a stainless steel, aluminum, ceramics (e.g., quartz), or coated metals or ceramics.
- the process chamber 100 also includes a window 104 , such as a lower dome, formed from an optically transparent material such as quartz.
- the optically transparent window 104 is coupled to, or is an integral part of, the chamber body 101 .
- a substrate support 106 adapted to support a substrate 108 thereon is disposed within the process chamber 100 between the upper dome 102 and the optically transparent window 104 .
- the substrate support 106 is coupled to a support plate 109 and forms a gap 111 therebetween.
- the support plate 109 is formed from an optically transparent material, such as quartz, to allow radiant energy from lamps 142 to impinge upon and heat the substrate support 106 to a desired processing temperature.
- the substrate support 106 is formed from silicon carbide or graphite coated with silicon carbide to absorb radiant energy from the lamps 142 and transfer the radiant energy to the substrate 108 .
- the substrate support 106 is shown in an elevated processing position, but may be vertically actuated by an actuator 112 to a loading position below the processing position to allow lift pins 110 to contact the optically transparent window 104 and raise the substrate 108 from the substrate support 106 .
- a robot (not shown) may then enter the process chamber 100 to engage and remove the substrate 108 therefrom through an opening 114 , such as a slit valve.
- the substrate support 106 is also adapted to be rotated during processing by the actuator 112 to facilitate uniform processing of the substrate 108 .
- the substrate support 106 while located in the processing position, divides the internal volume of the process chamber 100 into a process gas region 116 and a purge gas region 118 .
- the process gas region 116 includes the internal chamber volume located between the upper dome 102 and a plane 120 of the substrate support 106 while the substrate support 106 is located in the processing position.
- the purge gas region 118 includes the internal chamber volume located between the optically transparent window 104 and the plane 120 .
- Purge gas supplied from a purge gas source 122 is introduced to the purge gas region 118 through a purge gas inlet 124 formed within a sidewall of the chamber body 101 .
- the purge gas flows laterally along flow path 126 across the back surface of the support 106 , and is exhausted from the purge gas region 118 through a purge gas outlet 128 located on the opposite side of the process chamber 100 as the purge gas inlet 124 .
- An exhaust pump 130 coupled to the purge gas outlet 128 , facilitates removal of the purge gas from the purge gas region 118 .
- Process gas supplied from a process gas supply source 132 is introduced into the process gas region 116 through a process gas inlet 134 formed in a sidewall of the chamber body 101 .
- the process gas flows laterally across the upper surface of the substrate 108 along flow path 136 .
- the process gas exits the process gas region 116 through a process gas outlet 138 located on the opposite side of the process chamber 100 as the process gas inlet 134 . Removal of the process gas through the process gas outlet 138 is facilitated by a vacuum pump 140 coupled thereto.
- Multiple lamps 142 are disposed adjacent to and beneath the optically transparent window 104 to heat the substrate 108 as the process gas passes thereover to facilitate the deposition of a material onto the upper surface of the substrate 108 .
- the lamps 142 are positioned in a lamp housing 150 , formed from, for example, copper, aluminum, or stainless steel.
- the lamps include bulbs 141 surrounded by an optional reflector 142 A.
- Each lamp 142 is coupled to a power distribution board 147 through which power is supplied to each lamp 142 .
- the lamps 142 are arranged in annular groups of increasing radius around a shaft 127 of the substrate support 106 .
- the shaft 127 is formed form quartz or another optically transparent material.
- the gap 151 is in fluid communication with a temperature control unit 154 .
- the temperature control unit 154 contains a fluid, a fluid source, or a connection to an external fluid source, and provides a cooling fluid, such as a gas, to the gap 151 through piping 156 , as shown by flow path 158 .
- the temperature control unit 154 may optionally include a forced induction unit 154 A, such as a fan or jet pack, as well as a heat exchanger 1548 to remove heat from the circulating cooling fluid. While the cooling fluid is located in the gap 151 , the cooling fluid facilitates heat transfer from the optically transparent window 104 to cooling channels 149 within the lamp housing 150 . Thus, heat is removed from the optically transparent window 104 , which further increases the rate of cooling of the substrate 108 by reducing the radiation of heat from the optically transparent window 104 to the substrate 108 . The cooling fluid is recycled to the temperature control unit 154 for reuse, as shown by the flow path 158 .
- a forced induction unit 154 A such as a fan or jet pack
- the cooling channels 149 are not only utilized to remove thermal energy from the optically transparent window 104 , but also to cool the lamps 142 . Because only one set of cooling channels 149 are utilized to cool both the optically transparent window 104 and the lamps 142 , manufacturing costs of the process chamber 100 are reduced.
- the lamps 142 are adapted to the heat the substrate to a predetermined temperature to facilitate thermal decomposition of the process gas onto the surface of the substrate 108 .
- the material deposited onto the substrate may be a group III, group IV, and/or group V material, or may be a material including a group III, group IV, and/or group V dopant.
- the deposited material may include gallium arsenide, gallium nitride, or aluminum gallium nitride.
- the lamps may be adapted to heat the substrate to a temperature within a range of about 300 degrees Celsius to about 1200 degrees Celsius, such as about 300 degrees Celsius to about 950 degrees Celsius.
- FIG. 1 illustrates one embodiment of a process chamber
- the substrate support 106 may be formed from an optically transparent material, such as quartz, to allow for direct heating of the substrate 108 .
- an optional circular shield 139 may be disposed around the substrate support 106 and coupled to a sidewall of the chamber body 101 .
- the process gas supply source 132 may be adapted to supply multiple types of process gases, for example, a group III precursor gas and a group V precursor gas. The multiple process gases may be introduced into the chamber through the same process gas inlet 134 , or through different process gas inlets 134 .
- the size, width, and/or number of gas inlets 124 , 134 , or gas outlets 128 , 138 may be adjusted to further facilitate a uniform deposition of material on the substrate 108 .
- the substrate support 106 may be an annular ring or edge ring having a central opening therethrough, and may be adapted to support the perimeter of the substrate 108 .
- the substrate support 106 may be formed from silicon carbide, silicon-carbide-coated graphite, or glassy-carbon-coated graphite.
- FIG. 2A is a partial sectional schematic view of an upper surface 260 of a lamp housing 250 A.
- the lamp housing 250 A is similar to lamp housing 150 and may be used in place thereof.
- the upper surface 260 includes features, such as openings 262 , formed therein.
- the openings 262 allow radiant energy from the lamps 142 to pass through the upper surface 260 to impinge upon a substrate or substrate support.
- An opening 262 is disposed above each of the lamps 142 .
- the openings 262 induce a turbulent flow within a cooling fluid as the cooling fluid passes between the upper surface 260 and bottom surface of a lower dome, such as optically transparent window 104 shown in FIG. 1 .
- the turbulent flow of the cooling fluid increases thermal coupling between a lower dome and cooling channels 149 formed within the lamp housing 250 A.
- thermal energy can quickly be removed from a lower dome, particularly compared to when the lower dome is cooled by stagnant, ambient air.
- the rapid reduction in the temperature of the lower dome facilitates a reduction in substrate cool down time, because radiant heating of the substrate by the lower dome is decreased.
- a cooling fluid with a lower thermal conductivity may be utilized while still providing sufficient cooling.
- a cooling fluid with a lower thermal conductivity may be desired when such a cooling fluid is cost efficient.
- One such cost efficient cooling fluid may be atmospheric air.
- FIG. 2A illustrates one embodiment; however, other embodiments are also contemplated.
- features other than openings 262 may be used in addition to or as an alternative to the openings 262 to induce a turbulent flow of the cooling fluid.
- features such as ridges or bumps may be utilized to induce a turbulent flow to a cooling fluid.
- FIG. 2B illustrates an alternative embodiment of a reflector 242 A.
- the reflector 242 A is similar to reflector 142 A, except that the reflector 242 A includes an extended portion 242 B that projects above the surface 260 of the lamp housing.
- the extended portion 242 B of the reflector 242 A facilitates increased turbulence of the cooling fluid flowing thereover, thus increasing heat transfer from optically transparent window 104 to the lamp housing.
- the number of reflectors 242 A having an extended portion 242 B may be selected to generate the desired turbulence of the cooling fluid, and thus, not each reflector 242 A may have an extended portion 242 B.
- more than one reflector may include an extended portion 242 B, although only one is shown for clarity.
- each lamp 142 may include a reflector 242 A having an extended portion 242 B.
- the extended portions 242 B may be in contact with a lower surface of the optically transparent window 104 .
- the extended portion 242 B includes a conical section, however, other shapes are also contemplated.
- FIGS. 3A-3C illustrate enlarged schematic views of an upper surface of a lamp housing having additional turbulence inducing features thereon, according to embodiments of the invention.
- FIG. 3A illustrates an upper surface 360 A, which is similar to the upper surface 260 .
- the upper surface 360 A includes a plurality of ridges 380 extending therefrom to facilitate turbulent flow of a cooling fluid as the cooling fluid flows thereover.
- the ridges 380 may have a length of several millimeters to several centimeters, or more, and a height limited to the spacing between the upper surface 360 A and a lower surface of the optically transparent window 104 . In one embodiment, it is contemplated that the ridges 380 may be in contact with the optically transparent window 104 .
- FIG. 3B illustrates an upper surface 360 B, which is similar to the upper surface 260 .
- the upper surface 360 B includes a plurality of bumps 381 extending therefrom to facilitate turbulent flow of a cooling fluid as the cooling fluid flows thereover.
- the bumps 381 may have a diameter of a millimeter to several millimeters, or more, and a height limited to the spacing between the upper surface 360 B and a lower surface of the optically transparent window 104 . In one embodiment, it is contemplated that the bumps 381 may be in contact with the optically transparent window 104 . Additionally, the bumps 381 may be formed by texturing the surface 360 B, for example by exposure to an etchant. Alternatively, the bumps 381 may be part of the natural surface roughness of an unpolished or unfinished surface.
- FIG. 3C illustrates an upper surface 360 C, which is similar to the upper surface 260 .
- the upper surface 360 C includes one or more channels 382 formed therein to facilitate turbulent flow of a cooling fluid as the cooling fluid flows thereover.
- the channels 382 may have a length ranging from several millimeters to several centimeters, or more.
- a channel 382 may extend continuously around the upper surface 360 C.
- the channel 382 may have a depth with a range of about 0.5 millimeters to about 3 millimeters, or more.
- FIGS. 3A-3C illustrate embodiments of turbulence inducing features, however, additional or alternative turbulence inducing features are also contemplated. Also, the sizes of the turbulence inducing features, and the spacing between the optically transparent window 104 and the lamp head, may be selected to create a localized recirculation to maximize heat transfer between the optically transparent window 104 and the lamp head.
- Cooling fluids suitable for use herein generally include one or more highly conductive gases, including helium, hydrogen, and nitrogen. However, additional gases are contemplated. For example, it is contemplated ambient air, filtered ambient air, and clean, dry air (CDA) may also be utilized. Furthermore, it is contemplated that in some embodiments, one or more liquid coolants, such as water or oils, may be utilized.
- Benefits of embodiments described herein include increased cooling of chamber components and substrates.
- the increased cooling is facilitated by thermally coupling the lower dome to cooling channels disposed within a lamp housing using cooling fluid.
- the lamp housing includes features that induce a turbulent flow to the cooling fluid, thus increasing heat transfer between the lower dome and the cooling channels within the lamp housing.
- the increased heat transfer due to the turbulent flow allows a less expensive cooling fluid having a lower heat transfer coefficient to be utilized during processing.
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Abstract
Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support. The plurality of lamps are positioned in a lamp housing. A cooling channel is formed in the lamp housing. A surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween. The gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window. Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
Description
- This application is a divisional application of U.S. patent application Ser. No. 14/175,459, filed Feb. 7, 2014, which claims benefit of U.S. Provisional Patent Application Ser. No. 61/772,618, filed Mar. 5, 2013, all of which are herein incorporated by reference.
- Embodiments of the present invention generally relate to methods and apparatus for heating substrates, such as semiconductor substrates.
- Semiconductor substrates are processed for a wide variety of applications, including the fabrication of integrated devices and microdevices. One method of processing substrates includes depositing a material, for example, an epitaxial material, on a substrate surface. Deposited film quality is dependent upon several factors, including process conditions such as temperature. As transistor size decreases, temperature control becomes more important in forming high quality films. Temperature control becomes more difficult as throughput increases, particularly due to the demands of rapid substrate temperature increases and decreases (e.g., substrate ramp up and cool down). The substrate heating rate can be increased by adjusting lamp settings. However, substrate cooling is largely dependent on the ambient temperature, which may be difficult or expensive to reduce. To further exacerbate cooling issues, the ambient temperature in close proximity to a substrate is influenced by heated chamber components, particularly a heated lower dome. The absorbed heat radiates to a substrate during cooling, which undesirably extends the time to sufficiently cool a substrate.
- Therefore, there is a need for improved cooling.
- Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support. The plurality of lamps are positioned in a lamp housing. A cooling channel is formed in the lamp housing. A surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween. The gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window. Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
- In one embodiment, a process chamber comprises a chamber body including an optically transparent window and a lamp housing disposed adjacent to the optically transparent window. A gap is formed between the optically transparent window and the lamp housing. A plurality of lamps and one or more cooling channels are disposed within the lamp housing. The process chamber also includes a cooling fluid source adapted to provide a cooling fluid to the gap between the optically transparent window and the lamp housing.
- In another embodiment, a method of cooling comprises circulating a cooling fluid within a space between an optically transparent window and a lamp housing having at least one cooling channel formed therein. A surface of the lamp housing includes one or more turbulence inducing features to cause a turbulent flow of the cooling fluid. The cooling fluid thermally couples the optically transparent window and the at least one cooling channel.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
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FIG. 1 is a schematic sectional view of a process chamber according to one embodiment of the invention. -
FIG. 2A is a partial sectional schematic view of an upper surface of lamp housings, according to embodiments of the invention. -
FIG. 2B is an enlarged view of a reflector, according to one embodiment of the invention. -
FIGS. 3A-3C illustrate enlarged schematic views of an upper surface of a lamp housing, according to embodiments of the invention. - To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
- Embodiments described herein generally relate to apparatus for processing substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps are positioned to provide radiant energy through an optically transparent window to a substrate positioned on the substrate support. The plurality of lamps are positioned in a lamp housing. A cooling channel is formed in the lamp housing. A surface of the lamp housing is spaced a distance from the optically transparent window to form a gap therebetween. The gap functions as a fluid channel and is adapted to contain a fluid therein to facilitate cooling of the optically transparent window. Turbulence inducing features, such as openings, formed in the surface of the lamp housing induce a turbulent flow of the cooling fluid, thus improving heat transfer between the optically transparent window and the lamp housing.
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FIG. 1 is a schematic sectional view of aprocess chamber 100 according to one embodiment of the invention. Theprocess chamber 100 may be used to process one or more substrates, including the deposition of a material on an upper surface of a substrate. Theprocess chamber 100 includes achamber body 101 and a lid orupper dome 102 formed from a material such as a stainless steel, aluminum, ceramics (e.g., quartz), or coated metals or ceramics. Theprocess chamber 100 also includes awindow 104, such as a lower dome, formed from an optically transparent material such as quartz. The opticallytransparent window 104 is coupled to, or is an integral part of, thechamber body 101. Asubstrate support 106 adapted to support asubstrate 108 thereon is disposed within theprocess chamber 100 between theupper dome 102 and the opticallytransparent window 104. Thesubstrate support 106 is coupled to a support plate 109 and forms agap 111 therebetween. The support plate 109 is formed from an optically transparent material, such as quartz, to allow radiant energy fromlamps 142 to impinge upon and heat thesubstrate support 106 to a desired processing temperature. Thesubstrate support 106 is formed from silicon carbide or graphite coated with silicon carbide to absorb radiant energy from thelamps 142 and transfer the radiant energy to thesubstrate 108. - The
substrate support 106 is shown in an elevated processing position, but may be vertically actuated by anactuator 112 to a loading position below the processing position to allowlift pins 110 to contact the opticallytransparent window 104 and raise thesubstrate 108 from thesubstrate support 106. A robot (not shown) may then enter theprocess chamber 100 to engage and remove thesubstrate 108 therefrom through anopening 114, such as a slit valve. Thesubstrate support 106 is also adapted to be rotated during processing by theactuator 112 to facilitate uniform processing of thesubstrate 108. - The
substrate support 106, while located in the processing position, divides the internal volume of theprocess chamber 100 into a process gas region 116 and apurge gas region 118. The process gas region 116 includes the internal chamber volume located between theupper dome 102 and aplane 120 of thesubstrate support 106 while thesubstrate support 106 is located in the processing position. Thepurge gas region 118 includes the internal chamber volume located between the opticallytransparent window 104 and theplane 120. - Purge gas supplied from a
purge gas source 122 is introduced to thepurge gas region 118 through apurge gas inlet 124 formed within a sidewall of thechamber body 101. The purge gas flows laterally alongflow path 126 across the back surface of thesupport 106, and is exhausted from thepurge gas region 118 through apurge gas outlet 128 located on the opposite side of theprocess chamber 100 as thepurge gas inlet 124. Anexhaust pump 130, coupled to thepurge gas outlet 128, facilitates removal of the purge gas from thepurge gas region 118. - Process gas supplied from a process
gas supply source 132 is introduced into the process gas region 116 through aprocess gas inlet 134 formed in a sidewall of thechamber body 101. The process gas flows laterally across the upper surface of thesubstrate 108 alongflow path 136. The process gas exits the process gas region 116 through aprocess gas outlet 138 located on the opposite side of theprocess chamber 100 as theprocess gas inlet 134. Removal of the process gas through theprocess gas outlet 138 is facilitated by avacuum pump 140 coupled thereto. -
Multiple lamps 142 are disposed adjacent to and beneath the opticallytransparent window 104 to heat thesubstrate 108 as the process gas passes thereover to facilitate the deposition of a material onto the upper surface of thesubstrate 108. Thelamps 142 are positioned in alamp housing 150, formed from, for example, copper, aluminum, or stainless steel. The lamps includebulbs 141 surrounded by anoptional reflector 142A. Eachlamp 142 is coupled to apower distribution board 147 through which power is supplied to eachlamp 142. Thelamps 142 are arranged in annular groups of increasing radius around ashaft 127 of thesubstrate support 106. Theshaft 127 is formed form quartz or another optically transparent material. - An upper surface of the
lamp housing 150 is positioned in a spaced apart orientation from the opticallytransparent window 104 to form agap 151 therebetween. In one example, thegap 151 may be about 0.5 millimeters to about 10 millimeters, or more. In one example, thegap 151 is about 6 millimeters. Thegap 151 is in fluid communication with atemperature control unit 154. Thetemperature control unit 154 contains a fluid, a fluid source, or a connection to an external fluid source, and provides a cooling fluid, such as a gas, to thegap 151 through piping 156, as shown byflow path 158. Thetemperature control unit 154 may optionally include a forcedinduction unit 154A, such as a fan or jet pack, as well as aheat exchanger 1548 to remove heat from the circulating cooling fluid. While the cooling fluid is located in thegap 151, the cooling fluid facilitates heat transfer from the opticallytransparent window 104 to coolingchannels 149 within thelamp housing 150. Thus, heat is removed from the opticallytransparent window 104, which further increases the rate of cooling of thesubstrate 108 by reducing the radiation of heat from the opticallytransparent window 104 to thesubstrate 108. The cooling fluid is recycled to thetemperature control unit 154 for reuse, as shown by theflow path 158. The coolingchannels 149 are not only utilized to remove thermal energy from the opticallytransparent window 104, but also to cool thelamps 142. Because only one set of coolingchannels 149 are utilized to cool both the opticallytransparent window 104 and thelamps 142, manufacturing costs of theprocess chamber 100 are reduced. - The
lamps 142 are adapted to the heat the substrate to a predetermined temperature to facilitate thermal decomposition of the process gas onto the surface of thesubstrate 108. In one example, the material deposited onto the substrate may be a group III, group IV, and/or group V material, or may be a material including a group III, group IV, and/or group V dopant. For example, the deposited material may include gallium arsenide, gallium nitride, or aluminum gallium nitride. The lamps may be adapted to heat the substrate to a temperature within a range of about 300 degrees Celsius to about 1200 degrees Celsius, such as about 300 degrees Celsius to about 950 degrees Celsius. - Although
FIG. 1 illustrates one embodiment of a process chamber, additional embodiments are also contemplated. For example, in another embodiment, it is contemplated that thesubstrate support 106 may be formed from an optically transparent material, such as quartz, to allow for direct heating of thesubstrate 108. In yet another embodiment, it is contemplated that an optionalcircular shield 139 may be disposed around thesubstrate support 106 and coupled to a sidewall of thechamber body 101. In another embodiment, the processgas supply source 132 may be adapted to supply multiple types of process gases, for example, a group III precursor gas and a group V precursor gas. The multiple process gases may be introduced into the chamber through the sameprocess gas inlet 134, or through differentprocess gas inlets 134. Additionally, it is also contemplated that the size, width, and/or number ofgas inlets gas outlets substrate 108. - In another embodiment, the
substrate support 106 may be an annular ring or edge ring having a central opening therethrough, and may be adapted to support the perimeter of thesubstrate 108. In such an embodiment, thesubstrate support 106 may be formed from silicon carbide, silicon-carbide-coated graphite, or glassy-carbon-coated graphite. -
FIG. 2A is a partial sectional schematic view of anupper surface 260 of alamp housing 250A. Thelamp housing 250A is similar tolamp housing 150 and may be used in place thereof. Theupper surface 260 includes features, such asopenings 262, formed therein. Theopenings 262 allow radiant energy from thelamps 142 to pass through theupper surface 260 to impinge upon a substrate or substrate support. Anopening 262 is disposed above each of thelamps 142. In addition to allowing radiant energy to pass therethrough, theopenings 262 induce a turbulent flow within a cooling fluid as the cooling fluid passes between theupper surface 260 and bottom surface of a lower dome, such as opticallytransparent window 104 shown inFIG. 1 . The turbulent flow of the cooling fluid increases thermal coupling between a lower dome and coolingchannels 149 formed within thelamp housing 250A. Thus, thermal energy can quickly be removed from a lower dome, particularly compared to when the lower dome is cooled by stagnant, ambient air. The rapid reduction in the temperature of the lower dome facilitates a reduction in substrate cool down time, because radiant heating of the substrate by the lower dome is decreased. - While a laminar flow of the cooling fluid between the
lamp housing 250A and a lower dome would also remove heat from the lower dome, the turbulent flow increases heat transfer due to convection of the cooling fluid. Because heat transfer through the cooling fluid is increased due to a turbulent flow of the cooling fluid, a cooling fluid with a lower thermal conductivity may be utilized while still providing sufficient cooling. A cooling fluid with a lower thermal conductivity may be desired when such a cooling fluid is cost efficient. One such cost efficient cooling fluid may be atmospheric air. -
FIG. 2A illustrates one embodiment; however, other embodiments are also contemplated. For example, it is contemplated that features other thanopenings 262 may be used in addition to or as an alternative to theopenings 262 to induce a turbulent flow of the cooling fluid. For example, features such as ridges or bumps may be utilized to induce a turbulent flow to a cooling fluid. -
FIG. 2B illustrates an alternative embodiment of a reflector 242A. The reflector 242A is similar toreflector 142A, except that the reflector 242A includes an extended portion 242B that projects above thesurface 260 of the lamp housing. The extended portion 242B of the reflector 242A facilitates increased turbulence of the cooling fluid flowing thereover, thus increasing heat transfer from opticallytransparent window 104 to the lamp housing. It is contemplated that the number of reflectors 242A having an extended portion 242B may be selected to generate the desired turbulence of the cooling fluid, and thus, not each reflector 242A may have an extended portion 242B. However, it is to be understood that more than one reflector may include an extended portion 242B, although only one is shown for clarity. In one example, eachlamp 142 may include a reflector 242A having an extended portion 242B. In some embodiments, it is contemplated that the extended portions 242B may be in contact with a lower surface of the opticallytransparent window 104. In the embodiment shown inFIG. 2B , the extended portion 242B includes a conical section, however, other shapes are also contemplated. -
FIGS. 3A-3C illustrate enlarged schematic views of an upper surface of a lamp housing having additional turbulence inducing features thereon, according to embodiments of the invention.FIG. 3A illustrates anupper surface 360A, which is similar to theupper surface 260. Theupper surface 360A includes a plurality ofridges 380 extending therefrom to facilitate turbulent flow of a cooling fluid as the cooling fluid flows thereover. Theridges 380 may have a length of several millimeters to several centimeters, or more, and a height limited to the spacing between theupper surface 360A and a lower surface of the opticallytransparent window 104. In one embodiment, it is contemplated that theridges 380 may be in contact with the opticallytransparent window 104. -
FIG. 3B illustrates an upper surface 360B, which is similar to theupper surface 260. The upper surface 360B includes a plurality ofbumps 381 extending therefrom to facilitate turbulent flow of a cooling fluid as the cooling fluid flows thereover. Thebumps 381 may have a diameter of a millimeter to several millimeters, or more, and a height limited to the spacing between the upper surface 360B and a lower surface of the opticallytransparent window 104. In one embodiment, it is contemplated that thebumps 381 may be in contact with the opticallytransparent window 104. Additionally, thebumps 381 may be formed by texturing the surface 360B, for example by exposure to an etchant. Alternatively, thebumps 381 may be part of the natural surface roughness of an unpolished or unfinished surface. -
FIG. 3C illustrates anupper surface 360C, which is similar to theupper surface 260. Theupper surface 360C includes one ormore channels 382 formed therein to facilitate turbulent flow of a cooling fluid as the cooling fluid flows thereover. Thechannels 382 may have a length ranging from several millimeters to several centimeters, or more. In one example, achannel 382 may extend continuously around theupper surface 360C. Thechannel 382 may have a depth with a range of about 0.5 millimeters to about 3 millimeters, or more. -
FIGS. 3A-3C illustrate embodiments of turbulence inducing features, however, additional or alternative turbulence inducing features are also contemplated. Also, the sizes of the turbulence inducing features, and the spacing between the opticallytransparent window 104 and the lamp head, may be selected to create a localized recirculation to maximize heat transfer between the opticallytransparent window 104 and the lamp head. - Cooling fluids suitable for use herein generally include one or more highly conductive gases, including helium, hydrogen, and nitrogen. However, additional gases are contemplated. For example, it is contemplated ambient air, filtered ambient air, and clean, dry air (CDA) may also be utilized. Furthermore, it is contemplated that in some embodiments, one or more liquid coolants, such as water or oils, may be utilized.
- Benefits of embodiments described herein include increased cooling of chamber components and substrates. The increased cooling is facilitated by thermally coupling the lower dome to cooling channels disposed within a lamp housing using cooling fluid. The lamp housing includes features that induce a turbulent flow to the cooling fluid, thus increasing heat transfer between the lower dome and the cooling channels within the lamp housing. The increased heat transfer due to the turbulent flow allows a less expensive cooling fluid having a lower heat transfer coefficient to be utilized during processing.
- While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (20)
1. A process chamber, comprising:
a chamber body including an optically transparent window;
a lamp housing disposed adjacent to the optically transparent window and forming a gap therebetween, the lamp housing having an upper surface comprising turbulence-inducing features;
a plurality of lamps disposed within the lamp housing;
one or more cooling channels disposed within the lamp housing; and
a temperature control unit adapted to provide a cooling fluid to the gap between the optically transparent dome and the lamp housing.
2. The process chamber of claim 1 , wherein the turbulence-inducing features include openings formed through the upper surface of the lamp housing.
3. The process chamber of claim 1 , wherein the turbulence-inducing features include one or more channels formed in the upper surface of the lamp housing.
4. The process chamber of claim 1 , wherein the turbulence-inducing features include extended portions of a reflector extending above the upper surface of the lamp housing.
5. The process chamber of claim 1 , wherein the lamp housing comprises copper or aluminum.
6. The process chamber of claim 1 , wherein the temperature control unit includes a heat exchanger.
7. The process chamber of claim 1 , wherein the temperature control unit includes a forced induction unit.
8. The process chamber of claim 1 , wherein the optically transparent window is a lower dome.
9. The process chamber of claim 1 , wherein the optically transparent dome comprises quartz.
10. A method of cooling, comprising:
circulating a cooling fluid to within a space between an optically transparent window and a lamp housing having at least one cooling channel formed therein, wherein a surface of the lamp housing includes one or more turbulence inducing features to cause a turbulent flow of the cooling fluid, and wherein the cooling fluid thermally couples the optically transparent window and the at least one cooling channel.
11. The method of claim 10 , wherein the cooling fluid comprises atmospheric air.
12. The method of claim 10 , wherein the cooling fluid comprises one or more of nitrogen, helium, or hydrogen.
13. The method of claim 10 , wherein the cooling fluid is a liquid.
14. The method of claim 10 , wherein a size of the space between the optically transparent window and the lamp housing is selected to generate localized recirculation of the cooling fluid.
15. The method of claim 10 , wherein forced induction facilitates flow of the cooling fluid between the optically transparent window and the lamp housing.
16. The method of claim 10 , further comprising circulating the cooling fluid through a heat exchanger.
17. A process chamber, comprising:
a chamber body including an optically transparent window;
a lamp housing disposed adjacent to the optically transparent window and forming a gap between the lamp housing and the optically transparent window, the lamp housing having an upper surface comprising turbulence-inducing features selected from the group consisting of:
openings formed through an upper surface of the lamp housing;
one or more channels formed in an upper surface of the lamp housing; and
extended portions of a reflector extending above the upper surface of the lamp housing;
a plurality of lamps disposed within the lamp housing;
one or more cooling channels disposed within the lamp housing; and
a temperature control unit adapted to provide a cooling fluid to the gap between the optically transparent dome and the lamp housing.
18. The process chamber of claim 17 , wherein the temperature control unit includes a heat exchanger.
19. The process chamber of claim 18 , wherein the temperature control unit includes a forced induction unit.
20. The process chamber of claim 19 , wherein the optically transparent window is a lower dome.
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US15/673,801 US20170338135A1 (en) | 2013-03-05 | 2017-08-10 | Thermal coupled quartz dome heat sink |
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US201361772618P | 2013-03-05 | 2013-03-05 | |
US14/175,459 US9748121B2 (en) | 2013-03-05 | 2014-02-07 | Thermal coupled quartz dome heat sink |
US15/673,801 US20170338135A1 (en) | 2013-03-05 | 2017-08-10 | Thermal coupled quartz dome heat sink |
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US14/175,459 Division US9748121B2 (en) | 2013-03-05 | 2014-02-07 | Thermal coupled quartz dome heat sink |
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US15/673,801 Abandoned US20170338135A1 (en) | 2013-03-05 | 2017-08-10 | Thermal coupled quartz dome heat sink |
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KR (1) | KR102244964B1 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024072485A1 (en) * | 2022-09-29 | 2024-04-04 | Applied Materials, Inc. | Dog bone exhaust slit tunnel for processing chambers |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160006778A (en) * | 2013-05-10 | 2016-01-19 | 어플라이드 머티어리얼스, 인코포레이티드 | Dome cooling using compliant material |
US10573498B2 (en) | 2017-01-09 | 2020-02-25 | Applied Materials, Inc. | Substrate processing apparatus including annular lamp assembly |
KR101846509B1 (en) * | 2017-03-29 | 2018-04-09 | (주)앤피에스 | Heater and substrate processing apparatus having the same |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5871811A (en) * | 1986-12-19 | 1999-02-16 | Applied Materials, Inc. | Method for protecting against deposition on a selected region of a substrate |
US5108792A (en) * | 1990-03-09 | 1992-04-28 | Applied Materials, Inc. | Double-dome reactor for semiconductor processing |
US5258824A (en) * | 1990-08-09 | 1993-11-02 | Applied Materials, Inc. | In-situ measurement of a thin film deposited on a wafer |
US5855677A (en) * | 1994-09-30 | 1999-01-05 | Applied Materials, Inc. | Method and apparatus for controlling the temperature of reaction chamber walls |
US5792269A (en) * | 1995-10-31 | 1998-08-11 | Applied Materials, Inc. | Gas distribution for CVD systems |
US5937142A (en) * | 1996-07-11 | 1999-08-10 | Cvc Products, Inc. | Multi-zone illuminator for rapid thermal processing |
US6367410B1 (en) | 1996-12-16 | 2002-04-09 | Applied Materials, Inc. | Closed-loop dome thermal control apparatus for a semiconductor wafer processing system |
US6666924B1 (en) * | 2000-03-28 | 2003-12-23 | Asm America | Reaction chamber with decreased wall deposition |
US6635117B1 (en) * | 2000-04-26 | 2003-10-21 | Axcelis Technologies, Inc. | Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system |
KR101004222B1 (en) * | 2001-02-09 | 2010-12-24 | 도쿄엘렉트론가부시키가이샤 | Film forming device |
JP4236882B2 (en) * | 2001-08-01 | 2009-03-11 | 東京エレクトロン株式会社 | Gas processing apparatus and gas processing method |
US8536492B2 (en) | 2003-10-27 | 2013-09-17 | Applied Materials, Inc. | Processing multilayer semiconductors with multiple heat sources |
US7718225B2 (en) * | 2005-08-17 | 2010-05-18 | Applied Materials, Inc. | Method to control semiconductor film deposition characteristics |
US7691204B2 (en) | 2005-09-30 | 2010-04-06 | Applied Materials, Inc. | Film formation apparatus and methods including temperature and emissivity/pattern compensation |
JP5063995B2 (en) | 2006-11-22 | 2012-10-31 | 大日本スクリーン製造株式会社 | Heat treatment equipment |
US7378618B1 (en) | 2006-12-14 | 2008-05-27 | Applied Materials, Inc. | Rapid conductive cooling using a secondary process plane |
US7969734B2 (en) * | 2007-01-03 | 2011-06-28 | General Electric Company | Unique cooling scheme for advanced thermal management of high flux electronics |
US8057601B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
US8398777B2 (en) | 2008-05-02 | 2013-03-19 | Applied Materials, Inc. | System and method for pedestal adjustment |
US9640412B2 (en) * | 2009-11-20 | 2017-05-02 | Applied Materials, Inc. | Apparatus and method for enhancing the cool down of radiatively heated substrates |
US8910644B2 (en) | 2010-06-18 | 2014-12-16 | Applied Materials, Inc. | Method and apparatus for inducing turbulent flow of a processing chamber cleaning gas |
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2014
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- 2014-02-11 KR KR1020157027313A patent/KR102244964B1/en active IP Right Grant
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024072485A1 (en) * | 2022-09-29 | 2024-04-04 | Applied Materials, Inc. | Dog bone exhaust slit tunnel for processing chambers |
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WO2014137550A3 (en) | 2015-03-05 |
US9748121B2 (en) | 2017-08-29 |
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WO2014137550A2 (en) | 2014-09-12 |
TWI625790B (en) | 2018-06-01 |
CN108486548A (en) | 2018-09-04 |
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