US20170243768A1 - Etching method of glass substrate and wet etching apparatus thereof - Google Patents
Etching method of glass substrate and wet etching apparatus thereof Download PDFInfo
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- US20170243768A1 US20170243768A1 US15/589,923 US201715589923A US2017243768A1 US 20170243768 A1 US20170243768 A1 US 20170243768A1 US 201715589923 A US201715589923 A US 201715589923A US 2017243768 A1 US2017243768 A1 US 2017243768A1
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- tank
- etching apparatus
- wet
- wet etching
- etchant
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
Definitions
- the present invention relates to the field of liquid crystal displays, and more particularly to an etching method of a glass substrate and a wet etching apparatus thereof.
- Liquid crystal display possesses advantages of being ultra thin, power saved and radiation free. It has been widely utilized in for example mobile phones, personal digital assistants (PDAs), digital cameras, laptop screens or notebook screens.
- a manufacturing process of a thin film transistor liquid crystal display generally comprises: an array process of front end, in which a TFT substrate and a CF substrate are manufactured; a cell process in the middle, in which mainly the TFT substrate and the CF substrate are laminated and liquid crystal is filled therebetween for forming a LCD panel; and a module assembly process of back end, in which the LCD panel, a backlight module, a printed circuit board (PCB) and other components are assembled.
- TFT-LCD thin film transistor liquid crystal display
- the front-end array process further comprises: processes of cleaning and drying, film coating, photoresist coating, exposing, developing, etching, stripping and so on for the glass substrate.
- the etching process can be categorized as dry etching and wet etching.
- the wet etching utilizes liquid chemical reagents, i.e. etchants to remove a portion of a thin film that is not covered with photoresist so as to form a desired pattern on the glass substrate.
- FIGS. 1 and 2 which shows a wet etching method of a glass substrate of a TFT-LCD according to the prior art.
- the method mainly comprises: step 1 ′, in which a conveyor 100 transports a glass substrate 200 to be etched into a wet bench 300 , and several baffles 400 rise up to construct a capacity space; step 2 ′, in which an etchant is injected, in a non-stopped manner, into the capacity space constructed by rising up the several baffles 400 via a supply line 500 until the glass substrate 200 to be etched is fully immersed in the etchant.
- the aforesaid method requires first transporting the glass substrate 200 in the wet bench 300 and, then, the etchant is injected to carry out the wet etching.
- the etching process takes extended period of time and is adverse to production efficiency.
- An objective of the present invention is to provide an etching method of a glass substrate, which shortens the etching process time and increases the production efficiency.
- Another objective of the present invention is to provide a wet etching apparatus, which allows an etchant to immerse the glass substrate to be etched in an extremely short period of time so as to be beneficial to raise the production efficiency.
- the structure is simple and easy for achievement.
- the present invention provides an etching method of a glass substrate, comprising the following steps:
- step 1 providing a glass substrate to be etched, a wet bench, etchants and a supply line;
- step 2 setting a tank in the wet bench
- step 3 filling in the tank with a predetermined amount of the etchants through the supply line;
- step 4 delivering the glass substrate to be etched into the wet bench
- step 5 raising the tank until the glass substrate is completely immersed with the etchants in the tank;
- step 6 lowering the tank to expose the glass substrate after reaching a predetermined period of soaking time.
- a material of the tank is PVC.
- the supply line is positioned at one side of the tank for filling the etchants.
- Cylinders are located at two ends of a bottom of the tank to provide power for raising and lowering the tank in steps 5 and 6 .
- the glass substrate to be etched is delivered into the wet bench by a conveyor in step 4 , and the conveyor comprises a plurality of rollers in the wet bench, and the tank surrounds the plurality of rollers, and the rollers are positioned inside the tank after raising the tank in step 5 .
- the glass substrate to be etched is delivered to a predetermined location in the wet bench in step 4 when the predetermined amount of the etchants is filled in the tank in step 3 .
- the glass substrate is a glass substrate employed in a TFT-LCD.
- the present invention further provides a wet etching apparatus, which comprises: a wet bench, a conveyor, a tank, and a supply line, wherein the tank is set in the wet bench; the conveyor comprises a plurality of rollers in the wet bench; the tank surrounds the plurality of rollers; and the supply line is employed for supplying etchants to the tank.
- the present invention further provides a wet etching apparatus, which comprises: a wet bench, a conveyor, a tank, and a supply line, wherein the tank is set in the wet bench; the conveyor comprises a plurality of rollers in the wet bench; the tank surrounds the plurality of rollers; and the supply line is employed for supplying etchants to the tank;
- a material of the tank is PVC
- the wet etching apparatus further comprises cylinders located at two ends of a bottom of the tank to provide power for raising and lowering the tank.
- the benefits of the present invention are that in the etching method of the glass substrate according to the present invention, a tank is set in the wet bench. A predetermined amount of the etchants is filled in the tank before the glass substrate is delivered into the wet bench. The tank is raised by the cylinders right after the glass substrate is delivered into the wet bench and the glass substrate is completely immersed with the etchants in an extremely short period of time. It is capable of shortening the etching process time and raising the production efficiency.
- the wet etching apparatus of the present invention with the tank set in the wet bench and cylinders located at two ends of a bottom of the tank, quickly raising and lowering the tank can be realized by the cylinders. It allows the etchants to immerse the glass substrate in an extremely short period of time and this is beneficial to raise the production efficiency.
- the structure is simple and easy for achievement.
- FIG. 1 is a schematic view illustrating step 1 ′ of a conventional wet etching method of a glass substrate
- FIG. 2 is a schematic view illustrating step 2 ′ of the conventional wet etching method of a glass substrate
- FIG. 3 is a flowchart illustrating an etching method of a glass substrate according to the present invention
- FIG. 4 is a schematic view showing a wet etching apparatus of a glass substrate according to the present invention.
- FIG. 5 is a schematic view illustrating step 4 of the etching method of a glass substrate according to the present invention.
- FIG. 6 is a schematic view illustrating step 5 of the etching method of a glass substrate according to the present invention.
- the present invention provides an etching method of a glass substrate, which comprises the following steps:
- Step 1 providing a glass substrate 1 to be etched, a wet bench 3 , etchants 6 , and a supply line 7 ;
- Step 2 setting a tank 9 in the wet bench 3 ;
- Step 3 filling in the tank 9 with a predetermined amount of the etchants 6 through the supply line 7 ;
- Step 4 delivering the glass substrate 1 to be etched into the wet bench 3 ;
- Step 5 raising the tank 9 until the glass substrate 1 is completely immersed with the etchants 6 in the tank 9 ;
- Step 6 lowering the tank 9 to expose the glass substrate 1 after reaching a predetermined soaking time.
- the glass substrate 1 in Step 1 is a glass substrate employed in a thin film transistor liquid crystal display (TFT-LCD).
- the supply line 7 has one end located in the wet bench 3 and an opposite end inserted in the etchants stored in the apparatus (not shown) for supplying the etchants 6 to the tank 9 in the flowing Step 3
- the tank 9 is set in the wet bench 3 .
- the tank 9 is employed for filling up the etchants 6 for carrying out wet etching to the glass substrate 1 and is made by a corrosion resistant material.
- the material of the tank 9 is PVC.
- cylinders 11 are located at two ends of a bottom of the tank 9 to provide power for raising and lowering the tank 9 in the following Steps 5 and 6 .
- Step 3 the tank 9 is filled with a predetermined amount of the etchants 6 through the supply line 7 .
- the supply line 7 is positioned at one side of the tank 9 for filling the etchants 6 .
- the predetermined amount of the etchants 6 can guarantee the glass substrate 1 to be completely immersed in the following Step 5 .
- Step 4 is carried out, namely the glass substrate 1 to be etched is delivered to a predetermined location in the wet bench 3 .
- the glass substrate 1 to be etched is delivered into the wet bench 3 by a conveyor 13 .
- the conveyor 13 comprises a plurality of rollers 131 in the wet bench 3 , and the tank 9 surrounds the plurality of rollers 131 .
- the rollers 131 are arranged in parallel at the up/down sides of the glass substrate 1 . Under this condition, the tank 9 containing the predetermined amount of the etchants 6 is located below the glass substrate 1 to be etched.
- Step 5 the tank 9 is raised until the glass substrate 1 is completely immersed with the etchants 6 in the tank 9 .
- the rollers 131 are immersed in the etchants, too. This process can be done in an extremely short period of time, and therefore, the glass substrate 1 can be completely immersed in the etchants in an extremely short period of time. The helps shorten the etching process time and raise the production efficiency.
- Step 6 is performed. With the cylinders 11 , the tank 9 is lowered to expose the glass substrate 1 for completing the etching to the glass substrate 1 .
- the cylinders 11 make the etchants 6 separate from the glass substrate quickly in order to allow for faster entry to the next operation thereby raising efficiency.
- the present invention further provides a wet etching apparatus of a glass substrate, which comprises a wet bench 3 , a conveyor 13 , a tank 9 , and a supply line 7 .
- the tank 9 is employed for containing the etchants 6 and is set in the wet bench 3 . Meanwhile, the tank 9 can be raised and lowered in the wet bench 3 .
- the conveyor 13 is employed for delivering the glass substrate 1 to a predetermined location in the wet bench 3 .
- the conveyor 13 comprises a plurality of rollers 131 in the wet bench 3 .
- the rollers 131 are arranged in parallel at the up/down sides of the glass substrate 1 .
- the tank 9 surrounds the plurality of rollers 131 .
- the supply line 7 is positioned at one side of the tank 9 for aiming the tank 9 to supply the etchants 6 to the tank 9 .
- a material of the tanks 9 is PVC, which is resistant to corrosion.
- the wet etching apparatus of the glass substrate further comprises cylinders 11 , which are located at two ends of a bottom of the tank 9 to provide power for raising and lowering the tank 9 .
- the tank 9 is at a low level in the wet bench 3 , and the tank 9 is filled with a predetermined amount of the etchants 6 through the supply line 7 ; and after the conveyor 13 delivers the glass substrate 1 to a predetermined location in the wet bench 3 , the cylinders 11 drive and raise up the tank 9 quickly. This allows the etchants 6 in the tank 9 to immerse the glass substrate 1 in an extremely short period of time. After predetermined soaking time has reached, the cylinders 11 drive the tank 9 again to lower down the tank 9 to the original location.
- a tank is set in the wet bench.
- a predetermined amount of the etchants is filled in the tank before the glass substrate is delivered into the wet bench.
- the tank is raised by the cylinders right after the glass substrate is delivered into the wet bench and the glass substrate is completely immersed with the etchants in an extremely short period of time. This helps shorten the etching process time and raise the production efficiency.
- the wet etching apparatus of the present invention with the tank set in the wet bench and cylinders located at two ends of a bottom of the tank, quickly raising and lowering the tank can be realized by the cylinders. This allows the etchants to immerse the glass substrate in an extremely short period of time and this is beneficial to raise the production efficiency.
- the structure is simple and easy for achievement.
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- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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Abstract
Description
- This is a divisional application of co-pending U.S. patent application Ser. No. 14/381,984, filed on Aug. 28, 2014, which is a national stage of PCT Application Number PCT/CN2014/082131, filed on Jul. 14, 2014, claiming foreign priority of Chinese Patent Application Number 201410298834.5, filed on Jun. 26, 2014.
- The present invention relates to the field of liquid crystal displays, and more particularly to an etching method of a glass substrate and a wet etching apparatus thereof.
- Liquid crystal display (LCD) possesses advantages of being ultra thin, power saved and radiation free. It has been widely utilized in for example mobile phones, personal digital assistants (PDAs), digital cameras, laptop screens or notebook screens.
- A thin film transistor liquid crystal display generally comprises a shell, a LCD panel located in the shell and a backlight module located in the shell. Particularly, a structure of the LCD panel comprises a thin film transistor (TFT) array substrate, a color filter (CF) substrate, and a liquid crystal layer. The working principle is that light from a backlight module is refracted to generate images by applying driving voltages to the two glass substrates for controlling the rotation of the liquid crystal molecules.
- A manufacturing process of a thin film transistor liquid crystal display (TFT-LCD) generally comprises: an array process of front end, in which a TFT substrate and a CF substrate are manufactured; a cell process in the middle, in which mainly the TFT substrate and the CF substrate are laminated and liquid crystal is filled therebetween for forming a LCD panel; and a module assembly process of back end, in which the LCD panel, a backlight module, a printed circuit board (PCB) and other components are assembled.
- The front-end array process further comprises: processes of cleaning and drying, film coating, photoresist coating, exposing, developing, etching, stripping and so on for the glass substrate. The etching process can be categorized as dry etching and wet etching. The wet etching utilizes liquid chemical reagents, i.e. etchants to remove a portion of a thin film that is not covered with photoresist so as to form a desired pattern on the glass substrate.
- In the prior art, two methods of spraying and soaking for carrying out wet etching to the glass substrate of the TFT-LCD are known. Soaking means to completely immerse the glass substrate in the etchants for proceeding etching. Referring to
FIGS. 1 and 2 , which shows a wet etching method of a glass substrate of a TFT-LCD according to the prior art. The method mainly comprises:step 1′, in which aconveyor 100 transports aglass substrate 200 to be etched into awet bench 300, andseveral baffles 400 rise up to construct a capacity space;step 2′, in which an etchant is injected, in a non-stopped manner, into the capacity space constructed by rising up theseveral baffles 400 via asupply line 500 until theglass substrate 200 to be etched is fully immersed in the etchant. The aforesaid method requires first transporting theglass substrate 200 in thewet bench 300 and, then, the etchant is injected to carry out the wet etching. The etching process takes extended period of time and is adverse to production efficiency. - An objective of the present invention is to provide an etching method of a glass substrate, which shortens the etching process time and increases the production efficiency.
- Another objective of the present invention is to provide a wet etching apparatus, which allows an etchant to immerse the glass substrate to be etched in an extremely short period of time so as to be beneficial to raise the production efficiency. The structure is simple and easy for achievement.
- For realizing the aforesaid objectives, the present invention provides an etching method of a glass substrate, comprising the following steps:
-
step 1, providing a glass substrate to be etched, a wet bench, etchants and a supply line; -
step 2, setting a tank in the wet bench; -
step 3, filling in the tank with a predetermined amount of the etchants through the supply line; -
step 4, delivering the glass substrate to be etched into the wet bench; -
step 5, raising the tank until the glass substrate is completely immersed with the etchants in the tank; and -
step 6, lowering the tank to expose the glass substrate after reaching a predetermined period of soaking time. - A material of the tank is PVC.
- The supply line is positioned at one side of the tank for filling the etchants.
- Cylinders are located at two ends of a bottom of the tank to provide power for raising and lowering the tank in
steps - The glass substrate to be etched is delivered into the wet bench by a conveyor in
step 4, and the conveyor comprises a plurality of rollers in the wet bench, and the tank surrounds the plurality of rollers, and the rollers are positioned inside the tank after raising the tank instep 5. - The glass substrate to be etched is delivered to a predetermined location in the wet bench in
step 4 when the predetermined amount of the etchants is filled in the tank instep 3. - The glass substrate is a glass substrate employed in a TFT-LCD.
- The present invention further provides a wet etching apparatus, which comprises: a wet bench, a conveyor, a tank, and a supply line, wherein the tank is set in the wet bench; the conveyor comprises a plurality of rollers in the wet bench; the tank surrounds the plurality of rollers; and the supply line is employed for supplying etchants to the tank.
- In the wet etching apparatus, a material of the tank is PVC.
- The wet etching apparatus further comprises cylinders located at two ends of a bottom of the tank to provide power for raising and lowering the tank.
- The present invention further provides a wet etching apparatus, which comprises: a wet bench, a conveyor, a tank, and a supply line, wherein the tank is set in the wet bench; the conveyor comprises a plurality of rollers in the wet bench; the tank surrounds the plurality of rollers; and the supply line is employed for supplying etchants to the tank;
- wherein a material of the tank is PVC; and
- wherein the wet etching apparatus further comprises cylinders located at two ends of a bottom of the tank to provide power for raising and lowering the tank.
- The benefits of the present invention are that in the etching method of the glass substrate according to the present invention, a tank is set in the wet bench. A predetermined amount of the etchants is filled in the tank before the glass substrate is delivered into the wet bench. The tank is raised by the cylinders right after the glass substrate is delivered into the wet bench and the glass substrate is completely immersed with the etchants in an extremely short period of time. It is capable of shortening the etching process time and raising the production efficiency. In the wet etching apparatus of the present invention, with the tank set in the wet bench and cylinders located at two ends of a bottom of the tank, quickly raising and lowering the tank can be realized by the cylinders. It allows the etchants to immerse the glass substrate in an extremely short period of time and this is beneficial to raise the production efficiency. The structure is simple and easy for achievement.
- In order to better understand the characteristics and technical aspect of the invention, reference is made to the following detailed description of the present invention with reference to the attached drawings, which are provided for the purpose of illustration, not intended to be limiting of the invention.
- The technical solution, as well as beneficial advantages, of the present invention will be apparent from the following detailed description of an embodiment of the present invention, with reference to the attached drawings.
- In drawings,
-
FIG. 1 is a schematicview illustrating step 1′ of a conventional wet etching method of a glass substrate; -
FIG. 2 is a schematicview illustrating step 2′ of the conventional wet etching method of a glass substrate; -
FIG. 3 is a flowchart illustrating an etching method of a glass substrate according to the present invention; -
FIG. 4 is a schematic view showing a wet etching apparatus of a glass substrate according to the present invention; -
FIG. 5 is a schematicview illustrating step 4 of the etching method of a glass substrate according to the present invention; and -
FIG. 6 is a schematicview illustrating step 5 of the etching method of a glass substrate according to the present invention. - Embodiments of the present invention will be described in detail for illustration of the technical matters, structural features, achieved objects, and effects with reference to the accompanying drawings.
- Referring to
FIGS. 3-6 , the present invention provides an etching method of a glass substrate, which comprises the following steps: - Step 1: providing a
glass substrate 1 to be etched, awet bench 3,etchants 6, and asupply line 7; - Step 2: setting a
tank 9 in thewet bench 3; - Step 3: filling in the
tank 9 with a predetermined amount of theetchants 6 through thesupply line 7; - Step 4: delivering the
glass substrate 1 to be etched into thewet bench 3; - Step 5: raising the
tank 9 until theglass substrate 1 is completely immersed with theetchants 6 in thetank 9; and - Step 6: lowering the
tank 9 to expose theglass substrate 1 after reaching a predetermined soaking time. - Specifically, the
glass substrate 1 inStep 1 is a glass substrate employed in a thin film transistor liquid crystal display (TFT-LCD). Thesupply line 7 has one end located in thewet bench 3 and an opposite end inserted in the etchants stored in the apparatus (not shown) for supplying theetchants 6 to thetank 9 in the flowingStep 3 - In
Step 2, thetank 9 is set in thewet bench 3. Thetank 9 is employed for filling up theetchants 6 for carrying out wet etching to theglass substrate 1 and is made by a corrosion resistant material. Preferably, the material of thetank 9 is PVC. Significantly,cylinders 11 are located at two ends of a bottom of thetank 9 to provide power for raising and lowering thetank 9 in the followingSteps - In
Step 3, thetank 9 is filled with a predetermined amount of theetchants 6 through thesupply line 7. Thesupply line 7 is positioned at one side of thetank 9 for filling theetchants 6. The predetermined amount of theetchants 6 can guarantee theglass substrate 1 to be completely immersed in thefollowing Step 5. - After the predetermined amount of the
etchants 6 is filled in thetank 9 inStep 3,Step 4 is carried out, namely theglass substrate 1 to be etched is delivered to a predetermined location in thewet bench 3. InStep 4, theglass substrate 1 to be etched is delivered into thewet bench 3 by aconveyor 13. Theconveyor 13 comprises a plurality ofrollers 131 in thewet bench 3, and thetank 9 surrounds the plurality ofrollers 131. Moreover, therollers 131 are arranged in parallel at the up/down sides of theglass substrate 1. Under this condition, thetank 9 containing the predetermined amount of theetchants 6 is located below theglass substrate 1 to be etched. - In
Step 5, thetank 9 is raised until theglass substrate 1 is completely immersed with theetchants 6 in thetank 9. Correspondingly, therollers 131 are immersed in the etchants, too. This process can be done in an extremely short period of time, and therefore, theglass substrate 1 can be completely immersed in the etchants in an extremely short period of time. The helps shorten the etching process time and raise the production efficiency. - After the predetermined soaking time is reached,
Step 6 is performed. With thecylinders 11, thetank 9 is lowered to expose theglass substrate 1 for completing the etching to theglass substrate 1. Thecylinders 11 make theetchants 6 separate from the glass substrate quickly in order to allow for faster entry to the next operation thereby raising efficiency. - Referring to
FIG. 4 , the present invention further provides a wet etching apparatus of a glass substrate, which comprises awet bench 3, aconveyor 13, atank 9, and asupply line 7. - The
tank 9 is employed for containing theetchants 6 and is set in thewet bench 3. Meanwhile, thetank 9 can be raised and lowered in thewet bench 3. Theconveyor 13 is employed for delivering theglass substrate 1 to a predetermined location in thewet bench 3. Theconveyor 13 comprises a plurality ofrollers 131 in thewet bench 3. Therollers 131 are arranged in parallel at the up/down sides of theglass substrate 1. Thetank 9 surrounds the plurality ofrollers 131. Thesupply line 7 is positioned at one side of thetank 9 for aiming thetank 9 to supply theetchants 6 to thetank 9. - A material of the
tanks 9 is PVC, which is resistant to corrosion. - Specifically, the wet etching apparatus of the glass substrate further comprises
cylinders 11, which are located at two ends of a bottom of thetank 9 to provide power for raising and lowering thetank 9. Before theglass substrate 1 is delivered into thewet bench 3, thetank 9 is at a low level in thewet bench 3, and thetank 9 is filled with a predetermined amount of theetchants 6 through thesupply line 7; and after theconveyor 13 delivers theglass substrate 1 to a predetermined location in thewet bench 3, thecylinders 11 drive and raise up thetank 9 quickly. This allows theetchants 6 in thetank 9 to immerse theglass substrate 1 in an extremely short period of time. After predetermined soaking time has reached, thecylinders 11 drive thetank 9 again to lower down thetank 9 to the original location. - In conclusion, in the etching method of the glass substrate according to the present invention, a tank is set in the wet bench. A predetermined amount of the etchants is filled in the tank before the glass substrate is delivered into the wet bench. The tank is raised by the cylinders right after the glass substrate is delivered into the wet bench and the glass substrate is completely immersed with the etchants in an extremely short period of time. This helps shorten the etching process time and raise the production efficiency. In the wet etching apparatus of the present invention, with the tank set in the wet bench and cylinders located at two ends of a bottom of the tank, quickly raising and lowering the tank can be realized by the cylinders. This allows the etchants to immerse the glass substrate in an extremely short period of time and this is beneficial to raise the production efficiency. The structure is simple and easy for achievement.
- Above are only specific embodiments of the present invention, the scope of the present invention is not limited to this, and to any persons who are skilled in the art, change or replacement which is easily derived should be covered by the protected scope of the invention. Thus, the protected scope of the invention should go by the subject claims.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US15/589,923 US20170243768A1 (en) | 2014-06-26 | 2017-05-08 | Etching method of glass substrate and wet etching apparatus thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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CN201410298834.5 | 2014-06-26 | ||
CN201410298834.5A CN104045242B (en) | 2014-06-26 | 2014-06-26 | The engraving method of glass substrate and etching infuser device |
US14/381,984 US9676661B2 (en) | 2014-06-26 | 2014-07-14 | Etching method of glass substrate and wet etching apparatus thereof |
US15/589,923 US20170243768A1 (en) | 2014-06-26 | 2017-05-08 | Etching method of glass substrate and wet etching apparatus thereof |
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Application Number | Title | Priority Date | Filing Date |
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US14/381,984 Division US9676661B2 (en) | 2014-06-26 | 2014-07-14 | Etching method of glass substrate and wet etching apparatus thereof |
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US20170243768A1 true US20170243768A1 (en) | 2017-08-24 |
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US14/381,984 Active 2035-07-13 US9676661B2 (en) | 2014-06-26 | 2014-07-14 | Etching method of glass substrate and wet etching apparatus thereof |
US15/589,923 Abandoned US20170243768A1 (en) | 2014-06-26 | 2017-05-08 | Etching method of glass substrate and wet etching apparatus thereof |
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US14/381,984 Active 2035-07-13 US9676661B2 (en) | 2014-06-26 | 2014-07-14 | Etching method of glass substrate and wet etching apparatus thereof |
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US (2) | US9676661B2 (en) |
CN (1) | CN104045242B (en) |
WO (1) | WO2015196520A1 (en) |
Families Citing this family (5)
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CN104091775B (en) * | 2014-07-22 | 2017-02-15 | 深圳市华星光电技术有限公司 | wet etching device and etching method thereof |
CN107123621A (en) * | 2017-05-10 | 2017-09-01 | 京东方科技集团股份有限公司 | A kind of OLED touch-control display panels and preparation method thereof, touch control display apparatus |
CN107564840B (en) * | 2017-08-01 | 2020-11-24 | 深圳市华星光电技术有限公司 | Immersion etching equipment and immersion etching method |
CN112521008A (en) * | 2020-12-30 | 2021-03-19 | 浙江靖和光电科技股份有限公司 | Glass rod processing technology |
CN115925272A (en) * | 2022-12-07 | 2023-04-07 | 蚌埠中光电科技有限公司 | Chemical treatment process used before grinding of TFT-LCD glass substrate |
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- 2014-07-14 US US14/381,984 patent/US9676661B2/en active Active
- 2014-07-14 WO PCT/CN2014/082131 patent/WO2015196520A1/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
US9676661B2 (en) | 2017-06-13 |
CN104045242A (en) | 2014-09-17 |
WO2015196520A1 (en) | 2015-12-30 |
US20160236973A1 (en) | 2016-08-18 |
CN104045242B (en) | 2016-02-24 |
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