US20170243768A1

US20170243768A1 - Etching method of glass substrate and wet etching apparatus thereof

Info

Publication number: US20170243768A1
Application number: US15/589,923
Authority: US
Inventors: Jia Li
Original assignee: Shenzhen China Star Optoelectronics Technology Co Ltd
Current assignee: TCL China Star Optoelectronics Technology Co Ltd
Priority date: 2014-06-26
Filing date: 2017-05-08
Publication date: 2017-08-24
Also published as: US9676661B2; CN104045242A; WO2015196520A1; US20160236973A1; CN104045242B

Abstract

A wet etching apparatus includes a wet bench; a tank, which is set in the wet bench and is movable in the wet bench in an upper position and a lower position; a conveyor, which includes a plurality of rollers arranged in the wet bench in such a way that the tank surrounds the plurality of rollers; and a supply line, which supplies an etchant into the tank located in the lower position. The tank is movable by cylinders arranged at two ends of a bottom of the tank to selectively move the tank between a lower position and an upper position. The rollers of the conveyor convey a substrate into the tank such that when the tank is moved to the upper position, the etchant supplied into to tank is raised to completely cover the substrate so as to have the substrate completely immersed in the etchant.

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of co-pending U.S. patent application Ser. No. 14/381,984, filed on Aug. 28, 2014, which is a national stage of PCT Application Number PCT/CN2014/082131, filed on Jul. 14, 2014, claiming foreign priority of Chinese Patent Application Number 201410298834.5, filed on Jun. 26, 2014.

FIELD OF THE INVENTION

The present invention relates to the field of liquid crystal displays, and more particularly to an etching method of a glass substrate and a wet etching apparatus thereof.

BACKGROUND OF THE INVENTION

Liquid crystal display (LCD) possesses advantages of being ultra thin, power saved and radiation free. It has been widely utilized in for example mobile phones, personal digital assistants (PDAs), digital cameras, laptop screens or notebook screens.
A thin film transistor liquid crystal display generally comprises a shell, a LCD panel located in the shell and a backlight module located in the shell. Particularly, a structure of the LCD panel comprises a thin film transistor (TFT) array substrate, a color filter (CF) substrate, and a liquid crystal layer. The working principle is that light from a backlight module is refracted to generate images by applying driving voltages to the two glass substrates for controlling the rotation of the liquid crystal molecules.
A manufacturing process of a thin film transistor liquid crystal display (TFT-LCD) generally comprises: an array process of front end, in which a TFT substrate and a CF substrate are manufactured; a cell process in the middle, in which mainly the TFT substrate and the CF substrate are laminated and liquid crystal is filled therebetween for forming a LCD panel; and a module assembly process of back end, in which the LCD panel, a backlight module, a printed circuit board (PCB) and other components are assembled.
The front-end array process further comprises: processes of cleaning and drying, film coating, photoresist coating, exposing, developing, etching, stripping and so on for the glass substrate. The etching process can be categorized as dry etching and wet etching. The wet etching utilizes liquid chemical reagents, i.e. etchants to remove a portion of a thin film that is not covered with photoresist so as to form a desired pattern on the glass substrate.
In the prior art, two methods of spraying and soaking for carrying out wet etching to the glass substrate of the TFT-LCD are known. Soaking means to completely immerse the glass substrate in the etchants for proceeding etching. Referring to FIGS. 1 and 2, which shows a wet etching method of a glass substrate of a TFT-LCD according to the prior art. The method mainly comprises: step 1′, in which a conveyor 100 transports a glass substrate 200 to be etched into a wet bench 300, and several baffles 400 rise up to construct a capacity space; step 2′, in which an etchant is injected, in a non-stopped manner, into the capacity space constructed by rising up the several baffles 400 via a supply line 500 until the glass substrate 200 to be etched is fully immersed in the etchant. The aforesaid method requires first transporting the glass substrate 200 in the wet bench 300 and, then, the etchant is injected to carry out the wet etching. The etching process takes extended period of time and is adverse to production efficiency.

SUMMARY OF THE INVENTION

An objective of the present invention is to provide an etching method of a glass substrate, which shortens the etching process time and increases the production efficiency.
Another objective of the present invention is to provide a wet etching apparatus, which allows an etchant to immerse the glass substrate to be etched in an extremely short period of time so as to be beneficial to raise the production efficiency. The structure is simple and easy for achievement.
For realizing the aforesaid objectives, the present invention provides an etching method of a glass substrate, comprising the following steps:
step 1, providing a glass substrate to be etched, a wet bench, etchants and a supply line;
step 2, setting a tank in the wet bench;
step 3, filling in the tank with a predetermined amount of the etchants through the supply line;
step 4, delivering the glass substrate to be etched into the wet bench;
step 5, raising the tank until the glass substrate is completely immersed with the etchants in the tank; and
step 6, lowering the tank to expose the glass substrate after reaching a predetermined period of soaking time.
A material of the tank is PVC.
The supply line is positioned at one side of the tank for filling the etchants.
Cylinders are located at two ends of a bottom of the tank to provide power for raising and lowering the tank in steps 5 and 6.
The glass substrate to be etched is delivered into the wet bench by a conveyor in step 4, and the conveyor comprises a plurality of rollers in the wet bench, and the tank surrounds the plurality of rollers, and the rollers are positioned inside the tank after raising the tank in step 5.
The glass substrate to be etched is delivered to a predetermined location in the wet bench in step 4 when the predetermined amount of the etchants is filled in the tank in step 3.
The glass substrate is a glass substrate employed in a TFT-LCD.
The present invention further provides a wet etching apparatus, which comprises: a wet bench, a conveyor, a tank, and a supply line, wherein the tank is set in the wet bench; the conveyor comprises a plurality of rollers in the wet bench; the tank surrounds the plurality of rollers; and the supply line is employed for supplying etchants to the tank.
In the wet etching apparatus, a material of the tank is PVC.
The wet etching apparatus further comprises cylinders located at two ends of a bottom of the tank to provide power for raising and lowering the tank.
The present invention further provides a wet etching apparatus, which comprises: a wet bench, a conveyor, a tank, and a supply line, wherein the tank is set in the wet bench; the conveyor comprises a plurality of rollers in the wet bench; the tank surrounds the plurality of rollers; and the supply line is employed for supplying etchants to the tank;
wherein a material of the tank is PVC; and
wherein the wet etching apparatus further comprises cylinders located at two ends of a bottom of the tank to provide power for raising and lowering the tank.
The benefits of the present invention are that in the etching method of the glass substrate according to the present invention, a tank is set in the wet bench. A predetermined amount of the etchants is filled in the tank before the glass substrate is delivered into the wet bench. The tank is raised by the cylinders right after the glass substrate is delivered into the wet bench and the glass substrate is completely immersed with the etchants in an extremely short period of time. It is capable of shortening the etching process time and raising the production efficiency. In the wet etching apparatus of the present invention, with the tank set in the wet bench and cylinders located at two ends of a bottom of the tank, quickly raising and lowering the tank can be realized by the cylinders. It allows the etchants to immerse the glass substrate in an extremely short period of time and this is beneficial to raise the production efficiency. The structure is simple and easy for achievement.
In order to better understand the characteristics and technical aspect of the invention, reference is made to the following detailed description of the present invention with reference to the attached drawings, which are provided for the purpose of illustration, not intended to be limiting of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The technical solution, as well as beneficial advantages, of the present invention will be apparent from the following detailed description of an embodiment of the present invention, with reference to the attached drawings.

In drawings,

FIG. 1 is a schematic view illustrating step 1′ of a conventional wet etching method of a glass substrate;

FIG. 2 is a schematic view illustrating step 2′ of the conventional wet etching method of a glass substrate;

FIG. 3 is a flowchart illustrating an etching method of a glass substrate according to the present invention;

FIG. 4 is a schematic view showing a wet etching apparatus of a glass substrate according to the present invention;

FIG. 5 is a schematic view illustrating step 4 of the etching method of a glass substrate according to the present invention; and

FIG. 6 is a schematic view illustrating step 5 of the etching method of a glass substrate according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Embodiments of the present invention will be described in detail for illustration of the technical matters, structural features, achieved objects, and effects with reference to the accompanying drawings.
Referring to FIGS. 3-6, the present invention provides an etching method of a glass substrate, which comprises the following steps:
Step 1: providing a glass substrate 1 to be etched, a wet bench 3, etchants 6, and a supply line 7;
Step 2: setting a tank 9 in the wet bench 3;
Step 3: filling in the tank 9 with a predetermined amount of the etchants 6 through the supply line 7;
Step 4: delivering the glass substrate 1 to be etched into the wet bench 3;
Step 5: raising the tank 9 until the glass substrate 1 is completely immersed with the etchants 6 in the tank 9; and
Step 6: lowering the tank 9 to expose the glass substrate 1 after reaching a predetermined soaking time.
Specifically, the glass substrate 1 in Step 1 is a glass substrate employed in a thin film transistor liquid crystal display (TFT-LCD). The supply line 7 has one end located in the wet bench 3 and an opposite end inserted in the etchants stored in the apparatus (not shown) for supplying the etchants 6 to the tank 9 in the flowing Step 3
In Step 2, the tank 9 is set in the wet bench 3. The tank 9 is employed for filling up the etchants 6 for carrying out wet etching to the glass substrate 1 and is made by a corrosion resistant material. Preferably, the material of the tank 9 is PVC. Significantly, cylinders 11 are located at two ends of a bottom of the tank 9 to provide power for raising and lowering the tank 9 in the following Steps 5 and 6.
In Step 3, the tank 9 is filled with a predetermined amount of the etchants 6 through the supply line 7. The supply line 7 is positioned at one side of the tank 9 for filling the etchants 6. The predetermined amount of the etchants 6 can guarantee the glass substrate 1 to be completely immersed in the following Step 5.
After the predetermined amount of the etchants 6 is filled in the tank 9 in Step 3, Step 4 is carried out, namely the glass substrate 1 to be etched is delivered to a predetermined location in the wet bench 3. In Step 4, the glass substrate 1 to be etched is delivered into the wet bench 3 by a conveyor 13. The conveyor 13 comprises a plurality of rollers 131 in the wet bench 3, and the tank 9 surrounds the plurality of rollers 131. Moreover, the rollers 131 are arranged in parallel at the up/down sides of the glass substrate 1. Under this condition, the tank 9 containing the predetermined amount of the etchants 6 is located below the glass substrate 1 to be etched.
In Step 5, the tank 9 is raised until the glass substrate 1 is completely immersed with the etchants 6 in the tank 9. Correspondingly, the rollers 131 are immersed in the etchants, too. This process can be done in an extremely short period of time, and therefore, the glass substrate 1 can be completely immersed in the etchants in an extremely short period of time. The helps shorten the etching process time and raise the production efficiency.
After the predetermined soaking time is reached, Step 6 is performed. With the cylinders 11, the tank 9 is lowered to expose the glass substrate 1 for completing the etching to the glass substrate 1. The cylinders 11 make the etchants 6 separate from the glass substrate quickly in order to allow for faster entry to the next operation thereby raising efficiency.
Referring to FIG. 4, the present invention further provides a wet etching apparatus of a glass substrate, which comprises a wet bench 3, a conveyor 13, a tank 9, and a supply line 7.
The tank 9 is employed for containing the etchants 6 and is set in the wet bench 3. Meanwhile, the tank 9 can be raised and lowered in the wet bench 3. The conveyor 13 is employed for delivering the glass substrate 1 to a predetermined location in the wet bench 3. The conveyor 13 comprises a plurality of rollers 131 in the wet bench 3. The rollers 131 are arranged in parallel at the up/down sides of the glass substrate 1. The tank 9 surrounds the plurality of rollers 131. The supply line 7 is positioned at one side of the tank 9 for aiming the tank 9 to supply the etchants 6 to the tank 9.
A material of the tanks 9 is PVC, which is resistant to corrosion.
Specifically, the wet etching apparatus of the glass substrate further comprises cylinders 11, which are located at two ends of a bottom of the tank 9 to provide power for raising and lowering the tank 9. Before the glass substrate 1 is delivered into the wet bench 3, the tank 9 is at a low level in the wet bench 3, and the tank 9 is filled with a predetermined amount of the etchants 6 through the supply line 7; and after the conveyor 13 delivers the glass substrate 1 to a predetermined location in the wet bench 3, the cylinders 11 drive and raise up the tank 9 quickly. This allows the etchants 6 in the tank 9 to immerse the glass substrate 1 in an extremely short period of time. After predetermined soaking time has reached, the cylinders 11 drive the tank 9 again to lower down the tank 9 to the original location.
In conclusion, in the etching method of the glass substrate according to the present invention, a tank is set in the wet bench. A predetermined amount of the etchants is filled in the tank before the glass substrate is delivered into the wet bench. The tank is raised by the cylinders right after the glass substrate is delivered into the wet bench and the glass substrate is completely immersed with the etchants in an extremely short period of time. This helps shorten the etching process time and raise the production efficiency. In the wet etching apparatus of the present invention, with the tank set in the wet bench and cylinders located at two ends of a bottom of the tank, quickly raising and lowering the tank can be realized by the cylinders. This allows the etchants to immerse the glass substrate in an extremely short period of time and this is beneficial to raise the production efficiency. The structure is simple and easy for achievement.
Above are only specific embodiments of the present invention, the scope of the present invention is not limited to this, and to any persons who are skilled in the art, change or replacement which is easily derived should be covered by the protected scope of the invention. Thus, the protected scope of the invention should go by the subject claims.

Claims

What is claimed is:

1. A wet etching apparatus, comprising:

a wet bench;

a tank, which is set in the wet bench and is movable in the wet bench in an upper position and a lower position;

a conveyor, which comprises a plurality of rollers arranged in the wet bench in such a way that the tank surrounds the plurality of rollers; and

a supply line, which supplies an etchant into the tank located in the lower position;

wherein the tank is movable from the lower position to the upper position to raise the etchant supplied into to the tank.

2. The wet etching apparatus according to claim 1, wherein the tank is made of a corrosion resistant material.

3. The wet etching apparatus according to claim 2, wherein the material that makes the tank comprises PVC.

4. The wet etching apparatus according to claim 1 further comprising a driving device that is operatively coupled to the tank and is operable to move the tank between the upper and lower positions.

5. The wet etching apparatus according to claim 4, wherein the driving device comprises a cylinder that is coupled to the tank and is operable to move the tank between the upper and lower positions.

6. The wet etching apparatus according to claim 4, wherein the driving device comprises two cylinders respectively arranged at two ends of a bottom of the tank and coupled to the tank to move tank between the upper and lower positions.

7. The wet etching apparatus according to claim 1, wherein the conveyor is operable to convey a substrate into the tank such that when the tank is moved to the upper position, the etchant contained in the tank completely covers the substrate to have the substrate completely immersed in the etchant.

8. The wet etching apparatus according to claim 7, wherein the tank is selectively moved down to the lower position from the upper position after a lapse of a predetermined period of time after the substrate is immersed in the etchant in order to remove the substrate out of the etchant.

9. A wet etching apparatus, comprising:

a wet bench;

wherein the tank is movable by a driving device from the lower position to the upper position to raise the etchant supplied into to the tank; and

wherein the driving device comprises at least one cylinder that is operable to move the tank between the upper and lower positions.

10. The wet etching apparatus according to claim 9, wherein the tank is made of a corrosion resistant material.

11. The wet etching apparatus according to claim 10, wherein the material that makes the tank comprises PVC.

12. The wet etching apparatus according to claim 9, wherein the driving device comprises two cylinders respectively arranged at two ends of a bottom of the tank and coupled to the tank to move tank between the upper and lower positions.

13. The wet etching apparatus according to claim 9, wherein the conveyor is operable to convey a substrate into the tank such that when the tank is moved to the upper position, the etchant contained in the tank completely covers the substrate to have the substrate completely immersed in the etchant.

14. The wet etching apparatus according to claim 13, wherein the tank is selectively moved down to the lower position from the upper position after a lapse of a predetermined period of time after the substrate is immersed in the etchant in order to remove the substrate out of the etchant.